JP2013095842A - Adhesive sheet and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive sheet which can improve a treating ability per prescribed time, and to provide a method for producing the same.SOLUTION: The adhesive sheet AS1 includes a base sheet BS, the first adhesive layer AD1 disposed on one side of the base sheet BS, and the second adhesive layer AD2 disposed on one side of the base sheet BS so as to surround the first adhesive layer AD1, wherein the first adhesive layer AD1 is formed in a shape corresponding to the shapes of the adhesion surfaces CP1 of a plurality of adherends CP and is disposed such that the first adhesive layer AD1 can adhere to the adherends CP.

Description

  The present invention relates to an adhesive sheet and a method for producing the same.

Conventionally, an adhesive sheet in which a plurality of adhesive layers are provided on a base sheet is known (for example, see Patent Document 1).
The conventional adhesive sheet described in Patent Literature 1 includes a base film and a first pressure-sensitive adhesive layer laminated on one surface of the base film, a base film, and the base material. What is provided with the 1st adhesive layer laminated | stacked on the one surface of the film and the 2nd adhesive layer laminated | stacked on the said 1st adhesive layer is disclosed. These adhesive sheets have a first pressure-sensitive adhesive layer attached to a semiconductor wafer (hereinafter sometimes simply referred to as a wafer), and a first pressure-sensitive adhesive layer or a second pressure-sensitive adhesive layer is attached to a ring frame. The wafer and the ring frame are configured to be integrated.

JP 2006-111727 A

  However, in the adhesive sheet AS described in Patent Document 1, as shown in FIG. 10A, when a wafer WF in which a groove WA having a predetermined depth is formed by so-called dicing is used, as shown in FIG. After the back grinding process of the wafer WF by the grinder 91 shown in FIG. 10, an adhesive cutting process for cutting the first adhesive layer AD1 by the cutting means 92 must be performed as shown in FIG. For this reason, there is an inconvenience that the processing capacity per unit time is lowered.

  The objective of this invention is providing the adhesive sheet which can improve the processing capability per predetermined time, and its manufacturing method.

  The adhesive sheet of the present invention surrounds the first adhesive layer on one surface of the base sheet, the first adhesive layer provided on one surface of the base sheet, and the base sheet. A second adhesive layer provided, wherein the first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of the plurality of adherends, and is provided so that the plurality of adherends can be bonded together. It is characterized by being.

  The adhesive sheet of the present invention includes a base sheet, a first adhesive layer provided on one surface of the base sheet, and a first laminate laminated between the base sheet and the first adhesive layer. 2 adhesive layers, the first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of the plurality of adherends, provided to be capable of adhering the plurality of adherends, The two adhesive layers are characterized in that their outer edges are sized to protrude from the first adhesive layer.

  The adhesive sheet of the present invention includes a base sheet, a first adhesive layer provided on one surface of the base sheet, and the first adhesive layer in a plan view on the other surface of the base sheet. A second adhesive layer provided in a protruding size, wherein the first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of the plurality of adherends, and the plurality of adherends are formed. It is provided so that adhesion is possible.

  The adhesive sheet of the present invention includes a base sheet, a first adhesive layer provided in the entire region of one surface of the base sheet, and the first adhesive layer on the one surface of the base sheet. The first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of the plurality of adherends, and adheres the plurality of adherends. The second adhesive layer is provided in an annular shape on the first adhesive layer.

  The adhesive sheet of the present invention is provided in a closed loop shape on a base sheet, a first adhesive layer provided in the entire region of one surface of the base sheet, and an outer edge portion of the other surface of the base sheet. The first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of the plurality of adherends, and is provided so as to adhere the plurality of adherends. It is characterized by.

  In the adhesive sheet of the present invention, it is preferable that an intermediate layer is provided between the first adhesive layer and the second adhesive layer.

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, the step of feeding out a base sheet, and A step of laminating the first adhesive layer having a shape corresponding to the shape of the adherend surfaces of a plurality of adherends on one surface, and surrounding the first adhesive layer on one surface of the base sheet And laminating the second adhesive layer, and at least one of the first adhesive layer and the second adhesive layer is laminated by printing the adhesive in a predetermined shape with a predetermined plate It is characterized by being.

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, the step of feeding out a base sheet, and Laminating the second adhesive layer on one surface, and laminating the first adhesive layer having a shape corresponding to the shape of the adherend surfaces of a plurality of adherends within the surface of the second adhesive layer And at least one of the first adhesive layer and the second adhesive layer is laminated by printing the adhesive in a predetermined shape with a predetermined plate.

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, the step of feeding out a base sheet, and A step of laminating the first adhesive layer having a shape corresponding to the shape of the adherend surfaces of a plurality of adherends on one surface, and a plan view of the other surface of the base sheet from the first adhesive layer. Laminating the second adhesive layer to a size that protrudes, and at least one of the first adhesive layer and the second adhesive layer prints the adhesive in a predetermined shape with a predetermined plate It is characterized by being laminated.

