CN103035558B - Sheet producing device and manufacture method - Google Patents
Sheet producing device and manufacture method Download PDFInfo
- Publication number
- CN103035558B CN103035558B CN201210391596.3A CN201210391596A CN103035558B CN 103035558 B CN103035558 B CN 103035558B CN 201210391596 A CN201210391596 A CN 201210391596A CN 103035558 B CN103035558 B CN 103035558B
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- otch
- sheet
- bonding sheet
- banding
- cutter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Dicing (AREA)
Abstract
Even if also being able to carry out well the formation of bonding sheet in the case of stripping film thinning, peeling off and the sheet adhering apparatus pasted and method of attaching and sheet producing device and manufacture method.Sheet adhering apparatus (10) is configured to include: discharge unit (14), sends stock roll (RS), and this stock roll forms on banding stripping film (RL) by being pasted by banding sheet (WS) temporarily；Cutter unit (15), forms otch (CU) on banding sheet (WS), forms bonding sheet (AS) in otch (CU) inner side；Peel plate (18), peels off bonding sheet (AS) towards next period stripping area (inside region Sb) from initial stage stripping area (transport direction leading section Sa).Cutter unit (15) is configured to be formed the otch that the degree of depth of the depth ratio of the initial stage otch (CU1) corresponding with initial stage stripping area (Sa) the next period otch (CU2) corresponding with next period stripping area (Sb) is deep.
Description
Technical field
The present invention relates to sheet producing device and manufacture method, in more detail, relate to be formed on banding sheet
Otch and form sheet producing device and the manufacture method of bonding sheet.
Background technology
In the past, the adherend such as semiconductor wafer (being sometimes referred to as " wafer " below) pasted the thin of bonding sheet
Sheet sticker is widely used, as relevant sheet adhering apparatus, such as in patent documentation 1 the most
Open.The sheet adhering apparatus of patent documentation 1 possesses: discharge unit, sends stock roll, and stock roll will be by carrying
Shape sheet pastes on stripping film temporarily and forms；Cutter, form loop-like otch during sending stock roll；
Peel plate, will be formed in the bonding sheet inside otch and peels off from stripping film；And pressure roller, the bonding that will strip down
Sheet pressing pastes on wafer and ring frame.In the case of forming otch by this sheet adhering apparatus, such as figure
Shown in 4 (A), adjust the relative spacing between these cutter HC and seaming roll PR, make the blade of cutter HC
Enter in stripping film RL about 20 μm.It addition, this stripping film RL generally uses thickness to be about 50 μm
Stripping film.In the figure, WS represents banding sheet, and BS represents that substrate sheets, AD represent that adhesive phase, RS represent
Stock roll.
Patent documentation 1: Japanese Unexamined Patent Publication 2005-116928 publication
But, for stripping film RL, in order to reduce material cost, use the situation that 25 μm left and right thicknesses are relatively thin
More and more.When the stock roll that have employed the stripping film RL of this thinner thickness is used for the device of patent documentation 1,
As shown in Fig. 4 (B), the blade of cutter HC does not enter into stripping film RL, it is impossible to utilize peel plate will be formed in
Bonding sheet inside otch CU and be formed at useless outside otch CU and be reliably separated, this bonding sheet also can be with
Useless is together wound, thus the problem that can occur to paste bonding sheet.
Here, in Fig. 4 (B), in order to make the blade of cutter HC enter in stripping film RL, this is cut
Relative spacing between cutter HC and seaming roll PR adjusts again such that it is able to by bonding sheet positively from useless
Sheet separates.But, in this case, owing to being in the thickness of the stripping film RL on the position being formed with otch CU
Degree becomes the thinnest, so the stickup that there will be following bonding sheet is bad, such as: as long as by some external force,
Bonding sheet and corresponding stripping film part will come off from stock roll RS, or, peel off when utilizing peel plate
During bonding sheet, corresponding stripping film part also can be peeled off together with bonding sheet, is in the state with stripping film part
Bonding sheet be adhered in adherend.
