JP6100484B2 - Conveying apparatus and conveying method - Google Patents

Conveying apparatus and conveying method Download PDF

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JP6100484B2
JP6100484B2 JP2012177119A JP2012177119A JP6100484B2 JP 6100484 B2 JP6100484 B2 JP 6100484B2 JP 2012177119 A JP2012177119 A JP 2012177119A JP 2012177119 A JP2012177119 A JP 2012177119A JP 6100484 B2 JP6100484 B2 JP 6100484B2
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frame
plate
conveying
accommodating
transport
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JP2014036143A (en
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憲吾 穴澤
憲吾 穴澤
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Lintec Corp
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Description

本発明は、板状部材を収容可能な板状部材収容手段を搬送する搬送装置および搬送方法に関する。   The present invention relates to a transport apparatus and a transport method for transporting a plate-shaped member accommodating unit that can accommodate a plate-shaped member.

従来、半導体製造工程において、半導体ウェハ(以下、単にウェハという場合がある)やリングフレーム(フレーム部材)に接着シートを貼付する装置が知られている(例えば、特許文献1参照)。
特許文献1に記載の装置は、複数のウェハが収容されたカセットが載置される板状部材収容手段載置部と、複数のリングフレームが収容され底部にキャスター車輪が設けられたワゴンと、ウェハおよびリングフレームに接着シートを貼付するマウント機構と、板状部材収容手段載置部からマウント機構にウェハを搬送するウェハ搬送機構と、ワゴンからマウント機構にリングフレームを搬送するリングフレーム搬送機構とを備え、ワゴンに収容されたリングフレームを使い切ると、当該ワゴンをシート貼付装置から切り離し、リングフレームを補充して再度シート貼付装置内に配置するように構成されている。
また、ウェハを特許文献1の装置へ搬送する搬送装置として、ウェハが収容されたカセットを工程内で敷設された工程内搬送路を通して搬送先に搬送する構成が知られている(例えば、特許文献2参照)。
2. Description of the Related Art Conventionally, an apparatus for attaching an adhesive sheet to a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) or a ring frame (frame member) in a semiconductor manufacturing process is known (see, for example, Patent Document 1).
The apparatus described in Patent Document 1 includes a plate-like member storage means mounting portion on which a cassette in which a plurality of wafers are stored, a wagon in which a plurality of ring frames are stored and caster wheels are provided at the bottom, A mount mechanism for attaching an adhesive sheet to the wafer and the ring frame, a wafer transport mechanism for transporting the wafer from the plate-like member receiving means mounting portion to the mount mechanism, and a ring frame transport mechanism for transporting the ring frame from the wagon to the mount mechanism; When the ring frame accommodated in the wagon is used up, the wagon is separated from the sheet sticking device, and the ring frame is replenished and placed in the sheet sticking device again.
Further, as a transfer device that transfers a wafer to the apparatus disclosed in Patent Document 1, a configuration is known in which a cassette containing a wafer is transferred to a transfer destination through an in-process transfer path laid in the process (for example, Patent Document 1). 2).

特開2005−33119号公報JP-A-2005-33119 特開2000−68350号公報JP 2000-68350 A

しかしながら、上記特許文献2のカセットを搬送する構成はウェハ用の搬送装置であることから、仮に特許文献2の搬送装置を上記特許文献1に適用したとしても、リングフレームを搬送するワゴンは別途搬送する必要があり、半導体製造工程における製造ラインが大型化したり、オペレータの作業が煩雑となったりするなどの不都合を解消することはできない。
本発明の目的は、装置の構成を簡略化できる搬送装置および搬送方法を提供することである。
また、他の目的は、オペレータの作業が煩雑化することを防止することができる搬送装置および搬送方法を提供することである。
However, since the structure for transporting the cassette of Patent Document 2 is a wafer transport device, even if the transport device of Patent Document 2 is applied to Patent Document 1, the wagon for transporting the ring frame is transported separately. Inconveniences such as an increase in the size of the manufacturing line in the semiconductor manufacturing process and the complexity of the operator's work cannot be solved.
The objective of this invention is providing the conveying apparatus and conveying method which can simplify the structure of an apparatus.
Another object is to provide a transport apparatus and a transport method that can prevent the operator's work from becoming complicated.

前記目的を達成するために、本発明の搬送装置は、板状部材を収容可能な板状部材収容手段または、前記板状部材が接着シートを介して固定されるフレーム部材を収容可能なフレーム収容手段を選択的に支持可能な支持手段と、前記支持手段に支持されたものを判別可能な判別手段と、前記支持手段を搬送可能な搬送手段と、前記搬送手段を誘導する誘導手段とを備え、前記判別手段の判別結果を基にして、前記支持手段で支持した前記板状部材収容手段または前記フレーム収容手段を共通の前記誘導手段を介して目的地に搬送する、という構成を採用している。 In order to achieve the above-mentioned object, the conveying device of the present invention is a frame housing capable of housing a plate-like member housing means capable of housing a plate-like member or a frame member to which the plate-like member is fixed via an adhesive sheet. A support means capable of selectively supporting the means; a determination means capable of determining what is supported by the support means; a transport means capable of transporting the support means; and a guide means for guiding the transport means. , based on the discrimination result of said discriminating means to be conveyed to a destination the plate-like member accommodating means or said frame accommodating means supported by said support means through a common said inductive means, to adopt a structure that Yes.

この際、本発明の搬送装置では、前記誘導手段は、前記搬送手段が走行する搬送路、当該搬送路の一部を当該搬送路から離間した待機位置移動可能な退避手段を備えている、ことが好ましい In this case, the conveying apparatus of the present invention, the guide means, said a conveying path conveying means travels, the part of the conveying path and a retreating means movable to a standby position away from the conveying path It is preferable .

