JP6579941B2 - Peeling system - Google Patents

Description

  The disclosed embodiments relate to a stripping system.

  In recent years, for example, in semiconductor device manufacturing processes, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. Since a large-diameter and thin semiconductor substrate may be warped or cracked during transport or polishing, the support substrate is bonded to the semiconductor substrate to reinforce it, and then transported or polished. The process which peels from a board | substrate is performed.

  For example, in Patent Document 1, a supporting substrate is held using a first holding unit, and a substrate to be processed (semiconductor substrate) is held using a second holding unit that is vertically opposed to the first holding unit. And the peeling system which peels a support substrate from a to-be-processed substrate by moving the outer peripheral part of a 1st holding | maintenance part perpendicularly upward is disclosed.

JP 2014-053463 A

  However, the above-described conventional technology has room for further improvement in that the footprint, which is the ratio of the peeling system to the floor area of a clean room or the like, is reduced.

  An object of one embodiment is to provide a peeling system capable of reducing the footprint.

A stripping system according to an aspect of an embodiment is a stripping system that strips a polymerization substrate in which a substrate to be processed and a support substrate are bonded to a substrate to be processed and a support substrate, and includes a composite station, a stripping station, and a cleaning station. And a carry-out station and a transfer area. In the composite station, a carry-in / out station where the superposed substrate and the substrate to be processed after peeling are placed, and a pretreatment station where pretreatment before peeling is performed on the superposed substrate are stacked. In the peeling station, a plurality of peeling devices for peeling the superposed substrate from the substrate to be processed and the support substrate are stacked. The cleaning station is provided with a cleaning device for cleaning the substrate to be processed after peeling. At the carry-out station, the support substrate after peeling is placed. In the transfer area, one transfer device for transferring the polymerization substrate, the substrate to be processed, and the support substrate is arranged between the compound station, the peeling station, the cleaning station, and the carry-out station. The transfer device includes a pair of arms having a substrate holding portion provided with a suction mechanism at the tip, and the substrate to be processed after being peeled off by the substrate holding portion of one arm is removed after being peeled off by the substrate holding portion of the other arm. Each of the support substrates can be simultaneously held, and the transfer device further includes a substrate holding unit horizontally provided between the lower surface of the first holding unit that is provided in the peeling device and holds the support substrate and the non-joint surface of the support substrate. The non-bonded surface is sucked by the insertion and suction mechanism, and the peeled support substrate is taken out from the peeling device, and the peeled support substrate is conveyed to the carry-out station in a state where the front and back surfaces of the substrate holding part are reversed.

  According to one aspect of the embodiment, the footprint can be reduced.

FIG. 1 is a schematic plan view showing a configuration of a peeling system as a comparative example of the present embodiment. FIG. 2 is a schematic side view of a superposed substrate held by a dicing frame. FIG. 3 is a schematic plan view of a superposed substrate held on a dicing frame. FIG. 4A is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 4B is a schematic front view illustrating the configuration of the peeling system according to the present embodiment. FIG. 4C is a schematic side view illustrating the configuration of the peeling system according to the present embodiment. FIG. 5A is a schematic plan view illustrating the configuration of the transport device. FIG. 5B is a schematic side view illustrating the configuration of the transport device. FIG. 5C is a schematic diagram illustrating the stroke length of the transport device in the Z-axis direction. FIG. 6 is a flowchart showing a processing procedure of a peeling process executed by the peeling system according to the present embodiment. FIG. 7A is a schematic side view showing a transfer route of the DF-attached superposition substrate. FIG. 7B is a schematic plan view showing a transport route of the DF-attached superposition substrate. FIG. 7C is a schematic plan view illustrating a transfer route of the substrate to be processed and the support substrate. FIG. 8A is a schematic diagram (part 1) illustrating the operation of taking out the support substrate. FIG. 8B is a schematic diagram (part 2) illustrating the operation of taking out the support substrate. FIG. 8C is a schematic diagram (part 3) illustrating the operation of taking out the support substrate. FIG. 8D is a schematic diagram (part 4) illustrating the operation of taking out the support substrate. FIG. 8E is a schematic diagram illustrating a modified example of the operation of taking out the support substrate. FIG. 9A is a schematic plan view illustrating a configuration of a peeling system according to a first modification. FIG. 9B is a schematic plan view illustrating a configuration of a peeling system according to a second modification.

  Hereinafter, embodiments of a peeling system disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

<0. Introduction>
First, prior to the description of the peeling system according to the present embodiment, a configuration of a peeling system 1 ′ serving as a comparative example of the present embodiment will be described with reference to FIGS. FIG. 1 is a schematic plan view showing a configuration of a peeling system 1 ′ as a comparative example of the present embodiment. 2 and 3 are a schematic side view and a schematic plan view of the superposed substrate T held by the dicing frame F. FIG.

