JPH04152512A - Wafer chuck - Google Patents

Wafer chuck

Info

Publication number
JPH04152512A
JPH04152512A JP27694290A JP27694290A JPH04152512A JP H04152512 A JPH04152512 A JP H04152512A JP 27694290 A JP27694290 A JP 27694290A JP 27694290 A JP27694290 A JP 27694290A JP H04152512 A JPH04152512 A JP H04152512A
Authority
JP
Japan
Prior art keywords
wafer
chuck
upper chuck
substrate
upper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27694290A
Inventor
Naoyuki Ishiwatari
Masayuki Saito
Kazuya Watanabe
Yoshio Watanabe
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP27694290A priority Critical patent/JPH04152512A/en
Publication of JPH04152512A publication Critical patent/JPH04152512A/en
Application status is Pending legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/707Chucks, e.g. chucking or un-chucking operations

Abstract

PURPOSE: To obtain a wafer chuck capable of reducing the out of focus of a wafer during reduction projection exposure with the flatness of a wafer much more improved by comprising a specific upper chuck made up of a substrate having the orientation flat and a specific lower chuck which vacuum-sucks the upper chuck and the wafer.
CONSTITUTION: This wafer chuck comprises an upper chuck 1 and a lower chuck 2: the upper chuck 1 is made up of a substrate having an orientation flat 5 and forms recesses 7 leaving the rim 4 and projections 6 of various shapes, where a recess 7 is provided with a wafer suck hole 8; the lower chuck 2 comprises upper chuck holes 9 inside and wafer suck holes 8 and is overlaid with a mechanism which vacuum-sucks the upper chuck 1 and a wafer. For example, the above-mentioned upper chuck 1 is formed using a substrate of the same shape and size as those of a silicon wafer substrate to be mounted. A wafer chuck 3 is so structured as to rapidly exchange the upper chuck 1 against damage and the like of the upper chuck 1.
COPYRIGHT: (C)1992,JPO&Japio
JP27694290A 1990-10-16 1990-10-16 Wafer chuck Pending JPH04152512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27694290A JPH04152512A (en) 1990-10-16 1990-10-16 Wafer chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27694290A JPH04152512A (en) 1990-10-16 1990-10-16 Wafer chuck

Publications (1)

Publication Number Publication Date
JPH04152512A true JPH04152512A (en) 1992-05-26

Family

ID=17576560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27694290A Pending JPH04152512A (en) 1990-10-16 1990-10-16 Wafer chuck

Country Status (1)

