JP2015088620A - Peeling system, peeling method, program, and computer storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently perform peeling processing between a processed substrate and a support substrate.SOLUTION: A peeling system 1 includes: a first processing block 10 for performing processing to a superposed substrate T and a processed substrate W; and a second processing block 20 for performing processing to a support substrate S. The first processing block 10 includes: a carry-in/carry-out station 11; a standby station 12; a first transfer region 13; a peeling station 14; and a cleaning station 15. The second processing block 20 includes a first delivery station 21, a second delivery station 22, a second transportation region 23, and a carry-out station 24.

Description

  The present invention relates to a peeling system for peeling a superposed substrate from a substrate to be processed and a support substrate, a peeling method using the peeling system, a program, and a computer storage medium. About.

  In recent years, for example, in semiconductor device manufacturing processes, semiconductor substrates such as silicon wafers and compound semiconductor wafers have become larger and thinner. A large-diameter and thin semiconductor substrate may be warped or cracked during transportation or polishing. For this reason, after a support substrate is bonded to a semiconductor substrate and reinforced, a transport or polishing process is performed, and then a process of peeling the support substrate from the semiconductor substrate is performed.

  For example, Patent Document 1 discloses two peeling systems as a peeling system for peeling a superposed substrate in which a substrate to be processed (semiconductor substrate) and a supporting substrate are bonded to the substrate to be processed and the supporting substrate.

  The first peeling system (hereinafter referred to as “first peeling system”) includes a first carry-in / out station on which a substrate to be processed and a superposed substrate are placed, and a second carry-in on which a support substrate is placed. Deposition station, peeling device for peeling the polymerized substrate to the substrate to be processed and support substrate, cleaning device for cleaning the peeled substrate to be processed, and transport for transporting the substrate to be processed, support substrate, and polymerized substrate in the peeling system Device.

  The second stripping system (hereinafter referred to as “second stripping system”) includes a loading / unloading station on which a substrate to be processed, a support substrate, and a polymerization substrate are placed, and a substrate to be processed, a support substrate, and a polymerization substrate. A transfer region having a transfer device for transferring a substrate to be processed, a support substrate, and a superposed substrate between a peeling processing station having various processing devices for performing predetermined processing and a loading / unloading station and a peeling processing station; have. Further, the peeling processing station includes a peeling device that peels the superposed substrate into the substrate to be processed and the support substrate, a first cleaning device that cleans the peeled target substrate, and a second that cleans the peeled support substrate. And a cleaning device.

JP 2013-016579 A

  However, in the first peeling system and the second peeling system of Patent Document 1 described above, the substrate to be processed, the support substrate, and the superposed substrate are all transported by one transport device. Although the processing of the substrate has been completed, there is a case where waiting for transport of the other substrate occurs. Therefore, there is room for improvement in the throughput of the peeling process.

  Moreover, the superposition | polymerization board | substrate may be hold | maintained at the cyclic | annular dicing frame via the dicing tape. The superposed substrate and the substrate to be processed after peeling are conveyed while being held by the dicing frame, but the supporting substrate after being peeled is conveyed without being held by the dicing frame. In such a case, in the first peeling system and the second peeling system, dicing frames and substrates having different shapes are transported by one transport device, so that the control becomes complicated.

  Such a problem is a problem that may also occur in a manufacturing process such as SOI (Silicon On Insulator) that involves peeling of the substrate.

  This invention is made | formed in view of this point, and it aims at performing the peeling process of a to-be-processed substrate and a support substrate efficiently.

  In order to achieve the above object, the present invention provides a peeling system for peeling a polymerized substrate in which a substrate to be processed and a support substrate are bonded with an adhesive, to the substrate to be processed and the support substrate, A first processing block that performs processing on the substrate to be processed; and a second processing block that performs processing on the support substrate. The first processing block is mounted with the superposed substrate and the substrate to be processed. A loading / unloading station; a peeling station having a peeling device for peeling the superposed substrate from the substrate to be processed and the supporting substrate; a cleaning station having a cleaning device for cleaning the substrate to be processed; A first transfer region having a first transfer device for transferring the superposed substrate and the substrate to be processed between the peeling station and the cleaning station; Block is in the output station in which the supporting substrate is mounted, and a second transport region with a second transfer device for transferring the support substrate with respect to the output station, characterized in that it has a.

  According to the present invention, in the first processing block, the superposed substrate is carried into the carry-in / out station from the outside of the peeling system, and then the superposed substrate is peeled off from the substrate to be processed and the support substrate at the peeling station, and further peeled off at the cleaning station After the subsequent substrate to be processed is cleaned, the substrate to be processed is unloaded from the loading / unloading station to the outside of the peeling system. On the other hand, in the second processing block, the support substrate peeled off at the peeling station is carried out of the peeling system from the carry-out station. As described above, the process for the superposed substrate and the substrate to be processed and the process for the support substrate are performed separately in the first processing block and the second process block, respectively. This transport is performed by a separate first transport device and second transport device. Therefore, it is possible to reduce the conventional waiting time for transporting the substrate and to improve the throughput of the peeling process.

  Further, even when the superposed substrate (substrate to be processed) is held by the dicing frame, the transport of the superposed substrate and the target substrate held by the dicing frame and the transport of the support substrate not held by the dicing frame are: This is performed by a separate first transport device and second transport device. Therefore, it is possible to simplify the control when the superposed substrate, the substrate to be processed, and the support substrate are transported, and to efficiently perform the peeling process.

