JP5822768B2 - Semiconductor wafer jig peeling apparatus and semiconductor wafer jig peeling method - Google Patents

Description

  The present invention relates to a semiconductor wafer jig peeling apparatus and a semiconductor wafer jig peeling method used in a semiconductor manufacturing process.

  In order to adapt a conventional semiconductor wafer to a thin semiconductor package (not shown) in the back grinding process, the back surface is back grinded and supported on the adhesive tape of the carrier jig in the dicing process, and then the individual semiconductor chips are formed with a dicing blade. By separating, a large number of semiconductor chips are formed (see Patent Documents 1, 2, 3, and 4). In the semiconductor wafer back grinding process, the semiconductor wafer is thinly cut to a thickness of 100 μm or less, sometimes 30 to 50 μm by a rotating grindstone. However, this makes the semiconductor wafer very thin and brittle, which hinders handling and conveyance. There is a risk of coming.

  In view of this, in the past, (1) when a semiconductor wafer is back-ground, the inner region is back-ground while leaving the peripheral edge of the semiconductor wafer, and the remaining peripheral edge ensures the rigidity of the semiconductor wafer and bends. (2) A method is proposed in which a rigidity securing ring is positioned and fixed to the periphery of the semiconductor wafer by an adhesive, and the rigidity securing ring is used to impart rigidity to the semiconductor wafer to suppress and prevent bending. (See Patent Document 5).

JP 2009-260219 A JP 2009-164476 A JP 2005-191039 A Japanese Patent No. 4239974 JP 2011-159864 A

  However, when the method (1) is adopted, the strength of the semiconductor wafer can be improved and the warpage can be reduced. There will be a new problem that equipment and costs cannot be reduced.

  On the other hand, the method (2) is very convenient because the problem (1) can be solved. However, when positioning the rigidity securing ring on the periphery of the semiconductor wafer, the positioning is performed gradually while shifting the rigidity securing ring forward, backward, left and right, but if an adhesive is used to fix the rigidity securing ring, Therefore, it is difficult to align the position while making fine adjustments. In addition, when it is desired to remove the rigidity securing ring from the peripheral edge of the semiconductor wafer and reuse it, it cannot be easily and safely removed, and an inconvenient situation is expected.

  The present invention has been made in view of the above, and can improve the rigidity of a semiconductor wafer, reduce manufacturing equipment and costs, and position a semiconductor wafer jig while finely adjusting the semiconductor wafer jig to the peripheral edge of the semiconductor wafer. It is an object of the present invention to provide a semiconductor wafer jig peeling device and a semiconductor wafer jig peeling method that can be easily and safely removed from the peripheral edge of a semiconductor wafer.

In order to solve the above-mentioned problems in the present invention, an apparatus comprising a semiconductor wafer jig that is detachably attached to a thin semiconductor wafer and improves the strength, and a peeling device that removes the semiconductor wafer jig from the semiconductor wafer. Because
The semiconductor wafer jig includes an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral surface of the one surface of the semiconductor wafer. Including, adhering the adhesive layer to the majority of the opposing surface in the base material layer, the remainder of the opposing surface as a peeling trigger part without the adhesive layer,
The peeling device covers a flexible plate held down on a table for mounting and fixing a semiconductor wafer, an exposed one side of the semiconductor wafer mounted on the table, and a semiconductor wafer jig, and covering the flexible plate. A covering slide mechanism that slides the plate in the width direction of the semiconductor wafer, a peeling claw that engages with a notch formed on the peripheral edge of the semiconductor wafer by sliding the flexible plate of the coating slide mechanism, and the peeling claw After that, the non-holding part of the flexible plate of the covering slide mechanism is pushed up and the semiconductor wafer jig is peeled off from the peripheral edge of one side of the semiconductor wafer, and when the peeling mechanism is pushed up from the position opposite the notch of the semiconductor wafer. And an urging mechanism for urging the flexible plate in the direction of the semiconductor wafer while moving in the direction of the coating slide mechanism. .

In addition, a peeling opportunity part can be dividedly formed between the opposing surface remaining part of a base material layer, and the edge part of an adhesion layer.
Also, the adhesive layer can be formed in a substantially plane C shape, and both end portions of this adhesive layer can be opposed to each other through the remaining portion of the opposing surface.

