JP2018113361A - Substrate holder, vertical substrate transfer device, and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate holder capable of facilitating attachment and detachment of a substrate while suppressing generation of particles.SOLUTION: The substrate holder is used in a vertical substrate transfer apparatus, is capable of holding a substrate in an upright posture, and includes a frame body and an attracting portion. The frame body has a peripheral edge portion of the substrate and a facing surface opposed to the substrate in the thickness direction. The attracting portion is provided on the opposing surface and is configured to electrostatically attracting at least a part of the peripheral portion of the substrate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate holder that can hold a substrate in an upright posture, and a vertical substrate transfer apparatus and a vacuum processing apparatus including the substrate holder.

  In recent years, a carrier circulation type in-line sputtering apparatus has been widely used. As this type of in-line sputtering apparatus, there are known a horizontal (horizontal) transfer method for transferring a substrate in a lying posture and a vertical (vertical) transfer method for transferring the substrate in an upright posture. The vertical transfer method has an advantage that the increase in the installation area of the apparatus accompanying the increase in the size of the substrate can be minimized as compared with the horizontal transfer method.

  A carrier for transporting a substrate in a substantially vertical posture is used in the vertical transport device. The carrier needs a substrate holding structure that can stably hold the posture of the substrate. For example, Patent Document 1 describes a structure in which a substrate is held by a plurality of clamps provided at the periphery of an opening of a carrier. Patent Document 2 discloses a structure that prevents the substrate from warping by adsorbing the back surface (non-deposition surface) of the substrate mounted on the carrier by electrostatic adsorption.

WO 2008/133139 JP 2007-96056 A

  However, in the configuration of Patent Document 1, particles generated by a mechanical clamping mechanism around the substrate may adhere to the substrate and cause film formation failure. In addition, the configuration described in Patent Document 2 has a problem in that the operation of attaching and detaching the substrate to and from the carrier is complicated because the electrostatic attraction unit is provided on the back plate that holds the back surface of the substrate.

  In view of the circumstances as described above, an object of the present invention is to provide a substrate holder that can easily attach and detach a substrate while suppressing generation of particles, and a vertical substrate transport apparatus and a substrate processing apparatus including the substrate holder. There is.

In order to achieve the above object, a substrate holder according to an aspect of the present invention is a substrate holder that is used in a vertical substrate transport apparatus and can hold a substrate in an upright posture, and includes a frame and a suction unit It comprises.
The frame includes a peripheral surface of the substrate and a facing surface facing the substrate in the thickness direction.
The adsorption portion is provided on the facing surface and configured to be capable of electrostatically adsorbing at least a part of a peripheral portion of the substrate.

Since the substrate holder is configured to electrostatically attract the substrate by the attracting portion provided on the facing surface of the frame that faces the peripheral edge of the substrate, the substrate holder is compared with the substrate holding structure using the clamp mechanism. Thus, the generation of particles can be suppressed.
Moreover, since the adsorption | suction part is provided in the opposing surface of the frame which opposes the peripheral part of a board | substrate, at least the back surface (non-film-forming surface) of a board | substrate is maintained in an open state. Accordingly, it is possible to easily attach and detach the substrate to and from the frame by using a transfer robot that can access the back surface of the opened substrate.

The frame may further include a frame-shaped mask portion that defines a film formation region of the substrate. In this case, the facing surface is provided on a part of the mask portion facing the peripheral edge portion of the substrate.
According to this configuration, the peripheral portion of the film formation surface of the substrate can be held while the film formation region of the substrate is defined by the mask portion.

The suction portion may have a plurality of chuck regions provided on the facing surface. Each of the plurality of chuck regions includes a chuck electrode.
Thereby, since the several location of the peripheral part of a board | substrate can be adsorb | sucked, a board | substrate can be hold | maintained stably.

The substrate holder may further include a power supply circuit provided on the frame body and capable of supplying power to the plurality of chuck regions.
Thereby, installation of the power supply line from the outside can be made unnecessary.

