JP2009141070A - Peeling device and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized and simply-controlled peeling device for peeling a second planar member W2 from a planar processing object W for which the second planar member W2 is bonded through an adhesive sheet S to a first planar member W1 such as a wafer. <P>SOLUTION: In the peeling device whose processing object W is a planar body for which the second planar member W2 is bonded through the adhesive sheet S to the first planar member W1 and which peels the second planar member W2 from the processing object W, a support means 1 for supporting the processing object W from the side of the first planar member W1 and a peeling means 2 for peeling the second planar member W2 from the processing object W are provided. The peeling means 2 comprises a wedge body 4 which can be inserted between the second planar member W2 and the adhesive sheet S, a displacement means 6 for displacing the wedge body 4 in the direction of isolating it from the adhesive sheet S, and a moving means 5 for moving the wedge body 4 along the interface P of the second planar member W2 and the adhesive sheet S. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention uses, as a processing object, a plate-like body in which a second plate-like member is bonded to a first plate-like member such as a semiconductor wafer via an adhesive sheet, and from the processing object to the second plate-like member. The present invention relates to a peeling apparatus and a peeling method for peeling off a film.

  In the semiconductor manufacturing process, in order to reduce the size of the semiconductor chip, there is a process of grinding the back surface of a semiconductor wafer (hereinafter referred to as “wafer”) to make it extremely thin (back grinding process). In this back grinding process, a hard support plate having a smooth surface is bonded to the surface of the wafer (surface on which the circuit is formed) via an adhesive sheet, and grinding is performed from the back side until the wafer has a thickness of several tens of μm. Done. And the process which peels a support plate is performed after a back grinding process.

  For example, as a device for peeling off the support plate as described above, a table that supports a processing object having a support plate bonded to a wafer via an adhesive sheet from the support plate side, and a pair that rotates around one of the tables as a rotation center. Japanese Patent Application Laid-Open No. H10-228561 is known which includes a peeling means having a plurality of arms and a peeling slash forming means arranged on the other side of the table. In the apparatus disclosed in Patent Document 1, a wafer is integrated with a frame by an adhesive sheet, and the frame is held by a pair of arms. Then, the cutting edge forming means forms a peeling edge between the support plate supported by the table and the adhesive sheet, and then peels off the supporting plate from the object to be processed by rotating the arm of the peeling means. Like to do. That is, the support plate is peeled from the object to be processed by starting the peeling hook formed by the peeling hook forming means and lifting the wafer through the holding sheet.

However, since the apparatus disclosed in Patent Document 1 is provided with the peeling means and the peeling hook forming means separately on one and the other of the table, the apparatus becomes large and the control becomes complicated. There is a bug. Further, when the arm of the peeling means is rotated upward, the holding sheet may be stretched or cut, and the support plate may not be peeled off, which may cause peeling failure.
JP 2006-59861 A

  In view of the above, it is an object of the present invention to provide a peeling apparatus and a peeling method that can suppress the increase in size and complexity of the apparatus and reduce the occurrence of peeling failure.

  In order to solve the above-mentioned problem, the invention according to claim 1 is directed to a processing object that is a plate-like body in which a second plate-like member is bonded to a first plate-like member via an adhesive sheet. In a peeling apparatus for peeling the second plate-shaped member from the object, a supporting means for supporting the processing object from the first plate-shaped member side, and a peeling means for peeling the second plate-shaped member from the processing object The peeling means comprises a wedge body that can be inserted between the second plate-like member and the adhesive sheet, a displacement means for displacing the wedge body in a direction separating from the adhesive sheet, and the wedge body. It is provided with the moving means to move along the interface of a 2nd plate-shaped member and an adhesive sheet, It is characterized by the above-mentioned.

  Moreover, in the said invention, you may employ | adopt the structure provided with the peeling restriction | limiting means which restrict | limits the peeling area | region where a 2nd plate-shaped member peels from the said process target object.

  Furthermore, in the above invention, the separation limiting unit may include a pressing unit, and may include a transfer unit that allows the pressing unit to move on the second plate member in synchronization with the movement of the wedge body.

  Moreover, you may employ | adopt the structure provided with the holding means to hold | maintain the said 2nd plate-shaped member.