Moreover, it is possible to divide the adhesive layer into a plurality of parts and make both end portions of the plurality of adhesive layers face each other through the remaining part of the opposing surface.
Moreover, it is possible to make the average surface roughness Ra of the pressure-sensitive adhesive surface, which is made of silicone rubber or fluorine rubber and adheres to the peripheral edge of one surface of the semiconductor wafer, in the range of 0.5 to 5 μm.

  Also, the covering slide mechanism and the peeling mechanism are opposed to each other across the table of the peeling device, and an urging mechanism is provided above the table so as to be movable up and down, and the peeling claw is supported on the facing surface of the flexible plate facing the semiconductor wafer. Thus, it is possible to face the notch of the semiconductor wafer from the peeling mechanism side, and the urging mechanism can be provided with a rotatable roller that contacts the flexible plate of the covering slide mechanism when the peeling mechanism is pushed up.

Further, in the present invention, in order to solve the above-mentioned problem, a semiconductor wafer jig peeling method for removing a semiconductor wafer jig which is detachably attached to a thin semiconductor wafer and improves strength by a peeling device,
A jig for a semiconductor wafer is composed of an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral edge of the one surface of the semiconductor wafer. Forming,
The peeling apparatus is a peeling apparatus for a semiconductor wafer jig according to claim 1 or 2 .

  The semiconductor wafer jig can be removed from the semiconductor wafer while being heated to a temperature of 50 ° C. to 150 ° C.

  Here, the semiconductor wafer in the claims is not particularly limited to the φ150, 200, 300, and 450 mm types. One side of the semiconductor wafer may be the front surface or the back surface of the semiconductor wafer. The base material layer and the adhesive layer may have the same thickness or width, or may have different thicknesses and widths. The base material layer and the adhesive layer may be formed integrally or separately.

  The base material layer is mainly formed in a ring shape, but when a flat orientation flat is formed on the peripheral edge of the semiconductor wafer, the base material layer is formed in a shape along the peripheral edge of the semiconductor wafer. This base material layer does not specifically ask the presence or absence of transparency, opaqueness, translucency, coloring, and flexibility. The adhesive layer does not ask for a plurality.

  According to the present invention, when the semiconductor wafer jig adhered to the semiconductor wafer is peeled, first, the semiconductor wafer is mounted on the table of the peeling apparatus, and one surface thereof and the adhered semiconductor wafer jig are exposed. The semiconductor wafer is fixed on the table with the notch of the semiconductor wafer directed toward the peeling mechanism.

  Next, the flexible plate of the covering slide mechanism descends and overlaps the semiconductor wafer jig adhered to the semiconductor wafer, and the flexible plate covers one side of the semiconductor wafer and the semiconductor wafer jig to form a notch on the semiconductor wafer. The peeling claw is made to oppose, the flexible plate slides to cause the peeling claw to interfere with the notch of the semiconductor wafer, the biasing mechanism approaches the flexible plate and contacts the exposed surface, and faces the notch of the semiconductor wafer. To do.

  Next, the peeling mechanism pushes up the non-holding portion of the flexible plate, and the peeling claw comes into contact with the semiconductor wafer jig to gradually peel off the adhesive semiconductor wafer jig. In addition, the biasing mechanism moves in the direction of the covering slide mechanism from the position opposite to the vicinity of the notch of the semiconductor wafer, and biases the flexible plate in the direction of the semiconductor wafer. This urging while moving suppresses the propagation and dispersion of the push-up force, and most of the semiconductor wafer jig is gradually peeled from the semiconductor wafer.

  Then, after the urging mechanism moves to and stops at the holding portion of the flexible plate and stops and the urging mechanism returns to the original position, the flexible plate of the covering slide mechanism returns to the original position and adheres. The semiconductor wafer jig is peeled from the semiconductor wafer by peeling off the remaining part of the semiconductor wafer jig in the state.

According to the present invention, there is an effect that the rigidity of a semiconductor wafer can be improved and manufacturing equipment and cost can be reduced. Further, the semiconductor wafer jig can be positioned while being finely adjusted to the peripheral edge of the semiconductor wafer, or can be easily and safely removed from the peripheral edge of the semiconductor wafer. Further, since the fingertip or the like can be lifted by interfering with the peeling trigger part, the semiconductor wafer jig in a close contact state can be easily and safely removed from the peripheral part of the semiconductor wafer.

