JP2009300542A - Alignment drawing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment drawing apparatus capable of forming an accurate pattern even if dust deposits on a thin substrate which is liable to cause warpage. <P>SOLUTION: The alignment drawing apparatus 10 is a direct alignment apparatus that directly draws a pattern on a substrate SW. The alignment drawing apparatus 10 is equipped with a base 11 provided with a drawing table 13 mounted with the substrate SW, and a gate structure 12 storing a drawing optical system 20. The gate structure 12 is provided with a cleaning unit 30 that includes an adhesive roller 31 in contact with the surface of the substrate SW to remove dust depositing on the substrate surface, and a coil spring 32 that gives a force to the adhesive roller 31 in contact with the substrate SW at given pressure. The drawing table 13 is provided with two pairs of fixing means 50 that are disposed across the substrate SW, approximately parallel to the Y direction where drawing beams are arrayed and press and fix the substrate SW mounted on the drawing table 13 to the drawing table 13. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure drawing apparatus that exposes and draws a pattern on the surface of a flat substrate having a photosensitive material layer formed on the surface thereof, such as an electronic circuit substrate, a glass substrate for a liquid crystal element, and a glass element substrate for a PDP.

  Electronic circuit boards (printed circuit boards) are mounted on electronic devices such as mobile phones, various mobile devices, and personal computers. For example, as these electronic devices are miniaturized, circuits formed on the substrate are integrated. There is a demand to increase the degree, and miniaturization is also required for patterns such as wiring, connection lands, and vias. In addition, with the miniaturization described above, the substrate is also becoming thinner.

  The thinner the substrate is, the easier it is to be deformed by the resist coating up to the exposure drawing process and the subsequent heat treatment, and the deformation proceeds by contact with various transport equipment even during the transport of the substrate. Therefore, in an exposure drawing apparatus that draws a pattern, in particular, the periphery of the substrate is often deformed by several millimeters due to warpage due to heat or deformation in a wave shape. It is difficult to fix the substrate greatly deformed in this way to the exposure table only by simple vacuum suction.

  On the other hand, in the substrate manufacturing process including the exposure process, dust scattered in the environment is likely to adhere to the substrate. In such a state where deformation or dust adheres, it is difficult to form an accurate pattern, and a fine pattern cannot be formed accurately.

  For example, in Patent Document 1 below, in a contact-type exposure apparatus in which a mask is brought into close contact with a substrate coated with a photoresist and exposed from above the mask, the dust is deposited on the mask and the substrate by the cleaning head when the substrate and the mask are transferred. A method for removing the is disclosed. On the other hand, Patent Document 2 discloses a method of fixing a work in order to draw an accurate pattern on a warped work in the droplet discharge method. Further, Patent Document 3 discloses a method of attracting a substrate to a stage and pressing the periphery with a clamp, in particular, in order to draw a pattern on the substrate having a warp around the periphery.

JP 2007-25436 A JP 2008-18347 A JP 2008-83478 A

  However, Patent Document 1 discloses a dust removal method, and References 2 and 3 disclose a method for correcting warpage, but a method for dealing with dust attached to a warped substrate is disclosed. Is not described in any patent document.

  The present invention has been made in view of the above-described problems of the prior art, and provides an exposure drawing apparatus capable of forming an accurate pattern even when dust adheres to a thin substrate that is likely to warp. The purpose is to do.

In order to achieve the above object, an exposure drawing apparatus according to the present invention irradiates a substrate by placing image information corresponding to the pattern on a beam emitted from a light source in the exposure drawing apparatus that projects and draws a pattern on the substrate. A drawing optical system, a drawing table on which the substrate is placed, a moving mechanism that relatively moves the drawing optical system and the drawing table during irradiation of the drawing beam, and a substrate that is substantially perpendicular to the relative moving direction of the moving mechanism And a fixing means for pressing and fixing the substrate placed on the drawing table against the drawing table, and a dust removing means for removing dust on the surface of the substrate fixed by the fixing means. Features.

  The fixing means is desirably installed at both ends in the moving direction. Further, when a plurality of fixing means are provided, it is desirable that at least one of them can be slid in the moving direction.

  Furthermore, it is desirable to provide a retracting means for retracting the dust removing means away from the substrate when the dust removing means approaches the fixing means, thereby avoiding a collision between the two.

  The dust removing means, for example, urges the dust removing head to contact the surface of the substrate and remove the dust attached to the surface of the substrate, and the dust removing head to come into contact with the substrate with a constant pressure. It can be set as the structure which has a biasing means. An adhesive roller can be used as the dust removal head.