The power supply circuit may include a control unit capable of individually supplying power to the plurality of chuck regions.
As a result, the suction start / release operation in each chuck region can be individually controlled, so that the occurrence of warping and bending of the substrate can be suppressed.

A vertical substrate transfer apparatus according to an aspect of the present invention includes a substrate holder and a transfer unit.
The substrate holder is configured to electrostatically attract at least a part of the peripheral portion of the substrate provided on the opposing surface and a frame having an opposing surface facing the peripheral portion of the substrate and the thickness direction of the substrate. And an adsorbing part configured to be possible.
The transport unit transports the substrate holder in a standing posture.

A substrate processing apparatus according to an aspect of the present invention includes a substrate holder, a transfer unit, and a processing unit.
The substrate holder is configured to electrostatically attract at least a part of the peripheral portion of the substrate provided on the opposing surface and a frame having an opposing surface facing the peripheral portion of the substrate and the thickness direction of the substrate. And an adsorbing part configured to be possible.
The transport unit transports the substrate holder in a standing posture.
The processing unit processes the substrate held by the substrate holder.

  As described above, according to the present invention, it is possible to easily attach and detach the substrate while suppressing the generation of particles.

It is a front view showing roughly the substrate holder concerning one embodiment of the present invention. It is a schematic sectional drawing of the AA line direction in FIG. It is a schematic plan view which shows the structure of the substrate processing apparatus which concerns on one Embodiment of this invention. It is a schematic sectional drawing of the BB line direction in FIG. It is a schematic side view which shows one structural example of the transfer unit in the said substrate processing apparatus. It is a schematic front view which shows the modification of a structure of the board | substrate holder shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Substrate holder]
FIG. 1 is a front view schematically showing a substrate holder 100 according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along line AA in FIG.

  In each drawing, the X axis, the Y axis, and the Z axis indicate three axial directions that are orthogonal to each other. In the present embodiment, they correspond to the thickness direction, the width direction, and the height direction of the substrate holder 100, respectively.

The substrate holder 100 is used in a vertical substrate transfer apparatus, which will be described later, and is configured as a carrier for transferring the substrate W while being held in a substantially vertical posture (standing posture) (FIG. 4).
The vertical substrate transport apparatus is not limited to the one that transports the substrate W in a vertical posture, and includes a case where the substrate W is transported while being inclined by about 5 ° with respect to the vertical direction. That is, the standing posture is not limited to a literally vertical posture, but includes a substantially vertical posture.
The vertical substrate transfer apparatus is applied to a substrate processing apparatus described later (FIG. 3). The substrate processing apparatus is composed of, for example, an inline sputtering apparatus. The substrate W is typically a rectangular glass substrate, and the size thereof is not particularly limited. For example, a substrate having a G4 to G6 size is used.

  The substrate holder 100 includes a frame body 10 and a suction part 20.

(Frame)
The frame 10 is configured by a rectangular plate-like member having a long side in the vertical direction, and is typically configured by a metal material such as stainless steel or an aluminum alloy. The frame 10 is formed with a thickness larger than that of the substrate W, and has a front surface 101 facing a film forming source (a sputtering cathode in this example) and a back surface 102 on the opposite side (see FIG. 2).

  A rectangular opening 11 capable of accommodating the substrate W in a standing posture is provided in the surface of the frame body 10. A frame-shaped mask portion 12 that demarcates a film formation region of the substrate W is provided at the peripheral portion of the opening 11. The mask portion 12 is provided over the entire inner peripheral edge portion of the opening 11 and is formed with a thickness smaller than the thickness of the frame body 10.

