JP2006015453A - Method of cutting semiconductor wafer masking tape, and device for cutting masking tape - Google Patents

Method of cutting semiconductor wafer masking tape, and device for cutting masking tape Download PDF

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JP2006015453A
JP2006015453A JP2004195679A JP2004195679A JP2006015453A JP 2006015453 A JP2006015453 A JP 2006015453A JP 2004195679 A JP2004195679 A JP 2004195679A JP 2004195679 A JP2004195679 A JP 2004195679A JP 2006015453 A JP2006015453 A JP 2006015453A
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wafer
cutter blade
semiconductor wafer
notch
cutting
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JP2004195679A
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JP4640763B2 (en
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Masayuki Yamamoto
雅之 山本
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2004195679A priority Critical patent/JP4640763B2/en
Priority to KR1020050044777A priority patent/KR101140052B1/en
Priority to TW94122027A priority patent/TWI330582B/en
Priority to CNB2005100818660A priority patent/CN100471632C/en
Publication of JP2006015453A publication Critical patent/JP2006015453A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting a semiconductor wafer masking tape, by which a masking tape stuck to a notched semiconductor wafer is cut along a wafer peripheral surface, in a manner eliminating exposure and remains of the masking tape in a notch to a large extent, to thereby minimize adhesion of dust etc. to the masking tape. <P>SOLUTION: The method of cutting the semiconductor wafer masking tape is carried out by relatively moving a cutter blade 12 along the peripheral surface of the semiconductor wafer W, to thereby cut away the masking tape stuck to the surface of the semiconductor wafer W, along the shape of the wafer. According to the method, the cutter blade is relatively moved along the peripheral surface of the semiconductor wafer W having a positioning notch n formed therein. Specifically at the time of cutting a front half of the notch n concaved in the wafer peripheral surface, the cutter blade 12 is automatically rotated so as to direct its cutting edge at the wafer center, while at the time of cutting a rear half of the notch n, the cutter blade 12 is automatically rotated so as to direct its cutting edge at the wafer periphery. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、半導体ウエハの外周に沿ってカッタ刃を相対走行させて半導体ウエハの表面に貼り付けられた保護テープをウエハ外形に沿って切り抜くための方法と装置に関する。   The present invention relates to a method and an apparatus for cutting a protective tape attached to a surface of a semiconductor wafer along the outer shape of the semiconductor wafer by relatively running a cutter blade along the outer periphery of the semiconductor wafer.

上記保護テープの切断手段としては、例えば特許文献１に開示されているように、テーブルに載置保持されたウエハの表面に保護テープを供給して貼付けた後、保護テープにカッタ刃を突き刺した状態で、テーブルを回転させることでウエハの外周に沿ってカッタ刃を相対走行させ、保護テープをウエハ外周に沿って切断するよう構成したものが知られている。
特開２００４−２５４０２号公報 As the cutting means for the protective tape, for example, as disclosed in Patent Document 1, after supplying and pasting the protective tape to the surface of the wafer placed and held on the table, a cutter blade was pierced into the protective tape. It is known that the cutter blade is relatively moved along the outer periphery of the wafer by rotating the table in this state, and the protective tape is cut along the outer periphery of the wafer.
JP 2004-25402 A

一般に、ウエハの外周には位置決め用のオリエンテーションフラットやノッチが形成されており、オリエンテーションフラットを備えたウエハの場合、カッタ刃をウエハ中心側にスライド変位させる等することで直線的なオリエンテーションフラットに沿って相対走行させることが可能となる。しかし、ウエハの外周に形成されるノッチは、周方向での幅および半径方向の深さが数ｍｍ程度の小さいものであるために、このノッチ形成部位においてはカッタ刃がウエハ周方向に沿って通過してしまい、ノッチの内部に保護テープの一部が臨む状態でテープ切断処理が行われるものとなっていた。   In general, an orientation flat or notch for positioning is formed on the outer periphery of the wafer. In the case of a wafer equipped with an orientation flat, the cutter blade is slid to the wafer center side, etc. along the linear orientation flat. Can be relatively driven. However, since the notch formed on the outer periphery of the wafer has a small width in the circumferential direction and a depth in the radial direction of about several millimeters, the cutter blade is located along the circumferential direction of the wafer at this notch forming portion. The tape cutting process is performed with a part of the protective tape facing the inside of the notch.

しかし、ノッチの内部に臨む保護テープ部分は、その粘着面が露出した状態であるために、バックグラインド処理工程において発生した粉塵がノッチの内部で露出している粘着面に付着し、付着した粉塵がその後の処理工程において脱落して周囲を汚損するおそれがあった。また、ノッチ内部の保護テープ部分が粉塵で覆われると、ノッチを光学的に検出してウエハの位置合わせをする際の障害にもなる。   However, the part of the protective tape facing the inside of the notch is in the state where the adhesive surface is exposed, so the dust generated in the back grinding process adheres to the adhesive surface exposed inside the notch, and the attached dust However, there is a risk that it will fall off and soil the surroundings in the subsequent processing step. Further, if the protective tape portion inside the notch is covered with dust, it becomes an obstacle when the wafer is aligned by optically detecting the notch.