  The present invention is also applied to a contact-type exposure apparatus in which a mask is brought into close contact with a substrate coated with a photoresist and exposed from above the mask by a beam controlled based on pattern drawing data. The present invention can be applied to either a direct exposure drawing apparatus that directly draws a pattern on a photoresist.

  According to the above-described exposure drawing apparatus according to the present invention, the substrate is stretched in a flat shape by the fixing means and brought into close contact with the drawing table, and at the same time, the dust attached to the substrate surface can be removed by the dust removing means. A pattern can be formed on a flat and clean substrate from which dust is removed, and an accurate pattern can be formed even when a fine pattern is formed on a thin substrate.

  Embodiments of an exposure drawing apparatus according to the present invention will be described below with reference to the drawings. First, the overall configuration of the apparatus will be described with reference to FIG. FIG. 1 is a perspective view schematically showing a part of the exposure / drawing apparatus 10 of the present embodiment by cutting away.

  As shown in FIG. 1, an exposure drawing apparatus 10 directly exposes a pattern on a substrate SW coated with a photosensitive material such as a photoresist by a beam controlled based on pattern drawing data. Device. The exposure drawing apparatus 10 includes a base 11 on which a drawing table 13 on which a substrate SW is placed and a gate-like structure 12 in which a drawing optical system 20 is housed.

  The drawing optical system 20 modulates a beam emitted from the light source unit 21 based on image information corresponding to a pattern by a plurality of light spatial modulation elements, and forms a substrate as a plurality of drawing beams arranged in a line along the Y direction in the figure. Irradiate on SW.

In the base 11, there is a movement mechanism (not shown) for moving the drawing optical system 20 and the drawing table 13 in the X direction perpendicular to the Y direction in which the drawing beam is arranged during irradiation of the drawing beam. Is provided. In this example, a drawing table 13 is provided on the base 11 so as to be movable in the X and Y directions in the figure, and the moving mechanism can drive the drawing table 13 in the X and Y directions. . The drawing table 13 may be fixed and the drawing optical system 20 may be movable.

  The drawing optical system 20 includes a light source unit 21 provided in each of the two boxes 12a and 12b formed on the upper portion of the gate-like structure 12, and a beam emitted from the light source unit divided into four parts. The modulation projection unit 22 modulates and irradiates the substrate SW. In FIG. 1, only one light source unit 21 is shown.

  The light source unit 21 includes an aperture 21g having four openings arranged by a UV lamp 21a that emits ultraviolet light, an elliptical mirror 21b, first and second plane mirrors 21c and 21d, a condenser lens 21e, a fly-eye lens 21f, and 2 × 2. It has. The light emitted from the UV lamp 21a is directed upward in the figure by the elliptical mirror 21b, reflected in the horizontal direction by the first flat mirror 21c, condensed by the condenser lens 21e, and downward by the second flat mirror 21d. And is corrected to a pattern forming beam via the fly-eye lens 21f, divided into four beams via the aperture 21g, and incident on the modulation projection unit 22. The optical system of the light source unit 21 is provided with a shutter (not shown).

  As shown in an enlarged view in FIG. 2, the modulation projection unit 22 is provided for each of the beams separated from the prism 22a by the prism 22a for horizontally separating the four beams incident from the light source unit 21 two by two. And a modulation projection optical system 23. The modulation projection optical system 23 is provided as one optical source unit, that is, four sets for four beams and a total of eight sets for two light source units. Since these functions are the same, only the frontmost modulation projection optical system 23 in FIG.

The modulation projection optical system 23 includes first, second, and third plane mirrors 23a, 23b, and 23c, first and second projection lenses 23d and 23e, a DMD (Digital Micro-mirror Device) 23f as a spatial modulation element, and both surfaces. A mirror 23g is provided. The beam reflected by the prism 22 is reflected at a right angle by the first plane mirror 23a and enters the first projection lens 23d having a horizontal optical axis, and is reflected downward by the second plane mirror 23b through this. The The beam is reflected by the upper mirror surface of the double-sided mirror 23g and enters the DMD 23f.