  Further, according to the method of the present invention, a plate-like body in which a second plate-like member is bonded to a first plate-like member via an adhesive sheet is used as a processing object, and the second plate-like member is processed from the processing object. A step of supporting the object to be processed by a support means, a step of inserting a wedge body between the second plate-like member and an adhesive sheet, and attaching the wedge body to the adhesive sheet. And a step of moving the wedge body along an interface between the second plate-like member and the adhesive sheet.

  According to the present invention, the wedge body is inserted between the second plate-like member and the adhesive sheet, and in this state, the wedge body is configured to peel the second plate-like member by the displacing means and the moving means. Therefore, it is not necessary to provide the peeling means separately from the peeling slash forming means as in the prior art, and the enlargement of the apparatus can be suppressed, and simplification can be achieved in the control thereof.

  Further, since the holding sheet as in the conventional example is not used, there is no occurrence of a peeling failure due to the elongation or breakage of the holding sheet.

  Further, by providing the peeling restricting means, the second plate-like member peels over a wide area at a stretch, and a large pulling force acts on the first plate-like member, and the first plate-like member is damaged. It is also possible to prevent the second plate-like member from jumping to an unexpected part.

  Furthermore, since the pressing means is provided with transfer means that can move on the second plate-shaped member in synchronization with the movement of the wedge body, the wedge body is inserted between the second plate-shaped member and the adhesive sheet. As a result, the peeling region can be prevented from irregularly spreading, and the region can be gradually expanded, so that adverse effects on the first plate-like member can be reliably prevented.

  Hereinafter, with reference to drawings, the peeling apparatus which peels a 2nd plate-shaped member from a process target object is demonstrated.

  As shown in FIG. 4, a plate-like body in which a support plate W2 that is a second plate-like member is bonded to the surface of a wafer W1 that is a first plate-like member via an adhesive sheet S is a processing object W. The wafer W1 is ground to a thickness of several tens of μm by a back grinding process before being put into the peeling apparatus, and the surface of the adhesive sheet S that contacts the support plate W2 is an ultraviolet curable adhesive. Layer, a double-sided adhesive sheet whose surface abutting on the wafer W1 is a re-peelable adhesive layer, which is irradiated with ultraviolet rays through the support plate W2 after the back grinding process, and has a reduced adhesive force with the support plate W2 And The support plate W2 is made of, for example, a special glass plate that can be flexibly bent. Further, a chamfered portion W2a is formed on the entire periphery or partially on the adhesive sheet S side of the outer edge of the support plate W2.

  As shown in FIG. 1, the peeling apparatus includes a supporting means 1 and a peeling means 2 provided on the support means 1. The support means 1 is composed of a table T that supports the processing object W. The table T has a number of suction holes, and the processing object W is sucked through a vacuum pump (not shown). Adsorbed and supported from the wafer W1 side.

  The peeling means 2 includes a vertical mechanism 3, a wedge body 4 that can be inserted between the support plate W 2 and the adhesive sheet S, and an interface between the support plate W 2 and the adhesive sheet S (hereinafter referred to as “interface”). P ”(refer to FIG. 4), moving means 5 that moves along a direction along which the wedge body 4 is moved away from the adhesive sheet S, and peeling that the support plate W2 peels from the processing object W. It is comprised by the peeling restriction means 7 which restrict | limits an area | region, and the holding means 8 holding the support plate W2 peeled from the process target W.

  The vertical mechanism 3 includes a fixed frame F1, a cylinder 31 disposed on the fixed frame F1, a lift frame F2 that can be lifted and lowered by a piston rod 32 of the cylinder 31, and a guide that guides the lift of the lift frame F2. It consists of a rod 33.

  The moving means 5 includes a linear motion motor 51 fixed to the lift frame F2, a movable frame 53 that is advanced and retracted by the linear motion motor 51 along a guide rail 52 disposed on the lower surface of the lift frame F2, The leg 54 extends downward from the movable frame 53.

The wedge body 4 is pivotally attached to the lower end of the leg portion 54 by a support shaft 4a at an intermediate portion thereof. The wedge body 4 is moved by the linear motion motor 51 from the outside of the processing object W supported by the table T to the inside of the processing object W along the interface P.