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, the step of feeding out the base sheet, and one of the base sheets Laminating the first adhesive layer having a shape corresponding to the shape of the adherend surface of a plurality of adherends on the entire surface area, and the second adhesive having an annular shape on the outer edge of the first adhesive layer A step of laminating layers, wherein at least one of the first adhesive layer and the second adhesive layer is laminated by printing the adhesive in a predetermined shape with a predetermined plate. To do.

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, the step of feeding out the base sheet, and one of the base sheets A step of laminating the first adhesive layer having a shape corresponding to the shape of the adherend surface of a plurality of adherends in the entire area of the surface; A step of laminating an adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer is laminated by printing the adhesive in a predetermined shape with a predetermined plate. And

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, wherein the second adhesion is applied to the entire region or a partial region of the other surface. A step of feeding out the base material sheet on which the adhesive layer is laminated, and a surface of the adherend of the plurality of adherends so as to be inside the second adhesive layer in a plan perspective view on one surface of the fed base material sheet. And laminating the first adhesive layer having a shape corresponding to the shape, wherein the first adhesive layer is laminated by printing the adhesive in a predetermined shape with a predetermined plate. .

  The sheet manufacturing method of the present invention is a sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer, and a plurality of depositions are applied to the entire region or a partial region of one surface. A step of feeding out a base sheet on which the first adhesive layer having a shape corresponding to the shape of the adherend surface of the body is laminated, and the first adhesive layer in a plan view on the other side of the fed-out base sheet A step of laminating the second adhesive layer in a ring shape so as to include the second adhesive layer, wherein the second adhesive layer is laminated by printing the adhesive in a predetermined shape with a predetermined plate. To do.

  According to the present invention as described above, the first adhesive layer bonded to the plurality of adherends in the adhesive sheet is formed in advance in a shape corresponding to the shape of the adherend surface of each adherend. For this reason, it is not necessary to cut | disconnect the 1st adhesive bond layer of the said adhesive sheet according to the shape of a to-be-adhered surface after adhesion | attachment of an adhesive sheet, and can improve the processing capability per unit time.

  In addition, if an intermediate layer is provided between the first adhesive layer and the second adhesive layer, the adhesive layers are not bonded to each other. Therefore, when one adhesive layer is peeled off, the other It is possible to prevent the adhesive layers from being peeled off together.

  Furthermore, by printing at least one of the first adhesive layer and the second adhesive layer in a predetermined shape with a predetermined plate, the adhesive layer can be laminated in a complicated shape.

The partial cross section perspective view which shows the usage example of the adhesive sheet which concerns on 1st Embodiment of this invention. FIG. 3 is a side view of the sheet manufacturing apparatus according to the first embodiment. The perspective view which shows the adhesive sheet which concerns on 2nd Embodiment of this invention. The side view of the sheet manufacturing apparatus of the said 2nd Embodiment. The fragmentary sectional perspective view which shows the adhesive sheet which concerns on 3rd Embodiment of this invention. The fragmentary sectional perspective view which shows the usage example of the adhesive sheet which concerns on the modification of the said 3rd Embodiment. The fragmentary sectional perspective view which shows the adhesive sheet which concerns on 4th Embodiment of this invention. The fragmentary sectional perspective view which shows the usage example of the adhesive sheet which concerns on another modification. The fragmentary sectional perspective view which shows the usage example of the adhesive sheet which concerns on another modification. (A) is a side view which shows the usage example of the conventional adhesive sheet, (B) is a side view which shows the grinding process of a to-be-adhered body, (C) is a side view which shows the adhesive agent cutting process of the conventional adhesive sheet.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings.
In the second to fourth embodiments, the same components as those described in the next first embodiment and components having the same functions are denoted by the same reference numerals as those of the first embodiment. These descriptions are omitted or simplified. Moreover, in each figure, in order to make the content of the present invention easy to understand, the shape and arrangement state of each component are exaggerated.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
In FIG. 1, an adhesive sheet AS1 is attached to a wafer WF as an adherend and a ring frame RF as an adherend, thereby holding the wafer WF with the ring frame RF.

  The adhesive sheet AS1 includes a disk-shaped base sheet BS, and a first adhesive layer AD1 and a second adhesive layer AD2 provided at different positions on one surface of the base sheet BS.

  The first adhesive layer AD1 is formed in a shape corresponding to the shape of the adherend surface CP1 of each chip CP, and is provided at a position corresponding to the attachment position of each chip CP. That is, the first adhesive layer AD1 is arranged in a lattice shape corresponding to each chip CP, and is provided so that a plurality of chips CP can be bonded. The adhesive used for the first adhesive layer AD1 is not particularly limited, and examples thereof include those having thermoplasticity, thermal polymerization, and the like used for a die attach film.

