JP2013105858A - Support member, support structure and method for processing tabular object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a support member, a support structure and a method for processing a tabular object for suppressing a break, a crack resulting from a curve of the tabular object, and reducing breakage of the tabular object when the tabular object is peeled off from the top of the support member.SOLUTION: A support member 11 is a support member for holding one surface of a wafer W via a resin layer 12, formed of a film with an outer diameter larger than an outer diameter of the wafer W, and having a recess 14 at the center, the recess 14 is formed with an inner diameter having a gap 15 with the outer edge of the wafer W when the center of the wafer W is positioned to the center of the recess 14, the gap 15 is constituted by being set so that a part of the wafer W is buried in ultraviolet hardening resin of the recess 14 and the ultraviolet hardening resin bulges over the whole circumference of the wafer W when the ultraviolet hardening resin is applied to the recess 14 of the support member 11, and the center of the wafer W is positioned, loaded, and depressed to the center of the recess 14.

Description

  The present invention relates to a support member, a support structure, and a plate-like material processing method used for grinding a back surface of a plate-like material to thin the plate-like material to a predetermined thickness.

  Usually, when grinding a plate-like object, a protective tape is attached to the surface of the plate-like object in order to protect the surface of the plate-like object (see, for example, Patent Document 1). However, when the plate is ground to a predetermined thickness (for example, 90 μm) or less, the warpage of the plate cannot be suppressed during processing and the plate is damaged by the warping force of the plate itself. End up. Furthermore, chipping (cracking) and cracking occur due to the knife edge during processing.

  Therefore, conventionally, a method of grinding a plate-like object after sticking the plate-like object on a support member made of a rigid body is employed (for example, see Patent Document 2). In general, the plate-like material is stuck on the support member with wax, ultraviolet curable resin, or the like.

JP 05-198542 A JP 2004-207606 A

  However, if the support member is a rigid body, the warpage of the plate-like object can be suppressed, so that thin processing is possible, but peeling becomes difficult and breaks at the time of peeling.

  In view of the above problems, the present invention suppresses cracks and cracks caused by warpage of a plate-like material, and can reduce damage to the plate-like material when the plate-like material is peeled from the support member. It aims at providing the processing method of a member, a support structure, and a plate-shaped object.

  In order to solve the above-described problems and achieve the object, the present inventors have intensively studied a support member, a support structure, and a plate-like material processing method. As a result, the support member used to hold the plate-like material is formed of a film, and the shape is set to a predetermined shape, so that when the plate-like material is ground, the plate-like material is cracked or chipped (crack). It has been found that grinding can be performed stably without causing the occurrence of. The present invention has been completed based on such findings. That is, the outer diameter is larger than the outer diameter of the plate-like object and has a concave portion at the center, and the concave portion has an inner diameter having a gap and an outer edge of the plate-like object when the center of the plate-like object is positioned at the center of the concave portion. When the resin is applied to the concave portion of the support member and the center of the plate-like material is placed and pressed at the center of the concave portion and pressed, the plate-like material is partially buried in the resin of the concave portion. By forming the resin so that it rises in the gap between the outer edge of the plate-like object and the inner diameter of the recess over the entire outer periphery of the plate, cracks caused by warpage of the plate-like object are suppressed and supported. It has been found that the plate-like material can be prevented from being damaged when the plate-like material is peeled from the member.

  Therefore, the support member according to the present invention is a support member for holding one surface of the plate-like object via the resin, and has an outer diameter larger than the outer diameter of the plate-like object and a recess in the center. The concave portion is formed with an inner diameter having a gap with an outer edge of the plate-like material when the center of the plate-like material is positioned at the center of the concave portion, and the gap is formed by the support member. When the resin is applied to the concave portion and the center of the plate-like object is positioned and placed at the center of the concave portion and pressed, a part of the plate-like substance is buried in the resin of the concave portion and the plate-like The resin is set so as to protrude over the entire outer periphery of the object.

  The support structure according to the present invention is a support structure for holding one surface of a plate-like material via a resin, and has an outer diameter larger than the outer diameter of the plate-like material and a recess in the center. The recess is formed with an inner diameter having a gap with an outer edge of the plate-like object when the center of the plate-like object is positioned at the center of the recess. When a resin is applied to the recess and the center of the plate-like object is placed and pressed at the center of the recess, a part of the plate-like object is buried in the resin of the recess so that the plate-like object A support member that is set so that the resin protrudes over the entire outer periphery, a resin layer that is provided in the recess and is formed by curing the resin, and provided on the surface of the resin layer in the recess And a part of the plate is buried in the resin layer in the recess, and the resin layer extends over the entire outer periphery of the plate. Characterized by comprising formed by raised from the gap Te.

  A processing method of a plate-like object according to the present invention is a processing method of a plate-like object in which a back surface of a plate-like object disposed on a support member is ground and thinned to a predetermined thickness, the support member and the At least one of the plate-like material is made of a substance that transmits ultraviolet rays, and a support member preparing step for preparing the above-mentioned support member, and an ultraviolet curable resin is applied to the concave portion of the prepared support member, and the plate-like material is prepared. The surface of the plate is opposed to the ultraviolet curable resin, the center of the plate is positioned at the center of the recess, and the plate is buried in the UV curable resin of the recess to make the entire circumference of the plate After the plate-like object placing step of pressing and placing the plate-like object until the ultraviolet-curing resin rises from the gap, and the plate-like object placing step, The ultraviolet curable resin is cured by irradiating with ultraviolet rays through the support member or the plate-like material, and then on the support member. After the plate-like object fixing step for fixing the object and the plate-like object fixing step, the supporting member side is held by a holding table, and the back surface of the plate-like object is ground and thinned to the predetermined thickness. And a step of removing the support member and the ultraviolet curable resin from the plate-like material by softening by heating or adding water after the thinning step is performed. And

  Further, in the present invention, after performing the thinning step and before performing the removing step, the adhesive sheet is attached to the plate-like object side and attached to the annular frame via the adhesive sheet. It is preferable to further include a step.