  The second processing block further includes a first delivery station and a second delivery station, and the first delivery station has a delivery device for receiving the support substrate between the peeling station and the second delivery station. The second delivery station comprises a placement part for placing the support substrate, and a moving part for moving the placement part in a horizontal direction, wherein the first delivery station and the second transfer area You may deliver the said support substrate between.

  The first processing block may further include a peripheral edge processing station including a peripheral edge processing device for removing a peripheral edge of the adhesive on the superposed substrate.

  The first processing block may further include an inspection device that inspects the state of the substrate to be processed.

  The second processing block may further include another cleaning station provided with another cleaning device for cleaning the support substrate.

  The pressure in the first processing block is positive with respect to the pressure in the second processing block, and in the first processing block, the pressure in the loading / unloading station and the first transfer area is It may be positive with respect to the pressure of the peeling station and the cleaning station.

  The superposed substrate and the substrate to be processed may be respectively held on an annular dicing frame via a dicing tape.

  According to another aspect of the present invention, there is provided a peeling method for peeling a polymerized substrate in which a substrate to be processed and a support substrate are bonded with an adhesive using a peeling system to the substrate to be processed and the support substrate, the peeling system. Includes a first processing block that performs processing on the superposed substrate and the substrate to be processed, and a second processing block that performs processing on the support substrate, and the first processing block includes the superposed substrate and the target substrate. A loading / unloading station on which a processing substrate is placed, a peeling station having a peeling device for peeling the superposed substrate from the substrate to be processed and the support substrate, and a cleaning station having a cleaning device for cleaning the substrate to be processed And a first transfer device including a first transfer device for transferring the superposed substrate and the substrate to be processed between the carry-in / out station, the peeling station and the cleaning station. The second processing block includes a carry-out station on which the support substrate is placed, and a second transfer region including a second transfer device that transfers the support substrate to the carry-out station; The peeling method includes a carrying-in step of carrying the superposed substrate into the carry-in / out station, a peeling step of peeling the superposed substrate from the substrate to be processed and the support substrate at the peeling station, In the cleaning station, in the cleaning step of cleaning the substrate to be processed peeled off in the peeling step, the first unloading step of unloading the substrate to be processed cleaned in the cleaning step from the carry-in / out station, and the peeling step A second unloading step of unloading the peeled support substrate from the unloading station.

  After the carrying-in process and before the peeling process, a peripheral edge portion of the adhesive on the superposed substrate may be removed at a peripheral edge processing station provided in the first processing block.

  You may test | inspect the state of the said to-be-processed substrate in a test | inspection apparatus after the said washing | cleaning process and before the said 1st carrying-out process.

  The support substrate may be cleaned in another cleaning station provided in the second processing block after the peeling step and before the second unloading step.

  The pressure in the first processing block is positive with respect to the pressure in the second processing block, and in the first processing block, the pressure in the loading / unloading station and the first transfer area is It may be positive with respect to the pressure of the peeling station and the cleaning station.

  The superposed substrate and the substrate to be processed may be respectively held on an annular dicing frame via a dicing tape.

  According to another aspect of the present invention, there is provided a program that operates on a computer of a control device that controls the peeling system so that the peeling method is executed by the peeling system.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to the present invention, it is possible to efficiently perform a separation process between a substrate to be processed and a support substrate.

FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 2 is a schematic side view of a superposed substrate held by a dicing frame. FIG. 3 is a schematic plan view of a superposed substrate held on a dicing frame. FIG. 4 is a flowchart showing a processing procedure of a peeling process executed by the peeling system. FIG. 5 is a schematic diagram showing a transfer route of the superposed substrate. FIG. 6 is a schematic diagram illustrating a transfer route of the substrate to be processed and the support substrate. FIG. 7 is an explanatory diagram of airflow generated in the peeling system. FIG. 8 is a schematic plan view showing a configuration of a peeling system according to another embodiment. FIG. 9 is a schematic plan view showing a configuration of a peeling system according to another embodiment. FIG. 10 is a schematic plan view showing a configuration of a peeling system according to another embodiment. FIG. 11 is a schematic diagram showing a manufacturing process of the SOI substrate. FIG. 12 is a schematic diagram showing a manufacturing process of the SOI substrate.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

  First, the structure of the peeling system which concerns on this embodiment is demonstrated with reference to FIGS. 1-3. FIG. 1 is a schematic plan view showing the configuration of the peeling system according to the present embodiment. FIG. 2 is a schematic side view of the superposed substrate held on the dicing frame, and FIG. 3 is a schematic plan view of the superposed substrate.

  In the following, in order to clarify the positional relationship, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined, and the positive direction of the Z-axis is the vertically upward direction.

  The peeling system 1 according to the present embodiment shown in FIG. 1 includes a polymerization substrate T (see FIG. 2) in which a substrate to be processed W and a support substrate S are bonded with an adhesive G, a substrate to be processed W and a support substrate S. Peel off.

  In the following, as shown in FIG. 2, the plate surface of the substrate to be processed W that is bonded to the support substrate S via the adhesive G is referred to as “bonding surface Wj”, and the bonding surface Wj Is referred to as the “non-bonding surface Wn”. In addition, among the plate surfaces of the support substrate S, the plate surface on the side bonded to the substrate W to be processed via the adhesive G is referred to as “bonding surface Sj”, and the plate surface on the opposite side to the bonding surface Sj is referred to as “ This is referred to as “non-joint surface Sn”.