  The DMD 23f is an element in which a large number of micromirrors that can be switched between two angles independently are two-dimensionally arranged. The reflected light is directed to the third plane mirror 23c at one angle, and the third angle at the other angle. The light is reflected in a direction different from the plane mirror 23c. The light directed toward the third plane mirror 23c is reflected downward by the lower mirror surface of the double-sided mirror 23g in the drawing, and has a predetermined magnification and light amount necessary for drawing a pattern via the second projection lens 23e. Then, the substrate SW is irradiated to expose the photoconductor on the substrate SW.

  Since the eight modulation projection optical systems 23 are provided as described above, by controlling according to the pattern to project the micromirrors of the eight DMDs 23f included therein, the modulated projection optical system 23 is selectively reflected by the beam. A part of the substrate SW can be exposed in a strip shape along the Y direction (main scanning direction) according to a desired pattern. Then, by moving the drawing table 13 in the X direction (sub-scanning direction) at a constant speed in synchronization with the exposure by the drawing optical system 20, an exposure pattern can be formed on the entire surface of the substrate SW.

As shown in FIG. 1, the gate-like structure 12 includes a cleaning unit (dust removing means) 30 for removing dust attached to the surface of the substrate SW, and an alignment formed on the substrate SW for adjusting the drawing position. Two cameras 40 for detecting the mark are provided. The drawing table 13 is arranged across the substrate SW substantially parallel to the Y direction in which the drawing beams are arranged, and a plurality of substrates SW placed on the drawing table 13 are pressed against the drawing table 13 and fixed. In this example, two sets of fixing means 50 are provided.

  Next, configurations of the cleaning unit 30 and the fixing unit 50 will be described with reference to FIGS. 3 is a side view of the cleaning unit 30 and the fixing means 50 of the exposure drawing apparatus 10 as viewed from the direction Y orthogonal to the traveling direction X of the drawing table 13, and FIG. FIG. 5 is a plan view of these viewed from above. FIG. 4 shows a state where the cleaning unit 30 is separated from the substrate SW by avoiding the fixing means.

  As shown in FIGS. 3 and 4, the cleaning unit 30 is attached to a hanging plate 14 formed on the gate-like structure 12 of the exposure drawing apparatus 10. The cleaning unit 30 is in contact with the surface of the substrate SW and a dust removing head including an adhesive roller 31 that removes dust attached to the surface of the substrate so that the adhesive roller 31 contacts the substrate SW at a constant pressure. A coil spring 32 as an urging means for urging and a cylinder 33 for guiding the vertical movement of the adhesive roller 31 are provided. A plurality of coil springs 32 are provided as shown in FIG. 4, whereby the adhesive roller 31 can be brought into contact with the surface of the substrate SW in a stable state. The cleaning unit 30 is provided with a drive mechanism (not shown) that switches between an operation position where the adhesive roller 31 is moved up and down to contact the substrate SW and a non-contact retracted position. Further, when the weight of the cleaning unit 30 is large to some extent, the urging means is not necessarily provided.

  The adhesive roller 31 has a diameter of about 100 mm at the start of use, and has an adhesive layer formed on the surface thereof. As shown in FIG. 3, the adhesive roller 31 contacts the substrate SW and rotates as the substrate SW moves. Adsorbs dust. The cleaning unit 30 includes a transfer roller (not shown) that comes into contact with the adhesive roller 31, and transfers dust that adheres to the surface of the adhesive roller 31 to the transfer roller, so that the cleaning unit 30 continuously transfers the dust. Dust removal is possible. The adhesive roller 31 has a width that can substantially cover the width of the substrate SW in the Y direction. A copying roller 34 having a smaller diameter than the adhesive roller 31 is attached to both ends of the adhesive roller so as to be rotatable coaxially with the adhesive roller 31.

  As shown in FIG. 5, the adhesive roller 31 of the cleaning unit 30 moves the substrate SW on the drawing table 13 in the traveling direction so as to remove the dust in the drawing target area of the substrate SW immediately before the drawing beam is irradiated. On the other hand, it is provided close to the drawing optical system 20 at a position preceding the drawing beam. Further, since the cleaning unit 30 is provided in the gate-like structure 12 together with the drawing optical system 20, the cleaning unit 30 moves relative to the drawing table 13 integrally with the drawing optical system 20. Since the adhesive roller 31 is in contact with the substrate at a predetermined pressure by the coil spring 32, deformation such as slight warping of the substrate is corrected by pressing the substrate SW against the drawing table 13 by the adhesive roller 31. be able to.

