JP7437599B2 - Substrate processing equipment and substrate processing method - Google Patents

Description

The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Photolithography is performed as one of the steps in the manufacturing process of semiconductor devices. In photolithography, a resist is applied to a semiconductor wafer (hereinafter referred to as wafer), which is a substrate, to form a resist film, and a developer is supplied to develop the exposed resist film. . For example, Patent Document 1 describes a substrate processing apparatus that forms and develops such a resist film.

JP 2019-4072 Publication

The present disclosure provides a technique that can reduce the occupied floor space in a substrate processing apparatus.

The present disclosure provides a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid.
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and back sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
a second processing module that is provided to protrude from the transport path to one or the other side of the front and rear, and performs processing on the substrate different from processing performed by the first processing module;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
the second processing module overlaps with the delivery section;
The delivery section includes a plurality of substrate mounting sections arranged in a vertical direction and on which the substrates are respectively placed,
The third transport mechanism is
a protruding side transport mechanism provided on a side where the second processing module protrudes with respect to the transport path, overlapping the second processing module;
a non-protruding side transport mechanism provided on a side opposite to the protruding side with respect to the transport path,
the non-protruding side transport mechanism transports the substrate between the second processing module and the substrate platform;
The protrusion-side transport mechanism transports the substrate between each substrate platform.
The present disclosure provides a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid.
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
a second processing module that is provided so as to protrude from the transport path in one or the other direction, and that performs processing on the substrate that is different from the processing performed by the first processing module;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
The second transport mechanism is
a lower transport mechanism that delivers the substrate to the liquid processing module at a lower level among the plurality of levels and the first processing module at a height at the lower level;
an upper transport mechanism that delivers the substrate to the liquid processing module at an upper level among the plurality of levels and the first processing module at a height in the upper level;
including;
The lower layer and the upper layer are each composed of a plurality of layers,
The delivery unit has a height of an uppermost layer among the layers to which the substrate is transported by the lower transport mechanism, and a height of the lowermost layer among the layers to which the substrate is transported by the upper transport mechanism; provided for each.
The present disclosure provides a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid.
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
a second processing module that is provided so as to protrude from the transport path in one or the other direction, and that performs processing on the substrate that is different from the processing performed by the first processing module;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
The plurality of first processing modules include a first processing module provided across two adjacent hierarchies.
The present disclosure provides a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid.
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
The substrate transport block is provided above the substrate transport area by the first transport mechanism so that the front and back length is longer than the left and right length, and the substrate is processed by the first processing module. a second processing module that performs different processing;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
The second transport mechanism is
a lower transport mechanism that delivers the substrate to the liquid processing module at a lower level among the plurality of levels and the first processing module at a height at the lower level;
an upper transport mechanism that delivers the substrate to the liquid processing module at an upper level among the plurality of levels and the first processing module at a height in the upper level;
including;
The lower layer and the upper layer are each composed of a plurality of layers,
The delivery unit has a height of an uppermost layer among the layers to which the substrate is transported by the lower transport mechanism, and a height of the lowermost layer among the layers to which the substrate is transported by the upper transport mechanism; provided for each.
The present disclosure provides a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid.
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
The substrate transport block is provided above the substrate transport area by the first transport mechanism so that the front and back length is longer than the left and right length, and the substrate is processed by the first processing module. a second processing module that performs different processing;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
The plurality of first processing modules include a first processing module provided across two adjacent hierarchies.

According to the present disclosure, it is possible to reduce the occupied floor space in the substrate processing apparatus.

1 is a cross-sectional plan view of a substrate processing apparatus that is an embodiment of the present disclosure. FIG. 3 is a longitudinal sectional front view of the substrate processing apparatus. FIG. 3 is a vertical side view of the substrate processing apparatus. FIG. 3 is a vertical side view of the substrate processing apparatus. FIG. 3 is a longitudinal side view showing an example of an inspection module provided in the substrate processing apparatus. FIG. 3 is a schematic diagram of a substrate transport path in the substrate processing apparatus. FIG. 7 is a longitudinal side view schematically showing another example of the substrate processing apparatus. FIG. 3 is a cross-sectional plan view of a substrate processing apparatus that is another embodiment of the present disclosure. FIG. 3 is a vertical side view of the substrate processing apparatus. FIG. 3 is a vertical side view of the substrate processing apparatus. FIG. 7 is a cross-sectional plan view of a substrate processing apparatus that is still another embodiment of the present disclosure. FIG. 3 is a vertical side view of the substrate processing apparatus. FIG. 3 is a schematic diagram of a substrate transport path in the substrate processing apparatus. FIG. 7 is a cross-sectional plan view of a substrate processing apparatus that is still another embodiment of the present disclosure.

(First embodiment)
A first embodiment of the substrate processing apparatus of the present disclosure will be described with reference to a cross-sectional plan view in FIG. 1, a vertical front view in FIG. 2, and a vertical cross-sectional side view in FIGS. 3 and 4. The substrate processing apparatus 1 is installed, for example, in a clean room of a semiconductor manufacturing factory, and performs a resist liquid coating process on a wafer W as a liquid process. This substrate processing apparatus 1 is configured such that a carrier block D1 and a processing block D2 are arranged in a row in the horizontal direction (left and right direction) and are connected to each other, and the heights of the bottoms of the carrier block D1 and the processing block D2 are different from each other. All are available. The carrier block D1 serves as a substrate transport block.

In the following description, the carrier block D1 is viewed on the left and the processing block D2 is viewed on the right, and the arrangement direction of these blocks D1 and D2 is assumed to be the left-right direction. Further, regarding the front-rear direction of the device, when the carrier block D1 is viewed to the left, the front is the front, and the back is the rear. In each figure, in the X direction, Y direction, and Z direction that are orthogonal to each other, the X direction indicates the front-rear direction, the Y direction indicates the left-right direction, and the Z direction indicates the height direction. Note that FIGS. 3 and 4 show longitudinal side views of the substrate processing apparatus 1, and show longitudinal sections of a part of the apparatus at different positions on the left and right sides.

The carrier block D1 is configured to transport a container containing a plurality of wafers W by an external transport mechanism (not shown) provided outside the substrate processing apparatus 1, and to transfer wafers between the container and the inside of the substrate processing apparatus 1. It plays the role of transferring W. As the container, for example, a carrier C called FOUP (Front Opening Unify Pod) is used. The right side of the casing 11 constituting the carrier block D1 protrudes upward so as to be higher than the left side, thereby forming a step when viewed from the front. The left and right sides of the casing 11 configured in this manner are defined as a low body part 12 and a high body part 13, respectively.

The low body part 12 forms a container placement part on which the carrier C is placed, and four carrier stages 14 are provided on the upper surface thereof at intervals in the front-rear direction. The carrier C is placed on the carrier stage 14 in order to carry the wafer W into and out of the substrate processing apparatus 1 . A transfer port 15 for the wafer W is opened at a position corresponding to the carrier stage 14 in a side wall that forms the tall portion 13 of the casing 11 and faces left, and the transfer port 15 is opened and closed by an opening/closing mechanism 16. Ru.

In the housing 11, a first transport mechanism 17 is provided in the tall section 13 to transfer the wafer W between the carrier C on the carrier stage 14 and the processing block D2. The first transport mechanism 17 includes a moving body 171 configured to be movable in the front-rear direction (X direction), rotatable around a vertical axis, and movable up and down; A holding body 172 that holds the.

A fan filter unit (FFU) 18 is disposed above the transport area 10 of the first transport mechanism 17 in the tall section 13 . The fan filter unit 18 sucks air around the substrate processing apparatus 1 through a suction path (not shown), cleans the air through a filter, and supplies it downward to form a downflow. It is composed of The above filter constituting the fan filter unit 18 is provided over the entire movement area of the first transport mechanism 17 in the carrier block D1 in plan view, and a downward airflow is formed over the entire movement area. For example, the air that formed the downdraft is removed from an exhaust port (not shown) at the bottom of the housing 11. Incidentally, although downflows are formed at various locations such as the conveyance path of the processing block D2, illustration of the mechanism for forming the downflows is omitted.

Next, processing block D2 will be explained. The processing block D2 is composed of a rectangular casing 21, and a wafer W transport path 20 extending left and right is provided at the center in the front-rear direction in plan view. The transport path 20 is an area where the wafer W is transported by a second transport mechanism, which will be described later, and extends from the left end to the right end in the left-right direction in the housing 21 of the processing block D2, as shown in FIG. It is formed like this.

The processing block D2 is provided with a resist coating module 3, which is a liquid processing module that supplies a resist solution as a processing solution to the wafer W (that is, coats the resist) to form a resist film. In this example, the resist coating module 3 is installed in front of the transport path 20 so as to face the transport path 20 . As shown in FIGS. 2 and 3, this processing block D2 is configured by stacking a plurality of layers each including a resist coating module 3.

In this example, the processing block D2 includes six levels E1 to E6, and each level E1 to E6 is provided with one resist coating module 3. Thus, as shown in FIG. 2, when the processing block D2 is viewed from the front, the resist coating modules 3 are arranged in a row in the vertical direction, and the left and right positions of each resist coating module 3 are aligned. FIG. 1 is a cross-sectional plan view showing the level E6 of the processing block D2, and for the carrier block D1, a cross-sectional plan view of the lower position of the fan filter unit 18 is shown.

