JP5508890B2 - Sheet sticking device and sticking method - Google Patents

Description

  The present invention relates to a sheet sticking device and a sticking method, and more specifically, when sticking an adhesive sheet on an adherend, in order to facilitate peeling of the adhesive sheet attached to the adherend from the outer peripheral side, The present invention relates to a sheet sticking apparatus and a sticking method capable of sticking an adhesive sheet to an adherend by performing non-adhesion treatment.

  Conventionally, a protective sheet for protecting the circuit surface has been attached to a semiconductor wafer (hereinafter referred to as “wafer” as necessary).

As a method for sticking such a sheet, for example, as disclosed in Patent Document 1, a protective tape (adhesive sheet) is fed out to a position facing the surface of the wafer, and this protective tape is pressed by a pressing roller. A configuration is known in which the protective tape is cut in accordance with the size of the wafer after pasting.
Such a protective tape is finally peeled off, but since the protective tape is entirely bonded to the wafer, there is an inconvenience that initial peeling from the outer periphery of the wafer becomes difficult, In particular, as the wafer diameter increases, the curvature of the outer peripheral edge increases and becomes apparent.

  Such inconvenience can theoretically be solved by applying a non-adhesion treatment called “glue killing agent” to the label as disclosed in Patent Document 2, for example.

JP 2003-209082 A JP 2004-226547 A

  However, the configuration described in Patent Document 2 is a label manufacturing apparatus to which non-adhesion processing is performed, and there are many restrictions on the apparatus configuration, layout, sheet application position, and the like to be applied to an adhesive sheet application apparatus. This leads to inconvenience that the degree of freedom in designing the apparatus is greatly hindered.

[Object of invention]
An object of the present invention is to attach an adhesive sheet to an adherend in a state in which the adhesive sheet can be easily peeled off from the outer edge side after the adhesive sheet is attached to an adherend such as a wafer. It is providing the sheet sticking apparatus and sticking method which can be performed.

In order to achieve the above object, the present invention provides a sheet sticking device for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend, at a position facing the surface of the adherend. A feeding means for feeding out the adhesive sheet; an adherent treatment means for forming a treatment surface portion by subjecting at least one of the adherend and the adhesive sheet to a non-adhesive treatment that is non-adherent to the adherend; and the adhesive sheet A pressing means for pressing and sticking, wherein the processing surface portion is located in a partial region including the outer edge of the adhesive sheet, and the processing surface portion is positioned between the adherend and the adhesive sheet In this case, the adhesive sheet is attached to the adherend.

The present invention is also a sheet sticking device for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend, and feeding the adhesive sheet to a position facing the surface of the adherend. At least one of the means, the outer edge area including the outer edge side of the adherend, and the corresponding area of the adhesive sheet affixed on the outer edge area is subjected to a non-adhesive treatment that is non-adherent to the adherend. A non-adhesive treatment means for forming a surface portion; and a pressing means for pressing and adhering the adhesive sheet; and the adhesive sheet is covered with the treatment surface portion positioned between the adherend and the adhesive sheet. The structure of sticking to a kimono can be taken.

  In the present invention, the non-adhesion treatment means can include an application means for applying a non-adhesion treatment agent to at least one of the adherend and the adhesive layer.

  Moreover, the said application | coating means is good to take the structure that it is provided in the table which supports the said to-be-adhered body, and the said application | coating means is provided movably along the width direction of the said adhesive sheet.

  Furthermore, the adhesive layer is made of an adhesive whose adhesive strength is lost or reduced by energy rays, and the non-adhesion treatment means may include the energy ray irradiation means.

  Further, the adhesive sheet has a size that protrudes from an outer edge of the adherend, and after the adhesive sheet is attached to the adherend, a cutting unit that cuts the adhesive sheet according to the size of the adherend. Furthermore, the structure which includes is taken.

