JP2009294616A - Exposure drawing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exposure drawing device which presses a substrate on an exposure drawing table, flatly stretches the substrate so that it is closely attached to the table, and forms an accurate drawn pattern. <P>SOLUTION: The exposure drawing device includes: a projection optical system (35) which projects ultraviolet light on a substrate (SW); a drawing table (15) on which the substrate (SW) is placed and which moves the substrate (SW) in a first direction relatively to the projection optical system (35) and in a second direction intersecting the first direction; and substrate pressing means (40) to press the periphery of an exposure area (49) irradiated with the ultraviolet light on the drawing table (15). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure drawing apparatus that draws and exposes a drawing pattern on a flat substrate on which a photosensitive material layer is formed.

  Electronic circuit boards (printed circuit boards, hereinafter referred to as boards) are mounted on electronic devices such as mobile phones, various mobile devices, and personal computers. Along with the miniaturization of these electronic devices, a fine pattern tends to be required for wiring, connection lands, vias, and the like in a circuit pattern formed on a substrate.

  In order to meet these requirements, in a conventional contact-type exposure apparatus, a mask having the same size as the drawing target pattern must be prepared in advance, and the mask must be normally managed and maintained. On the other hand, in an exposure drawing apparatus of the direct exposure method, an image of an image formed by a light spatial modulation element such as a DMD (Digital Micro-mirror Device) is projected on the surface of a substrate based on drawing data obtained by converting a drawing pattern into an image. A drawing pattern is drawn by. In this drawing method, a drawing pattern is accurately formed on a large number of substrates.

However, since the substrate put into the exposure drawing apparatus is subjected to heat treatment, it is warped or deformed and put into the exposure drawing apparatus. Therefore, in order to bring the substrate into close contact with the exposure drawing table, various means for fixing the deformed substrate to the exposure drawing table have been taken in the exposure drawing apparatus. In patent document 1, the edge part of 2 sides of a board | substrate is pressurized, and a board | substrate is made to adsorb | suck to an exposure drawing table. In Patent Document 2, pressure is applied by clamping the edges of the four sides of the substrate, and the substrate is sucked onto the exposure drawing table.
JP 2008-18347 A JP 2008-83478 A

  As devices and units to be mounted become smaller and thinner, more recent substrates tend to be thinner. When the substrate is thinned, the substrate is likely to warp due to the heat treatment process up to the exposure drawing process. In an exposure drawing apparatus that draws a drawing pattern, the periphery is warped due to heat and deforms into a wave shape, and the vacuum suction mechanism alone makes it difficult to adhere to the exposure table. Therefore, in the exposure drawing apparatus, the pressurization method in Patent Document 1 and Patent Document 2 cannot make the substrate to be thinned sufficiently uniform and cannot form an accurate drawing pattern.

  Therefore, the exposure drawing apparatus of the present invention accurately presses the substrate against the exposure drawing table and draws the substrate into a flat surface and closely contacts the table with the exposure drawing apparatus that draws a drawing pattern even on a thin substrate. A simple drawing pattern is formed.

  In order to solve these problems, the present invention provides an exposure drawing apparatus having means capable of pressing a warped and deformed substrate against a flat surface on an exposure drawing table in the exposure drawing step of the exposure drawing apparatus.

Therefore, an exposure drawing apparatus according to a first aspect includes a projection optical system that projects ultraviolet light onto a substrate, a first direction that is placed on the substrate and is relatively relative to the projection optical system, and a second direction that intersects the first direction. And a substrate pressing means for pressing around the exposure area where the drawing table is irradiated with ultraviolet light.
Even if the substrate is warped in the center, the substrate pressing means can correct the substrate to a flat surface and form a highly accurate drawing pattern.

The substrate pressing means of the exposure drawing apparatus according to the second aspect is a rotating roller arranged in each of the first direction and the second direction with respect to the exposure region.
Since the substrate is pressed by the rotating roller, the friction with the substrate can be reduced and the warpage of the substrate can be reliably eliminated.
The exposure drawing apparatus of the 3rd viewpoint is provided with the dry film resist in the 2nd viewpoint.

  In the exposure drawing apparatus according to the fourth aspect, in the second or third aspect, when the drawing table moves in the second direction, the rotating roller and the substrate are not in contact with each other.