According to the second aspect of the present invention, for example, when the covering slide mechanism and the peeling mechanism are opposed to each other at an interval of 180 ° and the end portion of the flexible plate is used as the holding portion, the flexible plate is removed from the tip portion. It can be gradually peeled toward the end. Further, since the roller contacts the flexible plate of the covering slide mechanism so as to be rotatable from above, damage to the flexible plate and the semiconductor wafer accompanying the contact with the biasing mechanism can be expected.

Further, according to the invention described in claim 4, since the adhesive force of the adhesive layer is reduced due to the temperature rise, the force required for removing the semiconductor wafer jig can be reduced to about 2/3 to 1/4. become.

1 is an overall explanatory view schematically showing an embodiment of a semiconductor wafer jig peeling device and a semiconductor wafer jig peeling method according to the present invention. It is explanatory drawing which shows typically the semiconductor wafer and the jig | tool for semiconductor wafers in embodiment of the peeling apparatus of the jig | tool for semiconductor wafers concerning this invention. It is a perspective explanatory view showing typically the state where the semiconductor wafer jig is adhered to the semiconductor wafer in the embodiment of the semiconductor wafer jig peeling apparatus according to the present invention. It is back surface explanatory drawing which shows typically the semiconductor wafer jig | tool in embodiment of the peeling apparatus of the semiconductor wafer jig | tool which concerns on this invention. It is a whole explanatory view showing typically the state where a semiconductor wafer is fixed to a chuck table in an embodiment of a peeling device for a semiconductor wafer jig concerning the present invention. FIG. 6 is an overall explanatory view schematically showing a state in which the back surface of the semiconductor wafer and the semiconductor wafer jig in FIG. 5 are covered with a flexible plate. FIG. 7 is an overall explanatory view schematically showing a state in which a peeling claw is fitted and locked to a notch of the semiconductor wafer of FIG. 6. FIG. 8 is an overall explanatory view schematically showing a state where the urging mechanism of FIG. 7 is lowered and the roller is pressed against the flexible plate. FIG. 9 is an overall explanatory view schematically showing a state in which the tip of the flexible plate is pushed up by the peeling mechanism of FIG. 8 and the semiconductor wafer jig adhered to the semiconductor wafer is gradually peeled off. FIG. 10 is an overall explanatory view schematically showing a state in which the roller of FIG. 9 moves and elastically biases while sliding the flexible plate in the direction of the semiconductor wafer. It is a whole explanatory drawing which shows typically the state where the mechanism main part of the energizing mechanism of Drawing 10 moved near the end part of a flexible board. FIG. 12 is an overall explanatory view schematically showing a state where the semiconductor wafer jig is completely peeled from the semiconductor wafer of FIG. 11. It is back surface explanatory drawing which shows typically the semiconductor wafer jig | tool in 2nd Embodiment of the peeling apparatus of the jig | tool for semiconductor wafers concerning this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. A semiconductor wafer jig peeling apparatus according to the present embodiment is applied to a thin semiconductor wafer 1 having flexibility as shown in FIGS. A semiconductor wafer jig 10 that is detachably adhered to improve the strength and a peeling device 20 that automatically removes the semiconductor wafer jig 10 from the semiconductor wafer 1 are provided. The jig 10 is easily and safely peeled off.

  As shown in FIGS. 1 to 4, the semiconductor wafer 1 is made of, for example, a planar circular silicon wafer having a diameter of 200 mm, a circuit pattern is formed on the surface, and the back surface is back-ground by a general-purpose back-grinding device (not shown). Thus, the thickness is reduced to 100 μm or less. In this semiconductor wafer 1, a circuit pattern is formed on the back-ground back surface as needed, and a substantially V-shaped notch 2 that makes it easy to determine and align the crystal direction is cut out at the peripheral edge.

  As shown in FIGS. 1 to 4, the semiconductor wafer jig 10 includes an endless base material layer 11 facing the back surface of the semiconductor wafer 1, and a back surface peripheral portion of the semiconductor wafer 1 laminated on the base material layer 11. And an adhesive layer 13 that adheres in a peelable manner in a two-layer structure. For example, the base material layer 11 and the adhesive layer 13 of the semiconductor wafer jig 10 are formed to have the same width, but for convenience of manufacturing and work, etc. The width of the base material layer 11 is slightly wider than the width of the adhesive layer 13.