  Next, the fixing unit 50 will be described. In this example, as shown in FIGS. 1 and 5, the fixing means 50 is provided at both ends in the direction orthogonal to the arrangement direction of the drawing beams, that is, both ends in the moving direction of the substrate SW. Each fixing means 50 includes a pressing plate 51 that contacts and presses against the substrate SW, avoidance blocks 52a and 52b attached to the pressing plate 51 on both sides outside the width of the substrate SW, and the pressing plate 51 and the avoidance blocks 52a and 52b. Are composed of elevating mechanisms 53a and 53b that vertically move the substrate up and down with respect to the substrate SW.

As shown in FIG. 3, the pressing plate 51 is a plate-like structure having a rectangular cross-sectional shape with chamfered corners contacting the substrate SW so as not to damage the substrate SW. As shown in FIGS. 1 and 5, the avoidance block 52a is disposed at a position corresponding to the copying roller 34 of the cleaning unit 30, and the side surface is formed in a trapezoidal shape as shown in FIG. The elevating mechanisms 53a and 53b are mechanisms using a motor, or a mechanism using an air cylinder or a hydraulic cylinder. When the substrate SW is mounted on the drawing table 13 or unloaded, it is raised and pressed. When 51 is separated from the substrate SW and the substrate SW is mounted on the drawing table SW, the pressing plate 51 is lowered to softly press the substrate SW so as not to apply an impact to the substrate.

  During exposure drawing, the drawing table 13 slides with the substrate SW placed and fixed by the fixing means 50. When the fixing means 50 comes to the position of the cleaning unit 30, the copying roller 34 of the cleaning unit 30 avoids the avoidance block 52a. , 52b, the cleaning unit 30 rises as the drawing table 13 moves, the adhesive roller 31 moves away from the substrate SW, and the copying roller 34 follows the flat portion of the avoidance block as shown in FIG. Thus, the adhesive roller 31 is separated from the pressing plate 51 by a distance δ. When the adhesive roller 31 gets over the pressing plate 51 and the copying roller 34 starts to follow the descending slope of the avoidance block, the adhesive roller 31 descends again to the substrate side and comes into contact with the substrate to resume the dust removal operation. In this manner, the collision between the adhesion roller 31 and the fixing means 50 can be avoided by the cooperation of the avoidance blocks 52a and 52b and the copying roller 34. That is, in this example, the avoidance blocks 52a and 52b and the copying roller 34 function as a evacuation unit that avoids the collision between the both. Further, as a retracting mechanism, a photo sensor and a linear sensor for recognizing the position of the substrate SW are provided instead of providing the copying roller, and when the cleaning unit 30 reaches the position of the fixing means set in advance, it is not shown. The cleaning unit 30 may be moved in the Z direction by a drive mechanism to avoid collision with the fixing means 50.

  Note that the pressing plate 51 is preferably formed of transparent acrylic or glass so that the camera 40 can read even if an identification symbol or the like is written on a portion fixed by the pressing plate. However, if a strong fixing force is required for reasons such as large distortion of the substrate, and there is no identification symbol written on the portion to be fixed, or if it is not necessary to read the identification symbol, engineering resin Alternatively, it may be formed of an opaque material such as aluminum or steel.

  Further, at least one of the fixing means 50 is formed so as to be slidable in the X direction orthogonal to the arrangement direction Y of the drawing beams, and can be fixed at both ends of the substrate even when there is a difference in the size of the substrate SW. it can. In this case, the raising / lowering mechanism of the fixing means is placed on the slide rail, and the position is automatically adjusted by a driving mechanism using a ball screw and a motor. The size of the substrate SW is set according to the product type data.

  Next, the control mechanism of the exposure drawing apparatus will be described based on the block diagram shown in FIG. The control mechanism 60 includes a system control circuit 61 that controls the entire system, a table control unit 62 that controls driving of the drawing table 18, a DMD control unit 63 that controls the DMD 23f of the drawing optical system 20, and a light source unit 21. A light source control unit 64 for controlling, a cleaning unit control unit 65 for controlling the cleaning unit 30, a fixing unit control unit 66 for controlling the fixing unit 50, and raster conversion for converting input CAD pattern data into drawing raster data And an alignment mark observation control unit 68 for controlling the camera 40 for observing the alignment mark.

  The table control unit 62 controls the X-direction drive mechanism 13a and the Y-direction drive mechanism 13b while receiving feedback from the position detection unit 69 according to a command from the system control circuit 61, and a drawing table on which the substrate SW is placed. 13 is set to a predetermined position or moved at a predetermined speed.