According to the support member of the present invention, it is possible to suppress cracks and cracks due to warpage of the plate-like object, and to reduce the damage of the plate-like object when the plate-like object is peeled from the support member.
Moreover, according to the processing method of the plate-shaped object of the present invention, even if the support member is formed of a film, the plate-shaped object is held in the recess of the support member through the resin, so that the grounding volume is increased and the plate The warpage of the object can be suppressed, and the occurrence of cracks and cracks in the plate-like object can be suppressed. Furthermore, since the support member is formed of a film, the resin is easily softened by an external stimulus such as heat or water, so that the support member and the resin can be easily removed from the plate without damaging the plate. be able to.

FIG. 1 is a diagram simply showing the configuration of the support structure. FIG. 2 is a perspective view of the support member. FIG. 3 is a cross-sectional view of the wafer. FIG. 4 is a perspective view of the wafer. FIG. 5 is a flowchart illustrating an example of a plate-like material processing method according to the present embodiment. FIG. 6 is a diagram illustrating an example of the configuration of the sticking device. FIG. 7 is a diagram showing a state of operation of the resin supply means. FIG. 8 is a diagram illustrating a state in which a thermosetting resin is dropped. FIG. 9 is a diagram illustrating a state in which a thermosetting resin is dropped on the support member. FIG. 10 is a diagram illustrating a state where the wafer is lowered onto the support member. FIG. 11 is a diagram illustrating a state where the wafer is lowered on the support member. FIG. 12 is a diagram showing a state of irradiating UV. FIG. 13 is a perspective view showing an example of the configuration of the grinding apparatus. FIG. 14 is a diagram showing a process of thinning the wafer. FIG. 15 is a diagram illustrating a state after the wafer is thinned. FIG. 16 is a diagram illustrating a state where the support member and the resin layer are peeled from the wafer. FIG. 17 is a diagram illustrating a state where the support member and the resin layer are peeled from the wafer. FIG. 18 is a diagram showing another example of peeling the support member and the resin layer from the wafer. FIG. 19 is a diagram illustrating another example of peeling the support member and the resin layer from the wafer. FIG. 20 is a flowchart showing another example of the plate-like material processing method according to the present embodiment. FIG. 21 is a diagram illustrating a state in which an adhesive sheet is attached to the back side of the wafer. FIG. 22 is a diagram illustrating a state where the support member and the resin layer are peeled from the wafer.

  The present invention will be described in detail below. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

<Support structure>
FIG. 1 is a diagram simply showing the configuration of the support structure. As shown in FIG. 1, the support structure 10 according to the present embodiment includes a support member 11, a resin layer 12, and a plate-like object (wafer) W.

(Support member)
The support member 11 is a member for holding one surface of the wafer W via a resin layer 12 formed by curing an ultraviolet curable resin. The support member 11 is formed of a film having an outer diameter larger than the outer diameter of the wafer W and having a recess 14 in the center.

  The recess 14 is formed with an inner diameter having a gap 15 and an outer edge (end surface) Wa of the wafer W when the center of the wafer W is positioned at the center thereof. When the wafer W is circular, the recess 14 is formed in a circular shape.

  Examples of the material for forming the support member 11 include polyethylene terephthalate (PET), polypropylene (polypropylene, PP), polyethylene (polyethylene, PE), polycarbonate (Polycarbonate, PC), and polyvinyl chloride (PVC). ) And polyester (Polyester).

  The wafer W is held via a resin layer 12 formed by irradiating an ultraviolet curable resin with ultraviolet rays (UV) and curing it. Therefore, when irradiating UV from the support member 11 side, the support member 11 is preferably formed of a film formed of a material that can transmit UV, but is not particularly limited to this. Absent. When irradiating UV from the wafer W side, the support member 11 may be formed of a film formed of a material having low UV transmittance.

  A perspective view of the support member 11 is shown in FIG. As shown in FIG. 2, the support member 11 has a circular shape, but is not limited thereto, and may have an arbitrary shape according to the shape of the wafer W.

  The gap 15 is formed by applying an ultraviolet curable resin to the concave portion 14 of the support member 11, placing the center of the wafer W at the center of the concave portion 14, and pressing and placing the wafer W on the ultraviolet curable resin of the concave portion 14. The part is buried and the ultraviolet curable resin is designed to protrude over the entire outer periphery of the wafer W. Therefore, since the wafer W can be held in the recess 14 through the resin layer 12 even if the support member 11 is formed of a film, the support member 11 and the resin layer 12 of the wafer W are in contact with each other. The volume to be increased. As a result, it is possible to suppress cracks and cracks due to the warpage of the wafer W, and to reduce the possibility of the wafer W being damaged when the wafer W is peeled off from the support member 11.

