JP4988640B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sticking method, and more specifically, an adhesive sheet sticking apparatus capable of forming an adhesive sheet having a concave portion and sticking the concave portion so as to cover the convex portion of the adherend. And an affixing method.

  As a semiconductor wafer (hereinafter simply referred to as “wafer”), there is a type in which solder bumps (hereinafter referred to as “bumps”) for ensuring electrical conduction are formed on the circuit surface side. In addition, the wafer is subjected to a process such as back grinding by attaching a protective adhesive sheet to the circuit surface side. The adhesive sheet includes a base sheet that has substantially the same planar shape as the wafer, and an adhesive layer laminated on one surface of the base sheet. For example, the adhesive sheet is applied to the wafer by an apparatus disclosed in Patent Document 1. Affixed.

JP 2006-100413 A

  However, when an adhesive sheet is attached to a wafer having bumps using the apparatus of Patent Document 1, in the rear surface grinding, which is a subsequent process, the bumps cause variations in the thickness of the wafer after grinding, and high-precision semiconductor chips can be produced. As a result, there is a disadvantage that the yield of the semiconductor chip is lowered.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and an object of the present invention is to form an adhesive sheet having a concave portion and to allow the concave portion to be attached so as to cover the convex portion of the adherend. For example, when an adherend such as a wafer is used as a target, the adherend adheres securely to the adherend even in a processing step such as backside grinding, and the thickness of the adherend after backside grinding varies due to the convex portion. An object of the present invention is to provide an adhesive sheet sticking apparatus and a sticking method that do not occur.

To achieve the above object, the present invention includes a feeding means for feeding an adhesive sheet the adhesive layer is laminated on one surface of the substrate sheet at predetermined intervals, is affixed to an adherend fed by this feeding means A concave portion forming means for forming a concave portion in the adhesive layer of the adhesive sheet before being held, and an adherend that holds the adherend and affixing the adhesive sheet on which the concave portion is formed by the concave portion forming means to a predetermined position of the adherend A configuration is adopted in which an attaching means and a cutting means for cutting the attached adhesive sheet into a predetermined shape are provided.

  Further, the concave portion forming means includes a press member having a pressing surface having a planar shape corresponding to the concave portion, and a platen disposed relative to the press member on the base sheet side with the adhesive sheet interposed therebetween, You may take the structure of providing the press means which presses the said press surface to an adhesive bond layer by moving the said press member and a platen relatively.

Furthermore, in the sheet sticking device of the present invention, the adhesive sheet having an adhesive layer on one surface of the base sheet is fed at a predetermined interval to the original fabric temporarily attached to the strip-shaped release sheet at a predetermined interval. A feeding means for peeling the adhesive sheet from the release sheet in the feeding process, a holding means for holding the adhesive sheet peeled from the release sheet, and an adhesive sheet held by the holding means and before being attached to the adherend A configuration comprising: a concave portion forming means for forming a concave portion in the adhesive layer; and an attaching means for holding the adherend and attaching the adhesive sheet having the concave portion formed by the concave portion forming means to the adherend. Adopted.

  Further, the recess forming means presses the pressing surface against the adhesive layer by relatively moving the pressing member having a pressing surface having a planar shape corresponding to the recess, and the holding means and the pressing member. It is also possible to adopt a configuration comprising means.

Moreover, the sticking method of the present invention includes a step of feeding out an adhesive sheet in which an adhesive layer is laminated on one surface of a base sheet at a predetermined interval;
Forming a recess in the adhesive layer of the extended adhesive sheet;
A process of holding the adherend and affixing an adhesive sheet formed with a recess to a predetermined position of the adherend;
And a step of cutting the adhered adhesive sheet into a predetermined shape.

Further, in the sticking method of the present invention, the adhesive sheet having an adhesive layer on one surface of the base sheet is fed out the original fabric temporarily attached to the strip-shaped release sheet at a predetermined interval, A step of peeling the adhesive sheet from the release sheet in the feeding process;
Holding the adhesive sheet peeled from the release sheet;
Forming a recess in the adhesive layer of the adhesive sheet held by the holding means;
A method of holding the adherend and attaching an adhesive sheet having a recess to the adherend.