  The second adhesive layer AD2 is formed in an annular shape so as to fit within the plane of the ring frame RF, and surrounds the first adhesive layer AD1 on the same side as the first adhesive layer AD1 in the base sheet BS. Has been placed. This 2nd adhesive bond layer AD2 is not specifically limited, For example, a pressure sensitive adhesive thing can be illustrated.

Next, the sheet manufacturing apparatus 1A that manufactures the adhesive sheet AS1 will be described.
As shown in FIG. 2, the sheet manufacturing apparatus 1 </ b> A has a feeding unit 10 that feeds a belt-shaped base sheet BS, and a first adhesive layer AD <b> 1 that is laminated by printing on one surface of the base sheet BS. 20 A of lamination | stacking means, 2nd lamination | stacking means 20B laminated | stacked by printing 2nd adhesive bond layer AD2 in the position different from 1st adhesive bond layer AD1 in one surface of base sheet BS, and each adhesive bond layer AD1 , A curing means 30 as a solidification accelerating means for curing AD2, a release sheet supply means 40 for supplying the release sheet RL, and each adhesive layer AD1, on one surface of the base sheet BS by each lamination means 20A, 20B. The temporary attachment means 50 for temporarily attaching the release sheet RL to the original adhesive sheet OS on which AD2 is laminated, and the original adhesive sheet OS is cut along the outer edge portion of the second adhesive layer AD2 to form the adhesive sheet AS1. The cutting means 60 to be formed, the collecting means 70 for collecting the unnecessary sheet US formed around the adhesive sheet AS1, and the winding for winding the first raw fabric RS1 temporarily attached to the release sheet RL with a plurality of adhesive sheets AS1 And taking means 80.

  The feeding means 10 winds and supports the base sheet BS in a roll shape and supports the support roller 12 rotatably provided by a rotation motor 11 as a driving device, and the base sheet BS drawn from the support roller 12. And a drive roller 14 that is rotatably provided by a rotation motor 13 as a drive device, and a pinch roller 15 that sandwiches the base sheet BS between the drive roller 14.

  The first stacking unit 20A includes a rotary screen printer 21A as a printing unit. The rotary screen printing machine 21A is rotatably provided by a rotation motor 24A as a driving device above the base sheet BS conveyed in the left-right direction in FIG. 2, and has a first adhesive layer AD1 on a cylindrical surface. A rotary screen 22A as a plate on which a printing pattern is formed, a squeegee (not shown) provided in the rotary screen 22A, and the rotary screen 22A with the base sheet BS interposed therebetween, are arranged as a drive device. And an impression cylinder 23A rotatably provided by a dynamic motor 25A. The rotary screen printer 21A rotates the rotary screen 22A and the impression cylinder 23A, and the molten adhesive stored in the rotary screen 22A passes through holes (not shown) formed on the surface of the rotary screen 22A. By extruding with a squeegee, the first adhesive layer AD1 is printed and laminated on one surface of the base sheet BS.

  The second stacking means 20B has the same configuration as the first stacking means 20A, and can be described by replacing the symbol at the end A of the first stacking means 20A with B. Therefore, the description thereof is omitted.

  The curing unit 30 is provided on the downstream side in the transport direction of the base sheet BS with respect to the first stacking unit 20A. Depending on the curing characteristics of the first adhesive layer AD1 and the second adhesive layer AD2, for example, hot air, Those that generate fixing energy such as ultraviolet rays, infrared rays, microwaves, cold winds, and natural winds are employed.

The release sheet supply means 40 includes a support roller 42 that is wound around and supported by the release sheet RL and that can be rotated by a rotation motor 41 as a drive device.
The temporary attachment means 50 is rotatably provided by a rotation motor 51 as a driving device, and a guide roller 52 that guides the release sheet RL fed from the release sheet supply means 40 in the conveying direction of the base sheet BS, and an induction And a pinch roller 53 disposed to face the roller 52.

  The cutting means 60 includes a die cut roller 62 having a cutting blade 61 for forming a circular cut CU in the original adhesive sheet OS, and a platen roller disposed opposite to the die cut roller 62 with the original adhesive sheet OS and the release sheet RL interposed therebetween. 63. The cutting blade 61 forms a cut CU having a depth that does not penetrate the release sheet RL from the base sheet BS side, forms a circular adhesive sheet AS1 inside the cut CU, and forms a strip-like shape outside the cut CU. The unnecessary sheet S3 is formed. Note that the die cut roller 62 and the platen roller 63 are rotatably provided in synchronization by rotation motors 64 and 65 as drive devices, respectively. The cutting blade 61 is preferably subjected to non-adhesion treatment such as a fluororesin coating so that the adhesive of the original adhesive sheet OS does not adhere.

  The collection means 70 includes a peeling roller 71 that peels the unnecessary sheet US from the peeling sheet RL, and a collection roller 73 that is rotatably provided by a rotation motor 72 as a drive device and collects the unnecessary sheet US.

