1330582 九、發明說明： 【發明所屬之技術領域】 本發明係關於用以使切割刀沿半導體晶圓外周相對移 動，將貼附在半導體晶圓表面的保護帶沿晶圓外形切除的方 法和裝置。 【先前技術】 先前，眾所周知有一保護帶切斷裝置，係將保護帶供給 到載置保持於台的晶圓表面並貼附後，於將切割刀突刺在保 φ護帶之狀態，使台轉動而使切割刀沿晶圓外周相對移動，沿 晶圓外周切斷保護帶之構造者。（例如參照日本特開 2004-25402 號公報） 一般而言，晶圓外周形成有定位用的定向平面或凹槽 (notch)。具備定向平面的晶圓之情形，係以進行使切割 刀在晶圓中心側滑動變位等的方式，而可沿直線的定向平面 相對移動。但是，形成在晶圓外周的凹槽係周方向的寬度及 半徑方向的深度爲大約數nun之較小者，因此切割刀係於該凹 φ槽形成部位，切割刀係沿晶圓周方向通過。因而，形成爲在 保護帶的一部分面臨凹槽內部之狀態進行帶切斷處理者。 但是，面臨凹槽內部的保護帶部分係其黏接面爲露出之 狀態，因此背面硏磨處理步驟中產生的粉塵附著在露出於凹 槽內部的黏接面，且附著的粉麈在其後的處理步驟中有脫落 而污損周圍之虞。且，凹槽內部的保護帶部分被粉塵覆蓋 時，亦將成爲光學式檢測凹槽以進行晶圓之對位時的障礙。 【發明內容】 1330582 因而，殘留在凹槽內部的保護帶部分變成少量，亦僅略 微露出黏接帶。其結果抑制硏磨粉塵等附著在殘留於凹槽內 '部的保護帶部分的黏接面，而於以後的步驟中不會有粉塵脫 落污損周圍，或阻礙凹槽部分的光學式檢測之情形。 此外，切割刀移動裝置可舉出例如具備：使切割刀在半 導體晶圓周圍旋轉的第1驅動裝置之構造，或包含用於保持 半導體晶圓的保持裝置，和用於使保持裝置隨保持於該保持 裝置的半導體晶圓中心旋轉而轉動的第2驅動裝置之構造 _等。 且，本發明之半導體晶圓保護帶切斷裝置係包含調節切 割刀旋轉半徑的調節裝置爲較佳。根據該構造，可根據半導 體晶圓的外形變更調整切割刀的旋轉半徑。再者，包含彈性 體藉以對切割刀彈性施力，使其接近半導體晶圓的中心軸爲 較佳。 【實施方式】 以下，參照圖式說明本發明之一實施例。 # 第1圖係表示保護帶貼附裝置全體構造立體圖。該保護 帶貼附裝置具備：晶圓供給/回收部1，用於裝塡收容有半導 體晶圓（以下簡稱「晶圓」）W的卡匣C;具備機械臂2的 晶圓搬送機構3;調準夾片台（alignment stage) 4;夾片台 (chuck table) 5，用於載置晶圓W且吸附保持；帶供給部 6’用於朝向晶圓W供給保護表面用的保護帶T;隔離件回 收部7’用於將帶供給部6供給的具有隔離件的保護帶T的 隔離件s剝離且回收：貼附單元8，用於將保護帶T貼附在 1330582 載置於夾片台5且被吸附保持的晶圓W;帶切斷機構9,用 於將貼附在晶圓W的保護帶T沿晶圓W的外形切除而切 斷；剝離單元10，用於將貼附在晶圓W而已切斷處理後的 廢棄帶Τ’剝離；及帶回收部1 1，用於將以剝離單元10剝離 的廢棄帶Τ’捲繞回收；以下說明關於上述各構造部及機構 之具體構成。 晶圓供給/回收部1可並排裝塡2台卡匣C。於各卡匣C 以多段且水平姿勢插入收容有配線圖案面朝上的多數片晶 •圓W β 晶圓搬送機構3具備的機械臂2係構成可水平地進退移 動，並全體可驅動旋轉及升降。然後，機械臂2的前端具備 馬蹄形的真空吸附式晶圓保持部2a，將晶圓保持部2a插入 以多段收容在卡匣C的晶圓W彼此之間隙，且從背面吸附 保持晶圓W，再從卡匣C拉出已吸附保持的晶圓W，依調 準夾片台4、夾片台5、以及晶圓供給/回收部1之順序搬送。 調準夾片台4係將已藉由晶圓搬送機構3搬入載置的晶 φ圓W，根據已形成在其外周的凹槽n進行對位。 夾片台5係將從晶圓搬送機構3移載且以預定之對位姿 勢載置的晶圓W真空吸附。且，於該夾片台5上面，如第2 圖所示地形成有切割刀移動溝13，用於使後述的帶切斷機 構9具備的切割刀12沿晶圓w的外形旋轉移動，而切斷保 護帶T。 回到第1圖，帶供給部6係構成將供給軸14送出的具 有隔離件的保護帶T，捲繞引導至引導滾筒15群，且將已 1330582 剝離隔離件S的保護帶T引導至貼附單元8。於該供給軸14 構成賦予適度的轉動阻力，使其不會進行過剩的帶送出。 隔離件回收部7係形成回收軸16朝捲繞方向轉動驅 動，該回收軸16係用於捲繞從保護帶Τ剝離的隔離件s。 如第6圖所示，於貼附單元8朝前方水平地具備貼附滾 筒17,藉由滑動引導機構18及未圖示的螺旋進給式驅動機 構，朝左右方水平地往返驅動》 於剝離單元10朝前方水平地具備剝離滾筒19,藉由滑 φ動引導機構18及未圖示的螺絲輸送式驅動機構，朝左右方 水平地往返驅動。 帶回收部11係捲取廢棄帶Τ’的回收軸20朝捲取方向 轉動驅動。 帶切斷機構9係如第1圖所示，基本上在可驅動升降的 可動台21下部並排裝備一對支持臂22,該支持臂22係可 在位於夾片台5中心上的縱軸心X周圍驅動旋轉。且，構 成在該支持臂22的活動端側具備的切割刀單元23,裝設有 φ使刀尖朝下的切割刀12,以支持臂22在縱軸心X周圍旋轉 的方式，使切割刀12沿晶圓W外周移動而切除保護帶Τ。 其詳細構造於第2圖至第6圖表示》 如第2圖所示，可動台21係形成以正逆轉動驅動馬達 24的方式，沿縱軌25螺旋進給升降。在該可動台21的活 動端部裝備成可在前述縱軸心X周圍轉動的轉動軸26，係 於配備在可動台21上的馬達27藉由2條傳動帶（belt)2 8減 速連動，藉由馬達27的動作使轉動軸26在預定方向以低速 -10- 1330582 轉動。然後，在從該轉動軸26延伸到下方的支持構件29的 下端部，貫通支持有可水平方向滑動調節的支持臂22 ’藉 由支持臂22的滑動調節使從切割刀12的縱軸心X的距離， 亦即切割刀12的旋轉半徑可根據晶圓徑變更調節° 此外，轉動軸26、馬達27、以及傳動帶28構成本發明 中的切割刀移動裝置及第1驅動裝置。且’支持臂22相當 於本發明的調節裝置。 如第3圖所示，支持臂22的活動端部固設有托架30» φ該托架30裝設支持有切割刀單元23。切割刀單元23包含： 轉動構件31，支持成可於托架30，在縱軸心Υ周圍以一定 的小範圍轉動；縱壁狀的支持托架32,連結在轉動構件31 的端部下面；切割刀支持構件3 3，連結在支持托架32的側 面；托架34，支持在切割刀支持構件33;及切割刀保持件 35，安裝在該托架34。切割刀12係螺旋連結在切割刀保持 件3 5的側面。 此處，轉動構件3 1上方係如第4圖所示，配備有操作 0凸緣38,藉由長孔36和突起37之扣合而與轉動構件31 — 體地轉動。使該操作凸緣38藉由氣筒39轉動，藉以使切割 刀單元23全體對支持臂22變更在縱軸心Υ周圍的姿勢， 而可在預定的小範圍內調整切割刀12對移動方向的角度。 且，托架34對切割刀支持構件33係支持成可沿支持臂 22的長方向（第5圖中紙面正背面方向）滑動而移動，並 藉由未圖示的彈簧朝接近縱軸心X的方向滑動施力。 且，切割保持構件35係可在通過切割刀12的背緣之縱 -11- 1330582 軸心Z周圍自轉地支持在托架34,並藉由彈簧41將切割刀 12的刀尖朝接近縱軸心X的方向轉動施力。此外，彈簧41 '相當於本發明的彈性體。因而彈性體不限定於彈簧，例如亦 可利用樹脂性的傳動帶或橡膠等。 此外，將切割刀單元23可轉動地支持的支持托架30係 相當於本發明的支持裝置，轉動構件3卜長孔36、突起37、 氣筒39及彈簧41係構成本發明中的切割刀自轉轉動裝置。 