本発明はこのような実情に着目してなされたものであって、ノッチ付きの半導体ウエハの保護テープ切断処理において、ノッチの内部に保護テープが大きく露出して残存することをなくして、粉塵の付着などを抑制できるようにすることを目的としている。   The present invention has been made by paying attention to such a situation, and in the protective tape cutting process of a semiconductor wafer with a notch, the protective tape is not exposed to a large extent inside the notch, and the dust is removed. The purpose is to be able to suppress adhesion and the like.

第１の発明は、半導体ウエハの外周に沿ってカッタ刃を走行させて半導体ウエハの表面に貼り付けられた保護テープをウエハ外形に沿って切り抜く半導体ウエハの保護テープ切断方法において、位置決め用のノッチを外周に備えた半導体ウエハの外周に沿ってカッタ刃を走行させるとともに、ウエハ外周に凹入形成されたノッチの前半においては、カッタ刃をその刃先がウエハ中心に向かうように自転回動させるとともに、ノッチの後半においてはカッタ刃をその刃先がウエハ外周に向かうように自転回動させることを特徴とする。   According to a first aspect of the present invention, there is provided a semiconductor wafer protective tape cutting method in which a cutter tape is run along the outer periphery of a semiconductor wafer to cut out a protective tape affixed to the surface of the semiconductor wafer along the outer shape of the semiconductor wafer. The cutter blade runs along the outer periphery of the semiconductor wafer provided on the outer periphery, and in the first half of the notch recessedly formed on the outer periphery of the wafer, the cutter blade is rotated and rotated so that the blade edge faces the wafer center. In the latter half of the notch, the cutter blade is rotated and rotated so that the blade edge faces the outer periphery of the wafer.

これによると、カッタ刃がノッチ形成部位に至ると自転して刃先がノッチの内部にまで入り込むことになり、ノッチの内部に残る保護テープ部分は少量となり、露出する粘着面も僅かなものとなる。   According to this, when the cutter blade reaches the notch formation part, it rotates and the blade tip enters into the inside of the notch, the amount of the protective tape remaining inside the notch is small, and the exposed adhesive surface is also slight. .

従って、第１の発明方法によると、保護テープ切断処理の済んだウエハのノッチの内部に残存する保護テープ部分の粘着面に、研磨粉塵などが付着することが抑制され、以後の工程で粉塵が脱落して周囲を汚損することを効果的に抑制することができる。   Therefore, according to the first invention method, it is possible to suppress polishing dust and the like from adhering to the adhesive surface of the protective tape portion remaining inside the notch of the wafer that has been subjected to the protective tape cutting process. It is possible to effectively suppress dropping off and fouling the surroundings.

第２の発明は、半導体ウエハの外周に沿ってカッタ刃を相対走行させて半導体ウエハの表面に貼り付けられた保護テープをウエハ外形に沿って切り抜く半導体ウエハの保護テープ切断装置において、前記カッタ刃を、ウエハ中心を通る軸心と平行でカッタ刃の背縁近くに位置する軸心を中心に自転可能支持する支持手段と、位置決め用のノッチを外周に備えた半導体ウエハの外周に沿ってカッタ刃を相対走行させるカッタ刃走行手段と、ウエハ外周に凹入形成されたノッチの前半においては、カッタ刃をその刃先がウエハ中心に向かうように自転回動させるとともに、ノッチの後半においてはカッタ刃をその刃先がウエハ外周に向かうように自転回動させるカッタ刃自転回動手段とを備えてあることを特徴とする。   According to a second aspect of the present invention, there is provided a protective tape cutting apparatus for a semiconductor wafer, wherein the cutter blade is relatively moved along the outer periphery of the semiconductor wafer and the protective tape attached to the surface of the semiconductor wafer is cut along the outer shape of the semiconductor wafer. Is supported along the outer periphery of the semiconductor wafer provided with a support means for rotating about an axis that is parallel to an axis passing through the wafer center and close to the back edge of the cutter blade, and a notch for positioning. The cutter blade traveling means for relatively moving the blade and the first half of the notch recessedly formed on the outer periphery of the wafer rotate the cutter blade so that the blade tip is directed toward the center of the wafer, and the cutter blade in the second half of the notch. And a cutter blade rotation rotation means for rotating the rotation of the blade so that the blade edge faces the outer periphery of the wafer.

上記構成によると、カッタ刃は、ノッチの前半においては、その刃先がウエハ中心にむかうように自転してノッチの内部にまで入り込むとともに、ノッチの後半においては、その刃先がウエハ外周に向かうように逆方向に自転しながら進行するので、ノッチの内部に残る保護テープ部分は少量となり、露出する粘着面も僅かなものとなる。   According to the above configuration, the cutter blade rotates into the notch in the first half of the notch so that the blade edge goes to the center of the wafer, and enters the inside of the notch, and in the latter half of the notch, the blade edge faces the outer periphery of the wafer. Since it advances while rotating in the reverse direction, the amount of the protective tape remaining inside the notch is small, and the exposed adhesive surface is also slight.

