JP2013230532A - Protective tape cutting method and protective tape cutting apparatus of semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the floating and wrinkling of a protective tape in the vicinity of a cutting position which is stuck to a surface of a semiconductor wafer when the protective tape is cut along the outer shape of the wafer while removing dust that is generated from the protective tape when being cut.SOLUTION: In the process of cutting a protective tape T into the shape of a wafer W placed on a holding table by running a cutter blade along a cutter traveling groove 13 formed on a chuck table 5, the protective tape T is stuck to the surface of the wafer W by a pressure roller 51 while one end of the outside of a pressure roller 51 rolls around in the rear of a cutter blade as it intersects the edge of the wafer W supported by the holding surface of the chuck table 5 located outside beyond across the cutter traveling groove 13.

Description

  The present invention relates to a semiconductor wafer protective tape cutting method and a protective tape cutting device for cutting a protective tape affixed to the surface of a semiconductor wafer along the wafer outer shape.

The protective tape attached to the surface of a semiconductor wafer (hereinafter referred to as “wafer” as appropriate) is cut by the following configuration, for example. A cutter unit having a cutter blade is provided at the free end of a support arm that is pivotally driven around a vertical axis passing through the center of the wafer. As the support arm turns, the cutter blade is moved along the outer periphery of the wafer to cut the protective tape on the outer shape of the wafer (see Patent Document 1).
JP 2006-15453 A

  The edge of the outer periphery of the wafer is in a state in which the protective tape is difficult to adhere due to beveling. Therefore, when the protective tape is cut, the vicinity of the cut edge of the protective tape may rise from the wafer or wrinkles may occur. When the back grinding process is performed on the back surface of the wafer in such a state, there is a problem in that water and dust enter the cut surface and the ridge portion of the protective tape to contaminate and damage the circuit surface.

  Further, when the protective tape is cut, chips of the protective tape are generated and released as fine dust, which adheres to the protective tape. When background processing is performed in this state, there is a problem that the wafer thickness varies.

  The present invention has been made in view of such circumstances, and protects a semiconductor wafer capable of reliably adhering a protective tape in the vicinity of the cut edge when cutting the protective tape and removing dust generated during cutting. The main object of the present invention is to provide a tape cutting method and a protective tape cutting device.

  In order to achieve such an object, the present invention has the following configuration.

That is, the present invention is a semiconductor wafer protective tape cutting method for cutting a protective tape affixed to the surface of a semiconductor wafer along the outer shape of the semiconductor wafer,
A cutting process in which a cutter blade is caused to travel in a cutter running groove formed in the holding table, and the protective tape is cut into the shape of the semiconductor wafer on the holding table;
A protective tape by the pressing roller while abutting and supporting one end of the outer side of the pressing roller that intersects the edge of the semiconductor wafer and rolls behind the cutter blade with the holding surface of the outer holding table beyond the cutter running groove. Pasting process to paste the surface of the semiconductor wafer,
It is provided with.

  (Operation / Effect) According to this method, the pressing roller presses the portion cut by the cutter blade. Therefore, the lifting and wrinkles of the protective tape generated during cutting are crushed and brought into close contact with the wafer. Further, dust generated from the protective tape and adhering to the vicinity of the cut surface when the protective tape is cut can be collected by being attached to the surface of the pressing roller.

  Therefore, it is possible to prevent water and dust from entering between the wafer and the protective tape during the back-grinding process in the subsequent process, thereby avoiding contamination and damage to the circuit on the wafer surface. Further, since the dust adhering to the vicinity of the cut surface is removed, it is possible to avoid the variation in the thickness of the wafer caused by the adhesion of the dust.

  Furthermore, since one end of the pressing roller is in contact with and supported by the holding surface of the holding table outside the cutter running groove, excessive pressing is not applied to the wafer edge when the protective tape is pressed. Therefore, damage to the wafer edge can be avoided.

  In the above method, it is preferable that the pressure roller has an elastic layer on the outer periphery and rolls the surface of the protective tape while elastically biasing the pressure roller downward via an elastic material.

  In this case, it is possible to suppress an excessive pressure from being applied to the wafer edge by the elastic layer. That is, it is possible to apply the protective tape while applying an appropriate pressure to the wafer edge. Furthermore, dust on the protective tape can be attracted to the pressure roller side and collected by static electricity generated by friction between the elastic layer and the protective tape.