  In the following, in order to clarify the positional relationship, an orthogonal coordinate axis composed of an X axis, a Y axis, and a Z axis that are orthogonal to each other is defined, and the positive direction of the Z axis is defined as a vertically upward direction. Moreover, let the Y-axis negative direction be a front direction.

  A peeling system 1 ′, which is a comparative example of the present embodiment shown in FIG. 1, includes a superposed substrate T (see FIG. 2) in which a substrate to be processed W and a support substrate S are bonded to each other with an adhesive G. Peel to support substrate S.

  In the following, as shown in FIG. 2, the plate surface of the substrate to be processed W that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is defined as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and the plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the substrate to be processed W is thinned by polishing the non-bonding surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 50 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 750 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. Moreover, the thickness of the adhesive G which joins these to-be-processed substrate W and the support substrate S is about 40-150 micrometers.

  Further, as shown in FIG. 3, the superposed substrate T is fixed to the dicing frame F. This is for protecting the very thin substrate W to be damaged from damage as described above. The dicing frame F is a substantially annular member in which an opening Fa having a diameter larger than that of the superposed substrate T is formed in the center, and is formed of a metal such as stainless steel. The thickness of the dicing frame F is, for example, about 1 mm.

  The superposed substrate T is fixed to the dicing frame F via the dicing tape P. Specifically, the superposed substrate T is disposed in the opening Fa of the dicing frame F, and the dicing tape P is pasted on the non-joint surface Wn of the substrate W to be processed and the back surface of the dicing frame F so as to close the opening Fa from the back surface. wear. As a result, the superposed substrate T is fixed (held) to the dicing frame F. That is, the superposed substrate T is held by the dicing frame F with the substrate W to be processed positioned on the lower surface and the support substrate S positioned on the upper surface (see FIG. 2).

  Returning to the description of FIG. As shown in FIG. 1, the peeling system 1 ′ includes two processing blocks, a first processing block 10 and a second processing block 20. The first processing block 10 and the second processing block 20 are arranged side by side in the order of the second processing block 20 and the first processing block 10 in the positive direction of the X axis.

  In the first processing block 10, the superposed substrate T is carried in, the superposed substrate T is peeled off, and the substrate W to be processed is peeled off and carried out. That is, the first processing block 10 is a block that performs processing on the substrates (the superposed substrate T and the target substrate W) held by the dicing frame F. The first processing block 10 includes a carry-in / out station 11, a pretreatment station 12, a first transfer region 13, a peeling station 14, and a cleaning station 15.

  The second processing block 20 is a block that performs processing on a substrate that is not held by the dicing frame F, specifically, the support substrate S after being peeled off. The second processing block 20 includes a first delivery station 21, a second delivery station 22, a second transfer area 23, and a carry-out station 24.

  The carry-in / out station 11, the pretreatment station 12, the peeling station 14, and the cleaning station 15 are disposed adjacent to the first transfer region 13. Specifically, the carry-in / out station 11 and the pretreatment station 12 are arranged in the order of the carry-in / out station 11 and the pretreatment station 12 in the positive direction of the X axis on the Y axis negative direction side of the first transfer region 13. .

  Further, the first peeling device 141 of the peeling station 14 and the two cleaning devices 151 of the cleaning station 15 are the cleaning devices 141 and 2 in the positive direction of the X axis on the Y axis positive direction side of the first transfer region 13. The devices 151 are arranged in order. Further, the second peeling device 142 of the peeling station 14 is disposed on the X-axis negative direction side of the first transfer region 13.

  The first delivery station 21 is disposed on the X axis negative direction side of the peeling device 141 and on the Y axis positive direction side of the peeling device 142. Further, the second delivery station 22 and the carry-out station 24 are arranged adjacent to the second transfer area 23. Specifically, the second delivery station 22 is arranged on the Y axis positive direction side of the second transfer area 23 and on the X axis negative direction side of the first delivery station 21. The carry-out station 24 is arranged on the Y axis negative direction side of the second transfer area 23.

  First, the configuration of the first processing block 10 will be described. In the carry-in / out station 11, a cassette Ct in which a superposed substrate T (hereinafter referred to as “DF superposed substrate T”) held in a dicing frame F is accommodated and a cassette Cw in which a substrate to be processed W after peeling is accommodated. Is carried in and out of the outside. The loading / unloading station 11 is provided with a plurality of cassette mounting tables 111, and a cassette Ct or a cassette Cw is mounted on each cassette mounting table 111.

  In the following drawings and explanations, as shown in FIG. 1, the cassette Ct or the cassette Cw placed on each cassette placement table 111 may be described as “DF-LP”, respectively.

