JP2011166172A - Inspection device, and sheet pasting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device inspecting a state of a sheet pasted to a plate-like member such as a semiconductor wafer, and to provide a sheet pasting device. <P>SOLUTION: The sheet pasting device 10 is composed by including a pasting means 13 to paste an adhesive sheet S to a semiconductor wafer W, and the inspection device 21 for detecting a surface condition of the adhesive sheet S. The inspection device 21 includes a camera 70 as an inspection means to detect the surface condition. Detection data by the inspection means are output to a first information storing/processing means 52, and data subjected to predetermined processing by the first information storing/processing means 52 are input to a second information storing/processing means 53 mounted to a case 60 for storing the semiconductor wafer W therein. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an inspection apparatus and a sheet sticking apparatus, and more particularly, an inspection apparatus and sheet sticking capable of inspecting the thickness and the surface state of an adhesive sheet after sticking an adhesive sheet to a plate-like member such as a semiconductor wafer. Relates to the device.

  2. Description of the Related Art Conventionally, a semiconductor wafer (hereinafter simply referred to as “wafer”) has been provided with a protective sheet for protecting the circuit surface or a heat-sensitive adhesive sheet on the back surface or the front surface. It has been broken.

  As an apparatus for attaching such a sheet, an apparatus having a configuration in which a belt-like adhesive sheet is attached to a wafer and then the adhesive sheet is cut in accordance with the shape of the wafer is known (for example, Patent Documents). 1).

Japanese Patent Application No. 2005-123595

  The thickness of the adhesive sheet laminated with the adhesive varies depending on the fish eye during film formation, the tension during sheet feeding, and the like. As with wafers, the thickness required for back surface grinding has now reached the order of several tens of μm, and the influence of variations in the finished thickness of the wafer on semiconductor devices has become extremely large. Therefore, grasping the thickness of the adhesive sheet and the state of the sheet surface before grinding is an important factor in maintaining the back surface grinding accuracy of the wafer.

[Object of invention]
An object of the present invention is to provide an inspection apparatus and sheet affixing that can inspect the state in which a sheet is affixed to a plate-like member such as a wafer in response to a request to maintain accuracy when grinding the back surface of the wafer. To provide an apparatus.

In order to achieve the above object, an inspection apparatus according to the present invention includes an inspection unit that inspects a plate member supported by an inspection support unit or a plate member to which an adhesive sheet is attached,
The said inspection means has taken the structure of detecting the surface state of the said adhesive sheet from the predetermined position of the said inspection means.

  In this invention, the structure of including the 1st information storage process means which uses the output of the said test | inspection means as an input can be taken.

  Further, the present invention includes a case for accommodating the plate-like member, and the case is provided with a second information storage processing means for storing the surface state of the adhesive sheet in association with the plate-like member to be accommodated. Preferably, the first information storage processing means outputs the surface state of the adhesive sheet as data to the second information storage processing means with reference to a preset position.

  Further, the plate-like member is a semiconductor wafer, and the inspection means detects a portion indicating a crystal orientation provided on the semiconductor wafer, and performs an alignment function of the semiconductor wafer in cooperation with the inspection support means. It can be configured to have.

Moreover, the sticking device according to the present invention is a device for sticking an adhesive sheet to a plate-like member,
An inspection apparatus including an inspection unit that inspects a plate member supported by the inspection support unit or a plate member attached with an adhesive sheet,
The inspection unit is configured to detect a surface state of the adhesive sheet from a predetermined position of the inspection unit.

In the sticking apparatus, the inspection device includes an inspection unit that detects the surface state, a first information storage processing unit that stores the surface state by using detection data from the inspection unit as an input, and performs predetermined processing. Second information storage processing means that receives the output of one information storage processing means as input,
The second information storage processing means may be provided in a case that accommodates the plate-like member, and may be configured to store the surface state in association with the plate-like member in the case.

  The plate-like member may be a semiconductor wafer, and the inspection apparatus may be provided so as to include an alignment function of the semiconductor wafer by detecting a portion indicating a crystal orientation provided on the semiconductor wafer.

  Furthermore, the adhesive sheet has a size that protrudes from the plate-like member, and after the adhesive sheet is pasted on the surface of the plate-like member, a cutting function that cuts the adhesive sheet to fit the shape of the plate-like member; The robot further includes a robot having a function of transferring or conveying the plate-like member.