Summary of the invention
It is an object of the invention to, it is provided that also be able to glue well in the case of stripping film thinning even if a kind of
Close the formation of sheet, peel off and the sheet producing device pasted and manufacture method.
To achieve these goals, the sheet producing device of the present invention, including: discharge unit, send stock roll,
This stock roll is by having the banding sheet of adhesive phase via this binding agent on a face of the substrate sheets in banding
Layer pastes temporarily and forms on banding stripping film；And cutter unit, described banding sheet is formed reservation shape
Otch, forms bonding sheet, and forms useless in the outside of this otch in the inner side of this otch, and described cutting is single
Unit is configured to form the depth ratio of the otch corresponding with the transport direction leading section of described bonding sheet with described
The otch that the inside region of bonding sheet is corresponding in addition to described transport direction leading section at least one of deeply
Spend the depth ratio of deep otch and the otch corresponding with the transport direction rearward end of described bonding sheet and described bonding
At least one of degree of depth in addition to described transport direction rearward end of the otch that the inside region of sheet is corresponding is deep
Otch at least one party.
It addition, the method for producing sheet of the present invention, including: sending operation, send stock roll, this stock roll is passed through
The banding sheet on one face of the substrate sheets in banding with adhesive phase is pasted via this adhesive phase temporarily
Form on banding stripping film；And cutting action, described banding sheet is formed the otch of reservation shape, cuts at this
The inner side of mouth forms bonding sheet, and forms useless in the outside of this otch, in described cutting action, it is possible to
Form the depth ratio of the otch corresponding with the transport direction leading section of described bonding sheet and the medial area of described bonding sheet
Otch that at least one of degree of depth in addition to described transport direction leading section of the otch that territory is corresponding is deep and
The depth ratio of the otch corresponding with the transport direction rearward end of described bonding sheet and the inside region pair of described bonding sheet
In the otch that at least one of degree of depth in addition to described transport direction rearward end of the otch answered is deep at least
One side.
Invention effect
In the case of the thin slice manufactured by the present invention is adapted to sheet adhering apparatus, due to the sending of bonding sheet
The degree of depth of the otch that leading section, direction is corresponding formed than the inside region of bonding sheet except described transport direction before
At least one of degree of depth beyond end is deep, it is possible to by the transport direction leading section of bonding sheet positively from nothing
Separate with sheet.Thereby, it is possible to elimination is the most that cannot paste bonding because bonding sheet is wound together with useless
The problem of sheet.Now, at least some of in addition to described transport direction leading section of the inside region of bonding sheet
The degree of depth formed more shallow than the otch corresponding with the transport direction leading section of bonding sheet, but, if the giving of bonding sheet
Outgoing direction leading section can separate with useless, with the carrying out of stripping of bonding sheet, this bonding sheet along with bonding
At least one of otch in addition to described transport direction leading section of the inside region of sheet is from useless separation.
Further, since with at least some of in addition to described transport direction leading section of the inside region of bonding sheet
The degree of depth of otch of the depth ratio of otch of the stripping film stripping film corresponding with the transport direction leading section of bonding sheet
It is shallow, it is possible to suppression bonding sheet and corresponding stripping film part come off from stock roll or be in stripping
The stickup that the bonding sheet of the state of sheet part is adhered to the first-class bonding sheet of adherend is bad.Now, as patent literary composition
Offer 1 device such, the stripping film part corresponding with the transport direction leading section of bonding sheet is sometimes together with bonding sheet
Be stripped plate peel off, but due to the inside region of bonding sheet in addition to described transport direction leading section extremely
The depth as shallow of the otch of at least part of stripping film, so the stripping film part lifted-off together with bonding sheet will not be entered
One step increases, and this stripping film part stretches on the regular direction of recession of stripping film and is recovered.
Accompanying drawing explanation
Fig. 1 is the summary front view of the sheet adhering apparatus of present embodiment.
Fig. 2 is the summary axonometric chart of cutter unit.
Fig. 3 (A) is the expanded view of cutter substrate and cutter, and Fig. 3 (B) is the sectional view of (A).
Fig. 4 (A) and (B) are the explanatory diagrams of the cutting main points representing conventional example.