  In the pre-processing station 12, pre-processing before peeling processing is performed with respect to the superposition | polymerization board | substrate T with DF. For example, an alignment device 121 is disposed in the pretreatment station 12, and the alignment device 121 is positioned for preparation of a peeling process on the DF-attached superposition substrate T transported from the cassette Ct by the first transport device 131 described later. Then, an alignment process for adjusting the orientation is performed.

  Further, for example, a temporary area 122 is arranged in the preprocessing station 12. In the temporary area 122, for example, an ID reader for reading an ID (Identification) of the dicing frame F is arranged, and the ID-reader can identify the DF-attached superposed substrate T to be processed.

  Further, in the temporary area 122, in addition to the ID reading process by the ID reading device, for example, a standby process in which the DF-attached superposed substrate T waiting for processing is temporarily held can be performed as necessary. The temporary area 122 is provided with a mounting table on which the DF-attached superposition substrate T transferred by the first transfer device 131 is placed, and the ID reading device and the temporary standby unit are placed on the mounting table. The

  In each drawing and description below, as shown in FIG. 1, the alignment device 121 may be described as “DAM” and the temporary area 122 may be described as “BUF”.

  In the first transport region 13, a first transport device 131 that transports the superposed substrate T with DF or the substrate to be processed W after separation is disposed. The first transfer device 131 includes an arm that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the arm.

  In the first transfer region 13, the first transfer device 131 uses the first transfer device 131 to transfer the DF-attached superposed substrate T to the pretreatment station 12 and the separation station 14, and the substrate W after the separation is cleaned to the cleaning station 15 and the carry-in / out station. 11 is carried out.

  The substrate holding unit provided in the first transfer device 131 holds the dicing frame F by suction or gripping to hold the DF-attached superposed substrate T or the substrate to be processed W after peeling substantially horizontally. In each drawing and description below, as shown in FIG. 1, the first transport device 131 may be described as “FRA”.

  Two peeling devices 141 and 142 are arranged in the peeling station 14. In the peeling station 14, a peeling process for peeling the DF-attached superposed substrate T into the target substrate W and the support substrate S is performed by the peeling devices 141 and 142.

  Specifically, in the peeling devices 141 and 142, the DF-attached superposed substrate T is peeled into the target substrate W and the support substrate S in a state where the target substrate W is disposed on the lower side and the support substrate S is disposed on the upper side. To do. As the peeling devices 141 and 142, for example, a peeling device described in JP-A-2014-053463 can be used. In each drawing and description shown below, as shown in FIG. 1, the peeling devices 141 and 142 may be described as “DDB”.

  Two cleaning apparatuses 151 are arranged in the cleaning station 15. In the cleaning station 15, the two cleaning apparatuses 151 perform a cleaning process for cleaning the substrate W after separation while being held by the dicing frame F. As the cleaning device 151, for example, a first cleaning device described in JP 2014-053463 A can be used. In each drawing and description below, the cleaning device 151 may be described as “DCN” as shown in FIG.

  Next, the configuration of the second processing block 20 will be described. In the first delivery station 21, delivery processing is performed in which the support substrate S after peeling is received from the peeling devices 141 and 142 of the peeling station 14 and transferred to the second delivery station 22.

  A delivery device 211 is arranged at the first delivery station 21. The delivery device 211 has a non-contact holding portion that is a non-contact type such as a Bernoulli chuck, for example, and this non-contact holding portion is configured to be rotatable about a horizontal axis.

  As the delivery device 211, for example, a third transport device described in Japanese Patent Application Laid-Open No. 2014-053463 can be used. The delivery device 211 conveys the support substrate S from the peeling devices 141 and 142 to the second processing block 20 in a non-contact manner while inverting the front and back surfaces of the support substrate S after peeling. In each drawing and description below, as shown in FIG. 1, the delivery device 211 may be described as “MRRA”.

  In the second delivery station 22, a placement unit 221 for placing the support substrate S and a moving unit 222 for moving the placement unit 221 in the Y-axis direction are arranged. The mounting unit 221 includes, for example, three support pins, and supports and mounts the non-joint surface Sn of the support substrate S. In each drawing and description below, as shown in FIG. 1, the second delivery station 22 may be described as “SHTL”.

  The moving unit 222 includes a rail extending in the Y-axis direction and a driving unit that moves the placement unit 221 in the Y-axis direction. In the second delivery station 22, after the support substrate S is placed on the placement unit 221 from the delivery device 211 of the first delivery station 21, the placement unit 221 is moved to the second transport region 23 side by the moving unit 222. .

  Then, the support substrate S is transferred from the placement unit 221 to the second transfer device 231 in the second transfer region 23 described later. The placement unit 221 may be configured to be movable in other directions than the Y-axis direction.

  In the second transport region 23, a second transport device 231 that transports the support substrate S after peeling is disposed. The second transfer device 231 includes an arm that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the arm. In the second transfer area 23, the second transfer device 231 performs a process of transferring the peeled support substrate S to the carry-out station 24. In each drawing and description below, as shown in FIG. 1, the second transport device 231 may be described as “LRA”.