  In order to achieve such an object, the present invention has the following configuration.

That is, the present invention is a semiconductor wafer protective tape cutting device for cutting a protective tape attached to the surface of a semiconductor wafer along the outer shape of the semiconductor wafer,
A cutter blade for cutting a protective tape into the shape of the semiconductor wafer;
A pressure roller that rolls across the edge of the semiconductor wafer behind the cutter blade;
A holding surface for holding and holding the semiconductor wafer and for forming a cutter running groove on which the cutter blade runs, and abutting and supporting one end of a pressing roller that rolls out of the semiconductor wafer outside the cutter running groove. A holding table having
It is provided with.

  (Operation and Effect) According to this configuration, the pressing roller that rolls behind the cutter blade can roll while being supported by the holding surface of the holding table outside the cutter running groove. Therefore, the above method can be suitably performed.

  The pressure roller preferably has an elastic layer on the outer periphery.

  According to this structure, it can suppress that an excessive press is applied to a wafer edge by an elastic layer. That is, it is possible to apply the protective tape while applying an appropriate pressure to the wafer edge. Furthermore, dust on the protective tape can be attracted to the pressure roller side and collected by static electricity generated by friction between the elastic layer and the protective tape.

  For example, the following form can be used for the pressing roller.

  Set the semiconductor wafer mounting surface of the holding table and the holding surface outside the cutter running groove at the same height, and the portion facing the holding surface from the outer diameter of the portion of the pressing roller facing the wafer mounting surface The outer diameter of is made large.

  The mounting surface of the semiconductor wafer of the holding table and the holding surface outside the cutter running groove are set at the same height, and the pressing roller is formed in a tapered shape that increases in diameter as it goes outward from the center of the holding table. .

  The holding surface outside the cutter running groove is set higher than the semiconductor wafer mounting surface of the holding table by the thickness of the semiconductor wafer and the thickness of the protective tape, and the pressing roller is formed in a cylindrical shape.

  Since the form of these pressing rollers presses the protective tape while one end is abutted and supported by the holding surface of the holding table, the above-described embodiment method can be suitably implemented.

According to another embodiment of the present invention, a drive mechanism that relatively moves the cutter blade provided in the cutter unit around the center of the semiconductor wafer with respect to the outer periphery of the semiconductor wafer placed and held on the holding table;
It is mounted on the rear part of the cutter unit, and has the pressing roller that presses the protective tape in the vicinity of the rear part of the cutter blade, and the virtual line extending from the rotation axis of the pressing roller passes through the center of the semiconductor wafer. It is preferable to comprise a pressing unit.

  According to this configuration, although the pressing roller is provided in the vicinity of the rear of the cutter blade, the virtual line extending the rotation axis of the pressing roller passes through the center of the wafer, so that the frictional resistance with the protective tape is suppressed. In other words, the pressing roller rolls smoothly. Therefore, the protective tape can be securely attached to the wafer edge without reducing the load on the protective tape and the wafer and without forming the protective tape and wrinkles.

  Another embodiment of the present invention may have a configuration in which a plurality of pressing rollers are arranged close to each other.

  According to the semiconductor wafer protective tape cutting method and the protective tape cutting device of the present invention, the lifting or wrinkle of the protective tape generated near the cut edge in the process of cutting the protective tape can be immediately pressed by the pressing roller and attached to the wafer surface. it can. Therefore, the protection function of the wafer surface can be surely exhibited. That is, it is possible to reliably prevent water and dust from entering between the protective tape and the wafer during the back-flooding process in the subsequent process.

  Further, dust on the protective tape adhering to the vicinity of the cut opening of the protective tape can be collected by attaching it to the pressing roller. Therefore, the variation in the thickness of the wafer that has occurred during the back grinding process due to the adhesion of dust can be eliminated.