本発明によれば、カッタ刃が正逆方向に自転しながらノッチ内を進行してノッチ内部の保護テープを切断するので、ノッチ内部に残る保護テープ部分は少量となり、露出する粘着面も僅かなものとなる。その結果、ノッチの内部に残存する保護テープ部分の粘着面に、研磨粉塵などが付着することが抑制され、以後の工程で粉塵が脱落して周囲を汚損したり、ノッチ部分の光学的検出を阻害したりすることがない。   According to the present invention, the cutter blade advances in the notch while rotating in the forward and reverse directions to cut the protective tape inside the notch, so that the protective tape portion remaining inside the notch is small and the exposed adhesive surface is also slight. It will be a thing. As a result, it is possible to prevent abrasive dust from adhering to the adhesive surface of the protective tape part remaining inside the notch. There is no hindrance.

以下、図面を参照して本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図１は、保護テープ貼付け装置の全体構成を示す斜視図である。この保護テープ貼付け装置は、半導体ウエハ（以下、単に「ウエハ」と略称する）Ｗを収納したカセットＣが装填されるウエハ供給/回収部１、ロボットアーム２を備えたウエハ搬送機構３、アライメントステージ４、ウエハＷを載置して吸着保持するチャックテーブル５、ウエハＷに向けて表面保護用の保護テープＴを供給するテープ供給部６、テープ供給部６から供給されたセパレータ付きの保護テープＴからセパレータｓを剥離回収するセパレータ回収部７、チャックテーブル５に載置されて吸着保持されたウエハＷに保護テープＴを貼付ける貼付けユニット８、ウエハＷに貼付けられた保護テープＴをウエハＷの外形に沿って切り抜き切断するテープ切断機構９、ウエハＷに貼付けて切断処理した後の不要テープＴ’を剥離する剥離ユニット１０、剥離ユニット１０で剥離された不要テープＴ’を巻き取り回収するテープ回収部１１、等が備えられており、上記各構造部および機構についての具体的な構成を以下に説明する。   FIG. 1 is a perspective view showing the overall configuration of the protective tape attaching device. This protective tape affixing device includes a wafer supply / recovery unit 1 loaded with a cassette C containing a semiconductor wafer (hereinafter simply referred to as “wafer”) W, a wafer transfer mechanism 3 having a robot arm 2, an alignment stage. 4. Chuck table 5 on which the wafer W is placed and sucked and held, a tape supply unit 6 for supplying a protective tape T for surface protection toward the wafer W, and a protective tape T with a separator supplied from the tape supply unit 6 The separator s from the separator W, the sticking unit 8 for sticking the protective tape T to the wafer W placed on the chuck table 5 and sucked and held, and the protective tape T attached to the wafer W on the wafer W. A tape cutting mechanism 9 that cuts and cuts along the outer shape, and a peeling unit that peels off the unnecessary tape T ′ after being attached to the wafer W and cut. A knit 10, a tape collecting unit 11 for winding and collecting the unnecessary tape T 'peeled off by the peeling unit 10, and the like are provided, and a specific configuration of each of the structural units and mechanisms will be described below.

ウエハ供給/回収部１には２台のカセットＣを並列して装填可能であり、各カセットＣには、配線パターン面を上向きにした多数枚のウエハＷが多段に水平姿勢で差込み収納されている。   The wafer supply / collection unit 1 can be loaded with two cassettes C in parallel. In each cassette C, a large number of wafers W with the wiring pattern surface facing upward are inserted and stored in multiple stages in a horizontal posture. Yes.

ウエハ搬送機構３に備えられたロボットアーム２は、水平に進退移動可能に構成されるとともに、全体が駆動旋回および昇降可能となっている。そして、ロボットアーム２の先端には、馬蹄形をした真空吸着式のウエハ保持部２ａが備えられており、カセットＣに多段に収納されたウエハＷ同士の間隙にウエハ保持部２ａを差し入れてウエハＷを裏面から吸着保持し、吸着保持したウエハＷをカセットＣから引き出して、アライメントステージ４、チャックテーブル５、および、ウエハ供給/回収部１の順に搬送するようになっている。   The robot arm 2 provided in the wafer transfer mechanism 3 is configured to be able to move forward and backward horizontally, and can be driven and swung up and down as a whole. At the tip of the robot arm 2, a horseshoe-shaped vacuum suction type wafer holder 2a is provided, and the wafer holder 2a is inserted into the gap between the wafers W stored in multiple stages in the cassette C. Are sucked and held from the back surface, and the wafer W held by suction is pulled out from the cassette C and conveyed in the order of the alignment stage 4, the chuck table 5, and the wafer supply / recovery unit 1.

アライメントステージ４は、ウエハ搬送機構３によって搬入載置されたウエハＷを、その外周に形成されたノッチｎに基づいて位置合わせを行うようになっている。   The alignment stage 4 aligns the wafer W loaded and placed by the wafer transport mechanism 3 based on the notch n formed on the outer periphery thereof.