Country Link
JP (1) JPH04152512A (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6212786B1 (en) 1996-04-16 2001-04-10 Kuroda Precision Industries, Ltd. Thin board holding device and method of and apparatus for measuring thickness of thin board
JP2001326270A (en) * 2000-03-10 2001-11-22 Canon Inc Substrate holder, semiconductor manufacturing apparatus and method of manufacturing semiconductor device
WO2006025341A1 (en) * 2004-09-01 2006-03-09 Nikon Corporation Substrate holder, stage apparatus, and exposure apparatus
WO2006075356A1 (en) 2005-01-11 2006-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing apparatus
JP2006216775A (en) * 2005-02-03 2006-08-17 Shin Etsu Polymer Co Ltd Fixing jig and its usage
JP2006319012A (en) * 2005-05-11 2006-11-24 Shin Etsu Polymer Co Ltd Stationary carrier and manufacturing method thereof
JP2007329008A (en) * 2006-06-07 2007-12-20 Tokyo Electron Ltd Hot plate and its manufacturing method
JP2010029929A (en) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method
JP2010517295A (en) * 2007-01-26 2010-05-20 ラム リサーチ コーポレーションLam Research Corporation Bevel etcher with vacuum chuck
JP2013042157A (en) * 2006-05-15 2013-02-28 Asml Netherlands Bv Lithographic device and device manufacturing method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
JP2014093384A (en) * 2012-11-02 2014-05-19 Disco Abrasive Syst Ltd Chuck table
US9278433B2 (en) 2009-04-22 2016-03-08 Ev Group Gmbh Receiving device for receiving semiconductor substrates
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738165A (en) * 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6212786B1 (en) 1996-04-16 2001-04-10 Kuroda Precision Industries, Ltd. Thin board holding device and method of and apparatus for measuring thickness of thin board
JP4700819B2 (en) * 2000-03-10 2011-06-15 キヤノン株式会社 Substrate holding apparatus, semiconductor manufacturing apparatus, and semiconductor device manufacturing method
JP2001326270A (en) * 2000-03-10 2001-11-22 Canon Inc Substrate holder, semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US9885959B2 (en) 2003-04-09 2018-02-06 Nikon Corporation Illumination optical apparatus having deflecting member, lens, polarization member to set polarization in circumference direction, and optical integrator
US9678437B2 (en) 2003-04-09 2017-06-13 Nikon Corporation Illumination optical apparatus having distribution changing member to change light amount and polarization member to set polarization in circumference direction
US9760014B2 (en) 2003-10-28 2017-09-12 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9423698B2 (en) 2003-10-28 2016-08-23 Nikon Corporation Illumination optical apparatus and projection exposure apparatus
US9885872B2 (en) 2003-11-20 2018-02-06 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical integrator and polarization member that changes polarization state of light
US10281632B2 (en) 2003-11-20 2019-05-07 Nikon Corporation Illumination optical apparatus, exposure apparatus, and exposure method with optical member with optical rotatory power to rotate linear polarization direction
US10007194B2 (en) 2004-02-06 2018-06-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10234770B2 (en) 2004-02-06 2019-03-19 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US8717543B2 (en) 2004-09-01 2014-05-06 Nikon Corporation Substrate holder, stage apparatus, and exposure apparatus with first support part provided in a suction space and second support part
JP4779973B2 (en) * 2004-09-01 2011-09-28 株式会社ニコン Substrate holder, stage apparatus, and exposure apparatus
WO2006025341A1 (en) * 2004-09-01 2006-03-09 Nikon Corporation Substrate holder, stage apparatus, and exposure apparatus
JPWO2006025341A1 (en) * 2004-09-01 2008-05-08 株式会社ニコン Substrate holder, stage apparatus, and exposure apparatus
WO2006075356A1 (en) 2005-01-11 2006-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor manufacturing apparatus
US8696816B2 (en) 2005-01-11 2014-04-15 Mitsubishi Electric Corporation Semiconductor manufacturing apparatus
JPWO2006075356A1 (en) * 2005-01-11 2008-06-12 三菱電機株式会社 Semiconductor manufacturing equipment
JP2006216775A (en) * 2005-02-03 2006-08-17 Shin Etsu Polymer Co Ltd Fixing jig and its usage
JP4587828B2 (en) * 2005-02-03 2010-11-24 信越ポリマー株式会社 Fixing jig for precision substrates
JP4693488B2 (en) * 2005-05-11 2011-06-01 信越ポリマー株式会社 Fixed Carrier
JP2006319012A (en) * 2005-05-11 2006-11-24 Shin Etsu Polymer Co Ltd Stationary carrier and manufacturing method thereof
US9891539B2 (en) 2005-05-12 2018-02-13 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
JP2013042157A (en) * 2006-05-15 2013-02-28 Asml Netherlands Bv Lithographic device and device manufacturing method
JP2007329008A (en) * 2006-06-07 2007-12-20 Tokyo Electron Ltd Hot plate and its manufacturing method
US8580078B2 (en) 2007-01-26 2013-11-12 Lam Research Corporation Bevel etcher with vacuum chuck
JP2010517295A (en) * 2007-01-26 2010-05-20 ラム リサーチ コーポレーションLam Research Corporation Bevel etcher with vacuum chuck
US8721908B2 (en) 2007-01-26 2014-05-13 Lam Research Corporation Bevel etcher with vacuum chuck
US10101666B2 (en) 2007-10-12 2018-10-16 Nikon Corporation Illumination optical apparatus, exposure apparatus, and device manufacturing method
US9341954B2 (en) 2007-10-24 2016-05-17 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9857599B2 (en) 2007-10-24 2018-01-02 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9678332B2 (en) 2007-11-06 2017-06-13 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
JP2010029929A (en) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd Laser beam machining apparatus and laser beam machining method
US9278433B2 (en) 2009-04-22 2016-03-08 Ev Group Gmbh Receiving device for receiving semiconductor substrates
JP2014093384A (en) * 2012-11-02 2014-05-19 Disco Abrasive Syst Ltd Chuck table

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