JP2016167546A - Method of forming protective member - Google Patents

Method of forming protective member Download PDF

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JP2016167546A
JP2016167546A JP2015047049A JP2015047049A JP2016167546A JP 2016167546 A JP2016167546 A JP 2016167546A JP 2015047049 A JP2015047049 A JP 2015047049A JP 2015047049 A JP2015047049 A JP 2015047049A JP 2016167546 A JP2016167546 A JP 2016167546A
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wafer
liquid resin
stage
resin
center
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JP6475519B2 (en
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徹雄 久保
Tetsuo Kubo
徹雄 久保
寛 小野寺
Hiroshi Onodera
寛 小野寺
桑名　一孝
Kazutaka Kuwana
一孝 桑名
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to DE102016203663.7A priority patent/DE102016203663A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent air bubbles from entering a liquid resin for protecting one entire surface of a wafer.SOLUTION: A method of forming a protective member includes: a resin supply process of supplying a predetermined amount of a liquid resin 4 to an upper surface 1a of a stage 1; a resin sticking process of sticking a liquid resin 6 in an amount enough to stick to the center of a lower surface Wb of a wafer W held on a holding surface 12 of a holding part 10 facing the stage 1; an expanding process of aligning the center of the stage 1 with the center of the wafer W held on the holding surface 12 of the holding part 10, putting the stage 1 and holding part 10 closer to each other, and pressing the liquid resin 40 to expand the liquid resin 40 with pressure over the entire lower surface Wb of the wafer W; and a curing process of curing the expanded liquid resin 40. By executing these processes, a protective member 41 which protects the entire lower surface Wb of the wafer can be formed by expanding a liquid resin 40 so that air bubbles do not enter the liquid resin 40, so that the wafer W can be finished flatly by grinding the wafer W subsequently.SELECTED DRAWING: Figure 4

Description

本発明は、板状ワークの一方の面の全面に樹脂からなる保護部材を形成する方法に関する。   The present invention relates to a method for forming a protective member made of resin on the entire surface of one surface of a plate-like workpiece.

半導体ウエーハなどの製造工程においては、円柱状のインゴットをワイヤーソーによってスライスして円盤状のウエーハを形成するときに、ウエーハに反りやうねりが形成されることがある。この反りやうねりを除去するために、反りやうねりが形成されたウエーハの片面にポリエチレン等の液状樹脂を塗布し、これを硬化させた後にウエーハの反対側の面と該片面とを順次研削してウエーハを平坦に形成する技術がある。   In a manufacturing process of a semiconductor wafer or the like, when a cylindrical ingot is sliced with a wire saw to form a disk-shaped wafer, warpage or undulation may be formed on the wafer. In order to remove the warpage and waviness, a liquid resin such as polyethylene is applied to one side of the wafer on which the warp or waviness is formed, and after curing this, the opposite surface of the wafer and the one side are ground sequentially. There is a technology for forming the wafer flat.

かかる技術において、ウエーハの片面に液状樹脂を貼着するためには、例えば、ステージ上に載置されたシートの上に液状樹脂を滴下し、ステージの上方で吸引保持部に保持されたウエーハを、その片面側からシートに対して上方から押し付けてウエーハの中心から外周側に向けて液状樹脂を拡張させ該片面の全域に液状樹脂を行きわたらせた後、この液状樹脂を加熱したり、紫外光を照射したりすることにより液状樹脂を硬化させる方法が提案されている（例えば、下記の特許文献１を参照）。   In this technique, in order to adhere the liquid resin to one side of the wafer, for example, the liquid resin is dropped on a sheet placed on the stage, and the wafer held by the suction holding unit above the stage is removed. The liquid resin is expanded from the center of the wafer toward the outer peripheral side by pressing from the upper side against the sheet from one side of the wafer, and the liquid resin is spread over the entire area of the one side, and then the liquid resin is heated or irradiated with ultraviolet light. And a method of curing a liquid resin by irradiating (see, for example, Patent Document 1 below).

特開２０１２−１４３７２３号公報JP 2012-143723 A

上記したようなシートの上において液溜まりとなった液状樹脂には、水のような液体とは異なり表面張力が弱く働くため、液溜まりの中心部分にわずかな凹みが形成される。この凹みの大きさは、液状樹脂を塗布しようとするウエーハのサイズに比例する。すなわち、大きいウエーハ（例えば、直径４５０ｍｍ）と小さいウエーハ（例えば、直径２００ｍｍ）とでは、大きいウエーハに液状樹脂を塗布する方が液状樹脂の使用量が多くなることから、液溜まりの中心にできる凹みも大きくなる。   Unlike the liquid such as water, the liquid resin that has become a liquid reservoir on the sheet as described above has a weak surface tension, so that a slight recess is formed in the central portion of the liquid reservoir. The size of the recess is proportional to the size of the wafer to which the liquid resin is to be applied. That is, for large wafers (for example, 450 mm in diameter) and small wafers (for example, 200 mm in diameter), the amount of liquid resin used increases when a liquid resin is applied to a large wafer. Also grows.