  According to the present invention, since the surface state of the adhesive sheet can be detected by the inspection means, for example, when a defective portion such as air bubbles or scratches is detected in the surface of the adhesive sheet, the portion is detected. By memorizing, the back grinding can be temporarily suspended, and corrective actions such as reattaching the adhesive sheet can be performed. This is because if the plate-shaped member is a semiconductor wafer and there are bumps on the surface, air bubbles are often mixed, and the wafer is often damaged during back-grinding. The advantage is that there is nothing to do. Furthermore, it is possible to prevent variations in thickness after back grinding.

  Further, since the case includes second information storage processing means for storing the surface state in association with the accommodated plate-like member, the plate-like member to which the adhesive sheet is attached is moved for each case. When the processing is performed, it is possible to read and refer to the information written in the second information storage processing means.

  Further, since the second information storage processing means can store the sheet surface state at every predetermined interval in the circumferential direction of the plate-like member, the second information storage processing means can perform adhesion when performing processing such as grinding of the plate-like member in a subsequent process. It is possible to determine whether correction such as re-attachment of the sheet is necessary.

  Further, the configuration having the semiconductor wafer alignment function by the inspection means and the inspection support means eliminates the need for using a separate alignment apparatus, and enables effective use of the apparatus.

  Furthermore, since the robot is configured to have a cutting function for cutting the adhesive sheet and a function for transferring or transporting the semiconductor wafer, it is not necessary to use a plurality of apparatuses that achieve each function independently. Can do.

The schematic perspective view of the sheet sticking apparatus provided with the test | inspection apparatus which concerns on this embodiment. The schematic front view of the sheet | seat sticking apparatus which abbreviate | omitted the said inspection apparatus and some structures. The expansion perspective view of the inspection table provided with the optical sensor. The expansion perspective view of the table for inspection provided with the camera.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic perspective view of a sheet sticking apparatus provided with an inspection apparatus according to the present embodiment, and FIG. 2 shows a schematic front view in which some components such as the inspection apparatus are omitted. . In these drawings, a sheet sticking apparatus 10 is a sticking means 13 for sticking a sheet feeding unit 12 disposed on an upper part of a base 11 and an adhesive sheet S for protecting an upper surface (circuit surface) of a wafer W as a plate-like member. And a function of transferring and transferring the wafer W in addition to the function of cutting the adhesive sheet S along the outer edge of the wafer W after the adhesive sheet S (see FIG. 2) is attached to the wafer W. The robot 14, the cutter blade 15 that is detachably attached to the free end side of the robot 14, and the stocking device 17 that stocks the suction arm 16 that performs transfer and transfer, and unnecessary adhesion on the outside of the wafer W A peeling device 19 for peeling the sheet S1 from the upper surface of the sticking table 18 (sticking support means) for supporting the wafer W; a winding device 20 for winding the unnecessary adhesive sheet S1; Landing sheet S is configured with a testing device 21 for inspecting a wafer W after being affixed.

  The sheet sticking device 10 is substantially the same as that disclosed in Japanese Patent Application No. 2005-198806 filed by the present applicant, except for the inspection device 21. Accordingly, the following description will be given schematically and detailed description will be omitted.

  As shown in FIG. 2, the sheet feeding unit 12 feeds a roll-shaped original fabric L in which a belt-like adhesive sheet S is temporarily attached to one surface of a belt-like release sheet PS and peels the adhesive sheet S. The peel plate 23 that peels from the sheet PS, the collecting roller 24 that winds and collects the peel sheet PS, the tension measuring means 27 located on the base side of the peel plate 23, and the sticking angle θ of the adhesive sheet S are kept constant. It is configured to include a pasting angle maintaining means 28.

  The sticking means 13 includes a pressing roller 31 that applies a pressing force to the adhesive sheet S supplied to the upper surface side of the wafer W, in addition to the sticking table 18 that supports the wafer W. The pressing roller 31 is supported by a portal frame 32 provided so as to be movable in the X-axis direction in FIG.

  The robot 14 includes a plurality of arms, and is configured as an articulated robot that selectively and detachably mounts the cutter blade 15 and the suction arm 16 on the free end side thereof. Therefore, the robot 14 is configured as a multi-function type having a function of cutting the adhesive sheet S in a closed loop shape according to the shape of the wafer W and a function of transferring and transporting the wafer W.