It is a perspective view which shows the whole protective tape sticking apparatus. It is a side view showing the whole tape cutting device. It is a perspective view which shows the principal part of a tape cutting device. It is a top view of a cutter unit. It is the front view which cut through a part of cutter unit vertically. It is a top view of a press unit. It is a top view of the press unit applied to the wafer of a different size from the wafer of FIG. It is a side view of a pressing unit. It is a front view of a pressing unit. It is a partially cutaway side view showing the periphery of the angle adjustment mechanism. It is a side view which shows the press roller of a press state. It is a front view which shows the sticking process of a protective tape. It is a front view which shows the sticking process of a protective tape. It is a front view which shows the sticking process of a protective tape. It is a front view which shows the sticking process of a protective tape. It is a side view which shows the press roller of a modification. It is a side view which shows the press roller of a modification. It is a side view which shows the press roller of a modification. It is a top view which shows the modification of a press unit.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing the overall configuration of the protective tape attaching device.

  This protective tape affixing apparatus includes a wafer supply / recovery unit 1 loaded with a cassette C containing a semiconductor wafer W (hereinafter referred to as “wafer” as appropriate), a wafer transfer mechanism 3 having a robot arm 2, an alignment stage 4, A chuck table 5 for mounting and holding a wafer W, a tape supply unit 6 for supplying a protective tape T for surface protection toward the wafer W, and a separator s from the protective tape T supplied from the tape supply unit 6 The separator collecting unit 7 to be collected, the adhering unit 8 for adhering the protective tape T to the wafer W placed on the chuck table 5 and sucked and held, and the protective tape T adhered to the wafer W along the outer shape of the wafer W A tape cutting device 9 for cutting and cutting, and a peeling unit 10 for peeling the unnecessary tape T ′ after being attached to the wafer W and cut. A tape recovery section 11 for recovering winding the unnecessary tape T 'that is peeled by the peeling unit 10 is provided. Hereinafter, a specific configuration of each structural unit and mechanism will be described below.

  The wafer supply / recovery unit 1 is configured so that two cassettes C can be placed in parallel. In each cassette C, a plurality of wafers W are inserted and stored in multiple stages in a horizontal posture with the circuit pattern surface (front surface) facing upward.

  The robot arm 2 provided in the wafer transfer mechanism 3 is configured to be able to move forward and backward horizontally, and can be driven and swung and moved up and down as a whole. The robot arm 2 has a horseshoe-shaped vacuum suction type wafer holder 2a at the tip thereof. Accordingly, the wafer holder 2a is inserted into the gap between the wafers W stored in multiple stages in the cassette C, the wafer W is sucked and held from the back surface, and the sucked and held wafer W is pulled out from the cassette C. Thereafter, the robot arm 2 transports the wafer W in the order of the alignment stage 4, the chuck table 5, and the wafer supply / collection unit 1.

  The alignment stage 4 aligns the wafer W placed by the wafer transfer mechanism 3 on the basis of notches and orientation flats formed on the outer periphery thereof.

  The chuck table 5 vacuum-sucks the wafer W transferred from the wafer transfer mechanism 6 and placed in a predetermined alignment posture. Further, on the upper surface of the chuck table 5, as shown in FIG. 2, the cutter blade 12 provided in the tape cutting device 9 is rotated along the outer shape of the wafer W to cut the protective tape T so as to cut the protective tape T. A groove 13 is formed. The holding surface outside the cutter blade 13 is set to the same height as the mounting surface of the wafer W. The arrival table corresponds to the holding table of the present invention.

  The tape supply unit 6 is configured to guide the protective tape T fed from the supply bobbin 14 around the guide roller 15 group and guide the protective tape T from which the separator s has been peeled off to the affixing unit 8. The supply bobbin 14 is configured to give an appropriate rotational resistance so that excessive tape feeding is not performed.

  In the separator collection unit 7, the collection bobbin 16 that winds up the separator s peeled from the protective tape T is driven to rotate in the winding direction.

  The affixing unit 8 includes an affixing roller 17 facing forward and horizontally. Further, as shown in FIG. 16, the affixing unit 8 is configured to reciprocate horizontally in the horizontal direction by a slide guide mechanism 18 and a screw feed type driving mechanism.

  The peeling unit 10 includes a peeling roller 19 that is horizontally facing forward. Further, the peeling unit 10 is configured to be reciprocated horizontally by a slide guide mechanism 18 and a screw feed type driving mechanism.

  The tape collection unit 11 is configured such that the collection bobbin 20 that takes up the unnecessary tape T ′ is driven to rotate in the take-up direction.