  The unloading station 24 is provided with a plurality of cassette mounting tables 241, and each cassette mounting table 241 is mounted with a cassette Cs in which the support substrate S after peeling is stored. At the carry-out station 24, the cassette Cs is carried out to the outside. In the following drawings and explanations, as shown in FIG. 1, the cassette Cs placed on each cassette placement table 241 may be described as “LP”.

  Further, the peeling system 1 ′ includes a control device 30. The control device 30 is a device that controls the operation of the peeling system 1 ′. The control device 30 is a computer, for example, and includes a control unit and a storage unit (not shown). The storage unit stores a program for controlling various processes such as a peeling process. The control unit controls the operation of the peeling system 1 'by reading and executing the program stored in the storage unit.

  Such a program may be recorded on a computer-readable storage medium and installed in the storage unit of the control device 30 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  By the way, the above-described peeling system 1 ′ has room for further improvement in order to reduce the footprint and save space. Therefore, in the present embodiment, the first processing block 10 and the second processing block 20 described above are integrated, and the peeling system is configured so that a series of peeling processing can be performed on the DF-attached polymer substrate T by one processing block. It was decided to.

  Hereinafter, the configuration of the peeling system 1 according to the present embodiment will be specifically described with reference to FIG. In the following, in the present embodiment, components different from the peeling system 1 ′ as a comparative example will be mainly described.

<1. Configuration of Peeling System 1>
4A to 4C are a schematic plan view, a schematic front view, and a schematic side view showing the configuration of the peeling system 1 according to the present embodiment in order.

  As shown in FIG. 4A, the peeling system 1 according to this embodiment includes one processing block 10_20. The processing block 10_20 integrates both the processing for the substrates (the superposed substrate T and the substrate to be processed W) held by the dicing frame F and the processing for the substrate (the support substrate S after peeling) that is not held by the dicing frame F. This is a processing block to be performed automatically.

  The processing block 10_20 includes a composite station 11_12, a first transfer region 13, a peeling station 14, a cleaning station 15, and an unloading station 24. The combined station 11_12 is a processing station that combines the carry-in / out station 11 and the preprocessing station 12 described above. In the processing block 10_20, there is only one transport area. For this reason, the 1st conveyance area 13 and the 1st conveyance apparatus 131 (FRA) arrange | positioned at this are hereafter described as "the conveyance area 13" and "the conveyance apparatus 131", respectively.

  The composite station 11_12, the peeling station 14, the cleaning station 15 and the carry-out station 24 are arranged adjacent to the transfer area 13. Specifically, the composite station 11_12 and the carry-out station 24 are arranged side by side in the order of the composite station 11_12 and the carry-out station 24 in the positive X-axis direction on the Y axis negative direction side of the transfer area 13.

  Further, the peeling station 14 and the cleaning station 15 are arranged side by side in the order of the peeling station 14 and the cleaning station 15 in the positive direction of the X axis on the Y axis positive direction side of the transfer region 13.

  4A and 4B, in the composite station 11_12, each cassette mounting table 111 (DF-LP) is stacked on the upper stage, and an alignment device 121 (DAM) and a temporary area 122 (BUF) are provided. For example, the alignment device 121 and the temporary region 122 are arranged in this order in the positive X-axis direction.

  As shown in FIGS. 4A and 4C, in the peeling station 14, the peeling device 141 is stacked on the upper stage of the peeling device 142.

  In such an arrangement configuration, in the peeling system 1, only the transfer device 131 arranged in the transfer area 13 performs a process of transferring all of the substrates related to a series of peeling processes. That is, the transfer device 131 in the peeling system 1 is provided to be operable in place of the delivery device 211 (MRRA) and the second transfer device 231 (LRA) described above.

  Further, as shown in FIG. 4C, the conveying device 131 is provided so as to be accessible to the stacked peeling devices 141 and 142, for example. Next, a specific configuration of the transport device 131 will be described with reference to FIGS. 5A and 5B.

  FIG. 5A is a schematic plan view illustrating the configuration of the transport device 131, and FIG. 5B is a schematic side view illustrating the configuration of the transport device 131.

  As shown in FIG. 5A, the transfer device 131 includes a substrate holding part 131a, a first link 131b, a second link 131c, and an arm base 131d.

  The substrate holding part 131a is formed in, for example, a bifurcated flat plate shape, and includes a plurality of suction pads 131aa (corresponding to an example of “suction mechanism”) on the surface. The base end portion of the substrate holding portion 131a is connected to the tip end portion of the first link 131b so as to be rotatable about the axis ax1 and rotatable about the axis ax2 perpendicular to the axis ax1.