The substrate pressing means of the exposure drawing apparatus according to the fifth aspect is a gas ejection unit that is arranged in each of the first direction and the second direction with respect to the exposure region and blows gas onto the substrate.
Since the gas is blown to press the substrate, the friction with the substrate can be almost eliminated, and further the warp of the substrate can be eliminated.

  In an exposure drawing apparatus according to a sixth aspect, in the fifth aspect, a liquid resist is applied to the substrate.

  In the exposure drawing apparatus of the seventh aspect, in the fifth or sixth aspect, the pressing by the gas ejection part is determined by adjusting the gas ejection amount or the distance between the gas ejection part and the substrate.

  In the exposure drawing apparatus of the present invention, the substrate in the exposure drawing region is stretched in a planar shape, whereby the substrate is brought into close contact with the exposure drawing table, and the drawing pattern can be accurately formed.

<< first embodiment >>
Below, the exposure drawing apparatus 100 of this invention is demonstrated. FIG. 1 is an overall perspective view of the exposure drawing apparatus 100. However, in order to explain the optical system of the exposure drawing apparatus, a part thereof is cut to show the internal structure.

<Configuration of exposure drawing apparatus 100>
The exposure drawing apparatus 100 is an apparatus that forms a drawing pattern by irradiating the substrate SW coated with a photosensitive material such as a photoresist with ultraviolet light UV. In the exposure drawing apparatus 100, a gate structure 12 is connected to a side surface of the housing bottom 11 based on the housing bottom 11, and two optical systems 20 are installed on the gate structure 12. An exposure drawing unit 30 is disposed between the gate structure units 12. Slides 13 are installed on the front surface of the exposure drawing unit 30, and alignment cameras AC are installed on the slide 13 at two locations. If necessary, the alignment cameras AC can be installed at a plurality of three or more locations to more accurately measure the position of the substrate SW.

  A moving table 15 is installed on the housing bottom 11, the moving table 15 is movable in the X-axis direction and the Y-axis direction of the housing bottom 11, and the substrate SW is placed on the moving table 15. The moving table 15 can move the substrate SW precisely in the X-axis direction and the Y-axis direction of the housing by, for example, linear moving means. The moving table 15 may use not only linear moving means but also moving means constituted by a ball screw, a slide way, a screw driving motor, and the like. Any moving mechanism may be used as long as it can control movement and accurately reflect the current position. The exposure drawing apparatus 100 is controlled by the main control unit 90 and controls the moving table 15, the optical system 20, the exposure drawing unit 30, the alignment camera AC, and the like. The control system of the main control unit 90 will be described later.

  The light source unit 20 includes two light source units 20a having the same internal configuration and a light source unit 20b. Since the light source unit 20a and the light source unit 20b have the same configuration, the light source unit 20a will be described as a representative.

  The light source unit 20a includes a UV lamp 21, a first total reflection mirror 22, a condenser lens 23, a second total reflection mirror 24, a fly-eye lens 25, an elliptical mirror 26, and an aperture (not shown). The light source 20 emits ultraviolet light UV in which various wavelengths from 365 nm to 440 nm are mixed.

  The light source unit 20a emits ultraviolet light UV, which is suitable for exposure drawing from the UV lamp 21, is emitted in the celestial direction (+ Z-axis direction) by the elliptical mirror 26, is changed in the horizontal direction by the first total reflection mirror 22, and is a condenser lens. 23, and the direction is changed to the ground direction (−Z axis direction) by the second total reflection mirror 24. The ultraviolet light UV whose direction is changed enters the exposure drawing unit 30 through the fly-eye lens 25 and the aperture.

  The exposure drawing unit 30 includes a light branching unit 31, a first projection lens 32, a reflection mirror 33, a DMD (direct micro mirror device) element 34, and a second projection lens group 35.