(adhesive)
The resin layer 12 is provided in the concave portion 14 of the support member 11. The resin layer 12 is formed using an ultraviolet curable resin. The ultraviolet curable resin is a resin that is three-dimensionally crosslinked and cured by ultraviolet rays. In addition, the ultraviolet curable resin includes a resin that swells and softens when moisture is absorbed and whose holding power decreases. The ultraviolet curable resin may be a resin that is three-dimensionally crosslinked and cured by ultraviolet rays. Examples of the ultraviolet curable resin include (1) polyester di (meth) acrylate, polyurethane di (meth) acrylate, and epoxy (meth). (Meth) acrylic compounds having (meth) acrylic groups at least at both molecular chain terminals selected from acrylates, (2) hydrophilic (meth) acrylic compounds having at least two (meth) acrylic groups in the molecule, and the like Can be mentioned. Specifically, for example, “REGILOCK” manufactured by DISCO Corporation is preferably used. These resins may be used alone or in combination of two or more.

  The UV curable resin has a viscosity of 1000 mPa · s or more and 50000 mPa · s, preferably 3000 mPa · s or more and 50000 mPa · s when uncured, and has a Shore hardness D type of 30 or more and 90 or less, preferably 40 when cured by ultraviolet irradiation. It is preferable that the hardness is 90 or less. As the ultraviolet curable resin, any resin composition that swells and lowers its holding power when absorbing hot water of 40 ° C. or higher and 90 ° C. or lower, preferably 60 ° C. or higher and 80 ° C. or lower can be used.

  In addition, since the ultraviolet curable resin is generally cured by electron beam irradiation or simple heating, the means for curing the ultraviolet curable resin may be either UV irradiation, electron beam irradiation, heating, or a combination thereof. Good.

  The ultraviolet curable resin is desirably transparent. The transparent ultraviolet curable resin used at that time refers to a resin having a high visible light transmittance even when completely cured. The transparency of the resin layer 12 is preferably such that the light transmittance at 550 nm when molded into a sheet having a thickness of 50 μm to 100 μm is 80% or more, more preferably 85% or more, and most preferably 90%. % Or more. When the resin layer 12 is used for a display element substrate or the like, the transparency of the resin layer 12 is preferably 85% or more.

  In addition, since the ultraviolet curable resin adheres the support member 11 and the wafer W, a conventionally used hot-melt type wax can be used as the resin layer 12, but the wafer W is ground later. There is a possibility that the wafer W may be cracked or cracked when it is peeled after being processed. On the other hand, since the resin layer 12 is obtained by curing an ultraviolet curable resin, if it contains moisture, the resin layer 12 swells and its holding power decreases, so that the wafer W can be easily peeled from the resin layer 12. This is preferable because it is possible.

(Wafer W)
Examples of the material for forming the wafer W include silicon (Si), sapphire, silicon carbide (SiC), and gallium nitride (GaN). 3 is a cross-sectional view of the wafer W, and FIG. 4 is a perspective view of the wafer W. As shown in FIGS. 3 and 4, the wafer W is a hard disk-shaped member, and the end face Wa is chamfered into a semicircular cross section in order to suppress the occurrence of chipping and cracking. A circuit is formed on the surface W1 of the wafer W.

  The wafer W is preferably formed of a material that can transmit UV, but is not particularly limited thereto.

  According to the support structure 10 according to the present embodiment, the wafer W can be held in the recess 14 via the resin layer 12 even if the support member 11 is formed of a film, and the wafer W is grounded to the resin layer 12. Since the volume is widened, it is possible to suppress cracks caused by warpage of the wafer W, and to prevent the wafer W from being damaged when the wafer W is peeled off from the support member 11.

<Processing method for plate-like material>
Next, a method for grinding the wafer W using the support structure 10 manufactured using the support member 11 will be described below.

FIG. 5 is a flowchart illustrating an example of a plate-like material processing method according to the present embodiment. As shown in FIG. 5, the plate-like material processing method is a method of grinding the back surface W <b> 2 of the wafer W disposed on the support member 11 to a predetermined thickness, and includes the following steps.
(A) Support member preparation step for preparing the support member 11 (step S11)
(B) An ultraviolet curable resin is applied to the recess 14 of the prepared support member 11, the surface W 1 of the wafer W is opposed to the ultraviolet curable resin, the center of the wafer W is positioned at the center of the recess 14, and the wafer W is recessed. 14 is a plate-like object placing step in which the wafer W is pressed and placed until the ultraviolet curable resin rises from the gap 15 over the entire outer circumference of the wafer W by being buried in the ultraviolet curable resin 14 (step S12).
(C) After executing the plate-like object placing step (step S12), the ultraviolet curable resin is irradiated with UV through the support member 11 to cure the ultraviolet curable resin, and the wafer W is fixed on the support member 11. Plate-shaped object fixing step (step S13)
(D) After executing the plate-like object fixing step (step S13), the thinning step (step S14) in which the support member 11 side is held by the holding table and the back surface W2 of the wafer W is ground to a predetermined thickness.
(E) After performing the thinning process (step S14), the UV curable resin is heated or hydrolyzed to be softened, and the removing process of peeling the support member 11 and the resin layer 12 from the wafer W (step S15).

  In this embodiment, since UV is irradiated from the support member 11 side, a material having high UV transmittance is used as the material of the support member 11, but the present invention is not limited to this. For example, when UV irradiation is performed from the wafer W side, the wafer W is formed using a material having high UV transmittance. Further, both the support member 11 and the wafer W may be formed using a material having high UV transmittance.

  For forming the support structure 10, a pasting apparatus that has been conventionally used is used. An example of the configuration of the sticking device is shown in FIG. In the present embodiment, a method for forming the support structure 10 by holding the wafer W with the support member 11 via the resin layer 12 using the sticking device 20 will be described.

