JP2006032488A - Electronic component holder and its using method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component holder that can be simplified in configuration and manufacturing method, does not break an electronic component by easily bending the component, and can prevent the increase of the cost and the occurrence of a large amount of wastes; and to provide a method of using the holder. <P>SOLUTION: The electronic component holder is provided with an ultraviolet-ray transmissive supporting board 1 having flat surfaces on both sides, an ultraviolet-ray transmissive elastic holding layer 2 thinly formed on the supporting board 1 in a laminated state, and the silicon wafer 10 of the electronic component that is adhesively held to the elastic holding layer 2 removably. To the backside (surface to be held) of the silicon wafer 10 adhesively held by the holding layer 2, an adhesive sheet 11 which is lowered in adhesiveness when the sheet 11 is irradiated with ultraviolet rays is stuck. Since it is not required to maintain vacuum suction during working the silicon wafer 10, the constitution and manufacturing method of this electronic component holder can be simplified. Even when holding the silicon wafer 10, in addition, the shapes of the flat surfaces of the elastic holding layer 2 can be held, because the rigid supporting plate 1 supports the holding layer 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component holder used when fixing or conveying an electronic component composed of a silicon wafer, a ceramic green sheet, glass, a printed circuit board, and the like, and a method of using the same.

Electronic components represented by silicon wafers, ceramic green sheets, glass, printed boards, etc. are thin and easy to break, may not be able to maintain flatness by themselves, and are difficult to handle by themselves. . Therefore, processing such as polishing, patterning, dicing, printing, and component mounting is performed while being held by the electronic component holder, or is transferred between processes.
The electronic component holder used for such work is required to firmly fix the electronic component at the time of processing or transportation, and then be easily removable.

As a conventional electronic component holder, although not shown, (1) a type in which electronic components are mounted on a plurality of protruding supports and vacuum-adsorbed (see Patent Document 1), (2) photocured on a PET film or the like There is a type in which a sticky adhesive layer is laminated and the adhesive layer is cured at the time of removing an electronic component to lose its adhesiveness (see Patent Document 2).
JP 2000-286329 A JP 2003-113355 A

  The conventional electronic component holder is configured as described above. However, in the case of (1), it is necessary to maintain vacuum suction when processing the electronic component, which complicates the configuration and the manufacturing method. There is a big problem.

In the case of (2), for example, when holding a silicon wafer or the like polished to a thickness of 0.5 mm or less as an electronic component, the PET layer or the like supports the adhesive layer, so that the planar shape can be maintained. There is a problem that it is difficult to bend easily and has a high risk of damaging an electronic component such as a silicon wafer.
In order to avoid this, it is sufficient to use a rigid plate material instead of PET film, etc. However, in that case, it cannot be reused after the adhesive layer loses its adhesiveness. It will cause the generation of things.

  The present invention has been made in view of the above, and can simplify the configuration and the manufacturing method. There is no risk that the electronic component is easily bent and damaged, and the cost is increased and a large amount of waste is generated. It is an object of the present invention to provide an electronic component holder that can prevent the above and a method of using the same.

In order to solve the above-mentioned problems, the present invention comprises an ultraviolet-transmissive support, an ultraviolet-transmissive elastic holding layer provided on the support, and an electronic component held on the elastic holding layer. It is characterized by.
Note that an adhesive layer whose adhesiveness is reduced by irradiation with ultraviolet rays can be provided on the surface to be held held by the elastic holding layer of the electronic component.
Further, the electronic component can be a semiconductor wafer to be diced or a die formed by dicing the semiconductor wafer.

Moreover, in order to solve the said subject in this invention, when using the electronic component holder in any one of Claim 1, 2, or 3, Comprising: When making an electronic component holder hold an electronic component , At least the electronic component is brought into contact with the elastic holding layer of the electronic component holder through the adhesive layer,
When removing an electronic component from the electronic component holder, the adhesive layer is irradiated with ultraviolet rays to reduce the adhesiveness of the adhesive layer.

  Here, as the support in the claims, a rigid material that transmits ultraviolet rays is selected, and is formed into a rectangle, a square, a polygon, a circle, an ellipse, or the like according to the shape of the electronic component. For the elastic holding layer, a material that transmits ultraviolet rays is selected, and a single or plural elastic holding layer is provided on one or both sides of the support, all or a part thereof. This elastic holding layer is formed into a rectangle, square, polygon, circle, ellipse, etc. according to the shape of the electronic component, excludes gas between the electronic component and restricts re-entry of the gas to Hold the parts.

  Electronic components include at least one or more semiconductor wafers (silicon wafers), dies (also referred to as chips or pellets), ceramic green sheets, glass, rigid substrates, flexible substrates, printed boards, substrates processed from these, chip components, etc. Is included. The shape of the electronic component is not particularly questioned.