チャックテーブル５は、ウエハ搬送機構３から移載されて所定の位置合わせ姿勢で載置されたウエハＷを真空吸着するようになっている。また、このチャックテーブル５の上面には、後述するテープ切断機構９に備えたカッタ刃１２をウエハＷの外形に沿って旋回移動させて保護テープＴを切断するためにカッタ走行溝１３が形成されている。   The chuck table 5 is configured to vacuum-suck the wafer W transferred from the wafer transfer mechanism 3 and placed in a predetermined alignment posture. Further, a cutter running groove 13 is formed on the upper surface of the chuck table 5 for cutting the protective tape T by rotating a cutter blade 12 provided in a tape cutting mechanism 9 described later along the outer shape of the wafer W. ing.

テープ供給部６は、供給ボビン１４から繰り出されたセパレータ付きの保護テープＴをガイドローラ１５群に巻回案内し、セパレータｓを剥離した保護テープＴを貼付けユニット８に導くよう構成されており、供給ボビン１４に適度の回転抵抗を与えて過剰なテープ繰り出しが行われないように構成されている。   The tape supply unit 6 is configured to guide the protective tape T with a separator drawn out from the supply bobbin 14 around the guide roller 15 group and guide the protective tape T from which the separator s has been peeled off to the affixing unit 8. The supply bobbin 14 is configured to give an appropriate rotational resistance so that excessive tape feeding is not performed.

セパレータ回収部７は、保護テープＴから剥離されたセパレータｓを巻き取る回収ボビン１６が巻き取り方向に回転駆動されるようになっている。   In the separator collection unit 7, the collection bobbin 16 that winds up the separator s peeled from the protective tape T is driven to rotate in the winding direction.

貼付けユニット８には貼付けローラ１７が前向き水平に備えられており、スライド案内機構１８および図示されないネジ送り式の駆動機構によって左右水平に往復駆動されるようになっている。   The affixing unit 8 is provided with an affixing roller 17 that faces forward and is horizontally reciprocated by a slide guide mechanism 18 and a screw feed type driving mechanism (not shown).

剥離ユニット１０には剥離ローラ１９が前向き水平に備えられており、前記スライド案内機構１８および図示されないネジ送り式の駆動機構によって左右水平に往復駆動されるようになっている。   The peeling unit 10 is provided with a peeling roller 19 that is horizontally oriented forward, and is reciprocated horizontally by the slide guide mechanism 18 and a screw feed type driving mechanism (not shown).

テープ回収部１１は、不要テープＴ’を巻き取る回収ボビン２０が巻き取り方向に回転駆動されるようになっている。   The tape collecting unit 11 is configured so that the collecting bobbin 20 that takes up the unnecessary tape T ′ is driven to rotate in the winding direction.

テープ切断機構９は、基本的には、駆動昇降可能な可動台２１の下部に、チャックテーブル５の中心上に位置する縦軸心Ｘ周りに駆動旋回可能に一対の支持アーム２２が並列装備されるとともに、この支持アーム２２の遊端側に備えたカッタユニット２３に、刃先を下向きにした前記カッタ刃１２が装着され、支持アーム２２が縦軸心Ｘ周りに旋回することでカッタ刃１２がウエハＷの外周に沿って走行して保護テープＴを切り抜くよう構成されており、その詳細な構造が図２〜図６に示されている。   The tape cutting mechanism 9 is basically equipped with a pair of support arms 22 arranged in parallel at the lower part of a movable base 21 that can be driven up and down so as to be capable of driving and turning about a longitudinal axis X located on the center of the chuck table 5. At the same time, the cutter blade 12 with the blade tip facing downward is mounted on the cutter unit 23 provided on the free end side of the support arm 22, and the support blade 22 pivots around the longitudinal axis X so that the cutter blade 12 is It is configured to run along the outer periphery of the wafer W and cut out the protective tape T, and its detailed structure is shown in FIGS.

図２に示すように、可動台２１は、モータ２４を正逆回転駆動することで縦レール２５に沿ってねじ送り昇降されるようになっており、この可動台２１の遊端部に前記縦軸心Ｘ周りに回動可能に装備された回動軸２６が、可動台２１の上に配備されたモータ２７に２本のベルト２８を介して減速連動され、モータ２７の作動によって回動軸２６が所定の方向に低速で回動されるようになっている。そして、この回動軸２６から下方に延出された支持部材２９の下端部に、支持アーム２２が水平方向スライド調節可能に貫通支持されており、支持アーム２２のスライド調節によってカッタ刃１２の縦軸心Ｘからの距離、つまり、カッタ刃１２の旋回半径をウエハ径に対応して変更調節することが可能となっている。   As shown in FIG. 2, the movable base 21 is screwed up and down along the vertical rail 25 by rotating the motor 24 forward and backward, and the vertical end of the movable base 21 is A rotating shaft 26 that is provided so as to be rotatable about an axis X is linked to a motor 27 provided on the movable base 21 by means of two belts 28, and the rotating shaft is operated by the operation of the motor 27. 26 is rotated in a predetermined direction at a low speed. A support arm 22 is supported by a lower end portion of a support member 29 extending downward from the rotation shaft 26 so as to be horizontally slidable. By adjusting the slide of the support arm 22, the vertical length of the cutter blade 12 is supported. The distance from the axis X, that is, the turning radius of the cutter blade 12, can be changed and adjusted in accordance with the wafer diameter.