  As shown in FIG. 2, the mask portion 12 has a surface portion 121 connected to the surface 101 of the frame body 10 and is formed so that the thickness gradually decreases toward the tip portion. The back surface portion 122 of the mask portion 12 is formed on the back surface 102 of the frame body 10 via a stepped portion, and constitutes a facing surface 13 that faces the peripheral edge portion of the film formation surface W1 of the substrate W. As a result, a region excluding the peripheral portion of the surface of the substrate W (film formation surface W1) is exposed to the outside from the surface 101 of the frame 10, and the back surface (non-film formation surface) of the substrate W from the back surface 102 of the frame 10. The whole area of W2) is exposed.

  The facing surface 13 is composed of a peripheral portion of the substrate W and a flat surface facing the thickness direction of the substrate W, and is provided on a part (back surface portion 122) of the mask portion 12 in this embodiment. The opposing surface 13 is configured to oppose the entire periphery of the peripheral portion of the film formation surface W1 of the substrate W, and an adsorption portion 20 capable of electrostatically adsorbing the substrate W is provided in the surface. Is provided.

(Suction part)
The adsorption unit 20 is provided on the facing surface 13 and is configured to be capable of electrostatically adsorbing at least a part of the peripheral edge of the substrate W. The suction unit 20 is typically composed of an electrostatic chuck and is built in a plurality of chuck regions 21 provided on the facing surface 13 as shown in FIG.

  The adsorption unit 20 includes a chuck electrode that is provided in each chuck region 21 and that develops an electrostatic adsorption force with respect to the substrate W when a voltage higher than a predetermined voltage is applied. The type of electrostatic attraction force is not particularly limited, and typically, Coulomb force, Johnson Rabeck force, or the like is employed.

  In this embodiment, the suction unit 20 is configured by a bipolar electrostatic chuck, and each chuck region 21 is provided with a positive electrode chuck electrode and a negative electrode chuck electrode. These two chuck electrodes are arranged adjacent to each other so as to face the facing surface 13. Each electrode is protected by an insulating film and contacts the substrate W through the insulating film. In addition, the adsorption | suction part 20 may be comprised with a monopolar electrostatic chuck.

  The plurality of chuck regions 21 are configured at substantially equal intervals over the entire circumference of the facing surface 13. In the example of FIG. 1, the upper and lower edges of the substrate W are held by the three chuck regions 21, and both side edges of the substrate W are held by the four chuck regions 21. Of course, this is an example. In addition, the size (area), the number of arrays, the array form, and the like of each chuck region 21 are not particularly limited as long as the substrate W can be stably held in the standing posture.

  A single chuck region 21 may be used. In this case, the chuck region 21 may be configured in a half frame shape so as to adsorb the upper half of the substrate W, or may be configured in a frame shape so as to adsorb the entire circumference of the substrate W.

  The substrate holder 100 further includes a power supply circuit 22 that can supply power to each chuck region 21 (chuck electrode). The power supply circuit 22 is provided in the frame body 10 and is built between the lower end portion 112 and the opening portion 11 of the frame body 10 as shown in FIG.

  The power supply circuit 22 includes a battery 221 and a control unit 222. The battery 221 is typically composed of a rechargeable secondary battery, such as a lithium ion secondary battery. The control unit 222 is configured to be able to supply the power of the battery 221 to each chuck region 21 by an input operation to a switch (not shown). The switching of the switch is operated, for example, at the transfer position (loading position / unloading position) of the substrate W in the substrate processing apparatus.

  The control unit 222 may be configured by a computer including a CPU / MPU and a memory. In this case, it is possible to automatically switch power supply to the chuck region 21 and stop thereof at a predetermined position.

  The power supply circuit 22 is electrically connected to the chuck electrodes in each chuck region 21 via a wiring group 23 routed inside the frame body 10. The power supply circuit 22 is typically configured to synchronize and supply power to each chuck region 21.

  Instead of this, the power may be individually supplied to the predetermined chuck region 21. As a result, the suction start / release operation in each chuck region 21 can be individually controlled, so that high flatness can be ensured even for a substrate that is likely to be warped or bent. For example, by controlling the power supply so that the suction operation is started sequentially from the upper edge side to the lower edge side of the substrate W, the substrate W can be stably maintained at a desired flatness while utilizing its own weight. It becomes possible to hold.

