TWI750381B - Sheet attaching device and attaching method - Google Patents

Abstract

A sheet attaching device (10) is provided with: supporting means (20) for supporting a body to be attached (WF) with a supporting surface (21A); feeding means (30) for feeding an adhesive sheet (AS); pressing means (40) ), the adhesive sheet (AS) is pressed and attached to the body (WF) supported on the support surface (21A); the supporting means (50) are attached, and the cleaning means (51) and the pressing means (52) are attached The cleaning means (51) is integrated, and the cleaning means (51) is to combine the supporting surface (21A), the surface to be attached (WF1) of the body (WF), and the surface of the adhesive sheet (AS) attached to the body (WF) At least one of them is cleaned, and the pressing means (52) presses the outer peripheral portion of the body to be attached (WF) to the support surface (21A) before the sheet (AS) is attached.

Description

Sheet attachment device and attachment method

The present invention relates to a sheet sticking device and sticking method.

Conventionally, a sheet sticking device is known, which corrects the posture of the body to which the sheet is attached, or cleans the body or the support surface that supports the body (for example, refer to Document 1: Japanese Patent Laid-Open No. 2005-2005). Bulletin 33120). The conventional sheet sticking device described in Document 1 includes a wafer pressing mechanism (pressing means) for straightening a semiconductor wafer (hereinafter also referred to as a "wafer") into a flat surface, and a wafer pressing mechanism (pressing means) that The wafer cleaning mechanism (cleaning means) for removing dust on the surface of the body) is constituted separately, and in order to drive these with different driving devices, there is a disadvantage of increasing the size of the apparatus and complicating the control.

An object of the present invention is to provide a sheet sticking device and a sticking method, which can prevent the device from being enlarged and the control being complicated and complicated. The present invention adopts the structure described in the claim. According to the present invention as described above, since the cleaning means and the pressing means are integrated with the sticking support means, it is possible to prevent the enlargement of the apparatus and the complicated control. In addition, if the outer peripheral portion of the adhesive sheet after cutting can be pressed to the body to be attached, the outer peripheral portion of the adhesive sheet can be closely attached to the body to be attached, so that the outer peripheral portion of the adhesive sheet can be prevented from floating from the body to be attached. condition.

