JP2006190817A - Substrate transfer device and substrate transfer method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that productivity is reduced due to the fact that the alignment of a transfer hand 14 over its insertion position is required so as to cope with the deformation degree of the semiconductor substrate 10, in a takeout operation when the semiconductor substrates 10 are taken out of a carrier 1 one by one by the flat transfer hand 14 and transferred to a processing stage 5 in a suceeding process. <P>SOLUTION: Paired forks 22 and 22 of the transfer hand 14 are inserted under the semiconductor substrate 10 in the carrier 1 so as to form a space A between the peripheral edge of the semiconductor substrate 10 and the inner diameter side of a root 28 of the forks 22 and 22. Then, the transfer hand 14 is moved up or the carrier 1 is moved down to support parts of the semiconductor substrate 10 as a takeout target near its lateral peripheral edges by the forks 22 and 22. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate transfer apparatus and a substrate transfer method for taking out semiconductor substrates such as silicon wafers stored in multiple stages in a carrier one by one and transferring them to a next processing stage.

  In general, when a semiconductor chip is manufactured from a semiconductor substrate such as a silicon wafer, a plurality of semiconductor substrates are transferred to an arbitrary position in a state of being accommodated in multiple stages in a carrier, and then the semiconductor substrate 1 Each sheet is taken out and supplied to the next processing stage.

In a conventional substrate transfer apparatus used in this type of work, a vacuum suction type transfer hand body formed in a flat shape is inserted below the substantially central portion of each semiconductor substrate, and then the lower surface of the semiconductor substrate is substantially omitted. After the central portion is adsorbed by the transfer hand body, the semiconductor substrate is taken out one by one from the carrier by pulling out the transfer hand body from the carrier (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 2001-168170 (see paragraphs 0002 to 0004 and FIG. 7)

  By the way, the holding of the semiconductor substrate at each stage in the carrier is performed by fitting the left and right outer peripheral edges of one semiconductor substrate into the fitting grooves formed in upper and lower multi-stage shapes on the left and right inner side walls of the carrier. Since both ends are freely supported, the semiconductor substrate in the carrier is easily bent downward by its own weight. Whether the semiconductor substrate is bent or not is different depending on the thickness of the semiconductor substrate (the thinner the substrate, the more downward it is bent).

  However, in the conventional substrate transfer apparatus, when the semiconductor substrate is taken out from the carrier, the substantially central portion of the lower surface having a large amount of deflection is sucked and held by the suction hand body, so that the contact between the semiconductor substrate to be taken out and the transfer hand body is made. In order to avoid the problem and secure the insertion space of the transfer hand body, the insertion position of the transfer hand body is adjusted one by one according to the bending state of the semiconductor substrate, or the accommodation pitch interval (fitting groove between the semiconductor substrates in the carrier) The vertical pitch interval) had to be set wide. In the former measure, it is troublesome to align the insertion position of the transfer hand body every time the semiconductor substrate is taken out, and this causes a problem of reducing productivity. Further, the latter measure has a problem that the number of semiconductor substrates that can be accommodated in one carrier is reduced as a result of an increase in the accommodation pitch interval between the semiconductor substrates in the carrier.

  In view of the above, it is a technical object of the present invention to provide a substrate transfer apparatus and a substrate transfer method that solve the above problems.

  In order to solve this technical problem, the invention of claim 1 is a flat for inserting the semiconductor substrates one by one from the carrier by inserting them below the respective semiconductor substrates accommodated in multiple stages in the carrier. A substrate transfer apparatus comprising a transfer hand body having a pair of forks for placing the semiconductor substrate at the tip of the transfer hand body when both are inserted into the carrier. The fork portions are provided to be spaced apart from each other so as to extend along a portion close to both outer peripheral edges intersecting with the insertion direction, and the both fork portions are outer peripheral edges of the semiconductor substrate when inserted into the carrier. And a length such that a gap is left between the inner diameter side of the base portions of the both fork portions.

  According to a second aspect of the present invention, in the substrate transfer apparatus according to the first aspect, an upward opening-shaped suction hole for adsorbing and holding the semiconductor substrate is formed on the upper surfaces of the fork portions. It is.