  The displacement means 6 includes a cylinder 61 provided at the lower portion of the movable frame 53 and a universal joint 63 provided at the lower end of the piston rod 62 of the cylinder 61 and connected to the rear end portion of the wedge body 4. ing.

  As a result, the piston rod 62 of the cylinder 61 moves downward so that the front end 4b of the wedge body 4 is displaced in a direction away from the adhesive sheet S. Further, a stopper bolt 4c is attached to the wedge body 4 so as to face a receiving portion 55 provided at the lower end of the leg portion 54, and the amount of displacement by which the wedge body 4 is separated from the adhesive sheet S is different from that of the receiving portion 55. Adjustment is possible with the stopper bolt 4c. The front end 4b of the wedge body 4 is set to coincide with the height of the interface P when the elevating frame F2 is at the lower end position and the piston rod 62 is at the upper end position.

  The separation limiting means 7 is attached to a single-axis robot 71 as a transfer means provided on the lower surface of the elevating frame F2 and a slider 73 of the single-axis robot 71 and is movable in the left-right direction in FIG. And a pressing roller 74 as pressing means suspended so as to be movable up and down via the cylinder 73. Thereby, the support plate W <b> 2 is pressed from above, and the separation region where the support plate W <b> 2 is separated from the object to be processed W is limited.

  The holding means 8 is provided on the lower surface of the elevating frame F2, and is configured by a pair of suction pads 81 that are positioned to the right of the pressure roller 74 in FIG. The support plate W2 peeled off by the insertion of the wedge body 4 can be sucked and held.

  Next, with reference to FIG. 1 thru | or FIG. 3, the peeling method of the support plate W2 from the process target W performed using the said peeling apparatus is demonstrated.

First, when the processing object W is placed on the table T with the wafer W side down, the processing object W is positioned and supported by suction by positioning means (not shown). Then, the elevating frame F2 is lowered by the vertical mechanism 3 to be in the state shown in FIG. In this state, the piston rod 62 of the cylinder 61 is at the ascending end position, and the front end 4b of the wedge body 4 coincides with the height of the interface P.

  Next, the pressing roller 74 and the suction pad 81 are lowered by the respective cylinders 73 and 82 to press the pressing roller 74 against the support plate W2, and the support plate W2 is sucked by the suction pad 81. Then, the wedge body 4 is moved toward the processing object W by driving the linear motion motor 51 while maintaining the height of the interface P. 2A, the front end 4b of the wedge body 4 is inserted between the support plate W2 and the adhesive sheet S at the outer edge portion of the processing object W. Here, since the chamfered portion W2a is formed on the adhesive sheet S side of the outer edge of the support plate W2, the front end 4b of the wedge body 4 is guided by the chamfered portion W2a and is formed between the support plate W2 and the adhesive sheet S. It will be surely inserted between them.

  Next, the movement of the wedge body 4 is temporarily stopped, and the front end 4b of the wedge body 4 is displaced in a direction away from the adhesive sheet S as shown in FIG. Thereby, the support plate W2 starts to peel from the adhesive sheet S.

Here, if the front end 4b of the wedge body 4 is displaced upward, the support plate W2 may try to peel over a wide range at once. At this time, an abrupt pulling force acts on the wafer W1, and the wafer W1 may be damaged.

  Therefore, in the present embodiment, the support roller W2 is pressed by the pressing roller 74 in front of the insertion position of the front end 4b of the wedge body 4 (front in the direction in which the peeling region is about to expand). For this reason, the peeling region of the support plate W2 is not peeled at a stretch over a wide area, and the wafer W is not damaged.

  Next, as shown in FIG. 2C, the movement of the wedge body 4 is resumed, and the pressing roller 74 is also moved rightward in FIG. 2 in synchronization with this movement. With this movement, the peeling area of the support plate W2 spreads to the right side in the figure as shown in FIG. When the wedge body 4 reaches a predetermined position, the movement by the linear motor 51 is stopped and the movement of the pressing roller 74 by the single-axis robot 71 is also stopped. Thereafter, the pressing roller 74 is gradually moved upward by the cylinder 73 to release the pressing of the support plate W2. As a result, as shown in FIG. 3A, the rightward portion in FIG. 3 is peeled off from the adhesive sheet S from the pressed portion of the pressing roller 74 by the elastic restoring force of the support plate W2. As shown in FIG. 3A, the peeled support plate W2 is supported in an inclined posture by the wedge body 4 and the suction pad 81.