  Further, the base end portion of the first link 131b is connected to the tip end portion of the second link 131c so as to be rotatable about an axis ax3 parallel to the axis ax2. The base end portion of the second link 131c is coupled to the arm base 131d so as to be rotatable about an axis ax4 parallel to the axis ax3.

  The substrate holding part 131a, the first link 131b, the second link 131c, and the arm base 131d are connected in this way to constitute one arm. Such an arm can reverse the front and back surfaces of the substrate holding part 131a by rotating around the axis ax1, and can advance and retract the substrate holding part 131a in the direction of the arrow 501 by rotating around the axis ax2 to the axis ax4. Is possible.

  An additional arm having the same configuration is connected to the arm base 131d. The substrate holding method of the substrate holding portions 131a of both arms may be the same method (here, the suction method), or may be a different method, for example, one is the suction method and the other is the gripping method. . With these two arms, for example, the target substrate W after peeling can be simultaneously held in one arm, and the supporting substrate S after peeling can be simultaneously held in the other arm.

  The arm base 131d is provided so as to be able to turn around an axis ax5 parallel to the axis ax4 (see an arrow 502 in the figure). Further, as shown in FIG. 5B, the transfer device 131 further includes a base portion 131e installed on the floor surface or the like. The arm base 131d is connected to the base portion 131e.

  The base 131e is provided so as to be movable up and down along an axis ax6 parallel to the Z axis, for example, by a so-called telescopic structure in which the third link 131ea, the fourth link 131eb, and the fifth link 131ec are combined (see arrow 503 in the figure). ) The substrate holding part 131a is moved up and down in the Z-axis direction.

  The stroke length of the transport device 131 in the Z-axis direction will be described with reference to FIG. 5C. FIG. 5C is a schematic diagram illustrating the stroke length of the transport device 131 in the Z-axis direction.

  As shown in FIG. 5C, the peeling device 141 includes a first holding unit 141a that holds the support substrate S and a second holding unit 141b that holds the substrate W to be processed while being opposed to the first holding unit 141a in the vertical direction. It is assumed that the support substrate S is peeled from the substrate W to be processed by moving the outer peripheral portion of the first holding portion 141a vertically upward. In the case of the peeling device 142, the first holding unit 142a corresponds to the first holding unit 141a, and the second holding unit 142b corresponds to the second holding unit 141b.

  As shown in FIG. 5C, in the transfer device 131, the substrate holding portion 131a has the highest position HiP higher than the movement upper limit position P1 of the first holding portion 141a of the peeling device 141, and the lowest slot position P2 of the cassette Ct. It is configured to have an accessible range with the lowest position LoP as the lowest point. That is, the above-mentioned base part 131e is provided so as to be movable up and down with a stroke length h in the drawing.

  Thus, the substrate can be transported by one transport device 131 between the stacked cassette mounting table 111 and the alignment device 121 and the similarly stacked stacking devices 141 and 142.

<2. Operation of Peeling System 1>
Next, the operation of the peeling system 1 configured as described above will be described with reference to FIGS. 6, 7A to 7C, and FIGS. 8A to 8E. FIG. 6 is a flowchart showing a processing procedure of a peeling process executed by the peeling system 1 according to the present embodiment.

  7A is a schematic side view showing the transfer route of the DF-attached superposition substrate T, FIG. 7B is a schematic plan view showing the transfer route of the DF-attached superposition substrate T, and FIG. FIG. 6 is a schematic plan view showing a transport route of the support substrate S.

  8A to 8D are schematic views (part 1) to (part 4) showing the operation of taking out the support substrate S, and FIG. 8E is a schematic view showing a modification example of the operation of taking out the support substrate S. . Note that the peeling system 1 executes each processing procedure shown in FIG. 6 based on the control of the control device 30.

  First, a cassette Ct containing a plurality of DF-attached superposition substrates T and an empty cassette Cw are placed on a predetermined cassette mounting table 111 of the composite station 11_12, and an empty cassette Cs is transferred to an unloading station 24. Is mounted on a predetermined cassette mounting table 241.

  Then, the transfer device 131 arranged in the transfer region 13 carries the substrate loading process for loading the DF-attached superposition substrate T into the upper stage of the composite station 11_12 (corresponding to the pretreatment station 12 in FIG. 1) based on the control of the control device 30. (See step S101 in FIG. 6 and T1 in FIG. 7A).

  Specifically, the transfer device 131 causes the substrate holding part 131a to enter the lower stage of the composite station 11_12 (corresponding to the carry-in / out station 11 in FIG. 1), and the DF-attached superposition substrate accommodated in the cassette Ct of the cassette mounting table 111. Hold T and remove from cassette Ct.

  At this time, the DF-attached superposition substrate T is held from above by the substrate holding portion 131a of the transfer device 131 in a state where the substrate W to be processed is located on the lower surface and the support substrate S is located on the upper surface. Then, the transport device 131 carries the DF-attached superposition substrate T taken out from the cassette Ct to the upper stage of the composite station 11_12.