接著，根據第6圖至第9圖說明爲了利用上述實施例裝 φ置將保護帶Τ貼附在晶圓W表面的一連串基本動作。 輸出貼附指令時，首先將晶圓搬送機構3中的機械臂2 移動向載置塡充在晶圓供給/回收部1的卡匣C，將晶圓保 持部2a插入收容在卡匣C的晶圓彼此之間隙。機械臂2係 藉由其晶圓保持部2a將晶圓W從背面（下面）吸附保持且 搬出，再將取出的晶圓W移載到調準夾片台4。 載置在調準夾片台4的晶圓W係利用形成在晶圓W外 周的凹槽η對位。再度藉由機械臂2搬出已完成對位之晶圓 _…而載置在夾片台5。 載置在夾片台5的晶圓W係於對位成其中心位於夾片 台5的中心上之狀態，被吸附保持。此時，如第6圖所示， 貼附單元8和剝離單元1 0係於左側的初期位置，且帶切斷 機構9的切割刀12係於上方的初期位置，各自待機。 接著，如第6圖中的假設線所示，將貼附單元8的貼附 滾筒17降下’並一面以該貼附滾筒17將保護帶T朝下方推 壓，一面將晶圓W上面轉動到前方（於第6圖爲右方），1330582 IX. Description of the Invention: The present invention relates to a method and apparatus for cutting a protective tape attached to a surface of a semiconductor wafer along a wafer profile for relatively moving the dicing blade along the periphery of the semiconductor wafer. . [Prior Art] As described above, it is known that a protective tape cutting device supplies a protective tape to a surface of a wafer placed on a stage and attached thereto, and then spurs the cutting blade in a state of protecting the tape to rotate the table. The cutter is moved relative to the outer circumference of the wafer to cut the structure of the protective tape along the outer circumference of the wafer. (For example, refer to Japanese Laid-Open Patent Publication No. 2004-25402.) Generally, an orientation flat or a notch for positioning is formed on the outer circumference of the wafer. In the case of a wafer having an orientation flat, the cutter is slidably displaced on the center side of the wafer, and is relatively movable along a linear orientation plane. However, the width of the groove in the circumferential direction of the wafer and the depth in the radial direction are smaller than the number nun. Therefore, the dicing blade is attached to the groove φ groove forming portion, and the dicing blade passes in the wafer circumferential direction. Therefore, it is formed such that the tape cutting process is performed in a state where a part of the protective tape faces the inside of the groove. However, the portion of the protective tape facing the inside of the groove is in a state in which the bonding surface is exposed, so that the dust generated in the back honing treatment step adheres to the bonding surface exposed inside the groove, and the attached whitefly is followed. In the processing steps, there is falling off and staining the surrounding area. Moreover, when the protective tape portion inside the groove is covered with dust, it will also become an obstacle when the optical detecting groove is used for the alignment of the wafer. SUMMARY OF THE INVENTION 1330582 Thus, the portion of the protective tape remaining inside the groove becomes a small amount, and only the adhesive tape is slightly exposed. As a result, it is suppressed that the honing dust or the like adheres to the bonding surface of the protective tape portion remaining in the 'portion of the groove, and in the subsequent step, there is no dust falling off the stained surface, or the optical detection of the groove portion is hindered. situation. Further, the cutter moving device may include, for example, a configuration including a first driving device that rotates the cutter around the semiconductor wafer, or a