このように、特に、大きいウエーハに液状樹脂を塗布する場合、ウエーハの一方の面で液状樹脂の上から押し付けるときに、液溜まりの凹み部分に空気が入り込んで、液状樹脂を硬化させても液状樹脂内に気泡ができてしまう。そして、このような液状樹脂で一方の面が保護されたウエーハの他方の面を研削しても、研削後のウエーハに凸状部分ができてしまい、ウエーハを高精度に研削加工することが困難となっている。   In this way, particularly when a liquid resin is applied to a large wafer, when the liquid resin is pressed on one side of the wafer from above the liquid, even if the liquid enters the concave portion of the liquid reservoir and the liquid resin is cured, the liquid resin is liquid. Bubbles are formed in the resin. And even if the other surface of the wafer whose one surface is protected with such a liquid resin, a convex portion is formed on the ground wafer, and it is difficult to grind the wafer with high accuracy. It has become.

本発明は、上記の事情にかんがみてなされたもので、ウエーハの一方の全面を保護する液状樹脂に気泡が混入しないようにすることを目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to prevent bubbles from being mixed into a liquid resin that protects one entire surface of a wafer.

本発明は、ウエーハの一方の面の全面に液状樹脂を押し拡げ硬化させて保護部材を形成する保護部材の形成方法であって、ステージの上面の中心に所定量の液状樹脂を供給する樹脂供給工程と、該ステージと対面し該保持部の保持面に保持されるウエーハの下面の中心に、該ウエーハに付着する程度の液状樹脂を付着させる樹脂付着工程と、該ステージの中心と該保持部の該保持面が保持するウエーハの中心とを一致させ、該ステージと該保持部とを接近させて該液状樹脂を押圧することにより、ウエーハの該下面の全面に該液状樹脂を押し拡げる拡張工程と、押し拡げられた該液状樹脂を硬化させる硬化工程と、を備える。   The present invention relates to a method for forming a protective member that forms a protective member by spreading and curing a liquid resin over the entire surface of one surface of a wafer, and supplying a predetermined amount of liquid resin to the center of the upper surface of a stage And a resin adhesion step for adhering a liquid resin that adheres to the wafer to the center of the lower surface of the wafer that faces the stage and is held by the holding surface of the holding portion, and the center of the stage and the holding portion An expansion step of spreading the liquid resin over the entire lower surface of the wafer by causing the holding surface of the wafer to coincide with the center of the wafer and pressing the liquid resin by bringing the stage and the holding portion closer to each other And a curing step for curing the spread liquid resin.

また、本発明は、ウエーハの一方の面の全面に液状樹脂を押し拡げ硬化させて保護部材を形成する保護部材の形成方法であって、下面が保持部の保持面に保持されたウエーハの上面の中心に所定量の液状樹脂を供給する樹脂供給工程と、該ウエーハと対面するステージの下面の中心に、該ステージに付着する程度の液状樹脂を付着させる樹脂付着工程と、該保持部の保持面に保持されたウエーハの中心と該ステージの中心とを一致させ、該ウエーハと該ステージとを接近させて該液状樹脂を押圧することにより、ウエーハの該上面の全面に該液状樹脂を押し拡げる拡張工程と、押し拡げられた該液状樹脂を硬化させる硬化工程と、を備える。   The present invention also relates to a method for forming a protective member that forms a protective member by spreading and curing a liquid resin over the entire surface of one surface of the wafer, the lower surface of the upper surface of the wafer held by the holding surface of the holding portion. A resin supply step of supplying a predetermined amount of liquid resin to the center of the wafer, a resin adhesion step of attaching a liquid resin of the degree to adhere to the stage to the center of the lower surface of the stage facing the wafer, and holding the holding unit By aligning the center of the wafer held on the surface with the center of the stage and bringing the wafer and the stage close together and pressing the liquid resin, the liquid resin is spread over the entire upper surface of the wafer. An expansion step, and a curing step for curing the expanded liquid resin.

本発明の保護部材の形成方法では、樹脂供給工程において、ステージの上面の中心または保持部の保持面に保持されたウエーハの上面の中心に向けて所定量の液状樹脂を供給し、樹脂付着工程において、ステージと対面する保持部の保持面に保持するウエーハの下面の中心またはウエーハと対面するステージの下面の中心に付着する程度の液状樹脂を付着させてから、拡張工程において、ステージとウエーハとで液状樹脂を挟み込んで押圧するため、樹脂供給工程で供給された液状樹脂に凹部が形成されたとしても、拡張工程において拡張された液状樹脂には凹部が形成されない。したがって、その後に硬化工程を実施すると、気泡がない保護部材をウエーハの一方の面に形成することができ、後のウエーハの研削によって、ウエーハを高精度に平坦に仕上げることができる。   In the method for forming a protective member of the present invention, in the resin supply step, a predetermined amount of liquid resin is supplied toward the center of the upper surface of the stage or the center of the upper surface of the wafer held by the holding surface of the holding portion, and the resin adhesion step In the expansion step, the liquid resin is attached to the center of the lower surface of the wafer held on the holding surface of the holding unit facing the stage or the center of the lower surface of the stage facing the wafer. Since the liquid resin is sandwiched and pressed, the liquid resin expanded in the expansion process does not have a recess even if the liquid resin supplied in the resin supply process forms a recess. Accordingly, when a curing step is subsequently performed, a protective member free of bubbles can be formed on one surface of the wafer, and the wafer can be finished flat with high accuracy by subsequent grinding of the wafer.