  The ultraviolet light UV incident on the exposure drawing unit 30 becomes a beam branched into four by the light branching unit 31. The beam is further controlled by being incident on eight DMD elements 34 via eight first projection lenses 32 and eight reflection mirrors 33. The controlled beam passes through the eight second projection lens groups 35 to adjust the magnification of the exposure drawing to be projected, and is irradiated onto the substrate SW. That is, the exposure drawing apparatus 100 irradiates the substrate with a predetermined magnification and light quantity by controlling the ultraviolet light UV of the light source unit 20a and the light source unit 20b in accordance with drawing data in which a desired drawing image is stored in advance. be able to. Note that the exposure / drawing apparatus 100 may be provided with a shutter (not shown) in the middle of the passage path of the ultraviolet light UV to control the amount of the ultraviolet light UV or to remove unnecessary ultraviolet light UV.

  The alignment camera AC is movable in the width direction (Y-axis direction) of the substrate SW and moves along the slide 13. The slide camera 13 can move the alignment camera AC in the Y-axis direction so as to image the alignment mark AM of the substrate SW by linear driving or motor driving. The alignment camera AC detects the alignment mark AM of the substrate SW on the first surface and confirms the position of the substrate SW. In this embodiment, the alignment cameras AC are installed at two locations. However, when the drawing pattern of the exposure image of the substrate SW is fine, the alignment camera AM may be increased to three locations or more to narrow the interval between the alignment marks AM. .

<Board fixing means>
The substrate SW conveyed to the exposure drawing apparatus 100 is a thin substrate having a thickness of about 600 mm in the X-axis direction and about 500 mm in the Y-axis direction, and a resist layer is formed so that exposure drawing can be performed with ultraviolet light UV. . In this embodiment, a photosensitive dry film is used for laminating a resist layer on the substrate SW. The photosensitive dry film uses a type in which a resist layer is formed on one side, and the resist layer is not formed on the other side. In the photosensitive dry film, the resist layer side is adhered to the surface of the substrate SW so that the film side comes into contact with the atmosphere. The photosensitive dry film is fixed to the substrate SW by post-heat treatment after bonding.

  The substrate SW to which the resist surface of the photosensitive dry film is bonded is conveyed to a predetermined position of the moving table 15 of the exposure drawing apparatus 100 and is fixed by suction. The suction-fixed substrate SW is transported to the lower part of the gate structure 12 as the moving table 15 moves in the X-axis direction. Under the gate structure 12, the alignment mark AM is detected by the alignment camera AC, and exposure drawing processing is performed.

  FIG. 2 is a diagram showing the configuration of the movement table 15. FIG. 2A shows a cross-sectional configuration diagram of the moving table 15, and FIG. 2B shows a top view of the moving table 15. The surface of the moving table 15 forms a uniform plane, and suction ports 16 for sucking and fixing the substrate SW are installed at a plurality of locations and connected to the suction pipe 17. The moving table 15 is sucked by a suction pump (not shown) from the suction pipe 17 so that the substrate SW placed on the moving table 15 is sucked and fixed by the suction port 16. As shown in FIG. 2B, the suction ports 16 are formed uniformly in a region (indicated by a broken line) on which the substrate SW is placed, and have a structure capable of sucking the substrate SW with a uniform pressure. ing. The moving table 15 may suck the substrate SW by adopting an electrostatic chucking method.

  Since the deformed substrate SW may not be able to be a uniform plane even when the above-described substrate fixing means is used, in this embodiment, the substrate SW is placed within the exposure drawing range immediately below the exposure drawing unit 30. In order to make it uniform, the board | substrate press part 40 is installed.

  FIG. 3 is a top view of the exposure drawing apparatus 100, and shows the arrangement of the substrate pressing unit 40 with the light source unit 20 and the exposure drawing unit 30 removed. FIG. 4 is a perspective view of the substrate pressing portion 40 installed at the lower portion of the gate structure portion 12. The substrate pressing unit 40 is installed between the moving table 15 and the exposure drawing unit 30, and the substrate SW passes between the substrate pressing unit 40 and the moving table 15 in the X-axis direction. Although the substrate SW is fixed by suction, it may be partially warped by several millimeters, so that it is necessary to form a uniform plane by pressing the periphery of the exposure range.