Embodiments of the Invention Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the X axis, the Y axis, and the Z axis in the present embodiment are in an orthogonal relationship, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. In addition, in this embodiment, when the direction viewed from the front direction in FIG. 1 parallel to the Y-axis is used as a reference, "up" is the arrow direction of the Z-axis and "down" is the opposite direction, " "Left" is the arrow direction of the X-axis and "Right" is the opposite direction, "Front" is the front direction in FIG. 1 parallel to the Y-axis, and "Rear" is the opposite direction. In FIG. 1 , the sheet attaching apparatus 10 includes: supporting means 20 for supporting the wafer WF as a body to be attached by the supporting surface 21A; feeding means 30 for feeding the adhesive sheet AS; and pressing means 40 for feeding the adhesive sheet AS The AS is attached by pressing the wafer WF supported by the support surface 21A; the cleaning means 51 cleans the support surface 21A and the surface of the adhesive sheet AS attached to the wafer WF; the attachment support means 50 is used for cleaning The pressing means 52 for pressing the outer peripheral portion of the wafer WF to the support surface 21A are integrated; the cutting means 60 is attached to the wafer so that the sheet portion AS1 (see FIG. 3 ) remains on the wafer WF The adhesive sheet AS of the WF is cut into a predetermined shape; the recovery means 70 recovers the excess sheet US other than the adhesive sheet part AS1 of the adhesive sheet AS; and the transport means 80 transports the wafer WF. The support means 20 includes: an inner stage 21 having a support surface 21A capable of sucking and holding the wafer WF by a decompression means not shown such as a decompression pump or a vacuum generator, and an outer stage 22 located on the inner stage The outer side of 21 supports the surplus sheet US as a surplus sheet support means; and the linear motor 23 supports the inner table 21 on its output shaft 23A as a driving machine. The outer table 22 includes a residual sheet support surface 22A, to which the sheet AS is attached together with the wafer WF supported by the inner table 21, and the residual sheet US formed by cutting by the cutting means 60 is attached. A support; a recess 22B, which supports the direct-acting motor 23 in its interior; an opening 22C, which is provided on the rear side of the recess 22B, allowing the wafer WF to enter and exit; and an opening 22D, which is provided on the left side of the recess 22B. 50 advance and retreat inside. The feeding means 30 includes: a support roller 31 for supporting the raw material tape RS to which the adhesive sheet AS is temporarily adhered to one surface of the peeling sheet RL; guide rollers 32A and 32B for guiding the raw material tape RS; and a linear motor 33 , as a driving machine, on its output shaft 33A, a pressing member 33B for sandwiching the raw material strip RS between the guide roller 32A is supported; a force measuring device 34A, which supports the guide roller 32B, and serves as a measurable adhesive sheet The tension detection means for the tension of AS; the peeling plate 34B is used as a peeling member to peel off the adhesive sheet AS from the peeling sheet RL; the driving roller 35 is driven by the rotary motor 35A as a driving machine, and is connected with the nip roller 35B. The peeling sheet RL is sandwiched; the recovery roller 36 recovers the peeling sheet RL; the frame 37 supports the support roller 31 and the recovery roller 36 among the aforementioned constituent members constituting the feeding means 30; and the linear motor 39, The frame 37 is supported by a slider (not shown) as a driving device, and is supported by a slider 38A (see FIG. 3 ) of a linear motor 38 as a driving device. The pressing means 40 is provided with: a linear motor 43 as a driving device supported by a slider 41A of a linear motor 41 as a driving device through a bracket 42; and a pressing roller 44 rotatably through a bracket 43B The output shaft 43A supported by the linear motor 43 serves as a pressing member to press the adhesive sheet AS against the surface WF1 to be attached to the wafer WF. The sticking support means 50 further includes: a single moving means 53 for moving the cleaning means 51 and the pressing means 52 from one end (left end) side of the support surface 21A to the other end (right end) side; and a support member 54 for supporting the cleaning The means 51 and the pressing means 52 are supported by the moving means 53 , and the cleaning means 51 and the pressing means 52 are integrated by the support member 54 . The cleaning means 51 includes a nozzle 51A which is an unillustrated gas supply means connected to a pressurizing pump or a pressurizing turbine for supplying gas such as air or a specific gas. The pressing means 52 includes an elastically deformable annular member 52A. The moving means 53 is provided with: a driving pulley 53C, which is driven by a rotary motor 53B as a driving machine supported by the moving frame 53A; a driven pulley 53D, supported by the moving frame 53A so as to rotate freely; a conveyor belt 53E, a hanging sleeve The driving pulley 53C and the driven pulley 53D; the first connecting member 53G connects the fixed bracket 53F fixed to the frame (not shown) and the conveyor belt 53E; and the second connecting member 53H connects the conveyor belt 53E to the support member 54 be linked. The cutting means 60 includes: a multi-joint robot arm 61 as a driving machine; and a cutting blade 62 (refer to FIG. 3 ) detachably supported by the working arm 61A of the multi-joint robot arm 61. The articulated robot arm 61 is a so-called 6-axis robot arm that can displace the object attached to the working arm 61A to any position and any angle within its working range. The recovery means 70 includes: a frame 71 , a slider 41B supported by the linear motor 41 ; a drive roller 73 driven by a rotary motor 72 as a drive mechanism supported by the frame 71 ; The surplus sheet US is sandwiched; and the recovery roller 75 is driven by an unillustrated driving machine, and recovers the surplus sheet US with a predetermined tension. The conveying means 80 includes: a multi-joint robot arm 61; Wafer WF can be adsorbed and held by means of decompression. In the above-mentioned sheet sticking apparatus 10, the procedure of