The resist coating module 3 includes a partition wall 31 that partitions the module into a region adjacent to the transport path 20 and the liquid processing module. A transport port (not shown) is formed. As schematically shown in FIGS. 1 and 2, the resist coating module 3 includes only one cup 32 for surrounding and processing the wafer W, and the cup 32 holds the back surface of the wafer W by suction. A spin chuck 33 for rotation is provided. The resist coating module 3 also includes a nozzle 34 for discharging resist liquid onto the surface of the wafer W, and this nozzle 34 is moved by a moving mechanism 35 onto the wafer W inside the cup 32 and onto the outside of the cup 32 shown in FIG. It is configured to be movable between the standby position and the standby position.

Furthermore, as shown in FIG. 1, behind the conveyance path 20 in the processing block D2, a plurality of heat treatment modules 4, for example, three, which are first treatment modules are lined up on the left and right so as to face the conveyance path 20. It is set in. The heat treatment modules 4 in this example are arranged in each of the floors E1 to E6, as shown in FIG. Therefore, when the processing block D2 is viewed from the rear, a plurality of heat treatment modules 4, for example, six stages, are provided in the vertical direction. In this way, for example, in the processing block D2, the heat treatment modules 4 are provided in three rows on the left and right, and among the three rows, the positions of the heat treatment modules 4 constituting the same row on the left and right are aligned.

The heat treatment module 4 in this example is a module that performs a heat treatment (PAB: Pre applied bake) on the wafer W after forming a resist film. In this heat treatment module 4, a process is performed in which the wafer W on which the resist film is formed is heated to remove the solvent in the resist film. For example, the heat treatment module 4 includes a hot plate 42 for heating the wafer W and a cooling plate 43 for adjusting the temperature of the wafer W, as schematically shown in FIG. The hot plate 42 and the cooling plate 43 are arranged one behind the other so that the cooling plate 43 faces the transport path 20. It is configured to transport W.

The processing block D2 is provided with a second transport mechanism 5 that moves along the transport path 20 and transports the wafer W between the resist coating module 3 and the heat treatment module 4. The second transport mechanism 5 in this example includes a lower transport mechanism 51 and an upper transport mechanism 52, and the lower transport mechanism 51 carries the wafer configured to convey. Further, the upper transport mechanism 52 is configured to transport the wafer W to the resist coating module 3 and heat treatment module 4 on the upper level. The lower layer and the upper layer each consist of a plurality of layers, and in this example, the lower layer consists of three layers E1 to E3, and the upper layer consists of three layers E4 to E6, respectively.

As shown in FIGS. 1 and 3, the second transport mechanism 5 (lower transport mechanism 51 and upper transport mechanism 52) has two holders 53 each holding a wafer W, and each holder 53 is independent of the other. A moving body 54 that moves forward and backward. The movable body 54 is rotated around a vertical axis by a rotating part 55, and the rotating part 55 is raised and lowered by an elevating part 56, and the elevating part 56 is moved in the left-right direction (Y direction) by a moving mechanism 57. configured to be possible. For example, the holding body 53, the movable body 54, the rotating part 55, and the elevating part 56 are provided in the conveyance path 20, and the moving mechanism 57 is provided below the heat treatment module 4. Note that the first transport mechanism 17 of the carrier block D1 described above is configured in the same manner as the second transport mechanism 5, except that the direction of movement by the moving mechanism 57 is different.

Further, the processing block D2 is provided with a second processing module and a third transport mechanism that delivers the wafer W to the second processing module. The second processing module is a module that performs processing on the wafer W that is different from the processing performed by the first processing module (thermal processing module 4). In this example, a case will be described in which the second processing module is the inspection module 6 for inspecting the wafer W before processing by the resist coating module 3 and after processing by the heat treatment module 4. An inspection module for inspecting the wafer W before processing by the resist coating module 3 is referred to as a pre-processing inspection module 61 (WIS1), and an inspection module for inspecting the wafer W after processing by the heat treatment module 4 is referred to as a post-processing inspection module 62 (WIS2). .

These pre-processing inspection module 61 and post-processing inspection module 62 are provided to protrude forward from the transport path 20, for example, in the processing block D2. In this example, these inspection modules 6 (61, 62) are arranged in a vertically stacked manner at the height of the floor E6 in a region adjacent to the carrier block D1 on the transport path 20. As will be described later, the pre-processing inspection module 61 and the post-processing inspection module 62 include a vertically elongated casing 63 that is rectangular in plan view, and the long side direction of the casing 63 is in the front-rear direction (X direction) of the processing block D2. installed along the line. In addition, the pre-processing inspection module 61 and the post-processing inspection module 62 constitute a part (protruding part) 60 in which the front surface of the casing 63 protrudes from the front of the transport path 20, and the back surface of the casing 63 forms a part (protruding part) 60 that protrudes from the front of the transport path 20. It is placed so that it faces the rear area. The protrusion 60 is located side by side with the cup 32, and for example, the front end of the protrusion 60 is located slightly forward of the center of the cup 32.

In the processing block D2, the third transport mechanism 7 is provided on the side where the test module 6 (61, 62) protrudes with respect to the transport path 20, so that the wafer W can be transported to the test module 6 (61, 62). is installed on the opposite side. In this example, since the inspection modules 6 (61, 62) are provided so as to protrude forward from the transport path 20, the third transport mechanism 7 is located in the area adjacent to the carrier block D1 at the rear of the transport path 20. will be placed in In this way, the third transport mechanism 7 and the heat treatment module 4 are provided in the rear of the transport path 20 in order from the carrier block D1 side.

As shown in FIGS. 1 and 4, the third transport mechanism 7 has the same structure as the second transport mechanism 5, except that the moving mechanism 57 is not provided. In other words, the two holders 71 each holding a wafer W are movable forward and backward by the movable body 72, the movable body 72 is rotatable by the rotating part 73, and the rotary part 73 is movable up and down by the elevating part 74.

The inspection module 6 (pre-processing and post-processing inspection modules 61, 62) will be described with reference to FIG. 5. The inspection module 6 includes a flat casing 63 that is rectangular in plan view, and assuming that the long side direction of the casing 63 is the front-back direction, a rear side wall of the casing 63 corresponds to the third transport mechanism 7. A transfer port 631 for the wafer W is formed at the position. A mounting section 64 that holds the wafer W horizontally is provided inside the casing 63, and this mounting section 64 has two positions within the casing 63: a standby position indicated by a solid line in FIG. It is configured to be movable by a moving mechanism 641 between the movement completion position shown in FIG. The standby position is a position where the wafer W is transferred to and from the third transport mechanism 7. The moving direction of the mounting section 64 is the long side direction of the casing 63 (namely, the front-back direction).

Inside the housing 63, above the movement path of the wafer W by the mounting unit 64, there is a horizontally long half mirror 65 extending in the short side direction of the housing 63, and light is irradiated downward through this half mirror 65. A lighting 66 is provided. Reference numeral 67 in FIG. 5 indicates a camera, which irradiates light from the illumination 66 to an irradiation area below the half mirror 65, and reflects light from an object in this irradiation area by the half mirror 65 and captures it into the camera 67. In this way, the camera 67 is configured to image an object located in the imaging area below the half mirror 65.

In the inspection module 6, the camera 67 intermittently captures images while the mounting section 64, which has received the wafer W at the standby position, moves toward the movement completion position, so that the entire surface of the wafer W is covered. An image is captured and image data is acquired. This image data is transmitted from the camera 67 to a control section 100, which will be described later, and the control section 100 inspects the surface of the wafer W based on this image data. Note that the mounting unit 64 that has moved to the movement completion position moves to a standby position in order to deliver the wafer W to the third transport mechanism 7. The wafer W at the above-mentioned movement completion position is located in front of the wafer W that is moved along the transport path 20 by the second transport mechanism 5. In other words, when a processing module protrudes from the transport path 20 to either the front or the rear of the transport path 20, it does not include that the moving area of the wafer W in the processing module protrudes forward or backward with respect to the transport path 20. I'm here.

The inspection module 6 and the third transport mechanism 7 may be arranged in a positional relationship such that the third transport mechanism 7 can transport the wafer W to the mounting section 64 in the standby position in the test module 6. Therefore, in the processing block D2, if there are no restrictions such as walls, the back surface (rear side wall) of the casing 63 of the inspection module 6 may be located on the rear side of the transport path 20, or the casing may 63 may be located forward of the rear end of the conveyance path 20.

To the left of the transport path 20 in the processing block D2, an area adjacent to the carrier block D1 in plan view is provided as an installation area 80 for the delivery section 8. The transfer unit 8 is configured to transfer the wafer W between the first transfer mechanism 17, the second transfer mechanism 5 (lower transfer mechanism 51 and upper transfer mechanism 52), and third transfer mechanism 7. , on which the wafer W is placed. The delivery section 8 in this example includes a plurality of substrate placement sections arranged in a vertical direction and on which wafers W are placed, and includes inspection modules 6 (61, 62) as shown in FIGS. 2 and 4. It is provided below.