  As shown in FIG. 4, the substrate pressing portion 40 includes a plurality of rollers 41 and a bracket 42 that press the substrate. The bracket 42 is formed of a material that is not easily deformed by heat from the ultraviolet light UV, and the roller 41 is held by a rotating shaft 43 and can freely rotate. The roller 41 includes eight front rollers 41a, nine middle rollers 41b, and eight rear rollers 41c arranged in the order in which the substrate SW is conveyed. The front roller 41a is a front rotating shaft 43a, and the middle roller 41b is The middle rotating shaft 43b and the rear roller 41c are held by the rear rotating shaft 43c. In addition, the roller 41 is horizontally arranged so that the contact surface with the moving table 15 contacts with a uniform pressure in order to form a uniform plane on the substrate. Similarly, the rotary shaft 43 is also arranged horizontally with the moving table 15, and the front rotary shaft 43a and the rear rotary shaft 43c are formed so as to pass through the eight front rollers 41a and the eight rear rollers 41c, respectively. . The middle rotating shaft 43b is formed at nine locations, and supports the nine middle rollers 41b in a cantilever manner. The drawing region 49 of the second projection lens group 35 of the exposure drawing unit 30 is a region surrounded by the front roller 41a, the middle roller 41b, and the rear roller 41c, and a drawing pattern is formed on the substrate SW with ultraviolet light UV. This is the area to draw. The material of the plurality of rollers 41 is preferably resinous so as not to damage the surface of the substrate SW, and may be a normal steel bearing.

  FIG. 5A is a top view showing the drawing region 49 of the exposure drawing unit 30 and is a diagram showing the relationship between the second projection lens group 35 and the substrate pressing unit 40. FIG. 5B is a side view of FIG. The size of the drawing region 49 in the X-axis direction is about 15 mm and about 25 mm in the Y-axis direction.

  The ultraviolet light UV emitted from the eight second projection lens groups 35 includes eight drawing regions 49a, drawing regions 49b, drawing regions 49c, drawing regions 49d, drawing regions 49e, drawing regions 49f, drawing regions 49g, and drawing regions. A drawing pattern can be formed in the drawing area by securing a space of 49h. As shown in FIG. 5A, rollers 41 are arranged around the drawing area 49, and the four rollers 41 press the substrate SW and attract the moving table 15 so that the substrate SW in the drawing area 49 is A uniform plane is maintained.

  FIG. 6 is a diagram showing a path of a drawing area 49 for drawing a drawing pattern on the substrate SW. The exposure drawing unit 30 draws the drawing area 49h from the eight drawing areas 49a by the eight second projection lens groups 35. Since the second projection lens group 35 is installed parallel to the Y-axis direction of the substrate SW, the drawing region 49 relatively moves in the −X-axis direction when the substrate SW moves in the + X-axis direction. In the following, the drawing area 49a will be described as a representative, but the drawing area 49b is similarly moved in the −X-axis direction.

  When the alignment camera AC detects the alignment mark AM1 and alignment mark AM3 on the front end side of the substrate SW, the exposure drawing apparatus 100 starts drawing the drawing area 49a. The drawing area 49a draws a drawing pattern while relatively moving in the arrow AR0 direction (−X axis direction) as the moving table 15 moves in the + X axis direction. When the alignment camera AC detects the alignment mark AM2 and alignment mark AM4 on the rear end side of the substrate SW, the exposure drawing apparatus 100 stops drawing at the rear end of the substrate SW, and the width of the drawing area 49a (Y-axis direction) is reduced. The moving table 15 is moved in the arrow AR1 direction (+ Y-axis direction) by the length. The exposure drawing apparatus 100 starts drawing and moves the moving table 15 in the −X axis direction to draw a drawing pattern while moving relatively in the direction of the arrow AR2 (+ X axis direction). When the alignment camera AC detects the alignment mark AM1 and alignment mark AM3 on the front end side of the substrate SW, the exposure drawing apparatus 100 stops drawing at the front end of the substrate SW, and the width of the drawing area 49a (the Y-axis direction) is the length. The movement table 15 is moved in the direction of the arrow AR3 (+ Y-axis direction) by the amount. The exposure drawing apparatus 100 starts drawing and moves the moving table 15 in the + X-axis direction, thereby drawing a drawing pattern while relatively moving in the arrow AR4 direction (−X-axis direction). When the alignment camera AC detects the alignment mark AM2 and alignment mark AM4 on the rear end side of the substrate SW, the exposure drawing apparatus 100 stops drawing at the rear end of the substrate SW.