一方、本発明の搬送方法は、板状部材を収容可能な板状部材収容手段または、前記板状部材が接着シートを介して固定されるフレーム部材を収容可能なフレーム収容手段を選択的に支持手段で支持する工程と、前記支持手段に支持されたものを判別する判別工程と、前記支持手段を搬送手段で搬送する搬送工程と、前記搬送手段を誘導手段で誘導する誘導工程とを備え、前記判別工程の判別結果を基にして、支持した前記板状部材収容手段または、前記フレーム収容手段を共通の前記誘導手段を介して目的地に搬送する、という構成を採用している。 On the other hand, the transport method of the present invention selectively supports plate-like member accommodating means capable of accommodating a plate-like member or frame accommodating means capable of accommodating a frame member to which the plate-like member is fixed via an adhesive sheet. A step of supporting by the means, a determination step of determining what is supported by the support means, a conveying step of conveying the supporting means by the conveying means, and a guiding step of guiding the conveying means by the guiding means, wherein based on the determination result of the determination step, the support was the plate-like member accommodating means or to be conveyed to a destination said frame accommodating means via a common said guide means employs the configuration that.

以上のような本発明によれば、搬送手段で搬送される支持手段が、板状部材収容手段とフレーム収容手段との双方を選択的に支持可能としたことで、板状部材収容手段の搬送とフレーム収容手段の搬送との共有化が図れ、装置の構成を簡略化できる。
また、そのような構成を採用することで、オペレータの作業が煩雑化することを防止することができる。
According to the present invention as described above, the support means conveyed by the conveying means can selectively support both the plate-shaped member accommodating means and the frame accommodating means, thereby conveying the plate-shaped member accommodating means. And the conveyance of the frame accommodating means can be shared, and the configuration of the apparatus can be simplified.
Further, by adopting such a configuration, it is possible to prevent the operator's work from becoming complicated.

また、誘導手段が搬送路を備えた場合、退避手段を設けることで、搬送手段を搬送先の近傍で退避させえておくことができ、搬送先の要求に対して即座に板状部材収容手段またはフレーム収容手段を搬送することができる。
さらに、判別手段を設けることで、板状部材収容手段またはフレーム収容手段を間違えた搬送先に搬送してしまうことを防止することができる。
In addition, when the guiding means includes a conveyance path, by providing the retraction means, the conveyance means can be retreated in the vicinity of the conveyance destination, and the plate-like member accommodating means or the The frame accommodating means can be transported.
Furthermore, by providing the discriminating means, it is possible to prevent the plate-shaped member accommodating means or the frame accommodating means from being conveyed to the wrong conveying destination.

本発明の実施形態に係る搬送装置を示す概略平面図。The schematic plan view which shows the conveying apparatus which concerns on embodiment of this invention. 図1に示す搬送装置の部分側面図。The partial side view of the conveying apparatus shown in FIG. 図1に示す搬送装置の部分正面図。The partial front view of the conveying apparatus shown in FIG.

以下、本発明の実施形態に係る搬送装置を図面に基づいて説明する。
なお、本明細書におけるX軸、Y軸、Z軸は、それぞれが直交する関係にあり、X軸及びY軸は、水平面内の軸とし、Z軸は、水平面に直交する軸とする。さらに、本実施形態では、Y軸と平行な図1の矢印AR方向から観た場合を基準とし、方向を示した場合、「上」がZ軸の矢印方向で「下」がその逆方向、「左」がX軸の矢印方向で「右」がその逆方向、「前」がY軸の矢印方向で「後」がその逆方向とする。
Hereinafter, a transport device according to an embodiment of the present invention will be described with reference to the drawings.
Note that the X axis, Y axis, and Z axis in this specification are orthogonal to each other, the X axis and Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Further, in the present embodiment, when viewed from the direction of the arrow AR in FIG. 1 parallel to the Y axis, when the direction is indicated, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

以下に、本発明の実施形態に係る搬送装置を図1乃至3に基づいて説明する。
搬送装置1は、板状部材としてのウェハWFを収容する板状部材収容手段2と、ウェハWFが図示しない接着シートを介して固定されるフレーム部材としてのリングフレームRFを収容可能なフレーム収容手段3とを所定の処理を施す処理装置に搬送する装置であり、板状部材収容手段2またはフレーム収容手段3を選択的に支持可能な支持手段10と、支持手段10を搬送可能な搬送手段20と、搬送手段20を誘導する誘導手段30と、支持手段10に支持された板状部材収容手段2またはフレーム収容手段3を判別可能な判別手段40と、板状部材収容手段2またはフレーム収容手段3を昇降可能な載置手段50とを備えている。
Below, the conveying apparatus which concerns on embodiment of this invention is demonstrated based on FIG.
The transfer apparatus 1 includes a plate-like member accommodating means 2 that accommodates a wafer WF as a plate-like member, and a frame accommodating means that can accommodate a ring frame RF as a frame member to which the wafer WF is fixed via an adhesive sheet (not shown). 3 is conveyed to a processing apparatus for performing a predetermined process. The supporting means 10 can selectively support the plate-like member accommodating means 2 or the frame accommodating means 3, and the conveying means 20 capable of conveying the supporting means 10. A guiding means 30 for guiding the conveying means 20, a discriminating means 40 capable of discriminating the plate-like member accommodating means 2 or the frame accommodating means 3 supported by the supporting means 10, and the plate-like member accommodating means 2 or the frame accommodating means. 3 and a mounting means 50 capable of moving up and down.

板状部材収容手段2は、表面に図示しない保護シートが貼付されたウェハWFを上下方向に多段に収容可能なウェハカセットWCと、ウェハカセットWCの上面に設けられ、左右両面に側方係合部WC1が設けられるとともに、後面に後方係合部WC2が設けられた把持部WC3とを備えている。
フレーム収容手段3は、リングフレームRFを上下方向に多段に収容可能なフレームカセットFCと、把持部WC3と同様にフレームカセットFCの上面に設けられ、左右両面に側方係合部FC1が設けられるとともに、後面に後方係合部FC2が設けられた把持部FC3とを備えている。
The plate-like member accommodation means 2 is provided on the upper surface of the wafer cassette WC, which can accommodate wafers WF having a protective sheet (not shown) attached to the surface in multiple stages in the vertical direction, and is laterally engaged on both the left and right sides. A portion WC1 is provided, and a gripping portion WC3 having a rear engagement portion WC2 on the rear surface is provided.
The frame accommodating means 3 is provided on the upper surface of the frame cassette FC, similarly to the grip portion WC3, and the side engaging portions FC1 are provided on both the left and right sides. In addition, a gripping portion FC3 having a rear engagement portion FC2 provided on the rear surface is provided.