  Next, as shown in FIG. 3B, the suction pad 81 is moved upward by the cylinder 82 to bring the support plate W2 into a horizontal posture and raise the vertical mechanism 3. As a result, the support plate W2 is lifted and completely separated from the processing object W. Then, the lifted support plate W2 is transferred to a conveying means (not shown) and is paid out from the peeling device.

  According to the peeling device having the above configuration, the support plate W2 can be peeled basically only by the movement of the wedge body 4, and the control becomes simple. In addition to the wedge body 4, the peeling device of the present embodiment includes a pressing roller 74 and a suction pad 81, which are suspended above the table 1 by a common lifting frame F <b> 2. Therefore, the apparatus can be reduced in size.

  In this embodiment, the wedge body 4 is configured to rotate about the support shaft 4a as the displacing means 6. However, the wedge body 4 is configured to move up and down in a horizontal posture. Also good.

  Further, if the movable frame 53 of the moving means 5 is extended and the pressing roller 74 is supported by this extended portion, the moving means for the pressing roller 74 is unnecessary.

  Furthermore, although the movement of the wedge body 4 is temporarily stopped when the wedge body 4 is displaced upward, the wedge body 4 may be displaced upward while continuing the movement.

  In the present embodiment, the support plate W2 is illustrated and described using a glass plate. However, the present invention is not limited to this, and an elastically deformable member such as a resin plate or a metal plate is used. be able to.

  Further, the first plate-like member is not limited to the wafer W1, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. The wafer W1 is a silicon wafer. Or a compound wafer.

  Further, instead of the pressing roller 74, the pressing means may employ a plate-like blade material, pressing with high-pressure air, pressing with an elastic member such as rubber, resin, sponge, or the like.

  Furthermore, there may be a step of peeling the remaining adhesive sheet S from the wafer W1. Further, a dicing tape used in the dicing process may be affixed to the ground surface of the wafer W1, and this dicing tape may be affixed at a stage prior to the peeling method of the present invention.

The side view of the peeling apparatus of embodiment of this invention. Process explanatory drawing which peels a support plate with a wedge body. Process explanatory drawing following FIG. 2 which peels a support plate with a wedge body. The typical sectional view of a processing subject.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Support means 2 Peeling means 4 Wedge body 5 Moving means 6 Displacement means 7 Peeling restriction means 71 Single-axis robot (transfer means)
74 Pressing roller (pressing means)
8 Holding means P Interface W Processing object (plate-like body)
W1 wafer (first plate-like member)
W2 support plate (second plate-like member)
S Adhesive sheet

Claims (5)

In the peeling apparatus that peels the second plate-shaped member from the processing object, using the plate-shaped body having the second plate-shaped member bonded to the first plate-shaped member via the adhesive sheet as the processing object.
Support means for supporting the object to be processed from the first plate-like member side;
A peeling means for peeling the second plate-like member from the processing object,
The peeling means includes a wedge body that can be inserted between the second plate-like member and the adhesive sheet, a displacement means for displacing the wedge body in a direction separating the adhesive body from the adhesive sheet, and the wedge body as a second plate. A peeling device comprising: a moving means that moves along the interface between the sheet-like member and the adhesive sheet.   The peeling apparatus according to claim 1, further comprising a peeling limiting unit that limits a peeling area where the second plate-like member peels from the processing object.   3. The peeling according to claim 2, wherein the peeling limiting means includes a pressing means, and includes a transferring means that allows the pressing means to move on the second plate-like member in synchronization with the movement of the wedge body. apparatus.   The peeling apparatus according to claim 1, further comprising a holding unit that holds the second plate-like member. A stripping method in which a plate-like body in which a second plate-like member is bonded to a first plate-like member via an adhesive sheet is a processing object, and the second plate-like member is peeled off from the processing object. ,
Supporting the processing object on a support means;
Inserting a wedge between the second plate-like member and the adhesive sheet;
Displacing the wedge body in a direction away from the adhesive sheet;
And a step of moving the wedge body along an interface between the second plate-like member and the adhesive sheet.

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