holding device for holding the semiconductor wafer, and a holding device for holding the holding device The structure of the second driving device that rotates the center of the semiconductor wafer of the holding device and rotates. Further, the semiconductor wafer protection tape cutting device of the present invention preferably includes an adjusting device for adjusting the radius of rotation of the cutting blade. According to this configuration, the radius of rotation of the cutter can be adjusted in accordance with the outer shape of the semiconductor wafer. Furthermore, it is preferred to include an elastomer to elastically apply force to the dicing blade to approximate the central axis of the semiconductor wafer. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. #第一图图 is a perspective view showing the entire structure of the protective tape attaching device. The protective tape attaching device includes a wafer supply/recovery unit 1 for mounting a cassette C containing a semiconductor wafer (hereinafter referred to as "wafer") W, and a wafer transfer mechanism 3 including a robot arm 2; Aligning an alignment stage 4; a chuck table 5 for placing the wafer W and adsorbing and holding; the tape supply portion 6' for supplying a protective tape for the protective surface toward the wafer W The spacer recovery portion 7' is used for peeling and recovering the spacer s of the protective tape T having the spacer supplied from the tape supply portion 6: the attaching unit 8 for attaching the protective tape T to the 1330582 a wafer W that is adsorbed and held by the wafer stage 5; a tape cutting mechanism 9 for cutting and cutting the protective tape T attached to the wafer W along the outer shape of the wafer W; and a peeling unit 10 for attaching The waste tape Τ' peeled off after the wafer W has been cut and processed; and the tape collecting portion 1 1 is used for winding and recycling the waste tape Τ which is peeled off by the peeling unit 10; the following describes each of the above-described structural portions and mechanisms The specific composition. The wafer supply/recovery unit 1 can mount two cassettes C side by side. In each of the cassettes C, a plurality of platelets in which the wiring pattern faces upward are inserted in a plurality of stages and in a horizontal posture. The robot arm 2 provided in the wafer transport mechanism 3 is configured to be horizontally movable forward and backward, and is rotatable in all directions. Lifting. Then, the front end of the robot arm 2 is provided with a horseshoe-shaped vacuum suction type wafer holding portion 2a, and the wafer holding portion 2a is inserted into a gap between the wafers W accommodated in the cassette C in a plurality of stages, and the wafer W is sucked and held from the back surface. Then, the wafer W that has been adsorbed and held is pulled out from the cassette C, and is transferred in the order of the alignment stage 4, the chuck stage 5, and the wafer supply/recovery unit 1. The alignment chuck stage 4 carries the crystal φ circle W that has been placed by the wafer transfer mechanism 3, and is aligned in