CN103035558A - Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet - Google Patents
Apparatus and method for bonding sheet, and apparatus and method for manufacturing sheet Download PDFInfo
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- CN103035558A CN103035558A CN2012103915963A CN201210391596A CN103035558A CN 103035558 A CN103035558 A CN 103035558A CN 2012103915963 A CN2012103915963 A CN 2012103915963A CN 201210391596 A CN201210391596 A CN 201210391596A CN 103035558 A CN103035558 A CN 103035558A
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- sheet
- otch
- bonding sheet
- cutter
- banded
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Abstract
The invention provides an apparatus and a method for bonding a sheet, and an apparatus and a method for manufacturing the sheet, which can well achieve the formation, the stripping and the bonding of a bonding sheet even when a stripping sheet is thinned. The sheet bonding device (10) comprises a discharging unit (14) discharging raw material rolls (RS) formed by temporarily bonding a band sheet (WS) on a band-shaped stripping sheet (RL); a cutting unit (15) forming a cut port (CU) on the band sheet (WS) and further forming a bonding sheet (AS) on the inner side of the cut port (CU); and a stripping plate (18) making the bonding sheet (AS) stripped from an initial stripping area (discharging direction front Sa) to a lower stripping area (inner side area SB). The cutting unit (15) is arranged in a way to form a cut port deeper than the initial cut port (CU1) corresponding to the initial stripping area (Sa) and a lower cut port (CU2) corresponding to the lower stripping area (Sb).
Description
Technical field
The present invention relates to sheet adhering apparatus and method of attaching and sheet producing device and manufacture method, in more detail, relate to sheet adhering apparatus and method of attaching and sheet producing device and the manufacture method that can form at banded sheet formation otch bonding sheet.
Background technology
In the past, the sheet adhering apparatus of being pasted bonding sheet by convered structure at semiconductor wafer (below be sometimes referred to as " wafer ") etc. had been widely used, and was as relevant sheet adhering apparatus, for example existing disclosed in patent documentation 1.The sheet adhering apparatus of patent documentation 1 possesses: discharge unit, send stock roll, and stock roll forms by banded sheet is pasted on the stripping film temporarily; Cutter form loop-like otch in sending the process of stock roll; Peel plate is peeled off the bonding sheet that is formed on the otch inboard from stripping film; And pressure roller, the bonding sheet that strips down pressed paste on wafer and the ring frame.Forming in the situation of otch by this sheet adhering apparatus, shown in Fig. 4 (A), adjust the relative spacing between these cutter HC and the seaming roll PR, the blade of cutter HC is entered into about stripping film RL 20 μ m.In addition, usually to adopt thickness be stripping film about 50 μ m to this stripping film RL.In the figure, WS represents banded sheet, and BS represents substrate sheets, and AD represents adhesive phase, and RS represents stock roll.
Patent documentation 1: TOHKEMY 2005-116928 communique
But, for stripping film RL, in order to reduce material cost, adopt the thinner situation of 25 μ m left and right thicknesses more and more.When the stock roll that has adopted the stripping film RL of this thinner thickness is used for the device of patent documentation 1, shown in Fig. 4 (B), the blade of cutter HC does not enter into stripping film RL, the bonding sheet that can not utilize peel plate will be formed on otch CU inboard separates reliably with useless that is formed on the otch CU outside, this bonding sheet also can with useless together be wound, thereby the problem that bonding sheet can occur to paste.
At this, in Fig. 4 (B), for the blade that makes cutter HC enters into stripping film RL, the relative spacing between these cutter HC and the seaming roll PR is adjusted again, thus can be with bonding sheet positively from useless separation.But, in this case, become too thin owing to be in the thickness of the locational stripping film RL that is formed with otch CU, so it is bad the stickup of following bonding sheet to occur, for example: as long as be subject to some external force, bonding sheet and with it corresponding stripping film part will come off from stock roll RS, perhaps, when utilizing peel plate release adhesive sheet, corresponding stripping film part also can be peeled off with bonding sheet, and the bonding sheet that is in stripping film state partly is adhered to by on the convered structure.
Summary of the invention
The object of the invention is to, even a kind of formation of bonding sheet, sheet adhering apparatus and method of attaching and sheet producing device and manufacture method of peeling off and pasting of also can carrying out well in the situation of stripping film thinning is provided.