For example, as shown in FIG. 4, the delivery section 8 is arranged at the height of the floors E2 to E5. However, the delivery unit 8 is located at least at the height position of the floor E3, which is the uppermost floor among the floors where the wafer W is transported by the lower transport mechanism 51, and the height position of the floor where the wafer W is transported by the upper transport mechanism 52. Among them, it is sufficient that the height position of the layer E4, which is the lowest layer, is provided.

The substrate platform in this example includes a platform module (TRS) 81 on which the wafer W is placed, and a temperature control module (SCPL) 82. 82 are stacked in multiple stages. For example, one mounting module 81 is configured to be able to vertically mount a plurality of wafers W. Further, the temperature adjustment module 82 has a temperature adjustment function to adjust the temperature of the wafer W before the processing by the resist coating module 3 and the heat treatment module 4.

Specifically, the mounting module (TRS) 81 and the temperature control module (SCPL) 82 are configured by vertically providing multiple plates on which wafers W are mounted, for example. For example, by making the outer shape of the plate correspond to the shape of the transport mechanism, or by forming a groove on the surface of the plate that corresponds to the shape of the transport mechanism, each transport mechanism can be raised and lowered relative to the surface of the plate. It is configured. The wafer W is transferred between the transport mechanism and the plate by the vertical movement of the transport mechanism.

Further, the temperature adjustment module 82 is configured such that the plate is provided with a coolant flow path and the plate is cooled to a desired temperature. Further, the mounting module 81 has a plurality of pins arranged in the horizontal direction in multiple stages vertically, and a transport mechanism moves up and down with respect to the pins in each stage, and the wafer W is placed on the pins in each stage. It is also possible to have a configuration in which Here, in order to distinguish the mounting module 81 and the temperature adjustment module 82 provided in the delivery section 8, numbers are attached after TRS and SCPL, respectively. Furthermore, hereinafter, the mounting module may be referred to as "TRS" and the temperature adjustment module may be referred to as "SCPL".

The wafer W is transferred to each module located at the height of the floors E2 and E3 of the transfer section 8 by the first transfer mechanism 17, the lower transfer mechanism 51, and the third transfer mechanism 7. Further, the wafer W is transferred to each module located at the height of the floors E4 and E5 of the transfer section 8 by the first transfer mechanism 17, the upper transfer mechanism 52, and the third transfer mechanism 7. Therefore, the first transport mechanism 17, the lower transport mechanism 51, the upper transport mechanism 52, and the third transport mechanism 7 each have a moving area so that the wafer W can be transported to the corresponding module of the delivery section 8. It is set.

On the other hand, the first transport mechanism 17 and the second transport mechanism 5 are operated from the left and right directions with respect to the substrate mounting section, and the third transport mechanism 7 is operated from the front and back directions relative to the substrate mounting section of the delivery section 8. The wafers W are transferred to each other. Therefore, the delivery section 8 is configured in a shape that allows the first transport mechanism 17, the second transport mechanism 5, and the third transport mechanism 7 to transport the wafer W.

FIG. 4 shows an example of the configuration of the delivery section 8. In this example, TRS1 and TRS3 are mounting modules 81 for carrying in wafers W from carrier block D1 to processing block D2, and TRS2 and TRS4 are mounting modules 81 for carrying out wafers W from processing block D2 to carrier block D1. For example, TRS1, TRS2, SCPL1, and SCPL2 are provided at a height position where the wafer W is transported by the lower transport mechanism 51. Furthermore, TRS3, TRS4, SCPL3, and SCPL4 are provided at a height position where the wafer W is transported by the upper transport mechanism 52. Note that, in reality, more loading modules (TRS) 81 and temperature adjustment modules 82 (SCPL) are mounted in the delivery section 8 than in the above configuration example.

In this example, a storage area 22 is provided in the area to the left of the resist coating module 3 in front of the transport path 20 in the processing block D2, as shown in FIG. In the storage area 22, a bottle is arranged to store the resist solution supplied to the wafer W by each resist coating module 3, and the resist solution in the bottle is supplied to each resist coating module 3 via a supply system (not shown). It is supplied to the nozzle 34. As shown in FIGS. 2 and 4, in the inspection module 6, the protrusion 60 that protrudes forward from the transport path 20 and the storage area 22 are configured to overlap in plan view.

Further, the area to the right of the resist coating module 3 in front of the conveyance path 20 is configured as an auxiliary equipment installation area 36 in which auxiliary equipment of the resist coating module 3 is installed. This incidental equipment includes a cable for supplying power to the module, an exhaust duct for exhausting the inside of the cup 32 that constitutes the module, a drain pipe for draining liquid from the module, and a drain pipe for supplying processing liquid to the module. This includes supply pipes, etc. The cup 32 is connected to an exhaust source such as an exhaust path in a factory via an exhaust duct, and the inside of the cup 32 is exhausted, and a drain pipe, which is ancillary equipment, is connected to the cup 32.

Further, an area extending from the right side to the rear of the third transport mechanism 7 in the processing block D2 is configured as, for example, an ancillary equipment installation area 44 of the heat treatment module 4. This incidental equipment includes a cable that supplies power to the module, an exhaust duct that exhausts the inside of the module, and the like. Note that the area above the fan filter unit 18 of the carrier block D1 is configured as an equipment installation area 23 in which, for example, various electrical equipment (electrical equipment) are provided.

The layers E2 to E5 of the processing block D2 are configured in the same manner as the layer E6, except that a delivery section 8 is provided instead of the inspection module 6. Furthermore, the hierarchy E1 is configured similarly to the hierarchy E6 except that the inspection module 6 and the delivery section 8 are not provided. As described above, wafers W are transported by the lower transport mechanism 51 to each module provided on the floors E1 to E3. As described above, wafers W are transferred to each module provided in floors E4 to E6 by the upper transfer mechanism 52. The module is configured as a place where the wafer W is placed, and includes each TRS of the delivery section 8, the SCPL, a resist coating module 3, and a heat treatment module 4.

The substrate processing apparatus 1 includes a control section 100 (see FIG. 1). This control unit 100 is constituted by a computer, and includes a program, memory, and CPU. A group of steps is incorporated into the program so that a series of operations in the substrate processing apparatus 1 can be executed. Then, according to the program, the control section 100 outputs a control signal to each section of the substrate processing apparatus 1, and the operation of each section is controlled to carry out the transport of the wafer W and the processing of the wafer W, which will be described later. The above program is stored in a storage medium such as a compact disk, hard disk, or DVD, and installed in the control unit 100.

Next, an example of the transport path of the wafer W in the substrate processing apparatus 1 will be described using an example in which the wafer W is inspected by the pre-processing inspection module 61 and the post-processing inspection module 62. First, a carrier C containing a plurality of wafers W is placed on the container placement portion (low body portion) 12 of the carrier block D1 by an external transfer mechanism (not shown). Subsequently, the wafer W in the carrier C is transferred by the first transfer mechanism 17 to TRS1 or TRS3 of the transfer section 8 of the processing block D2.

The wafer W transferred to the TRS1 (hereinafter referred to as "wafer W1") is a wafer that is processed in the lower levels E1 to E3. On the other hand, the wafer W transferred to the TRS3 (hereinafter referred to as "wafer W2") is a wafer processed at the upper levels E4 to E6. Hereinafter, reference will also be made to FIG. 6, which schematically shows the conveyance path. In FIG. 6, the transport paths of the wafers W1 and W2 are indicated by a dashed-dotted arrow and a dashed-double arrow, respectively. Furthermore, a transport mechanism used for transporting between the modules indicated by the arrow is shown in a circular frame near each arrow.

The wafer W1 of the TRS1 is transferred to the pre-processing inspection module 61 by the third transfer mechanism 7, and the surface of the wafer W1 is inspected as described above. The surface inspection in the pre-processing inspection module 61 is, for example, an inspection for the presence or absence of scratches on the wafer W1. Next, the inspected wafer W1 is transferred from the third transfer mechanism 7 to the SCPL1 of the transfer section 8, and is adjusted to a desired temperature. Subsequently, the wafer W1 is transported by the lower transport mechanism 51 to the resist coating module 3 of one of the levels E1, E2, and E3, and a resist liquid treatment is performed. This resist liquid treatment is performed by supplying resist liquid, which is a processing liquid, from a nozzle 34 to the rotation center of the wafer W1 on the spin chuck 33 while rotating the spin chuck 33 on which the wafer W1 is placed. It will be done. The resist liquid supplied almost to the center of the wafer W1 spreads outward due to the centrifugal force of rotation, and is applied to the entire surface of the wafer W1.

Thereafter, the wafer W1 is transported by the lower transport mechanism 51 to the heat treatment module 4 at the same level as the resist coating module 3 that has performed the liquid treatment of the resist solution, for example. Here, the wafer W1 is transferred by the lower transport mechanism 51 to the hot plate 42 via the cooling plate 43, and heated by the hot plate 42 to a temperature higher than the temperature at which the solvent in the resist solution volatilizes. After the solvent contained in the resist film formed on the wafer W1 is volatilized and removed by this heat treatment, the wafer W1 is received from the hot plate 42 to the cooling plate 43, and the temperature thereof is adjusted by the cooling plate 43.