  As shown in FIGS. 2 to 4, the base material layer 11 is formed in a thin planar ring shape with a predetermined material, and a plurality of fixing holes 12 for positioning and fixing the semiconductor wafer 1 at the time of processing are arranged at predetermined intervals in the circumferential direction. It is perforated and faces the peripheral edge of the back surface of the semiconductor wafer 1. The material of the base material layer 11 is not particularly limited. For example, silicon, glass epoxy resin, glass cloth composite material, carbon fiber reinforced plastic, liquid crystal polymer, polyether ether ketone, polyether imide, polyimide, Examples include metals (aluminum, SUS, tungsten, iron-nickel alloys (42 alloy, etc.)), other alloys, and the like. Among these, it is optimal to use a glass epoxy resin that is excellent in mechanical properties, hygroscopicity, strength, thermal conductivity, heat resistant temperature, and electrical properties.

  The base material layer 11 is formed to have the same diameter as the semiconductor wafer 1 or a slightly larger diameter. When the base layer 11 has the same diameter as the semiconductor wafer 1, the outer peripheral edge is aligned with the peripheral edge of the semiconductor wafer 1, and when the diameter is slightly larger than the semiconductor wafer 1, the outer peripheral edge Are close to each other along the peripheral edge within 3 mm from the peripheral edge of the semiconductor wafer 1. When the base material layer 11 is formed to have a diameter slightly larger than that of the semiconductor wafer 1, a positioning jig or the like of a handling device (not shown) directly contacts the edge of the thin semiconductor wafer 1 to cause chipping or cracks. It can be effectively suppressed.

  As shown in FIGS. 2 to 4, the adhesive layer 13 is formed in a thin planar ring shape having a thickness of 200 μm or less (for example, about 100 μm) with a predetermined material excellent in weak adhesiveness and the like. It is laminated and adhered to the flat opposed surface of the base material layer 11 facing the portion, and is detachably adhered to the peripheral edge of the back surface of the semiconductor wafer 1. The material of the pressure-sensitive adhesive layer 13 is not particularly limited, and examples thereof include silicone rubber and fluororubber, which have a peel strength that decreases at about 50 to 150 ° C., particularly about 60 ° C., and has excellent heat resistance. can give. Necessary predetermined fillers are added to these materials.

  When the adhesive layer 13 is molded by a molding method using a mold, the adhesive surface 14 that adheres to the peripheral edge of the back surface of the semiconductor wafer 1 of the adhesive layer 13 is a transfer method using a mold cavity or a filler made of silica as a molding material. It is formed coarsely by a method such as adding. The average surface roughness (arithmetic surface roughness) Ra of the adhesive surface 14 is in the range of 0.5 to 5 μm by measurement with a dedicated surface roughness measuring machine, a laser microscope, or a three-dimensional scanning electron microscope. It is preferable.

  This is because when the average surface roughness Ra of the adhesive surface 14 is less than 0.5 μm, the semiconductor wafer jig 10 is positioned when the semiconductor wafer jig 10 is overlaid and positioned on the peripheral edge of the back surface of the semiconductor wafer 1. This is because even if they are lightly stacked, they adhere to each other and seriously hinder the operation of sliding the semiconductor wafer jig 10 back and forth and left and right. Moreover, when Ra exceeds 5 μm, the semiconductor wafer jig 10 does not adhere to the peripheral edge of the back surface of the semiconductor wafer 1.

  As shown in FIGS. 1, 5 to 12, the peeling device 20 is formed of a flexible plate on the chuck table 21 for the semiconductor wafer 1, the back surface that is the exposed one side of the semiconductor wafer 1, and the semiconductor wafer jig 10. A covering slide mechanism 26 that sets and slides 30, a peeling claw 33 that fits and locks with the notch 2 of the semiconductor wafer 1 as the flexible plate 30 of the covering slide mechanism 26 slides, and a relation between the peeling claw 33 A peeling mechanism 34 that pushes up the flexible plate 30 after the stop to peel the semiconductor wafer jig 10 from the semiconductor wafer 1 and a biasing mechanism that biases the flexible plate 30 while moving downward when the peeling mechanism 34 is pushed up. 36.

  In the peeling device 20, the covering slide mechanism 26 and the peeling mechanism 34 face each other with an interval of 180 ° across the chuck table 21, and the biasing mechanism 36 moves up and down above the chuck table 21 from the viewpoint of space efficiency. Installed as possible. The chuck table 21 includes, for example, a table main body 22 having a substantially groove-shaped cross section, and a porous ceramic sintered body 23 having air permeability is fitted into the table main body 22 to expose its flat surface. The lower part or the side part of the ceramic sintered body 23 is connected to the vacuum pump 24 which is a vacuum generator through the air passage 25 of the table body 22.