  The invention of claim 3 is a substrate transfer method in which semiconductor substrates accommodated in multiple stages in a carrier are taken out one by one with a flat transfer hand body and transferred to a processing stage in the next process, wherein the inside of the carrier A pair of fork portions provided at the front end of the transfer hand body are provided below the semiconductor substrate in such a manner that a gap is provided between the outer peripheral edge of the semiconductor substrate and the inner diameter side of the base portion of the fork portions. Then, the transfer hand body is raised or the carrier is lowered, and the fork portions support the portions of the semiconductor substrate close to both outer peripheral edges that intersect the insertion direction.

  According to the present invention, when the semiconductor substrates in the carrier are taken out one by one, both fork portions of the transfer hand body are disposed on both outer peripheral edges intersecting the insertion direction among the semiconductor substrates accommodated in a state where both ends are freely supported. It is inserted below the nearest part. In addition, a gap is formed between the outer peripheral edge of the semiconductor substrate and the inner diameter side of the base portion of the fork portions.

  In this case, since the space between the fork portions is wide, even if the semiconductor substrate is bent downward due to its own weight, the fork portions are in contact with the greatly bent center portion of the semiconductor substrate. Without any problem, it is possible to smoothly enter the insertion space between the semiconductor substrates arranged vertically. Thereby, damage to the semiconductor substrate at the time of taking out can be prevented.

  Further, the portion of the semiconductor substrate close to both outer peripheral edges intersecting with the insertion direction has a small downward bending amount as compared with the central portion, and therefore the insertion position of both fork portions is relative to the semiconductor substrate to be taken out. Thus, it can be set constant regardless of the thickness of the semiconductor substrate. Therefore, it is possible not only to eliminate the trouble of aligning the insertion positions of the both fork portions every time the semiconductor substrate is taken out, but also to prevent malfunctions due to setting errors, etc. There is an effect that can be remarkably improved.

  Further, since there is a gap between the outer peripheral edge of the semiconductor substrate and the inner diameter side of the base portion of the both fork portions, even if the semiconductor substrate is bent downward by its own weight, The base portion of the portion does not collide with the semiconductor substrate. Therefore, according to the present invention, it is possible to reliably avoid damage to the semiconductor substrate at the time of taking out and improve the yield of the semiconductor substrate.

  DESCRIPTION OF EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings (FIGS. 1 to 6). 1 is a schematic front view of a substrate transfer device, FIG. 2 is a schematic plan view of the substrate transfer device, FIG. 3 is a plan view showing a state in which a semiconductor substrate is taken out from a carrier, and FIG. (B) is a sectional view taken along the line IVb-IVb of (a), FIG. 5 is a plan sectional view showing a state in which the transfer hand body is inserted into the carrier, and FIGS. 6 (a) and 6 (b) are transfer hands. It is explanatory drawing which shows the taking-out aspect with a body.

  First, an overall outline of the carrier and the substrate transfer apparatus according to the embodiment will be described with reference to FIGS.

  As shown in FIG. 1, the carrier 1 has a substantially rectangular tube shape in which the entrance / exit 2 of the semiconductor substrate 10 is opened sideways. A plurality of fitting grooves 3 (see FIGS. 2, 3, and 5) in which the left and right outer peripheries of the semiconductor substrate 10 are fitted are formed on the left and right inner side surfaces of the carrier 1 in a vertically parallel manner with a pitch interval P. Therefore, in the carrier 1, accommodating portions for accommodating only one semiconductor substrate 10 in a horizontal posture are provided in a multistage shape with a pitch interval P. In other words, a space of the accommodation pitch interval P is vacant between the semiconductor substrates 10 and 10 in the carrier 1. The carrier 1 is placed on the upper surface of the carrier stage 4.

  The carrier 1 of the embodiment is for a 6-inch semiconductor substrate 10. In this case, the accommodation pitch interval P is set to about 4.76 mm in accordance with SEMI (Semiconductor Equipment and Material International) standards. In addition, the opening width dimension WM (see FIGS. 3 and 6) between the left and right inner surfaces of the carrier 1 is about 132 mm.

  The substrate transfer device 11 arranged opposite to the carrier stage 4 is for taking out the semiconductor substrates 10 in the carrier 1 one by one and transferring them to the processing stage 5 (see FIG. 2) in the next process. . The substrate transfer device 11 is inserted below each semiconductor substrate 10 in the carrier 1 and has a flat transfer hand body 14 for taking out the semiconductor substrates 10 one by one from the carrier 1, and the transfer hand body 14. And a machine frame 12 made of cast iron or the like for supporting the arm body 13.