To achieve these goals, sheet adhering apparatus of the present invention, comprise: discharge unit, send stock roll, this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms; Cutter unit, the otch at described banded sheet formation reservation shape forms bonding sheet in the inboard of this otch, and forms useless in the outside of this otch; Peel off the unit, peel off towards the medial region of this bonding sheet from the described bonding sheet that the transport direction leading section of this bonding sheet will stick on the described stripping film temporarily; And press the unit, described bonding sheet pressed paste by on the convered structure, the otch that the degree of depth of the otch that the depth ratio that described cutter unit is configured to form the otch corresponding with the transport direction leading section of described bonding sheet and the medial region of described bonding sheet are corresponding is dark.
In the present invention, described cutter unit possesses the cutter that thickness direction at banded sheet has height, and these cutter comprise: high cutter section can form the otch corresponding with the transport direction leading section of described bonding sheet; And low cutter section, the described high cutter of aspect ratio section is low, can form the medial region of described bonding sheet.
In addition, described high cutter section is arranged on a plurality of positions of cutter, and each high cutter section is configured to optionally be configured on the position that can form the otch corresponding with the transport direction leading section of described bonding sheet.
In addition, the interlock of described discharge unit and described cutter unit with respect to forming 1 bonding sheet, utilizes described high cutter section repeatedly to cut.
In addition, also have energiser unit, can the stock roll in the zone of being cut by described cutter unit be heated.
In addition, chip sticking method of the present invention comprises: send operation, send stock roll, this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms; Cutting action, the otch at described banded sheet formation reservation shape forms bonding sheet in the inboard of this otch, and forms useless in the outside of this otch; Stripping process is peeled off towards the medial region of this bonding sheet from the described bonding sheet that the transport direction leading section of this bonding sheet will stick on the described stripping film temporarily; And press operation, described bonding sheet pressed paste by on the convered structure, in described cutting action, the otch that the degree of depth of the otch that the depth ratio that forms the otch corresponding with the transport direction leading section of described bonding sheet and the medial region of described bonding sheet are corresponding is dark.
In addition, sheet producing device of the present invention comprises: discharge unit, send stock roll, and this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms; And cutter unit, form the otch of reservation shape at described banded sheet, inboard at this otch forms bonding sheet, and form useless in the outside of this otch, the otch that the degree of depth of the otch that the depth ratio that described cutter unit is configured to form the otch corresponding with at least one party of the transport direction leading section of described bonding sheet and transport direction rearward end and the medial region of described bonding sheet are corresponding is dark.
In addition, method of producing sheet of the present invention comprises: send operation, send stock roll, this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms; And cutting action, form the otch of reservation shape at described banded sheet, inboard at this otch forms bonding sheet, and form useless in the outside of this otch, in described cutting action, the otch that the degree of depth of the otch that the depth ratio that can form the otch corresponding with at least one party of the transport direction leading section of described bonding sheet and transport direction rearward end and the medial region of described bonding sheet are corresponding is dark.
The invention effect
According to the present invention, because the degree of depth of the otch corresponding with the transport direction leading section of bonding sheet forms than dark with the degree of depth of otch corresponding to the medial region of bonding sheet, so can be with the transport direction leading section of bonding sheet positively from useless separation.Thus, can eliminate and in the past the sort ofly be wound the problem that to paste bonding sheet with useless because of bonding sheet.At this moment, the degree of depth of the otch corresponding with the medial region of bonding sheet forms than shallow with otch corresponding to the transport direction leading section of bonding sheet, but, as long as the transport direction leading section of bonding sheet can separate with useless, follow the carrying out that peels off of bonding sheet, this bonding sheet separates from useless along the otch corresponding with the medial region of bonding sheet.
In addition, because the depth as shallow of the otch of the stripping film that the depth ratio of the otch of the stripping film corresponding with the medial region of bonding sheet and the transport direction leading section of bonding sheet are corresponding, thus can suppress bonding sheet and with it corresponding stripping film partly come off or the bonding sheet that is in stripping film state partly is adhered to by the stickup of the first-class bonding sheet of convered structure bad from stock roll.At this moment, device as patent documentation 1, the stripping film part corresponding with the transport direction leading section of bonding sheet sometimes is stripped from plate with bonding sheet and peeled off, but because the depth as shallow of the otch of the stripping film corresponding with the medial region of bonding sheet, so the stripping film of being stripped from bonding sheet part can further not increase, this stripping film part stretches and is recovered at the regular direction of recession of stripping film.
In addition, according to above-mentioned sheet producing device and manufacture method, can prepare to be formed with as mentioned above the stock roll of otch, this stock roll is being used in the situation of sheet adhering apparatus, method of attaching, as mentioned above, can easily carry out peeling off and pasting of bonding sheet.