accordance with the groove n formed on the outer circumference thereof. The chuck table 5 vacuum-adsorbs the wafer W placed on the wafer transfer mechanism 3 and placed in a predetermined alignment posture. A cutter moving groove 13 is formed on the upper surface of the chuck table 5 as shown in Fig. 2, and the cutter blade 12 provided in the tape cutting mechanism 9 to be described later is rotationally moved along the outer shape of the wafer w. Cut off the protective tape T. Returning to Fig. 1, the tape supply unit 6 constitutes a protective tape T having a separator which is fed out from the supply shaft 14, and is guided to the group of the guide rollers 15 and guides the protective tape T of the 1330582 peeling spacer S to the sticker. Attached to unit 8. The supply shaft 14 is configured to impart a moderate rotational resistance so that excess tape is not sent out. The separator collecting portion 7 is configured to drive the recovery shaft 16 to be driven in the winding direction for winding the separator s which is peeled off from the protective tape. As shown in Fig. 6, the attaching unit 8 is provided with the attaching roller 17 horizontally forward, and is horizontally reciprocated to the left and right by the slide guide mechanism 18 and a screw feed type drive mechanism (not shown). The unit 10 is provided with a peeling roller 19 horizontally forward, and is horizontally reciprocated horizontally to the left and right by a slide pulsation guide mechanism 18 and a screw transfer type drive mechanism (not shown). The take-up portion 11 is configured to take up the take-up belt Τ', and the take-up shaft 20 is rotatably driven in the winding direction. As shown in FIG. 1, the belt cutting mechanism 9 is provided with a pair of support arms 22 which are disposed on the lower portion of the movable table 21 which can be driven to move up and down. The support arm 22 is at the longitudinal axis located at the center of the chuck table 5. The X is driven to rotate around. Further, the cutter unit 23 provided on the movable end side of the support arm 22 is provided with a cutter blade 12 that φ causes the blade edge to face downward, and supports the cutter 22 so as to rotate around the longitudinal axis X. 12 moves along the outer circumference of the wafer W to cut off the protective tape. The detailed structure is shown in Fig. 2 to Fig. 6. As shown in Fig. 2, the movable table 21 is formed so as to drive the motor 24 in the forward and reverse directions, and is fed up and down along the vertical rail 25. The movable end of the movable table 21 is equipped with a rotating shaft 26 rotatable around the longitudinal axis X, and the motor 27 provided on the movable table 21 is decelerated by two belts. The rotation shaft 26 is rotated by the action of the motor 27 at a low speed of -10 1330582 in a predetermined direction. Then, at the lower end portion of the support member 29 extending from the rotation shaft 26 to the lower side, the support arm 22' supporting the horizontally slidable adjustment is supported by the slide shaft of the cutter blade 12 by the slide adjustment of the