Next, the operation of the exposure drawing apparatus 10 according to the embodiment including the control by the control mechanism 60 will be described with reference to the flowchart shown in FIG. When the processing is started and the substrate SW is loaded (S
01) The system control circuit 61 moves the slidable fixing means 50 based on the type data of the substrate SW to be exposed (S02), and fixes both ends of the substrate SW. In step S02, it is assumed that it is automatically moved using a drive mechanism, but may be set manually.

Next, the system control circuit 61 drives the fixing means 50 to fix the substrate SW via the substrate fixing means control section 66 (S03). As a result, the substrate SW is fixed to the drawing table 13 (S04). The system control circuit 61 lowers the adhesive roller 31 of the cleaning unit 30 via the cleaning unit controller 65 (S05), and the substrate SW
Contact. Thereby, preparation for drawing is completed.

Subsequently, the system control circuit 61 opens a shutter (not shown) of the light source unit 21 through the light source control unit 64 to start beam irradiation (S06), and moves the drawing table 13 to a predetermined speed through the table control unit 62. To start moving (S07). At the same time, the system control circuit 61 controls the DMD control unit 63 to develop the drawing data input from the raster conversion unit 67 into the built-in bitmap memory 63a, and in synchronization with the movement of the drawing table 13, each DMD 23f. Is controlled according to the drawing data. Thereby, the photoreceptor on the substrate SW is exposed according to the pattern.

When the copying roller 34 comes into contact with the avoidance blocks 52a and 52b during exposure (S08, Yes), the cleaning unit 30 rises to avoid the fixing means 50 (S09), and when the copying roller 34 leaves the avoidance blocks 52a and 52b. (S10, Yes), the cleaning unit 30 descends and dust removal starts again (S11). The above operation is repeated until the drawing end point. When the drawing beam reaches the drawing end point (S12, Yes), the system control circuit 61 closes the shutter of the light source unit 21 via the light source control unit 64 to block beam irradiation. Then, the drawing table 13 is stopped via the table control unit 62 (S14), the adhesive roller 31 of the cleaning unit 30 is raised via the cleaning unit control unit 65 (S15), and the substrate fixing means control unit 66 Then, the fixing of the substrate SW by the fixing means 50 is released (S16). Substrate SW after exposure
Is carried out of the drawing table 13 and conveyed to the next process such as development.

According to the above embodiment, since the cleaning unit 30 removes dust immediately before exposure, it is unlikely that dust will remain on the substrate during exposure, and an accurate pattern can be drawn without dust.
In addition, since the substrate is held by the fixing means 50, even when the substrate is distorted by the pre-processing, it is possible to draw while maintaining high flatness by correcting the distortion, and drawing a more accurate pattern. It becomes possible.
Further, since the evacuation means is provided, even when the substrate is fixed to the drawing table by the fixing means 50, the contact between the cleaning unit 30 and the fixing means 50 can be avoided, and the cleaning unit 30 and the fixing means 50 are provided at the same time. However, there is no hindrance to the work, and both effects can be fully exhibited.

  In the above embodiment, the example in which the fixing means is arranged at both ends in the X direction has been described. However, when the distortion of the substrate is large, as shown in FIG. It is desirable to arrange the fixing means 50.

However, if the substrate SW is slightly lifted from the drawing table 13 due to slight deformation, the cleaning unit 30 is lowered and the drawing table 13 is moved while the fixing means 50 at both ends are fixed. The adhesive roller 31 of the unit 30 contacts the surface of the substrate SW to transfer dust, and at the same time, the substrate can be corrected to a flat surface. Therefore, the substrate SW is placed on the drawing table 1 simultaneously with the removal of dust by the cleaning unit 30.
The substrate SW can be adsorbed to the drawing table 13 and fixed by evacuation provided in the drawing table. The fixing means 50 positioned at both ends of the substrate are preferably provided with a plurality of air discharge holes in order to discharge air accumulated between the substrate SW and the drawing table 13.

  In the above embodiment, the avoidance block is attached to the pressing plate 51. However, the avoidance block may be installed independently in parallel with the substrate SW along the elevating mechanisms 53a and 53b.

  Furthermore, as the fixing means 50, only the example using the pressing plate 51 having a rectangular cross section has been described, but it is also possible to adopt a configuration as shown in FIGS. 9 to 11 are side views similar to FIG. 3, each showing a modification of the fixing means. In the example of FIG. 9, a pressing rod 54a having a circular cross section is used as a member for pressing the substrate SW. The arm 54b that supports the pressing rod 54a is attached to an elevating mechanism 54c using a cylinder, and the elevating mechanism 54c is mounted on a slide rail 54d so as to be slidable in the Y direction.