  The substrate W to be processed is a substrate in which a plurality of electronic circuits are formed on a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, and a plate surface on the side where the electronic circuits are formed is used as a bonding surface Wj. Further, the substrate to be processed W is thinned by polishing the non-joint surface Wn, for example. Specifically, the thickness of the substrate W to be processed is about 20 to 50 μm.

  On the other hand, the support substrate S is a substrate having substantially the same diameter as the substrate W to be processed, and supports the substrate W to be processed. The thickness of the support substrate S is about 650 to 750 μm. As this support substrate S, a glass substrate etc. other than a silicon wafer can be used. The thickness of the adhesive G that joins the substrate to be processed W and the support substrate S is about 40 to 150 μm.

  Further, as shown in FIG. 3, the superposed substrate T is fixed to the dicing frame F. The dicing frame F is a substantially annular member having an opening Fa having a diameter larger than that of the superposed substrate T at the center, and is formed of a metal such as stainless steel. The thickness of the dicing frame F is, for example, about 1 mm.

  The superposed substrate T is fixed to the dicing frame F via the dicing tape P. Specifically, the superposed substrate T is disposed in the opening Fa of the dicing frame F, and the dicing tape P is attached to the non-joint surface Wn of the substrate W to be processed and the back of the dicing frame F so as to close the opening Fa from the back. wear. As a result, the superposed substrate T is fixed (held) to the dicing frame F.

  As shown in FIG. 1, the peeling system 1 includes two processing blocks, a first processing block 10 and a second processing block 20. The first processing block 10 and the second processing block 20 are arranged adjacent to each other in the X-axis direction in the order of the second processing block 20 and the first processing block 10.

  In the first processing block 10, the superposed substrate T is carried in, the superposed substrate T is peeled off, and the target substrate W after being peeled is washed and carried out. That is, the first processing block 10 is a block that performs processing on the substrates (the superposed substrate T and the target substrate W) held by the dicing frame F. The first processing block 10 includes a carry-in / out station 11, a standby station 12, a first transfer region 13, a peeling station 14, and a cleaning station 15.

  The carry-in / out station 11, the standby station 12, the peeling station 14, and the cleaning station 15 are disposed adjacent to the first transfer region 13. Specifically, the carry-in / out station 11 and the standby station 12 are arranged side by side on the Y-axis negative direction side of the first transfer region 13, and the two cleaning devices of the peeling station 14 and the cleaning station 15 are provided. 151 and 152 are arranged side by side on the Y axis positive direction side of the first transport region 13. Further, the other peeling device 142 of the peeling station 14 is disposed on the X-axis negative direction side of the first transfer region 13.

  The loading / unloading station 11 is provided with a plurality of cassette mounting tables 111. Each cassette mounting table 111 has a cassette Ct in which the superposed substrate T is stored or a cassette Cw in which the substrate to be processed W after peeling is stored. Is placed. At the loading / unloading station 11, the cassette Ct and the cassette Cw are loaded / unloaded between the outside.

  In the standby station 12, for example, an ID reader for reading an ID (Identification) of the dicing frame F is arranged, and the overlapped substrate T being processed can be identified by the ID reader. In the standby station 12, in addition to the ID reading process described above, a standby process for temporarily waiting the superposed substrate T waiting for processing is performed as necessary. The standby station 12 is provided with a mounting table on which a superposed substrate T transferred by a first transfer device 131 described later is mounted. On the mounting table, an ID reader and a temporary standby unit are mounted. Is done.

  In the first transport region 13, a first transport device 131 that transports the overlapped substrate T or the substrate W after separation is disposed. The first transfer device 131 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. . In the first transport region 13, the first transport device 131 transports the superposed substrate T to the standby station 12 and the stripping station 14, and transports the target substrate W after stripping to the cleaning station 15 and the carry-in / out station 11. Processing is performed.

  Two peeling devices 141 and 142 are arranged in the peeling station 14. In the peeling station 14, a peeling process for peeling the superposed substrate T into the target substrate W and the support substrate S is performed by the peeling devices 141 and 142. Specifically, the peeling apparatuses 141 and 142 peel the superposed substrate T into the target substrate W and the support substrate S in a state where the target substrate W is disposed on the lower side and the support substrate S is disposed on the upper side. As the peeling devices 141 and 142, for example, a peeling device described in JP2013-016579A can be used. In addition, the number of the peeling apparatuses arrange | positioned in the peeling station 14 is not limited to this embodiment, It can set arbitrarily. Moreover, although the peeling apparatuses 141 and 142 of the present embodiment are arranged side by side in the horizontal direction, they may be arranged in a stacked manner in the vertical direction.

  Two cleaning devices 151 and 152 are arranged in the cleaning station 15. In the cleaning station 15, a cleaning process is performed in which the substrate to be processed W after being peeled is cleaned while being held on the dicing frame F by the cleaning devices 151 and 152. As the cleaning devices 151 and 152, for example, a cleaning device described in JP2013-016579A can be used. Note that the number of cleaning devices arranged in the cleaning station 15 is not limited to this embodiment, and can be set arbitrarily. Moreover, although the washing | cleaning apparatus 151,152 of this embodiment has been arrange | positioned along with the horizontal direction, you may laminate | stack and arrange these in the perpendicular direction.

  In the second processing block 20, the support substrate S after being peeled is cleaned and carried out. That is, the second processing block 20 is a block that performs processing on a substrate (supporting substrate S) that is not held by the dicing frame F. The second processing block 20 includes a first delivery station 21, a second delivery station 22, a second transfer area 23, and a carry-out station 24.