  The winding means 80 is rotatable by a driving roller 82 that is rotatably provided by a rotating motor 81 as a driving device, a pinch roller 83 that is disposed to face the driving roller 82, and a rotating motor 84 that is a driving device. And a take-up roller 85 for winding up the first original fabric RS1 temporarily attached to one surface of the release sheet RL at a predetermined interval via the adhesive layers AD1 and AD2.

In the above sheet manufacturing apparatus 1A, as a procedure for manufacturing the first original fabric RS1, first, as shown in FIG. 2, the wound base material sheet BS and release sheet RL are respectively supported by the support roller 12 and the support roller 42. The base sheet BS and the release sheet RL are passed through as shown in FIG.
In this state, the rotation motors 11 and 13, the rotation motors 24B, 25B, 24A, 25A, 41, 51, 64, 65, 72, 81, and 84 are driven to support the roller 12, the drive roller 14, and the rotary screen. 22B, 22A, impression cylinders 23B, 23A, support roller 42, guide roller 52, die cut roller 62, platen roller 63, recovery roller 73, drive roller 82, and take-up roller 85 are rotated to feed out the base sheet BS.

  When each roller rotates, the molten second adhesive layer AD2 is annularly laminated on one surface of the base sheet BS fed from the support roller 12 by the rotary screen printer 21B, and then the rotary screen printer The first adhesive layer AD1 in a molten state by 21A is laminated on the inner side of the second adhesive layer AD2 with the first adhesive layer AD1 having a shape corresponding to the shape of the adherend surface CP1 (see FIG. 1) of each chip CP. Thus, the original adhesive sheet OS is formed. Thus, by using the printing method, the adhesive layers AD1 and AD2 can be easily laminated in a complicated shape. Moreover, the production time of the adhesive sheet AS1 can be shortened by laminating the first adhesive layer AD1 while laminating the second adhesive layer AD2.

  The formed original adhesive sheet OS is sandwiched between the guide roller 52 and the pinch roller 53 by the temporary attachment means 50 after the adhesive layers AD1 and AD2 are cured by the curing means 30, and from the release sheet supply means 40. It is temporarily attached to the supplied release sheet RL. Thereafter, the original adhesive sheet OS temporarily attached to the release sheet RL is cut by the cutting means 60 at the outer edge portion of the second adhesive layer AD2 to form a circular adhesive sheet AS1 and an unnecessary sheet US. It is formed. Then, the unnecessary sheet US is peeled off from the release sheet RL and collected by the collection roller 73, and the first original fabric RS1 in which the plurality of adhesive sheets AS1 are temporarily attached on the release sheet RL is taken up by the take-up roller 85. It is done.

  As shown in FIG. 1, the adhesive sheet AS1 of the first original fabric RS1 is pasted on a wafer WF in which a groove WA having a predetermined depth is formed in advance by dicing, as shown in FIG. Thereafter, the surface of the wafer WF opposite to the first adhesive layer AD1 is ground, and the wafer WF is separated into a plurality of chips CP as shown by solid lines in FIG. It will be in the state adhered to agent layer AD1.

According to the first embodiment as described above, since the first adhesive layer AD1 is formed in advance in a shape corresponding to the shape of the adherend surface CP1 of each chip CP, the first adhesive layer AS1 is bonded after the bonding. It is not necessary to cut the adhesive layer AD1 according to the shape of the adherend surface CP1, and the processing capacity per unit time can be improved.
Further, since there is no need to cut the first adhesive layer AD1, it is possible to prevent the first adhesive layer AD1 from biting into the base sheet BS along with the cutting of the first adhesive layer AD1. it can. For this reason, the first adhesive layer AD1 can be easily peeled off from the base sheet BS when the chip CP is picked up, and the pick-up property of the chip CP can be improved.

Further, since there is no need to cut the first adhesive layer AD1, the first adhesive layer AD1 scatters in the space and adheres to the chip CP as the first adhesive layer AD1 is cut. It is possible to prevent a decrease in yield in the manufacture of
Further, since the second adhesive layer AD2 is provided on one surface of the base sheet BS so as to surround the first adhesive layer AD1, the second adhesive conforming to the ring frame RF corresponding to the adherend is provided. The adhesive sheet AS1 can be attached to the ring frame RF via the adhesive layer AD2, and the wafer WF can be reliably held via the adhesive sheet AS1.
Furthermore, since each adhesive layer AD1, AD2 is laminated in a shape corresponding to the shape of the adherend surface of the wafer WF or ring frame RF, the amount of adhesive used is minimized in forming each adhesive layer AD1, AD2. Can be limited. In the sheet manufacturing apparatus 1A, the cutting means 60 and the collecting means 70 are not necessarily provided. In this case, after adhering the strip-shaped original adhesive sheet OS to the ring frame RF by the second adhesive layer AD2, the base sheet BS may be cut by a cutting means such as an appropriate cutter.