Subsequently, the wafer W1 is transferred to the SCPL2 of the transfer section 8 by the lower transfer mechanism 51, and the temperature is adjusted to a desired temperature. Thereafter, the wafer W1 is transferred to the post-processing inspection module 62 by the third transfer mechanism 7, and the surface of the wafer W is inspected as described above. The surface inspection in the post-processing inspection module 62 is, for example, an inspection for defects in a resist film formed on a wafer. The inspected wafer W is then transported along the path of the third transport mechanism 7→TRS2 of the transfer unit 8→first transport mechanism 17 of the carrier block D1, and is returned to the original carrier, for example.

On the other hand, the wafer W2 of the TRS 3 is transported along the path from the third transport mechanism 7 to the pre-processing inspection module 61, and is inspected as described above. Next, the inspected wafer W2 is transported along the path of the third transport mechanism 7 → SCPL 3 → upper transport mechanism 52 → any one of the resist coating modules 3 on the floors E4, E5, and E6, and the resist solution is processed. be done. Subsequently, the wafer W2 is transported along the path of upper transport mechanism 52 → heat treatment module 4 on the same level as the resist coating module 3 → upper transport mechanism 52 → SCPL 4 → third transport mechanism 7 → post-processing inspection module 62, The tests mentioned above are carried out. The wafer W after inspection is transported along the path of third transport mechanism 7→TRS4→first transport mechanism 17→carrier C.

Further, when only the inspection by the post-processing inspection module 62 is performed, the wafer W in the carrier C is transferred from the first transport mechanism 17 to the TRS1 and TRS3 of the delivery section 8 to the second transport mechanism 51 and 52 to SCPL1. , SCPL3, and thereafter along the route explained with reference to FIG. 6, for example. When only the inspection by the pre-processing inspection module 61 is performed, the wafer W in the carrier C is transported along the route explained in FIG. 6 until it reaches the heat treatment module 4. The heat treatment module 4 and subsequent parts are transported along the route of second transport mechanisms 51, 52→TRS2, TRS4→first transport mechanism 17→carrier C. Note that the transport route described here is an example, and the transport route can be set as appropriate.

For example, when carrying the wafer W into the post-processing inspection module 62, it is shown that the wafer W is transferred to the SCPLs 2 and 4 immediately before the wafer W is carried into the post-processing inspection module 62; may be conveyed to the TRS immediately before. That is, the TRS on which the wafer W immediately before being carried into the post-processing inspection module 62 is placed may be provided in the delivery section 8. Furthermore, although the wafers W unloaded from the carrier C are shown to be transported to different TRSs (TRS1, TRS3) for each transport destination layer, they may be transported to the same TRS.

According to the embodiment described above, the substrate processing apparatus 1 includes the carrier block D1 including the first transport mechanism 17 and the processing block D2 including the second transport mechanism 5 and various processing modules. . The processing block D2 is provided with an inspection module 6, which is one of the processing modules, and a third transfer mechanism 7 that transfers the wafer W to the inspection module 6. It has a rectangular shape in plan view. The inspection module 6 having such a shape overlaps the transfer section 8 for transferring the wafer W between the carrier block D1 and the processing block D2 in the transfer path 20, and also overlaps with the transfer section 8 for transferring the wafer W between the carrier block D1 and the processing block D2. It is provided so as to protrude forward from the transport path 20. That is, the inspection module 6 is provided so that the long side direction of the inspection module 6 is aligned with the front-rear direction of the processing block D2. Therefore, when installing the inspection module 6 having the above-mentioned shape, by suppressing its protrusion in the left-right direction with respect to the delivery section 8, the increase in the left-right direction of the substrate processing apparatus 1 is suppressed, and the increase in occupied floor space is suppressed. can do.

A configuration that can reduce the occupied floor space like the substrate processing apparatus 1 of the present disclosure allows more semiconductor manufacturing equipment (substrate processing apparatus 1 and other equipment) to be installed in a clean room, thereby improving productivity in a semiconductor factory. can contribute to Further, an external transport mechanism that transports the carrier C within the clean room moves along a predetermined movement route. The substrate processing apparatus 1 that occupies a small floor area as in this embodiment has the advantage that it can be installed even if the installation space for the apparatus is small on its movement route.

By the way, although the inspection module 6 includes optical members such as a camera 67, it is desirable to provide the optical members apart from the heat treatment module 4 in order to prevent the optical members from being affected by the heat of the heat treatment module 4. By arranging the inspection module 6 to protrude from the transport path 20 in the front-rear direction, it is possible to avoid providing the inspection module 6 in line with the heat treatment module 4, and it is possible to stably perform highly accurate inspection. There are also advantages. In the above example, the inspection module 6 protrudes to the side opposite to the area where the heat treatment module 4 is disposed, which is preferable because the above-mentioned thermal influence can be suppressed more reliably.

In addition, in the substrate processing apparatus 1, in the processing block D2, a second transport mechanism 5 that delivers the wafer W to a processing module other than the inspection module 6, and a third transport mechanism that delivers the wafer W to the inspection module 6. It has 7. Therefore, in the substrate processing apparatus 1, an increase in the transport load on the second transport mechanism 5 is suppressed, and a decrease in transport throughput is suppressed. Note that the inspection module 6 and the delivery section 8 are provided in a stacked manner, and the third transport mechanism 7 transports the wafer W with respect to the delivery section 8 from the front and rear directions. On the other hand, since the first transport mechanism 17 and the second transport mechanism 5 deliver the wafer W to the transfer section 8 from the left and right directions, the third transport mechanism 7 The transport of the wafer W by the transport mechanism 5 of No. 2 is not obstructed.

The third transport mechanism 7 is provided on the opposite side of the transport path 20 from which the inspection module 6 protrudes. Therefore, by moving up and down between the height facing the delivery section 8 and the height facing the inspection module 6, the third transport mechanism 7 can deliver the wafer W therebetween. In other words, when transferring the wafer W, the third transport mechanism 7 does not need to be provided with a movement mechanism for moving back and forth like the first transport mechanism 17, and the device configuration is simplified. Therefore, it is preferable.

Further, the bottle storage area 22 is preferably provided on the front side of the apparatus near the resist coating module 3 in order to shorten the piping connecting the bottle and the nozzle 34 of the module. In the substrate processing apparatus 1, the space above the storage area 22 provided on the front side is utilized so that the storage area 22 and the protrusion 60 of the inspection module 6 overlap. This suppresses an increase in the floor area occupied by the inspection module 6 and the storage area 22, and more reliably reduces the floor area occupied by the apparatus. Note that a part of the storage area 22 may extend to the bottom of the carrier block D1.

By the way, it has been mentioned that after the wafer W is transferred to the resist coating module 3, the wafer W is transferred to the heat treatment module 4 on the same level as the level where this resist coating module 3 is installed. The destination is not limited to. The wafers W transferred to the resist coating modules 3 on the floors E1 to E3 may be transferred to any of the heat treatment modules 4 on the floors E1 to E3 that can be accessed by the lower transfer mechanism 51. The wafers W transferred to the resist coating modules 3 on the floors E4 to E6 may be transferred to any of the heat treatment modules 4 on the floors E4 to E6 that can be accessed by the upper transfer mechanism 52.

Further, in the above example, the inspection module 6 is provided above the delivery section 8, but it may be provided below, or the delivery section 8 is divided into upper and lower parts as shown in a second embodiment described later. In addition, the inspection module 6 may be provided between the divided delivery sections 8.

In the above, the second transport mechanism provided in the processing block D2 is not limited to the above example, and may be configured as shown in FIG. 7. In this example, a second transport mechanism is provided for each of two layers. The second transport mechanism is configured in the same manner as the second transport mechanism 5 (51, 52) described above, and is provided in three vertical stages in the transport path 20. In this example, the lower transport mechanism 501 transports each module on floors E1 and E2, the central transport mechanism 502 transports each module on floors E3 and E4, and the upper transport mechanism 503 transports each module on floors E5 and E6. Respective movement areas are set so as to transport wafers W to the respective modules. Further, the delivery section 8 is provided at a height position where the transport mechanisms 501, 502, and 503 can transport the wafer W.

(Second embodiment)
Next, a substrate processing apparatus 1A according to a second embodiment of the present disclosure will be described with reference to a cross-sectional plan view in FIG. 8 and a vertical cross-sectional side view in FIGS. 9 and 10. FIG. 8 shows a cross-sectional plan view of the layer E4 of the processing block D2. This substrate processing apparatus 1A differs from the first embodiment in that an inspection module 6 is provided between one substrate platform and another substrate platform that constitute the transfer section, and a heat treatment module 4 The number of vertical and horizontal directions is different. Also in this example, the inspection module 6 (pre-processing inspection module 61, post-processing inspection module 62) is provided so as to protrude forward from the transport path 20, and the third transport mechanism 7 is arranged at the rear of the transport path 20. has been done. In this substrate processing apparatus 1A, the ancillary equipment installation area 44 is provided only on the right side of the rear and right sides of the transport mechanism 7.