  The arm body 13 has a head member 16 that is horizontally rotatable about a vertical axis 15 with respect to the machine frame 12 and is supported so as to be movable up and down, and a horizontal rotation about a vertical axis 17 on the distal end side of the head member 16. A first swing member 18 pivotally attached in a movable state, and a second swing member 20 pivotally attached in a state of being horizontally rotatable around a vertical axis 19 around the distal end side of the first swing member 18. Has been. The transfer hand body 14 is pivotally attached to the distal end side of the second swing member 20 so as to be horizontally rotatable about a vertical axis 21.

  In the embodiment, the transfer hand body 14, the swing members 18, 20, and the head member 16 are horizontally rotated by a drive motor (not shown) so that the entire arm body 13 expands and contracts, thereby transferring the transfer hand body 14. However, from the state inserted into the carrier 1 (see the solid line state in FIGS. 1 and 2) to once above the head member 16, a straight line SL connecting the center of the carrier 1 and the center of the head member 16 in plan view. After moving along (see FIG. 3), it is configured to move to the next processing stage 5 (see the two-dot chain line state in FIG. 2).

  Next, a detailed configuration of the transfer hand body will be described with reference to FIGS. 4 and 5 and the like.

  The transfer hand body 14 is flat in a side view so that it can be smoothly inserted into the insertion space SP between the semiconductor substrates 10, 10 in the carrier 1, and has a substantially Y shape in a plan view such that the tip side is divided into two forks. (Fork type). In addition, the thickness of the transfer hand body 14 of the embodiment is about 2 mm at the maximum.

  A pair of fork portions 22, 22 provided on the front end side of the transfer hand body 14 is a portion on which the semiconductor substrate 10 to be taken out from the carrier 1 is placed. In each fork portion 22, an abutting pad portion 23 that is in close contact with a portion of the lower surface of the semiconductor substrate 10 near the left and right outer peripheral edges is integrally formed on the front end side of the upper surface so as to protrude upward. A suction hole 24 for adsorbing and holding the semiconductor substrate 10 is formed in an upward opening shape at a substantially central portion of the upper surface of each contact pad portion 23. In order to prevent the fine particles (particles) such as dust from adhering to or scratching the semiconductor substrate 10 as much as possible, the planar view areas of the pair of contact pad portions 23 and 23 are set to the minimum necessary. .

  Each suction hole 24 communicates with a flow hole 26 formed in the proximal end portion of the transfer hand body 14 via an air flow passage 25 formed in the transfer hand body 14. A suction source (not shown) such as a pump that forcibly sucks outside air is connected to the circulation hole 26 via a communication pipe 27 such as a flexible hose. In the embodiment, the semiconductor substrate 10 is adsorbed to both the suction holes 24, 24 by driving the suction source and sucking outside air from the suction holes 24, 24 of both the fork portions 22, 22. .

  On the other hand, both fork portions 22, 22 are arranged so as to extend along the portions near both the left and right outer peripheral edges (both outer peripheral edges intersecting the insertion direction) of the semiconductor substrate 10 when inserted into the carrier 1. It is provided at the front end of the transfer hand body 14 with a space W left therebetween.

  In the embodiment, the distance W between the fork parts 22 and 22 (internal dimension from the inner edge of one fork part 22 to the inner edge of the other fork part 22) is about 108 mm. The width dimension WF of each fork part 22 is set to about 10 mm. The distance W between the fork portions 22 and 22 may be 50% or more of the diameter of the semiconductor substrate 10 so that the support position of the fork portions 22 and 22 with respect to the semiconductor substrate 10 is as far as possible from the center of the semiconductor substrate 10. . It should be noted that the arrangement width dimension of both fork parts 22, 22 (external dimension from the outer edge of one fork part 22 to the outer edge of the other fork part 22) is smaller than the opening width dimension WM of the carrier 1. Not too long.

  Further, when the fork portions 22 and 22 are inserted into the carrier 1, a gap A (see FIGS. 2 and 5) is formed between the outer peripheral edge of the semiconductor substrate 10 and the inner diameter side of the base portion 28 of the fork portions 22 and 22. It is set to a long length LF (distance from the tip to the inner diameter side of the root portion 28) such that the reference is open. In the embodiment, the outer peripheral edge of the semiconductor substrate 10 and the both fork portions 22 in a state where the center of gravity O (center) of the semiconductor substrate 10 is positioned on a straight line connecting the suction holes 24 and 24 of the fork portions 22 and 22 in plan view. , 22 is configured such that a gap A is provided between the inner diameter side of the base portion 28 of the base portion 28.