支持手段10は、フレーム11と、フレーム11の左右両側に設けられたブラケット12に回転可能に支持されるとともに、側方係合部WC1,FC1に係脱可能な略L字状のフック13と、フレーム11に支持されるとともに、フック13を回転駆動する駆動機器である回動モータ14とを備えている。   The support means 10 is rotatably supported by a frame 11 and brackets 12 provided on the left and right sides of the frame 11, and a substantially L-shaped hook 13 that can be engaged with and disengaged from the side engaging portions WC1 and FC1. And a rotation motor 14 that is supported by the frame 11 and is a driving device that rotationally drives the hook 13.

搬送手段20は、複数の搬送体21を備え、各搬送体21は、上部開放型のCチャンネル形状のフレーム22と、フレーム22のリップ部221の下部4箇所に設けられた上部ローラ23と、フレーム22のウェブ部222の上部2箇所に設けられた下部ローラ24と、左側の下部ローラ24を回転駆動する駆動機器としての駆動モータ25と、当該搬送体21が搬送しているものや搬送している位置、当該搬送体21の搬送速度など、搬送体21による搬送状況を各処理装置および他の手段(支持手段10、誘導手段30、判別手段40、載置手段50)との間で通信可能な通信手段26と、搬送体21同士の接触を防止する光学センサや音波センサ等の図示しない検知手段とを備えている。
なお、各処理装置および他の手段には、各搬送体21の通信手段26と通信可能な図示しない通信手段が設けられ、各搬送体21と各処理装置と他の手段とは、それぞれが図示しない制御手段で動作が制御される。また、処理装置としては、板状部材収容手段2を搬入するベルトコンベヤやローラコンベヤなどのウェハ搬入手段4、フレーム収容手段3を搬入するベルトコンベヤやローラコンベヤなどのフレーム搬入手段5、図示しない接着シートをウェハWFおよびリングフレームRFに貼付してそれらを一体化する貼付装置6(6A,6B)、ウェハWFに貼付されている図示しない保護シートを剥離する剥離装置7(7A,7B)、ウェハWFを切断して個片化する加工装置8(8A,8B)、個片化されたウェハWFを基板等にボンディングするボンディング装置9(9A,9B)、空の板状部材収容手段2を搬出するベルトコンベヤやローラコンベヤなどのウェハカセット搬出手段10A、空のフレーム収容手段を搬出するベルトコンベヤやローラコンベヤなどのフレームカセット搬出手段10B等が例示できる。
The transport means 20 includes a plurality of transport bodies 21, and each transport body 21 includes an upper open-type C-channel frame 22, upper rollers 23 provided at four positions below the lip 221 of the frame 22, and A lower roller 24 provided at two upper portions of the web portion 222 of the frame 22, a drive motor 25 as a driving device that rotationally drives the lower left roller 24, and what the transport body 21 is transporting or transporting. The status of conveyance by the conveyance body 21 such as the position of the conveyance body 21 and the conveyance speed of the conveyance body 21 are communicated with each processing apparatus and other means (support means 10, guidance means 30, determination means 40, placement means 50). A possible communication means 26 and a detection means (not shown) such as an optical sensor and a sound wave sensor for preventing contact between the carriers 21 are provided.
In addition, each processing apparatus and other means are provided with communication means (not shown) that can communicate with the communication means 26 of each transport body 21, and each transport body 21, each processing apparatus, and other means are illustrated. The operation is controlled by the control means that does not. The processing apparatus includes a wafer carrying means 4 such as a belt conveyor or a roller conveyor for carrying the plate-like member containing means 2, a frame carrying means 5 such as a belt conveyor or a roller conveyor for carrying the frame containing means 3, an unillustrated adhesive. Affixing device 6 (6A, 6B) for affixing the sheet to wafer WF and ring frame RF and integrating them, peeling device 7 (7A, 7B) for peeling off a protective sheet (not shown) affixed to wafer WF, wafer Processing device 8 (8A, 8B) for cutting WF into individual pieces, bonding device 9 (9A, 9B) for bonding individual wafers WF to a substrate or the like, and empty plate-shaped member accommodating means 2 are carried out. Wafer cassette carrying means 10A, such as a belt conveyor or roller conveyor, and a belt conveyor Frame cassette unloading means 10B or the like of such Rakonbeya can be exemplified.