As shown in FIG. 10, the pre-processing inspection module 61 and the post-processing inspection module 62 are arranged in upper and lower positions at different heights in an installation area 80 of a delivery section 83 (corresponding to the delivery section 8 of the first embodiment). placed at different locations and apart from each other. In this example, a pre-processing inspection module (WIS1) 61 is disposed at the height of the floor E3, and a post-processing inspection module (WIS2) 62 is disposed at the height of the floor E4. For example, in the installation area 80, a large number of substrate mounting sections are provided in the vertical direction so as to overlap with the inspection modules 6 (61, 62) in a plan view. In this example, the substrates are placed at a height position between the inspection modules 6 (61, 62), at a lower height position of the pre-processing inspection module 61, and at a height position above the post-processing inspection module 62. A delivery section 83 is provided.

FIG. 10 shows an example of the configuration of the transfer unit 83, and a substrate mounting unit for transferring wafers W to and from the lower transfer mechanism 51 is located between the inspection modules 61 and 62 at the height of the floor E3. A storage section (TRS2, SCPL1, SCPL2) is provided. Furthermore, below the pre-processing inspection module 61, a substrate rest (TRS1) is provided that transfers the wafer W to and from the lower transport mechanism 51. Further, above the post-processing inspection module 62, there are provided substrate rests (TRS3, TRS4, SCPL3, SCPL4) for transferring wafers W to and from the upper transport mechanism 52. Furthermore, as shown in FIGS. 8 and 10, in the inspection module 6 (61, 62), a storage area 22 is provided below the protrusion 60 that protrudes from the conveyance path 20, and these areas are arranged so as to overlap in plan view. has been done.

In this example as well, as shown in FIGS. 8 and 9, the resist coating module 3 is arranged so as to face the transport path 20 in front of the transport path 20 in each of the six floors E1 to E6 of the processing block D2. , are arranged one by one. Therefore, when the processing block D2 is viewed from the front, the resist coating modules 3 are arranged in a row in the vertical direction, and the left and right positions of the resist coating modules 3 are aligned.

On the other hand, a plurality of heat treatment modules 4, for example, two heat treatment modules, are provided behind the conveyance path 20 so as to face the conveyance path 20, and are arranged in a plurality, for example, two, on the left and right. Further, as shown in FIG. 9, the heat treatment modules 4 are arranged in eight stages in the vertical direction in the processing block D2. In this manner, in the processing block D2, the heat treatment modules 4 are provided in eight stages in two rows on the left and right, and among the two rows on the left and right, the positions of the heat treatment modules 4 constituting the same row on the left and right are aligned.

More specifically, among the heat treatment modules 4 provided in eight stages, the lower four stages of heat treatment modules 4 are provided on floors E1 to E3, and the upper four stages of heat treatment modules 4 are provided on floors E4 to E6. . Note that, as described above, each layer is a layer that includes the resist coating module 3, and in the substrate processing apparatus 1 described above, one layer includes one step of the heat treatment module 4. In the substrate processing apparatus 1A of this example, since the heat treatment modules 4 are stacked in eight stages, there is a difference between the heights of the floors and the heights of the stages formed by the heat treatment modules 4. Specifically, some of the heat treatment modules 4 are provided across two adjacent levels.

The substrate processing apparatus 1A is the same as the substrate processing apparatus 1 except for the arrangement of the modules and the like described above. The transport route of the wafers W (W1, W2) of the substrate processing apparatus 1A is, for example, the same as the transport route of the substrate processing apparatus 1. Therefore, when performing a pre-processing inspection and a post-processing inspection in the substrate processing apparatus 1A, the wafers W are transferred between modules in the order explained in FIG. 6. In the substrate processing apparatus 1A, even if only one of the pre-processing inspection and post-processing inspection is performed, the route described in the description of the substrate processing apparatus 1 is used as the route for performing only one of the inspections. , wafer W is transported.

This substrate processing apparatus 1A also has the same effects as the substrate processing apparatus 1. Further, as described above, in the substrate processing apparatus 1A, the number of heat treatment modules 4 arranged on the left and right is smaller than the number of heat processing modules 4 arranged on the left and right in the substrate processing apparatus 1. Therefore, the substrate processing apparatus 1A can be configured so that the left and right lengths are shorter and the occupied floor area is smaller. In the substrate processing apparatus 1A, the number of heat treatment modules 4 arranged in the horizontal direction is reduced, while the number of stages of heat treatment modules 4 arranged in the vertical direction is increased. Therefore, it is possible to prevent delays in transportation from the resist coating module 3 to the heat treatment module 4, and to ensure throughput. Note that in this embodiment, the inspection module 6 is arranged between a plurality of substrate rests, but the inspection module 6 may be arranged above each board rest as in the first embodiment. However, the inspection module may be arranged below each substrate platform.

(Third embodiment)
Next, a third embodiment of the substrate processing apparatus of the present disclosure will be described with reference to a cross-sectional plan view in FIG. 11 and a vertical cross-sectional front view in FIG. 12. FIG. 11 shows a cross-sectional plan view of the layer E3 of the processing block D2. This substrate processing apparatus 1B is a configuration example in which the third transport mechanism includes a rear transport mechanism (protruding transport mechanism) 91 and a front transport mechanism (non-protruding transport mechanism) 92. The rear side transport mechanism 91 is a transport mechanism that transports the wafer W between the substrate placement parts of the delivery part 84 (corresponding to the delivery part 8 of the first embodiment), and is A processing module (inspection module 6) is provided on the protruding rear side. Further, the front side transport mechanism 92 is a transport mechanism that transports the wafer W between the inspection module 6 and the substrate platform, and the front side transport mechanism 92 is a transport mechanism that transports the wafer W between the inspection module 6 and the substrate platform. That is, it is provided on the front side.

In this example, the inspection modules 6 (61, 62) are arranged so as to protrude rearward from the conveyance path 20 as described above. Further, the pre-processing inspection module 61 corresponds to a lower second processing module, and the post-processing inspection module 62 corresponds to an upper second processing module, and these are arranged vertically. The delivery section 84 is provided in the installation area 80 on the left side of the conveyance path 20, similarly to the first embodiment. Therefore, the rear conveyance mechanism 91 is disposed behind the transfer section 84 on the conveyance path 20, and the front conveyance mechanism 92 is disposed in front of the transfer section 8 on the conveyance path 20, respectively.

Further, in this example, the front transport mechanism 92 includes a lower front transport mechanism 921 that delivers the wafer W to the pre-processing inspection module 61, and an upper front transport mechanism 922 that delivers the wafer W to the post-processing inspection module 62. It is equipped with These rear transport mechanism 91, lower front transport mechanism 921, and upper front transport mechanism 922 are each configured similarly to the third transport mechanism 7 described above. The upper front transport mechanism 922 corresponds to an upper non-projecting transport mechanism, and the lower front transport mechanism 921 corresponds to a lower non-projecting transport mechanism.

In this example, as shown in FIG. 12, the pre-processing inspection module 61 is provided at the height of the floor E2, and the post-processing inspection module 62 is provided at the height of the floor E5. Between the pre-processing inspection module 61 and the post-processing inspection module 62, substrate mounting sections are arranged in multiple stages at the height of the floors E2 to E5, and a transfer section 84 is configured. Further, the rear side transport mechanism 91 is provided between the inspection modules 6 (61, 62) so as to overlap these inspection modules 6 (61, 62). Being provided in an overlapping manner means that the protruding portion 60 of the inspection module 6 (61, 62) and a portion of the rear transport mechanism 91 overlap in a plan view.

Further, the transfer section 84 is provided with a substrate rest section (TRS, SCPL) as in the first embodiment, but the numbers attached to the TRS are different from those in the first embodiment for convenience of explanation. . FIG. 12 shows an example of the configuration of the delivery section 84. In this example, the lower front transport mechanism 921 transports the wafer W to the pre-processing inspection module 61 and the substrate rests (SCPL1, SCPL2, TRS11, TRS12) on the lower floors E2 to E3. Further, the upper front transport mechanism 922 transports the wafer W to the post-processing inspection module 62 and the substrate rests (SCPL3, SCPL4, TRS13, TRS14) on the upper floors E4 to E5.

As described above, the wafer W is transferred between the substrate placement sections of the transfer section 84 by the rear transfer mechanism 91. In other words, the rear transfer mechanism 91 is configured to be able to transfer the wafer W to each substrate platform on the floors E2 to E5. In this example, as in the second embodiment, the heat treatment modules 4 are provided in two rows in the left-right direction and in eight stages in the vertical direction, and the other configurations are the same as in the first embodiment. .

Next, an example of the transport path of the wafer W in this embodiment will be described using an example in which the wafer W is inspected by the pre-processing inspection module 61 and the post-processing inspection module 62. In the description of the transport route of this embodiment, the wafer W transported to the floors E1 to E3 is expressed as W1, and the wafer W transported to the floors E4 to E6 is expressed as W2. Further, FIG. 13 schematically shows the transport performed by each of the rear transport mechanism 91, lower front transport mechanism 921, and upper front transport mechanism 922 to the delivery section 84 and the inspection module 6 on this transport route. It is something. Similar to FIG. 6, the transport mechanism used is shown in a circular frame near the arrow, and in order to avoid complication of illustration, only the transport path of the wafer W1 is shown in FIG.