Description of reference numerals
10 sheet adhering apparatus；14 discharge units；15 cutter units；18 peel plate (stripping unit)；19 press
Pressure roller (pressing unit)；40 cutter；46 high cutter portions；48 low cutter portions；AD adhesive phase；AS bonding sheet；
BS substrate sheets；CU otch；CU1 initial stage otch；CU2 next period otch；RF ring frame (adherend)；RL
Stripping film；RS stock roll；Sa initial stage stripping area (the transport direction leading section of bonding sheet)；The Sb next period peels off
Region (inside region of bonding sheet)；Useless of US；WF semiconductor wafer (adherend)；WS banding sheet
Detailed description of the invention
Below, it is explained with reference to embodiments of the present invention.
It addition, in this manual, in the case of expressing the most especially, "left", "right", " on ", " under "
On the basis of Fig. 1.
In Fig. 1～Fig. 3, sheet adhering apparatus 10 is configured to possess: workbench 11, will be as adherend
Wafer W F and ring frame RF absorption supporting；Direct acting motor 12 as drive mechanism, it is possible to make workbench
11 move in the lateral direction；Discharge unit 14, it is possible to send stock roll RS, stock roll RS is by the stripping of banding
Constitute from sheet RL and the banding sheet WS being pasted onto on a face of stripping film RL temporarily；Cutter unit 15, by
Otch CU is formed, in the inner side shape of this otch CU on the banding sheet WS of stock roll RS that discharge unit 14 is sent
Become bonding sheet AS, and form useless US in the outside of this otch CU；Winder unit 16, it is possible to by useless
US winds；As the peel plate 18 of stripping unit, stripping film RL is turned back, thus by bonding sheet AS from stripping
Sheet RL peels off；And the pressing roller 19 as pressing unit, the bonding sheet AS pressing that plate 18 is peeled off will be stripped
Paste on ring frame RF and wafer W F.Banding sheet WS possesses substrate sheets BS and lamination in this substrate sheets
Adhesive phase AD on one face of BS, banding sheet WS are pasted onto stripping film by this adhesive phase AD temporarily
On RL.It addition, the lower surface in wafer W F is pasted with screening glass PS.
Described discharge unit 14 possesses: the support shaft 25 supporting stock roll RS；Send from support shaft 25
Go out and carried out the 1st driving roller the 27 and the 1st pinch roll 28 clamped by stock roll RS before cutter unit 15；
The 2nd driving roller the 31 and the 2nd pinch roll 32 that stripping film RL after have passed through peel plate 18 is clamped；
And wireline reel 34, by not shown drive mechanism with predetermined torque by by the stripping film after these rollers
RL winds.Each drives roller 27,31 to be configured to can be by rotation motor DM1, the DM2 as drive mechanism
Rotate.
Described cutter unit 15 possesses: die-cut roller 36, is configured in the banding sheet WS of sent stock roll RS
Side, is configured to centered by rotation axis MC rotate；Seaming roll 37 (platen roller), is joined
Put the stripping film RL side in stock roll RS, linked with die-cut roller 36 by not shown mechanism, be set
One-tenth can rotate centered by rotation axis PC；As the rotation motor DM3 of drive mechanism, make die-cut roller 36
Rotate；And the drive mechanism such as not shown direct acting motor as interval adjustment unit, to die-cut roller 36
And the relative spacing between seaming roll 37 is adjusted.
Described die-cut roller 36 possesses: cutter 40, cuts banding sheet WS and forms otch CU；Cutter base
Plate 41, cutter 40 are erected on the surface of cutter substrate 41；And cutter substrate 41 is wound on the circle of periphery
The magnetic cylinder body 43 of column.