  That is, the exposure drawing apparatus 100 can draw the drawing pattern on the entire surface of the substrate SW by reciprocating the movement table 15 twice.

  FIG. 7 is a view showing the vertical drive unit 50 that drives the substrate pressing unit 40. 7A is a top view of the substrate pressing unit 40 and the vertical driving unit 50, and FIG. 7B is a side view of the substrate pressing unit 40 and the vertical driving unit 50.

  The vertical drive unit 50 includes a support part 51, a cylinder part 52, and a connection part 53. The support portion 51 is joined to a lens fixing portion 36 that fixes the second projection lens group 35, and is installed to be vertically downward (−Z axis direction). The substrate pressing part 40 is connected to the bracket 42, the connecting part 53 and the cylinder part 52 of the vertical drive part 50. In the cylinder portion 52, the fixed portion 54 is fixed to the support portion 51, and the moving portion 55 can move vertically along the support portion 51. The vertical drive unit 50 can move the substrate pressing unit 40 vertically by driving the cylinder unit 52. For this reason, the roller 41 of the board | substrate press part 40 can go up and down horizontally with the movement table 15, and can press board | substrate SW uniformly.

  Even if the substrate SW is partially deformed, the exposure / drawing apparatus 100 can keep the drawing region 49 flat by pressing the substrate SW against the uniform plane of the moving table 15 with the roller 41 and attracting and fixing it with the moving table 15. Therefore, the drawing pattern can be drawn accurately. It is desirable that the moving distance of the cylinder portion 52 be correlated with the thickness of the substrate SW, and the height in the Z-axis direction is changed by the stroke of the cylinder portion 52 and a buffer portion (not shown) such as a spring, for example. The pressure applied to the SW can be kept uniform.

<Configuration of control system of exposure drawing apparatus>
FIG. 8 is an overall view of a control system of the exposure drawing apparatus 100. The main control unit 90 of the exposure drawing apparatus 100 controls the table control unit 91, the exposure control unit 92, the light source control unit 93, the substrate pressing control unit 94, the alignment mark observation unit 95, and the raster conversion unit 96.

  The table control unit 91 drives the moving table 15 on which the substrate SW is placed from the main control unit 90 based on the information of the alignment mark observation unit 95 using the X-axis drive unit 61 and the Y-axis drive unit 62. Further, the table control unit 91 acquires the position information of the moving table 15 by the position detection unit 63 and feeds back whether the position is accurate, thereby driving the X-axis drive unit 61 and the Y-axis drive unit 62.

  The light source control unit 93 controls the light source unit 20 according to an instruction from the main control unit 90 and controls the filter and the shutter to emit ultraviolet light UV having a desired wavelength and light amount.

  In response to an instruction from the main control unit 90, the substrate pressing control unit 94 presses the substrate pressing unit 40 to the substrate SW at an appropriate position and pressure during the exposure process.

  The alignment mark observation unit 95 detects the alignment mark AM formed on the substrate SW by the alignment camera AC, detects the deviation of the substrate, and transmits it to the main control unit 90.

  The main control unit 90 performs raster conversion by applying the pattern data 65 of CAD data exposed on the substrate SW to the raster conversion unit 96. The main control unit 90 uses the exposure control unit 92 to generate the bitmap memory 66 of the rasterized drawing data. The exposure control unit 92 uses the bitmap memory 66 to control the exposure drawing unit 30 to convert the ultraviolet light UV from the light source unit 20 into a drawing pattern and expose the substrate SW. By these controls, the exposure drawing apparatus 100 can draw the drawing pattern accurately by setting the substrate to a uniform plane.

  FIG. 9 is a flowchart of exposure drawing control of the exposure drawing apparatus 100. The following will be described with reference to the flowchart.

  In step S <b> 11, the main control unit 90 operates the suction pump by the table control unit 91 to suck and fix the transported substrate SW to the moving table 15. The substrate SW forms a resist layer and is heat-treated.