樹脂供給工程を示す断面図である。It is sectional drawing which shows a resin supply process. 樹脂付着工程を示す断面図である。It is sectional drawing which shows a resin adhesion process. ウエーハの下面に液状樹脂が付着した状態を示す断面図である。It is sectional drawing which shows the state which liquid resin adhered to the lower surface of the wafer. 拡張工程を示す断面図である。It is sectional drawing which shows an expansion process. ウエーハの径方向に液状樹脂が拡張された状態を示す断面図である。It is sectional drawing which shows the state by which liquid resin was expanded in the radial direction of the wafer. 硬化工程を示す断面図である。It is sectional drawing which shows a hardening process. 樹脂供給工程，樹脂付着工程の第２例を示す断面図である。It is sectional drawing which shows the 2nd example of a resin supply process and a resin adhesion process. 拡張工程の第２例を示す断面図である。It is sectional drawing which shows the 2nd example of an expansion process. 硬化工程の第２例を示す断面図である。It is sectional drawing which shows the 2nd example of a hardening process.

以下では、添付の図面を参照しながら、被加工物であるウエーハの一方の面の全面を保護する保護部材を形成する方法について説明する。   Hereinafter, a method for forming a protective member for protecting the entire surface of one surface of a wafer as a workpiece will be described with reference to the accompanying drawings.

１ 保護部材の形成方法の第１例
（１） 樹脂供給工程
まず、図１（ａ）に示すように、液状樹脂が滴下されるシート２をステージ１の上面１ａに載置し、図示しない吸引源の吸引力を上面１ａに作用させてシート２を吸引保持する。シート２は、特に材質が限定されるものではなく、例えばＰＥＴ（ポリエチレンテレタレート）によって構成されている。 1 First Example of Method for Forming Protective Member (1) Resin Supply Step First, as shown in FIG. 1A, a sheet 2 onto which liquid resin is dropped is placed on the upper surface 1a of the stage 1 and suction (not shown) The sheet 2 is sucked and held by applying the suction force of the source to the upper surface 1a. The material of the sheet 2 is not particularly limited, and is made of, for example, PET (polyethylene terephthalate).

続いて、ステージ１の上方側にある樹脂供給ノズル３から、所定量の液状樹脂４をステージ１の上面１ａに吸引保持されたシート２の上面の中心に滴下する。液状樹脂４は、ウエーハの一方の面を保護する保護部材となるもので、例えば紫外線硬化樹脂を使用する。図１（ｂ）に示すように、適量の液状樹脂４がシート２の上面に堆積して液溜まりの状態の液状樹脂４０になった時点で、樹脂供給ノズル３からシート２に液状樹脂４を滴下するのを停止する。シート２の上に溜まった液状樹脂４０には、その中心部分に凹部５が形成されている。なお、滴下する液状樹脂４の量は、後に液状樹脂が硬化して保護部材となる部分の厚さとウエーハの面積とにより求められる。   Subsequently, a predetermined amount of liquid resin 4 is dropped from the resin supply nozzle 3 on the upper side of the stage 1 to the center of the upper surface of the sheet 2 sucked and held on the upper surface 1 a of the stage 1. The liquid resin 4 serves as a protective member for protecting one surface of the wafer, and for example, an ultraviolet curable resin is used. As shown in FIG. 1B, when an appropriate amount of the liquid resin 4 is deposited on the upper surface of the sheet 2 to become a liquid resin 40 in a liquid pool state, the liquid resin 4 is applied to the sheet 2 from the resin supply nozzle 3. Stop dripping. The liquid resin 40 accumulated on the sheet 2 has a recess 5 at the center. Note that the amount of the liquid resin 4 to be dropped is determined by the thickness of the portion where the liquid resin is cured later to become a protective member and the area of the wafer.

（２） 樹脂付着工程
図２に示すように、ステージ１の上面１ａと対面する位置に、保持部１０に保持されたウエーハＷを位置させる。ウエーハＷは、円柱状のインゴットをワイヤーソーによってスライスされてデバイスが形成される前のものである。 (2) Resin Adhesion Step As shown in FIG. 2, the wafer W held by the holding unit 10 is positioned at a position facing the upper surface 1 a of the stage 1. The wafer W is before a device is formed by slicing a cylindrical ingot with a wire saw.