  With this setting, the semiconductor substrate 10 is attracted to the suction holes 24, 24 of the both fork portions 22, 22 at a point-symmetrical position across the center of gravity O in plan view. 22 can be stably held with good balance. If there are three or more suction holes 24 in total, the center of gravity O of the semiconductor substrate 10 to be taken out may be positioned on the inner diameter side of a polygon formed by a straight line connecting the suction holes 24 in plan view. The length LF of each fork portion 22 of the embodiment is about 115 mm.

  In the above configuration, a mode in which semiconductor substrates are taken out one by one from the carrier will be described with reference to FIGS. 6 (a) and 6 (b).

  First, by horizontally rotating the transfer hand body 14 and the swing members 18 and 20 so that the entire arm body 13 extends, both fork portions 22 and 22 of the transfer hand body 14 are disposed below the semiconductor substrate 10 to be taken out. 22 is inserted (refer to the solid line state in FIGS. 6A and 6B). At this time, the both fork portions 22 and 22 are disposed below a portion near the left and right outer peripheral edges of the semiconductor substrate 10 accommodated in a state where both ends are freely supported. Further, the center of gravity O of the semiconductor substrate 10 is positioned on a straight line connecting the suction holes 24 and 24 in a plan view, and the outer peripheral edge of the semiconductor substrate 10 and the inner diameter side of the base portions 28 of the fork portions 22 and 22. A gap A is made between (see FIG. 5).

  Then, since the interval W between the fork portions 22 and 22 is wide, even if the semiconductor substrate 10 is bent downward due to its own weight, the fork portions 22 and 22 are largely bent portions of the semiconductor substrate 10. It is possible to smoothly enter the insertion space SP between the semiconductor substrates 10 and 10 without contacting the (central portion). Thereby, damage of the semiconductor substrate 10 at the time of taking out can be prevented.

  Further, the portion near the left and right outer peripheral edges of the semiconductor substrate 10 has a downward deflection amount smaller than that of the central portion, and therefore the insertion positions of both fork portions 22 and 22 with respect to the semiconductor substrate 10 to be taken out are determined. It can be set constant regardless of the thickness. Therefore, it is possible not only to eliminate the trouble of aligning the insertion positions of the fork portions 22 and 22 every time the semiconductor substrate 10 is taken out, but also to prevent malfunctions due to setting errors and the like. Production efficiency is greatly improved.

  Further, since there is a gap A between the outer peripheral edge of the semiconductor substrate 10 and the inner diameter side of the base portion 28 of both the fork portions 22 and 22, even if the semiconductor substrate 10 is bent downward due to its own weight, it is removed. Sometimes the base portions 28 of the fork portions 22 and 22 do not collide with the semiconductor substrate 10. Also in this respect, damage to the semiconductor substrate 10 at the time of taking out is prevented. Therefore, according to the present invention, it is possible to reliably avoid damage to the semiconductor substrate 10 at the time of removal and improve the yield of the semiconductor substrate 10.

  In addition, unlike the prior art, it is not necessary to increase the accommodation pitch interval P between the semiconductor substrates 10 and 10 in the carrier 1 in order to secure the insertion space SP of the both fork portions 22 and 22. , 10 can be narrowed so that the carriers 1 do not come into contact with each other due to bending or the like, and the number of semiconductor substrates 10 that can be accommodated in one carrier 1 can be increased.

  After both fork portions 22 and 22 are inserted below the semiconductor substrate 10 to be taken out, the head member 16 is moved up so that the semiconductor substrate 10 to be taken out is placed on the upper surfaces of both fork portions 22 and 22. Lift up. At this time, a suction source (not shown) such as a pump is driven to suck outside air from the suction holes 24, 24 of both fork portions 22, 22, so that the semiconductor substrate 10 is sucked and held in both suction holes 24, 24. The

  Next, the transfer hand body 14 and the swing members 18 and 20 are horizontally rotated so that the entire arm body 13 is contracted, thereby pulling out the transfer hand body 14 holding the semiconductor substrate 10 by suction from the inside of the carrier 1. The transfer hand body 14 is linearly moved to the upper part of the head member 16 along a straight line SL connecting the center and the center of the head member 16 (see FIG. 3).