sticking the adhesive sheet AS to the to-be-affixed surface WF1 of the wafer WF will be described. First, with respect to the sheet sticking apparatus 10 in which each member is made to stand by at the initial position indicated by the solid line in FIG. 1 , a user of the sheet sticking apparatus 10 (hereinafter simply referred to as "user") takes the raw material tape RS It is installed as shown by the solid line in the figure, and the signal of automatic operation is input through the operation means not shown, such as an operation panel or a personal computer. Then, the feeding means 30 and the collecting means 70 drive the rotary motors 35A and 72 to wind up the release sheet RL and the adhesive sheet AS, and the tension of the adhesive sheet AS on the support means 20 is detected by the force measuring device 34A. When the predetermined value is reached, the driving of the rotation motors 35A and 72 is stopped. Next, the linear motor 33 is driven by the feeding means 30 to sandwich the adhesive sheet AS between the pressing member 33B and the guide roller 32A, and the feeding of the adhesive sheet AS is suppressed, and a standby state is obtained. After that, the sticking support means 50 is caused to drive the rotary motor 53B and the gas supply means not shown, and the nozzle 51A is used to blow gas on the support surface 21A, and the nozzle 51A is set at the position indicated by the solid line in FIG. 1 and The support surface 21A is cleaned by reciprocating between the positions indicated by the two-dot chain line in the same figure. When a photographing means such as a camera or a projector or an unillustrated detection means such as various sensors such as an optical sensor or an ultrasonic sensor detects that the nozzle 51A has reciprocated, the sticking support is performed. The means 50 stops the driving of the rotary motor 53B and the gas supply means (not shown). Then, after the transfer means 80 drives the articulated robot arm 61 and the decompression means (not shown) to suck and hold the wafer WF with the suction tool 81, the suction tool 81 is inserted into the opening 22C, as shown in FIG. 1 . After the wafer WF is placed on the support surface 21A as indicated by a two-dot chain line, the support means 20 is driven by a decompression means (not shown) to suck and hold the wafer WF. Next, the attaching support means 50 is driven to drive the rotary motor 53B, and as shown in FIG. 2A , the pressing means 52 is moved to the right so as to be positioned above the outer peripheral portion of the wafer WF, and then the support means 20 is driven straight. The movable motor 23 is used to raise the inner platform 21 . Thereby, the pressing means 52 presses the outer peripheral portion of the wafer WF before the sheet AS is attached to the support surface 21A, and corrects the posture of the wafer WF along the support surface 21A. After that, the sticking support means 50 is driven to drive the rotary motor 53B to return the pressing means 52 to the initial position. Then, the support means 20 is driven to drive the linear motor 23, and as shown by the solid line in FIG. 3, the inner table 21 is moved upward, and then the pressing means 40 is driven to drive the linear motor 43 and the linear motor 41 to After the pressing roller 44 is lowered, it is moved to the right, and the adhesive sheet AS is pressed and attached to the adhered surface WF1 and the surplus sheet supporting surface 22A by the pressing roller 44 . At this time, when more tension is applied to the next sheet AS along with the movement of the pressing roller 44, at the moment when the force measuring device 34A detects this, the feeding means 30 drives the linear motors 38 and 39, so that the force measuring device 34A detects this. The frame 37 is controlled to move in the left-right direction and the up-down direction so that the tension detected by 34A does not deviate from a predetermined value. In addition, in the sticking operation of the subsequent sheet AS, the cutting means 60 is caused to drive the articulated robot arm 61, and the tool is changed from the suction tool 81 to the cutting blade 62. When the attachment of the adhesive sheet AS is completed, the cutting means 60 drives the multi-joint robot arm 61, and as shown by the two-dotted chain line in FIG. The cutting blade 62 moves along the outer periphery of the wafer WF. Thereby, the adhesive sheet portion AS1 is left on the wafer WF, and the excess sheet US is formed on the outer periphery of the adhesive sheet portion AS1. Next, the collecting means 70 and the pressing means 40 are driven to drive the rotary motor 72 and the linear motor 41, and the frame 71 is moved to the right as shown by the two-dot chain line in FIG. 3 to collect the surplus sheet US. Then, while the surplus sheet US is being recovered by the recovering means 70, the conveying means 80 is driven to drive the articulated robot arm 61, and the tool is exchanged from the cutting blade 62 to the suction tool 81, and the supporting means 20 is driven straight. The movable motor 23 returns the inner platform 21 to the initial position. After that, the sticking support means 50 drives the rotary motor 53B and the gas supply means (not shown), blows the gas on the surface of the adhesive sheet portion AS1 with the nozzle 51A, and moves the nozzle 51A and the pressing means 52 to the right. By moving, the nozzle 51A cleans the surface of the bonded sheet portion AS1, and the pressing means 52 is positioned above the outer peripheral portion of the bonded sheet portion AS1. When the detection means not shown detects that the nozzle 51A and the pressing means 52 have reached the positions shown in FIG. 2B , the sticking support means 50 stops the driving of the rotation motor 53B and the gas supply means not shown. Next, the support means 20 is driven to drive the linear motor 23, and as shown in FIG. 2B, the inner side table 21 is raised. Thereby, the pressing means 52 presses the outer peripheral portion of the cut adhesive sheet portion AS1 to the wafer WF. Next, the support means 20 and the sticking support means 50 are driven to drive the linear motor 23, the rotary motor 53B, and a gas supply means (not shown) to lower the inner table 21, and then the nozzle 51A blows the gas to the inner table 21. The nozzle 51A moves to the left to clean the surface of the sheet portion AS1 that has been pressed by the pressing