Furthermore, the present invention is a sheet sticking method for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend, and the step of feeding the adhesive sheet to a position facing the surface of the adherend A non-adhesive treatment step of forming a treatment surface portion by subjecting at least one of the adherend and the adhesive sheet to a non-adhesion treatment that does not adhere to the adherend, and the treatment surface portion defines an outer edge of the adhesive sheet. And a step of attaching the adhesive sheet to the adherend in a state where the treatment surface portion is located between the adherend and the adhesive sheet. Yes.

  Examples of the non-adhesive treatment agent include commonly used printing inks and varnishes, as well as energy ray curing such as silicone resins, long chain alkyl polymer resins, polyolefin resins, alkyd resins, fluorine compound resins, and ultraviolet rays. What uses a property resin etc. as a component can be used.

  In this specification, “non-adhesion” includes not only the case where the adhesive force is lost, but also the case where the adhesive force is relatively weakened by reducing the adhesive force of the adhesive.

According to the present invention, the treatment surface portion that has been subjected to the non-adhesion treatment is formed in a partial region including the outer edge of the adhesive sheet or a partial region of the adhesive sheet that is affixed on the outer edge region of the adherend. Since the adhesive sheet is affixed to the adherend in a state where it is located between the adherend and the adhesive sheet, this treated surface portion is used as a peeling start portion after the adhesive sheet is affixed to the adherend. The adhesive sheet can be attached to the adherend in a possible state.
Further, if the non-adhesion treatment means includes an application means, the non-adhesion treatment can be performed only by providing the application means at a position facing the adhesive layer or the adherend. By providing the application means in the table that supports the body, it is possible to eliminate restrictions such as positional layout when applying the non-adhesion processing means to the sheet sticking apparatus.

  In addition, when the non-adhesion treatment means is configured to include an energy ray irradiation means, it becomes possible to perform the non-adhesion treatment without using the non-adhesion treatment agent, and the non-adhesion treatment agent is applied to other parts. For example, the device can be contaminated, and the labor for removing the attached non-adhesive treatment agent can be saved.

  Furthermore, in the structure provided with the cutting means, the adhesive sheet can be attached to adherends having various sizes, and a sheet attaching apparatus having versatility can be obtained.

The schematic front view of the sheet sticking apparatus which concerns on this embodiment. The principal part front view which shows the state which apply | coats a non-adhesion processing agent to an adhesive sheet. The table top view of the state which supported the wafer. The principal part side view which shows the state which apply | coats a non-adhesion processing agent to an adhesive sheet. The schematic front view which shows a modification. Schematic front view showing another modification Furthermore, the schematic front view which shows another modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  As shown in FIGS. 1 to 4, the sheet sticking apparatus 10 is provided with an adhesive sheet S having an adhesive layer A on one surface of a base sheet BS at a position facing a surface W1 of a wafer W as an adherend. The feeding means 12 for feeding, the table 13 for supporting the wafer W, the non-adhesion processing means 15 for applying a non-adhesion process to a part of the adhesive layer A of the adhesive sheet S, and pressing and bonding the adhesive sheet S to the wafer W The pressing means 14 for cutting, the cutting means 16 for cutting the adhesive sheet S in accordance with the size of the wafer W after affixing the adhesive sheet S to the wafer W, and the unnecessary sheet SD generated outside the wafer W by the cutting. The take-up means 18 to be taken and control means (not shown) for controlling these means are provided.

  The feeding means 12 collects the support roller 20 that supports the adhesive sheet S wound in a roll together with the release sheet RL, the release member 22 that folds the release sheet RL and peels the adhesive sheet S, and collects the release sheet RL. The adhering sheet S through the guide roller 28 when the adhering sheet S is attached to the collecting roller 23 to be performed, the plurality of guide rollers 25 to 32 and the dancer roller 33 disposed between the support roller 20 and the collecting roller 23. A load cell 34 for detecting the tension of the cylinder, cylinders 38A and 38B for holding the adhesive sheet S through the brake shoes 39A and 39B and suppressing the feeding of the adhesive sheet S, the peeling member 22, the guide rollers 27 to 30 and the load cell 34. The supporting frame F1 is lowered by the tension of the adhesive sheet S detected by the load cell 34. It is constituted by a biasing angle maintaining means 36. The feeding means 12 and the sticking angle maintaining means 36 have substantially the same configuration as that disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, and a detailed description thereof will be given here. Omitted.