[Second Embodiment]
Next, 2nd Embodiment of this invention is described based on drawing.
As shown in FIG. 3, the adhesive sheet AS2 of this embodiment includes a base sheet BS, a circular second adhesive layer AD2 provided on one surface of the base sheet BS, and the attachment of each chip CP. The first adhesive layer AD1 is formed in a shape corresponding to the shape of the surface CP1 (see FIG. 1), and is laminated on the base sheet BS via the second adhesive layer AD2. Here, each 2nd adhesive bond layer AD2 is made into the magnitude | size which an outer edge part protrudes from 1st adhesive bond layer AD1. In addition, the adhesive sheet AS2 may be cut together with the base sheet BS on the outer edge portion of the second adhesive layer AD2 on the release sheet RL (not shown) similarly to the adhesive sheet AS1 of the first embodiment.

Next, the sheet manufacturing apparatus 1B that manufactures the adhesive sheet AS2 will be described.
The sheet manufacturing apparatus 1B is different from the sheet manufacturing apparatus 1A of the first embodiment in that the cutting means 60 and the recovery means 70 are not provided. That is, as shown in FIG. 4, the sheet manufacturing apparatus 1 </ b> B includes a feeding unit 10, a first stacking unit 20 </ b> A, a second stacking unit 20 </ b> B, a curing unit 30, a release sheet supply unit 40, and a temporary bonding unit 50. And a winding means 80.

  In this sheet manufacturing apparatus 1B, when the base sheet BS and the release sheet RL are set as shown in FIG. 4 and the base sheet BS is fed out by rotating each roller, a rotary screen is formed on one surface of the base sheet BS. The molten second adhesive layer AD2 is laminated in a circular shape by the printing machine 21B, and then the molten first adhesive layer AD1 is circularly formed on the second adhesive layer AD2 by the rotary screen printing machine 21A. By laminating, the adhesive sheet AS2 is formed. The adhesive sheet AS2 is temporarily attached to the release sheet RL supplied from the release sheet supply means 40 after the adhesive layers AD1 and AD2 are cured by the curing means 30, and the adhesive sheet AS2 is placed on the release sheet RL. The temporarily attached second original fabric RS2 is taken up by the take-up roller 85.

  The adhesive sheet AS2 manufactured in this way is attached to the wafer WF and the ring frame RF by, for example, a sheet attaching device (not shown), and then the outer edge portion of the second adhesive layer AD2, that is, the ring frame RF. Cut in-plane. Then, as in the first embodiment, the wafer WF is pasted on the pre-diced wafer WF, and the wafer WF is ground and separated into a plurality of chips CP.

According to the second embodiment as described above, the same effect as that of the first embodiment can be obtained.
Note that the sheet manufacturing apparatus 1B may be provided with the cutting means 60 similar to that of the sheet manufacturing apparatus 1A of the first embodiment to form an original fabric in which a plurality of adhesive sheets AS2 are temporarily attached on the release sheet RL.
Moreover, since the shape of 2nd adhesive bond layer AD2 can be simplified compared with 1st Embodiment, adhesive sheet AS2 can be manufactured easily. Note that the second laminating means 20B in the sheet manufacturing apparatus 1B is omitted, and the one in which the second adhesive layer AD2 is laminated in advance on the entire area or a partial area of one surface of the base sheet BS is fed from the feeding means 10. The first adhesive layer AD1 may be laminated in the plane of the second adhesive layer AD2 in the base sheet BS. Also in such a case, the sheet manufacturing apparatus 1B is provided with the cutting means 60 similar to the sheet manufacturing apparatus 1A of the first embodiment, and a raw material in which a plurality of adhesive sheets AS2 are temporarily attached is formed on the release sheet RL. Alternatively, for example, after being affixed to the wafer WF and the ring frame RF by a sheet affixing device (not shown) or the like, the outer edge portion of the second adhesive layer AD2, that is, the surface of the ring frame RF is cut. May be.

[Third Embodiment]
Next, 3rd Embodiment of this invention is described based on drawing.
As shown in FIG. 5, the adhesive sheet AS3 of the present embodiment is provided with a base sheet BS and a shape corresponding to the shape of the attachment surface CP1 of each chip CP on one surface of the base sheet BS. 1 adhesive layer AD1 and cyclic | annular 2nd adhesive layer AD2 provided in the other surface of base sheet BS are provided. The first adhesive layer AD1 is provided in the center portion of the base sheet BS, and the second adhesive layer AD2 is provided in a size that protrudes from the first adhesive layer AD1 in plan perspective. In addition, the adhesive sheet AS3 may be cut together with the base sheet BS on the outer edge portion of the second adhesive layer AD2 on the release sheet RL (not shown) like the adhesive sheet AS1 of the first embodiment. Similarly to the adhesive sheet AS2 of the second embodiment, it may be cut in the plane of the ring frame RF during use.