  As shown in FIG. 2, the tape cutting mechanism 9 is provided with a pair of support arms 22 arranged in parallel at the lower part of a movable base 21 that can be driven up and down so as to be able to turn around a vertical axis X located on the center of the chuck table 5. ing. A cutter blade 12 with a blade tip facing downward is mounted on a cutter unit 23 provided on the free end side of the support arm 22. Therefore, the cutter blade 12 is configured to move along the outer periphery of the wafer W to cut the protective tape T when the support arm 22 pivots about the longitudinal axis X. The detailed structure is shown in FIGS.

  The movable table 21 is screwed up and down along the vertical rail 25 by driving the motor 24 forward and reverse. A rotating shaft 26, which is mounted on the free end portion of the movable table 21 so as to be rotatable around the vertical axis X, is decelerated in conjunction with a motor 27 provided on the movable table 21 via two belts 28. ing. Accordingly, the rotation shaft 26 is rotated in a predetermined direction by the operation of the motor 27. A support arm 22 is supported by a lower end portion of a support member 29 extending downward from the rotating shaft 26 so as to be horizontally slidable. By adjusting the slide of the support arm 22, the turning radius from the vertical axis X, which is the turning center of the cutter blade 12, to the cutter blade 12 can be changed and adjusted in accordance with the radius of the wafer.

  As shown in FIGS. 3 and 4, a bracket 30 is fixed to the free end portion of the support arm 22. The cutter unit 23 is mounted and supported on the bracket 30.

  The cutter unit 23 includes a rotating member 31, a support bracket 32, a cutter support member 33, a bracket 34, a cutter holder 35, and the like.

  The rotating member 31 is supported by the bracket 30 so as to be rotatable around a longitudinal support shaft Y within a predetermined range. The support bracket 32 has a vertical wall shape and is connected to the lower surface of the end portion of the rotating member 31. The cutter support member 33 is connected to the side surface of the support bracket 32. The bracket 34 is supported by the cutter support member 33. The cutter holder 35 is attached to the bracket 34. The cutter blade 12 is fastened and fixed to the side surface of the cutter holder 35 so as to be replaceable.

  An operation flange 38 that rotates integrally with the rotation member 31 by engagement of the elongated hole 36 and the protrusion 37 is provided above the rotation member 31. By rotating the operation flange 38 by the air cylinder 39, the attitude of the entire cutter unit 23 relative to the support arm 22 around the longitudinal fulcrum Y is changed, and the angle (cutting angle) of the cutter blade 12 with respect to the moving direction is predetermined. It is possible to adjust within the range.

  The bracket 34 is slidably supported by the cutter support member 33 via the guide rail mechanism 40. That is, the bracket 34 linearly slides in the longitudinal direction of the support arm 22 (the front and back direction in FIG. 5). A spring 42 is stretched between the cutter support member 33 and the bracket 34. Due to the elastic restoring force of the spring 42, the bracket 34 is slid and biased in a direction approaching the vertical axis X (swivel center).

  Further, on the opposite side of the cutter unit 23 from the direction in which the cutter blade travels, a pressing unit 50, which will be described later, is provided with a pressing roller 51 for preventing lifting and wrinkles that occur when the protective tape T is cut. .

  The detailed structure of the pressing unit 50 is shown in FIGS.

  The pressing unit 50 includes a horizontal main bracket 52, a connecting portion 52 a erected integrally from a corner of the main bracket 52, and a pivotable pivotable around a vertical support shaft P below the horizontal bracket 52. A pivot bracket 53 that is supported and connected, and a pressing roller 51 that is pivotally supported around a horizontal rotation axis Q are provided below the pivot bracket 53.

  A square block-like boss portion 54 is fixed to the lower surface of the rotating bracket 53. A swing arm 55 is pivotally attached to the boss portion 54 so as to swing up and down about the horizontal support shaft R. A pressing roller 51 is pivotally supported at one end of the swing arm so as to be freely rotatable.

  As shown in FIGS. 8 and 9, a spring 57 is stretched across the other end of the swing arm 55 and a spring receiving member 56 attached to the end side of the rotating bracket 53. The spring 57 biases one end of the swing arm 55 downward, and applies a downward bias to the pressing roller 51 provided at the other end of the swing arm 55. The swing arm 55 that is biased to swing is received by a stopper 58 provided in the boss portion 54. Therefore, the pressing roller 51 is limited to stop at a predetermined height. Note that the stopper 58 corresponds to the height adjusting portion of the present invention.