  The first delivery station 21 is disposed on the negative side in the X direction of the peeling device 141 of the peeling station 14 and on the positive side in the Y direction of the peeling device 142. Further, the second delivery station 22 and the carry-out station 24 are arranged adjacent to the second transfer area 23. Specifically, the second delivery station 22 is arranged side by side on the Y axis positive direction side of the second transfer area 23, and the carry-out station 24 is arranged side by side on the Y axis negative direction side of the second transfer area 23.

  At the first delivery station 21, a delivery process is performed in which the peeled support substrate S is received from the peeling devices 141 and 142 of the peeling station 14 and transferred to the second delivery station 22. A delivery device 211 is arranged at the first delivery station 21. The delivery device 211 includes a non-contact holding unit such as a Bernoulli chuck, and the non-contact holding unit is configured to be rotatable about a horizontal axis. Specifically, as the delivery device 211, for example, a transport device described in JP2013-016579A can be used. And the delivery apparatus 211 conveys the support substrate S to the 2nd processing block 20 from the peeling apparatuses 141 and 142, reversing the front and back of the support substrate S after peeling.

  In the second delivery station 22, a placement unit 221 that places the support substrate S and a moving unit 222 that moves the placement unit 221 in the Y direction are arranged. The mounting unit 221 includes, for example, three support pins, and supports and mounts the non-joint surface Sn of the support substrate S. The moving unit 222 includes a rail extending in the Y direction and a driving unit that moves the placement unit 221 in the Y direction. In the second delivery station 22, after the support substrate S is placed on the placement unit 221 from the delivery device 211 of the first delivery station 21, the placement unit 221 is moved to the second transport region 23 side by the moving unit 222. . Then, the support substrate S is transferred from the placement unit 221 to the second transfer device 231 in the second transfer region 23 described later. In addition, in this embodiment, although the mounting part 221 moves only to a Y direction, in addition to this, you may be comprised so that a movement also to an X direction is possible.

  In addition, since the delivery apparatus 211 of the first delivery station 21 described above holds the support substrate S by a non-contact holding unit such as a Bernoulli chuck, the transport reliability is not high. For this reason, if the support substrate S is directly transferred from the delivery device 211 to the second transport device 231 in the second transport region 23 described later, the support substrate S may be removed. Therefore, in the present embodiment, the second delivery station 22 is provided between the first delivery station 21 and the second transfer area 23, and the support substrate S is temporarily placed on the second delivery station 22.

  In the second transport region 23, a second transport device 231 that transports the support substrate S after peeling is disposed. The second transfer device 231 includes a transfer arm unit that can move in the horizontal direction, move up and down in the vertical direction, and turn around the vertical direction, and a substrate holding unit attached to the tip of the transfer arm unit. . In the second transfer area 23, the second transfer device 231 performs a process of transferring the peeled support substrate S to the carry-out station 24.

  The unloading station 24 is provided with a plurality of cassette mounting tables 241, and each cassette mounting table 241 is mounted with a cassette Cs in which the support substrate S after peeling is stored. At the loading / unloading station 11, the cassette Cs is unloaded from the outside.

  Further, the peeling system 1 includes a control device 30. The control device 30 is a device that controls the operation of the peeling system 1. The control device 30 is a computer, for example, and includes a control unit and a storage unit (not shown). The storage unit stores a program for controlling various processes such as a peeling process. The control unit controls the operation of the peeling system 1 by reading and executing the program stored in the storage unit.

  Such a program may be recorded on a computer-readable storage medium and installed in the storage unit of the control device 30 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  Next, the peeling processing method of the to-be-processed substrate W and the support substrate S performed using the peeling system 1 comprised as mentioned above is demonstrated. FIG. 4 is a flowchart showing an example of main steps of the peeling process. FIG. 5 is a schematic diagram showing a transport route for the superposed substrate T, and FIG. 6 is a schematic diagram showing a transport route for the substrate to be processed W and the support substrate S. The peeling system 1 executes each processing procedure shown in FIG. 4 based on the control of the control device 30.

  First, a cassette Ct containing a plurality of superposed substrates T and an empty cassette Cw are placed on a predetermined cassette mounting table 111 of the carry-in / out station 11, and an empty cassette Cs is placed in the carry-out station 24. It is mounted on a predetermined cassette mounting table 241. In the peeling system 1, the first transfer device 131 of the first processing block 10 takes out the superposed substrate T from the cassette Ct placed on the carry-in / out station 11. At this time, the superposed substrate T is held from above by the substrate holding portion of the first transfer device 131 with the substrate W to be processed positioned on the lower surface and the support substrate S positioned on the upper surface. Then, the first transfer device 131 performs a substrate carry-in process for carrying the superposed substrate T taken out from the cassette Ct into the standby station 12 (see step S101 in FIG. 4 and T1 in FIG. 5).

  Subsequently, in the standby station 12, the ID reading device performs an ID reading process for reading the ID of the dicing frame F (step S102 in FIG. 4). The ID read by the ID reading device is transmitted to the control device 30. Thereafter, the superposed substrate T is taken out from the standby station 12 by the first transfer device 131 and carried into the peeling device 141 of the peeling station 14 (see T2 in FIG. 5).

  In addition, for example, when a superposed substrate T waiting for processing is generated due to a difference in processing time between apparatuses, the superposed substrate T can be temporarily kept waiting using a temporary standby unit provided in the standby station 12, Loss time between a series of steps can be shortened.