In addition, have at the cutter of cutter unit in the situation of low cutter section and high cutter section, can form simply the otch of aforesaid notch depth.
In addition, because a plurality of high cutter section can optionally be configured to form the transport direction leading section of bonding sheet, so even the height of 1 high cutter section is deteriorated because of wearing and tearing, also can changes the position of each high cutter section and utilize other high cutter sections.
In addition, by utilizing high cutter section repeatedly to cut, the degree of depth of the otch corresponding with the transport direction leading section of bonding sheet can be stabilized to the predetermined degree of depth.
In addition, having in the situation of energiser unit, give energy to stock roll, for example, substrate sheets, adhesive phase etc. soften and form easily otch, can avoid well cutting bad.
Description of drawings
Fig. 1 is the summary front view of the sheet adhering apparatus of present embodiment.
Fig. 2 is the summary stereogram of cutter unit.
Fig. 3 (A) is the expanded view of cutter substrate and cutter, and Fig. 3 (B) is the cutaway view of (A).
Fig. 4 (A) reaches the key diagram of the cutting main points that (B) are the expression conventional example.
Description of reference numerals
10 sheet adhering apparatus; 14 discharge units; 15 cutter units; 18 peel plate (peeling off the unit); 19 by pressure roller (pressing the unit); 40 cutter; 46 high cutter sections; 48 low cutter sections; The AD adhesive phase; The AS bonding sheet; The BS substrate sheets; The CU otch; CU1 initial stage otch; CU2 next period otch; RF ring frame (by convered structure); The RL stripping film; The RS stock roll; Sa initial stage stripping area (the transport direction leading section of bonding sheet); Sb next period stripping area (medial region of bonding sheet); Useless of US; WF semiconductor wafer (by convered structure); The banded sheet of WS
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.
In addition, in this manual, in situation about not expressing especially, " left side ", " right side ", " on ", " under " take Fig. 1 as benchmark.
In Fig. 1～Fig. 3, sheet adhering apparatus 10 constitutes to be possessed: workbench 11, and will be as being supported by the wafer W F of convered structure and ring frame RF absorption; As the straight moving motor 12 of driving mechanism, workbench 11 is moved up at right and left; Discharge unit 14 can be sent stock roll RS, and stock roll RS is made of the stripping film RL of band shape and the banded sheet WS that sticks on the face of stripping film RL temporarily; Cutter unit 15 forms otch CU at the banded sheet WS of the stock roll RS that is sent by discharge unit 14, forms bonding sheet AS in the inboard of this otch CU, and forms useless US in the outside of this otch CU; Winder unit 16 can be reeled useless US; As the peel plate 18 of peeling off the unit, stripping film RL is turned back, thereby bonding sheet AS is peeled off from stripping film RL; And as press the unit by pressure roller 19, be pressed on ring frame RF and the wafer W F and paste being stripped from bonding sheet AS that plate 18 peels off.Banded sheet WS possesses substrate sheets BS and the adhesive phase AD of lamination on the face of this substrate sheets BS, and banded sheet WS is sticked on the stripping film RL by this adhesive phase AD temporarily.In addition, the lower surface at wafer W F is pasted with screening glass PS.
Described discharge unit 14 possesses: the bolster 25 that stock roll RS is supported; To the 1st driven roller 27 and the 1st pinch roll 28 of sending from bolster 25 and carrying out clamping by the stock roll RS before the cutter unit 15; To having passed through the 2nd driven roller 31 and the 2nd pinch roll 32 that peel plate 18 stripping film RL afterwards carries out clamping; And wireline reel 34, will reel by the stripping film RL after these rollers with predetermined torque by not shown driving mechanism.Each driven roller 27,31 is configured to and can be rotated by rotating motor DM1, the DM2 as driving mechanism.
Described cutter unit 15 possesses: die-cut roller 36, be configured in the banded sheet WS side of the stock roll RS that sends, and be configured to centered by rotation MC, rotate; Seaming roll 37 (platen roller) is configured in the stripping film RL side of stock roll RS,, is not configured to rotate centered by rotation PC with die-cut roller 36 interlocks by giving illustrated mechanism; As the rotating motor DM3 of driving mechanism, make die-cut roller 36 rotations; And as driving mechanisms such as the illustrated straight moving motor of not giving of interval adjustment unit, the relative spacing between die-cut roller 36 and the seaming roll 37 is adjusted.