  The table 13 includes an outer table 40 having a substantially square shape in plan view and an inner table 41 having a substantially circular shape in plan view. The outer table 40 is provided in a concave shape capable of receiving the inner table 41 in a state where a gap C (see FIG. 3) is formed between the outer table 40 and the outer edge of the inner table 41. The inner table 41 is provided so as to be movable up and down with respect to the outer table 40 via the single-axis robot 43, whereby the upper surface height position of the inner table 41 is adjusted according to the thickness of the adhesive sheet S and the thickness of the wafer W. It can be done. As shown in FIG. 3, the inner surface of the outer table 40 forming the gap C has an arcuate surface 40A, parallel surfaces 40B facing each other at both ends of the arcuate surface 40A, and these parallel surfaces 40B. A linear inner support surface 40 </ b> C is provided which is positioned in between and parallel to the outer surface of one side of the outer table 40.

  The pressing means 14 is positioned on the upper surface side of the frame 46 and the pressing roller 45 that presses and adheres the adhesive sheet S to the upper surface of the wafer W and the outer table 40, and moves the pressing roller 45 in the vertical direction in FIG. Cylinder 47. The frame 46 is supported on a slider (not shown) of the linear motor 49 so as to be movable in the left-right direction in FIG.

  The non-adhesion processing means 15 is disposed in the gap C of the table 13. The non-adhesion processing means 15 is a coating means 80 for spraying and applying the printing ink PI as a non-adhesion processing agent on the adhesive layer A side of the adhesive sheet S fed to the upper surface side in FIG. A linear motor 81 that is fixed to the inner support surface 40C of the outer table 40 and supports the coating means 80 so as to be movable along the width direction (vertical direction in FIG. 3) of the adhesive sheet S, and a hose 84 on the coating means 80. And an ink supply means 82 such as a compressor for supplying the printing ink PI. The application unit 80 includes a spray head 87 including a nozzle 86, and the spray head 87 is supported by the slider 81 </ b> A of the linear motor 81 and can reciprocate along the width direction of the adhesive sheet S.

  The cutting means 16 includes a robot main body 50 constituted by a so-called six-axis robot, and a cutter blade 51 supported on the free end side of the robot main body 50. The cutter blade 51 is detachably mounted via a tool holding chuck 52 located on the free end side of the robot body 50. The cutting means 16 has substantially the same structure as that disclosed in Japanese Patent Application No. 2006-15783 filed by the present applicant, and therefore detailed description thereof is omitted.

  The winding means 18 includes a roller 55 supported by the frame F2, a driving roller 60 driven by the motor M1, and a winding roller 63 that rotates by following the unnecessary sheet SD between the driving roller 60. I have. The frame F2 is supported on the slider 65 of the linear motor 49 and is provided so as to be movable in the left-right direction in FIG.

  Next, the sheet sticking method according to the present embodiment will be described with reference to FIG.

  In the initial setting, as shown in FIG. 1, the adhesive sheet S pulled out from the support roller 20 is peeled off from the release sheet RL by the release member 22 at the raised position and fixed to the take-up roller 63. The sheet RL is fixed to the collection roller 23. At this time, as shown in FIG. 3, the spray head 87 of the non-bonding processing means 15 is kept at a standby position with the one end side of the linear motor 81 as the initial position.