  As shown in FIG. 6, the sticking device 20 includes a surface plate 21 that holds the support member 11, a resin supply means 22 that supplies an ultraviolet curable resin onto the support member 11, and a surface plate above the surface plate 21. 21, a holding pad 23 that holds the other surface opposite to the exposed surface in a state where one surface of the wafer W arranged facing the surface 21 is exposed downward, and an ultraviolet light (UV) irradiation means 24. Further, the support member 11 and the holding pad 23 are provided inside the sticking chamber 25, and the resin supply means 22 is provided so as to be movable between the inside and the outside of the sticking chamber 25.

  The surface plate 21 has a horizontal upper surface 21a on which the support member 11 is placed. The surface plate 21 is formed of a transparent or translucent hard material such as quartz glass in order to transmit UV.

  The resin supply means 22 is configured by a resin dropping portion 32 being disposed at the tip of the arm portion 31, and the support member that holds the resin dropping portion 32 on the surface plate 21 by the pivoting or horizontal movement of the arm portion 31. 11 can be selectively positioned above the central portion (operation position) of 11 and a position retracted from above the surface plate 21 (non-operation position).

  The UV irradiation means 24 is provided below the surface plate 21, and irradiates UV from below the support member 11 that is transmitted through the surface plate 21 and placed on the horizontal upper surface 21a. As the ultraviolet light irradiation means 24, for example, a xenon flash type UV lamp can be used.

  The holding pad 23 is made of a porous material and communicates with a suction source (not shown). The holding pad 23 is installed on a base 35 made of a metal such as stainless steel. The holding pad 23 and the base 35 are supported by the lifting / lowering means 40 so as to be lifted and lowered. The holding pad 23 is formed in a shape corresponding to the shape of the wafer W to be held, and is formed in a disk shape when the wafer W is circular.

  The elevating and lowering means 40 includes a plurality of guide rods 41 standing in the vertical direction, an elevating rod 42 depending on the vertical direction from above, and is slidable with respect to the guide rod 41 and has an upper portion at the lower end of the elevating rod 42. A base holding portion 43 that is fixed and holds the base 35 is provided at the lower portion, and a motor 44 that raises and lowers the lifting rod 42. The raising / lowering means 40 is driven by the motor 44 to raise and lower the raising / lowering rod 42, so that the base holder 43 is guided by the guide rod 41, and the holding pad 23 and the base together with the base holder 43. 35 is configured to move up and down. Further, the lifting / lowering means 40 includes an encoder 45 which is a lifting / lowering position detecting means for detecting the vertical position of the holding pad 23 through recognition of the vertical position of the lifting / lowering rod 42, and the lifting position recognized by the encoder 45. The information is recognized by the control means 46, and the control means 46 can control the motor 44 based on the recognized information, and can control the elevation position of the holding pad 23.

  A pressure detection means 47 is connected to the lower end of the lifting rod 42. The pressure detection means 47 is a load detector that detects the pressure applied to the holding pad 23, and the control means 46 can control the raising and lowering of the holding pad 23 based on the pressure value.

  The sticking device 20 has a liquid dripping means 50 that is movably arranged inside and outside the sticking chamber 25. The liquid dripping means 50 has a function of supplying a liquid onto the horizontal upper surface 21 a of the surface plate 21, and is configured with a dripping head 52 disposed at the tip of the arm portion 51. By the pivoting or horizontal movement of the arm portion 51, the liquid dropping means 50 causes the dropping head 52 to be positioned above the central portion of the horizontal upper surface 21 a of the surface plate 21 (dropping position) and the dropping head 52. Can be positioned at a position retracted from above the surface plate 21 (non-acting position).

  An openable / closable door 25a serving as a carry-in / out port for the wafer W to which the support member 11 is adhered is provided at the side of the adhesion chamber 25. An open / close sensor 25b is provided for detecting the open state of the open / close door 25a. When the open / close door 25a is open, the control means 46 detects this, and the attaching operation of the support member 11 is performed inside the attaching chamber 25. Avoid it. The sticking chamber 25 is covered with UV cut glass so that the inside can be visually recognized and ultraviolet rays are prevented from leaking to the outside.

  Next, each process of the processing method of the plate-shaped object which concerns on this embodiment with reference to FIGS. 5-22 is demonstrated. First, the support member 11 is prepared (support member preparation process: step S11). As described above, the support member 11 is formed of a material that transmits UV. The support member 11 has a recess 14 at the center thereof (see FIGS. 1 and 2).

  The prepared support member 11 is installed on the horizontal upper surface 21 a of the surface plate 21.

  The wafer W is brought into contact with the holding pad 23, and a negative pressure is applied to the holding pad 23 to suck and hold the wafer W. The wafer W is positioned and held at a predetermined position of the holding pad 23.

  An ultraviolet curable resin is applied to the prepared concave portion 14 of the support member 11 so that the surface W1 of the wafer W faces the concave portion 14, the center of the wafer W is positioned at the center of the concave portion 14, and the wafer W is cured by the ultraviolet rays of the concave portion 14. The wafer W is pressed and placed until it is buried in the resin and the ultraviolet curable resin rises from the gap 15 over the entire outer periphery of the wafer W (plate-like object placing step: step S12).

  As shown in FIG. 7, the resin supply means 22 moves in the horizontal direction (X-axis direction) entering the adhering chamber 25 and is orthogonal to the X-axis direction and the horizontal direction as necessary. It also moves in the Y-axis direction. Then, as shown in FIG. 8, the resin dropping portion 32 is positioned above the central portion of the support member 11, and a predetermined amount of the ultraviolet curable resin 55 a is dropped from the resin dropping portion 32. As illustrated in FIG. 9, a mountain-shaped lump of ultraviolet curable resin 55 b is deposited on the central portion of the support member 11. The predetermined amount of the ultraviolet curable resin 55a is an amount by which the resin layer 12 having a desired thickness is formed over the entire surface of one side of the wafer W.