  Each chuck region 21 receives the supply of electric power and starts the holding operation of the substrate W, and the electric power supply is cut off to release the holding operation of the substrate W. The power supply circuit 22 may be configured to apply a reverse voltage to the chuck region 21 during the dechucking operation in order to quickly hold the substrate W.

[Substrate processing equipment]
Subsequently, a vertical substrate transfer apparatus and a substrate processing apparatus according to this embodiment will be described.

  FIG. 3 is a schematic plan view showing a configuration of an in-line sputtering apparatus (hereinafter referred to as a sputtering apparatus) 200 as a substrate processing apparatus.

  As illustrated in FIG. 3, the sputtering apparatus 200 includes a first load lock chamber 241, a heating chamber 242, a first sputtering inlet chamber 243, a first sputtering chamber 244, and a first in order in the transport direction of the substrate holder 100. A sputter outlet chamber 245, a first inversion chamber 246, a second sputter inlet chamber 247, a second sputter chamber 248, a second sputter outlet chamber 249, a transfer chamber 250, and a second load lock chamber 251. The substrates W are sequentially transported in a standing posture to each of the chambers while being held by the substrate holder 100. The first reversing chamber 246 is for reversing the transport direction of the substrate holder 100 by 180 degrees.

  A vacuum pump P is connected to the heating chamber 242, the first and second sputtering inlet chambers 243 and 247, the first and second sputtering outlet chambers 245 and 249, the first inversion chamber 246, and the transfer chamber 250, respectively. Sputter cathodes SP1 and SP2 are disposed in the first and second sputtering chambers 244 and 248, respectively. Furthermore, between the first load lock chamber 241 and the heating chamber 242, between the heating chamber 242 and the first sputter inlet chamber 243, between the first sputter outlet chamber 245 and the first inversion chamber 246, Gate valves between the first inversion chamber 246 and the second sputter inlet chamber 247, between the second sputter outlet chamber 249 and the transfer chamber 250, and between the transfer chamber 250 and the second load lock chamber 251. Are arranged respectively.

  Each of the chambers constitutes a vertical substrate transfer device (hereinafter referred to as a transfer device) 300. FIG. 4 is a schematic cross-sectional view in the BB line direction in FIG.

  As shown in FIG. 4, the transport apparatus 300 includes a substrate holder 100 and a transport unit 310 that transports the substrate holder 100 in an upright posture. The transfer unit 310 includes a transfer chamber 30 (first and second sputtering chambers 244 and 248 in the illustrated example), a drive mechanism unit 31, and a support mechanism unit 32.

  The drive mechanism unit 31 is provided at the bottom of the transfer chamber 30. The drive mechanism unit 31 rotationally drives the drive roller 311 that supports the lower end 112 of the substrate holder 100, the drive shaft 312 that rotates the drive roller 311, the support unit 313 that supports the drive shaft 312, and the drive shaft 312. And a motor 314. A plurality of drive rollers 311 are arranged at predetermined intervals along the conveyance direction of the substrate holder 100, and convey the substrate roller 100 toward the downstream side while supporting the substrate holder 100.

  The support mechanism unit 32 is provided in the upper part of the transfer chamber 30. The support mechanism unit 32 includes a pair of magnetic field generation units 321 facing the magnet unit 113 provided on the upper end 111 of the substrate holder 100 and a pair of surfaces facing the direction perpendicular to the transport direction with the upper end 111 of the substrate holder 100 interposed therebetween. And a guide wall portion 322. The magnetic field generator 321 is composed of a plurality of permanent magnets arranged along the transport direction of the substrate holder 100, and holds the standing position of the substrate holder 100 by magnetically attracting the magnet portion 113 of the substrate holder 100. The pair of guide wall portions 322 are opposed to the upper end portion 111 of the substrate holder 100 with a space therebetween, and restricts the substrate holder 100 from falling over a predetermined angle.