Described cutter 40 are projecting from cutter substrate 41, and when forming otch CU, cutter 40 are at banding sheet
There is on the thickness direction of WS height.As shown in Fig. 3 (A), when cutter substrate 41 is launched into plane, cutting
Cutter 40 in circular, be configured to be formed on banding sheet WS the internal diameter size than ring frame RF big and
Otch CU less than the circular of overall dimensions.Cutter 40 possess: 4 high cutter portions 46, at toroidal
Formed across 90 degree of intervals on circumferencial direction；4 low cutter portions 48, lay respectively between adjacent high cutter portion 46,
Aspect ratio height cutter portion 46 is low.Each high cutter portion 46 on the circumferencial direction of cutter 40 with the angular range of 30 degree
Formed.In the case of present embodiment, it is etched cutter substrate 41 processing and cutter 40, high cutter portion
The height of 46 is set to 450 μm, and the height in low cutter portion 48 is set to 435 μm.
Described cutter substrate 41 is arranged on magnetic cylinder body 43 and can be loaded and unloaded by magnetic force.Cutter substrate 41 is in exhibition
It is generally square shape when being split into plane, is being respectively arranged with high cutter portion 46 along its 4 limits.It addition, cutter base
The length on one side of plate 41 is configured to below the periphery length of magnetic cylinder body 43, it is possible to from the state launched with relatively
The opposed state in 2 limits be wound on magnetic cylinder body 43.Therefore, as in figure 2 it is shown, cutter substrate 41 is being installed
Time on magnetic cylinder body 43, the high cutter portion 46 of cutter 40 is positioned at axial both sides and the circumferencial direction two of magnetic cylinder body 43
Side.Here, be to form banding sheet WS by high cutter portion 46 at the bonding sheet AS formed by cutter 40
Transport direction (stock roll RS from support shaft 25 towards the direction of wireline reel 34) front end area.By this height
The bonding sheet AS part that cutter portion 46 is formed becomes as being stripped the bonding sheet that plate 18 is peeled off at first from stripping film RL
The initial stage stripping area Sa of transport direction leading section, the otch CU part corresponding with this initial stage stripping area Sa
Become initial stage otch CU1.It addition, be adjacent to the bonding sheet by the formation of low cutter portion 48 with initial stage stripping area Sa
AS part becomes the next period stripping of the inside region of the bonding sheet followed by peeled off as initial stage stripping area Sa stripping
From region Sb, the otch CU part corresponding with this next period stripping area Sb becomes next period otch CU2.It addition, work as
When cutter substrate 41 is wound onto on magnetic cylinder body 43, it is also possible to 2 opposed limits are changed to other 2 limits, or
Reversion will be axially directed relative to magnetic cylinder body 43.Thus, 4 high cutter portions 46 all can be formed and peel off with the initial stage
Initial stage otch CU1 corresponding for region Sa, can select arbitrary high cutter according to the deterioration state etc. in high cutter portion 46
Portion 46.
Here, be provided with not shown energiser unit on cutter unit 15, by this energiser unit to raw material
While volume RS gives energy, it is possible to form otch CU.As energiser unit, such as, except interior be located at die-cut
Outside winding heater at least one party of roller 36 and seaming roll 37, it is also possible to enumerate from leave these rollers 36,
The wind pushing mechanism of warm air, irradiation ultraviolet radiation, infrared ray, microwave are sent to the forming position of otch CU in the position of 37
The irradiation unit etc. of Isoenergetical line etc..
Described winder unit 16 is configured to possess: stripper roll 50, is wound on and defines otch by cutter unit 15
On useless US after CU, this useless US is peeled off from stripping film RL；And wireline reel 51, will pass through
Useless slice US winding after stripper roll 50.Wireline reel 51 is configured to can be by turning as drive mechanism
Galvanic electricity motivation DM4 rotates, and is wound by useless US with predetermined torque.
Then, the method for attaching of the bonding sheet AS of present embodiment is described.
First, stock roll RS being supported in support shaft 25 is made to drive roller the 27 and the 1st pinch roll 28 from the 1st
Between and die-cut roller 36 and seaming roll 37 between pass through.Then, from stripping film RL, banding sheet WS is peeled off,
After this banding sheet WS is entangled in stripper roll 50, it is conducted end and is fixed on wireline reel 51.It addition, stripping
Turn back in the front end of peel plate 18 from sheet RL, drive between roller the 31 and the 2nd pinch roll 32 by the 2nd, by it
Leading end is fixed on wireline reel 34.It addition, in the present embodiment, the thickness of banding sheet WS be 100 μm,
The thickness of stripping film RL is 25 μm.It addition, cutter 40 are wound onto on the periphery of magnetic cylinder body 43, pass through
Relative spacing between high cutter portion 46 and seaming roll 37 is adjusted to 5 μm by not shown interval adjustment unit.