  In the peeling station 14, the peeling device 141 performs a peeling process on the superposed substrate T. By the peeling process, the superposed substrate T is separated into the target substrate W and the support substrate S (step S103 in FIG. 4).

  Thereafter, in the peeling system 1, the processing for the target substrate W after peeling is performed in the first processing block 10, and the processing for the supporting substrate S after peeling is performed in the second processing block 20. Note that the substrate to be processed W after peeling is held by the dicing frame F.

  In the first processing block 10, the substrate to be processed W after being peeled is taken out from the peeling device 141 of the peeling station 14 by the first transfer device 131 and is carried into the cleaning device 151 of the cleaning station 15 (W1 in FIG. 5). reference). In the cleaning station 15, the cleaning device 151 performs a cleaning process on the substrate to be processed W after being peeled. By such a cleaning process, the adhesive G remaining on the bonding surface Wj of the substrate W to be processed is removed (step S104 in FIG. 4).

  The substrate to be processed W after the cleaning processing is taken out from the cleaning device 151 of the cleaning station 15 by the first transfer device 131 and accommodated in the cassette Cw placed on the loading / unloading station 11 (see W2 in FIG. 5). . Thereafter, the cassette Cw containing the plurality of substrates to be processed W is unloaded from the loading / unloading station 11 and collected (step S105 in FIG. 4). Thus, the process for the substrate to be processed W is completed.

  On the other hand, in the second processing block 20, processing (step S 106 and step S 107 described later) is performed on the support substrate S after peeling in parallel with the processing of step S 104 and step S 105.

  In the second processing block 20, first, the delivery device 211 of the first delivery station 21 performs delivery processing of the support substrate S after peeling. Specifically, the delivery device 211 takes out the support substrate S after peeling from the peeling device 141 of the peeling station 14 (see S1 in FIG. 5) and carries it into the second delivery station 22 (Step S106 in FIG. 4). (See S2 in FIG. 5).

  Here, the support substrate S after peeling is in a state where the upper surface side, that is, the non-joint surface Sn side is held by the peeling device 141, and the delivery device 211 does not contact the joint surface Sj side of the support substrate S from below. Hold on. Thereafter, the delivery device 211 inverts the held support substrate S and places it on the placement unit 221 of the second delivery station 22. Thereby, the support substrate S is mounted on the mounting portion 221 with the bonding surface Sj facing upward.

  In the second delivery station 22, the placement unit 221 on which the support substrate S is placed is moved to a predetermined position on the second transfer region 23 side by the moving unit 222. The predetermined position is a position where the transfer arm unit of the second transfer device 231 can receive the support substrate S on the placement unit 221.

  Subsequently, the support substrate S is taken out from the second delivery station 22 by the second transfer device 231 and accommodated in the cassette Cs placed on the carry-out station 24 (see S3 in FIG. 5). Thereafter, the cassette Cs containing the plurality of support substrates S is unloaded from the unloading station 24 and collected (step S107 in FIG. 4). Thus, the process for the support substrate S is also completed.

  As described above, the peeling system 1 according to this embodiment includes the first processing block 10 that performs processing on the superposed substrate T and the substrate W to be processed, and the second processing block 20 that performs processing on the support substrate S. For this reason, since it becomes possible to perform the process with respect to the superposition | polymerization board | substrate T and the to-be-processed substrate W, and the process with respect to the support substrate S in parallel, a series of substrate processes can be performed efficiently. More specifically, the peeling system 1 according to the present embodiment is a front end (a carry-in / out station 11 and a first transfer) for a substrate (a superposed substrate T and a substrate to be processed W after peeling) held by a dicing frame F. Region 13) and a front end (unloading station 24 and second transport region 23) for a substrate (support substrate S after peeling) that is not held by the dicing frame F. As a result, the process of transporting the substrate W to be carried in / out the station 11 and the process of transporting the support substrate S to the carry-out station 24 can be performed in parallel. Therefore, it is possible to reduce the conventional waiting time for transporting the substrate and to improve the throughput of the peeling process.

  Further, according to the present embodiment, even if the superposed substrate T and the substrate to be processed W are held by the dicing frame F, the superposed substrate T and the substrate to be processed W held by the dicing frame F are transported and the dicing frame F is used. The transfer of the support substrate S not held by the first and second transfer devices 131 and 231 is performed separately. Therefore, compared with the conventional case where the substrate held by the dicing frame and the substrate not held by the dicing frame are transferred by one transfer device, in this embodiment, the superposed substrate T, the substrate W to be processed, and the support substrate S are used. The control at the time of conveying can be simplified, and the peeling process can be performed efficiently.

  Furthermore, in the peeling system 1 according to the present embodiment, the peeling station 14 and the second transfer area 23 are connected via the first delivery station 21 and the second delivery station 22. Thereby, since it becomes possible to carry in directly the peeling support substrate S from the peeling station 14 to the 2nd conveyance area 23, without passing through the 1st conveyance area | region 13, conveyance of the support substrate S after peeling is carried out. It can be done smoothly.

  And the 2nd delivery station 22 is provided with the mounting part 221 which mounts the support substrate S, and the moving part 222 which moves the mounting part 221 to a horizontal direction. Accordingly, when the support substrate S is delivered between the first delivery station 21 and the second transfer area 23, the placement unit 221 on which the support substrate S is placed can be moved, so that the delivery of the first delivery station 21 can be performed. There is no need to extend the non-contact holding part of the apparatus 211 or the transfer arm part of the second transfer apparatus 231 in the second transfer area 23. Therefore, the exclusive area of the 1st delivery station 21 and the 2nd conveyance area | region 23 can be made small, and the exclusive area of the peeling system 1 whole can be made small.