保持部１０は、ウエーハＷを吸引保持する保持面１２を有するポーラス部材１１を有しており、保持面１２には、吸引源が接続されている。保持部１０には、保持部１０をステージ１に接近または離反させる方向に昇降させる昇降手段１３が接続されている。一方、樹脂付着手段１４は、保持部１０の近傍に配設されており、液状樹脂を載せるバー状のプレート１５と、鉛直方向の軸を中心としてプレート１５を回転させる回転部１６と、プレート１５を昇降させる昇降部１７とにより少なくとも構成されている。回転部１６がプレート１５を回転させることにより、プレート１５を、ノズル等から液状樹脂の滴下が行われる位置と、液状樹脂を付着させる所望の位置との間を移動させることができる。
なお、保持部１０は、保持面１２に吸引源に連通する吸引溝を形成してウエーハＷを吸引保持させても良い。 The holding unit 10 includes a porous member 11 having a holding surface 12 for sucking and holding the wafer W, and a suction source is connected to the holding surface 12. The holding unit 10 is connected to an elevating means 13 that raises and lowers the holding unit 10 in a direction in which the holding unit 10 approaches or separates from the stage 1. On the other hand, the resin adhering means 14 is disposed in the vicinity of the holding unit 10, and has a bar-shaped plate 15 on which the liquid resin is placed, a rotating unit 16 that rotates the plate 15 about a vertical axis, and a plate 15. And an elevating part 17 for elevating and lowering. When the rotating unit 16 rotates the plate 15, the plate 15 can be moved between a position where the liquid resin is dropped from a nozzle or the like and a desired position where the liquid resin is attached.
The holding unit 10 may suck and hold the wafer W by forming a suction groove communicating with the suction source on the holding surface 12.

保持部１０は、吸引源によって吸引力を保持面１２に作用させてウエーハＷの上面Ｗａを保持面１２で吸引保持し、ウエーハＷの下面Ｗｂをステージ１に吸引保持されたシート２と対面させる。次いで、プレート１５の一端の上面に適量の液状樹脂６を付着させる。そして、回転部１６がプレート１５を回転させ、プレート１５を、保持部１０に吸引保持されたウエーハＷの中心位置の直下に移動させる。液状樹脂６の量は、少なくともウエーハＷの下面Ｗｂに付着する程度の少ない量であればよい。なお、液状樹脂６は、上記した液状樹脂４と同様のものを使用する。
また、樹脂付着手段１４は、プレート１５を回転部１６で回転させウエーハの中心に液状樹脂６を付着させる構成としたが、ウエーハの中心に液状樹脂６を付着させる構成であれば、プレート１５を直動移動させても良いし、ウエーハの外周を保持する外周保持部が、ウエーハを保持して上面下面を反転させる反転軸を備え、ウエーハの上面に液状樹脂６を付着（滴下）させ、反転軸でウエーハを反転させ、反転したウエーハを保持部１０に保持させるようにしても良い。 The holding unit 10 applies a suction force to the holding surface 12 by a suction source to suck and hold the upper surface Wa of the wafer W with the holding surface 12, and causes the lower surface Wb of the wafer W to face the sheet 2 sucked and held on the stage 1. . Next, an appropriate amount of the liquid resin 6 is attached to the upper surface of one end of the plate 15. Then, the rotating unit 16 rotates the plate 15 and moves the plate 15 directly below the center position of the wafer W sucked and held by the holding unit 10. The amount of the liquid resin 6 may be an amount that is at least small enough to adhere to the lower surface Wb of the wafer W. The liquid resin 6 is the same as the liquid resin 4 described above.
Further, the resin adhering means 14 is configured to rotate the plate 15 by the rotating unit 16 and adhere the liquid resin 6 to the center of the wafer. However, if the liquid resin 6 is adhered to the center of the wafer, the plate 15 The outer periphery holding part that holds the outer periphery of the wafer may have a reversing shaft that holds the wafer and reverses the upper and lower surfaces, and attaches (drops) the liquid resin 6 to the upper surface of the wafer for inversion. The wafer may be inverted with the shaft, and the inverted wafer may be held by the holding unit 10.

次に、昇降部１７がプレート１５を上昇させて、図３に示すように、ウエーハＷの中心の下面Ｗｂに液状樹脂６を付着させる。この液状樹脂６は、ウエーハＷの下面Ｗｂから落下せずに、下面Ｗｂにおいて付着された状態が維持される。なお、液状樹脂６をウエーハＷの中心の下面Ｗｂに付着させる際は、プレート１５が上昇するのではなく、保持部１０が下降するようにしてもよい。   Next, the elevating part 17 raises the plate 15 to attach the liquid resin 6 to the lower surface Wb at the center of the wafer W, as shown in FIG. The liquid resin 6 is not dropped from the lower surface Wb of the wafer W, but is maintained on the lower surface Wb. When the liquid resin 6 is attached to the lower surface Wb at the center of the wafer W, the holding unit 10 may be lowered instead of the plate 15 being raised.

（３） 拡張工程
その後、ステージ１の中心の平面方向の位置と保持部１０の保持面１２が保持するウエーハＷの中心の平面方向の位置とを一致させ、昇降手段１３によって保持部１０をステージ１に接近させる方向に下降させる。 (3) Expansion Step Thereafter, the position in the plane direction of the center of the stage 1 is matched with the position in the plane direction of the center of the wafer W held by the holding surface 12 of the holding section 10, and the holding section 10 is moved to the stage by the lifting means 13. Lower in a direction to approach 1.