means 52 . When the detection means not shown detects that the nozzle 51A has reached the position shown by the solid line in FIG. 1 , the sticking support means 50 stops the driving of the rotation motor 53B and the gas supply means not shown. Thereby, when the suction tool 81 or the pressing means 52 abuts on the surface of the bonding sheet portion AS1, the dust on the surface of the bonding sheet portion AS1 can be prevented from being pressed toward the wafer WF, and the pressing of dust can be prevented. The resulting damage to the wafer WF. Then, the transfer means 80 drives the articulated robot arm 61 and the decompression means (not shown), inserts the suction tool 81 into the opening 22C, sucks and holds the wafer WF by the suction tool 81, and removes the wafer WF from the inner stage 21. The wafer WF is carried out to the next process. After that, each means is driven to drive its own driving machine to return each member to its initial position. By this return operation, the adhesive sheet AS of a predetermined feeding amount is peeled off from the release sheet RL and placed on the support means 20, and then the same operation as above is repeated. According to the above-mentioned embodiment, since the sticking support means 50 in which the cleaning means 51 and the pressing means 52 are integrated is provided, it is possible to prevent the apparatus from increasing in size and the control being complicated. As described above, the best structure, method, etc. for carrying out the present invention are disclosed in the foregoing description, but the present invention is not limited thereto. That is, in the present invention, the specific embodiments are mainly illustrated and described, but the above-described embodiments are not limited in shape, The material, quantity, and other detailed structures can be modified in various ways by the manufacturer. In addition, the description of the limited shape, material, etc. disclosed above is an example to facilitate understanding of the present invention, and is not intended to limit the present invention, and a part or all of the limitation of such shape, material, etc. is limited. The description of the names of the removed components is included in the present invention. For example, the support means 20 may be arranged so that the adhered surface WF1 and the residual sheet support surface 22A are positioned in the same plane when the inner table 21 is moved upward, as long as the adhesive sheet AS can be moved by the pressing roller 44 If it is attached within the range of the adhered surface WF1 and the residual sheet support surface 22A, the adhered surface WF1 may be arranged above or below the residual sheet support surface 22A, and may have a structure without adsorption and holding. The outer stage 22 may have a plurality of openings 22C, or may not have the openings 22C. In the case where the openings 22C are not provided, there is only a gap between the inner stage 21 and the outer stage 22 to allow the wafer WF to be loaded and unloaded. . The feeding means 30 may have a structure in which the peeling sheet RL is folded back and peeled by the peeling plate 34B with respect to the raw material tape RS obtained by temporarily bonding the adhesive sheet AS to the peeling sheet RL at a predetermined interval. In this case, the adhesive sheet AS, which has been peeled off from the peeling sheet RL, may be pressed and stuck by a pressing roller as a pressing means, and the recovery means 70 may not be used. Further, the feeding means 30 may be configured to feed the adhesive sheet AS that is not temporarily attached to the release sheet RL, and in this case, the release plate 34B, the drive roller 35, the recovery roller 36 and the like may not be provided. In the feeding means 30, the support roller 31 or the recovery roller 36 may be supported on the frame 37, and the frame 37 may be moved by a single driving machine having two output shafts in the up-down direction and the left-right direction, and the linear motors 38, 39 may be used to move the frame 37. Each of the vertical direction and the left-right direction may be extended obliquely, or may be extended in directions that are not orthogonal to each other. The linear motor 38 is supported by the slider of the linear motor 39, and the slider of the linear motor 38 38A may be used to support the frame 37. Instead of using the linear motors 38 and 39, the material tape RS may be fed from the support roller 31 along with the rightward movement of the pressing roller 44. The tension detection means may be a pressure Any sensor or regulator can be used as long as it can measure the tension of the next sheet AS, and the support roller 31 may be supported by a lockable drive mechanism, and the linear motor 33 may be omitted. The attachment support means 50 may have a structure in which the cleaning means 51 and the pressing means 52 are directly supported by the moving means 53 and the cleaning means 51 and the pressing means 52 may be integrated by the moving means 53. In this case, there is no The support member 54 may also be used. The sticking support means 50 may be a structure in which the integrated cleaning means 51 and the pressing means 52 can be moved by the user's hand, and in this case, the moving means 53 may not be used. The cleaning means 51 may be a dust removal member such as an adhesive roller, a brush, or a scraper, or a suction means such as a decompression pump or a vacuum generator. The outer periphery of the pressing means 52 may also be inside, and it is not limited to a person who cleans while moving, and a person who cleans the surface to be cleaned at a position moved to the other end side may be used. The cleaning means 51 may clean the adhered surface WF1 of the wafer WF supported on the support surface 21A, and may clean the adhered surface WF1 before, after, or both of the posture correction of the wafer WF. 21A, any one surface, two surfaces, or all three surfaces of the surface WF1 of the wafer WF and the surface of the adhesive sheet AS attached to the wafer WF may be cleaned. In this way, when the suction tool 81 or the pressing means 52 is brought into contact with the bonding sheet portion AS1 with respect to the wafer WF, it is possible to prevent the dust on the surface of the bonding sheet portion AS1 from being pressed toward the wafer WF, thereby preventing the