  Subsequently, in the upper stage of the composite station 11_12, a pre-peeling process is performed (see step S102 in FIG. 6). Specifically, the alignment device 121 performs alignment processing for aligning the position and orientation of the DF-attached superposition substrate T based on the control of the control device 30. Then, the ID reading device performs an ID reading process for reading the ID of the dicing frame F based on the control of the control device 30. The ID read by the ID reading device is transmitted to the control device 30.

  Subsequently, based on the control of the control device 30, the transfer device 131 carries out the DF-attached superposed substrate T from the upper stage of the composite station 11_12 and transfers it to the peeling station 14 (see T2 in FIG. 7B). The transport destination may be either the upper peeling device 141 or the lower peeling device 142 vacant, but the following description will be made assuming that the transport destination is transported to the peeling device 141.

  Further, for example, when a DF-attached superposed substrate T waiting for processing occurs due to a difference in processing time between apparatuses, the DF-attached superposed substrate T is temporarily kept in standby using the temporary area 122 provided in the upper stage of the composite station 11_12. The loss time between a series of processes can be shortened.

  And in the peeling station 14, the peeling apparatus 141 performs a peeling process based on control of the control apparatus 30 (refer step S103 of FIG. 6).

  Thereafter, in the peeling system 1, the processing for the target substrate W after peeling and the processing for the supporting substrate S after peeling are performed in parallel in the processing block 10_20. Note that the substrate to be processed W after peeling is held by the dicing frame F.

  First, the transfer device 131 takes out the target substrate W after peeling and the support substrate S after peeling from the peeling device 141 based on the control of the control device 30. At this time, the transfer device 131 takes out the substrate to be processed W after peeling by the substrate holding portion 131a of one arm, and takes out the support substrate S after peeling by the substrate holding portion 131a of the other arm.

  Here, the support substrate S after peeling is in a state where the upper surface side, that is, the non-joint surface Sn side is held by the peeling device 141. In the peeling system 1 ′ as the comparative example described above, the delivery device 211 ( MRRA) holds and removes the bonding surface Sj side of the support substrate S from the lower side in a non-contact manner by the non-contact holding unit, and then reverses the held support substrate S so that the bonding surface Sj faces upward. It was.

  In order to substitute for this operation, the transfer device 131 of the peeling system 1 according to the present embodiment takes out the support substrate S after peeling by the method shown in FIGS. 8A to 8E, for example.

  Specifically, as shown in FIG. 8A, first, based on the control of the control device 30, the transport device 131 causes the substrate holding portion 131 a of the arm that takes out the support substrate S to enter the peeling device 141, and the peeling device 141. And is made to approach the support substrate S in a state of being held by the first holding portion 141a (see arrow 801 in the figure).

  Here, as shown in FIG. 8B, in the peeling device 141, the support substrate S after being peeled is held in a state in which the non-joint surface Sn is sucked by the suction portion 141aa of the first holding portion 141a. Therefore, the transfer device 131 has the suction pad 131aa facing downward between the lower surface of the first holding portion 141a and the non-joint surface Sn of the support substrate S based on the control of the control device 30. (See arrow 802 in the figure).

  Then, as illustrated in FIG. 8C, if the transfer device 131 inserts the substrate holding portion 131a all the way between the lower surface of the first holding portion 141a and the non-joint surface Sn of the support substrate S, Based on the control, the non-bonding surface Sn is sucked by the suction pad 131aa instead of the suction portion 141aa, and the support substrate S is held.

  8D, the transfer device 131 holds the support substrate S, and then separates the support substrate S from the first holding portion 141a of the peeling device 141 based on the control of the control device 30 to release the peeling device 141. (See arrow 803 in the figure). Thereafter, the transfer device 131 reverses the front and back surfaces of the substrate holding portion 131a based on the control of the control device 30 (see the arrow 804 in the figure), and the bonding surface Sj on the side where the adhesive G is attached is directed upward. Keep it facing.

  By using such a method, the conveyance device 131 can perform an operation in place of the delivery device 211 of the peeling system 1 ′ as a comparative example. That is, since the substrate related to the series of peeling operations can be transported only by the transport device 131, the delivery device 211 is not necessary, and the footprint can be reduced.

  8A to 8D exemplify the case where the substrate holding portion 131a is the suction method, but instead of this, for example, a gripping method may be used.

  Specifically, for example, as shown in FIG. 8E, a substrate holding part 131aA according to a modification may be a type in which the support substrate S is sandwiched and held between the fixed part 131ab and the movable part 131ac.

  In such a case, the transport device 131 causes the substrate holding portion 131aA to enter the peeling device 141, and then causes the substrate holding portion 131aA to approach the support substrate S from below (see arrow 805 in the drawing), and then the fixing portion 131ab. And the movable portion 131ac (see an arrow 806 in the figure), the support substrate S is held and taken out and inverted.