保持部１０が下降していくと、ウエーハＷの下面Ｗｂに付着した液状樹脂６が、ウエーハＷの下面Ｗｂよりも先に液状樹脂４０の凹部５に接触する。さらに、保持部１０が下降していくと、凹部５に接触した液状樹脂６が液状樹脂４０内に押し込まれていき、凹部５が存在しない状態になる。そしてさらに、図５に示すように、保持部１０を鉛直方向下方に下降させて押圧することで、液状樹脂４０をウエーハＷの径方向に拡張させる。拡張された状態の液状樹脂４０には凹部がなくなることから、液状樹脂４０に空気が入り込むことはない。このようにしてウエーハＷの下面Ｗｂの全面に液状樹脂４０を押し拡げる。   As the holding portion 10 is lowered, the liquid resin 6 attached to the lower surface Wb of the wafer W comes into contact with the concave portion 5 of the liquid resin 40 before the lower surface Wb of the wafer W. Further, when the holding unit 10 is lowered, the liquid resin 6 that has come into contact with the recess 5 is pushed into the liquid resin 40 and the recess 5 does not exist. Further, as shown in FIG. 5, the liquid resin 40 is expanded in the radial direction of the wafer W by lowering and pressing the holding portion 10 downward in the vertical direction. Since the expanded liquid resin 40 has no recess, air does not enter the liquid resin 40. In this way, the liquid resin 40 is spread over the entire lower surface Wb of the wafer W.

なお、本工程では、保持部１０を下降させる代わりに、ステージ１を上昇させてもよい。すなわち、ステージ１と保持部１０とを接近させて液状樹脂を押圧できればよい。   In this step, the stage 1 may be raised instead of lowering the holding unit 10. That is, it is only necessary that the liquid resin can be pressed by bringing the stage 1 and the holding unit 10 close to each other.

（４）硬化工程
拡張工程を実施した後、図６に示すように、例えばステージ１の内部に配設された複数のＵＶランプ１８によって図５に示した液状樹脂４０に向けて紫外光を照射して硬化させる。紫外光の刺激により液状樹脂４０が硬化することにより、ウエーハＷの下面Ｗｂの全面を保護する保護部材４１が形成される。次に、保持部１０は、保持面１２に保持されたウエーハＷの上面Ｗａに対する吸引保持を解除し、昇降手段１３によって保持部１０を上昇させ、ウエーハＷの上面Ｗａから保持面１２を離反させる。その後は、例えば研削砥石などによってウエーハＷの上面Ｗａ側から研削を行い、その後、保護部材４１を剥離してから研削した上面側を保持し、ウエーハＷの下面Ｗｂを研削する。 (4) Curing process After performing the expansion process, as shown in FIG. 6, for example, ultraviolet light is irradiated toward the liquid resin 40 shown in FIG. 5 by a plurality of UV lamps 18 disposed inside the stage 1. And let it harden. When the liquid resin 40 is cured by the stimulation of ultraviolet light, a protective member 41 that protects the entire lower surface Wb of the wafer W is formed. Next, the holding unit 10 releases the suction holding with respect to the upper surface Wa of the wafer W held on the holding surface 12, lifts the holding unit 10 by the lifting means 13, and separates the holding surface 12 from the upper surface Wa of the wafer W. . After that, for example, grinding is performed from the upper surface Wa side of the wafer W with a grinding wheel or the like, and then the upper surface side after the protective member 41 is peeled is held and the lower surface Wb of the wafer W is ground.

このように、本発明の保護部材の形成方法では、樹脂供給工程の後に樹脂付着工程を実施して保持部１０の保持面１２に吸引保持されるウエーハＷの下面Ｗｂの中心に付着する程度の液状樹脂６を下面Ｗｂに付着させてから、拡張工程を実施するように構成したため、ウエーハの下面Ｗｂに付着された液状樹脂６から先に液状樹脂４０の凹部５に接触させ、続いて液状樹脂６が付着されていない部分のウエーハの下面Ｗｂで液状樹脂４０を押し付けることにより、凹部５がなくなるため、液状樹脂４０内に気泡が混入しないようにウエーハＷの下面Ｗｂにおいて液状樹脂４０を拡張することができる。
その後は、硬化工程を実施して液状樹脂４０を硬化させるため、ウエーハＷの下面Ｗｂの全面を保護する保護部材４１を形成することができ、その後の研削によって、ウエーハＷの両面を平坦に形成することができる。 As described above, in the method for forming the protective member of the present invention, the resin adhesion process is performed after the resin supply process, and is adhered to the center of the lower surface Wb of the wafer W sucked and held by the holding surface 12 of the holding unit 10. Since the expansion process is performed after the liquid resin 6 is attached to the lower surface Wb, the liquid resin 6 attached to the lower surface Wb of the wafer is first brought into contact with the concave portion 5 of the liquid resin 40, and then the liquid resin is used. By pressing the liquid resin 40 on the lower surface Wb of the wafer where the 6 is not attached, the recess 5 is eliminated, so that the liquid resin 40 is expanded on the lower surface Wb of the wafer W so that bubbles do not enter the liquid resin 40. be able to.
Thereafter, since the liquid resin 40 is cured by performing a curing step, the protective member 41 that protects the entire lower surface Wb of the wafer W can be formed, and both surfaces of the wafer W are formed flat by subsequent grinding. can do.