  Next, the air flow generated in the peeling system 1 when the peeling process of the superposed substrate T is performed in the peeling system 1 configured as described above will be described with reference to FIG. In addition, the arrow in FIG. 7 has shown the direction of the airflow.

  In the peeling system 1, the pressures in the loading / unloading station 11, the standby station 12, and the first transfer area 13 in the first processing block 10 are positive with respect to the pressures in the peeling station 14 and the cleaning station 15. If it does so, the airflow which goes to the peeling station 14 and the washing | cleaning station 15 from the 1st conveyance area | region 13 will arise, and atmosphere will not flow out from the peeling station 14 and the washing | cleaning station 15 to the 1st conveyance area | region 13. For this reason, particles generated when performing the peeling process of the superposed substrate T in the peeling station 14 and particles generated when performing the cleaning process of the substrate W to be processed in the cleaning station 15 are diffused to the first transport region 13 side. Can be suppressed. Therefore, the inside of the carrying in / out station 11, the standby station 12, and the 1st conveyance area | region 13 can be kept clean, and it can suppress that a particle adheres to the superposition | polymerization substrate T before peeling and the to-be-processed substrate W after peeling. Further, it is possible to suppress a decrease in product yield.

  Further, the pressure in the first processing block 10 becomes a positive pressure with respect to the second processing block 20. That is, the pressure in the peeling station 14 is positive with respect to the pressure in the first delivery station 21. Then, an air flow from the peeling station 14 toward the first delivery station 21 is generated.

  Further, in the second processing block 20, the pressure at the first delivery station 21 becomes positive with respect to the second delivery station 22, the second transfer region 23, and the carry-out station 24. Then, an air flow from the first delivery station 21 toward the second delivery station 22 is generated.

  In this way, an air flow from the peeling station 14 to the second delivery station 22 through the first delivery station 21 is generated, and the atmosphere in the second delivery station 22 and the first delivery station 21 does not flow out to the peeling station 14. Thereby, it can suppress that an unnecessary particle flows in into the peeling station 14, and the peeling process in the said peeling station 14 can be performed appropriately. In addition, since the support substrate S after peeling is washed after being carried out from the carry-out station 24 of the second processing block 20, it is not always necessary to keep the atmosphere in the second processing block 20 clean. From this point of view, it is preferable to positively pressurize the pressure in the first processing block 10 relative to the second processing block 20.

  Next, another embodiment of the peeling system 1 will be described.

  As shown in FIG. 8, the peeling system 1 may include a peripheral edge processing station 16 that removes the peripheral edge of the adhesive G on the superposed substrate T. The peripheral edge processing station 16 is disposed on the X axis positive direction side of the first transfer region 13 in the first processing block 10.

  In the peripheral edge processing station 16, a peripheral edge processing apparatus is arranged. The peripheral edge processing apparatus performs an edge cut process in which the peripheral edge of the adhesive G on the superposed substrate T is dissolved and removed with a solvent. Note that the peripheral edge processing apparatus dissolves the peripheral edge of the adhesive G with the solvent, for example, by immersing the polymerization substrate T in the solvent of the adhesive G.

  The edge cut processing at the peripheral edge processing station 16 is performed between step S102 and step S103 shown in FIG. That is, after the ID reading process is performed at the standby station 12 in step S <b> 102, the superposed substrate T is taken out from the standby station 12 by the first transfer device 131 and carried into the peripheral edge processing station 16. Then, at the peripheral edge processing station 16, an edge cut process is performed on the superposed substrate T. By removing the peripheral edge portion of the adhesive G by the edge cutting process, the substrate to be processed W and the support substrate S are easily peeled in the peeling process in the subsequent step S103. Therefore, the time required for the peeling process can be shortened.

  As described above, in the peeling system 1 according to the present embodiment, since the peripheral edge processing station 16 is incorporated in the first processing block 10, the superposed substrate T carried into the first processing block 10 is transferred to the first transfer device 131. And can be carried directly into the peripheral edge processing station 16. Therefore, the throughput of a series of peeling processes can be improved. Moreover, the time from the edge cut process to the peeling process can be easily managed, and the peeling performance can be stabilized.

  Moreover, as shown in FIG. 9, the peeling system 1 may have an inspection apparatus 17 that inspects the state of the substrate W after separation. The inspection device 17 is disposed on the X axis positive direction side of the first transport region 13 in the first processing block 10.

  In the inspection device 17, the presence or absence of a residue of the adhesive G on the substrate W to be processed peeled off at the peeling station 14 is inspected. Such inspection is performed, for example, by imaging the bonding surface Wj of the substrate W to be processed held by the chuck.

  The inspection of the target substrate W in the inspection apparatus 17 is performed between step S104 and step S105 shown in FIG. That is, after the processing of the substrate to be processed W is performed at the cleaning station 15 in step S104, the substrate to be processed W after cleaning is taken out from the cleaning station 15 by the first transfer device 131 and carried into the inspection device 17. Is done. Then, the inspection device 17 inspects whether or not the adhesive G remains on the substrate W to be processed. When the residue of the adhesive G is confirmed in the inspection apparatus 17, the substrate to be processed W is transferred to the cleaning station 15, and the cleaning processing is performed again on the substrate to be processed W. On the other hand, when the residue of the adhesive G is not confirmed in the inspection apparatus 17, the to-be-processed substrate W is conveyed to the carrying in / out station 11, and accommodated in cassette Cw. Thereafter, in step S105, the cassette Cw is unloaded from the loading / unloading station 11 and collected.