  Such a chuck table 21 is configured such that after the surface of the semiconductor wafer 1 is detachably mounted on the surface of the ceramic sintered body 23 and the notch 2 is directed in the direction of the peeling mechanism 34, and the vacuum pump 24 is driven, The semiconductor wafer 1 is positioned and fixed with high accuracy on the surface of the sintered body 23 using negative pressure, and the back surface of the semiconductor wafer 1 and the semiconductor wafer jig 10 are exposed.

  The covering slide mechanism 26 includes a pedestal 27 having a substantially inverted L-shaped cross section adjacent to one side of the chuck table 21 with a gap, and is moved forward and backward horizontally with respect to the chuck table 21 on the vertical surface of the pedestal 27. An air cylinder 28 is mounted horizontally, and a Z-axis actuator 29 that can be moved up and down is installed on the air cylinder 28. The Z-axis actuator 29 includes a back surface of the semiconductor wafer 1, a semiconductor wafer jig 10, and the like. The flexible plate 30 that can be bent is horizontally held.

  The Z-axis actuator 29 is not particularly limited. For example, a screw rod is erected on the air cylinder 28, and a gear inside an actuator body guided by a guide bar (not shown) is meshed with the screw rod. Or a linear motor is installed on the air cylinder 28 or the like.

  The flexible plate 30 is formed into a flat rectangular plate larger than the chuck table 21 with a predetermined material, for example, and the end portion 31 is detachably held by a pair of upper and lower holding claws protruding in the lateral direction of the Z-axis actuator 29. At the same time, the distal end portion 32 faces the peeling mechanism 34 from above or is pushed up by contact. The material of the flexible plate 30 is not particularly limited, and examples thereof include polycarbonate, acrylic resin, polyethylene, polypropylene, polyethylene terephthalate, and various elastomers.

  Such a covering slide mechanism 26 is formed by lowering and laminating the flexible plate 30 on the semiconductor wafer jig 10 of the semiconductor wafer 1 that is adsorbed and fixed to the chuck table surface when the semiconductor wafer jig 10 is peeled off. The back surface of the semiconductor wafer 1 is completely covered, and the flexible plate 30 is driven by the air cylinder 28 in the radial direction that is the width direction of the semiconductor wafer 1, specifically, from the peeling mechanism 34 side to the covering slide mechanism 26 side. Functions to slide horizontally.

  The peeling claw 33 is formed into a long and narrow plate piece of, for example, various metals and the like, and the tip end portion is tapered so as to correspond to the notch 2 concealed by the semiconductor wafer jig 10. It is supported near the tip of the facing surface facing the wafer back surface. When the flexible plate 30 covers the back surface of the semiconductor wafer 1 and the semiconductor wafer jig 10, the peeling claw 33 faces or engages with the notch 2 of the semiconductor wafer 1 from the peeling mechanism 34 side.

  The peeling mechanism 34 is composed of, for example, an electromagnetic solenoid or an air cylinder. The peeling mechanism 34 is disposed adjacent to the other side of the chuck table 21 with a gap, and a reciprocating plunger 35 is directed upward. When the flexible plate 30 covers the back surface of the semiconductor wafer 1 and the semiconductor wafer jig 10, the peeling mechanism 34 is applied from below to the distal end portion 32 of the flexible plate 30 where the plunger 35 protrudes from the chuck table 21. Touch or push up.

  The urging mechanism 36 includes, for example, a guide rail 37 that can be raised and lowered directly above the chuck table 21, and a mechanism main body 38 that moves in the lateral direction of the chuck table 21 is fitted to the guide rail 37. A rotatable roller 39 that is in contact with the flexible plate 30 of the covering slide mechanism 26 when the peeling mechanism 34 is pushed up is suspended by a vertically long bracket 40 below the mechanism body 38. In the urging mechanism 36, for example, a rack is provided on the guide rail 37, and a rotatable pinion is provided in the mechanism main body 38, and the mechanism main body 38 moves by meshing the rack and the pinion.