  Next, the control means 46 starts driving the raising / lowering means 40, and lowers the holding pad 23 that sucks and holds the wafer W together with the base 35. As shown in FIG. 10, on the surface where the wafer W is exposed. The ultraviolet curable resin 55b is pressed. The position of the holding pad 23 is detected by the raising / lowering position detecting means 45. When the holding pad 23 is lowered to a predetermined position, this is detected by the raising / lowering position detecting means 45, and the control means 46 Stop driving. When the holding pad 23 is lowered to a predetermined position, the surface W1 side of the wafer W is pressed onto the ultraviolet curable resin 55b, and the ultraviolet curable resin 55b spreads over the entire surface of the wafer W. As shown in FIG. UV curable resin 55c is applied to a part of the surface and the entire surface W1. On the other hand, the back surface W2 is exposed upward so that the ultraviolet curable resin 55c is not applied to the back surface W2. Moreover, the detection of the pressure by the pressure detection means 47 is started simultaneously with the start of the driving of the lifting and lowering means 40. The pressure value increases due to the pressing of the ultraviolet curable resin 55b due to the lowering of the holding pad 23, and the pressure gradually decreases after the lowering of the holding pad 23 due to the stop of driving of the lifting and lowering means 40. And it waits in the position until the measured value in the pressure detection means 47 becomes zero in the state which the holding pad 23 stopped.

  After executing the plate-like object placing step (step S12), the resin layer 12 formed by irradiating the ultraviolet curable resin 55c with UV from the support member 11 side through the support member 11 to cure the ultraviolet curable resin 55c. Thus, the wafer W is fixed on the support member 11 (step S13: plate-like object fixing step).

  Specifically, when the measured pressure value becomes zero, as shown in FIG. 12, the UV irradiation device 24 is turned on, and the UV irradiation device 24 disposed below the support member 11 is directed toward the support member 11. UV irradiation. UV passes through the surface plate 21 and the support member 11 and is irradiated to the ultraviolet curable resin 55c. As a result, a resin layer 12 having a uniform thickness and a uniform thickness is formed between the wafer W and the support member 11. When the ultraviolet curable resin 55c that has been irradiated with UV is cured, the wafer W is firmly fixed to and supported by the support member 11 via the resin layer 12.

  In this embodiment, the UV curable resin 55c is irradiated with UV from the support member 11 side through the support member 11. However, the present invention is not limited to this, and the wafer W is UV transmissive. In the case where it is made of a high material, the UV curable resin 55c may be irradiated with UV from the wafer W side through the wafer W.

  After executing the plate-like object fixing step (step S13), the support member 11 side is held by the holding table, and the back surface W2 of the wafer W is ground and thinned to a predetermined thickness (step S14: thinning step). That is, the wafer W is ground on the back surface W2 of the wafer W while being supported by the support member 11. The grinding of the wafer W is performed using a grinding apparatus that has been conventionally used. Next, an example of a grinding apparatus will be described.

  A perspective view showing an example of the configuration of the grinding device 60 is shown in FIG. As shown in FIG. 13, the grinding device 60 includes a device housing 61. The apparatus housing 61 has a rectangular parallelepiped main portion 62 that extends elongated and an upright wall 63 that is provided at a rear end portion (upper right end in FIG. 13) of the main portion 62 and extends substantially vertically upward. Yes. A pair of guide rails 64 extending in the vertical direction is provided on the front surface of the upright wall 63. A grinding unit 65 as a grinding means is mounted on the pair of guide rails 64 so as to be movable in the vertical direction.

  The grinding unit 65 includes a moving base 67 and a spindle unit 68 attached to the moving base 67. The movable base 67 is provided with a pair of leg portions 69 extending in the vertical direction on both sides of the rear surface, and a guided groove 70 is slidably engaged with the pair of guide rails 64 on the pair of leg portions 69. Is formed. Thus, a support portion 72 protruding forward is provided on the front surface of the movable base 67 slidably mounted on the pair of guide rails 64 provided on the upright wall 63. A spindle unit 68 is attached to the support portion 72.

  The spindle unit 68 includes a spindle housing 73 attached to the support portion 72 and a rotating spindle 74 that is rotatably disposed on the spindle housing 73. The spindle housing 73 constituting the spindle unit 68 is formed in a substantially cylindrical shape, and includes a shaft hole penetrating in the axial direction. A rotary spindle 74 that is inserted through a shaft hole formed in the spindle housing 73 is provided with a thrust bearing flange that is formed to project in the radial direction at the center thereof. It is rotatably supported by high-pressure air supplied between them. A rotating spindle 74 rotatably supported by the spindle housing 73 has one end portion (lower end portion in FIG. 13) protruding from the lower end of the spindle housing 73, and a wheel at one end (lower end portion in FIG. 13). A mount 75 is provided. A grinding wheel 76 is attached to the lower surface of the wheel mount 75. A plurality of fastening bolts 77 are inserted into a plurality of bolt insertion holes provided in the wheel mount 75 and are respectively screwed into screw holes of a grinding wheel 76 provided corresponding to the bolt insertion holes. The grinding wheel 76 is detachably mounted. A plurality of grinding wheels 78 are provided on the lower surface of the grinding wheel 76.