  When the power is turned on, the winding means 18 is activated, and when there is a hole formed in the adhesive sheet S in the previous sheet sticking operation, the adhesive sheet S is wound until the hole exceeds the roller 55. take. After that, the brake shoes 39A and 39B come into contact with the guide rollers 27 and 30, respectively, to suppress the feeding of the adhesive sheet S and enter a standby state.

  Next, when the wafer W is set on the table 13 via a transfer means (not shown), the pressing roller 45 moves to the left side in FIG. 1 and the load cell 34 detects a change in the tension of the adhesive sheet S, and the frame F1. 2, the adhesive sheet S is attached to the upper surface of the outer table 40 and the upper surface of the wafer W, as shown in FIG.

  As shown in FIG. 2, when the adhesive sheet S approaches the pasting end side of the wafer W, the pressing roller 45 temporarily stops moving. Then, the printing ink PI is sprayed from the nozzle 86, and the spray head 87 moves along the width direction of the adhesive sheet S. Thereby, as shown in FIG. 4, the corresponding area Sa of the adhesive sheet S to be applied on the outer edge area Wa (see FIG. 3) including the outer edge Wb of the wafer is used as the processing surface portion, and the printing ink PI is applied. Become. Note that this application may be performed only in one direction of forward movement and backward movement, in addition to the spray head 87 reciprocating once from the initial position.

  When the printing ink PI is applied to the adhesive sheet S, the pressing roller 45 starts to move again. When the adhesive sheet S is applied to the entire surface of the wafer W, the cutting means 15 is activated and the cutter blade 51 moves the wafer. The adhesive sheet S is cut along the outer peripheral edge of W. This cutting is performed by rotating 360 degrees or more after the cutter blade 51 pierces the adhesive sheet S.

  After the cutting of the adhesive sheet S is completed in this way, the wafer W is removed from the table 13 via a transfer device (not shown), and the frame F2 moves to the left side in FIG. Is peeled off from the upper surface of the table 13 and taken up by the take-up roller 63. Next, the brake shoes 38, 39 are separated from the guide rollers 27, 30 and the frame F1 is raised. At the same time, the pressing roller 45 is raised, the pressing means 14 and the frame F2 are returned to the positions shown in FIG. The sheet S is fed out and thereafter the same operation as described above is performed.

  Therefore, according to such an embodiment, the adhesive sheet S is applied to the wafer W because the corresponding area Sa of the adhesive sheet S to be applied to the outer edge area Wa of the wafer W is used as the processing surface portion. In the step of peeling from the wafer W, the corresponding region Sa of the adhesive sheet S can be easily peeled from the wafer W as an initial peeling portion.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the case where the printing ink PI is applied to the adhesive sheet S side is illustrated and described. However, as illustrated in FIG. 5, the nozzle 86 is formed using the outer edge area Wa including the outer edge Wb of the wafer as the processing surface portion. The printing ink PI may be applied through this. The nozzle 86 in this case may be retracted to a position that does not interfere when the adhesive sheet S is applied. It is also possible to apply the printing ink PI to both the adhesive sheet S and the wafer W.

  Moreover, although the structure which cut | disconnects the adhesive sheet S by the cutting means 16 after sticking the adhesive sheet S to the wafer W was shown and demonstrated, it is applicable also to the structure shown by FIG. In the configuration shown in the figure, the single-piece adhesive sheet S temporarily attached to the release sheet RL is detachable via the release member 22, and the peeled adhesive sheet S is the pressing plate 100 of the pressing means 14. It is configured to be held by suction. Then, the printing ink PI is applied from the nozzle 86 using a partial area including the outer edge on the adhesive layer side of the adhesive sheet S held by the pressing plate 100 as a processing surface portion. Thereafter, the adhesive sheet S can be attached to the adherend W by lowering the pressing plate 100. In this case, a delivery slip can be exemplified as the adhesive sheet S, and the adherend W can be a delivery object such as a book or an electrical appliance.