  The roller 39 is formed using various metals and resins, and a rubber or elastomer for buffering is selectively covered on a peripheral surface that contacts the flexible plate 30. Further, the bracket 40 is suspended below the mechanism main body 38 so as to be movable up and down via a coil spring or the like, and moves up and down according to the state of the surface that is the exposed surface of the flexible plate 30, so that the semiconductor wafer 1 and the flexible A buffering function is provided to alleviate the impact on the plate 30.

  Such an urging mechanism 36 moves in the direction of the semiconductor wafer 1 while moving horizontally in the direction of the covering slide mechanism 26 from the position facing the notch 2 side of the semiconductor wafer 1 when the peeling mechanism 34 is pushed up. The flexible plate 30 functions to be elastically biased by the roller 39.

  In the above configuration, when a predetermined treatment is performed by giving rigidity to the thin and fragile semiconductor wafer 1 having a thickness of 100 μm or less that is back-ground, first, the back surface of the thin semiconductor wafer 1 that is back-ground is used as the upper surface. The adhesive layer 13 of the semiconductor wafer jig 10 is lightly superimposed on the peripheral edge of the back surface of the semiconductor wafer 1 and aligned in the front-rear and left-right directions. At this time, since the average surface roughness Ra of the adhesive surface 14 is 0.5 μm or more, the semiconductor wafer jig 10 does not adhere only by being lightly stacked, and the semiconductor wafer jig 10 is shifted several times and properly aligned. can do.

  After the semiconductor wafer jig 10 is aligned in this manner, the stress relief, PVD, and solder bumps can be formed on the semiconductor wafer 1 with increased strength by pressing the semiconductor wafer jig 10 with a roller or the like and adhering it detachably without gaps. Etc., necessary processing can be performed. At this time, since the average surface roughness Ra of the adhesive surface 14 is 5 μm or less, the semiconductor wafer jig 10 can be reliably adhered to the peripheral edge of the back surface of the semiconductor wafer 1.

  Next, when the semiconductor wafer jig 10 adhered to the semiconductor wafer 1 is peeled off, first, the semiconductor wafer 1 is mounted on the surface of the chuck table 21 of the peeling device 20 (see FIG. 1), and the back surface and the semiconductor wafer. Each of the jigs 10 is exposed, the notch 2 of the semiconductor wafer 1 is directed toward the peeling mechanism 34, and the vacuum pump 24 is driven to position and fix the semiconductor wafer 1 on the chuck table 21 (see FIG. 5). At this time, the plunger 35 of the peeling mechanism 34 contacts and supports the tip 32 of the flexible plate 30 horizontally from below without protruding. The biasing mechanism 36 faces the vicinity of the notch 2 of the semiconductor wafer 1 above the flexible plate 30.

  Next, the flexible plate 30 held down by the Z-axis actuator 29 of the covering slide mechanism 26 is lowered, and the flexible plate 30 is stacked on the semiconductor wafer jig 10 adhered to the semiconductor wafer 1. The back surface and the semiconductor wafer jig 10 are covered with a flexible plate 30, and the peeling claw 33 is opposed to the notch 2 of the semiconductor wafer 1 with an interval (see FIG. 6). Thus, when the peeling claw 33 faces the notch 2 of the semiconductor wafer 1, the air cylinder 28 of the covering slide mechanism 26 is driven to slide the flexible plate 30 from the peeling mechanism 34 side to the covering slide mechanism 26 side substantially horizontally. The peeling claw 33 interferes with and engages with the notch 2 of the wafer 1 (see FIG. 7).

  At this time, a guide groove for the separation claw 33 is cut out in advance in the radial direction on the surface of the chuck table 21, and the separation claw 33 is guided through the guide groove to realize reliable fitting and locking. it can. When the peeling claw 33 is fitted and locked to the notch 2 of the semiconductor wafer 1, the urging mechanism 36 is lowered to bring the roller 39 into contact with the exposed surface of the flexible plate 30, and this roller 39 is in the vicinity of the notch 2 of the semiconductor wafer 1. (Refer to FIG. 8).

  Next, the peeling mechanism 34 is driven to raise the plunger 35, the tip 32 of the flexible plate 30 is pushed up and bent from below, and the peeling claw 33 is pressure-bonded to the semiconductor wafer jig 10 to adhere to the semiconductor wafer. The jig 10 is gradually peeled off (see FIG. 9). At this time, the semiconductor wafer jig 10 is not simply peeled off, but is peeled off while being heated to a temperature of 50 ° C. to 150 ° C., preferably 60 ° C. by a surrounding heater or the like. This is because if peeling is performed while heating to a temperature of 50 ° C. to 150 ° C., the force required for peeling can be reduced to about 2/3 to 1/4.