  As shown in FIGS. 6 and 7, the rotation bracket 53 has two rotation positions so that an imaginary line extending the rotation axis Q of the pressing roller 51 corresponding to the size of the wafer W passes through the wafer center X. It can be positioned and held. That is, since the rotation axis Q of the pressing roller 51 is orthogonal to the tangential direction of the wafer outer periphery, the pressing roller 51 can roll and move in the tangential direction of the wafer outer periphery.

  FIG. 10 shows the angle adjustment mechanism. That is, as shown in FIGS. 6 and 7, a positioning block 59 having an outer peripheral surface formed in an arcuate surface centering on the longitudinal support shaft P is fixed to the upper surface of the main bracket 52. Returning to FIG. 10, the angle adjustment block 60 is fixed to the upper surface of the rotation bracket 53 so as to face the arc surface of the positioning block 59. A ball 61 is incorporated in the angle adjusting block 60 through a spring 62 in a protruding and biased state. The ball 61 is biased and engaged with any one of the V notches 63 formed at two positions in the circumferential direction of the arc surface in the positioning block 59, so that the rotating bracket 53 is positioned at two positions corresponding to the size of the wafer W. Can be positioned.

  The main bracket 52 is formed with an arc-shaped long hole 64 centered on the vertical axis P. By tightening a tightening bolt 65 with a handle inserted into the long hole 64 into the rotating bracket 53, the rotating bracket 53 positioned by the angle adjusting mechanism is fixed.

  FIG. 11 shows the pressing state of the protective tape T by the pressing roller 51. The pressing roller 51 has an elastic layer made of an elastic material such as rubber having an appropriate hardness on its peripheral surface, and is formed into a cylinder having the same diameter over the entire length. The pressing roller 51 is set to a length extending from the vicinity of the outer periphery of the wafer placement surface of the chuck table 5 to the outside of the cutter running groove 13. The pressing roller 5 in the pressing action state is received and supported across the inside and outside of the cutter running groove 13 while being elastically deformed. Therefore, the pressing roller 13 is restrained by the elastic layer from applying excessive pressing to the wafer edge protruding into the cutter running groove 13.

  Next, a series of operations for attaching and cutting the protective tape T on the surface of the wafer W using the above-described embodiment apparatus will be described with reference to FIGS.

  When a sticking command is issued, first, the robot arm 2 in the wafer transfer mechanism 3 is moved toward the cassette C placed and loaded on the cassette base 12. The wafer holding part 2a is inserted into the gap between the wafers accommodated in the cassette C. The wafer holding unit 2 a carries out the wafer W by sucking and holding it from the back surface (lower surface), and transfers the taken wafer W to the alignment stage 4.

  The wafer W placed on the alignment stage 4 is aligned using a notch n (see FIG. 1) formed on the outer periphery of the wafer W. The aligned wafer W is unloaded again by the robot arm 2 and placed on the chuck table 5.

  The wafer W placed on the chuck table 5 is sucked and held in a state of being aligned so that the center thereof is on the center of the chuck table 5. At this time, as shown in FIG. 12, the pasting unit 8 and the peeling unit 10 are in the initial position on the left side. Further, the cutter blade 12 of the tape cutting mechanism 9 is in the upper initial position.

  Next, as shown by the phantom lines in FIG. 12, the application roller 17 of the application unit 8 is lowered. The affixing unit 8 moves on the wafer W forward (rightward in FIG. 10) while pressing the protective tape T downward by the affixing roller 17. Affixed to the top surface.

  As shown in FIG. 13, when the affixing unit 8 reaches the end position, the cutter blade 12 that has been waiting upward is lowered. The cutter blade 12 is pierced by the protective tape T on the cutter running groove 13 of the chuck table 5. At this time, the cutter blade 12 is pressed against the outer peripheral edge of the wafer by the spring 42. At the same time, the pressing roller in the pressing unit 50 is brought into contact with the protective tape T with an appropriate pressure.