図３に示すように、支持アーム２２の遊端部にはブラケット３０が固着され、このブラケット３０にカッタユニット２３が装着支持されている。カッタユニット２３は、ブラケット３０に縦軸心Ｙ周りに一定小範囲内で回動可能に支持された回動部材３１、回動部材３１の端部下面に連結された縦壁状の支持ブラケット３２、支持ブラケット３２の側面に連結されたカッタ支持部材３３、カッタ支持部材３３に支持されたブラケット３４、このブラケット３４に取り付けられたカッタホルダ３５、等から構成され、カッタ刃１２はカッタホルダ３５の側面にネジ連結されている。   As shown in FIG. 3, a bracket 30 is fixed to the free end portion of the support arm 22, and the cutter unit 23 is mounted and supported on the bracket 30. The cutter unit 23 is supported by a bracket 30 so as to be rotatable around a longitudinal axis Y within a certain small range, and a vertical wall-shaped support bracket 32 connected to the lower surface of the end of the rotation member 31. The cutter support member 33 is connected to the side surface of the support bracket 32, the bracket 34 is supported by the cutter support member 33, the cutter holder 35 is attached to the bracket 34, and the cutter blade 12 is formed on the side surface of the cutter holder 35. Screw connected.

ここで、回動部材３１の上方には、図４に示すように、長孔３６と突起３７との係合によって回動部材３１と一体に回動する操作フランジ３８が配備されており、この操作フランジ３８をエアーシリンダ３９によって回動することで、支持アーム２２に対するカッタユニット２３全体の縦軸心Ｙ周りでの姿勢を変更して、走行方向に対するカッタ刃１２の角度を所定の小範囲内で調整することが可能となっている。   Here, as shown in FIG. 4, an operation flange 38 that rotates integrally with the rotation member 31 by the engagement of the elongated hole 36 and the protrusion 37 is provided above the rotation member 31. By rotating the operation flange 38 by the air cylinder 39, the attitude of the entire cutter unit 23 relative to the support arm 22 around the longitudinal axis Y is changed, and the angle of the cutter blade 12 with respect to the traveling direction is within a predetermined small range. It is possible to adjust with.

また、カッタ支持部材３３に対してブラケット３４は支持アーム２２の長手方向（図５においては紙面表裏方向）にスライド移動可能に支持されるとともに、図示されていないバネによって前記縦軸心Ｘに近づく方向にスライド付勢されている。   Further, the bracket 34 is supported so as to be slidable in the longitudinal direction of the support arm 22 (the front and back direction in FIG. 5) with respect to the cutter support member 33, and approaches the longitudinal axis X by a spring (not shown). The slide is biased in the direction.

また、カッタホルダ３５は、カッタ刃１２の背縁を通る縦軸心Ｚ周りに自転可能にブラケット３４に支持されるとともに、カッタ刃１２の刃先が前記縦軸心Ｘに近づく方向にバネ４１によって回動付勢されている。   The cutter holder 35 is supported by the bracket 34 so as to be able to rotate about the vertical axis Z passing through the back edge of the cutter blade 12 and is rotated by a spring 41 in a direction in which the cutting edge of the cutter blade 12 approaches the vertical axis X. It is energized.

なお、カッタユニット２３を回動可能に支持するブラケット３０は、本発明における支持手段に、モータ２７は本発明におけるカッタ刃走行手段に、エアーシリンダ３９およびバネ４１は本発明におけるカッタ刃自転回動手段に、それぞれ相当する。   The bracket 30 that rotatably supports the cutter unit 23 is a support means in the present invention, the motor 27 is a cutter blade traveling means in the present invention, and the air cylinder 39 and the spring 41 are the rotation rotation of the cutter blade in the present invention. It corresponds to each means.

次に、上記実施例装置を用いて保護テープＴをウエハＷの表面に貼付けるための一連の基本動作を図６〜図９に基づいて説明する。   Next, a series of basic operations for attaching the protective tape T to the surface of the wafer W using the above-described embodiment apparatus will be described with reference to FIGS.

貼付け指令が出されると、先ず、ウエハ搬送機構３におけるロボットアーム２がウエハ供給／回収部１に載置装填されたカセットＣに向けて移動され、ウエハ保持部２ａがカセットＣに収容されているウエハ同士の隙間に挿入され、ウエハ保持部２ａでウエハＷを裏面（下面）から吸着保持して搬出し、取り出したウエハＷをアライメントステージ４に移載する。   When a sticking command is issued, first, the robot arm 2 in the wafer transfer mechanism 3 is moved toward the cassette C placed and loaded on the wafer supply / recovery unit 1, and the wafer holding unit 2 a is accommodated in the cassette C. The wafer W is inserted into the gap between the wafers, and the wafer W is sucked and held from the back surface (lower surface) by the wafer holding unit 2 a, and the removed wafer W is transferred to the alignment stage 4.