  According to the present invention, the configuration and the manufacturing method can be simplified, and there is an effect that the electronic component is not easily bent and damaged. Further, it is possible to effectively suppress and prevent the increase in cost and the generation of a large amount of waste.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, the electronic component holder according to the present embodiment is ultraviolet transmissive with front and back surfaces formed flat. A support plate 1, an ultraviolet transmissive elastic holding layer 2 that is thinly laminated on the support plate 1, and a silicon wafer 10 that is an electronic component that is detachably held on the elastic holding layer 2. The pressure-sensitive adhesive sheet 11 whose adhesiveness is lowered by irradiation of ultraviolet rays is adhered to the back surface (held surface) of the silicon wafer 10 that is closely held by the elastic holding layer 2.

  The ultraviolet transmittance of the support plate 1 and the elastic holding layer 2 is preferably a light transmittance of 10% or more at a wavelength of 400 nm. This is because when the light transmittance at a wavelength of 400 nm is less than 10%, the amount of ultraviolet rays required to reduce the adhesiveness of the adhesive sheet 11 increases, which may increase the cost. Further, the absorption of ultraviolet rays generates heat in the electronic component holder, which may adversely affect durability.

  As shown in FIGS. 1 and 2, the support plate 1 is made of soda-lime glass, white plate glass, quartz glass, or the like that transmits ultraviolet rays, acrylic resin, polycarbonate resin, polyolefin resin, epoxy resin, or the like. It is formed into a plane rectangle using a transparent resin material. Among these, the use of glass is optimal from the viewpoints of flatness, ultraviolet transmittance, and cost. The support plate 1 is set to a thickness of 0.3 mm or more from the viewpoint of ensuring rigidity, and is set to a thickness of 5 mm or less in order to avoid becoming unnecessarily heavy.

  As shown in the figure, the elastic holding layer 2 has a rubber hardness of 5 to 60 Hs (JIS A) by using a predetermined elastomer having elasticity, the front and back surfaces being flat, and the support plate 1. It is formed by laminating on the surface. Examples of the material of the elastic holding layer 2 include silicone rubber, fluorine rubber, urethane elastomer, natural rubber, cyclopentadiene rubber, and ionomer.

  However, in order to maintain the transparency of ultraviolet rays, it is preferable to keep the addition of reinforcing fillers usually used to a minimum. In this regard, if it is a silica-based filler, addition of 5 parts by volume or less can be stopped with respect to 100 parts by volume of the resin material. On the other hand, the addition of a carbon-based filler is not preferable. Among the above materials, when heat resistance is required, silicone rubber or fluorine rubber is preferably used.

  The reason why the rubber hardness of the elastic holding layer 2 is in the range of 5 to 60 Hs (JIS A) is that when it is less than 5 Hs, the mechanical strength is insufficient and the durability is deteriorated. On the other hand, if it exceeds 60 Hs, the adhesion is reduced and the silicon wafer 10 cannot be sufficiently held.

  The elastic holding layer 2 is formed to a thickness of about 0.01 to 1 mm, and the flat surface is a close-contact holding surface 3 that holds and holds the adhesive sheet 11 attached to the back surface of the silicon wafer 10. The center line average roughness (JIS B601) of the adhesion holding surface 3 is set to about 3.2 μm or less. The thickness of the elastic holding layer 2 is in the range of 0.01 to 1 mm. When the elastic holding layer 2 is less than 0.01 mm, the amount of variation in the thickness direction is reduced, and the function of closely following and holding the silicon wafer 10 is lowered. It is because there is a possibility of doing. Conversely, if it exceeds 1 mm, it may be difficult to maintain the planarity of the silicon wafer 10.

  The reason why the centerline average roughness of the close contact holding surface 3 is about 3.2 μm or less is that when this value is exceeded, the close contact force becomes weak and sufficient holding force may not be obtained.

  The silicon wafer 10 is formed into a disk having a size of 8 inches or 12 inches, for example, and transported from the wafer manufacturer to the IC manufacturer. After the circuit formation or back grinding, the silicon wafer 10 is mounted and held on the surface of the electronic component holder. Dicing in state. By dicing the silicon wafer 10, a plurality of dies are divided and formed, and bonding and sealing are performed on each die.

  In the above configuration, when producing an electronic component holder, the elastomer material is screen printed, metal mask printed, dipping, doctor blade coating, knife coating, bar coating, spin coating, roll coating, dispensing, etc. What is necessary is just to manufacture by apply | coating to the whole surface or one part of the support plate 1, and making it harden | cure after that. Further, it may be formed on the support plate 1 in a mold by a method such as compression or injection, or a sheet body is formed by calendaring, extrusion, pressing or the like, and this sheet body is adhered to the support plate 1. May be manufactured.

  Next, when the silicon wafer 10 is held using the manufactured electronic component holder, an adhesive sheet 11 whose adhesiveness is reduced by ultraviolet irradiation is adhered to the back surface of the silicon wafer 10 in advance (see FIG. 3). If the pressure-sensitive adhesive sheet 11 is placed on the adhesion holding surface 3 of the elastic holding layer 2 or placed and pressed lightly, the silicon wafer 10 can be held in close contact with the elastic holding layer 2 (see FIG. 1). When the silicon wafer 10 is held in close contact with the elastic holding layer 2 in this way, thereafter, various processes such as printing, coating, dicing, polishing, component mounting, and lamination, conveyance, and the like are performed.