In step S12, the main control unit 90 drives the Y-axis drive unit 62 of the moving table 15 based on information from the alignment mark observation unit 95, and adjusts the position in the Y-axis direction.
In step S <b> 13, the main control unit 90 drives the X-axis drive unit 61 of the moving table 15 from the information of the alignment mark observation unit 95 to adjust the position in the X-axis direction. The position information of the movement table 15 in the X-axis direction and the Y-axis direction is acquired by the position detection unit 63.

In step S <b> 14, the main control unit 90 drives the vertical drive unit 50 to lower the substrate pressing unit 40.
In step S15, the main control unit 90 controls the contact pressure by adjusting the descending position according to the thickness of the substrate SW by the substrate pressing control unit 94, and presses the roller 41 of the substrate pressing unit 40 against the substrate to flatten the substrate SW. Let me.

  In step S16, the main control unit 90 uses the raster conversion unit 96 to convert the pattern data 65 into the bitmap memory 66, and controls the exposure control unit 92 and the light source control unit 93 to start exposure drawing. The light source control unit 93 controls the light amount and wavelength of the ultraviolet light UV with a shutter, and the exposure control unit 92 converts the ultraviolet light UV incident on the exposure drawing unit 30 to convert it into a drawing pattern. The exposure process is started.

  In step S <b> 17, the main control unit 90 drives the X-axis drive unit 61 of the moving table 15 to move in the X-axis direction (see FIG. 6), thereby matching the position acquired by the position detection unit 63. The pattern is exposed and drawn. The main controller 90 adjusts the precise substrate position while observing the alignment mark AM with the alignment mark observation unit 95.

  In step S <b> 18, the main control unit 90 closes the shutter by the light source control unit 93 to block the light from the light source unit 20 and ends the exposure drawing.

  In step S <b> 19, the main control unit 90 drives the vertical drive unit 50 to raise the substrate pressing unit 40.

  In step S20, the main control unit 90 determines whether the entire surface of the substrate SW has been exposed and drawn. If exposure drawing has not been performed, the process returns to step 12 to adjust the position in the Y-axis direction. If the entire surface is exposed and drawn, the exposure drawing process is terminated.

<< Second Embodiment >>
In the first embodiment, the roller 41 pressurizes the substrate SW placed on the moving table 15 to correct the deformed substrate SW. However, since the roller 41 moves in contact with the substrate SW, the roller 41 is formed on the surface of the substrate SW. There is a possibility that a load is applied to the photosensitive dry film. Further, when the liquid resist is applied to the substrate SW, even if the liquid resist is heat-treated and cured, the resist remains viscous, so that when the roller 41 is pressed, the adhesion between the roller 41 and the resist or the resist The exposure drawing process cannot be performed due to peeling or the like. Therefore, the present embodiment provides an exposure drawing apparatus 100 that can hold a substrate on a uniform plane even when a liquid resist is used.

  The exposure drawing apparatus 100 of this embodiment is provided with a substrate pressing unit 140 that does not use the roller 41. Other than the substrate pressing part 140 is the same as that of the first embodiment, so only the substrate pressing part 140 will be described.

  FIG. 10A is a perspective view of the substrate pressing portion 140, which is partially cut away so that the inside can be easily seen. FIG. 10B is a side view of the vertical drive unit 50 and the substrate pressing unit 140.

  The substrate pressing portion 140 is composed of an air pipe 141 and a bracket 142, and the air pipe 141 is installed in parallel with the major axis direction (Y-axis direction) of the bracket 142. The air pipe 141 has a cylindrical shape with a diameter of about 25 mm and is formed in a tubular shape, and has eight protrusions 143 on the lower surface (−Z-axis direction). By sending compressed air from a suction port 144 of the air pipe 141 by a pump (not shown), the compressed air is discharged from the protruding port 143. Note that not only air but also an inert gas such as nitrogen gas is sent from the pump, thereby reducing the influence of overoxygen on the resist. Further, eight or more protruding openings 143 may be provided.

  After the substrate SW is fixed to the moving table by 15 and then placed at the drawing start position, gas is ejected from the projection port 143, whereby the deformation of the substrate SW is corrected and a uniform plane can be formed.

  The substrate pressing unit 140 drives the vertical drive unit 50 and arranges it at a position where the distance from the substrate SW is several mm.