アライメントステージ４に載置されたウエハＷは、ウエハＷの外周に形成されているノッチｎを利用して位置合わせされ、位置合わせのすんだウエハＷは再びロボットアーム２によって搬出されてチャックテーブル５に載置される。   The wafer W placed on the alignment stage 4 is aligned using the notch n formed on the outer periphery of the wafer W, and the aligned wafer W is unloaded again by the robot arm 2 and the chuck table 5. Placed on.

チャックテーブル５に載置されたウエハＷは、その中心がチャックテーブル５の中心上にあるように位置合わせされた状態で吸着保持される。この時、図６に示すように、貼付けユニット８と剥離ユニット１０は左側の初期位置に、また、テープ切断機構９のカッタ刃１２は上方の初期位置でそれぞれ待機している。   The wafer W placed on the chuck table 5 is sucked and held in a state of being aligned so that the center thereof is on the center of the chuck table 5. At this time, as shown in FIG. 6, the affixing unit 8 and the peeling unit 10 are waiting at the left initial position, and the cutter blade 12 of the tape cutting mechanism 9 is waiting at the upper initial position.

次に、図６中の仮想線で示すように、貼付けユニット８の貼付けローラ１７が下降されるとともに、この貼付けローラ１７で保護テープＴを下方に押圧しながらウエハＷ上を前方（図６では右方向）に転動し、これによって保護テープＴがウエハＷの表面全体に貼付けられる。   Next, as shown by the phantom lines in FIG. 6, the affixing roller 17 of the affixing unit 8 is lowered, and the wafer W is pushed forward (in FIG. 6) while pressing the protective tape T downward with the affixing roller 17. The protective tape T is applied to the entire surface of the wafer W.

図７に示すように、貼付けユニット８が終端位置に達すると、上方に待機していたカッタ刃１２が下降されて、チャックテーブル５のカッタ走行溝１３において保護テープＴに突き刺される。   As shown in FIG. 7, when the affixing unit 8 reaches the end position, the cutter blade 12 waiting upward is lowered and pierced by the protective tape T in the cutter running groove 13 of the chuck table 5.

カッタ刃１２が所定の切断高さ位置まで下降されて停止すると、図８に示すように、支持アーム２２が所定の方向に回転され、これに伴ってカッタ刃１２が縦軸心Ｘ周りに旋回移動して保護テープＴがウエハ外形に沿って切断される。   When the cutter blade 12 is lowered to a predetermined cutting height position and stopped, as shown in FIG. 8, the support arm 22 is rotated in a predetermined direction, and accordingly, the cutter blade 12 is swung around the vertical axis X. The protective tape T is moved and cut along the wafer outer shape.

ウエハＷの外周に沿ったテープ切断が終了すると、図９に示すように、カッタ刃１２は元の待機位置まで上昇され、次いで、剥離ユニット１０が前方へ移動しながらウエハＷ上で切り抜き切断されて残った不要テープＴ’を巻き上げ剥離する。   When the tape cutting along the outer periphery of the wafer W is completed, as shown in FIG. 9, the cutter blade 12 is raised to the original standby position, and then the peeling unit 10 is cut and cut on the wafer W while moving forward. The remaining unnecessary tape T ′ is wound up and peeled off.

剥離ユニット１０が剥離作業の終了位置に達すると、剥離ユニット１０と貼付けユニット８とが逆方向に移動して初期位置に復帰する。この時、不要テープＴ’が回収ボビン２０に巻き取られるとともに、一定量の保護テープＴがテープ供給部６から繰り出される。   When the peeling unit 10 reaches the end position of the peeling operation, the peeling unit 10 and the pasting unit 8 move in the opposite directions and return to the initial position. At this time, the unnecessary tape T ′ is wound around the recovery bobbin 20 and a certain amount of the protective tape T is fed out from the tape supply unit 6.

テープ貼付け作動が終了すると、チャックテーブル５における吸着が解除された後、貼付け処理のすんだウエハＷはロボットアーム２のウエハ保持部２ａに移載されてウエハ供給/回収部１のカセットＣに差込み回収される。   When the tape sticking operation is completed, after the suction on the chuck table 5 is released, the wafer W that has been stuck is transferred to the wafer holding part 2a of the robot arm 2 and inserted into the cassette C of the wafer supply / collection part 1. To be recovered.

以上で１回のテープ貼付け処理が完了し、以後、上記作動を順次繰返してゆく。   Thus, one tape attaching process is completed, and thereafter, the above operations are sequentially repeated.

そして、上記保護テープ貼付け工程のうちのテープ切断工程においては、ウエハＷの外周に形成されたノッチｎでのテープ切断が以下のようにして行われる。なお、前記ノッチｎは、周方向の開放幅が４〜５ｍｍ、深さが３ｍｍ程度に凹入湾曲されている。   Then, in the tape cutting step of the protective tape attaching step, tape cutting at the notch n formed on the outer periphery of the wafer W is performed as follows. The notch n is concavely curved with an opening width in the circumferential direction of 4 to 5 mm and a depth of about 3 mm.