Thus, the relative spacing between low cutter portion 48 and seaming roll 37 is 20 μm.In the present embodiment, such as Fig. 1
Shown in, the central authorities in the region being formed without cutter 40 in the direction of rotation of die-cut roller 36 are set to die-cut roller
The starting position St of 36, when this starting position St is again adjacent to seaming roll 37, makes die-cut roller 36
Stop the rotation.
Then, when making rotation motor DM1～DM4 linkage send stock roll RS, by cutter 40 from base
Material sheet BS lateral stripping film RL side forms otch CU, banding sheet WS and is divided into the bonding sheet AS inside otch CU
With useless US outside otch CU.Here, form initial stage otch CU1 by high cutter portion 46 on bonding sheet AS
And after defining initial stage stripping area Sa, form next period otch CU2 by low cutter portion 46 and form next period stripping
Region Sb.Thus, high cutter portion 46 enters into 20 μm in the stripping film RL corresponding with initial stage otch CU1, thus
Initial stage otch CU1 positively enters in stripping film RL, and initial stage stripping area Sa easily separates with useless US.
It addition, low cutter portion 48 only enters 5 μm in the stripping film RL corresponding with next period otch CU2, so and the next period
Stripping film RL part corresponding for stripping area Sb is difficult to be cut.
After forming otch CU, stock roll RS sent, utilize stripper roll 50 from stripping film RL by useless US
Peeling off, useless US is winding on wireline reel 51.Now, stripping area Sa easily separates with useless US,
So bonding sheet AS will not wind to wireline reel 51 direction together with useless US.Then, useless when being wound with
When the bonding sheet AS of stock roll RS of sheet US peels off scheduled volume from the front end of peel plate 18 and comes off, utilize and do not give
The sensor of diagram detects that the front end of this bonding sheet AS stops action, standby.Now, due to
Initial stage, otch CU1 positively entered into stripping film RL, so initial stage stripping area Sa is from stripping film RL positively
Peel off, roller 31 direction will be driven to be wound around to the 2nd together with stripping film RL.It addition, sometimes with initial stage stripping area
Stripping film RL part corresponding for territory Sa also can come off from peel plate 18 together with bonding sheet AS.But, due to
Stripping film RL part corresponding for next period stripping area Sb is difficult to be cut, so along with sending of stock roll RS
The stripping film part come off together with bonding sheet AS will not increase further, in the stripping come off together with bonding sheet AS
Act in sheet part from the front end of peel plate 18 to the 2nd power driving the stretching of roller 31 direction, it is possible to will be with the initial stage
Stripping film RL part corresponding for stripping area Sa is positively peeled off from bonding sheet AS.It addition, when being in shape of awaiting orders
During state, as it is shown in figure 1, die-cut roller 36 is configured to, the position of cutter 40 is not had to be positioned at seaming roll 37 side,
By die-cut roller 36 and seaming roll 37 can be made as the incision site adjustment unit of not shown drive mechanism
Position move in the vertical direction.According to this structure, it is possible to arbitrarily adjust the interval of each bonding sheet AS,
Their position can be changed in the vertical direction according to bonding sheet AS length on transport direction.Then,
By not shown transport unit ring frame RF and wafer W F it is placed on and adsorbs holding on workbench 11.
Then, workbench 11 is transported to left side by direct acting motor 12 in the lower section of peel plate 18 from right side.When
Workbench 11 is when predetermined position is detected by not shown sensor, and the 1st and the 2nd drives roller 27,31
Conveyance with workbench 11 synchronously rotates, and sends stock roll RS, and bonding sheet AS shells in the front end of peel plate 18
From.Then, the bonding sheet AS being stripped is adhered to ring frame by by what pressing roller 19 produced by pressure
On each upper surface of RF and wafer W F, wafer W F and ring frame RF are integrated by bonding sheet AS.This
Time, peel off stripping film RL corresponding to codomain Sa with the initial stage and partly positively peel off from bonding sheet AS, so will not
There is the situation that the bonding sheet AS of the state with stripping film RL part is adhered in adherend.