  When mounting the processed electronic component on another substrate or the like at the end of processing, the elastic holding layer 2 or the adhesive sheet 11 is irradiated with ultraviolet rays (see the arrow in FIG. 1) from the back surface side of the support plate 1 for adhesion. If the adhesiveness of the sheet 11 is lowered, the silicon wafer 10 can be easily removed.

  In the case of dicing, if the insertion of the blade is stopped at a depth that does not completely cut the adhesive sheet 11, the adhesive sheet 11 that has become unnecessary after the silicon wafer 10 divided into a plurality of dies is removed. It is possible to peel and remove all at once, and the electronic component holder can be used repeatedly.

  According to the above configuration, since it is not necessary to maintain vacuum suction at the time of processing the silicon wafer 10, the configuration and manufacturing method of the electronic component holder can be remarkably simplified. Even when the silicon wafer 10 is held as an electronic component, the elastic holding layer 2 is mounted and supported by the rigid support plate 1, so that the planar shape can be reliably held. Therefore, the risk of damage to electronic components such as the silicon wafer 10 due to bending can be greatly reduced. Furthermore, since the electronic component holder can be reused, the running cost is not increased and a large amount of waste is not generated. In particular, an electronic component holder using soda lime glass and fluorine rubber has an excellent effect.

  In addition, a conductive polymer or an ion conductivity-imparting agent may be added to or applied to the elastic retaining layer 2 of the above-described embodiment within a range not losing ultraviolet transparency for the purpose of preventing charging. Moreover, the electronic component holder can be formed with holes, marks, and the like for alignment with the work table as required.

Embodiments of an electronic component holder and a method for using the same according to the present invention will be described below.
First, an elastomeric material having a thickness of 0.1 mm is applied to the entire surface of a support plate made of soda lime glass by a roll coater, heated at 150 ° C. for 1 hour, and further heated and cured at 200 ° C. for 4 hours, and an elastic holding layer. To obtain an electronic component holder integrally provided.

  The size of the support plate was 2.5 mm thick, 320 mm long × 320 mm wide, and the elastomer material was a fluorine-based rubber (trade name: SIFEL 660) manufactured by Shin-Etsu Chemical. When the light transmittance of the electronic component holder was measured with a spectrophotometer, it showed a transmittance of 42% at a wavelength of 400 nm.

  Next, a UV curable dicing tape (trade name: D-series) made by Lintec having a thickness of 125 μm was attached to the back surface of a silicon wafer having a thickness of 0.5 mm and φ300 mm. When this silicon wafer was placed on the center of the electronic component holder on the elastic holding layer side with the dicing tape facing the silicon wafer, the silicon wafer was held in close contact with its own weight. Was able to hold.

  Next, the silicon wafer is cut into a 5 mm square die using a dicer, and the silicon wafer is irradiated with ultraviolet rays from the back side of the electronic component holder using a UV irradiation machine (trade name: NEL UA300-II) manufactured by Nitto Denko. did. Then, the silicon wafer separated into a plurality of dies could be easily removed by suction tweezers.

At this time, the silicon wafer was removed, and the dicing tape that was no longer needed could be peeled and removed all at once.
The above operation was repeated 100 times, but there was no problem in holding or removing the silicon wafer.

It is a section explanatory view showing an embodiment of an electronic parts holder concerning the present invention, and a method for using the same. It is explanatory drawing which shows the electronic component holder in embodiment of the electronic component holder which concerns on this invention. It is explanatory drawing which shows the silicon wafer in embodiment of the electronic component holder which concerns on this invention.

Explanation of symbols

1 Support plate (support)
2 Elastic holding layer 3 Adhesion holding surface 10 Silicon wafer (electronic component)
11 Adhesive sheet (adhesive layer)

Claims (4)

  An electronic component holder comprising: an ultraviolet transmissive support; an ultraviolet transmissive elastic holding layer provided on the support; and an electronic component held on the elastic holding layer.   The electronic component holder according to claim 1, wherein an adhesive layer whose adhesiveness is lowered by irradiation of ultraviolet rays is provided on a surface to be held held by the elastic holding layer of the electronic component.   The electronic component holder according to claim 1 or 2, wherein the electronic component is a semiconductor wafer to be diced or a die formed by dicing the semiconductor wafer. 4. The method of using an electronic component holder according to claim 1, wherein when the electronic component holder is held by an electronic component holder, at least the electronic component is provided on an elastic holding layer of the electronic component holder. Through the adhesive layer,
A method of using an electronic component holder, wherein when the electronic component is removed from the electronic component holder, the adhesive layer is irradiated with ultraviolet rays to reduce the adhesiveness of the adhesive layer.

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