  According to the present invention, even if an adherend having bumps on a circuit pattern such as a wafer is formed, an adhesive sheet that can receive and securely protect the pattern and bumps is easily formed and pasted. Can do. As a result, for example, it is possible to reliably adhere to the adherend even in a processing step such as back grinding, and to prevent variations in thickness due to patterns and bumps on the wafer after the grinding step. It is possible to prevent a decrease in yield.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view showing a state where an adhesive sheet is stuck on a wafer by the sheet sticking apparatus according to the embodiment, FIG. 2 is a partial cross-sectional view taken along arrow a in FIG. 1, and FIG. A sheet sticking apparatus for sticking an adhesive sheet is shown. 1 and 2, the adhesive sheet S includes a base sheet BS and an adhesive layer A laminated on one surface (the lower surface in FIG. 2) of the base sheet BS. Is formed with a recess C so as to surround the plurality of patterns P1 having bumps B formed on the circuit surface W1 of the wafer W, and is attached to the circuit surface W1 side of the wafer W.

[First Embodiment]
In FIG. 3, the sheet sticking apparatus 10 includes a feeding means 15 for feeding the adhesive sheet S at a predetermined interval from a support roller 11 that supports the original fabric R in which the belt-like adhesive sheet S is temporarily attached to the belt-like release sheet RL, and a peeling means 15. The recovery means 12 for recovering the sheet RL, the recess forming means 14 for forming the recess C in the adhesive layer A of the adhesive sheet S from which the release sheet RL has been peeled, the wafer W as the adherend, and the recess A sticking means 13 for sticking the adhesive sheet S on which the C is formed to a predetermined position of the wafer W, and a cutting means 16 for cutting the adhesive sheet S stuck by the sticking means 13 along the shape of the wafer W are provided. It is configured.

  The feeding means 15 includes a linear motor 43, a frame F that is fixed to the first slider 44 of the linear motor 43 and is movable in the left-right direction in FIG. 3, and is supported by the frame F, and is supported by the motor M2. A drive roller 46 that can be driven, a pinch roller 47 that sandwiches the unnecessary adhesive sheet S1 generated on the outside of the wafer W by the cutting of the cutting means 16 between the drive roller 46, and the drive roller 46 by the motor M2, and rotates synchronously. The winding roller 48 winds up the unnecessary adhesive sheet S1.

  The collection means 12 includes a peel plate PP that peels the release sheet RL from the original fabric R, a drive roller 18 that can be driven by the motor M1, and a pinch roller 19 that sandwiches the release sheet RL between the drive roller 18. The motor M1 includes a collection roller 20 that rotates synchronously with the drive roller 18 and winds the release sheet RL.

  As shown in FIG. 4, the concave portion forming means 14 includes a press member 21 provided on the adhesive layer A side (lower side in the drawing) of the adhesive sheet S, and the adhesive sheet S with respect to the press member 21. The platen 22 is disposed between the base sheet BS and the presser 23 provided on the platen 22 and the pressing member 21 and the platen 22.

  The press member 21 supports a pressure contact member 25 (see FIG. 5) in which a glass plate 26 as a transmission member capable of transmitting ultraviolet rays is fitted inside the standing portion 27A of the frame member 27, and the pressure contact member 25. In addition, a support 28 that can contain an ultraviolet lamp 30 as an energy beam irradiation means is provided. The upper surface of the standing portion 27A and the upper surface of the glass plate 26 are flush with each other, and a pressing surface 21A having the same planar shape as the concave portion C is formed corresponding to the concave portion C. The frame member 27 and the standing portion 27A are made of a light shielding material that does not transmit ultraviolet rays or visible light. The pressure contact member 25 is detachably provided on the support 28 via a known fixing structure (not shown). Thereby, it can replace with the press-contact member 25 which has 21 A of press surfaces corresponding to the pattern P1 of various wafers W.

  The platen 22 has a holding mechanism (not shown), and is provided so that the base sheet BS can be sucked and held by a pressure receiving surface 22A via a pressure reduction source (not shown). Thereby, the adhesive sheet S can be fixed and the recess C can be formed.