occurrence of dust. Breakage of wafer WF due to pressing. The pressing means 52 may be inelastically deformable, may be a plate-like member or a roller, or may be a plurality of members dispersed on the support member 54, as long as it can abut on the wafer WF or a part of the adhesive sheet portion AS1 Or all of them may be pressed against the outer peripheral portion of the wafer WF or the adhesive sheet portion AS1 to the support surface 21A. The moving means 53 may be constituted only by a driving machine. The support member 54 may be composed of a plurality of members. The cutting means 60 does not have to be cut into the same shape as the attached surface WF1 of the wafer WF as the shape of the adhesive sheet portion AS1 remaining on the wafer WF, and may be cut into a different shape or cut in proportion to the shape The veneer WF1 is larger, or it is cut to be smaller than the veneer WF1. In the recovery means 70, the frame 71 may be set to be rotatable by a rotary motor as a driving machine supported by the sliding member 41B of the linear motor 41, instead of using the driving roller 73 and the pinch roller 74, A structure in which the surplus sheet US is recovered directly from the outer deck 22 by the recovery roller 75 may be used, or a configuration in which the surplus sheet US is recovered without moving the frame 71 or the recovery roller 75 along the surface to be covered WF1 may be sufficient. The transfer means 80 may raise the inner stage 21 to the position indicated by the solid line in FIG. 3 , and then place the wafer WF on the support surface 21A from above without passing through the opening 22C. Other independent structures may be used, and if the body-attached conveyance is performed by another device, the conveyance means 80 may not be used. In addition, the material, type, shape, etc. of the adhesive sheet AS of the present invention and the body to be attached are not particularly limited. For example, the adhesive sheet AS may have a polygonal shape such as a circle, an elliptical circle, a triangle, or a quadrangle, or other shapes, and may be adhesive forms such as pressure-sensitive adhesiveness and thermal-sensitive adhesiveness. In the case of a flexible adhesive sheet AS, the adhesive sheet may be bonded by an appropriate method by providing a heating means such as a suitable coil heater or a heating side of a heating tube for heating the adhesive sheet. The above-mentioned adhesive sheet AS includes, for example, a single layer of the adhesive layer, an intermediate layer between the base sheet and the adhesive layer, and three or more layers such as a masking layer on the upper surface of the base sheet. Or even the so-called double-sided adhesive sheet that can peel the substrate sheet from the adhesive layer, and the double-sided adhesive sheet can also be a single-layer or multi-layer intermediate layer, or a single-layer or multi-layer without intermediate layer. By. Furthermore, as the body to be attached, for example, food, resin containers, semiconductor wafers such as silicon semiconductor wafers or compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood or other materials can be attached. Any form of member, article, etc., such as a resin board, is targeted. In addition, the adhesive sheet AS may be replaced according to the function and use, for example, a label for information recording, a label for decoration, a protective sheet, a dicing tape, a die attach film, a die bonding tape, and a recording layer may be formed into a resin Arbitrary sheets, films, tapes, etc. of arbitrary shapes such as sheets are attached to an arbitrary body to be attached as described above. The means and steps of the present invention are not limited at all as long as the operations, functions, or steps described in the means and steps can be achieved, and needless to say, they are completely independent of the single embodiment shown in the foregoing embodiment. object or process. For example, as long as the support means can support the body to be attached to the support surface, there is no limitation at all if the technical common sense at the time of filing is referred to and within the technical scope (the description of other means and steps is omitted). In addition, as the driving machine of the above-mentioned embodiment, electric machines such as rotary motors, linear motors, linear motors, single-axis robots, and multi-joint robots, pneumatic cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders can be used. Actuators and the like, and those directly or indirectly combined with these can be used (there are also those that overlap with those exemplified in the embodiment). In the above-mentioned embodiment, in the case of using rollers, a driving device for rotationally driving each roller may be provided, and the surface of each roller may be constituted by an elastically deformable member such as rubber or resin, so that each roller cannot be elastically deformed. A deformed member may be used. In the case of using a pressing means such as a pressing roller or a pressing head, or a pressing member, a roller, a round bar, a scraper, rubber, resin, sponge may be used instead of or in combination with the above-mentioned ones. or other pressing members, or a structure that is pressed by the blowing of air such as the atmosphere or a specific gas, and the pressing means or the pressing portion of the pressing member may be constituted by elastically deformable members such as rubber or resin. It may be composed of a member that cannot be elastically deformed. In the case of using a peeling means or a peeling member, it can also be composed of a plate-shaped member, a round bar, a roller, etc., and the supporting (holding) means or the supporting (holding) member, etc. In the case of the constructor supported or held by the support member, the holding means such as mechanical chuck or chuck cylinder, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, driving machine, etc. In the structure supported (held) by the supporting member, when a cutting means or a cutting blade is used, a cutting blade, laser cutting, ion beam, fire, heat, water may be used instead of or in combination with the above-mentioned examples. Cutting means such as pressure, heating wire, blowing of gas or liquid, etc., or by combining a suitable driving machine, the cutting means is moved and cutting is performed.