２ 保護部材の形成方法の第２例
本発明に係る保護部材の形成方法は、上記の構成に限定されるものではなく、シートを保持するステージとウエーハＷを保持する保持部とを上下逆さまに配置して行ってもよい。すなわち、図７に示すように、ポーラス部材２１を有する保持部２０を、シート２ａを保持するステージ２３の下側に配置させて例えばステージ２３側を昇降可能な構成にしてもよい。 2 Second Example of Method for Forming Protective Member The method for forming a protective member according to the present invention is not limited to the above configuration, and the stage for holding the sheet and the holding portion for holding the wafer W are turned upside down. It may be arranged. That is, as shown in FIG. 7, the holding unit 20 having the porous member 21 may be arranged below the stage 23 holding the sheet 2a so that the stage 23 side can be raised and lowered, for example.

（１）樹脂供給工程
まず、保持部２０の保持面２２にウエーハＷの下面Ｗｂ側を吸引保持し、吸引保持されたウエーハＷの上面Ｗａの中心に所定量の液状樹脂を滴下して堆積させ、液溜まりの状態の液状樹脂４０ａとする。ここにいう所定量は、上記第１例と同様に、後に液状樹脂が硬化して保護部材となる部分の厚さとウエーハＷの面積とにより求められる。
なお、保持部２０は、保持面２２に吸引源に連通する吸引溝を形成してウエーハＷを吸引保持させても良い。 (1) Resin Supply Step First, the lower surface Wb side of the wafer W is sucked and held on the holding surface 22 of the holding unit 20, and a predetermined amount of liquid resin is dropped and deposited on the center of the upper surface Wa of the sucked and held wafer W. The liquid resin 40a is in a liquid pool state. The predetermined amount here is obtained by the thickness of the portion where the liquid resin later cures and becomes a protective member and the area of the wafer W, as in the first example.
The holding unit 20 may suck and hold the wafer W by forming a suction groove communicating with the suction source on the holding surface 22.

（２）樹脂付着工程
ウエーハＷに対面するステージ２３は、図示しない吸引源の吸引力を保持面２３ａに作用させてシート２ａを保持面２３ａで吸引保持し、シート２ａの下面を保持部２０に吸引保持されたウエーハＷと対面させる。 (2) Resin adhesion step The stage 23 facing the wafer W causes the suction force of a suction source (not shown) to act on the holding surface 23a to suck and hold the sheet 2a with the holding surface 23a, and the lower surface of the sheet 2a to the holding unit 20 It faces the wafer W held by suction.

次いで、樹脂付着手段１４ａのプレート１５の一端の上面に適量の液状樹脂６ａを付着させた後、回転部１６がプレート１５を回転させ、プレート１５をステージ２３に吸引保持されたシート２ａの中心位置の直下に移動させる。続いて昇降部１７がプレート１５を上昇させ、シート２ａの中心の下面に液状樹脂６ａを付着させる。この液状樹脂６ａは、図８に示すように、シート２ａの下面から落下せずに、該下面において付着された状態が維持される。液状樹脂６ａの量は、少なくともウエーハＷの下面Ｗｂに付着する程度の少ない量であればよい。なお、液状樹脂６ａをシート２ａの中心の下面に付着させる際は、プレート１５が上昇するのではなく、ステージ２３が下降するようにしてもよい。
また、樹脂付着手段１４ａでは、回転部１６がプレート１５を回転させ液状樹脂６ａをシートの中心に位置づけているが、シート２ａの中心に液状樹脂６ａを付着させる機構であれば、回転部１６に限らず、シート２ａの外側からシート２ａの中心に向かって直動する直動部を備える構成であっても良い。 Next, after an appropriate amount of liquid resin 6a is attached to the upper surface of one end of the plate 15 of the resin attaching means 14a, the rotating unit 16 rotates the plate 15 and the center position of the sheet 2a in which the plate 15 is sucked and held on the stage 23 Move it directly below. Then, the raising / lowering part 17 raises the plate 15, and makes liquid resin 6a adhere to the lower surface of the center of the sheet | seat 2a. As shown in FIG. 8, the liquid resin 6a is not dropped from the lower surface of the sheet 2a, but is maintained in a state of being attached to the lower surface. The amount of the liquid resin 6a may be an amount that is at least small enough to adhere to the lower surface Wb of the wafer W. When the liquid resin 6a is attached to the lower surface at the center of the sheet 2a, the stage 23 may be lowered instead of the plate 15 being raised.
Further, in the resin adhering means 14a, the rotating unit 16 rotates the plate 15 to position the liquid resin 6a at the center of the sheet. However, if the mechanism adheres the liquid resin 6a to the center of the sheet 2a, the rotating unit 16 Not limited to this, a configuration may be provided that includes a linear motion portion that linearly moves from the outside of the seat 2a toward the center of the seat 2a.