ウエハＷのノッチｎ以外の周縁部をカッタ刃１２が進行する間は、エアーシリンダ３９のロッドが伸びることにより、図１０中の（ａ）に示すように、カッタ刃１２は、ウエハＷの外周縁に対して適度の切り込み傾斜角度をもって周方向に摺接移動してゆく。カッタ刃１２がノッチｎの上手側の端部に至ると、エアーシリンダ３９のロッドが収縮することにより、カッタ刃１２が内側方向へ自転自在の状態になる。これにより、図１０中の（ｂ）に示すように、ウエハＷの外周縁から外れたカッタ刃１２は、その刃先がカッタ刃旋回中心方向にバネ付勢力によって自転しながら前進することで、刃先がノッチｎ内に食い込みながら進行する。刃先がノッチｎの底部付近に達すると、カッタ刃１２を進行させながら、再びエアーシリンダ３９のロッドを伸ばすことにより、カッタ刃１２を逆向きに自転させてウエハ外周に向けて移行させる（図１０の（ｃ）参照）。カッタ刃１２がノッチｎの下手側の端部に至ると、以後、図１０中の（ｄ）に示すように、カッタ刃１２は再びウエハＷの外周縁に沿って進行してゆく。   While the cutter blade 12 travels along the peripheral edge other than the notch n of the wafer W, the rod of the air cylinder 39 extends, so that the cutter blade 12 moves outside the wafer W as shown in FIG. It slides and moves in the circumferential direction with an appropriate cutting inclination angle with respect to the periphery. When the cutter blade 12 reaches the upper end of the notch n, the rod of the air cylinder 39 contracts so that the cutter blade 12 can rotate inward. As a result, as shown in FIG. 10B, the cutter blade 12 deviated from the outer peripheral edge of the wafer W advances while the blade tip rotates in the direction of the cutter blade turning center by the spring biasing force. Advances while biting into the notch n. When the cutting edge reaches the vicinity of the bottom of the notch n, the cutter blade 12 is rotated again in a reverse direction by moving the rod of the air cylinder 39 again while the cutter blade 12 is advanced (FIG. 10). (See (c)). When the cutter blade 12 reaches the lower end of the notch n, the cutter blade 12 proceeds again along the outer peripheral edge of the wafer W, as shown in FIG.

このようにカッタ刃１２が自転してノッチｎに食い込み移動するとともに、ノッチｎの後半部では逆方向に自転することで、ノッチｎ内の保護テープＴはえぐり取られて、ノッチｎ内に切り残された残存テープｔは少ないものとなる。   In this way, the cutter blade 12 rotates and bites into the notch n and moves in the reverse direction in the latter half of the notch n, so that the protective tape T in the notch n is removed and cut into the notch n. The remaining tape t that remains is small.

なお、本発明は以下のような形態で実施することも可能である。   The present invention can also be implemented in the following forms.

（１）カッタホルダ３５をパルスモータなどのアクチュエータで自転駆動可能に構成し、予め入力されたプログラムに基づいてカッタ刃１２をノッチｎの内縁に沿って自転しながら移動するように制御することでノッチｎ内の残存テープｔを更に少なくすることができる。   (1) The cutter holder 35 is configured to be driven to rotate by an actuator such as a pulse motor, and the cutter blade 12 is controlled to move while rotating along the inner edge of the notch n based on a program inputted in advance. The remaining tape t in n can be further reduced.

（２）本発明方法は、カッタ刃１２に対してウエハＷを回転させてテープ切断を行う形態で実施することも可能である。   (2) The method of the present invention can also be carried out in a form in which the wafer W is rotated with respect to the cutter blade 12 to perform tape cutting.

本発明の一実施例に係る保護テープ貼付け装置の全体を示す斜視図である。It is a perspective view which shows the whole protective tape sticking apparatus which concerns on one Example of this invention. テープ切断機構の正面図である。It is a front view of a tape cutting mechanism. テープ切断機構の要部の斜視図である。It is a perspective view of the principal part of a tape cutting mechanism. テープ切断機構の要部の平面図である。It is a top view of the principal part of a tape cutting mechanism. テープ切断機構の要部の側面図である。It is a side view of the principal part of a tape cutting mechanism. 実施例装置の動作説明図である。It is operation | movement explanatory drawing of an Example apparatus. 実施例装置の動作説明図である。It is operation | movement explanatory drawing of an Example apparatus. 実施例装置の動作説明図である。It is operation | movement explanatory drawing of an Example apparatus. 実施例装置の動作説明図である。It is operation | movement explanatory drawing of an Example apparatus. ノッチでのテープ切断作動を示す平面図であるIt is a top view which shows the tape cutting operation | movement by a notch.