  Returning to the description of FIGS. 6 and 7C. Then, based on the control of the control device 30, the transport device 131 first transports the substrate W after being taken out to the cleaning station 15 (see W <b> 1 in FIG. 7C).

  Then, the cleaning device 151 of the cleaning station 15 performs a processing target substrate cleaning process for cleaning the bonded surface Wj of the target processing substrate W after peeling based on the control of the control device 30 (see step S104 in FIG. 6). By such a substrate cleaning process, the adhesive G remaining on the bonding surface Wj of the substrate W to be processed is removed.

  On the other hand, in parallel with the substrate cleaning process, the transfer device 131 performs a support substrate carry-out process in which the peeled support substrate S that has been taken out and reversed is transferred to the carry-out station 24 under the control of the control device 30. (See step S106 in FIG. 6 and S1 in FIG. 7C). Thereafter, the support substrate S is unloaded from the unloading station 24 and collected. Thus, the process for the support substrate S is completed.

  Further, based on the control of the control device 30, the transfer device 131 carries out the processed substrate W after cleaning from the cleaning device 151 and transfers it to the lower stage (corresponding to the carry-in / out station 11) of the composite station 11_12. A carry-out process is performed (see step S105 in FIG. 6 and W2 in FIG. 7C). Thereafter, the substrate to be processed W is carried out from the lower stage of the composite station 11_12 to the outside and collected. Thus, the process for the substrate to be processed W is completed.

  As described above, the peeling system 1 according to this embodiment is a peeling system that peels the DF-attached superposition substrate T in which the target substrate W and the support substrate S are bonded to the target substrate and the support substrate, A composite station 11_12, a peeling station 14, a cleaning station 15, a carry-out station 24, and a transfer area 13 are provided. The composite station 11_12 is a stack of a loading / unloading station 11 on which the DF-attached superposition substrate T and the substrate to be treated W after peeling are placed, and a pretreatment station 12 on which pretreatment before peeling is performed on the DF-attached superposition substrate T. Is done. In the peeling station 14, a plurality of peeling devices 141 and 142 for peeling the DF-attached superposed substrate T to the target substrate W and the support substrate S are stacked. The cleaning station 15 is provided with a cleaning device 151 for cleaning the target substrate W after peeling. In the carry-out station 24, the support substrate S after being peeled is placed. In the transfer area 13, one transfer device 131 for transferring the DF-attached superposition substrate T, the substrate W to be processed, and the support substrate S is disposed between the composite station 11_12, the peeling station 14, the cleaning station 15, and the carry-out station 24. .

  Therefore, according to the peeling system 1 which concerns on this embodiment, a footprint can be made small.

  Further, in the peeling system 1 according to the present embodiment, the delivery device 211 (MRRA), the second delivery station 22 (SHTL), and the second transport device 231 that need to be arranged in the peeling system 1 ′ as a comparative example. There is no need to provide (LRA). Therefore, according to the peeling system 1 which concerns on this embodiment, it can contribute to reducing a number of apparatus and comprising a system at low cost.

  Further, in the peeling system 1 according to the present embodiment, all the substrates related to a series of peeling processes can be transported within one transport region 13 by the transport device 131 including two arms. Therefore, according to the peeling system 1 which concerns on this embodiment, efficiency improvement of a board | substrate conveyance can be achieved, As a result, it can contribute to maintaining and improving a throughput.

<3. Other Embodiments>
By the way, the structure of the peeling system which this application discloses is not limited to the structure described so far. Therefore, hereinafter, a modified example of the peeling system will be described with reference to FIGS. 9A and 9B.

  FIG. 9A is a schematic plan view showing the configuration of the peeling system 50 according to the first modification, and FIG. 9B is a schematic plan view showing the configuration of the peeling system 70 according to the second modification. In the following description, parts that are the same as those already described are given the same reference numerals as those already described, and redundant descriptions are omitted.

  As shown in FIG. 9A, the peeling system 50 according to the first modification is configured such that the arrangement position of the composite station 11_12 and the arrangement position of the carry-out station 24 are opposite to those of the above-described peeling system 1.

  Even with such a configuration, it is possible to realize a footprint substantially the same as that of the peeling system 1, and it is possible to reduce the cost and to maintain and improve the throughput as compared with the peeling system 1 'as a comparative example.

  Also, as shown in FIG. 9B, the peeling system 70 according to the second modified example is such that the peeling station 14 in which the peeling devices 141 and 142 are stacked is in the direction in which the transfer region 13 extends (here, the X-axis negative direction). Configured to be arranged on the side. In addition, three cleaning devices 151 are arranged side by side with respect to the cleaning station 15.