  In the example of FIG. 10, in order to press the substrate SW in a non-contact manner, a pipe 55b having a circular cross section is passed through the holding plate 55a, and a vent hole 55c is formed on the substrate side of the pipe 55b. In the example of FIG. 11, a rectangular space 56b is formed inside the pressing plate 56a, and a vent hole 56c is formed on the substrate side of the space 56b. In these configurations, a gas such as an inert gas or compressed air is sent into the pipe 55b or the space 56b and is ejected from the vent holes 55c and 56c, thereby pressing the substrate using the pressure of the gas. Can be eliminated.

  Furthermore, in the above embodiment, the example in which the present invention is applied to a direct exposure lithography apparatus has been described. However, when applied to a contact exposure lithography apparatus, a mask mounted on a frame is used as a substrate. By pressing the substrate with the fixing means and removing the dust with the cleaning unit before adhering, the deformed substrate can be flattened and cleaned on the drawing table, improving the adhesion between the mask and the substrate, and accurately A simple pattern can be formed.

It is a perspective view which fractures | ruptures and shows a part of exposure drawing apparatus which concerns on embodiment of this invention. It is the perspective view which took out and showed the drawing optical system of the apparatus of FIG. It is the side view which looked at the dust removal means and fixing means of the apparatus of FIG. 1 from the direction orthogonal to the advancing direction of a table. It is the front view which looked at the dust removal means of the apparatus of FIG. 1 along the advancing direction of a table. It is the top view which looked at the apparatus of FIG. 1 from upper direction. It is a block diagram which shows the control mechanism of the apparatus of FIG. It is a flowchart which shows the action | operation of the control mechanism of FIG. It is a top view which shows the other example of arrangement | positioning of the fixing means of the apparatus of FIG. It is side surface sectional drawing which shows the 1st modification of the fixing means of the apparatus of FIG. It is side surface sectional drawing which shows the 2nd modification of the fixing means of the apparatus of FIG. It is side surface sectional drawing which shows the 3rd modification of the fixing means of the apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Exposure drawing apparatus SW Board | substrate 11 Base 12 Gate-like structure 13 Drawing table 20 Drawing optical system 21 Light source part 22 Modulation projection part 22a Prism 23 Modulation projection optical system 23a, 23b, 23c 1st, 2nd, 3rd plane mirror 23d, 23e First and second projection lenses 23f DMD
23g Double-sided mirror 30 Cleaning unit 31 Adhesive roller 32 Coil spring 33 Cylinder 34 Copying roller 40 Camera 50 Fixing means 51 Press plates 52a and 52b Avoiding blocks 53a and 53b Lifting mechanism 60 Control mechanism 61 System control circuit 62 Table control unit 63 DMD control unit 64 Light source controller 65 Cleaning unit controller 66 Fixing means controller 67 Raster converter 68 Alignment mark observation controller

Claims (6)

In an exposure drawing apparatus that projects and projects a pattern on a substrate,
A drawing optical system that irradiates the substrate with image information corresponding to the pattern on a beam emitted from a light source;
A drawing table on which the substrate is placed;
A moving mechanism for relatively moving the drawing optical system and the drawing table during irradiation of the drawing beam;
A fixing means that is arranged across the substrate substantially perpendicularly to the relative moving direction by the moving mechanism, and presses and fixes the substrate placed on the drawing table against the drawing table;
An exposure drawing apparatus comprising: dust removing means for removing dust on the surface of the substrate fixed by the fixing means.   The exposure drawing apparatus according to claim 1, wherein the fixing unit is installed at both ends in the moving direction.   The exposure drawing apparatus according to claim 1 or 2, wherein a plurality of the fixing means are provided, and at least one of the fixing means is slidable in the moving direction.   4. The vehicle according to claim 1, further comprising a retracting unit that retracts the dust removing unit in a direction away from the substrate when the dust removing unit approaches the fixing unit to avoid a collision between the two. The exposure drawing apparatus described in 1.   The dust removing means contacts the surface of the substrate and removes dust attached to the surface of the substrate, and the dust removing head so that the dust removing head is in contact with the substrate at a constant pressure. 5. The exposure drawing apparatus according to claim 4, further comprising biasing means for biasing.   The exposure drawing apparatus according to claim 5, wherein the dust removing head includes an adhesive roller.

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