符号の説明Explanation of symbols

１２ カッタ刃
３０ ブラケット
３９ エアーシリンダ
４１ バネ
ｎ ノッチ
Ｗ 半導体ウエハ
Ｔ 保護テープ
Ｘ 軸心
Ｚ 軸心
12 Cutter blade 30 Bracket 39 Air cylinder 41 Spring n Notch W Semiconductor wafer T Protective tape X Axis center Z Axis center

Claims (2)

半導体ウエハの外周に沿ってカッタ刃を相対走行させて半導体ウエハの表面に貼り付けられた保護テープをウエハ外形に沿って切り抜く半導体ウエハの保護テープ切断方法において、
位置決め用のノッチを外周に備えた半導体ウエハの外周に沿ってカッタ刃を相対走行させるとともに、ウエハ外周に凹入形成されたノッチの前半においては、カッタ刃をその刃先がウエハ中心に向かうように自転回動させるとともに、ノッチの後半においてはカッタ刃をその刃先がウエハ外周に向かうように自転回動させることを特徴とする半導体ウエハの保護テープの切断方法。 In the semiconductor wafer protective tape cutting method of cutting the protective tape attached to the surface of the semiconductor wafer along the outer shape of the semiconductor wafer by relatively running the cutter blade along the outer periphery of the semiconductor wafer,
The cutter blade is relatively moved along the outer periphery of the semiconductor wafer provided with a positioning notch on the outer periphery, and the cutter blade is directed toward the wafer center in the first half of the notch formed in the outer periphery of the wafer. A method for cutting a protective tape for a semiconductor wafer, wherein the cutter blade is rotated and rotated in the latter half of the notch so that the cutter blade rotates toward the outer periphery of the wafer. 半導体ウエハの外周に沿ってカッタ刃を相対走行させて半導体ウエハの表面に貼り付けられた保護テープをウエハ外形に沿って切り抜く半導体ウエハの保護テープ切断装置において、
前記カッタ刃を、ウエハ中心を通る軸心と平行でカッタ刃の背縁近くに位置する軸心を中心に自転可能支持する支持手段と、
位置決め用のノッチを外周に備えた半導体ウエハの外周に沿ってカッタ刃を相対走行させるカッタ刃走行手段と、
ウエハ外周に凹入形成されたノッチの前半においては、カッタ刃をその刃先がウエハ中心に向かうように自転回動させるとともに、ノッチの後半においてはカッタ刃をその刃先がウエハ外周に向かうように自転回動させるカッタ刃自転回動手段と
を備えてあることを特徴とする半導体ウエハの保護テープ切断装置。
In a semiconductor wafer protective tape cutting device for cutting a protective tape attached to the surface of a semiconductor wafer along the outer periphery of the semiconductor wafer by relatively running the cutter blade along the outer periphery of the semiconductor wafer,
Supporting means for supporting the cutter blade in a rotatable manner around an axis parallel to an axis passing through the wafer center and located near the back edge of the cutter blade;
Cutter blade traveling means for relatively traveling the cutter blade along the outer periphery of the semiconductor wafer provided with a notch for positioning on the outer periphery;
In the first half of the notch recessed in the outer periphery of the wafer, the cutter blade is rotated so that the cutting edge is directed toward the wafer center, and in the latter half of the notch, the cutter blade is rotated so that the cutting edge is directed toward the wafer outer periphery. A protective tape cutting device for a semiconductor wafer, comprising: a cutter blade rotating and rotating means for rotating.
JP2004195679A 2004-07-01 2004-07-01 Semiconductor wafer protective tape cutting method and protective tape cutting device Expired - Fee Related JP4640763B2 (en)

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JP2004195679A JP4640763B2 (en) 2004-07-01 2004-07-01 Semiconductor wafer protective tape cutting method and protective tape cutting device
KR1020050044777A KR101140052B1 (en) 2004-07-01 2005-05-27 Method and apparatus for cutting protective tape of semiconductor wafer
TW94122027A TWI330582B (en) 2004-07-01 2005-06-30 Method and apparatus for cutting protective tape of semiconductor wafer
CNB2005100818660A CN100471632C (en) 2004-07-01 2005-07-01 Protective belt cutting method and device for semiconductor wafer

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JP2009125871A (en) * 2007-11-26 2009-06-11 Nitto Denko Corp Protection tape cutting method and protection tape cutting apparatus of semiconductor wafer
US8109185B2 (en) 2007-11-26 2012-02-07 Nitto Denko Corporation Method for cutting protective tape of semiconductor wafer and protective tape cutting device
CN101569886B (en) * 2008-05-02 2012-05-23 日东电工株式会社 Cutter blade cleaning method and cutter blade cleaning device, as well as adhesive tape joining apparatus including the same
JP2010087279A (en) * 2008-09-30 2010-04-15 Panasonic Electric Works Co Ltd Method of forming protective film for wafer
JP2013230532A (en) * 2012-05-01 2013-11-14 Nitto Denko Corp Protective tape cutting method and protective tape cutting apparatus of semiconductor wafer
TWI631607B (en) * 2017-08-09 2018-08-01 志聖工業股份有限公司 Film cutting device and film cutting method thereof

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TW200615102A (en) 2006-05-16
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CN1715019A (en) 2006-01-04
CN100471632C (en) 2009-03-25
JP4640763B2 (en) 2011-03-02

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