support arm 22 The distance, that is, the radius of rotation of the cutter 12 can be adjusted according to the wafer diameter. Further, the rotary shaft 26, the motor 27, and the belt 28 constitute the cutter moving device and the first driving device in the present invention. And the 'support arm 22' is equivalent to the adjustment device of the present invention. As shown in Fig. 3, the movable end of the support arm 22 is fixed with a bracket 30»φ. The bracket 30 is mounted to support the cutter unit 23. The cutter unit 23 includes: a rotating member 31 supported to be rotatable about a longitudinal axis around the longitudinal axis of the bracket 30; a longitudinal wall-shaped support bracket 32 coupled to the lower end of the rotating member 31; The cutter support member 33 is coupled to the side of the support bracket 32; the bracket 34 is supported by the cutter support member 33; and the cutter holder 35 is attached to the bracket 34. The cutter 12 is screwed to the side of the cutter holder 35. Here, the upper portion of the rotating member 3 1 is provided with an operation 0 flange 38 as shown in Fig. 4, and is rotated integrally with the rotating member 31 by the engagement of the elongated hole 36 and the projection 37. The operation flange 38 is rotated by the air cylinder 39, so that the entire cutter unit 23 changes the posture of the support arm 22 around the longitudinal axis, and the angle of the cutter 12 to the moving direction can be adjusted within a predetermined small range. . Further, the bracket 34 supports the cutter support member 33 so as to be slidable in the longitudinal direction of the support arm 22 (the front and back directions of the paper surface in FIG. 5), and is moved toward the longitudinal axis X by a spring (not shown). Slide the force in the direction. Moreover, the cutting and holding member 35 is rotatably supported by the bracket 34 around the longitudinal axis -11-133252 of the back edge of the cutting blade 12, and the blade tip of the cutting blade 12 is approached to the longitudinal axis by the spring 41. The direction of the heart X is rotated. Further, the spring 41' corresponds to the elastic body of the present invention. Therefore, the elastic body is not limited to the spring, and for example, a resinous belt or rubber or the like can be used. Further, the support bracket 30 rotatably supported by the cutter unit 23 corresponds to the support device of the present invention, and the rotary member 3, the elongated hole 36, the projection 37, the gas cylinder 39 and the spring 41 constitute the cutter rotation in the present invention. Turn the device. Next, a series of basic operations for attaching the protective tape to the surface of the wafer W in order to use the above-described embodiment will be described based on Figs. 6 to 9 . When the attaching command is output, first, the robot arm 2 in the wafer transfer mechanism 3 is moved to the cassette C loaded on the wafer supply/recovery unit 1, and the wafer holding unit 2a is inserted into the cassette C. The gap between the wafers. The robot arm 2 sucks and holds the wafer W from the