  In the sheet manufacturing apparatus for the adhesive sheet AS3, the feeding means 10 is opposite to the sheet manufacturing apparatus 1A, that is, the base sheet BS is fed out so that one surface of the base sheet BS is on the lower side. The stacking means 20A is configured to print the shape first adhesive layer AD1 corresponding to the shape of the adherend surface CP1 of each chip CP on one surface (the lower surface in FIG. 2) of the base sheet BS, Accordingly, the configuration is different from the sheet manufacturing apparatus 1A of the first embodiment in that the curing means 30 is also provided on the lower side in FIG. Then, after the rotary screen printing machine 21A prints the first adhesive layer AD1 on the lower surface in FIG. 2 of the base sheet BS, the added curing means 30 is the first adhesive from the lower surface side in FIG. The operation differs from the sheet manufacturing apparatus 1A of the first embodiment in that the layer AD1 is cured. The adhesive sheet AS3 manufactured in this way is attached to the wafer WF and the ring frame RF by, for example, a sheet attaching device (not shown), and then the outer edge portion of the second adhesive layer AD2, that is, the ring frame RF. Cut in-plane.

The effects similar to those of the first embodiment can be obtained by the third embodiment as described above.
The sheet manufacturing apparatus for the adhesive sheet AS3 is provided with a cutting means 60 similar to that of the sheet manufacturing apparatus 1A of the first embodiment, and a raw fabric in which a plurality of adhesive sheets AS2 are temporarily attached is formed on the release sheet RL. Also good.
Moreover, as shown in FIG. 6, it is good also as a structure which provides 2nd adhesive bond layer AD2 in the whole area | region of the other surface of base sheet BS. Similarly to the adhesive sheet AS1 of the first embodiment, such an adhesive sheet AS3 may have the outer edge portion of the second adhesive layer AD2 cut along with the base sheet BS on the release sheet RL (not shown). Similarly to the adhesive sheet AS2 of the second embodiment, it may be cut in the plane of the ring frame RF during use.
In these cases, the second adhesive layer AD2 is configured to be laminated on the entire region or a partial region of the other surface of the base sheet BS with the sheet manufacturing apparatus for the adhesive sheet AS3, and the second adhesive layer is seen through in plan view. The first adhesive layer AD1 is laminated on one surface of the base sheet BS so as to be inside the AD2, that is, the second adhesive layer AD2 protrudes from the first adhesive layer AD1 in a plan view. What should I do? Further, the second laminating means 20B in the sheet manufacturing apparatus for the adhesive sheet AS3 is omitted, and the one in which the second adhesive layer AD2 is laminated in advance on the entire area or a partial area of the other surface of the base sheet BS is fed out. The first adhesive layer AD1 may be laminated on one surface of the base sheet BS so as to extend from 10 and to be inside the second adhesive layer AD2 in plan perspective. Such a sheet manufacturing apparatus for the adhesive sheet AS3 may also be provided with a cutting means 60 similar to that of the sheet manufacturing apparatus 1A to form an original fabric in which a plurality of adhesive sheets AS3 are temporarily attached to the release sheet RL. The adhesive sheet AS3 manufactured in this way is attached to the wafer WF and the ring frame RF by, for example, a sheet attaching device (not shown), and then the outer edge portion of the second adhesive layer AD2, that is, the ring frame RF. Cut in-plane. The sheet manufacturing apparatus for the adhesive sheet AS3 is provided with a cutting means 60 similar to that of the sheet manufacturing apparatus 1A of the first embodiment, and a raw fabric in which a plurality of adhesive sheets AS2 are temporarily attached is formed on the release sheet RL. Also good.

[Fourth Embodiment]
Next, 4th Embodiment of this invention is described based on drawing.
As shown in FIG. 7, the adhesive sheet AS4 of the present embodiment is provided in a shape corresponding to the shape of the adherend surface CP1 of each chip CP in the entire region of the base sheet BS and one surface of the base sheet BS. The first adhesive layer AD1 is provided, and the second adhesive layer AD2 provided in an annular shape on the outer edge portion of the other surface of the base sheet BS. In addition, the adhesive sheet AS4 may be cut together with the base sheet BS on the outer edge portion of the second adhesive layer AD2 on the release sheet RL (not shown), similarly to the adhesive sheet AS1 of the first embodiment. Similarly to the adhesive sheet AS2 of the second embodiment, it may be cut in the plane of the ring frame RF during use.

  Since the sheet manufacturing apparatus of the adhesive sheet AS4 has the same configuration as the sheet manufacturing apparatus 1A of the first embodiment, the description and illustration of the configuration are omitted. Then, after the rotary screen printer 21B prints the second adhesive layer AD2 on the other surface (the upper surface in FIG. 2) of the base sheet BS in a ring shape, the rotary screen printer 21A detects one of the base sheets BS. The first adhesive layer AD1 is printed on the entire surface or a partial region of the surface (the lower surface in FIG. 2). The adhesive sheet AS4 manufactured in this way is attached to the wafer WF and the ring frame RF by, for example, a sheet attaching device (not shown), and then the outer edge portion of the second adhesive layer AD2, that is, the ring frame RF. Cut in-plane.