Described die-cut roller 36 possesses: cutter 40, cut banded sheet WS and form otch CU; Cutter substrate 41, cutter 40 are erected on the surface of cutter substrate 41; And the columned magnetic cylinder body 43 that cutter substrate 41 is wound on periphery.
Described cutter 40 are from cutter substrate 41 outstanding settings, and when forming otch CU, cutter 40 have height at the thickness direction of banded sheet WS.Shown in Fig. 3 (A), when cutter substrate 41 was launched into the plane, cutter 40 were circular, and it is large and less than the otch CU of the circular of overall dimension to be configured to form internal diameter size than ring frame RF at banded sheet WS.Cutter 40 possess: 4 high cutter sections 46 form across 90 degree intervals on the circumferencial direction of toroidal; 4 low cutter sections 48 lay respectively between the adjacent high cutter section 46, and the high cutter of aspect ratio section 46 is low.Each high cutter section 46 angular range with 30 degree on the circumferencial direction of cutter 40 forms.Present embodiment situation under, tool setting substrate 41 carries out etching and processing and cutter 40, the height of high cutter section 46 is set to 450 μ m, the height of low cutter section 48 is set to 435 μ m.
Described cutter substrate 41 is arranged on the magnetic cylinder body 43 and can loads and unloads by magnetic force.Cutter substrate 41 is roughly square shape when being launched into the plane, be respectively arranged with high cutter section 46 along its 4 limits.In addition, the length on one side of cutter substrate 41 is configured to below the periphery length of magnetic cylinder body 43, can be wound on the magnetic cylinder body 43 with 2 relative opposed states in limit from the state that launches.Therefore, as shown in Figure 2, when being installed to cutter substrate 41 on the magnetic cylinder body 43, the high cutter section 46 of cutter 40 is positioned at axial both sides and the circumferencial direction both sides of magnetic cylinder body 43.At this, be transport direction (stock roll RS is from the direction of bolster 25 towards the wireline reel 34) front end area that forms banded sheet WS by high cutter section 46 at the bonding sheet AS that forms by cutter 40.The bonding sheet AS that forms by this high cutter section 46 partly becomes the initial stage stripping area Sa as the transport direction leading section of being stripped from the bonding sheet that plate 18 peels off from stripping film RL at first, and the otch CU corresponding with this initial stage stripping area Sa partly becomes initial stage otch CU1.In addition, be adjacent to partly become the next period stripping area Sb that peels off the medial region of the bonding sheet of then peeling off afterwards as initial stage stripping area Sa by the bonding sheet AS that low cutter section 48 forms with initial stage stripping area Sa, the otch CU corresponding with this next period stripping area Sb partly becomes next period otch CU2.In addition, when cutter substrate 41 is wound onto on the magnetic cylinder body 43, also opposed 2 limits can be changed to other 2 limits, or will with respect to magnetic cylinder body 43 axial towards counter-rotating.Thus, 4 high cutter sections 46 all can form the initial stage otch CU1 corresponding with initial stage stripping area Sa, can select arbitrarily high cutter section 46 according to deterioration state of high cutter section 46 etc.
At this, be provided with at cutter unit 15 and do not give illustrated energiser unit, when giving energy by this energiser unit to stock roll RS, can form otch CU.As energiser unit, for example, the winding heater on the interior at least one party who is located at die-cut roller 36 and seaming roll 37, can also enumerate irradiation unit of wind pushing mechanism from 37 position to the formation position of otch CU that send warm air from leaving these rollers 36,, irradiation ultraviolet radiation, infrared ray, microwave Isoenergetical line etc. etc.
Described winder unit 16 constitutes to be possessed: stripper roll 50, on the useless US around formed otch CU by cutter unit 15 after, should peel off from stripping film RL by useless US; And wireline reel 51, will pass through stripper roll 50 useless US afterwards and reel.Wireline reel 51 is configured to and can be rotated by the rotating motor DM4 as driving mechanism, with predetermined torque useless US is reeled.
The method of attaching of the bonding sheet AS of present embodiment then, is described.