  When the peeling mechanism 34 is driven, the mechanism main body 38 of the urging mechanism 36 is guided by the guide rail 37 and moved horizontally from the opposite position to the vicinity of the notch 2 of the semiconductor wafer 1 in the direction of the covering slide mechanism 26, and is moved to the flexible plate 30. The roller 39 that is in contact moves while rotating in the same direction, and urges the flexible plate 30 while sliding in the direction of the semiconductor wafer 1 (see FIG. 10). Propagation and dispersion of the push-up force of the plunger 35 are effectively prevented by this elastic biasing force while the roller 39 moves, and most of the semiconductor wafer jig 10 is gradually peeled off from the semiconductor wafer 1.

  When the mechanism main body 38 of the urging mechanism 36 moves to the vicinity of the end portion 31 of the flexible plate 30 (see FIG. 11), the urging mechanism 36 stops and returns to the original reference position to return to the flexible plate 30. The roller 39 is spaced upward from the distal end portion 31. Thereafter, the Z-axis actuator 29 of the covering slide mechanism 26 moves up and returns to the original reference position to raise the flexible plate 30 so that the remaining portion of the semiconductor wafer jig 10 adhered to the semiconductor wafer 1 is removed. As a result, the semiconductor wafer jig 10 is completely peeled off from the semiconductor wafer 1 (see FIG. 12).

  According to the above configuration, the strength of the semiconductor wafer 1 can be increased by adhering the semiconductor wafer jig 10 along the periphery of the back-ground thin semiconductor wafer 1. Warping and bending can be effectively suppressed and prevented, and subsequent handling and transportation can be facilitated. Therefore, it is not necessary to back grind the inner region while leaving the peripheral portion of the semiconductor wafer 1, and a dedicated device can be reliably omitted, so that significant reduction in manufacturing equipment and cost can be expected.

  In addition, the semiconductor wafer jig 10 is not fixed to the periphery of the back surface of the semiconductor wafer 1 with an adhesive so as not to be peeled off. Instead, a weak adhesive layer 13 is used, so that the semiconductor wafer 1 is attached to the semiconductor wafer 1. Accurate alignment can be performed by overlapping 10 and finely adjusting the position by repeating it manually.

  In addition, since no adhesive that causes contamination is required, work is not delayed or complicated. In addition, the semiconductor wafer jig 10 can be reused without being discarded for each operation. In addition, since the semiconductor wafer jig 10 is automatically and uniformly peeled from the peripheral edge of the semiconductor wafer 1 by the peeling device 20 instead of manually, it can be easily and safely removed.

  Next, FIG. 13 shows a second embodiment of the present invention. In this case, the pressure-sensitive adhesive layer 13 is divided into a pair and laminated on most of the base material layer 11, and the remaining portion 15 other than the majority is shown. Is a pair of peeling trigger parts 16 in which the adhesive layer 13 is not present, and one of the pair of peeling trigger parts 16 is opposed to the notch 2 of the semiconductor wafer 1 from above.

  The pair of pressure-sensitive adhesive layers 13 are each curved and formed into a substantially semicircular arc shape, laminated and adhered to most of the opposing surface of the base material layer 11, and both end portions are gaps in the remaining portion 15 other than most of the opposing surface. Opposite through. Each peeling trigger part 16 is partitioned and formed as a gap between the remaining part 15 on the opposite surface and both ends of the pair of adhesive layers 13, and when the semiconductor wafer jig 10 adhered from the semiconductor wafer 1 is peeled off. It becomes a landmark and a trigger. In each peeling trigger part 16, the fixing hole 12 of the base material layer 11 is selectively positioned as a working mark. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected. Moreover, since there is no adhesive layer 13 in the peeling trigger part 16, the semiconductor in close contact from the peripheral part of the semiconductor wafer 1 due to the reduction of the adhesive area. Obviously, the wafer jig 10 can be easily and safely removed, and the possibility of delays and complications can be effectively eliminated. Further, in an emergency, the semiconductor wafer jig 10 can be easily removed by lifting the peeling trigger 16 with a fingertip or the like interfering with it.