  Even with this configuration, the footprint can be reduced as compared with the peeling system 1 ′ as a comparative example. Further, by increasing the number of cleaning devices 151, it is possible to improve the removal performance for removing the adhesive G remaining on the substrate W to be processed. Further, by increasing the number of cleaning devices 151, it is possible to improve tact time and improve productivity. For example, one of the cleaning apparatuses 151 may be used for cleaning the support substrate S instead of the substrate W to be processed.

  Further, in the embodiment described above, an example in which the superposed substrate to be peeled is the superposed substrate T with DF in which the substrate to be processed W and the support substrate S are bonded by the adhesive G has been described. The superposition | polymerization board | substrate used as the peeling object of the apparatuses 141 and 142 is not limited to this superposition | polymerization board | substrate T with DF. For example, in the peeling station 14, in order to generate an SOI substrate, a superposed substrate in which a donor substrate on which an insulating film is formed and a substrate to be processed are bonded to each other can be a peeling target.

  In the embodiment described above, the example in the case where the target substrate W and the support substrate S are bonded using the adhesive G has been described. However, the bonding surfaces Wj and Sj are divided into a plurality of regions, and each region is divided. Adhesives with different adhesive strengths may be applied.

  In the above-described embodiment, an example in which the superposed substrate T is held by the dicing frame F has been described. However, the superposed substrate T is not necessarily held by the dicing frame F.

  Further effects and modifications can be easily derived by those skilled in the art. Thus, the broader aspects of the present invention are not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications can be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

1, 1 ′, 50, 70 Peeling system 11 Loading / unloading station 11 — 12 Combined station 12 Pretreatment station 13 Transfer area 14 Peeling station 15 Cleaning station 24 Unloading station 30 Control device 131 Transfer devices 131a, 131aA Substrate holder 131aa Adsorption pad 141, 142 Peeling devices 141a, 142a First holding portions 141b, 142b Second holding portions 151 Cleaning devices Cs, Ct, Cw Cassette F Dicing frame G Adhesive P Dicing tape S Support substrate T Polymerized substrate W with DF Processed substrate

Claims (6)

A peeling system that peels the substrate to be processed and the support substrate from the superposed substrate in which the substrate to be processed and the support substrate are bonded.
A composite station in which a carry-in / out station on which the substrate to be processed and the substrate to be processed after peeling are placed, and a pre-treatment station on which pre-treatment before peeling is performed on the polymerization substrate are stacked,
A peeling station in which a plurality of peeling devices for peeling the superposed substrate from the substrate to be processed and the support substrate are laminated,
A cleaning station provided with a cleaning device for cleaning the substrate to be processed after peeling;
An unloading station on which the support substrate after peeling is placed;
A transfer area in which one transfer device for transferring the superposed substrate, the substrate to be processed and the support substrate is arranged between the composite station, the peeling station, the cleaning station and the unloading station ;
The transfer device
A pair of arms having a substrate holding part provided with a suction mechanism at the tip,
The substrate to be processed after being peeled off by the substrate holding portion of one arm, and the supporting substrate after being peeled off by the substrate holding portion of the other arm can be simultaneously held, respectively.
The transfer device further includes
The substrate holding unit is horizontally inserted between the lower surface of a first holding unit that is provided in the peeling apparatus and holds the support substrate and the non-joint surface of the support substrate, and the non-joint surface is sucked by the suction mechanism. wherein in an inverted state of the front and back surfaces of the substrate holder after having taken out the supporting substrate after peeling from the peeling device, characterized that you convey the supporting substrate after peeling to the output station by Peeling system. The combined station and the unloading station are arranged side by side on the same side,
2. The peeling system according to claim 1, wherein the peeling station and the cleaning station are arranged side by side on the opposite side of the combined station and the unloading station across the transfer area. The peeling system according to claim 2, wherein the order of arrangement of the combined station and the carry-out station is interchangeable. The combined station and the unloading station are arranged side by side on the same side,
The cleaning station is arranged side by side on the opposite side of the combined station and the unloading station across the transfer area,
The peeling system according to claim 1, wherein the peeling station is disposed on an extending direction side of the transfer region. The peeling system according to claim 4, wherein the cleaning station includes three or more cleaning devices arranged side by side. In the composite station, the pretreatment station is stacked on the upper stage, and the loading / unloading station is stacked on the lower stage.
In the peeling station, the two peeling devices are stacked on the upper and lower stages,
The peeling device is
A second holding unit that is arranged vertically facing the first holding unit and holds the substrate to be processed;
The transfer device
The position higher than the upper limit position of the first holding part of the peeling device arranged in the upper stage is the highest point, and the position lower than the lowest slot position of the cassette arranged in the carry-in / out station is the lowest point. The peeling system according to any one of claims 1 to 5, wherein the peeling system has a stroke length along a vertical direction.