At first, make the stock roll RS that is supported on the bolster 25 between the 1st driven roller 27 and the 1st pinch roll 28 and pass through between die-cut roller 36 and the seaming roll 37.Then, from stripping film RL banded sheet WS is peeled off, should band shape sheet WS be entangled on the stripper roll 50 after, its leading end is fixed on the wireline reel 51.In addition, stripping film RL turns back at the front end of peel plate 18, between the 2nd driven roller 31 and the 2nd pinch roll 32, its leading end is fixed on the wireline reel 34.In addition, in the present embodiment, the thickness of banded sheet WS is that the thickness of 100 μ m, stripping film RL is 25 μ m.In addition, cutter 40 are wound onto on the periphery of magnetic cylinder body 43, by giving illustrated interval adjustment unit the relative spacing between high cutter section 46 and the seaming roll 37 are not adjusted to 5 μ m.Thus, the relative spacing between low cutter section 48 and the seaming roll 37 is 20 μ m.In the present embodiment, as shown in Figure 1, the central authorities in the zone that is not formed with cutter 40 on the direction of rotation of die-cut roller 36 are made as the starting position St of die-cut roller 36, again near under the state of seaming roll 37, die-cut roller 36 are stopped the rotation at this starting position St.
Then, make rotating motor DM1～DM4 interlock and when sending stock roll RS, form otch CU by cutter 40 from substrate sheets BS side direction stripping film RL side, banded sheet WS is divided into the bonding sheet AS of otch CU inboard and the useless US in the otch CU outside.At this, on bonding sheet AS, form initial stage otch CU1 by high cutter section 46 and formed after the initial stage stripping area Sa, form next period otch GU2 and form next period stripping area Sb by low cutter section 46.Thus, high cutter section 46 enters into the stripping film RL corresponding with initial stage otch CU1 20 μ m, thereby initial stage otch CU1 positively enters into stripping film RL, and initial stage stripping area Sa separates with useless US easily.In addition, low 48 in cutter section enters into the stripping film RL corresponding with next period otch CU2 5 μ m, so the stripping film RL corresponding with next period stripping area Sb partly is difficult for being cut.
Form after the otch CU, the stock roll RS that sends utilizes stripper roll 50 from stripping film RL useless US to be peeled off, and useless US is winding on the wireline reel 51.At this moment, stripping area Sa separates with useless US easily, so bonding sheet AS can not reel to wireline reel 51 directions with useless US.Then, when the bonding sheet AS of the stock roll RS that is wound with useless US peels off scheduled volume and when coming off from the front end of peel plate 18, utilize and do not give illustrated transducer and detect the front end of this bonding sheet AS and stop action, be ready.At this moment, because initial stage otch CU1 positively enters into stripping film RL, so initial stage stripping area Sa positively peels off from stripping film RL, can not twine to the 2nd driven roller 31 directions with stripping film RL.In addition, the stripping film RL corresponding with initial stage stripping area Sa part also can come off from peel plate 18 with bonding sheet AS sometimes.But, because the stripping film RL corresponding with next period stripping area Sb partly is difficult to be cut, so the stripping film that comes off with bonding sheet AS along with sending of stock roll RS part can further not increase, act on the power that stretches to the 2nd driven roller 31 directions from the front end of peel plate 18 in the stripping film part that comes off with bonding sheet AS, the stripping film RL part corresponding with initial stage stripping area Sa positively can be peeled off from bonding sheet AS.In addition, when being ready, as shown in Figure 1, die-cut roller 36 is configured to, there is not the position of cutter 40 to be positioned at seaming roll 37 sides, by as the incision site adjustment unit that does not give illustrated driving mechanism the position of die-cut roller 36 and seaming roll 37 is moved up at upper and lower.According to this structure, can adjust arbitrarily the interval of each bonding sheet AS, can be according to the length of bonding sheet AS on transport direction, in their position of above-below direction change.Then, ring frame RF and wafer W F are not loaded adsorb maintenance on the workbench 11 by giving illustrated conveyance unit.Then, workbench 11 by straight moving motor 12 below peel plate 18 from the right side by conveyance to the left side.When workbench 11 is not given illustrated transducer when detecting at preposition, the 1st and the 2nd driven roller 27,31 and the conveyance of workbench 11 synchronously rotate, send stock roll RS, bonding sheet AS peels off at the front end of peel plate 18.Then, the bonding sheet AS of being stripped from is subject to being adhered on each upper surface of ring frame RF and wafer W F by the pressing force that produces by pressure roller 19, and wafer W F and ring frame RF are by bonding sheet AS and integrated.At this moment, peel off stripping film RL part corresponding to codomain Sa with the initial stage and positively peel off from bonding sheet AS, so can not occur to be adhered to by the situation on the convered structure with the bonding sheet AS of stripping film RL state partly.