back surface (lower surface) by the wafer holding portion 2a, and transfers the taken wafer W to the alignment chuck table 4. The wafer W placed on the alignment chuck stage 4 is aligned by the groove η formed on the outer periphery of the wafer W. Once again, the robot arm 2 carries out the wafer that has been aligned and is placed on the chuck table 5. The wafer W placed on the chuck stage 5 is placed in a state where the center is positioned at the center of the chuck stage 5, and is adsorbed and held. At this time, as shown in Fig. 6, the attaching unit 8 and the peeling unit 10 are in the initial position on the left side, and the cutting blade 12 with the cutting mechanism 9 is placed at the upper initial position, and stands by. Next, as shown by the hypothetical line in Fig. 6, the attaching roller 17 of the attaching unit 8 is lowered, and the protective tape T is pushed downward by the attaching roller 17, and the wafer W is rotated to the upper side. Front (on the right side of Figure 6),
1330582 藉此將保護帶τ貼附在晶圓w的表面全體》 如第7圖所示，貼附單元8到達終端位置時’在上方待 '機的切割刀12降下，而於夾片台5的切割刀移動溝13突剌 在保護帶T。 切割刀12降下到預定的切斷高度位置而停止時，如第 8圖所示，支持臂22朝預定方向轉動，切割刀12與其一起 在縱軸心X周圍旋轉移動，而沿晶圓外形切斷保護帶T。 完成沿晶圓W外周的帶切斷時’如第9圖所示，切割 φ 刀1 2上升到原來的待機位置，接著剝離單元1 〇 —面朝前方 移動，一面將晶圓W上面已切除切斷的殘餘廢棄帶Τ’捲起 而剝離。 剝離單元1 0到達剝離作業結束位置時，剝離單元1 0和 貼附單元8朝反方向移動而回到初期位置。此時，將廢棄帶 Τ’捲繞在回收軸20，並將一定量的保護帶Τ從帶供給部6 送出。 帶貼附動作結束時，解除夾片台5之吸附後，將已完成 φ貼附處理的晶圓W移動到機械臂2的晶圓保持部2a，且插 入在晶圓供給/回收部1的卡匣C而回收。 以上完成一次帶貼附處理，以後即順序反覆上述動作。 然後，於上述保護帶貼附步驟中的帶切斷步驟，如以下 方式進行於形成在晶圓W外周的凹槽η之帶切斷。此外， 凹槽η係凹入彎曲成周方向的開放寬度爲4〜5晒，深度爲大 約 3 ππη 。 切割刀12在晶圓W的凹槽η以外的周緣部進行之間， -1 3 - 1330582 藉由氣筒39的桿延伸，而如第10(a)圖所示，切割刀12 對晶圓W外周緣以適度的切入傾斜角度，在周方向持續滑 接移動。切割刀12到達凹槽η的上側端部時，藉由氣筒39 的桿收縮，切割刀1 2形成朝內側方向自由自轉之狀態。藉 此，如第10(b)圖所示，離開晶圓W外周緣的切割刀12 係以其刀尖在切割刀旋轉中心方向藉由彈簧施力一面自轉 —面前進的方式，刀尖一面吞入凹槽η內一面進行。刀尖到 達凹槽η底部附近時，藉由一面使切割刀12進行，一面再 φ度延伸氣筒39的桿，使切割刀12逆向地自轉而朝向晶圓外 周移行（參照第1 〇 ( c )圖）。切割刀12到達凹槽η下側 的端部時，以後如第1 〇 ( d )圖所示，切割刀1 2再度沿晶 圓W外周緣進行下去。 如此地以切割刀12自轉而吞入移動到凹槽η，並於凹 槽η的後半部反向自轉的方式，挖取凹槽η內的保護帶Τ， 凹槽η內切剰的殘留帶t變成較少。 此外，本發明亦可用以下的形態實施。 φ (Ο亦可將切割刀保持件35構成以脈衝馬達等致動器 自轉驅動。該情形以控制成根據預先輸入的程式使切割刀 12 —面沿凹槽η的內緣自轉一面移動之方式，可使凹槽η 內的殘留帶t更少。 (2)本發明方法亦可於使晶圓W對切割刀12轉動以 進行帶切斷之形態下實施。實現該構造時，將吸附保持晶圓 W的夾片台5例如利用馬達等驅動裝置轉動地構成即可。該 構造之情形，馬達相當於本發明的第2驅動裝置。 ⑧ -14- 1330582 本發明在不逸脫其思想或本質下，可以其他具體方式實 施，因而宣示本發明之範圍者並非以上之說明，而應參照附 加的申請專利範圍。 【圖式簡單說明】 爲了說明發明而例示數種認爲是目前適當的形態’但請 理解發明並非限定於圖示之構造及方法者。 第1圖係表示本發明一實施例之保護帶貼附裝置全體 立體圖。1330582 Thereby, the protective tape τ is attached to the entire surface of the wafer w. As shown in FIG. 7, when the attaching unit 8 reaches the end position, the cutting blade 12 of the 'topping machine' is lowered, and the clamping table 5 is lowered. The cutting blade moves the groove 13 to protrude in the protective tape T. When the cutting blade 12 is lowered to a predetermined cutting height position and stopped, as shown in Fig. 8, the supporting arm 22 is rotated in a predetermined direction, and the cutting blade 12 is rotated together with the longitudinal axis X, and is cut along the outline of the wafer. Break protection tape T. When the tape is cut along the outer circumference of the wafer W, as shown in Fig. 9, the cutting φ knife 12 rises to the original standby position, and