  Further, as shown in FIG. 7, while the adhesive sheet S is being peeled off from the release sheet RL, the pressure roller 110 is applied to the adherend W, and the nozzle is immediately before the end of the operation of peeling the adhesive sheet S from the release sheet RL. The printing ink PI may be applied from 86.

Furthermore, when the adhesive sheet S having the adhesive layer A in which the adhesive strength disappears or decreases due to energy rays such as ultraviolet rays is applied, the printing ink PI is applied from the application means 87 of the non-adhesion processing means 15 of the above embodiment. Instead of this, it is sufficient to employ an irradiation means for irradiating the adhesive layer A with ultraviolet rays or the like.
Moreover, although the said embodiment demonstrated the case where a process surface part was formed in the partial area | region containing the outer edge Sb of an adhesive sheet, a process surface part was formed in the area | region which does not include the outer edge Sb of an adhesive sheet, and this process surface part is The formed area may be attached to the outer edge area Wa including the outer edge Wb of the wafer.

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 12 Feeding means 13 Table 14 Pressing means 15 Non-adhesion processing means 16 Cutting means 87 Application | coating means (irradiation means)
A Adhesive layer BS Base sheet S Adhesive sheet Sa Corresponding area (treated surface)
Sb Outer edge of adhesive sheet W Wafer (Substrate)
Wa outer edge area (treated surface)
Wb Wafer outer edge (outer edge of adherend)
W1 surface

Claims (7)

A sheet sticking device for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend,
A feeding means for feeding the adhesive sheet to a position facing the surface of the adherend;
Non-adhesive treatment means for forming a treatment surface portion by applying a non-adhesion treatment that does not adhere to the adherend to at least one of the adherend and the adhesive sheet;
Pressing means for pressing and sticking the adhesive sheet,
Affixing the adhesive sheet on the adherend in a state where the treatment surface portion is located in a partial region including the outer edge of the adhesive sheet and the treatment surface portion is located between the adherend and the adhesive sheet. A sheet sticking device characterized by the above. A sheet sticking device for sticking an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend,
A feeding means for feeding the adhesive sheet to a position facing the surface of the adherend;
At least one of an outer edge area including an outer edge of the adherend and a corresponding area of an adhesive sheet attached on the outer edge area is subjected to a non-adhesion process that does not adhere to the adherend to form a treatment surface portion. Non-bonding treatment means;
Pressing means for pressing and sticking the adhesive sheet,
A sheet sticking device, wherein the adhesive sheet is stuck to an adherend in a state where the processing surface portion is located between the adherend and the adhesive sheet.   3. The sheet sticking according to claim 1, wherein the non-adhesion treatment means includes an application means for applying a non-adhesion treatment agent to at least one of the adherend and the adhesive layer. apparatus.   The sheet according to claim 3, wherein the application unit is provided in a table that supports the adherend, and the application unit is provided to be movable along a width direction of the adhesive sheet. Pasting device. The said adhesive layer consists of the adhesive agent from which an adhesive force lose | disappears or falls with an energy ray, The said non-adhesion process means is comprised including the irradiation means of the said energy beam | light, or characterized by the above-mentioned. 2. The sheet sticking device according to 2 .   The adhesive sheet has a size that protrudes from an outer edge of the adherend, and further includes a cutting unit that cuts the adhesive sheet in accordance with the size of the adherend after the adhesive sheet is attached to the adherend. The sheet sticking device according to any one of claims 1 to 5, wherein A sheet attaching method for attaching an adhesive sheet having an adhesive layer on one surface of a base sheet to an adherend,
Extending the adhesive sheet to a position facing the surface of the adherend;
A non-adhesion treatment step of forming a treatment surface portion by applying a non-adhesion treatment that is non-adherent to the adherend on at least one of the adherend and the adhesive sheet;
A process of attaching the adhesive sheet to an adherend in a state where the treatment surface portion is located in a partial region including the outer edge of the adhesive sheet and the treatment surface portion is located between the adherend and the adhesive sheet. The sheet sticking method characterized by comprising.

Images