Therefore, according to this execution mode, by the cutting of cutter 40, can make the notch depth of initial stage stripping area Sa darker than the notch depth of next period stripping area Sb, can prevent that bonding sheet AS and useless US one be stripped from and cause this bonding sheet AS not paste.And, since low cutter section 48 shallow in the notch depth that the stripping film RL part corresponding with next period stripping area Sb forms, come off and cause carrying out the stickup of this bonding sheet AS so can prevent the stock roll RS of bonding sheet AS after having passed through cutter unit 15.Like this, according to above-mentioned execution mode, even stripping film RL thinning, also can carry out well bonding sheet AS formation, peel off and paste, can tackle the requirement that realizes cost because of this thinning.
As mentioned above, disclose in the above-mentioned record and be used for implementing optimum formation of the present invention, method etc., yet the invention is not restricted to this.
That is to say, although the present invention has mainly carried out special diagram, explanation to specific execution mode, yet in the situation that does not break away from technological thought of the present invention and purpose range, those skilled in the art can as required for execution mode described above, carry out various changes to shape, position or configuration etc.
Therefore, defining record exemplarily record for the ease of understanding the present invention of above-mentioned disclosed shape etc., is not to limit the present invention, and part or all the record of component names of having removed the restrictions such as these shapes also is comprised in the present invention.
For example, described winder unit 16 can be omitted, also can from stripping film RL useless US do not peeled off, utilize peel plate 18 that bonding sheet AS is peeled off, utilize wireline reel 34 that stripping film RL and useless US are twined.In this case, can prevent to utilize peel plate 18 that initial stage stripping area Sa is peeled off and cause bonding sheet AS to reel to the 2nd driven roller 31 directions with useless US.
In addition, when forming otch C, make each rotating motor DM1～DM4 interlock, it is mobile that stock roll RS is come and gone at transport direction, with respect to forming 1 bonding sheet AS, repeatedly cuts at corresponding with initial stage stripping area Sa high cutter section 46 places.
In addition, peel plate 18 that also can be by omitting described sheet adhering apparatus 10 and consist of sheet producing device by pressure roller 19.By this device, with above-mentioned execution mode in the same manner, formed after the bonding sheet AS by cutter unit 15, stock roll RS is winding on the wireline reel 34, this stock roll RS forms by bonding sheet AS is pasted on the stripping film RL temporarily.Be winding to also in addition conveyance, the keeping of stock roll RS on the wireline reel 34, perhaps also can in the sheet adhering apparatus that does not have cutter unit etc., utilize.Like this, to be wound up in the situation of sheet adhering apparatus that stock roll RS on the wireline reel 34 keeps this state directly to be used in not having cutter unit etc., the transport direction rearward end of discharge unit 14 becomes the initial stage stripping area Sa of this sheet adhering apparatus etc., so it is regional darker than other also the high cutter section 46 of cutter unit 15 can be arranged to the otch CU of transport direction rearward end of the discharge unit 14 on the bonding sheet AS at least.
In addition, the flat shape of cutter 40 is so long as can also get final product the inboard of this otch CU at banded sheet WS formation otch CU as the shape that bonding sheet AS forms, can be polygon, ellipse, oval, prismatic, with the various changes such as shape of straight line and curve combination, the height of cutter also can change arbitrarily.
In addition, in the above-described embodiment, also can omit the high cutter of beyond the high cutter section 46 of formation initial stage stripping area Sa at least one section 46.
In addition, by cutter substrate 41 is formed circle or polygon, thereby can increase the quantity of the high cutter section 46 that optionally utilizes.
In addition, show in the above-described embodiment high cutter section 46 is formed on example on the circumferencial direction of cutter 40 with the angular ranges of 30 degree, yet can form with the following angular range of 30 degree, and the angular range formation more than can be in the scope that high cutter section 46 has not connected with adjacent high cutter section 46 spending with 30.
In addition, as long as cutter unit 15 can form described initial stage otch CU1, next period otch CU2, also can use other cutter units such as laser.
In addition, cutter 40 can also use outside the graver that forms by machining, the rotating mould except forming by etching and processing, also can use the flat cutter, Thomson cutter etc. that have formed cutter at flat board.
In addition, the height of high cutter section 46, low cutter section 48 can be on the basis that the thickness of considering stock roll RS, character etc. suitably change, the intermediate knife section that height of formation is lower and higher than low cutter section 48 than high cutter section 46.
In addition, discharge unit 14, peel plate 18, also can carry out various design alterations by pressure roller 19.
In addition, also can utilize so-called carrying part (bearer) to consist of the interval adjustment unit, by ask the thickness that can consider stock roll RS every cutter 40 that adjustment unit is regulated and the relative spacing between the seaming roll 37, character, especially the thickness, character etc. of stripping film RS suitably change.