誘導手段30は、天井CLに設けられたスペーサCL1に敷設されて搬送体21が走行する搬送路31と、当該搬送路31と当該搬送路31から離間した待機位置WP(図3参照)との間で搬送体21を移動可能な退避手段32とを備えている。
搬送路31は、断面視横向きH形状に設けられ、下側の下フランジ部310が搬送体21の上部ローラ23と下部ローラ24とで挟み込まれ、搬送体21を所定の位置に誘導可能に設けられている。なお、各処理装置における板状部材収容手段載置部(貼付装置6では付番61で示す位置)および、フレーム収容手段載置部(貼付装置6では付番62、剥離装置7では付番72、加工装置8では付番82、ボンディング装置9では付番92で示す位置)の上部に相当する搬送路31には、切欠部312が形成されている。
退避手段32は、搬送路31の各切欠部312に位置し、天井CLに設けられた駆動機器であるリニアモータ321と、リニアモータ321のスライダ322に設けられたレール支持板323と、搬送路31と同様の断面視横向きH形状に設けられてレール支持板323の下面に設けられた搬送レール324と退避レール325とを備えている。搬送レール324および退避レール325は、搬送路31の切欠部312の長さよりやや短い長さに設定され、切欠部312内に位置して搬送路31を繋ぎ、搬送体21の走行を許容可能に設けられている。
The guiding means 30 includes a conveyance path 31 that is laid on a spacer CL1 provided on the ceiling CL and travels by the conveyance body 21, and a standby position WP (see FIG. 3) that is separated from the conveyance path 31 and the conveyance path 31. The retraction means 32 which can move the conveyance body 21 between is provided.
The conveyance path 31 is provided in an H shape in the horizontal direction in cross section, and the lower flange portion 310 on the lower side is sandwiched between the upper roller 23 and the lower roller 24 of the conveyance body 21 so that the conveyance body 21 can be guided to a predetermined position. It has been. In addition, in each processing apparatus, the plate-shaped member accommodating means placing portion (position indicated by number 61 in the pasting device 6) and the frame accommodating means placing portion (number 62 in the pasting device 6 and number 72 in the peeling device 7). A notch 312 is formed in the conveying path 31 corresponding to the upper portion of the processing device 8 with a number 82 and a position indicated with a number 92 in the bonding device 9.
The retracting means 32 is located at each notch 312 of the conveyance path 31 and is a linear motor 321 which is a driving device provided on the ceiling CL, a rail support plate 323 provided on the slider 322 of the linear motor 321, and the conveyance path. 31 is provided with a transport rail 324 and a retreat rail 325 which are provided in an H shape in the cross sectional view similar to FIG. 31 and provided on the lower surface of the rail support plate 323. The conveyance rail 324 and the retraction rail 325 are set to have a length slightly shorter than the length of the notch 312 of the conveyance path 31, and are located in the notch 312 to connect the conveyance path 31 and allow the conveyance body 21 to travel. Is provided.

判別手段40は、上面が搬送体21のフレーム22の下面に支持され、下面で支持手段10のフレーム11を支持するロードセル41からなり、重量を計測することで支持手段10が支持しているものが何なのかを判別可能となっている。判別するものとしては、ウェハWFを収容している板状部材収容手段2、ウェハWFを収容していない板状部材収容手段2、リングフレームRFを収容しているフレーム収容手段3、リングフレームRFを収容していないフレーム収容手段3、図示しない接着シートを介してリングフレームRFと一体化されたウェハWF(以降「一体物」という)のウェハWFに図示しない保護シートが貼付されて収容されたフレーム収容手段3、ウェハWFから保護シートが剥離された一体物が収容されたフレーム収容手段3、ウェハWFが個片化された一体物が収容されたフレーム収容手段3等を判別できるようになっている。   The discriminating means 40 is composed of a load cell 41 whose upper surface is supported on the lower surface of the frame 22 of the carrier 21 and which supports the frame 11 of the support means 10 on the lower surface, and is supported by the support means 10 by measuring the weight. It is possible to determine what is. The discriminating means includes a plate-like member accommodating means 2 that accommodates the wafer WF, a plate-like member accommodating means 2 that does not accommodate the wafer WF, a frame accommodating means 3 that accommodates the ring frame RF, and a ring frame RF. And a protective sheet (not shown) attached to the wafer WF of the wafer WF integrated with the ring frame RF (not shown) through an adhesive sheet (not shown). The frame accommodating means 3, the frame accommodating means 3 in which the integrated object with the protective sheet peeled off from the wafer WF is accommodated, the frame accommodating means 3 in which the integrated object in which the wafer WF is separated into individual pieces, and the like can be discriminated. ing.

載置手段50は、天井CLに設けられた支持フレームCL2に支持された駆動機器であるリニアモータ51と、リニアモータ51のスライダ52に支持され、後方係合部WC2,FC2に係脱可能な出力軸53を有する駆動機器である直動モータ54とを備え、支持手段10と各処理装置における板状部材収容手段載置部61、フレーム収容手段載置部62、72、82、92、またはウェハ搬入手段4、フレーム搬入手段5、ウェハカセット搬出手段10A、フレームカセット搬出手段10Bとの間で、板状部材収容手段2またはフレーム収容手段3を受け渡し可能に設けられている。   The mounting means 50 is supported by a linear motor 51 that is a driving device supported by a support frame CL2 provided on the ceiling CL, and a slider 52 of the linear motor 51, and can be engaged with and disengaged from the rear engagement portions WC2 and FC2. A linear motion motor 54 that is a drive device having an output shaft 53, and the support member 10 and the plate-like member accommodating means placing portion 61, the frame accommodating means placing portions 62, 72, 82, 92 in each processing apparatus, or The plate-like member accommodation means 2 or the frame accommodation means 3 can be delivered between the wafer carry-in means 4, the frame carry-in means 5, the wafer cassette carry-out means 10A, and the frame cassette carry-out means 10B.

次に、上記実施形態における搬送装置1の動作について図面を参照して説明する。
先ず、図1に示すように、複数(N個:Nは自然数)の搬送体21が全て搬送路31の待機領域311に位置した状態で、左端に位置する搬送体21から右方向へ順番に第1搬送体211、第2搬送体212(中省略)・・・第N搬送体21Nと称することとする。
そして、貼付装置6A,6Bが図示しない通信手段を介して板状部材収容手段2とフレーム収容手段3とを要求する要求信号を出力すると、図示いない制御手段が各手段(支持手段10、搬送手段20、誘導手段30、判別手段40、載置手段50)に各指令を出力する。すると、搬送手段20が第1搬送体211の回動モータ14を駆動し、フレーム搬入手段5がリングフレームRFを収容したフレーム収容手段3を搬入するフレーム搬入位置5Aの上方に第1搬送体211を移動させる。
Next, operation | movement of the conveying apparatus 1 in the said embodiment is demonstrated with reference to drawings.
First, as shown in FIG. 1, a plurality (N: N is a natural number) of the transport bodies 21 are all positioned in the standby area 311 of the transport path 31, and sequentially from the transport body 21 located at the left end in the right direction. The 1st conveyance body 211, the 2nd conveyance body 212 (omission omitted) ... Let it call the Nth conveyance body 21N.
When the sticking devices 6A and 6B output request signals for requesting the plate-like member housing means 2 and the frame housing means 3 via communication means (not shown), the control means (not shown) controls each means (support means 10, transport means). 20, each command is output to the guiding means 30, the discriminating means 40, and the placing means 50). Then, the transport means 20 drives the rotation motor 14 of the first transport body 211, and the first transport body 211 is located above the frame carry-in position 5A where the frame carry-in means 5 carries the frame housing means 3 housing the ring frame RF. Move.