The wafer W1 in the carrier C of the carrier block D1 is transported through the first transport mechanism 17 → TRS11 → lower front transport mechanism 921 → pre-processing inspection module 61 → lower front transport mechanism 921 → TRS12 → rear transport mechanism 91 → SCPL1 →The lower conveyance mechanism 51 of the processing block D2→The resist coating module 3 of one of the floors E1, E2, and E3 is conveyed, and the resist liquid is subjected to liquid processing.

Thereafter, the wafer W1 is transferred from the lower transport mechanism 51 → the heat treatment module 4 on the same level as the resist coating module 3 → the lower transport mechanism 51 → SCPL 2 → the rear transport mechanism 91 → TRS 13 → the upper front transport mechanism 922 → after processing. It is transported along the path of the inspection module 62 and inspected as described above. The wafer W after inspection is transported along the path of upper front transport mechanism 922 → TRS 14 → first transport mechanism 17 → carrier C.

On the other hand, the wafer W2 in the carrier C of the carrier block D1 is transported through the pre-processing inspection module 61 to the TRS 12 in the same manner as the wafer W1. Next, the rear transport mechanism 91 transports from the TRS 12 to the SCPL 3 where the upper transport mechanisms 52 of the floors E4 to E6 can access. Thereafter, the wafer W2 is sequentially transported by the upper transport mechanism 52 through the resist coating modules 3 and the heat treatment modules 4 of the floors E4 to E6, and then transported to the SCPL 4, similarly to the above-described examples. Subsequently, the wafer is transported to the TRS 13 by the rear transport mechanism 91, and then transported via the post-processing inspection module 62 along the same route as the wafer W1, and returned to the carrier C.

Further, when only the inspection by the pre-processing inspection module 61 is performed, the wafers W1 and W2 that have been processed and transferred to the SCPL2 and SCPL4 may be transferred to the TRS 14 and returned to the carrier C by, for example, the rear transfer mechanism 91. When only the inspection by the post-processing inspection module 62 is performed, the wafers W1 and W2 transferred from the carrier C to the TRS11 are transferred to the SCPL1 and SCPL3, respectively, by the rear transfer mechanism 91, and thereafter are transferred along the above-described route. do it.

In this embodiment as well, since the inspection module 6, which is the second processing module, is provided in the substrate processing apparatus 1B so as to protrude rearward with respect to the transport path 20, the occupied floor space is reduced as described above. can suppress the increase in Further, the wafer W is transferred to the inspection module 6 by a front transfer mechanism 92, and the wafer W is transferred to the substrate mounting section of the transfer section 84 by a rear transfer mechanism 91. In this way, since the transfer of the wafer W is shared between the rear transport mechanism 91 and the front transport mechanism 92, the transport load is distributed and the transport throughput can be improved.

Further, in this example, the pre-processing inspection module 61 and the post-processing inspection module 62 are provided separated in the vertical direction, and transport to the respective inspection modules 6 (61, 62) is carried out by the lower front transport mechanism 921 and the upper This is shared by the front transport mechanism 922. Therefore, the transport load can be further distributed, contributing to an improvement in transport throughput. Note that the rear transport mechanism 91 and the lower and upper front transport mechanisms 921 and 922 are provided on the rear side and the front side of the transport path 20, respectively, so even if these transport mechanisms are provided, the substrate processing apparatus 1C is Increase in length in the left and right direction is suppressed.

In addition, as described above, the pre-processing inspection module 61 and the post-processing inspection module 62 are vertically isolated, and each substrate mounting section that constitutes the delivery section 84 is provided between the inspection modules 6 (61, 62). . Then, the space between the protrusions 60 protruding from the transfer section 84 of the inspection module 6 (61, 62) is used as a space for the rear transport mechanism 91 to move, and the substrates at the heights of the floors E1 to E3 are placed. The configuration is such that the rear transport mechanism 91 can transfer wafers W between the storage section and the substrate placement sections on floors E4 to E6. In this way, the space between the protrusions 60 of the inspection modules 6 (61, 62) is used to transport between floors, so that the front and rear widths of the device are also prevented from increasing. , the floor space occupied by the device can be more reliably reduced.

Also in this example, the delivery section 84 is provided between the inspection modules 6, and the inspection modules 6 and the delivery section 84 overlap in plan view, which can contribute to reducing the occupied floor space. Further, since the protruding portions 60 of the pre-processing inspection module 61 and the post-processing inspection module 62 are provided so as to partially overlap with each other in a plan view, an empty space is formed in the front-back direction of the processing block D2. can. For example, this space may be effectively used as the ancillary equipment installation area 44 of the heat treatment module 4.

Although the front transport mechanism 92 has a structure divided into upper and lower parts as the lower front transport mechanism 921 and the upper front transport mechanism 922 as described above, it may have an undivided structure. In other words, a common transport mechanism may be used to transport some of the pre-processing inspection module 61, post-processing inspection module 62, and transfer unit 84 to the substrate rests. However, from the viewpoint of distributing the transport load as described above, it is preferable that the front transport mechanism 92 be divided into upper and lower parts.

In each of the above-described embodiments, the inspection module 6 has been described as having a rectangular shape in plan view, but it is also possible to use a relatively large inspection module 6 having a square shape in plan view, with a portion of the inspection module 6 protruding forward or backward from the conveyance path 20. It may be provided so that

(Fourth embodiment)
Next, a fourth embodiment will be described using FIG. 14. This embodiment is a configuration example in which the inspection module 6 is provided in the carrier block D1. The inspection module 6 in this example is provided above the wafer W transfer area 10 in the carrier block D1 so that the length of the front and back of the inspection module 6 is longer than the length of the left and right sides. That is, the long side direction of the casing 63 of the inspection module 6 is arranged so as to be aligned with the movement direction (X direction) of the first transport mechanism 17 of the transport area 10, and the entire casing of the carrier block D1 It is contained within the body 11.

In the configuration example shown in FIG. 14, the pre-processing inspection module 61 and the post-processing inspection module 62 are located at the rear of the carrier block D1, overlap the transport area 10 in plan view, and are located on the rear side of the transport path 20 of the processing block D2. (In FIG. 14, only 62 of the pre-processing inspection module 61 and post-processing inspection module 62 are displayed). More specifically, a space with a height greater than the height shown in the figure is formed above the fan filter unit 18 and between the equipment installation area 23 (see FIG. 2), and these inspection modules 6 (61, 62) are placed one above the other in that space. FIG. 14 is a cross-sectional plan view showing the level E3 of the processing block D2, and for the carrier block D1, a cross-sectional plan view of the lower position of the equipment installation area 23 is shown.

Further, the third transport mechanism 7 is arranged on the rear side of the transport path 20 so as to be adjacent to the inspection module 6 (61, 62) in plan view. For example, a transfer port for the wafer W is formed in the side wall of the housing 63 of the pre-processing inspection module 61 and the post-processing inspection module 62 facing the processing block D2. The wafer W is configured to be delivered to the storage section 64. Then, the wafer W placed on the substrate platform (TRS, SCPL) of the transfer unit 85 is transferred to the pre-processing inspection module 61 and the post-processing inspection module 62 by the third transfer mechanism 7, and the wafer W is inspected. is now being implemented. The transport path of the wafer W in the apparatus of the fourth embodiment is, for example, the same as that of the substrate processing apparatus 1 of the first embodiment.

According to the configuration of FIG. 14, the inspection module 6 is provided above the transfer area 10 of the first transfer mechanism 17 of the carrier block D1 so that the length of the inspection module 6 is longer than the left and right sides. Therefore, when installing the inspection module 6 having a rectangular shape in plan view, it is possible to suppress an increase in the horizontal direction of the substrate processing apparatus 1C, and to suppress an increase in the occupied floor space.

Furthermore, in the above example configurations of each device, the heat treatment module is placed at the rear and the liquid treatment module is placed at the front, but conversely, the heat treatment module may be placed at the front and the liquid treatment module at the rear. In such a case where the positional relationship of the modules is reversed, the orientation of the inspection module 6 may be adjusted to match the arrangement of the heat treatment module and the liquid treatment module.

Furthermore, it is not necessarily necessary to include both the pre-processing inspection module 61 and the post-processing inspection module 62, and any configuration may be sufficient as long as it includes either one of the inspection modules. Further, for example, the layout of the fourth embodiment may be combined with layouts of other embodiments. In other words, one inspection module 6 is provided in the carrier block D1 as shown in the fourth embodiment, and the other inspection module 6 is placed over the delivery section and along the transport path 20 as shown in the first to third embodiments. It may be provided so as to protrude forward or backward from.

Furthermore, the second transport mechanism may or may not be shared in each layer provided in the processing block D2. If the second transport mechanism is not shared in each layer (that is, if multiple second transport mechanisms are provided), there is no limit to the number of layers that one second transport mechanism is responsible for transporting, and The number may be one or more than one. The number of layers to which each second transport mechanism is responsible for transport may be the same or may be different.