In addition, the thickness of the parts of formation stock roll RS is not limited to the illustration in the above-mentioned execution mode.
In addition, the driving mechanism that setting is moved sheet adhering apparatus 10, under the state that workbench 11 is stopped, sheet adhering apparatus 10 is moved to the right of Fig. 1, make workbench 11 left direction move, and sheet adhering apparatus 10 is moved to right, bonding sheet AS is pasted by on the convered structure.
In addition, the driving mechanism of above-mentioned execution mode can adopt rotating motor, directly the motor drive mechanisms such as moving motor, linear motor, single-shaft mechanical arm, multi-joint manipulator, cylinder, fluid cylinder, without actuators such as bar cylinder and rotor cylinders etc., these are made up directly or indirectly (also have with execution mode in the part that repeats of illustrative parts).
In addition, as by convered structure, can substitute wafer W F, ring frame RF, as object, semiconductor wafer also can be semiconductor silicon wafer, compound semiconductor wafer with other materials such as glass slope, steel plate or resin plates.In addition, substitute ring frame RF, also can use the frame of other shapes such as C shape, U-shaped shape, also can ringless-type frame RF and with independent by the stickup object of convered structure as bonding sheet AS.
Claims (8)
1. sheet adhering apparatus comprises:
Discharge unit is sent stock roll, and this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms;
Cutter unit, the otch at described banded sheet formation reservation shape forms bonding sheet in the inboard of this otch, and forms useless in the outside of this otch;
Peel off the unit, peel off towards the medial region of this bonding sheet from the described bonding sheet that the transport direction leading section of this bonding sheet will stick on the described stripping film temporarily; And
Press the unit, described bonding sheet is pressed pasted by on the convered structure,
Described sheet adhering apparatus is characterised in that,
The otch that the degree of depth of the otch that the depth ratio that described cutter unit is configured to form the otch corresponding with the transport direction leading section of described bonding sheet and the medial region of described bonding sheet are corresponding is dark.
2. sheet adhering apparatus according to claim 1 is characterized in that,
Described cutter unit possesses the cutter that thickness direction at banded sheet has height, and these cutter comprise: high cutter section can form the otch corresponding with the transport direction leading section of described bonding sheet; And low cutter section, the described high cutter of aspect ratio section is low, can form the medial region of described bonding sheet.
3. sheet adhering apparatus according to claim 2 is characterized in that,
Described high cutter section is arranged on a plurality of positions of cutter, and each high cutter section is configured to optionally be configured on the position that can form the otch corresponding with the transport direction leading section of described bonding sheet.
4. according to claim 2 or 3 described sheet adhering apparatus, it is characterized in that,
The interlock of described discharge unit and described cutter unit with respect to forming 1 bonding sheet, utilizes described high cutter section repeatedly to cut.
5. according to claim 1 to the described sheet adhering apparatus of 4 any one, it is characterized in that,
Also have energiser unit, can the stock roll in the zone of being cut by described cutter unit be heated.
6. a chip sticking method is characterized in that, comprising:
Send operation, send stock roll, this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms;
Cutting action, the otch at described banded sheet formation reservation shape forms bonding sheet in the inboard of this otch, and forms useless in the outside of this otch;
Stripping process is peeled off towards the medial region of this bonding sheet from the described bonding sheet that the transport direction leading section of this bonding sheet will stick on the described stripping film temporarily; And
Press operation, described bonding sheet is pressed pasted by on the convered structure,
In described cutting action, the otch that the degree of depth of the otch that the depth ratio that forms the otch corresponding with the transport direction leading section of described bonding sheet and the medial region of described bonding sheet are corresponding is dark.
7. a sheet producing device is characterized in that, comprising:
Discharge unit is sent stock roll, and this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms; And
Cutter unit, the otch at described banded sheet formation reservation shape forms bonding sheet in the inboard of this otch, and forms useless in the outside of this otch,
The otch that the degree of depth of the otch that the depth ratio that described cutter unit is configured to form the otch corresponding with at least one party of the transport direction leading section of described bonding sheet and transport direction rearward end and the medial region of described bonding sheet are corresponding is dark.