そして、フレーム搬入位置5Aに対応する載置手段50が以下の上昇動作を行う。すなわち、載置手段50がリニアモータ51を駆動し、スライダ52を下方に移動させた後、直動モータ54を駆動し、出力軸53を前進させてフレーム収容手段3の後方係合部FC2に係合させた後、リニアモータ51を駆動し、スライダ52を所定位置まで上昇させる。次いで、支持手段10が回動モータ14を駆動し、一対のフック13の先端をフレーム収容手段3の側方係合部FC1にそれぞれ係合させた後、載置手段50が直動モータ54を駆動し、出力軸53を後退させることで、支持手段10がフレーム収容手段3を支持した状態となる(以下「上昇動作」という)。この状態において、第1搬送体211の判別手段40が以下の判別動作を開始する。すなわち、判別手段40がロードセル41を駆動し、重量を計測することで支持手段10が支持したものが何なのかの判別を行う(以降「判別動作という」)。この判別動作により、要求されたものと違う収容物が収容された板状部材収容手段2やフレーム収容手段3を要求された場所に供給してしまうことを防止できる。この場合、フレーム収容手段3を支持したことを検出し、通信手段26を介してその情報を図示しない制御手段に出力し、制御手段が第1搬送体211で支持しているものがフレーム収容手段3であることを認識する。
その後、搬送手段20が第1搬送体211の駆動モータ25を動作し、フレーム収容手段載置部62の上方で切欠部312内に位置して搬送路31を繋いでいる退避レール325内の所定位置で、当該第1搬送体211が停止するように駆動モータ25の駆動を停止する。
And the mounting means 50 corresponding to the frame carrying-in position 5A performs the following raising operation. That is, after the mounting means 50 drives the linear motor 51 and moves the slider 52 downward, the linear motion motor 54 is driven and the output shaft 53 is advanced to the rear engagement portion FC2 of the frame housing means 3. After the engagement, the linear motor 51 is driven to raise the slider 52 to a predetermined position. Next, after the support means 10 drives the rotation motor 14 and the tips of the pair of hooks 13 are engaged with the side engaging portions FC1 of the frame accommodating means 3, the mounting means 50 causes the linear motion motor 54 to move. By driving and retreating the output shaft 53, the support means 10 is in a state of supporting the frame accommodating means 3 (hereinafter referred to as "lifting operation"). In this state, the determination unit 40 of the first transport body 211 starts the following determination operation. That is, the determination unit 40 drives the load cell 41 and measures the weight to determine what is supported by the support unit 10 (hereinafter referred to as “determination operation”). By this determination operation, it is possible to prevent the plate-like member accommodation means 2 and the frame accommodation means 3 in which the different contents from those requested are supplied from being supplied to the requested location. In this case, it is detected that the frame accommodating means 3 is supported, and the information is output to the control means (not shown) via the communication means 26, and what is supported by the first conveying body 211 by the control means is the frame accommodating means. 3 is recognized.
Thereafter, the transport unit 20 operates the drive motor 25 of the first transport body 211, and is located in the notch portion 312 above the frame housing unit mounting portion 62 and is connected to the transport rail 31 in the retreat rail 325. At the position, the drive of the drive motor 25 is stopped so that the first transport body 211 stops.

次いで、フレーム収容手段載置部62に対応する載置手段50が以下の下降動作を行う。すなわち、載置手段50がリニアモータ51を駆動し、スライダ52を上方に移動させた後、直動モータ54を駆動し、出力軸53を前進させて後方係合部、この場合はフレーム収容手段3の後方係合部FC2に係合させる。そして、支持手段10が回動モータ14を駆動し、一対のフック13の先端を側方係合部、この場合はフレーム収容手段3の側方係合部FC1から離脱させる。次いで、載置手段50がリニアモータ51を駆動し、スライダ52を所定位置まで下降させた後、直動モータ54を駆動し、出力軸53を後退させることで、所定の位置、この場合は貼付装置6Bのフレーム収容手段載置部62上にフレーム収容手段3を載置する(以降「下降動作」という)。
なお、フレーム収容手段3を支持手段10から載置手段50に渡した後、フレーム収容手段載置部62に対応する退避手段32が以下の退避動作を行う。すなわち、退避手段32がリニアモータ321を駆動し、搬送レール324で搬送路31を繋ぐようにレール支持板323を移動させ、退避レール325で支持した搬送体21、この場合は第1搬送体211を搬送路31から離間した待機位置WPに退避させる(以降「退避動作」という。なお、退避レール325で搬送路31を繋ぐようにレール支持板323を移動させる動作を「反退避動作」という)。これにより、貼付装置6Bへのフレーム収容手段3の搬送が終了する。
Next, the placing means 50 corresponding to the frame accommodating means placing portion 62 performs the following lowering operation. That is, after the mounting means 50 drives the linear motor 51 and moves the slider 52 upward, the linear motion motor 54 is driven and the output shaft 53 is advanced to move the rear engaging portion, in this case, the frame accommodating means. 3 is engaged with the rear engagement portion FC2. Then, the support means 10 drives the rotation motor 14 to disengage the tips of the pair of hooks 13 from the side engaging portions, in this case, the side engaging portions FC1 of the frame housing means 3. Next, after the mounting means 50 drives the linear motor 51 and lowers the slider 52 to a predetermined position, the linear motion motor 54 is driven and the output shaft 53 is moved backward, so that the predetermined position, in this case, affixing is performed. The frame accommodating means 3 is placed on the frame accommodating means placing portion 62 of the apparatus 6B (hereinafter referred to as “lowering operation”).
After the frame accommodating means 3 is transferred from the support means 10 to the placing means 50, the retracting means 32 corresponding to the frame accommodating means placing portion 62 performs the following retracting operation. That is, the retracting means 32 drives the linear motor 321, moves the rail support plate 323 so as to connect the transport path 31 by the transport rail 324, and supports the transport body 21 supported by the retract rail 325, in this case, the first transport body 211. Is retracted to a standby position WP separated from the conveyance path 31 (hereinafter referred to as “retraction operation”. The operation of moving the rail support plate 323 so as to connect the conveyance path 31 with the retraction rail 325 is referred to as “anti-retraction operation”). . Thereby, conveyance of the frame accommodating means 3 to the sticking device 6B is completed.