It is preferable if the number of second transport mechanisms is small because the manufacturing cost of the device can be reduced. However, by providing a plurality of second transport mechanisms 51 and 52 as in the configuration of the substrate processing apparatus 1, the transport load on the second transport mechanism 5 can be suppressed, which is preferable from the viewpoint of obtaining high throughput. Furthermore, as in the substrate processing apparatus 1, by making each of the second transport mechanisms 51 and 52 take charge of transporting the same number of layers, the transport load can be unevenly distributed between the second transport mechanisms 51 and 52. This is preferable because it prevents this and allows high throughput to be obtained.

Furthermore, in the above, the hierarchy constituting the processing block may include at least a liquid processing module. Moreover, the liquid processing module provided in each level is not limited to the above-mentioned example, and may have a configuration in which a plurality of cups 32 are arranged in the left-right direction. However, a configuration in which only one cup 32 is provided can contribute to reducing the length of the processing block D2 in the left-right direction.

Furthermore, the number of installed first processing modules is not limited to the above-mentioned example, and the first processing modules may be stacked in one layer. Furthermore, as shown in the second and third embodiments, the first processing module may be provided at a height that spans two levels, as long as the second transport mechanism can transport the wafer W. Furthermore, when the second transport mechanism is responsible for transporting multiple floors, there may be some floors where the first processing module is not provided.

Furthermore, the number of installed first processing modules does not need to be the same in a plurality of layers, and the number of first processing modules may be different for each layer. In this case, the horizontal installation positions of the first processing modules do not need to be the same on all levels, and depending on the number of installed first processing modules, these horizontal installation positions may be shifted for each level. You can. Furthermore, the number of stacked layers constituting the processing block D2 may be four, five, seven, or eight layers, and is not limited to the illustrated number of layers.

Further, the liquid processing module may be a module that performs liquid processing for forming an antireflection film or a liquid processing for forming a protective film, or a developing module that performs a developing process on the wafer W using a developer as a processing liquid. It may be. In addition, it is a module that applies processing liquid (chemical liquid) to form an insulating film, a module that supplies adhesive for bonding wafers W, and a module that supplies cleaning liquid to wafer W to clean it. It may also be a module. Note that the above-mentioned protective film is a film formed to protect the resist film during immersion exposure.

Further, when the above-mentioned development module is provided, a heat treatment module that performs a heat treatment (PEB: Post Exposure Bake) on the wafer W before the development treatment is exemplified as the first treatment module. That is, in the processing block D2, the wafer W may be transported in the order of the heat treatment module → the development module. Therefore, the first processing module is not limited to a module that processes the wafer W after the liquid processing module, and the liquid processing module is not limited to a module that forms a coating film.

Further, the first processing module may be configured as a hydrophobization processing module that supplies gas to the wafer W and performs hydrophobization processing. For example, a hydrophobization treatment module may be provided as the first treatment module, an antireflection film formation module may be provided as the liquid treatment module, and the transport may be carried out in the order of the hydrophobization treatment module→the antireflection film formation module. Therefore, the first processing module is not limited to a module that simply heats the wafer W.

Furthermore, the second processing module is not limited to being an inspection module, and may be a processing module that performs a curing process by irradiating ultraviolet rays after forming a resist film on the wafer W, for example. This processing module is configured, for example, in the inspection module 6 shown in FIG. 5 without a camera, but by providing an ultraviolet irradiation section in place of the half mirror 65 and the illumination 66. Then, while irradiating ultraviolet rays downward from the ultraviolet irradiation section, the mounting section 64 on which the wafer W is placed is moved from the standby area to the movement completion position, and the entire surface of the wafer W is irradiated with ultraviolet rays. Cure processing is performed.

Further, in the substrate processing apparatus 1 and the like, the lower transport mechanism 51 and the upper transport mechanism 52 independently transport the wafer W. In other words, since wafers W are transferred independently between the floors E1 to E3 and the floors E4 to E6, the processing performed on the floors E1 to E3 is different from the processing performed on the floors E4 to E6. Good too. For example, the modules arranged in the lower and upper layers may be different, such that resist coating and PAB are performed in the layers E1 to E3, and PEB and development are performed in the layers E4 to E6.

Furthermore, the configuration of the delivery section 8 and the like is not limited to the above example, and the number and layout of the placement module (TRS) 81 and temperature control module (SCPL) 82 can be selected as appropriate. Therefore, in the above-mentioned transport route, a step that is said to be transported to TRS may be transported to SCPL, or conversely, a step that is stated to be transported to SCPL may be transported to TRS, or during the transport route Conveyance to TRS and SCPL may be interposed. In addition, the storage area 22 may be provided so as not to interfere with the pre-processing inspection module 61 and the post-processing inspection module 62, and may be vertically overlapped with the storage area 22 to provide an area for installing ancillary equipment of the liquid processing module or for electrical equipment. The installation area may be arranged.

The embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The embodiments described above may be omitted, replaced, modified, and combined in various forms without departing from the scope and spirit of the appended claims.

C Carrier (container)
D1 Carrier block (substrate transport block)
D2 Processing blocks E1 to E6 Floor 12 Low section (container placement section)
17 First transport mechanism 10 Transport area 20 Transport path 3 Resist coating module (liquid processing module)
4 Heat treatment module (first treatment module)
5, 51, 52 Second transport mechanism 6, 61, 62 Inspection module 7 Third transport mechanism 8 Delivery section

Claims (18)