Therefore, according to this embodiment, by the cutting of cutter 40, it is possible to make initial stage stripping area Sa
The notch depth notch depth than next period stripping area Sb deep, it is possible to prevent bonding sheet AS and useless US mono-
Body is stripped and causes this bonding sheet AS not paste.The low cutter portion 48 being additionally, since with next period stripping area
The notch depth formed in stripping film RL part corresponding for Sb is shallow, it is possible to prevent bonding sheet AS from have passed through
Stock roll RS after cutter unit 15 comes off and causes carrying out the stickup of this bonding sheet AS.Like this,
According to above-mentioned embodiment, though stripping film RL thinning, it is also possible to carry out the formation of bonding sheet AS, stripping well
From and paste, it is possible to reply realizes the requirement that cost reduces because of this thinning.
As it has been described above, above-mentioned record discloses optimum composition, the method etc. for implementing the present invention, but this
Bright it is not limited to this.
It is to say, although the present invention is main, and specific embodiment carried out special diagram, explanation, but
In the case of the technological thought of the present invention and purpose scope, those skilled in the art can pin as required
To embodiments described above, shape, position or configuration etc. are carried out various change.
Therefore, the record defining shape etc. disclosed above is for the ease of understanding that the present invention exemplarily records
, it is not intended to limit the present invention, eliminates the note of the some or all of component names of the restrictions such as these shapes
Load is also contained in the present invention.
For example, it is possible to described winder unit 16 is omitted, it is also possible to from stripping film RL, useless US is not peeled off,
Utilize peel plate 18 to be peeled off by bonding sheet AS, utilize wireline reel 34 to be wound around by stripping film RL and useless US.
In this case, it is possible to prevent from utilizing peel plate 18 to be peeled off by initial stage stripping area Sa and cause bonding sheet
AS drives roller 31 direction winding to the 2nd together with useless US.
It addition, when forming otch CU, make each rotate motor DM1～DM4 linkage, make stock roll RS exist
Reciprocate on transport direction, relative to forming 1 bonding sheet AS, at the height corresponding with initial stage stripping area Sa
Repeatedly cut at cutter portion 46.
In addition it is also possible to constituted by the peel plate 18 and pressing roller 19 omitting described sheet adhering apparatus 10
Sheet producing device.By this device, identically with above-mentioned embodiment, define viscous by cutter unit 15
After closing sheet AS, stock roll RS is winding on wireline reel 34, and this stock roll RS is by facing bonding sheet AS
Time paste and form on stripping film RL.Be winding to stock roll RS on wireline reel 34 can also additionally transport,
Keeping, or also be able in middle utilizations such as the sheet adhering apparatus without cutter unit.Like this, will be wound up into
Stock roll RS on wireline reel 34 keeps this state to be used directly in not having the sheet adhering apparatus etc. of cutter unit
In the case of, the transport direction rearward end of discharge unit 14 becomes the initial stage stripping area Sa of this sheet adhering apparatus etc.,
So can also giving discharge unit 14 that the high cutter portion 46 of cutter unit 15 is arranged at least bonding sheet AS
The otch CU of outgoing direction rearward end is deeper than other regions.
As long as it addition, the flat shape of cutter 40 can form otch CU on banding sheet WS and this be cut
The shape that the inner side of mouthful CU is formed as bonding sheet AS, can be polygon, ellipse, oval, prismatic,
The various changes such as the shape by straight line and curve combination, the height of cutter can also arbitrarily change.
Additionally, in the above-described embodiment, it is also possible to omit beyond the high cutter portion 46 of formation initial stage stripping area Sa
At least one high cutter portion 46.
It addition, by cutter substrate 41 being formed as circular or polygon such that it is able to increase and may optionally utilize
The quantity in high cutter portion 46.