  The pressing means 23 includes a lower motor 32 that moves the press member 21 up and down and an upper motor 33 that moves the platen 22 up and down, and the press member 21 and the platen 22 are relatively movable. With such a configuration, the press member 21 is pressed against the adhesive layer A by the operation of the motors 32 and 33, and the concave portion C is formed in the adhesive layer A by the pressing surface 21A. The motors 32 and 33 are provided such that the movement amounts of the output shafts 32A and 33A can be controlled, thereby adjusting the distance between the pressing surface 21A and the pressure receiving surface 22A, and the recess C according to the distance. The depth D1 (see FIG. 2) can be adjusted.

  The affixing means 13 is supported by a table 35 having an outer table T1 and an inner table T2, and a second slider (not shown) of the linear motor 43, and also via a driving means (not shown) in the left-right direction in FIG. And a press roller 50 movably provided in the vertical direction.

The inner table T2 has a size that forms a gap with the outer table T1, is substantially the same shape as the wafer W, and its upper surface is formed as a suction surface that holds the wafer W by suction. Further, the inner table T2 is disposed in the outer table T1 via the linear motor 41, and the outer table T1 is attached to a frame (not shown) via the linear motor 39. Accordingly, the inner table T2 can be controlled to be pressed by adjusting the relative distance from the press roller 50 according to the thickness of the wafer W, and the outer table T1 can be controlled according to the thickness of the adhesive sheet S. Yes.

  The cutting means 16 includes a cutter blade 52, an arm 53 that holds the cutter blade 52, a rotation shaft 54 that rotates the arm 53 in a plane, and the cutter blade 52 via the rotation shaft 54 and the arm 53. And a motor (not shown) that rotates along the outer periphery of the wafer W.

  Next, a method for sticking the adhesive sheet S using the sheet sticking apparatus 10 will be described.

  First, the original fabric R is pulled out from the support roller 11, and the adhesive sheet S and the release sheet RL are peeled at the tip position of the peel plate PP. The release sheet RL is fixed to the collection roller 20 through the drive roller 18 and the pinch roller 19, while the adhesive sheet S is fixed to the take-up roller 48 through the press member 21 and the platen 22. . Note that the frame F and the press roller 50 stand by at the position of the two-dot chain line in FIG. 3, and the wafer W is placed on the inner table T2 by a transfer means (not shown).

  When automatic operation is selected by an operation panel (not shown), the rotation of the drive roller 46 is locked, while the frame F is indicated by a solid line from the position of the two-dot chain line in a state where the rotation lock of the support roller 11 is released. By moving to the position, the adhesive sheet S with a predetermined interval is fed out. At this time, the release sheet RL is wound around the collection roller 20 by driving the motor M1. Then, the following operation is performed in a state where the rotation of the support roller 11 is also locked.

  That is, in the recess forming means 14, the press member 21 and the platen 22 advance, and the pressing surface 21 </ b> A presses the surface of the adhesive layer A to form the recess C. During the pressing, the adhesive sheet S is irradiated with ultraviolet rays by the ultraviolet lamp 30 from the pressing surface 21A side. Accordingly, the pressed concave portion C can be prevented from being cured and returned to its original shape or deformed, and the adhesive force of the bottom surface C1 of the concave portion C is reduced. For example, the wafer W having the bumps B is provided. Even if the adhesive sheet S is affixed to the adhesive sheet and the adhesive sheet is peeled off after a predetermined treatment step, the inconvenience of peeling off the bumps B can be eliminated. Further, the travel amounts of the output shafts 32A and 33A of the motors 32 and 33 are controlled so that the depth D1 of the recess C becomes the depth D1 input in advance by an operation panel (not shown). In the present embodiment, as shown in FIG. 2, the depth D1 of the recess C is a height from the position of the circuit surface W1 without the pattern P1 of the wafer W to the apex of the bumps B formed on the pattern P1. Is set substantially the same as the height H1. As a result, for example, even if the adhesive sheet S is applied to the wafer W having the bumps B and the back surface grinding is performed, the inconvenience that the thickness of the wafer W after the back surface grinding varies due to the bumps B is eliminated. can do. Then, when the predetermined time has elapsed, the press member 21 is separated from the adhesive sheet S, and after the suction by the pressure receiving surface 22A is released, the platen 22 moves backward.