  Referring to FIG. 3, sputtering apparatus 200 further includes an atmospheric chamber 252, a substrate transfer chamber 253, and a second inversion chamber 254.

  The atmospheric chamber 252 is connected to the first and second load lock chambers 241 and 251 via a gate valve. The atmospheric chamber 252 carries the substrate holder 100 into the first load lock chamber 241 and carries the substrate holder 100 out of the second load lock chamber 251.

  In the substrate delivery chamber 253, the processed substrate W is taken out from the substrate holder 100 by the transfer unit 400, and the unprocessed substrate W is transferred to the substrate holder 100. The substrate holder 100 holding the unprocessed substrate W is inverted in the second inversion chamber 254 and then transferred to the first load lock chamber 241 through the atmosphere chamber 252.

  The substrate delivery position is not limited to the above example, and various changes can be made. For example, the take-out position of the substrate W from the substrate holder 100 and the transfer position of the substrate W to the substrate holder 100 may be different from each other, or the substrate holder 100 after the substrate W is taken out (or after transfer). The transfer route can be appropriately determined according to the apparatus configuration.

  FIG. 5 is a schematic side view showing a configuration example of the transfer unit 400.

  The transfer unit 400 includes a support table 401 that supports the substrate W, a base 404 that supports the support table 401, and a support block 405 that is disposed between the support table 401 and the base 404.

  The support table 401 has a plurality of suction pads 402 that can vacuum-suck the non-film-forming surface W2 (see FIG. 2) of the substrate W. The support block 405 includes a pivot shaft 403 that pivots the support table 401 about 90 degrees with respect to the base 404, and is configured to be movable in the front-rear direction (X-axis direction in FIG. 5) with respect to the base 404. Is done. As shown in FIG. 5, the transfer unit 400 is configured to be able to rotate approximately 90 degrees between a recumbent posture and a standing posture while the support table 401 holds the substrate W by suction. Further, the transfer unit 400 is configured to be able to transfer the substrate W sucked and held on the support table 401 to the substrate holder 100 held upright by the support body 260 in the substrate transfer chamber 253. Is done.

[Operation of substrate holder]
Subsequently, the operation of the substrate holder 100 configured as described above will be described together with the operation of the sputtering apparatus 200.

  As shown in FIG. 5, the substrate holder 100 transported to the substrate delivery chamber 253 is stopped with its back surface 102 facing the transfer unit 400. The transfer unit 400 converts the support table 401 from a recumbent posture to a standing posture, and the peripheral portion of the film-forming surface W1 of the unprocessed substrate W sucked and held on the support table 401 is placed on the opposing surface 13 of the substrate holder 100. After making them face each other, the support table 401 is advanced to bring the substrate W into contact with the facing surface 13. At this time, since the front surface 101 of the substrate holder 100 is supported by the support body 40, the substrate W can be stably received on the back surface 102 (opposing surface 13).

  The power supply circuit 22 of the substrate holder 100 starts an electrostatic chucking operation on the substrate W by supplying power to the chucking unit 20 (each chuck region 21). Switching of power supply ON by the power supply circuit 22 may be performed by an input operation such as pressing by a transfer unit 400 on a switch (not shown), or may be performed in a non-contact manner by wireless communication.

  The timing of power supply to each chuck region 21 may be before the substrate W contacts the facing surface 13 or after contact. Further, the timing of the suction operation in each chuck region 21 is simultaneously performed in each, but is not limited thereto.

  After the transfer of the substrate W from the support table 401 to the substrate holder 100 is completed, the support table 401 returns to the original retracted position. On the other hand, the substrate holder 100 is transported to the first load lock chamber 241 via the atmospheric chamber 252 after the transport direction is changed 180 degrees by the second reversing chamber 254 while holding the substrate W.