The effect similar to 1st Embodiment can be acquired also by the above 4th Embodiment.
In addition, the sheet manufacturing apparatus for the adhesive sheet AS4 is provided with the cutting means 60 similar to the sheet manufacturing apparatus 1A of the first embodiment, and a raw fabric in which a plurality of adhesive sheets AS2 are temporarily attached is formed on the release sheet RL. Also good.
Further, the first laminating means 20A in the sheet manufacturing apparatus for the adhesive sheet AS4 is omitted, and the one in which the first adhesive layer AD1 is laminated in advance on the entire area or a partial area of one surface of the base sheet BS is fed out. The second adhesive layer AD2 may be printed in an annular shape so that the first adhesive layer AD1 is included on the other surface of the base sheet BS in a plan view. Such a sheet manufacturing apparatus for the adhesive sheet AS4 may also be provided with a cutting means 60 similar to that of the sheet manufacturing apparatus 1A to form an original fabric in which a plurality of adhesive sheets AS4 are temporarily attached to the release sheet RL.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  For example, as shown in FIG. 8, the intermediate layer ML is laminated on the second adhesive layer AD2 in the adhesive sheet AS2, and the adhesive layer AS5 is formed by laminating the first adhesive layer AD1 on the intermediate layer ML. May be. In this case, the intermediate layer ML is stacked between the first stacking unit 20A and the second stacking unit 20B in the configuration of the sheet manufacturing apparatuses 1A and 1B with the same configuration as the first and second stacking units 20A and 20B. A laminating means may be provided, and the second laminating means 20B may be configured such that the second adhesive layer AD2 is laminated in the entire region of one surface of the base sheet BS or in a circular shape. Since the intermediate layer ML may be made of paper, film, or the like, the paper, film, or the like is appropriately changed to the second adhesive layer instead of the one having the same structure as the first and second laminating means 20A, 20B. What can be laminated | stacked on AD2 is employable. When the intermediate layer ML is provided in this way, for example, when the diced wafer WF (chip CP) is picked up together with the first adhesive layer AD1 and bonded to the substrate or the like, the second adhesive layer AD1 is connected to the second adhesive layer AD1. Bonding can be reliably performed by preventing bonding with the adhesive layer AD2 attached.

In the first embodiment, the first adhesive layer AD1 and the second adhesive layer AD2 are stacked by printing using a plate. For example, the second adhesive layer AD2 having a predetermined shape is separated by another peeling. An original sheet for sheet manufacture temporarily attached to one surface of the sheet is prepared in advance, and the second adhesive layer AD2 is peeled off from the original sheet for sheet manufacture and laminated on the base sheet BS. Good. In this case, the second lamination means 20B may be provided with a sheet manufacturing raw material feeding means for winding and supporting the sheet manufacturing raw material.
Moreover, you may comprise either one of the 1st lamination | stacking means 20A and the 2nd lamination | stacking means 20B by lamination methods other than the printing method.

In the above embodiment, the rotary screen printing machine as the printing unit is exemplified, but as the printing unit, for example, solvent coating method, gravure printing, screen printing, further, letterpress printing, intaglio printing, planographic printing, stencil printing, etc. Any printing method can be adopted, and there is no limitation as long as the material to be laminated can be printed (laminated) on the base sheet BS.
In the first to fifth embodiments, the second stacking unit 20B is provided on the upstream side of the first stacking unit 20A in the conveying direction of the base sheet BS. However, the first stacking unit 20A is replaced with the second stacking unit 20A. You may provide upstream from the means 20B.

Furthermore, as shown in FIG. 9, in the adhesive sheet AS6, the first adhesive layer AD1 is provided in the entire region of one surface of the base sheet BS, and a plurality of chips CP in the first adhesive layer AD1 can be bonded. By providing the first adhesive layer AD1 so as to surround a region, the second adhesive layer AD2 may be laminated on one surface of the base sheet BS via the first adhesive layer AD1.
In the embodiment, the outer edge portion of the second adhesive layer AD2 is formed continuously in the circumferential direction, but the outer edge portion may be formed intermittently along the circumferential direction.
Further, the first adhesive layer AD1 may be a pressure-sensitive adhesive, and the second adhesive layer AD2 may be an adhesive having thermoplasticity, thermal polymerization property, or the like.