  On the other hand, in the affixing means 13, the concave portion previously formed by the concave portion forming means 14 is stopped at a predetermined position (this explanation assumes that the feeding means 15 performs the second feeding for convenience). In this state, the inner table T2 is positioned by the linear motion motor 41 so that the upper surface of the placed wafer W and the upper surface of the outer table T1 are at the same height, and the outer table T1 is positioned by the linear motion motor 39. W and the outer table T1 are positioned at a predetermined position below the adhesive sheet S that has been fed out. Then, the press roller 50 is lowered by a predetermined amount by a driving means (not shown) and is moved in the direction indicated by the solid line from the position of the two-dot chain line in FIG. Affixing to the upper surface of W while pressing. Thereby, the adhesive sheet S is bonded so that the concave portion C covers the pattern surface P1 and the bumps B of the wafer W.

  Thereafter, when the cutting means 16 is lowered and the cutter blade 52 pierces the adhesive sheet S, a motor (not shown) rotates, so that the adhesive sheet S is cut along the shape of the wafer W along the outer periphery of the wafer W. . After the adhesive sheet S is cut, the cutting unit 16 is retracted upward, and the wafer W is transferred to a predetermined position via a transfer unit (not shown).

  Thereafter, while the support roller 11 is rotationally locked, the frame F moves to the right while the drive roller 46 and the take-up roller 48 rotate in the direction to wind up the unnecessary adhesive sheet S1, thereby the unnecessary adhesive sheet. S1 is wound up. And the outer side table T1 descend | falls and it prepares for pasting of the following adhesive sheet S, and the same operation | movement will be performed after that.

  Therefore, according to such a sheet sticking apparatus 10 and a sticking method using the same, the adhesive sheet S is attached so that the concave portion C of the adhesive sheet S covers the pattern P1 of the wafer W as shown in FIG. It can be attached to the wafer W.

[Second Embodiment]
Next, a sheet pasting apparatus according to a second embodiment of the present invention will be described with reference to FIG. In the following description, the same reference numerals are used for the same or equivalent components as in the first embodiment, and the description is omitted or simplified.

  The raw fabric R of the second embodiment is configured by temporarily attaching a substantially circular adhesive sheet S corresponding to the outer edge of the wafer W to the strip-shaped release sheet RL at predetermined intervals. In the case of the present embodiment, the feeding means 15 is configured in the same configuration as the collecting means 12 in the first embodiment. The holding means is made of a platen 22 and holds the adhesive sheet S peeled off by the peel plate PP on the pressure receiving surface 22A. The press member 21 and the lower motor 32 constituting the recess forming means 14 are provided so as to be movable in the left-right direction in the figure via a driving means (not shown). The affixing means includes an upper motor 33 that constitutes the pressing means 23 and a table 60 that can hold the wafer W disposed immediately below the platen 22.

  In the above configuration, when the platen 22 holds the adhesive sheet S on the pressure receiving surface 22A, the pressing member 21 and the lower motor 32 are moved to the position indicated by the two-dot chain line in the figure, and then the adhesive layer is moved by the operation of the lower motor 32. A recess C is formed in A. After the recess C is formed, the press member 21 and the lower motor 32 are retracted to a position indicated by a solid line in the drawing. Thereafter, the upper motor 33 is operated to lower the platen 22, and the adhesive sheet S is attached to the wafer W so that the recess C covers the pattern P 1 of the wafer W.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

  For example, the recess C can be variously modified. For example, as shown in FIG. 7, the recess C can be formed in a shape corresponding to each pattern P1. In this case, the pressing surface 21 </ b> A may be replaced with the pressure contact member 25 which is subdivided in accordance with the shape of the concave C portion.

  Further, a concave member as shown in FIG. 8 can be formed by forming a transmission member so that the shape of the bottom surface C1 of the concave portion C corresponds to the shape of the pattern P1 and the bump B.

  Furthermore, the concave portion forming means 14 can be variously modified. For example, as shown in FIG. 9, an ultraviolet lamp 30 is provided on the platen 22 side, and a transparent member 26 having the same planar shape as the pressing surface 21A is provided. Alternatively, the pressure receiving surface 61A may be formed by the pressure receiving member 61 configured by the frame member 62 that supports the plate member 22 and may be detachably provided on the platen 22 via a known fixing structure (not shown). In this case, the base sheet BS is preferably a base material that transmits ultraviolet rays. In addition, it does not prevent providing the ultraviolet lamp 30 in both the press member 21 side and the platen 22 side.