なお、第1搬送体211が待機領域311から移動する時点または少し遅れて、第2搬送体212が上述と同様にして搬送され、ウェハ搬入手段4がウェハWFを収容した板状部材収容手段2を搬入するウェハ搬入位置4Aの上方で停止し、ウェハ搬入位置4Aに対応する載置手段50が上昇動作を行い板状部材収容手段2を支持し、支持した板状部材収容手段2は、貼付装置6Bの板状部材収容手段載置部61に対応する載置手段50が下降動作を行うことにより、当該板状部材収容手段載置部61上に載置される。なお、第2搬送体212は、板状部材収容手段載置部61に対応する退避手段32の退避動作により待機位置WPに退避し、貼付装置6Bへの板状部材収容手段2の搬送が終了する。
そして、上述と同様にして、第3および第4搬送体213、214により貼付装置6Aへのフレーム収容手段3および板状部材収容手段2の搬送が終了し、第3および第4搬送体213、214は、貼付装置6Aのフレーム収容手段載置部62および板状部材収容手段載置部61に対応する退避手段32の退避動作によりそれぞれ待機位置WPに退避する。
In addition, when the 1st conveyance body 211 moves from the waiting | standby area | region 311 or a little behind, the 2nd conveyance body 212 is conveyed similarly to the above, and the plate-shaped member accommodation means 2 in which the wafer carrying-in means 4 accommodated the wafer WF was received. Is stopped above the wafer carry-in position 4A, and the mounting means 50 corresponding to the wafer carry-in position 4A performs the ascending operation to support the plate-shaped member accommodating means 2, and the supported plate-shaped member accommodating means 2 is affixed. The mounting means 50 corresponding to the plate-shaped member accommodating means placing portion 61 of the apparatus 6B is placed on the plate-shaped member accommodating means placing portion 61 by performing a lowering operation. The second transport body 212 is retracted to the standby position WP by the retracting operation of the retracting means 32 corresponding to the plate-shaped member accommodating means placing portion 61, and the transport of the plate-shaped member accommodating means 2 to the pasting device 6B is completed. To do.
Then, in the same manner as described above, the conveyance of the frame accommodating means 3 and the plate-shaped member accommodating means 2 to the pasting device 6A is finished by the third and fourth conveying bodies 213, 214, and the third and fourth conveying bodies 213, 214 is retracted to the standby position WP by the retracting operation of the retracting means 32 corresponding to the frame accommodating means placing portion 62 and the plate-like member accommodating means placing portion 61 of the sticking device 6A.

そして、貼付装置6A,6Bでは、板状部材収容手段2およびフレーム収容手段3からそれぞれウェハWFおよびリングフレームRFがそれぞれ1枚ずつ取り出され、図示しない接着シートを介してリングフレームRFとウェハWFとが一体化され一体物が形成され、当該一体物は貼付装置6A,6Bに載置されているフレーム収容手段3に収納される。
ここで、例えば、貼付装置6Bにおけるフレーム収容手段3が一体物で一杯になる時期に差しかかると、貼付装置6Bが図示しない通信手段を介してフレーム収容手段3を要求する信号を出力し、図示いない制御手段が各手段に各指令を出力する。すると、貼付装置6Bのフレーム収容手段載置部62に対応する退避手段32が反退避動作を行った後、載置手段50が上昇動作を行うことで、一体物を収容したフレーム収容手段3を第1搬送体211が支持し、当該第1搬送体211の判別手段40が判別動作を行う。さらに、第5搬送体215が新たなリングフレームRFが収容されたフレーム収容手段3を上述と同様にして搬送し、当該新たなリングフレームRFが収容されたフレーム収容手段3を上述と同様にして貼付装置6Bのフレーム収容手段載置部62に載置し、上記同様の動作が行われる。なお、第5搬送体215が貼付装置6Bに搬送されるときは、各切欠部312に搬送レール324が位置して搬送路31を繋いでいるので、退避中の第2、第3、第4搬送体212、213、214によってその搬送が阻害されることはない。また、場合によっては、搬送中の第N搬送体21Nが搬送路31上に位置する他の第N搬送体21Nと接触する場合があるが、本実施形態の場合、図示しない検知手段によって搬送体21同士が接触することはない。
なお、一体物を収容したフレーム収容手段3は、第1搬送体211の搬送と、上昇動作、判別動作、下降動作、退避動作および反退避動作が繰り返され、剥離装置7(7A,7B)でウェハWFに貼付されている図示しない保護シートが剥離され、加工装置8(8A,8B)でウェハWFが個片化され、ボンディング装置9(9A,9B)で個片化されたウェハWFが基板等にボンディングされ、最終的にフレームカセット搬出手段10B上に載置され外部へ搬出される。その後、第1搬送体211は、待機領域311に帰還する。
Then, in the attaching devices 6A and 6B, one wafer WF and one ring frame RF are respectively taken out from the plate-like member accommodating means 2 and the frame accommodating means 3, respectively, and the ring frame RF and the wafer WF are connected via an adhesive sheet (not shown). Are integrated to form an integrated object, and the integrated object is stored in the frame storing means 3 mounted on the attaching devices 6A and 6B.
Here, for example, when it comes to a time when the frame accommodating means 3 in the sticking device 6B is filled with an integrated object, the sticking device 6B outputs a signal requesting the frame accommodating means 3 via a communication means (not shown). The control means that does not output each command to each means. Then, after the retracting means 32 corresponding to the frame accommodating means placing portion 62 of the sticking device 6B performs the anti-retreat operation, the placing means 50 performs the ascending operation, so that the frame accommodating means 3 that accommodates the integral object is removed. The first conveyance body 211 supports, and the determination unit 40 of the first conveyance body 211 performs a determination operation. Further, the fifth carrier 215 conveys the frame accommodating means 3 in which the new ring frame RF is accommodated in the same manner as described above, and the frame accommodating means 3 in which the new ring frame RF is accommodated in the same manner as described above. It mounts on the frame accommodating means mounting part 62 of the sticking device 6B, and the same operation as described above is performed. In addition, when the 5th conveyance body 215 is conveyed by the sticking apparatus 6B, since the conveyance rail 324 is located in each notch part 312 and has connected the conveyance path 31, it is 2nd, 3rd, 4th currently retracting. The conveyance is not obstructed by the conveyance bodies 212, 213, and 214. In some cases, the N-th transport body 21N being transported may come into contact with another N-th transport body 21N located on the transport path 31, but in this embodiment, the transport body is detected by a detection unit (not shown). 21 does not contact each other.
The frame accommodating means 3 that accommodates the integral object repeats the conveyance of the first conveyance body 211, the ascending operation, the determining operation, the descending operation, the retreating operation, and the anti-retreating operation, and the peeling device 7 (7A, 7B). A protective sheet (not shown) attached to the wafer WF is peeled off, the wafer WF is separated into pieces by the processing apparatus 8 (8A, 8B), and the wafer WF separated into pieces by the bonding apparatus 9 (9A, 9B) is the substrate. Are finally mounted on the frame cassette unloading means 10B and unloaded to the outside. Thereafter, the first transport body 211 returns to the standby area 311.