  The grinding device 60 includes a grinding unit feed mechanism 80 that moves the grinding unit 65 in the vertical direction (direction perpendicular to the holding surface of the chuck table) along the pair of guide rails 64. The grinding unit feed mechanism 80 includes a male screw rod 81 disposed on the front side of the upright wall 63 and extending substantially vertically. The male screw rod 81 is rotatably supported at its upper end and lower end by bearing members 82 and 83 attached to the upright wall 63. The upper bearing member 82 is provided with a pulse motor 84 as a drive source for rotationally driving the male screw rod 81, and an output shaft of the pulse motor 84 is connected to the male screw rod 81 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is formed on the rear surface of the movable base 67, and a through female screw hole (not shown) extending in the vertical direction is formed in this connecting portion. ) And the male screw rod 81 is screwed into the female screw hole. Therefore, when the pulse motor 84 is rotated forward, the moving base 67, that is, the grinding unit 65 is lowered, that is, moved forward, and when the pulse motor 84 is reversed, the moving base 67, that is, the grinding unit 65 is raised, that is, moved backward.

  A chuck table mechanism 85 is disposed in the main portion 62 of the apparatus housing 61. The chuck table mechanism 85 includes a holding table (chuck table) 86, a cover member 87 that covers the periphery of the chuck table 86, and bellows means 88 a and 88 b disposed before and after the cover member 87. The chuck table 86 is configured to be rotated by a rotation driving unit (not shown), and is configured to suck and hold the wafer W on its upper surface by operating a suction unit (not shown). Further, the chuck table 86 is moved between a workpiece placing area 89 and a grinding area A facing the grinding wheel 76 constituting the spindle unit 68 by a chuck table moving means (not shown). The bellows means 88a, 88b can be formed of an appropriate material such as a campus cloth. The front end of the bellows means 88 a is fixed to the front wall of the main portion 62, and the rear end is fixed to the front end surface of the cover member 87. The front end of the bellows means 88 b is fixed to the rear end surface of the cover member 87, and the rear end is fixed to the front surface of the upright wall 63 of the device housing 61. When the chuck table 86 is moved in the direction indicated by the arrow X, the bellows means 88a is expanded and the bellows means 88b is contracted, and when the chuck table 86 is moved in the direction indicated by the arrow Y, the bellows means 88a is By being contracted, the bellows means 88b is extended. Next, a method for thinning the wafer W using the grinding device 60 will be described.

  As shown in FIG. 14, while rotating the chuck table 86 in the A direction, the grinding wheel 78 and the back surface W2 of the wafer W so that the outermost circumference of the rotation track of the grinding wheel 78 rotating in the B direction passes through the center of the wafer W. Are brought into contact with each other to uniformly grind the back surface W2. Then, when the wafer W is thinned to a predetermined thickness (for example, 30 μm to 80 μm), the grinding unit 65 is raised as shown in FIG. 15 to finish the grinding. By doing in this way, wafer W 'thinned to the predetermined thickness is obtained.

  In this thinning step (step S14), the end surface Wa formed over the entire outer periphery of the wafer W ′ is adhered to the support member 11 by the cured resin layer 12, and the outer peripheral side and the end surface Wa of the end surface Wa are bonded by the resin layer 12. It is held so as to be pressed from above. By grinding the wafer W ′ while the wafer W ′ is held in this manner, even if the wafer W ′ is thin enough to warp without the end face Wa, the wafer W is removed from the resin layer 12. Since the outer periphery of 'does not peel off, it is possible to suppress the occurrence of cracks or chips (cracks) in the wafer W'.

  After performing the thinning step (step S14), the resin layer 12 is heated or hydrolyzed to be softened, and the support member 11 and the resin layer 12 are peeled from the wafer W '(step S15: removal step).

  When the resin layer 12 is heated and softened, as shown in FIG. 16, the wafer W ′ and the support member 11 are turned upside down, and then the back surface W2 of the wafer W ′ is attached to the bonding device 20 of FIG. Install on the surface plate 21.

  The support member 11 and the resin layer 12 are peeled off from the surface W1 of the wafer W ′ while the wafer W ′ is sucked and held by the surface plate 21, and the support member 11 and the resin layer 12 are completely removed as shown in FIG. The surface W1 of the wafer W ′ is exposed and removed. When the support member 11 and the resin layer 12 are peeled off, it is desirable to facilitate peeling by inserting a sharp peeling jig between the resin layer 12 and the support member 11.

  In this way, the wafer W ′ is formed. The wafer W ′ formed in this way is ground without being cracked or chipped because it is ground while being firmly held by the resin layer 12.

  Next, a method for adding the resin layer 12 to soften it will be described. When the resin layer 12 is hydrated and softened, as shown in FIG. 18, a water tank 92 containing warm water (for example, the temperature is 90 ° C.) 91 is prepared. A support base 93 is provided at the center position of the bottom of the water tank 92. When softening the resin layer 12, the support member 11 having the wafer W ′ and the resin layer 12 is immersed in the hot water 91 and the support member 11 having the wafer W ′ and the resin layer 12 on the support base 93. So that the wafer W ′ is supported by the support base 93. By doing so, the resin layer 12 hydrates and swells, the holding power of the resin layer 12 decreases, and the resin layer 12 can be easily peeled from the wafer W ′.

  After immersing the support member 11 with the wafer W ′ and the resin layer 12 in the warm water 91 for a predetermined time (the time required for the resin layer 12 to swell and decrease the adhesive force), the wafer W ′ is immersed in the warm water 91. In the state of being immersed, as shown in FIG. 19, the support member 11 and the resin layer 12 are peeled off from the wafer W ′ and taken out of the hot water 91. Since the adhesive strength of the resin layer 12 is reduced by being immersed in the hot water 91, the peeling from the wafer W 'can be easily performed.