（３）拡張工程
その後、ステージ２３の中心の水平方向の位置と保持部２０の保持面２２が保持するウエーハＷの中心の水平方向の位置とを一致させ、ステージ２３を下降させて、ステージ２３が保持するシート２ａをウエーハＷの上に堆積された液状樹脂４０ａに押し付ける。このとき、シート２ａの下面に付着した液状樹脂６ａがシート２ａの下面よりも先に液状樹脂４０ａの凹部５ａに接触する。さらに、ステージ２３が下降していくと、凹部５ａに接触した液状樹脂６ａが液状樹脂４０ａ内に押し込まれていき、凹部５ａが存在しない状態となる。このようにして、ウエーハＷの上面Ｗａにおいて径方向に液状樹脂４０ａを拡張させる。この拡張された液状樹脂４０ａには、空気が入り込むことはない。 (3) Expansion Step Thereafter, the horizontal position of the center of the stage 23 and the horizontal position of the center of the wafer W held by the holding surface 22 of the holding unit 20 are matched, the stage 23 is lowered, and the stage 23 Is pressed against the liquid resin 40a deposited on the wafer W. At this time, the liquid resin 6a attached to the lower surface of the sheet 2a comes into contact with the concave portion 5a of the liquid resin 40a before the lower surface of the sheet 2a. When the stage 23 is further lowered, the liquid resin 6a that has come into contact with the recess 5a is pushed into the liquid resin 40a, and the recess 5a does not exist. In this way, the liquid resin 40a is expanded in the radial direction on the upper surface Wa of the wafer W. Air does not enter the expanded liquid resin 40a.

なお、本工程では、ステージ２３を下降させる代わりに、保持部２０を上昇させてもよい。すなわち、ステージ２３と保持部２０とを接近させて液状樹脂を押圧できればよい。   In this step, the holding unit 20 may be raised instead of lowering the stage 23. That is, it is only necessary that the liquid resin can be pressed by bringing the stage 23 and the holding unit 20 close to each other.

（４）硬化工程
拡張工程を実施した後、図９に示すように、例えばステージ２３の内部に配設された複数のＵＶランプ１８ａによって、図８に示した液状樹脂４０ａに向けて紫外光を照射して硬化させる。紫外光の刺激により液状樹脂４０ａが硬化することにより、ウエーハＷの上面Ｗａの全面を保護する保護部材４１ａが形成される。このように、液状樹脂４０ａに気泡が混入しないように、ウエーハＷの上面Ｗａの全面に貼着することができる。したがって、研削後のウエーハＷの両面を平坦にすることができる。 (4) Curing step After performing the expansion step, as shown in FIG. 9, for example, UV light is directed toward the liquid resin 40a shown in FIG. 8 by a plurality of UV lamps 18a disposed inside the stage 23. Irradiate to cure. As the liquid resin 40a is cured by the stimulation of ultraviolet light, a protective member 41a that protects the entire upper surface Wa of the wafer W is formed. In this manner, the liquid resin 40a can be adhered to the entire upper surface Wa of the wafer W so that bubbles do not enter the liquid resin 40a. Therefore, both surfaces of the wafer W after grinding can be flattened.

なお、樹脂付着手段１４，１４ａは、上記の構成に限定されない。例えばプレート１５の内部に配管を配設してプレートの先端側から滴量の液状樹脂６、６ａを噴出させる構成にしてもよい。   In addition, the resin adhesion means 14 and 14a are not limited to said structure. For example, pipes may be provided inside the plate 15 so that drops of the liquid resins 6 and 6a are ejected from the front end side of the plate.

１：ステージ １ａ：保持面 ２：シート ３：樹脂供給ノズル
４，４０，４０ａ：液状樹脂 ４１：保護部材 ５，５ａ：凹部 ６，６ａ：液状樹脂
１０：保持部 １１：ポーラス部材 １２：保持面 １３：昇降手段
１４，１４ａ：樹脂付着手段 １５：プレート １６：回転部 １７：昇降部
１８，１８ａ：ＵＶランプ
２０：保持部 ２１：ポーラス部材 ２２：保持面 ２３：ステージ ２３ａ：保持面 1: Stage 1a: Holding surface 2: Sheet 3: Resin supply nozzles 4, 40, 40a: Liquid resin 41: Protection member 5, 5a: Recess 6, 6, 6a: Liquid resin 10: Holding portion 11: Porous member 12: Holding surface 13: Lifting means 14, 14a: Resin adhering means 15: Plate 16: Rotating part 17: Lifting part 18, 18a: UV lamp 20: Holding part 21: Porous member 22: Holding surface 23: Stage 23a: Holding surface

Claims (2)