  As described above, in the peeling system 1 according to the present embodiment, since the inspection apparatus 17 is incorporated in the first processing block 10, the state of the substrate W to be processed is inspected by inspecting the state of the substrate W to be processed. Can be carried outside. Therefore, the product yield can be improved.

  The inspection of the target substrate W in the inspection apparatus 17 may be performed between step S103 and step S104 illustrated in FIG. For example, there may be a case where the adhesive G does not remain on the target substrate W after peeling after the peeling processing of the superposed substrate T is performed at the peeling station 14 in step S103. In such a case, if the substrate to be processed W is transported from the peeling station 14 to the inspection apparatus 17 and the presence or absence of the residue of the adhesive G on the substrate to be processed W is inspected, the residue of the adhesive G is not confirmed. The cleaning process of the substrate W to be processed in S104 can be omitted.

  The inspection of the substrate to be processed W performed by the inspection apparatus 17 is not limited to the above-described inspection for the presence or absence of the adhesive G residue on the substrate to be processed W. For example, a defect or the like of the substrate to be processed W after peeling may be inspected.

  Further, as shown in FIG. 10, the peeling system 1 may include another cleaning station 25 that performs a cleaning process on the support substrate S after peeling. The other cleaning station 25 is arranged in the second processing block 20 on the negative X-direction side of the second delivery station 22 and on the positive Y-axis side of the second transfer region 23.

  In another cleaning station 25, another cleaning device for cleaning the support substrate S after being peeled is disposed. As another cleaning apparatus, for example, a cleaning apparatus described in JP2013-016579A can be used.

  The cleaning process in the other cleaning station 25 is performed between step S106 and step S107 shown in FIG. That is, in step S <b> 106, after the peeled support substrate S is delivered from the peeling station 14 to the second delivery station 22 through the first delivery station 21, the support substrate S is secondly transferred by the second transfer device 231. It is taken out from the delivery station 22 and carried into another cleaning station 25. In another cleaning station 25, another cleaning apparatus performs a cleaning process on the support substrate S after peeling. By this cleaning process, the adhesive G remaining on the bonding surface Sj of the support substrate S is removed. The washed support substrate S is transported to the carry-out station 24 and accommodated in the cassette Cs. Thereafter, in step S107, the cassette Cs is unloaded from the loading / unloading station 11 and collected.

  As described above, in the peeling system 1 according to the present embodiment, since the other cleaning station 25 is incorporated in the second processing block 20, the support substrate S is cleaned to the outside by cleaning the support substrate S. Can be carried out. Therefore, the processing and transport of the support substrate S outside the peeling system 1 can be appropriately performed.

  In the peeling system 1 described above, the first processing block 10 may include a mounting device for attaching the dicing frame F to the superposed substrate T. In such a case, the superposed substrate T to which the dicing frame F is not attached is taken out from the cassette Ct and loaded into the mounting device. After the dicing frame F is attached to the superposed substrate T in the mounting device, the superposed substrate fixed to the dicing frame F is used. T is transported to the peeling station 14. Note that the mounting device may be arranged at an arbitrary position of the first processing block 10.

  Moreover, in the above peeling system 1, the arrangement of the processing apparatus and the transfer area of each processing station can be arbitrarily designed, and may be arranged side by side in the horizontal direction or stacked in the vertical direction. Good.

  Further, in the embodiment described above, an example in which the superposed substrate to be peeled is the superposed substrate T in which the substrate to be processed W and the support substrate S are bonded by the adhesive G has been described. However, the superposition | polymerization board | substrate used as the peeling object of a peeling apparatus is not limited to this superposition | polymerization board | substrate T. FIG. For example, in the peeling station 14, in order to generate an SOI substrate, a superposed substrate in which a donor substrate on which an insulating film is formed and a substrate to be processed are bonded to each other can be a peeling target.

  Here, a method for manufacturing an SOI substrate will be described with reference to FIGS. 11 and 12 are schematic views showing the manufacturing process of the SOI substrate. As shown in FIG. 11, the polymerization substrate Ta for forming the SOI substrate is formed by bonding a donor substrate K and a handle substrate H.

  The donor substrate K is a substrate in which the insulating film 6 is formed on the surface and the hydrogen ion implantation layer 7 is formed at a predetermined depth near the surface to be bonded to the handle substrate H. As the handle substrate H, for example, a silicon wafer, a glass substrate, a sapphire substrate, or the like can be used.

  In the stripping station 14, for example, a portion of the outer peripheral portion of the polymerization substrate Ta is pulled in a state where the donor substrate K and the handle substrate H are held by individual holding portions, thereby forming a hydrogen ion implantation layer formed on the donor substrate K. 7 is subjected to mechanical impact. Thereby, as shown in FIG. 12, the silicon-silicon bond in the hydrogen ion implantation layer 7 is cut, and the silicon layer 8 is peeled from the donor substrate K. As a result, the insulating film 6 and the silicon layer 8 are transferred onto the upper surface of the handle substrate H, and the SOI substrate Wa is formed.