  Although the semiconductor wafer 1 is positioned and fixed on the chuck table 21 in the above embodiment, the semiconductor wafer jig 10 may be heated to a temperature of 50 ° C. to 150 ° C. by a heater or the like immediately after the semiconductor wafer 1 is fixed. . Moreover, in the said embodiment, although the adhesion layer 13 of the jig | tool 10 for semiconductor wafers was stuck to the back surface peripheral part of the semiconductor wafer 1, the adhesive layer 13 of the jig | tool 10 for semiconductor wafers was stuck to the surface peripheral part of the semiconductor wafer 1. A circuit pattern or the like may be formed on the back surface of the semiconductor wafer 1.

  Alternatively, the adhesive layer 13 of the semiconductor wafer jig 10 may be adhered to the periphery of the back surface of the semiconductor wafer 1, and then the semiconductor wafer jig 10 may be peeled off and adhered to the surface periphery of the semiconductor wafer 1 again. Further, the adhesive layer 13 is divided into a plurality of parts (for example, divided into three parts, four parts, etc.), the plurality of adhesive layers 13 are abutted via gaps, and the gaps between the plurality of adhesive layers 13 are respectively separated from the peeling trigger part 16. It is also possible to do.

  The semiconductor wafer jig peeling apparatus and the semiconductor wafer jig peeling method according to the present invention can be used in the field of semiconductor manufacturing and the like.

DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Notch 10 Semiconductor wafer jig | tool 11 Base material layer 13 Adhesive layer 15 Remaining part 16 Peeling trigger part 20 Peeling apparatus 21 Chuck table (table)
24 Vacuum pump 26 Covering slide mechanism 28 Air cylinder 29 Z-axis actuator 30 Flexible plate 31 End portion 32 End portion 33 Peeling claw 34 Peeling mechanism 35 Plunger 36 Energizing mechanism 37 Guide rail 38 Mechanism body 39 Roller 40 Bracket

Claims (4)

A semiconductor wafer jig peeling device comprising a semiconductor wafer jig that is detachably attached to a thin semiconductor wafer to improve strength, and a peeling device that removes the semiconductor wafer jig from the semiconductor wafer,
The semiconductor wafer jig includes an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral surface of the one surface of the semiconductor wafer. Including, adhering the adhesive layer to the majority of the opposing surface in the base material layer, the remainder of the opposing surface as a peeling trigger part without the adhesive layer,
The peeling device covers a flexible plate held down on a table for mounting and fixing a semiconductor wafer, an exposed one side of the semiconductor wafer mounted on the table, and a semiconductor wafer jig, and covering the flexible plate. A covering slide mechanism that slides the plate in the width direction of the semiconductor wafer, a peeling claw that engages with a notch formed on the peripheral edge of the semiconductor wafer by sliding the flexible plate of the coating slide mechanism, and the peeling claw After that, the non-holding part of the flexible plate of the covering slide mechanism is pushed up and the semiconductor wafer jig is peeled off from the peripheral edge of one side of the semiconductor wafer, and when the peeling mechanism is pushed up from the position opposite the notch of the semiconductor wafer. And a biasing mechanism that biases the flexible plate in the direction of the semiconductor wafer while moving in the direction of the covering slide mechanism. For body wafer jig peeling device. The covering slide mechanism and the peeling mechanism are opposed to each other across the table of the peeling device, and an urging mechanism is provided above the table so as to be movable up and down, and the peeling claw is supported on the facing surface of the flexible plate facing the semiconductor wafer. 2. The semiconductor wafer jig according to claim 1 , wherein the peeling mechanism side can be opposed to the notch of the semiconductor wafer, and the biasing mechanism is provided with a rotatable roller that contacts the flexible plate of the covering slide mechanism when the peeling mechanism is pushed up. Tool peeling device. A semiconductor wafer jig peeling method in which a semiconductor wafer jig that is detachably attached to a thin semiconductor wafer and improves strength is removed by a peeling device,
A jig for a semiconductor wafer is composed of an endless base material layer facing the peripheral edge of one surface of the semiconductor wafer, and an adhesive layer that is provided on the opposing surface of the base material layer and adheres detachably to the peripheral edge of the one surface of the semiconductor wafer. Forming,
3. A semiconductor wafer jig peeling method, wherein the peeling apparatus is the semiconductor wafer jig peeling apparatus according to claim 1 or 2 . The method for peeling a semiconductor wafer jig according to claim 3 , wherein the semiconductor wafer jig is removed from the semiconductor wafer while being heated to a temperature of 50C to 150C.

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