ウエーハの一方の面の全面に液状樹脂を押し拡げ硬化させて保護部材を形成する保護部材の形成方法であって、
ステージの上面の中心に所定量の液状樹脂を供給する樹脂供給工程と、
該ステージと対面し該保持部の保持面に保持されるウエーハの下面の中心に、該ウエーハに付着する程度の液状樹脂を付着させる樹脂付着工程と、
該ステージの中心と該保持部の該保持面が保持するウエーハの中心とを一致させ、該ステージと該保持部とを接近させて該液状樹脂を押圧することにより、ウエーハの該下面の全面に該液状樹脂を押し拡げる拡張工程と、
押し拡げられた該液状樹脂を硬化させる硬化工程と、を備える保護部材の形成方法。 A method of forming a protective member that forms a protective member by spreading and curing a liquid resin over the entire surface of one surface of the wafer,
A resin supply step of supplying a predetermined amount of liquid resin to the center of the upper surface of the stage;
A resin adhering step for adhering a liquid resin to an extent to adhere to the wafer to the center of the lower surface of the wafer facing the stage and held on the holding surface of the holding unit;
By aligning the center of the stage with the center of the wafer held by the holding surface of the holding unit, and bringing the stage and the holding unit close together and pressing the liquid resin, the entire surface of the lower surface of the wafer is pressed. An expansion process for expanding the liquid resin;
And a curing step of curing the expanded liquid resin. ウエーハの一方の面の全面に液状樹脂を押し拡げ硬化させて保護部材を形成する保護部材の形成方法であって、
下面が保持部の保持面に保持されたウエーハの上面の中心に所定量の液状樹脂を供給する樹脂供給工程と、
該ウエーハと対面するステージの下面の中心に、該ステージに付着する程度の液状樹脂を付着させる樹脂付着工程と、
該保持部の保持面に保持されたウエーハの中心と該ステージの中心とを一致させ、該ウエーハと該ステージとを接近させて該液状樹脂を押圧することにより、ウエーハの該上面の全面に該液状樹脂を押し拡げる拡張工程と、
押し拡げられた該液状樹脂を硬化させる硬化工程と、を備える保護部材の形成方法。 A method of forming a protective member that forms a protective member by spreading and curing a liquid resin over the entire surface of one surface of the wafer,
A resin supply step of supplying a predetermined amount of liquid resin to the center of the upper surface of the wafer whose lower surface is held by the holding surface of the holding unit;
A resin adhering step of adhering a liquid resin of an amount adhering to the stage to the center of the lower surface of the stage facing the wafer;
By aligning the center of the wafer held on the holding surface of the holding portion with the center of the stage, bringing the wafer and the stage close together and pressing the liquid resin, the entire surface of the upper surface of the wafer is An expansion process for expanding the liquid resin;
And a curing step of curing the expanded liquid resin.
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018067586A (en) * 2016-10-18 2018-04-26 株式会社ディスコ Resin coating method for wafer
JP2018088441A (en) * 2016-11-28 2018-06-07 株式会社ディスコ Method for measuring curing energy and device for forming protective member
JP2018088440A (en) * 2016-11-28 2018-06-07 株式会社ディスコ Method for measuring shrinkage rate and device for forming protective member
KR20180083802A (en) 2017-01-13 2018-07-23 가부시기가이샤 디스코 Wafer cleaning apparatus
JP2018125323A (en) * 2017-01-30 2018-08-09 株式会社ディスコ Protection member formation device
DE102019219076A1 (en) 2018-12-07 2020-06-10 Disco Corporation TRAINING DEVICE FOR PROTECTIVE ELEMENT
KR20210011879A (en) 2019-07-23 2021-02-02 가부시기가이샤 디스코 Processing method and resin adhesion apparatus
KR20220031508A (en) 2020-09-04 2022-03-11 가부시기가이샤 디스코 Apparatus for supplying liquid resin
DE102023206090A1 (en) 2022-07-05 2024-01-11 Disco Corporation GRINDING PROCESS FOR WAFER DISCS

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7034809B2 (en) * 2018-04-09 2022-03-14 株式会社ディスコ Protective sheet placement method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335532A (en) * 1994-06-13 1995-12-22 Fujitsu Ltd Method for spin coating of resin
US20080216952A1 (en) * 2007-03-06 2008-09-11 Cheng Uei Precision Industry Co., Ltd. Adhesive Method Of Optical Components
JP2009175701A (en) * 2007-12-27 2009-08-06 Seiko Instruments Inc Method of manufacturing display device
JP2013175647A (en) * 2012-02-27 2013-09-05 Disco Abrasive Syst Ltd Resin sticking device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5670208B2 (en) 2011-01-13 2015-02-18 株式会社ディスコ Resin coating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335532A (en) * 1994-06-13 1995-12-22 Fujitsu Ltd Method for spin coating of resin
US20080216952A1 (en) * 2007-03-06 2008-09-11 Cheng Uei Precision Industry Co., Ltd. Adhesive Method Of Optical Components
JP2009175701A (en) * 2007-12-27 2009-08-06 Seiko Instruments Inc Method of manufacturing display device
JP2013175647A (en) * 2012-02-27 2013-09-05 Disco Abrasive Syst Ltd Resin sticking device

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