then the peeling unit 1 〇 faces face forward, and the wafer W is cut off. The cut residual waste tape is rolled up and peeled off. When the peeling unit 10 reaches the peeling operation end position, the peeling unit 10 and the attaching unit 8 move in the reverse direction and return to the initial position. At this time, the waste tape Τ' is wound around the take-up shaft 20, and a predetermined amount of the protective tape 送 is fed out from the tape supply unit 6. When the attaching operation is completed, the adsorption of the wafer stage 5 is released, and the wafer W that has completed the φ attaching process is moved to the wafer holding unit 2a of the robot arm 2, and inserted into the wafer supply/recovery unit 1. Card C is recycled. The above is completed with the attaching process, and the above actions are repeated in the order. Then, the tape cutting step in the above-described protective tape attaching step is performed in the following manner to cut the tape n formed on the outer periphery of the wafer W. Further, the groove η is concavely curved and has an open width in the circumferential direction of 4 to 5, and a depth of about 3 ππη. The dicing blade 12 is stretched between the peripheral portions other than the groove η of the wafer W, -1 3 - 1330582 is extended by the rod of the gas cylinder 39, and as shown in Fig. 10(a), the dicing blade 12 is opposed to the wafer W The outer circumference is continuously slidably moved in the circumferential direction at a moderate slanting angle. When the cutter blade 12 reaches the upper end portion of the groove n, the cutter blade 12 is in a state of being freely rotated in the inner side direction by the contraction of the rod of the air cylinder 39. Thereby, as shown in Fig. 10(b), the cutting blade 12 that is away from the outer periphery of the wafer W is rotated by the spring in the direction of the center of rotation of the cutting blade by the spring, and the cutting edge is advanced. The inside of the groove η is swallowed. When the blade edge reaches the vicinity of the bottom of the groove η, the dicing blade 12 is advanced, and the rod of the gas cylinder 39 is extended by φ, and the dicing blade 12 is reversely rotated to move toward the outer periphery of the wafer (refer to the first 〇(c) Figure). When the cutter 12 reaches the lower end of the groove η, as shown in the first 〇 (d) diagram, the cutter 1 2 is again advanced along the outer circumference of the wafer W. In this way, the cutting blade 12 is rotated and swallowed to move to the groove η, and in the latter half of the groove η, the protective tape 内 in the groove η is removed, and the residual band of the groove η is cut. t becomes less. Further, the present invention can also be carried out in the following aspects. φ (Ο) The cutter holder 35 can also be configured to be driven by an actuator such as a pulse motor. This case is controlled in such a manner that the cutter 12 is moved along the inner edge of the recess η according to a pre-program input. The residual band t in the groove η can be made less. (2) The method of the present invention can also be carried out in the form of rotating the wafer W against the cutting blade 12 to perform tape cutting. When the structure is realized, the adsorption is maintained. The chuck table 5 of the wafer W may be configured to be rotatable by, for example, a driving device such as a motor. In the case of this configuration, the motor corresponds to the second driving device of the present invention. 