  In the embodiment described above, the example in the case where the target substrate W and the support substrate S are bonded using the adhesive G has been described. However, the bonding surfaces Wj and Sj are divided into a plurality of regions, and each region is divided. Adhesives with different adhesive strengths may be applied.

  In the above-described embodiment, an example in which the superposed substrate T is held by the dicing frame F has been described. However, the superposed substrate T is not necessarily held by the dicing frame F.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood.

DESCRIPTION OF SYMBOLS 1 Peeling system 10 1st processing block 11 Carry-in / out station 12 Standby station 13 1st conveyance area 14 Peeling station 15 Cleaning station 16 Peripheral part processing station 17 Inspection apparatus 20 2nd processing block 21 1st delivery station 22 2nd delivery station 23 Second transfer area 24 Unloading station 25 Other cleaning station 30 Control device 131 First transfer device 141, 142 Peeling device 151, 152 Cleaning device 211 Delivery device 221 Placement unit 222 Moving unit 231 Second transfer device F Dicing frame P Dicing Tape S Support substrate T Polymerized substrate W Processed substrate

Claims (15)

A separation system for separating a substrate to be processed and a support substrate by bonding with a bonding agent, the substrate to be processed and the support substrate,
A first processing block for performing processing on the superposed substrate and the substrate to be processed;
A second processing block that performs processing on the support substrate,
The first processing block includes:
A loading / unloading station on which the superposed substrate and the substrate to be processed are placed;
A peeling station comprising a peeling device for peeling the superposed substrate from the substrate to be processed and the support substrate;
A cleaning station including a cleaning device for cleaning the substrate to be processed;
A first transfer region including a first transfer device for transferring the superposed substrate and the substrate to be processed between the carry-in / out station, the peeling station, and the cleaning station;
The second processing block includes
A carry-out station on which the support substrate is placed;
And a second transfer region having a second transfer device for transferring the support substrate to the carry-out station. The second processing block further includes a first delivery station and a second delivery station,
The first delivery station comprises a delivery device for receiving the support substrate between the peeling station and the second delivery station;
The second delivery station includes a placement unit for placing the support substrate, and a moving unit for moving the placement unit in the horizontal direction, and between the first delivery station and the second transfer region. The peeling system according to claim 1, wherein the support substrate is delivered. 3. The peeling system according to claim 1, wherein the first processing block further includes a peripheral edge processing station including a peripheral edge processing apparatus that removes a peripheral edge of the adhesive on the superposed substrate. The peeling system according to any one of claims 1 to 3, wherein the first processing block further includes an inspection device for inspecting a state of the substrate to be processed. 5. The peeling system according to claim 1, wherein the second processing block further includes another cleaning station provided with another cleaning device for cleaning the support substrate. 6. The pressure in the first processing block is positive with respect to the pressure in the second processing block,
In the first processing block, the pressure in the carry-in / out station and the first transfer region is a positive pressure with respect to the pressures in the peeling station and the cleaning station. The peeling system according to any one of the above. The peeling system according to any one of claims 1 to 6, wherein the superposed substrate and the substrate to be processed are each held by an annular dicing frame via a dicing tape. A peeling method using a peeling system to peel a polymerization substrate in which a substrate to be processed and a support substrate are bonded with an adhesive, to the substrate to be processed and the support substrate,
The peeling system includes
A first processing block for performing processing on the superposed substrate and the substrate to be processed;
A second processing block that performs processing on the support substrate,
The first processing block includes:
A loading / unloading station on which the superposed substrate and the substrate to be processed are placed;
A peeling station comprising a peeling device for peeling the superposed substrate from the substrate to be processed and the support substrate;
A cleaning station including a cleaning device for cleaning the substrate to be processed;
A first transfer region including a first transfer device for transferring the superposed substrate and the substrate to be processed between the carry-in / out station, the peeling station, and the cleaning station;
The second processing block includes
A carry-out station on which the support substrate is placed;
A second transfer area comprising a second transfer device for transferring the support substrate to the unloading station;
The peeling method includes:
A loading step of loading the superposed substrate into the loading / unloading station;
In the peeling station, a peeling step of peeling the superposed substrate from the substrate to be processed and the support substrate;
In the cleaning station, a cleaning step of cleaning the substrate to be processed peeled off in the peeling step;
A first unloading step of unloading the substrate to be processed cleaned in the cleaning step from the loading / unloading station;
A second unloading step of unloading the support substrate peeled in the peeling step from the unloading station. 9. The peripheral portion of the adhesive on the superposed substrate is removed at a peripheral portion processing station provided in the first processing block after the carrying-in step and before the peeling step. The peeling method as described. The peeling method according to claim 8 or 9, wherein the state of the substrate to be processed is inspected by an inspection apparatus after the cleaning step and before the first unloading step. The said support substrate is wash | cleaned in the other washing | cleaning station provided in the said 2nd process block after the said peeling process and before the said 2nd carrying-out process. The peeling method according to one item. The pressure in the first processing block is positive with respect to the pressure in the second processing block,
The pressure in the carry-in / out station and the first transfer area in the first processing block is a positive pressure with respect to the pressure in the peeling station and the cleaning station. The peeling method as described in any one. The peeling method according to any one of claims 8 to 12, wherein the superposed substrate and the substrate to be processed are each held by an annular dicing frame via a dicing tape. The program which operate | moves on the computer of the control apparatus which controls the said peeling system so that the peeling method as described in any one of Claims 8-13 may be performed by a peeling system. A readable computer storage medium storing the program according to claim 14.

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