  In the present embodiment, the resin layer 12 is heated or hydrolyzed to be softened, and the support member 11 and the resin layer 12 are peeled off from the wafer W ′. However, the present invention is not limited to this. For example, any means that can soften the resin layer 12 and peel the support member 11 and the resin layer 12 from the wafer W ′ can be used.

  Thus, according to the processing method of the plate-shaped object which concerns on this embodiment, since the wafer W is hold | maintained at the recessed part 14 of the supporting member 11 via the resin layer 12, even if the supporting member 11 is formed with a film. Further, the grounding volume is increased, and the warpage of the wafer W can be suppressed, so that cracking of the wafer W and occurrence of cracks can be suppressed. Further, since the support member 11 is formed of a film, the resin layer 12 is easily softened by an external stimulus such as heat or water, so that the support member 11 and the resin layer are separated from the wafer W ′ without damaging the wafer W ′. 12 can be easily removed.

  Therefore, in the processing method of the plate-like object according to the present embodiment, even when the wafer W is ground to a predetermined thickness by grinding the wafer W to a thickness of 10 μm or more and 80 μm or less, for example, the wafer W is warped or the wafer W is cracked or cracked. Can be suppressed.

  Moreover, the processing method of the plate-shaped object which concerns on this embodiment is not limited to this. FIG. 20 is a flowchart showing another example of the plate-like material processing method according to the present embodiment. As shown in FIG. 20, the plate-like material processing method according to the present embodiment is performed after the thinning process (step S14) and before the UV curable resin removal process (step S15). A transfer step (step S21) of attaching the adhesive sheet to the 'side and attaching the adhesive sheet to the annular frame via the adhesive sheet is further provided.

  That is, as shown in FIG. 21, the front and back of the wafer W ′ and the support member 11 are reversed, and the adhesive sheet 95 is attached to the back surface W2 side of the wafer W ′ and attached to the annular frame 96 through the adhesive sheet 95. (Step S21: Transfer process). For example, the pressure-sensitive adhesive sheet 95 includes a sheet base material made of polyvinyl chloride or polyolefin having a thickness of about 90 μm, and a pressure-sensitive adhesive layer having a thickness of about 10 μm applied to one surface of the sheet base material. It is done. The back surface W <b> 2 of the wafer W ′ is attached to the adhesive layer of the adhesive sheet 95. A ring-shaped metal annular frame 96 is attached to the periphery of the adhesive layer of the adhesive sheet 95, and the wafer W ′ is supported integrally with the annular frame 96 via the adhesive sheet 95. It becomes a state.

  After sticking the back surface W2 side of the wafer W ′ to the pressure-sensitive adhesive sheet 95, the resin layer 12 is softened by heating or adding water as described above, and the support member 11 and the resin layer 12 are peeled from the wafer W ′ (step). S15: Removal step). When the support member 11 and the resin layer 12 are peeled from the wafer W ′, as shown in FIG. 22, a sharp peeling jig is inserted between the resin layer 12 and the wafer W ′, etc. Then, the resin layer 12 is completely removed and the surface W1 of the wafer W ′ is exposed. Thereby, the wafer W ′ is obtained.

  Therefore, even when the wafer W ′ is attached to the adhesive sheet 95, the support member 11 and the resin layer 12 can be easily peeled from the wafer W ′ attached to the adhesive sheet 95, and the support member can be removed from the wafer W ′. Even if the 11 and the resin layer 12 are peeled off, a wafer W ′ free from cracks and chips can be easily obtained.

  Hereinafter, the support structure of the present embodiment will be specifically described by way of examples. However, the present embodiment is not limited to these examples.

(Examples 1 to 5 (Run Nos. 1 to 5): fixed using a PET film having a recess in the center)
A PET film, which is a support member having a diameter of 20.32 cm, a thickness of 300 μm, and a recess (diameter: 17.272 cm, depth: 200 μm), is coated with an ultraviolet curable resin (“Resilock”) as a fixing agent. Disco) was used. First, an ultraviolet curable resin is applied to the center of the concave portion of the PET film, and a sapphire wafer (diameter: 15.24 cm) before the circuit is formed is placed on the ultraviolet curable resin, and then the sapphire wafer is cured with a solvent. The mold resin was pressurized (100 N) with a precision press so that the resin thickness was 120 μm. Then, UV irradiation was applied from the PET film side to cure the solvent ultraviolet curable resin, and the sapphire wafer was attached to the PET film with an adhesive. Then, the exposed surface of the sapphire wafer was ground using a vitrified grindstone so that the finished thickness was 80 μm. Thereafter, the adhesive was peeled off by visual observation and an optical microscope, the sapphire wafer was cracked, the presence or absence of cracks, and the presence or absence of peeling between the sapphire wafer and the adhesive were observed. This observation was conducted on five sapphire wafers. Each observation result is shown in Table 1.

(Comparative Examples 1 to 5 (Run Nos. 6 to 10): fixed using a smooth flat PET film)
In Example 1, it carried out like Example 1 except having used the smooth flat PET film in which the recessed part was not formed as a supporting member. Table 1 shows the results of observation of the peeling of the adhesive, the cracking of the sapphire wafer, the presence or absence of cracks, and the presence or absence of peeling between the sapphire wafer and the adhesive.