  The substrate holder 100 carried into the first load lock chamber 241 is sequentially transferred to the heating chamber 242, the first sputter inlet chamber 243, and the first sputter chamber 244. In the first sputtering chamber 244, a film forming process is performed on the film forming surface W 1 of the substrate W via the mask unit 12. Since the mask portion 12 is configured so that the thickness decreases toward the tip (see FIG. 2), the desired mask accuracy is ensured. In addition, since the suction portion 20 (chuck region 21) is provided on the back surface portion 122 of the mask portion 12, the adhesion between the mask portion 12 and the substrate W is increased, and thereby, between the mask portion 12 and the substrate W. Therefore, the wraparound of the film forming material is suppressed as much as possible, and the mask accuracy is further improved.

  After completion of the film formation process in the first sputtering chamber 244, the substrate holder 100 moves the second sputtering chamber 248 through the first sputtering outlet chamber 245, the first inversion chamber 246, and the second sputtering inlet chamber 247. It is conveyed to. In the second sputtering chamber 248, a film forming process similar to that described above is performed, but may be omitted if necessary. Thereafter, the substrate holder 100 is transferred again to the substrate delivery chamber 253 via the second sputter outlet chamber 249, the transfer chamber 250, the second load lock chamber 251, and the atmospheric chamber 252.

  In the substrate transfer chamber 253, the film-formed substrate W is transferred from the substrate holder 100 to the support table 401 of the transfer unit 400. After the suction pad 402 of the support table 401 sucks the non-film-forming surface W2 of the substrate W, the substrate holder 100 cuts off the power supply from the power supply circuit 22 to each chuck region 21 and applies to the film-forming surface W1 of the substrate W. Release the electrostatic attraction force. As a result, the film-formed substrate W is transferred from the substrate holder 100 to the support table 401.

  The switching of power supply OFF by the power supply circuit 22 may be performed by an input operation such as pressing by a transfer unit 400 to a switch (not shown), or may be performed in a non-contact manner by wireless communication. The release of the electrostatic attraction force may be performed by applying a voltage opposite to that at the time of holding from the power supply circuit 22 to each chuck region 21.

  After the transfer unit 400 converts the support table 401 to the lying posture, the transferred substrate W is transferred to another transfer robot, and then a new unprocessed substrate W is formed by the same operation as described above. Transferred to the substrate holder 100. Thereafter, the above-described operation is repeatedly executed.

  As described above, according to the present embodiment, the substrate holder 100 electrostatically holds the substrate W by the attracting portion 20 (chuck region 21) provided on the facing surface 13 of the frame 10 facing the peripheral edge of the substrate W. Therefore, the generation of particles can be suppressed as compared with the substrate holding structure using the clamp mechanism.

  Further, since the suction portion 20 (chuck region 21) is provided on the facing surface 13 of the frame 10 facing the peripheral edge of the film forming surface W1 of the substrate W, the non-film forming surface W2 of the substrate W is in an open state. Maintained. This facilitates access to the non-film-formation surface W2 of the substrate W by the transfer unit 400 without requiring special positioning, and enables the substrate W to be attached to and detached from the frame body 10 quickly and reliably. Become.

  Moreover, since the adsorption | suction part 20 (chuck area | region 21) is provided in the several places of the opposing surface 13 of the frame 10, the board | substrate W can be hold | maintained more stably. Furthermore, since the power supply circuit 22 is provided integrally with the frame body 10, it is possible to eliminate the need for an external power supply line.

  As mentioned above, although embodiment of this invention was described, this invention is not limited only to the above-mentioned embodiment, Of course, a various change can be added.

  For example, in the above embodiment, the suction part 20 of the substrate holder 100 is configured to suck and hold the peripheral edge of the film formation surface W1 of the substrate W. Instead, the suction part 20 of the substrate W is formed on the non-film formation surface W2 of the substrate W. You may comprise so that a peripheral part may be adsorbed-held. Thereby, the entire film can be formed on the film formation surface W1 of the substrate W.