A space for securing the drawing area of the substrate pressing unit 140 is about 15 mm in the X-axis direction, and a space of about 500 mm corresponding to the entire width of the exposure drawing unit 30 can be formed in the Y-axis direction. For this reason, the exposure control unit can freely move the moving table 15 in the X-axis direction and the Y-axis direction after the substrate pressing unit 140 is disposed about several mm above the substrate SW. There is no need to raise the substrate pressing portion 140 until the drawing process is completed.
In the present embodiment, two cylindrical air pipes 141 are shown, but two pipes incorporating a flat plate may be used.

1 is an overall perspective view of an exposure drawing apparatus 100. FIG. (A) is a block diagram of the cross section of the moving table 15. FIG. 4B is a top view of the moving table 15. 4 is a top view showing a substrate pressing unit 40 arranged in the exposure drawing apparatus 100. FIG. 4 is a perspective view of a substrate pressing unit 40. FIG. FIG. 4A is a top view showing a drawing area 49. FIG. (B) is a side view of (a). It is the figure which showed the path | route of the drawing area | region 49 which draws a drawing pattern on the board | substrate SW. FIG. 4A is a top view of the substrate pressing unit 40 and the vertical drive unit 50. FIG. FIG. 4B is a side view of the substrate pressing unit 40 and the vertical drive unit 50. 2 is an overall view of a control system of the exposure drawing apparatus 100. FIG. 4 is a flowchart of exposure drawing control of the exposure drawing apparatus 100. (A) is a perspective view of the board | substrate press part 140. FIG. FIG. 4B is a side view of the substrate pressing unit 140 and the vertical drive unit 50.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Case bottom part 12 ... Gate structure part 13 ... Slide 15 ... Moving table 16 ... Adsorption port, 17 ... Adsorption piping 20 ... Optical system 21 ... UV lamp 22 ... 1st total reflection mirror, 23 ... Condenser lens 24 ... 2nd Total reflection mirror, 25 ... fly-eye lens, 26 ... elliptical mirror 30 ... exposure drawing section 31 ... light branching section 32 ... first projection lens 33 ... reflection mirror 34 ... DMD element, 35 ... second projection lens group 36 ... lens fixed Part 40 ... Substrate pressing part 41 ... Roller, 42 ... Bracket, 43 ... Rotating shaft 49 ... Drawing area 50 ... Vertical drive part 51 ... Support part 52 ... Cylinder part 53 ... Connection part, 54 ... Fixing part, 55 ... Moving part 61 ... X-axis drive unit, 62 ... Y-axis drive unit 63 ... Position detection unit 90 ... Main control unit 91 ... Table control unit 92 ... Exposure control 93 ... Light source control unit 94 ... Substrate pressing control unit 95 ... Alignment mark observation unit 96 ... Raster converter 100 ... Exposure drawing device, 140 ... Substrate pressing unit 141 ... Air piping, 142 ... Bracket 143 ... Projection port, 144 ... Suction port AC ... Alignment camera, AM ... Alignment mark SW ... Substrate UV ... Ultraviolet light

Claims (7)

A projection optical system that projects ultraviolet light onto the substrate;
A drawing table that mounts the substrate and moves in a first direction and a second direction intersecting the first direction relative to the projection optical system;
Substrate pressing means for pressing the periphery of an exposure area irradiated with the ultraviolet light on the drawing table side;
An exposure drawing apparatus comprising:   2. The exposure drawing apparatus according to claim 1, wherein the substrate pressing unit is a rotating roller disposed in each of the first direction and the second direction with respect to the exposure region.   The exposure drawing apparatus according to claim 2, wherein a dry film resist is provided on the substrate.   4. The exposure drawing apparatus according to claim 2, wherein when the drawing table moves in the second direction, the rotating roller and the substrate are in a non-contact state. 5.   2. The exposure drawing according to claim 1, wherein the substrate pressing unit is a gas ejection unit that is disposed in each of the first direction and the second direction with respect to the exposure region and blows gas to the substrate. apparatus.   6. The exposure drawing apparatus according to claim 5, wherein a liquid resist is applied to the substrate.   The exposure drawing apparatus according to claim 5 or 6, wherein the pressing by the gas ejection part is determined by adjusting an ejection amount of the gas or a distance between the gas ejection part and the substrate.