8. a method of producing sheet is characterized in that, comprising:
Send operation, send stock roll, this stock roll pastes banded stripping film by the banded sheet that will have at a face of the substrate sheets of band shape adhesive phase via this adhesive phase temporarily forms; And
Cutting action, the otch at described banded sheet formation reservation shape forms bonding sheet in the inboard of this otch, and forms useless in the outside of this otch,
In described cutting action, the otch that the degree of depth of the otch that the depth ratio that can form the otch corresponding with at least one party of the transport direction leading section of described bonding sheet and transport direction rearward end and the medial region of described bonding sheet are corresponding is dark.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-211945 | 2011-09-28 | ||
| JP2011211945A JP5897856B2 (en) | 2011-09-28 | 2011-09-28 | Sheet manufacturing apparatus and manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103035558A true CN103035558A (en) | 2013-04-10 |
| CN103035558B CN103035558B (en) | 2016-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210391596.3A Active CN103035558B (en) | 2011-09-28 | 2012-09-25 | Sheet producing device and manufacture method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5897856B2 (en) |
| KR (1) | KR101837133B1 (en) |
| CN (1) | CN103035558B (en) |
| TW (1) | TWI534942B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5789463B2 (en) * | 2011-09-28 | 2015-10-07 | リンテック株式会社 | Sheet sticking apparatus and sticking method, and sheet manufacturing apparatus and manufacturing method |
| KR101719044B1 (en) | 2014-12-29 | 2017-04-05 | 한국해양과학기술원 | location and position control device using water-jet linked sub-nozzle |
| JP2017204614A (en) * | 2016-05-13 | 2017-11-16 | 株式会社ディスコ | Tape sticking device |
| JP2020068327A (en) * | 2018-10-25 | 2020-04-30 | リンテック株式会社 | Sheet sticking method |
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| JP2005116928A (en) * | 2003-10-10 | 2005-04-28 | Lintec Corp | Mounting device and mounting method |
| KR100515222B1 (en) * | 2005-03-18 | 2005-09-15 | 김인영 | Cutting roller for sticking thin plate cutter of two faces tape cutting apparatus |
| JP2005297457A (en) * | 2004-04-14 | 2005-10-27 | Lintec Corp | Sticking apparatus and sticking method |
| US20110117706A1 (en) * | 2008-10-16 | 2011-05-19 | Nishio Akinori | Protective tape joining method and protective tape joining apparatus |
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| JP2003025287A (en) * | 2001-07-16 | 2003-01-29 | Dainippon Printing Co Ltd | Punching blade structure and punching die |
| JP4677758B2 (en) * | 2004-10-14 | 2011-04-27 | 日立化成工業株式会社 | Die-bonded dicing sheet, method for manufacturing the same, and method for manufacturing a semiconductor device |
| JP4520403B2 (en) | 2005-12-09 | 2010-08-04 | リンテック株式会社 | Tape sticking device and sticking method |
| JP4468884B2 (en) | 2005-12-09 | 2010-05-26 | リンテック株式会社 | Tape sticking device, mounting device, and mounting method |
| JP4787713B2 (en) | 2006-10-10 | 2011-10-05 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5234755B2 (en) * | 2008-07-09 | 2013-07-10 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5112984B2 (en) | 2008-08-06 | 2013-01-09 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5388792B2 (en) * | 2009-10-23 | 2014-01-15 | 新日鉄住金化学株式会社 | Multilayer adhesive sheet and manufacturing method thereof |
| JP5388794B2 (en) * | 2009-10-28 | 2014-01-15 | カルソニックカンセイ株式会社 | Punching device and punching method |
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- 2011-09-28 JP JP2011211945A patent/JP5897856B2/en active Active
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2012
- 2012-09-12 KR KR1020120100891A patent/KR101837133B1/en active IP Right Grant
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Patent Citations (4)
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| JP2005116928A (en) * | 2003-10-10 | 2005-04-28 | Lintec Corp | Mounting device and mounting method |
| JP2005297457A (en) * | 2004-04-14 | 2005-10-27 | Lintec Corp | Sticking apparatus and sticking method |
| KR100515222B1 (en) * | 2005-03-18 | 2005-09-15 | 김인영 | Cutting roller for sticking thin plate cutter of two faces tape cutting apparatus |
| US20110117706A1 (en) * | 2008-10-16 | 2011-05-19 | Nishio Akinori | Protective tape joining method and protective tape joining apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013074098A (en) | 2013-04-22 |
| TWI534942B (en) | 2016-05-21 |
| JP5897856B2 (en) | 2016-04-06 |
| CN103035558B (en) | 2016-09-28 |
| KR101837133B1 (en) | 2018-03-09 |
| TW201316447A (en) | 2013-04-16 |
| KR20130034591A (en) | 2013-04-05 |
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