10‧‧‧Sheet attaching device 20‧‧‧Supporting means 21‧‧‧Inner platform 21A‧‧‧Support surface 22‧‧‧Outer platform 22A‧‧‧Remaining sheet supporting surface 22B‧‧‧Concave part 22C‧‧‧ Opening 22D‧‧‧Opening 23‧‧‧Direct Motor 23A‧‧‧Output Shaft 30‧‧‧Feeding Means 31‧‧‧Support Roller 32A‧‧‧Guide Roller 32B‧‧‧Guide Roller 33‧‧‧ Linear Motor 33A‧‧‧Output Shaft 33B‧‧‧Pushing Member 34A‧‧‧Dynamometer 34B‧‧‧Peeling Plate 35‧‧‧Drive Roller 35A‧‧‧Rotating Motor 35B‧‧‧Clamping Roller 36‧‧‧Recovery Roller 37‧‧‧Frame 38‧‧‧Linear Motor 39‧‧‧Linear Motor 40‧‧‧Pressing Means 41‧‧‧Linear Motor 41A‧‧‧Slide 41B‧‧‧Slider 42‧‧ ‧Bracket 43‧‧‧Direct motor 43A‧‧‧Output shaft 43B‧‧‧Bracket 44‧‧‧Press roller 50‧‧‧Attaching support means 51‧‧‧Cleaning means 51A‧‧‧Nozzle 52‧ ‧‧Pushing means 52A‧‧‧Annular member 53‧‧‧Moving means 53A‧‧‧Moving frame 53B‧‧‧Rotating motor 53C‧‧‧Drive pulley 53D‧‧‧Slave pulley 53E‧‧‧Conveyor belt 53F ‧‧‧Fixing Bracket 53G‧‧‧First Linking Member 53H‧‧‧Second Linking Member 54‧‧‧Support Member 61‧‧‧Articulated Robot Arm 61A‧‧‧Working Arm 70‧‧‧Recovering Means 71‧ ‧‧Frame 72‧‧‧Rotating Motor 73‧‧‧Drive Roller 74‧‧‧Clamping Roller 75‧‧‧Recovery Roller 80‧‧‧Conveying Means 81‧‧‧Suction Tool AS‧‧‧Adhering Sheet RL‧ ‧‧Releasable sheet RS‧‧‧Raw tape WF‧‧‧Wafer WF1‧‧‧Substrate US‧‧‧Residual sheet