  When the pressing setting of the cutter blade 12 to the outer peripheral edge of the wafer at the cutting start position is completed, the support arm 22 is rotated in a predetermined direction as shown in FIG. Along with this rotation, the cutter blade 12 rotates while sliding on the outer peripheral edge of the wafer, and cuts the protective tape T along the outer periphery of the wafer. At the same time, the pressing roller 51 of the pressing unit 50 rolls while appropriately pressing the vicinity of the cut surface of the protective tape T from the surface.

  When the tape cutting along the wafer outer periphery is completed, the cutter blade 12 is raised to the original standby position as shown in FIG. Next, while the peeling unit 10 moves forward, the unnecessary tape T 'cut and cut on the wafer W is turned up and peeled off.

  When the peeling unit 10 reaches the peeling completion position, the peeling unit 10 and the pasting unit 8 move backward and return to the initial position. At this time, the unnecessary tape T ′ is wound around the recovery bobbin 20 and a certain amount of the protective tape T is fed out from the tape supply unit 6.

  When the above-described tape sticking operation is completed, after the suction on the chuck table 5 is released, the wafer W that has been pasted is transferred to the wafer holding part 2a of the robot arm 2 and the cassette C of the wafer supply / collection part 1 is transferred. It is inserted and collected.

  Thus, one tape sticking process is completed, and thereafter, the above operations are sequentially repeated in response to loading of a new wafer.

  According to the above implementation apparatus, the pressing roller 51 can be disposed in the vicinity of the rear of the cutter blade 12 by providing the pressing unit 50 behind the cutter unit 23. Furthermore, it can be arranged so that a virtual line obtained by extending the rotation axis Q of the pressing roller 51 surely passes through the vertical axis X of the chuck table 5 corresponding to the center of the wafer W. Therefore, since the distance between the cutter blade W and the pressing roller 51 is short, the floating and wrinkles of the protective tape T generated at the time of cutting can be immediately crushed and securely attached to the wafer W. In addition, since the friction between the pressing roller 51 set in this way and the protective tape T is suppressed, it is possible to suppress a load on the protective tape T and the wafer W due to excessive pressing accompanying the friction. As a result, damage to the wafer edge can also be avoided.

  The present invention can also be implemented in the following forms.

  (1) As shown in FIG. 16, the pressing roller 51 may have a configuration in which cylinders having different diameters are combined. That is, when the wafer mounting surface of the chuck table 5 and the table surface outside the cutter running groove 13 are set to the same height, the tip side of the pressing roller 51 acting on the table surface outside the cutter running groove 13 is arranged. The diameter is increased by the thickness of the wafer W and the thickness of the protective tape T. According to this configuration, the pressing roller 51 can apply a uniform pressing to the protective tape T and the table surface outside the cutter running groove 13, and avoid damage to the edge of the wafer W.

  (2) As shown in FIG. 17, the pressing roller 51 may have a tapered cylindrical shape. That is, when the wafer mounting surface of the chuck table 5 and the table surface outside the cutter running groove 13 are set to the same height, the tip side of the pressing roller 51 is configured to have a tapered shape having a larger diameter than the base end side. . According to this configuration, the pressing roller 51 can apply a substantially uniform pressing to the outer surface of the protective tape T and the cutter running groove 13, and avoid damage to the edge of the wafer W.

  (3) As shown in FIG. 18, the pressing roller 51 may have a straight shape having the same diameter over the entire length. That is, when the table surface outside the cutter running groove 13 of the chuck table 5 is set higher than the wafer placement surface by the thickness of the wafer W and the thickness of the protective tape T, the pressing roller 51 is protected. Uniform pressing can be applied to the table surface outside the tape T and the cutter running groove 13, and damage to the edge of the wafer W can be avoided.

  (4) As shown in FIG. 19, the swing arm 55 may be provided with two front and rear pressing rollers 51. In this case, an imaginary line obtained by extending the rotation axis Q of the front pressing roller 51 is set in a posture passing through the center of the wafer. According to this configuration, the pressing roller 51 on the front side smoothly rolls and presses without dragging the protective tape T, and then rolls and presses again on the pressing roller 51 on the rear side. It can be surely prevented.

  Further, the rotation axis of the rear pressure roller 51 does not pass through the center of the wafer W. That is, since the pressing roller 51 rolls in a state that is not orthogonal to the tangential direction of the outer periphery of the wafer like the front pressing roller 51, when it is made of rubber having a large friction coefficient, the frictional force with the protective tape T Becomes larger. Therefore, dust on the protective tape T generated at the time of cutting can be removed by electrostatic adsorption.