Additionally, show in the above-described embodiment and high cutter portion 46 be formed at cutter with the angular range of 30 degree
Example on the circumferencial direction of 40, but can be formed with the angular range of less than 30 degree, and can also be at height
Cutter portion 46 is formed with the angular range of more than 30 degree in the range of not connected with adjacent high cutter portion 46.
As long as it addition, cutter unit 15 can form described initial stage otch CU1, next period otch CU2, also
Other cutter units such as laser can be used.
Additionally, cutter 40 are in addition to being formed by etching and processing, it is also possible to use by machining shape
Outside the graver of one-tenth, rotating mould, it is possible to use define the flat cutter of cutter, Thomson cutter etc. on flat board.
It addition, the height in high cutter portion 46, low cutter portion 48 can consider that the thickness of stock roll RS, character etc. are entered
On the basis of row suitably change, form low and higher than low cutter portion 48 intermediate knife portion of aspect ratio height cutter portion 46.
Additionally, discharge unit 14, peel plate 18, pressing roller 19 can also carry out various design alteration.
Alternatively, it is also possible to utilize so-called carrier (bearer) to constitute interval adjustment unit, adjusted by interval
Relative spacing between cutter 40 and seaming roll 37 that whole unit regulates can consider stock roll RS thickness,
Character, the especially thickness of stripping film RS, character etc. suitably change.
Additionally, the thickness constituting the parts of stock roll RS is not limited to the illustration in above-mentioned embodiment.
It addition, arrange the drive mechanism making sheet adhering apparatus 10 move, when making workbench 11 stop,
Make sheet adhering apparatus 10 move to the right direction of Fig. 1, make workbench 11 left direction move, and make thin slice
Sticker 10 right direction moves, and is pasted in adherend by bonding sheet AS.
Additionally, the drive mechanism of above-mentioned embodiment can use rotation motor, direct acting motor, linear electrical
The motor drive mechanisms such as machine, single-shaft mechanical arm, multi-joint manipulator, cylinder, fluid cylinder, activate without bar cylinder and rotor cylinder etc.
These are combined (also having the part repeated with the parts of illustration in embodiment) by devices etc. directly or indirectly.
It addition, as adherend, wafer W F, ring frame RF can be substituted, by glass slope, steel plate or tree
The other materials such as fat plate are as object, and semiconductor wafer can also be semiconductor silicon wafer, compound semiconductor wafer.
It addition, substitute ring frame RF, it is possible to use the frame of other shapes such as C-shape, U-shape, it is also possible to ringless-type
Frame RF and using single adherend as the pasted objects of bonding sheet AS.
Claims (2)
1. a sheet producing device, it is characterised in that including:
Discharge unit, sends stock roll, and this stock roll is by having bonding on a face of the substrate sheets in banding
The banding sheet of oxidant layer pastes via this adhesive phase temporarily and forms on banding stripping film；And
Cutter unit, forms the otch of reservation shape on described banding sheet, forms bonding sheet in the inner side of this otch,
And form useless in the outside of this otch,
Described cutter unit is configured to form the otch corresponding with the transport direction leading section of described bonding sheet
The depth ratio otch corresponding with the inside region of described bonding sheet in addition to described transport direction leading section
Otch that at least one of degree of depth is deep and the otch corresponding with the transport direction rearward end of described bonding sheet deep
Degree than the otch corresponding with the inside region of described bonding sheet in addition to described transport direction rearward end at least
At least one party in the otch that a part of degree of depth is deep.