  Thereafter, the head member 16 is horizontally rotated about 90 ° in the clockwise direction in FIG. 2, and then the transfer hand body 14 and the swing members 18 and 20 are horizontally rotated so that the entire arm body 13 is extended. Then, the transfer hand body 14 holding the semiconductor substrate 10 by suction is moved to the position of the processing stage 5. Then, after the head member 16 is moved down or the processing stage 5 is moved up, the semiconductor substrate 2 is placed on the processing stage 5 and then the outside air from the suction holes 24 and 24 by the suction source (not shown). Is stopped (see the two-dot chain line state in FIG. 2).

  The present invention is not limited to the above-described embodiment, and can be embodied in various forms. For example, the shape of the transfer hand body is not limited to a substantially Y shape in plan view as described above, but is a shape in which the tip side is divided into two forks, such as a substantially U shape in plan view and a substantially U shape in plan view. I just need it. The distance and length between the fork parts, the width of the fork part, and the like can be freely set according to the size of the semiconductor substrate accommodated in the carrier.

  Further, by incorporating an elevating mechanism for moving the upper surface plate on which the carrier 1 is placed up and down by the above-described accommodation pitch interval P in the carrier stage 4, the carrier 1 on the carrier stage 4 is driven by the elevating mechanism to accommodate the accommodation pitch interval P. You may comprise so that it may raise / lower. In this case, after inserting both fork portions 22 and 22 below the semiconductor substrate 10 to be taken out, the carrier stage 4 is moved down instead of the head member 16, so that the semiconductor substrate 10 to be taken out is placed in both fork portions. It can be lifted so as to be placed on the upper surfaces of the 22 and 22.

  In addition, the configuration of each unit is not limited to the illustrated embodiment, and various modifications can be made without departing from the spirit of the present invention.

It is a schematic front view of a substrate transfer apparatus. It is a schematic plan view of a substrate transfer apparatus. It is a top view which shows the state which took out the semiconductor substrate from the carrier. (A) is an enlarged plan view of a transfer hand body, (b) is IVb-IVb view side sectional drawing of (a). It is a plane sectional view showing the state where the transfer hand body is inserted into the carrier. It is explanatory drawing which shows the taking-out aspect in a transfer hand body, (a) is a figure in the case of taking out an upper stage semiconductor substrate, (b) is a figure in the case of taking out a middle stage semiconductor substrate.

Explanation of symbols

LF Length of fork part P Storing pitch interval SP Insertion space WF Distance between both fork parts 1 Carrier 2 Loading / unloading port 3 Fitting groove 10 Semiconductor substrate 11 Substrate transfer device 12 Machine frame 13 Arm body 14 Transfer hand body 16 Head member 18 First swing member 20 Second swing member 22 Fork portion 24 Suction hole 28 Base portion

Claims (3)

A substrate transfer apparatus provided with a flat transfer hand body for inserting the semiconductor substrates one by one from the inside of the carrier, inserted below each semiconductor substrate accommodated in a multistage manner in a carrier,
At the front end of the transfer hand body, a pair of fork portions for placing the semiconductor substrate are both along a portion near both outer peripheral edges that intersects the insertion direction of the semiconductor substrate when both are inserted into the carrier. Are provided with a space between each other,
The both fork portions are set to such a length that a gap is formed between the outer peripheral edge of the semiconductor substrate and the inner diameter side of the base portion of the fork portions when inserted into the carrier. A substrate transfer device.   2. The substrate transfer apparatus according to claim 1, wherein suction holes each having an upward opening are formed on the upper surfaces of the fork portions to hold the semiconductor substrate by suction. A substrate transfer method for taking out semiconductor substrates housed in multiple stages in a carrier one by one with a flat transfer hand body and transferring them to a processing stage of the next process,
Below the semiconductor substrate in the carrier, a pair of fork portions provided at the front end of the transfer hand body are provided with a gap between the outer peripheral edge of the semiconductor substrate and the inner diameter side of the base portions of the fork portions. After being inserted so as to be vacant, the transfer hand body is raised or the carrier is lowered, and the fork portions support the portions of the semiconductor substrate close to both outer peripheral edges that intersect the insertion direction. A substrate transfer method.

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