In a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid,
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
a second processing module that is provided so as to protrude from the transport path in one or the other direction, and that performs processing on the substrate that is different from the processing performed by the first processing module;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
the second processing module overlaps with the delivery section;
The delivery section includes a plurality of substrate mounting sections arranged in a vertical direction and on which the substrates are respectively placed,
The third transport mechanism is
a protruding side transport mechanism provided on a side where the second processing module protrudes with respect to the transport path, overlapping the second processing module;
a non-protruding side transport mechanism provided on a side opposite to the protruding side with respect to the transport path,
the non-protruding side transport mechanism transports the substrate between the second processing module and the substrate platform;
A substrate processing apparatus in which the protrusion-side transport mechanism transports the substrate between each substrate platform . The substrate processing apparatus according to claim 1 , wherein the second processing module is provided between one of the substrate mounting parts and the other substrate mounting part. A portion of the second processing module that protrudes from the conveyance path is
3. The substrate processing apparatus according to claim 1 , wherein the storage area in which the processing liquid supplied to the substrate in each of the liquid processing modules is stored overlaps in plan view. The second processing module includes an upper second processing module and a lower second processing module that are arranged in the vertical direction,
The protruding side transport mechanism is provided between an upper second processing module and a lower second processing module,
The non-protruding transfer mechanism includes an upper non-protruding transfer mechanism that transfers the substrate to the upper second processing module, and a lower non-protruding transfer mechanism that transfers the substrate to the lower second processing module. 4. The substrate processing apparatus according to claim 3 , further comprising a side non-protruding side transport mechanism. In a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid,
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
a second processing module that is provided so as to protrude from the transport path in one or the other direction, and that performs processing on the substrate that is different from the processing performed by the first processing module;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
The second transport mechanism is
a lower transport mechanism that delivers the substrate to the liquid processing module at a lower level among the plurality of levels and the first processing module at a height at the lower level;
an upper transport mechanism that delivers the substrate to the liquid processing module at an upper level among the plurality of levels and the first processing module at a height in the upper level;
including;
The lower layer and the upper layer are each composed of a plurality of layers,
The delivery unit has a height of an uppermost layer among the layers to which the substrate is transported by the lower transport mechanism, and a height of the lowermost layer among the layers to which the substrate is transported by the upper transport mechanism; substrate processing equipment installed in each . 6. The substrate processing apparatus according to claim 5 , wherein the lower layer and the upper layer each include three layers. 7. The second processing module is an inspection module for inspecting the substrate before or after processing by the liquid processing module and the first processing module. Substrate processing equipment. 8. The substrate processing apparatus according to claim 1, wherein each of the liquid processing modules at each level includes only one cup for surrounding and processing the substrate. 9. The substrate processing apparatus according to claim 1, wherein the transfer section has a temperature adjustment function to adjust the temperature of the substrate before processing by the liquid processing module and the first processing module. 10. The substrate processing apparatus according to claim 1, wherein the first processing module is a heat processing module that heats the substrate. In a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid,
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
a second processing module that is provided so as to protrude from the transport path in one or the other direction, and that performs processing on the substrate that is different from the processing performed by the first processing module;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
A substrate processing apparatus in which the plurality of first processing modules include a first processing module provided across two adjacent layers. In a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid,
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
The substrate transport block is provided above the substrate transport area by the first transport mechanism so that the front and back length is longer than the left and right length , and the substrate is processed by the first processing module. a second processing module that performs different processing;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
The second transport mechanism is
a lower transport mechanism that delivers the substrate to the liquid processing module at a lower level among the plurality of levels and the first processing module at a height at the lower level;
an upper transport mechanism that delivers the substrate to the liquid processing module at an upper level among the plurality of levels and the first processing module at a height in the upper level;
including;
The lower layer and the upper layer are each composed of a plurality of layers,
The delivery unit has a height of an uppermost layer among the layers to which the substrate is transported by the lower transport mechanism, and a height of the lowermost layer among the layers to which the substrate is transported by the upper transport mechanism; substrate processing equipment installed in each. In a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid,
A container mounting section on which a container in which a plurality of the substrates are stored is placed, and a first transport mechanism that delivers the substrates to the container, and is provided on either the left or right side with respect to the processing block. A substrate transport block provided,
a transport path for the substrate extending left and right in the processing block;
a plurality of levels each including a plurality of levels, each of which comprises the processing block such that the liquid processing modules are arranged in a vertical line on one of the front and rear sides of the transport path;
A plurality of first processing modules are provided in the longitudinal direction on the other side of the transport path, and process the substrate before or after the processing of the liquid processing module;
a second transport mechanism that moves the transport path to transport the substrate between the liquid processing module and the first processing module;
The substrate transport block is provided above the substrate transport area by the first transport mechanism so that the front and back length is longer than the left and right length , and the substrate is processed by the first processing module. a second processing module that performs different processing;
a third transport mechanism that delivers the substrate to the second processing module;
Provided on one side of the left and right sides of the conveyance path, on which the substrate is placed to transfer the substrate between the first conveyance mechanism, the second conveyance mechanism, and the third conveyance mechanism. A delivery department,
Equipped with
A substrate processing apparatus in which the plurality of first processing modules include a first processing module provided across two adjacent layers. In a substrate processing method using a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with liquid,
placing a container in which a plurality of the substrates are accommodated on a container mounting portion provided on a substrate transport block provided on one of the left and right sides of the processing block;
a step of delivering the substrate to the container by a first transport mechanism provided in the substrate transport block;
Each of the plurality of liquid processing modules included in a hierarchy constituting the processing block and arranged in a row in the vertical direction on one of the front and rear sides of the substrate transport path extending left and right in the processing block a step of processing the substrate;
a step of processing the substrate before or after the processing of the liquid processing module in a plurality of first processing modules provided in the longitudinal direction on the other side of the transport path;
a step of transporting the substrate between the liquid processing module and the first processing module by a second transport mechanism that moves the transport path;
performing a process different from the process performed by the first processing module on the substrate by a second processing module provided so as to protrude from the transport path in one or the other direction;
a step of delivering the substrate to the second processing module by a third transport mechanism;
In order to transfer the substrate between the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism, the substrate is placed on a transfer section provided on one side of the left and right sides of the transfer path. and a step of placing the
the second processing module overlaps with the delivery section;
The delivery section includes a plurality of substrate mounting sections arranged in a vertical direction and on which the substrates are respectively placed,
The third transport mechanism is
a protruding side transport mechanism provided on a side where the second processing module protrudes with respect to the transport path, overlapping the second processing module;
a non-protruding side transport mechanism provided on a side opposite to the protruding side with respect to the transport path,
a step of transporting the substrate between the second processing module and the substrate platform by the non-protruding side transport mechanism;
A substrate processing method comprising the step of transporting the substrate between each substrate platform by the protrusion-side transport mechanism . A substrate processing method using a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with a liquid, the processing block comprising a plurality of layers each including the liquid processing module ,
placing a container in which a plurality of the substrates are accommodated on a container mounting portion provided on a substrate transport block provided on one of the left and right sides of the processing block;
a step of delivering the substrate to the container by a first transport mechanism provided in the substrate transport block;
Each of the plurality of liquid processing modules included in a hierarchy constituting the processing block and arranged in a row in the vertical direction on one of the front and rear sides of the substrate transport path extending left and right in the processing block a step of processing the substrate;
a step of processing the substrate before or after the processing of the liquid processing module in a plurality of first processing modules provided in the longitudinal direction on the other side of the transport path;
a step of transporting the substrate between the liquid processing module and the first processing module by a second transport mechanism that moves the transport path;
performing a process different from the process performed by the first processing module on the substrate by a second processing module provided so as to protrude from the transport path in one or the other direction;
a step of delivering the substrate to the second processing module by a third transport mechanism;
In order to transfer the substrate between the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism, the substrate is placed on a transfer section provided on one side of the left and right sides of the transfer path. The process of placing
A lower transport mechanism included in the second transport mechanism causes the liquid processing module on the lower level of the plurality of levels and the first processing module at the height of the lower level to a step of delivering the substrate;
The upper transport mechanism included in the second transport mechanism transports the substrate to the liquid processing module at the upper level among the plurality of levels and the first processing module at the height of the upper level. The process of handing over and
Equipped with
The lower layer and the upper layer are each composed of a plurality of layers,
The delivery unit has a height of an uppermost layer among the layers to which the substrate is transported by the lower transport mechanism, and a height of the lowermost layer among the layers to which the substrate is transported by the upper transport mechanism; Substrate processing methods provided in each. A substrate processing method using a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with a liquid, the processing block comprising a plurality of layers each including the liquid processing module ,
placing a container in which a plurality of the substrates are accommodated on a container mounting portion provided on a substrate transport block provided on one of the left and right sides of the processing block;
a step of delivering the substrate to the container by a first transport mechanism provided in the substrate transport block;
Each of the plurality of liquid processing modules included in a hierarchy constituting the processing block and arranged in a row in the vertical direction on one of the front and rear sides of the substrate transport path extending left and right in the processing block a step of processing the substrate;
a step of processing the substrate before or after the processing of the liquid processing module in a plurality of first processing modules provided in the longitudinal direction on the other side of the transport path;
a step of transporting the substrate between the liquid processing module and the first processing module by a second transport mechanism that moves the transport path;
performing a process different from the process performed by the first processing module on the substrate by a second processing module provided so as to protrude from the transport path in one or the other direction;
a step of delivering the substrate to the second processing module by a third transport mechanism;
In order to transfer the substrate between the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism, the substrate is placed on a transfer section provided on one side of the left and right sides of the transfer path. and a step of placing the
In the substrate processing method, the plurality of first processing modules include a first processing module provided across two adjacent layers. A substrate processing method using a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with a liquid, the processing block comprising a plurality of layers each including the liquid processing module ,
placing a container in which a plurality of the substrates are accommodated on a container mounting portion provided on a substrate transport block provided on one of the left and right sides of the processing block;
a step of delivering the substrate to the container by a first transport mechanism provided in the substrate transport block;
Each of the plurality of liquid processing modules included in a hierarchy constituting the processing block and arranged in a row in the vertical direction on one of the front and rear sides of the substrate transport path extending left and right in the processing block a step of processing the substrate;
a step of processing the substrate before or after the processing of the liquid processing module in a plurality of first processing modules provided in the longitudinal direction on the other side of the transport path;
a step of transporting the substrate between the liquid processing module and the first processing module by a second transport mechanism that moves the transport path;
A second processing module is provided above the substrate transport area by the first transport mechanism in the substrate transport block so that the front and back length is longer than the left and right length. a step of performing processing different from the processing by the processing module;
a step of delivering the substrate to the second processing module by a third transport mechanism;
In order to transfer the substrate between the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism, the substrate is placed on a transfer section provided on one side of the left and right sides of the transfer path. The process of placing
Equipped with
A lower transport mechanism included in the second transport mechanism causes the liquid processing module on the lower level of the plurality of levels and the first processing module at the height of the lower level to a step of delivering the substrate;
The upper transport mechanism included in the second transport mechanism transports the substrate to the liquid processing module at the upper level among the plurality of levels and the first processing module at the height of the upper level. The process of handing over and
Equipped with
The lower layer and the upper layer are each composed of a plurality of layers,
The delivery unit has a height of an uppermost layer among the layers to which the substrate is transported by the lower transport mechanism, and a height of the lowermost layer among the layers to which the substrate is transported by the upper transport mechanism; Substrate processing methods provided in each. A substrate processing method using a substrate processing apparatus including a processing block provided with a plurality of liquid processing modules each processing a substrate with a liquid, the processing block comprising a plurality of layers each including the liquid processing module ,
placing a container in which a plurality of the substrates are accommodated on a container mounting portion provided on a substrate transport block provided on one of the left and right sides of the processing block;
a step of delivering the substrate to the container by a first transport mechanism provided in the substrate transport block;
Each of the plurality of liquid processing modules included in a hierarchy constituting the processing block and arranged in a row in the vertical direction on one of the front and rear sides of the substrate transport path extending left and right in the processing block a step of processing the substrate;
a step of processing the substrate before or after the processing of the liquid processing module in a plurality of first processing modules provided in the longitudinal direction on the other side of the transport path;
a step of transporting the substrate between the liquid processing module and the first processing module by a second transport mechanism that moves the transport path;
A second processing module is provided above the substrate transport area by the first transport mechanism in the substrate transport block so that the front and back length is longer than the left and right length. a step of performing processing different from the processing by the processing module;
a step of delivering the substrate to the second processing module by a third transport mechanism;
In order to transfer the substrate between the first transfer mechanism, the second transfer mechanism, and the third transfer mechanism, the substrate is placed on a transfer section provided on one side of the left and right sides of the transfer path. The process of placing
Equipped with
In the substrate processing method, the plurality of first processing modules include a first processing module provided across two adjacent layers.

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