  In addition, the types and materials of the adhesive sheets AS1 to AS6 in the present invention are not particularly limited. For example, the adhesive sheets AS1 to AS6 have a layer other than the intermediate layer ML between the first adhesive layer AD1 and the second adhesive layer AD2. It may be more than one layer. Further, the adhesive sheets AS1 to AS6 may be a protective sheet, a dicing tape, a die attach film, or the like. The wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, etc., and the adhesive sheet to be attached to such a wafer is not limited to a protective sheet, dicing tape, die attach film, but any other sheet, film, tape, etc. An adhesive sheet having an arbitrary use and shape can be applied. Further, the adherend may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. As described above, as an adherend, not only a glass plate, a steel plate, a resin plate, and other members, but also other forms of members and articles can be targeted.

  The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

AD1 1st adhesive layer AD2 2nd adhesive layer BS Base material sheet ML Intermediate layer AS1 to AS6 Adhesive sheet CP Chip (adherend)
CP1 surface

Claims (13)

A base sheet;
A first adhesive layer provided on one surface of the base sheet;
A second adhesive layer provided on one surface of the base sheet so as to surround the first adhesive layer;
The adhesive sheet, wherein the first adhesive layer is formed in a shape corresponding to a shape of an adherend surface of a plurality of adherends, and is provided so that the plurality of adherends can be bonded. A base sheet;
A first adhesive layer provided on one surface of the base sheet;
A second adhesive layer laminated between the base sheet and the first adhesive layer;
The first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of a plurality of adherends, and is provided so that the plurality of adherends can be bonded,
The adhesive sheet, wherein the second adhesive layer has a size such that an outer edge portion thereof protrudes from the first adhesive layer. A base sheet;
A first adhesive layer provided on one surface of the base sheet;
A second adhesive layer provided on the other surface of the base sheet in a size that protrudes from the first adhesive layer in a plan view,
The adhesive sheet, wherein the first adhesive layer is formed in a shape corresponding to a shape of an adherend surface of a plurality of adherends, and is provided so that the plurality of adherends can be bonded. A base sheet;
A first adhesive layer provided in the entire region of one surface of the base sheet;
A second adhesive layer laminated via the first adhesive layer on the one surface of the base sheet,
The first adhesive layer is formed in a shape corresponding to the shape of the adherend surface of a plurality of adherends, and is provided so that the plurality of adherends can be bonded,
The adhesive sheet, wherein the second adhesive layer is provided in an annular shape on the first adhesive layer. A base sheet;
A first adhesive layer provided in the entire region of one surface of the base sheet;
A second adhesive layer provided in a closed loop on the outer edge of the other surface of the base sheet,
The adhesive sheet, wherein the first adhesive layer is formed in a shape corresponding to a shape of an adherend surface of a plurality of adherends, and is provided so that the plurality of adherends can be bonded.   The adhesive sheet according to claim 2, wherein an intermediate layer is provided between the first adhesive layer and the second adhesive layer. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out the base sheet;
Laminating the first adhesive layer having a shape corresponding to the shape of the adherend surfaces of the plurality of adherends on one surface of the drawn base sheet;
Laminating the second adhesive layer so as to surround the first adhesive layer on one surface of the base sheet,
At least one of the first adhesive layer and the second adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out the base sheet;
A step of laminating the second adhesive layer on one surface of the unrolled base sheet, and a shape corresponding to the shape of the adherend surfaces of a plurality of adherends within the surface of the second adhesive layer. And laminating a first adhesive layer,
At least one of the first adhesive layer and the second adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out the base sheet;
Laminating the first adhesive layer having a shape corresponding to the shape of the adherend surfaces of the plurality of adherends on one surface of the drawn base sheet;
Laminating the second adhesive layer to a size that protrudes from the first adhesive layer in a plan view on the other surface of the base sheet,
At least one of the first adhesive layer and the second adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out the base sheet;
Laminating the first adhesive layer having a shape corresponding to the shape of the adherend surface of a plurality of adherends in the entire region of one surface of the base sheet;
Laminating the annular second adhesive layer on the outer edge of the first adhesive layer,
At least one of the first adhesive layer and the second adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out the base sheet;
Laminating the first adhesive layer having a shape corresponding to the shape of the adherend surface of a plurality of adherends in the entire region of one surface of the base sheet;
And laminating the annular second adhesive layer on the outer edge of the other surface of the base sheet,
At least one of the first adhesive layer and the second adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out the base material sheet on which the second adhesive layer is laminated in the entire region or a partial region of the other surface;
The first adhesive layer having a shape corresponding to the shape of the adherend surface of a plurality of adherends is laminated on one surface of the drawn base sheet so as to be inside the second adhesive layer in a plan view. Comprising the steps of:
The first adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate. A sheet manufacturing method for manufacturing an adhesive sheet provided with a first adhesive layer and a second adhesive layer,
A step of feeding out a base material sheet in which the first adhesive layer having a shape corresponding to the shape of the adherend surface of a plurality of adherends is laminated in the entire region or a partial region of one surface;
A step of annularly laminating the second adhesive layer so that the first adhesive layer is included in a plan view on the other surface of the fed base sheet,
The second adhesive layer is laminated by printing an adhesive in a predetermined shape with a predetermined plate.

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