  As shown in Table 1, in Comparative Example 2 (Run No. 7), peeling of the adhesive was observed in the grinding process, and in all of Comparative Examples 1 to 5 (Run No. 6 to 10), the sapphire wafer It was confirmed that cracks and cracks occurred. Specifically, it was confirmed that the adhesive applied to the outer peripheral portion of the sapphire wafer was peeled off, and the wafer was cracked and cracked from the peeled portion. On the other hand, in Examples 1 to 5 (Run Nos. 1 to 5), in the grinding process, peeling of the adhesive, cracking of the sapphire wafer, cracks, and peeling of the sapphire wafer and the adhesive were not confirmed. It was confirmed to be excellent. Therefore, there is no peeling between the sapphire wafer and the adhesive, but the difference in the influence on the cracking of the sapphire wafer and the occurrence of cracks depending on the presence or absence of a recess on the surface of the PET film that fixes the sapphire wafer when grinding the sapphire wafer Was confirmed to occur.

  As is clear from the above test results, even when the sapphire wafer is further thinned to 80 μm or less by fixing the sapphire wafer to a PET film having a concave portion at the center of the surface as a support member via an adhesive. It was confirmed that the grinding process could be performed stably without causing cracks and cracks in the fire wafer.

DESCRIPTION OF SYMBOLS 10 Support structure 11 Support member 12 Resin layer 14 Recess 15 Clearance 20 Adhering device 21 Surface plate 21a Horizontal upper surface 22 Resin supply means 23 Holding pad 24 Ultraviolet light irradiation means (UV irradiation apparatus)
Reference Signs List 25 Adhering chamber 25a Open / close door 25b Open / close sensor 31 Arm part 32 Resin dripping part 35 Base 40 Lifting means 41 Guide rod 42 Lifting rod 43 Base holder 44 Motor 45 Encoder (lifting position detection means)
46 Control means 47 Pressure detection means 50 Liquid dropping means 51 Arm part 52 Dropping head 55a to 55c UV curable resin 60 Grinding device 61 Equipment housing 62 Main part 63 Upright wall 64 Guide rail 65 Grinding unit 67 Moving base 68 Spindle unit 69 Leg Part 70 Guided groove 72 Support part 73 Spindle housing 74 Rotating spindle 75 Wheel mount 76 Grinding wheel 77 Fastening bolt 78 Grinding wheel 80 Grinding unit feed mechanism 81 Male thread rod 82 and 83 Bearing member 84 Pulse motor 85 Chuck table mechanism 86 Holding table ( Chuck table)
87 Cover members 88a, 88b Bellows means 89 Workpiece placement area 91 Hot water 92 Water tank 93 Support base 95 Adhesive sheet 96 Annular frame A Grinding area W, W 'Wafer W1 Surface W2 Back surface Wa End face

Claims (4)

A support member for holding one surface of the plate-like material via a resin,
It is formed of a film having an outer diameter larger than the outer diameter of the plate-like object and having a recess in the center,
The recess is formed with an inner diameter having a gap with an outer edge of the plate-like object when the center of the plate-like object is positioned at the center of the recess,
The gap is formed by applying a resin to the recess of the support member, placing the center of the plate-like material at the center of the recess and placing and pressing the resin on the resin in the recess. The support member is characterized in that the resin is set so that the portion is buried and the resin protrudes over the entire outer periphery of the plate-like object. A support structure for holding one surface of a plate-like material via a resin,
It is formed of a film having an outer diameter larger than the outer diameter of the plate-like object and having a recess in the center,
The recess is formed with an inner diameter having a gap with an outer edge of the plate-like object when the center of the plate-like object is positioned at the center of the recess,
The gap is formed by applying a resin to the recess of the support member, placing the center of the plate-like material at the center of the recess and placing and pressing the resin on the resin in the recess. A support member that is set so that the resin bulges and the resin bulges over the entire outer periphery of the plate-like object,
A resin layer provided in the recess and formed by curing the resin;
A plate-like object provided on the surface of the resin layer of the recess;
Have
A part of the plate is buried in the resin layer in the recess,
The support structure, wherein the resin layer is formed to protrude from the gap over the entire outer periphery of the plate-like object. A processing method for a plate-like object, in which the back surface of the plate-like object disposed on the support member is ground and thinned to a predetermined thickness,
A support member preparing step for preparing the support member according to claim 1, wherein at least one of the support member and the plate-like material is made of a substance that transmits ultraviolet rays;
An ultraviolet curable resin is applied to the concave portion of the prepared support member, the surface of the plate-like material is opposed to the ultraviolet curable resin, and the center of the plate-like material is positioned at the center of the concave portion. A plate-like object mounting in which an object is buried in the ultraviolet curable resin in the recess and the plate-like object is pressed and placed over the entire outer periphery of the plate-like object until the ultraviolet curable resin rises from the gap. Placing process;
After carrying out the plate-like object placing step, the ultraviolet curable resin is irradiated with ultraviolet rays through the support member or the plate-like material to cure the ultraviolet curable resin, and the plate-like material is fixed on the support member. A plate-shaped object fixing step,
After carrying out the plate-like object fixing step, a thinning step of holding the support member side with a holding table and grinding the back surface of the plate-like object to thin the predetermined thickness;
After carrying out the thinning step, the ultraviolet curable resin is heated or hydrolyzed and softened, and the removing step of peeling the support member and the ultraviolet curable resin from the plate-like material,
A method for processing a plate-like object comprising:   The transfer process of attaching the pressure sensitive adhesive sheet to the plate-like object side and attaching it to the annular frame via the pressure sensitive adhesive sheet after performing the thinning process and before performing the removing process. The processing method of the plate-shaped object of description.

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