  Further, the adherend in the present invention is not limited to a semiconductor wafer, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. It may be a wafer or a compound wafer.

  Furthermore, the pressing means 23 of either the press member 21 or the platen 22 may be omitted.

  Moreover, you may comprise the press means 23 with an air cylinder, a hydraulic cylinder, etc. other than a motor.

  Furthermore, the transmission member 26 is not limited to the glass plate 26 as long as the energy beam can be transmitted, and a member that can transmit the energy beam can be appropriately selected according to the energy beam to be used.

The top view of the state which stuck the adhesive sheet on the wafer with the sheet sticking apparatus which concerns on each embodiment. FIG. The schematic front view of the sheet sticking apparatus which concerns on 1st Embodiment. The fragmentary sectional view of a recessed part formation means and a sticking means. The schematic perspective view of a press-contact member. The schematic front view of the sheet sticking apparatus which concerns on 2nd Embodiment. The schematic perspective view of the adhesive sheet affixed by the 1st modification. The fragmentary sectional view in which the adhesive sheet was stuck on the wafer by the 2nd modification. The fragmentary sectional view of the recessed part formation means which concerns on a 3rd modification.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 13 Sticking means 14 Recess formation means 15 Feeding means 16 Cutting means 21 Press member 21A Press surface 22 Platen (holding means)
23 Pressing means A Adhesive layer C Recessed BS Base material sheet R Original fabric RL Release sheet S Adhesive sheet W Semiconductor wafer (Substrate)

Claims (6)

A feeding means for feeding out an adhesive sheet having an adhesive layer laminated on one surface of the base sheet at a predetermined interval, and a recess in the adhesive layer of the adhesive sheet before being fed out by this feeding means and pasted to an adherend. A recess forming means for forming the adherend, an attaching means for holding the adherend and attaching the adhesive sheet having the recess formed by the recess forming means to a predetermined position of the adherend, and the attached adhesive sheet. A sheet sticking device comprising a cutting means for cutting into a predetermined shape.   The recess forming means includes a press member having a pressing surface having a planar shape corresponding to the recess, a platen disposed relative to the press member on the base sheet side with the adhesive sheet interposed therebetween, and the press The sheet sticking device according to claim 1, further comprising: a pressing unit that presses the pressing surface against the adhesive layer by relatively moving the member and the platen. The adhesive sheet having an adhesive layer on one surface of the base sheet feeds the original fabric temporarily attached to the strip-shaped release sheet at a predetermined interval at a predetermined interval, and the adhesive sheet is removed from the release sheet in the supply process. Forming means for forming a recess in the adhesive layer of the adhesive sheet held by the holding means and attached to the adherend , holding means for holding the adhesive sheet peeled off from the release sheet, and a holding means for holding the adhesive sheet peeled off from the release sheet A sheet sticking apparatus comprising: means and a sticking means for holding the adherend and sticking the adhesive sheet having a recess formed by the recess forming means to the adherend.   The recess forming means includes a pressing member having a pressing surface having a planar shape corresponding to the recess, and a pressing means that presses the pressing surface against the adhesive layer by relatively moving the holding means and the pressing member. The sheet sticking device according to claim 3, comprising: A step of feeding out an adhesive sheet in which an adhesive layer is laminated on one surface of the base sheet at a predetermined interval;
Forming a recess in the adhesive layer of the extended adhesive sheet;
A process of holding the adherend and affixing an adhesive sheet formed with a recess to a predetermined position of the adherend;
And a step of cutting the adhered adhesive sheet into a predetermined shape. The adhesive sheet having an adhesive layer on one surface of the base sheet feeds the original fabric temporarily attached to the strip-shaped release sheet at a predetermined interval at a predetermined interval, and the adhesive sheet is removed from the release sheet in the supply process. A peeling step;
Holding the adhesive sheet peeled from the release sheet;
Forming a recess in the adhesive layer of the adhesive sheet held by the holding means;
And a step of sticking an adhesive sheet formed with a recess to the adherend while holding the adherend.

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