8 - 14 - 1330582 The present invention does not escape its thoughts or In essence, it can be implemented in other specific ways, and thus the scope of the present invention is not described above, but should be referred to the scope of the appended claims. [Simplified Description of the Drawings] Several examples are considered to be presently appropriate for the purpose of illustrating the invention. 'But the invention is not limited to the structure and method shown in the drawings. Fig. 1 is a perspective view showing a whole of a protective tape attaching device according to an embodiment of the present invention.
第2圖係帶切斷機構的前視圖。 第3圖係帶切斷機構的主要部分立體圖。 第4圖係帶切斷機構的主要部分俯視圖。 第5圖係帶切斷機構的主要部分側視圖。 第6圖係實施例裝置的動作說明圖。 第7圖係實施例裝置的動作說明圖。 第8圖係實施例裝置的動作說明圖。 第9圖係實施例裝置的動作說明圖。Figure 2 is a front view of the strap cutting mechanism. Fig. 3 is a perspective view of a main part of the strap cutting mechanism. Figure 4 is a plan view of the main part of the strap cutting mechanism. Figure 5 is a side view of the main part of the strap cutting mechanism. Fig. 6 is a view showing the operation of the apparatus of the embodiment. Fig. 7 is an explanatory view of the operation of the embodiment device. Fig. 8 is a view showing the operation of the apparatus of the embodiment. Fig. 9 is a view showing the operation of the apparatus of the embodiment.
第10圖係表示在凹槽的帶切斷動作俯視圖。 【主要元件符號說明】 1 晶圓供給/回收部 2 機械臂 2a 晶圓保持部 3 晶圓搬送機構 4 調準夾片台 5 夾片台 ⑧ -15- 1330582 6 帶供給部 7 隔離件回收部 8 貼附單元 9 帶切斷機構 10 剝離單元 11 帶回收部 1 2 切割刀 13 切割刀移動溝 14 供給軸 15 引導滾筒 16、 20 回收軸 17 貼附滾筒 18 滑動引導機構 19 剝離滾筒 2 1 可動台 22 支持臂 23 切割刀單元 24、 27 馬達 25 縱軌 26 轉動軸 28 傳動帶 29 支持構件 30、 34 托架 3 1 轉動構件 0 -16- 1330582Fig. 10 is a plan view showing the tape cutting operation in the groove. [Description of main component symbols] 1 Wafer supply/recovery unit 2 Robot arm 2a Wafer holding unit 3 Wafer transfer mechanism 4 Alignment clip table 5 Clip table 8 -15- 1330582 6 Belt supply unit 7 Separator collection unit 8 Attachment unit 9 Belt cutting mechanism 10 Stripping unit 11 Belt recovery unit 1 2 Cutting blade 13 Cutting blade moving groove 14 Supply shaft 15 Guide roller 16, 20 Recovery shaft 17 Attaching roller 18 Slide guide mechanism 19 Stripping roller 2 1 Movable Table 22 Support arm 23 Cutter unit 24, 27 Motor 25 Longitudinal rail 26 Rotary shaft 28 Transmission belt 29 Support member 30, 34 Bracket 3 1 Rotating member 0 -16 - 1330582
3 2 33 3 5 3 6 3 7 3 8 39 4 1• c η 5ττ, t X、Υ、ζ W 支持托架 切割刀支持構件 切割刀保持件 長孔 突起 凸緣 氣筒 彈簧 卡匣 凹槽 隔離件 保護帶 廢棄帶 殘留帶 縱軸心 晶圓3 2 33 3 5 3 6 3 7 3 8 39 4 1• c η 5ττ, t X, Υ, ζ W Support bracket cutter support member cutter holder long hole protrusion flange gas cylinder spring groove groove spacer Protective tape waste strip residual ribbon vertical axis wafer
(D -17-(D -17-