また、例えば、貼付装置6Bにおける板状部材収容手段2からウェハWFが全て取り出される時期に差し掛かると、貼付装置6Bが図示しない通信手段を介して板状部材収容手段2を要求する信号を出力し、図示いない制御手段が各手段に各指令を出力する。すると、貼付装置6Bの板状部材収容手段載置部61に対応する退避手段32が反退避動作を行った後、載置手段50が上昇動作を行うことで、空の板状部材収容手段2を第2搬送体212が支持し、当該第2搬送体212の判別手段40が判別動作を行う。さらに、第6搬送体216が新たなウェハWFが収容された板状部材収容手段2を上述と同様にして搬送し、当該新たなウェハWFが収容された板状部材収容手段2を上述と同様にして貼付装置6Bの板状部材収容手段載置部61に載置し、上記同様の動作が行われる。なお、ウェハWFが全て取り出され空になった板状部材収容手段2は、第2搬送体212の搬送と下降動作により、ウェハカセット搬出手段10A上に載置され外部へ搬出される。その後、第2搬送体212は、待機領域311に帰還する。   Further, for example, when it is time to take out all the wafers WF from the plate-like member housing means 2 in the pasting device 6B, the pasting device 6B outputs a signal requesting the plate-like member housing means 2 via a communication means (not shown). Then, control means (not shown) outputs each command to each means. Then, after the retracting means 32 corresponding to the plate-shaped member accommodating means placing portion 61 of the sticking device 6B performs the anti-retreat operation, the placing means 50 performs the ascending operation, so that the empty plate-shaped member accommodating means 2 is operated. Is supported by the second transport body 212, and the determination means 40 of the second transport body 212 performs a determination operation. Further, the sixth transport body 216 transports the plate-shaped member accommodating means 2 in which the new wafer WF is accommodated in the same manner as described above, and the plate-shaped member accommodating means 2 in which the new wafer WF is accommodated is similar to the above. Then, it is placed on the plate-like member accommodating means placing portion 61 of the sticking device 6B, and the same operation as described above is performed. The plate-shaped member accommodating means 2 that has been emptied after the entire wafer WF has been taken out is placed on the wafer cassette carrying means 10A and carried outside by the carrying and lowering operations of the second carrier 212. Thereafter, the second transport body 212 returns to the standby area 311.

以上のような一実施形態によれば、次のような効果がある。
すなわち、搬送体21が、板状部材収容手段2とフレーム収容手段3との双方を支持可能としたことで、1つの搬送路31で板状部材収容手段2とフレーム収容手段3とを搬送でき、搬送装置1の装置構成を簡略化できる。
According to the embodiment as described above, the following effects are obtained.
That is, since the transport body 21 can support both the plate-shaped member accommodating means 2 and the frame accommodating means 3, the plate-shaped member accommodating means 2 and the frame accommodating means 3 can be conveyed by one conveying path 31. The apparatus configuration of the transfer apparatus 1 can be simplified.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質等を限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質等の限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれるものである。   As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

例えば、本発明は、上記実施形態のように、各処理装置として貼付装置6、剥離装置7、加工装置8、ボンディング装置9、ウェハカセット搬出手段10Aおよびフレームカセット搬出手段10Bが配置された場合の搬送装置に限られるものではなく、他の装置が配置された場合でもよいし、またそれらの設置台数も適宜変更できる。   For example, in the present invention, the pasting device 6, the peeling device 7, the processing device 8, the bonding device 9, the wafer cassette unloading means 10A, and the frame cassette unloading means 10B are arranged as each processing apparatus as in the above embodiment. The present invention is not limited to the transfer device, and other devices may be arranged, and the number of installed devices can be changed as appropriate.

さらに、板状部材として半導体ウェハWFである場合を示したが、板状部材は半導体ウェハWFに限定されるものではなく、ガラス板、鋼板、または、樹脂板、基板、光ディスク等、その他の板状部材も対象とすることができ、半導体ウェハWFは、シリコンウェハや化合物ウェハ等が例示できる。   Furthermore, although the case where it was the semiconductor wafer WF was shown as a plate-shaped member, a plate-shaped member is not limited to the semiconductor wafer WF, Other plates, such as a glass plate, a steel plate, or a resin plate, a board | substrate, an optical disk, etc. Shaped members can also be targeted, and examples of the semiconductor wafer WF include a silicon wafer and a compound wafer.