  Further, in the above embodiment, the suction portion 20 (opposing surface 13) of the substrate holder 100 is formed only at the peripheral edge portion of the opening portion 11 of the frame body 10. However, the present invention is not limited to this, for example, the substrate shown in FIG. Like the holder 1100, the bridge part 14 which cuts the opening part 11 between the opposite sides of the frame 10 may be provided, and the suction part 20 may also be provided on the bridge part 14. The form of the bridge portion 14 is not particularly limited, and may be any of a lattice shape, a truss shape, and the like. For example, FIG. 6 shows an example in which the bridge portion 14 is formed in a cross shape, and four film formation regions are defined on the film formation surface of the substrate W by the bridge portion 14 functioning as a mask portion. ing.

  In the above embodiment, the glass substrate is described as an example of the substrate W. However, the present invention is not limited to this, and a flexible plastic film substrate may be used as the substrate W. In this case, instead of simultaneously performing the suction operation of each suction part 20 of the substrate holder 100 as described above, the suction operation is started in order from the upper edge side to the lower edge side of the substrate, thereby making it possible to use the planar weight while utilizing the weight of the substrate. A high holding posture can be obtained.

  Further, in the above embodiment, the suction portions 20 (chuck regions 21) are arranged in a single row on the facing surface 13 of the substrate holder 100. However, the present invention is not limited to this, and the suction portions 20 may be arranged in multiple rows. Thereby, the retention strength with respect to the board | substrate W can be improved. In this case, each adsorption | suction part 20 may be arrange | positioned on the opposing surface 13 at multiple rows | lines in zigzag form.

DESCRIPTION OF SYMBOLS 10 ... Frame 11 ... Opening part 12 ... Mask part 13 ... Opposite surface 14 ... Bridging part 20 ... Adsorption part 21 ... Chuck area 22 ... Power supply circuit 23 ... Wiring group 100, 1100 ... Substrate holder 200 ... Sputtering device 300 ... Vertical Mold substrate transfer device 400 ... Transfer unit W ... Substrate W1 ... Deposition surface W2 ... Non-deposition surface

Claims (7)

A substrate holder that is used in a vertical substrate transfer apparatus and can hold a substrate in an upright posture,
A frame having an opposing surface facing the peripheral portion of the substrate and the thickness direction of the substrate;
A substrate holder comprising: an adsorption portion provided on the facing surface and configured to be capable of electrostatically adsorbing at least a part of a peripheral portion of the substrate. The substrate holder according to claim 1,
The frame body further includes a frame-shaped mask portion that defines a film formation region of the substrate,
The said opposing surface is provided in a part of said mask part facing the peripheral part of the said board | substrate. The substrate holder according to claim 1 or 2,
The suction portion has a plurality of chuck regions provided on the facing surface;
The plurality of chuck regions each include a chuck electrode. The substrate holder according to claim 3, wherein
A substrate holder further comprising a power supply circuit provided on the frame body and capable of supplying power to the plurality of chuck regions. The substrate holder according to claim 4, wherein
The power supply circuit includes a control unit capable of individually supplying power to the plurality of chuck regions. A frame having an opposing surface facing the peripheral portion of the substrate and the thickness direction of the substrate, and configured to be capable of electrostatically adsorbing at least a part of the peripheral portion of the substrate provided on the opposing surface. A substrate holder having a suction part;
A vertical substrate transport apparatus comprising: a transport unit that transports the substrate holder in an upright posture. A frame having an opposing surface facing the peripheral portion of the substrate and the thickness direction of the substrate, and configured to be capable of electrostatically adsorbing at least a part of the peripheral portion of the substrate provided on the opposing surface. A substrate holder having a suction part;
A transport unit for transporting the substrate holder in an upright position;
A substrate processing apparatus comprising: a processing unit that processes the substrate held by the substrate holder.

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