2. a method of producing sheet, it is characterised in that including:
Sending operation, send stock roll, this stock roll is by having bonding on a face of the substrate sheets in banding
The banding sheet of oxidant layer pastes via this adhesive phase temporarily and forms on banding stripping film；And
Cutting action, forms the otch of reservation shape on described banding sheet, forms bonding sheet in the inner side of this otch,
And form useless in the outside of this otch,
In described cutting action, it is possible to form the deep of the otch corresponding with the transport direction leading section of described bonding sheet
Degree than the otch corresponding with the inside region of described bonding sheet in addition to described transport direction leading section at least
The deep otch of the degree of depth of a part and the depth ratio of the otch corresponding with the transport direction rearward end of described bonding sheet
At least one in addition to described transport direction rearward end of the otch corresponding with the inside region of described bonding sheet
Point the deep otch of the degree of depth at least one party.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011211945A JP5897856B2 (en) | 2011-09-28 | 2011-09-28 | Sheet manufacturing apparatus and manufacturing method |
| JP2011-211945 | 2011-09-28 |
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| Publication Number | Publication Date |
|---|---|
| CN103035558A CN103035558A (en) | 2013-04-10 |
| CN103035558B true CN103035558B (en) | 2016-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210391596.3A Active CN103035558B (en) | 2011-09-28 | 2012-09-25 | Sheet producing device and manufacture method |
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| Country | Link |
|---|---|
| JP (1) | JP5897856B2 (en) |
| KR (1) | KR101837133B1 (en) |
| CN (1) | CN103035558B (en) |
| TW (1) | TWI534942B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5789463B2 (en) * | 2011-09-28 | 2015-10-07 | リンテック株式会社 | Sheet sticking apparatus and sticking method, and sheet manufacturing apparatus and manufacturing method |
| KR101719044B1 (en) | 2014-12-29 | 2017-04-05 | 한국해양과학기술원 | location and position control device using water-jet linked sub-nozzle |
| JP2017204614A (en) * | 2016-05-13 | 2017-11-16 | 株式会社ディスコ | Tape sticking device |
| JP2020068327A (en) * | 2018-10-25 | 2020-04-30 | リンテック株式会社 | Sheet sticking method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025287A (en) * | 2001-07-16 | 2003-01-29 | Dainippon Printing Co Ltd | Punching blade structure and punching die |
| JP4444619B2 (en) * | 2003-10-10 | 2010-03-31 | リンテック株式会社 | MOUNTING DEVICE AND MOUNTING METHOD |
| JP4371890B2 (en) * | 2004-04-14 | 2009-11-25 | リンテック株式会社 | Pasting device and pasting method |
| JP4677758B2 (en) * | 2004-10-14 | 2011-04-27 | 日立化成工業株式会社 | Die-bonded dicing sheet, method for manufacturing the same, and method for manufacturing a semiconductor device |
| KR100515222B1 (en) * | 2005-03-18 | 2005-09-15 | 김인영 | Cutting roller for sticking thin plate cutter of two faces tape cutting apparatus |
| JP4468884B2 (en) | 2005-12-09 | 2010-05-26 | リンテック株式会社 | Tape sticking device, mounting device, and mounting method |
| JP4520403B2 (en) | 2005-12-09 | 2010-08-04 | リンテック株式会社 | Tape sticking device and sticking method |
| JP4787713B2 (en) | 2006-10-10 | 2011-10-05 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5234755B2 (en) * | 2008-07-09 | 2013-07-10 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5112984B2 (en) | 2008-08-06 | 2013-01-09 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP5075084B2 (en) * | 2008-10-16 | 2012-11-14 | 日東電工株式会社 | Protective tape application method and protective tape application device |
| JP5388792B2 (en) * | 2009-10-23 | 2014-01-15 | 新日鉄住金化学株式会社 | Multilayer adhesive sheet and manufacturing method thereof |
| JP5388794B2 (en) * | 2009-10-28 | 2014-01-15 | カルソニックカンセイ株式会社 | Punching device and punching method |
-
2011
- 2011-09-28 JP JP2011211945A patent/JP5897856B2/en active Active
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2012
- 2012-09-12 TW TW101133302A patent/TWI534942B/en active
- 2012-09-12 KR KR1020120100891A patent/KR101837133B1/en active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| CN103035558A (en) | 2013-04-10 |
| JP2013074098A (en) | 2013-04-22 |
| TWI534942B (en) | 2016-05-21 |
| KR101837133B1 (en) | 2018-03-09 |
| TW201316447A (en) | 2013-04-16 |
| JP5897856B2 (en) | 2016-04-06 |
| KR20130034591A (en) | 2013-04-05 |
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