また、支持手段10は、吸引、磁着、ねじによる螺着等によって板状部材収容手段2やフレーム収容手段3を支持するようにしてもよい。
さらに、判別手段は、板状部材収容手段2およびフレーム収容手段3に着色したりマークを施したりしたものを対象とし、それを撮像手段で撮像したり、光学センサ、接触センサ、圧力センサ、エリアセンサ等で検知して判別するようにしてもよい。
また、通信手段26に所謂GPS(Global Positioning System)機能や位置センサ等の機能を追加してもよい。
Further, the support means 10 may support the plate-like member accommodation means 2 and the frame accommodation means 3 by suction, magnetic attachment, screwing with screws, or the like.
Further, the discriminating means targets the ones in which the plate-like member accommodating means 2 and the frame accommodating means 3 are colored or marked, and can be imaged by the imaging means, or an optical sensor, contact sensor, pressure sensor, area You may make it discriminate | determine by detecting with a sensor etc. FIG.
Further, a function such as a so-called GPS (Global Positioning System) function or a position sensor may be added to the communication means 26.

さらに、退避手段32は、各処理装置の直近上流側1か所にそれぞれ設置してもよく、搬送レール324や退避レール325は、1本ずつに限らず複数本ずつ設けてもよい。
また、退避手段32を設けることなく構成し、各処理装置から要求がある度に、搬送手段20が待機領域311で最左端に位置する搬送体21から順に搬送し、搬送した板状部材収容手段2またはフレーム収容手段3を載置手段50に渡したら、当該搬送体21を搬送路31を走行してきた方向と同じ方向に走行させ、搬送路31の待機領域311で待機している複数の搬送体21の最後尾に帰還するようにしてもよい。
Furthermore, the retracting means 32 may be installed at one place on the immediate upstream side of each processing apparatus, and the transport rails 324 and the retracting rails 325 may be provided not only one by one but also plural.
Further, the plate-like member accommodating means that is configured without the retracting means 32 and that conveys the conveying means 20 in order from the conveying body 21 positioned at the leftmost end in the standby area 311 each time there is a request from each processing apparatus. 2 or the frame accommodating means 3 is transferred to the placing means 50, the transport body 21 is caused to travel in the same direction as the travel direction of the transport path 31, and a plurality of transports waiting in the standby area 311 of the transport path 31 are performed. You may make it return to the tail end of the body 21. FIG.

また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的または間接的に組み合せたものを採用することもできる(実施形態で例示したものと重複するものもある)。   The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to the above, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

1 搬送装置
2 板状部材収容手段
3 フレーム収容手段
10 支持手段
20 搬送手段
22E ロードセル(判別手段)
22F,265 通信手段
31 搬送路
30 誘導手段
32 退避手段
RF リングフレーム(フレーム部材)
WF 半導体ウェハ(板状部材)
WP 待機位置
DESCRIPTION OF SYMBOLS 1 Conveyance apparatus 2 Plate-shaped member accommodating means 3 Frame accommodating means 10 Support means 20 Conveying means 22E Load cell (discriminating means)
22F, 265 Communication means 31 Carriage path 30 Guiding means 32 Retraction means RF Ring frame (frame member)
WF Semiconductor wafer (plate member)
WP standby position

Claims (3)

板状部材を収容可能な板状部材収容手段または、前記板状部材が接着シートを介して固定されるフレーム部材を収容可能なフレーム収容手段を選択的に支持可能な支持手段と、
前記支持手段に支持されたものを判別可能な判別手段と、
前記支持手段を搬送可能な搬送手段と、
前記搬送手段を誘導する誘導手段とを備え、
前記判別手段の判別結果を基にして、前記支持手段で支持した前記板状部材収容手段または前記フレーム収容手段を共通の前記誘導手段を介して目的地に搬送することを特徴とする搬送装置。
A plate-shaped member accommodating means capable of accommodating a plate-shaped member, or a supporting means capable of selectively supporting a frame accommodating means capable of accommodating a frame member to which the plate-shaped member is fixed via an adhesive sheet;
Discriminating means capable of discriminating what is supported by the support means;
Transport means capable of transporting the support means;
Guiding means for guiding the conveying means,
Wherein based on the determination result of the determination means, the conveying apparatus characterized by conveying the plate-like member accommodating means or said frame accommodating means supporting the destination through a common said guide means in said support means.
前記誘導手段は、前記搬送手段が走行する搬送路、当該搬送路の一部を当該搬送路から離間した待機位置移動可能な退避手段を備えていることを特徴とする請求項1に記載の搬送装置。 Said induction means includes a conveyance path in which the conveying means travels, the part of the conveying path in claim 1, characterized in that it comprises a retracting means movable to a standby position away from the conveying path The conveying apparatus as described. 板状部材を収容可能な板状部材収容手段または、前記板状部材が接着シートを介して固定されるフレーム部材を収容可能なフレーム収容手段を選択的に支持手段で支持する工程と、
前記支持手段に支持されたものを判別する判別工程と、
前記支持手段を搬送手段で搬送する搬送工程と、
前記搬送手段を誘導手段で誘導する誘導工程とを備え、
前記判別工程の判別結果を基にして、支持した前記板状部材収容手段または、前記フレーム収容手段を共通の前記誘導手段を介して目的地に搬送することを特徴とする搬送方法。
A step of selectively supporting a plate-like member accommodating means capable of accommodating a plate-like member or a frame accommodating means capable of accommodating a frame member to which the plate-like member is fixed via an adhesive sheet;
A discrimination step for discriminating what is supported by the support means;
A transport step of transporting the support means by a transport means;
A guiding step of guiding the conveying means by a guiding means,
Wherein based on the determination result of the determination step, the plate-like member containing means supporting or conveying method characterized by conveying the frame accommodating means to the destination via the common of said guide means.
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