  (5) The above-described embodiment apparatus can adjust the height of the pressing roller 51 by changing the height of the stopper 58.

  (6) The present invention can also be applied to a configuration in which the protective tape T is cut by rotating the wafer W side with respect to the fixed cutter blade 12.

DESCRIPTION OF SYMBOLS 5 ... Chuck table 12 ... Cutter blade 13 ... Cutter running groove 23 ... Cutter unit 50 ... Press unit 51 ... Press roller X ... Wafer center W ... Semiconductor wafer T ... Protective tape Q ... Rotating shaft

Claims (9)

A semiconductor wafer protective tape cutting method for cutting a protective tape attached to a surface of a semiconductor wafer along the outer shape of the semiconductor wafer,
A cutting process in which a cutter blade is caused to travel in a cutter running groove formed in the holding table, and the protective tape is cut into the shape of the semiconductor wafer on the holding table;
A protective tape by the pressing roller while abutting and supporting one end of the outer side of the pressing roller that intersects the edge of the semiconductor wafer and rolls behind the cutter blade with the holding surface of the outer holding table beyond the cutter running groove. Pasting process to paste the surface of the semiconductor wafer,
A method for cutting a protective tape of a semiconductor wafer, comprising: In the semiconductor wafer protective tape cutting method according to claim 1,
The pressing roller has an elastic layer on its outer periphery, and rolls the surface of the protective tape while elastically biasing the pressing roller downward via an elastic material. A protective tape cutting device for a semiconductor wafer that cuts a protective tape attached to the surface of the semiconductor wafer along the outer shape of the semiconductor wafer,
A cutter blade for cutting a protective tape into the shape of the semiconductor wafer;
A pressure roller that rolls across the edge of the semiconductor wafer behind the cutter blade;
A holding surface for holding and holding the semiconductor wafer and for forming a cutter running groove on which the cutter blade runs, and abutting and supporting one end of a pressing roller that rolls out of the semiconductor wafer outside the cutter running groove. A holding table having
A protective tape cutting device for a semiconductor wafer, comprising: In the semiconductor wafer protective tape cutting device according to claim 3,
The said press roller has an elastic layer in outer periphery. The protective tape cutting device of the semiconductor wafer characterized by the above-mentioned. In the semiconductor wafer protective tape cutting device according to claim 3 or 4,
The mounting surface of the semiconductor wafer of the holding table and the holding surface outside the cutter running groove are set to the same height, and the holding roller faces the holding surface by the outer diameter of the portion of the pressing roller that faces the wafer mounting surface. A protective tape cutting device for a semiconductor wafer, characterized in that the outer diameter of the portion is formed to be large. In the semiconductor wafer protective tape cutting device according to claim 3 or 4,
The mounting surface of the semiconductor wafer of the holding table and the holding surface outside the cutter running groove are set to the same height, and the pressing roller is formed in a tapered shape that increases in diameter from the center of the holding table toward the outside. A protective tape cutting device for semiconductor wafers. In the semiconductor wafer protective tape cutting device according to claim 3 or 4,
The holding surface outside the cutter running groove is set to be higher than the mounting surface of the semiconductor wafer of the holding table by the thickness of the semiconductor wafer and the thickness of the protective tape, and the pressing roller is formed in a cylindrical shape. Semiconductor wafer protection tape cutting device. In the semiconductor wafer protective tape cutting device according to any one of claims 3 to 7,
A drive mechanism for relatively rotating the cutter blade provided in the cutter unit around the center of the semiconductor wafer with respect to the outer periphery of the semiconductor wafer placed and held on the holding table;
It is mounted on the rear part of the cutter unit, and has the pressing roller that presses the protective tape in the vicinity of the rear part of the cutter blade, and the virtual line extending from the rotation axis of the pressing roller passes through the center of the semiconductor wafer. A semiconductor wafer protective tape cutting device comprising a pressing unit. In the semiconductor wafer protective tape cutting device according to any one of claims 3 to 8,
A protective tape cutting device for a semiconductor wafer, wherein a plurality of pressing rollers are arranged close to each other in the front-rear direction.

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