Fig. 1 is a side view showing a sheet sticking apparatus according to an embodiment of the present invention. Fig. 2A is an explanatory diagram of the operation of the sheet sticking device. Fig. 2B is an explanatory diagram of the operation of the sheet sticking device. Fig. 3 is an explanatory diagram of the operation of the sheet sticking device.

10‧‧‧Sheet Attachment Device

20‧‧‧Support means

21‧‧‧Inner Platform

21A‧‧‧Support surface

22‧‧‧Outside platform

22A‧‧‧Residual sheet support surface

22B‧‧‧Recess

22C‧‧‧Opening

22D‧‧‧Opening

23‧‧‧Direct motor

23A‧‧‧Output shaft

30‧‧‧Means of Feeding

31‧‧‧Backup roller

32A‧‧‧Guide Roller

32B‧‧‧Guide Roller

33‧‧‧Direct motor

33A‧‧‧Output shaft

33B‧‧‧Pushing member

34A‧‧‧Dynamometer

34B‧‧‧Peel plate

35‧‧‧Drive Roller

35A‧‧‧Rotary Motor

35B‧‧‧Pinch Roller

36‧‧‧Recycling Roller

37‧‧‧Framework

38‧‧‧Linear motor

39‧‧‧Linear motor

40‧‧‧Pressing means

41‧‧‧Linear motor

41A‧‧‧Sliding

41B‧‧‧Sliding

42‧‧‧Bracket

43‧‧‧Direct motor

43A‧‧‧Output shaft

43B‧‧‧Bracket

44‧‧‧Press roller

50‧‧‧Attaching Support Means

51‧‧‧Cleaning methods

51A‧‧‧Nozzle

52‧‧‧Pressure means

52A‧‧‧Ring member

53‧‧‧Means of movement

53A‧‧‧Mobile Frame

53B‧‧‧Rotary Motor

53C‧‧‧Drive pulley

53D‧‧‧driven pulley

53E‧‧‧Conveyor belt

53F‧‧‧Fixing bracket

53G‧‧‧First connecting member

53H‧‧‧Second connecting member

54‧‧‧Support member

60‧‧‧Means of cutting

61‧‧‧Multi-joint robotic arm

61A‧‧‧Working Arm

70‧‧‧Means of recycling

71‧‧‧Framework

72‧‧‧Rotary motor

73‧‧‧Drive Roller

74‧‧‧Pinch Roller

75‧‧‧Recycling Roller

80‧‧‧Transportation

81‧‧‧Suction tool

AS‧‧‧adhesive sheet

RL‧‧‧Peeling sheet

RS‧‧‧Raw tape

WF‧‧‧Wafer

WF1‧‧‧veneer

US‧‧‧Residual flakes

Claims (3)

A sheet attaching device is characterized by comprising: a supporting means for supporting a body to be attached with a supporting surface; a feeding means for feeding an adhesive sheet; and a pressing means for pressing and attaching the adhesive sheet to the supporting surface supported on the supporting surface The body to be attached to; and the attachment support means is to integrate the cleaning means and the pressing means, and the cleaning means is to attach the support surface, the attached surface of the attached body, and the attachment to the attached body Next, at least one of the surfaces of the sheet is cleaned, and the pressing means is to press the outer peripheral portion of the body to be attached to the support surface. The sheet sticking device according to claim 1, comprising: cutting means for cutting the adhesive sheet stuck to the body to be stuck into a predetermined shape so that a portion of the adhesive sheet remains on the body to be stuck, the aforementioned The pressing means is provided so as to be capable of pressing the outer peripheral portion of the cut adhesive sheet portion to the body to be attached. A method for attaching a sheet, comprising: a supporting step for supporting a body to be attached with a support surface; a feeding step for feeding an adhesive sheet; and a pressing step for pressing and attaching the adhesive sheet to the support surface supported on the supporting surface The body to be attached to; the cleaning process, cleaning at least one of the support surface, the surface to be attached to the body, and the surface of the adhesive sheet attached to the body to be attached; and the pressing process, the The outer peripheral portion of the body to be attached before the adhesive sheet is attached is pressed to the support surface, and the cleaning step and the pressing step are carried out by an attaching support means integrating the cleaning means and the pressing means.

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