  The stock apparatus 17 that accommodates the cutter blade 15 and the suction arm 16 includes a first stocker 17A that accommodates the cutter blade 15 and a second stocker 17B that accommodates the suction arm 16.

  As shown in FIG. 2, the peeling device 19 includes a small-diameter roller 34 and a large-diameter roller 35. These rollers 34 and 35 are provided so as to be movable along the X-axis direction in FIG. It is supported by the frame F. The large diameter roller 35 is supported by an arm member 37, and the arm member 37 can be displaced by a cylinder 38 in a direction in which the large diameter roller 35 is separated from and approaches the small diameter roller 34.

  The winding device 20 is supported on the driving roller 40 supported by the moving frame F and the free end side of the rotating arm 41, and contacts the outer peripheral surface of the driving roller 40 via the spring 42 to nip the unnecessary adhesive sheet S1. And a take-up roller 43. The take-up roller 43 rotates in the right direction in FIG. 2 against the force of the spring 42 as the take-up amount increases.

  The inspection device 21 stores an inspection table 50 constituting an inspection support means, an optical sensor 51 as an inspection means provided on the inspection table 50, and an output of the optical sensor 51 as an input. The first information storage processing means 52 that performs the above-described processing and the second information storage processing means 53 that receives the output of the first information storage processing means 52 as an input.

  As shown in FIG. 3, the inspection table 50 includes an outer table 55 having a substantially rectangular outer shape in plan view, and a substantially circular inner table 56 provided in the surface of the outer table 55. Although the inner table 56 is not particularly limited, the inner table 56 is provided with a plurality of suction holes 56A on the upper surface side so that the wafer W placed on the table 56 can be sucked and held, and is not shown. It is provided to be rotatable in a plane through the device.

  As shown in FIGS. 1 and 3, the optical sensor 51 is constituted by a laser reflection type sensor. The optical sensor 51 detects a continuous thickness along the circumferential direction by rotating the wafer W with the sheet adhered and held on the inner table 56. That is, with the upper surface of the inspection table 50 as a reference position, the distance from the predetermined position of the optical sensor 51 to the adhesive sheet S by projecting the laser beam onto the wafer with the sheet pasted by the optical sensor 51 and receiving the light. Can be detected. Detection data of the optical sensor 51 is output to the first information storage processing means 52. In the present embodiment, the circumferential position D at which the distance is detected by the optical sensor 51 is closer to the outer periphery of the wafer W. By providing the optical sensor 51 so as to be movable in the radial direction of the wafer W, the radial direction of the wafer W is provided. The distance can be detected at a plurality of locations. Further, the laser beam may be transmitted through the adhesive sheet S and the light reflected by the surface of the wafer W may be received, thereby detecting the distance to the wafer W after the sheet S is pasted. it can.

  The first information storage processing unit 52 has a function of calculating an average value of thicknesses at the circumferential position D with the output of the optical sensor 51 as an input, and the average thickness is calculated as the second information storage processing unit 53. To output. Here, the first information storage processing unit 52 includes an operation unit (not shown) for inputting various inspection conditions and the like, and also has a function of controlling the entire sheet sticking apparatus 10 to perform a predetermined operation. It is configured. The first information storage processing unit 52 can be exemplified by a personal computer, a microcomputer board, a sequencer, and the like, but is not limited thereto.

  As shown in FIG. 1, the second information storage processing means 53 is mounted on the outside of a case 60 that can accommodate the wafers W in a multistage manner. The second information storage processing unit has an RFID (Radio Frequency Identification) function, and is opposed to the second information storage processing unit 53 when the case 60 is placed at a predetermined position of the sheet sticking apparatus 10. At the closest position, there is an R / W device 61 (reading / writing device) that reads information stored in the second information storage processing unit 53 and writes data provided from the first information storage processing unit 52. Has been placed. The R / W device 61 is connected to the first information storage processing unit 52, and is connected to the second information storage processing unit 53 in response to a control signal from the first information storage processing unit 52. It is possible to communicate information between them. In addition, the second information storage processing unit 53 can store and update various individual values such as thickness information of the wafer W stored in association with positions corresponding to the multi-stage wafer storage positions in the case 60. ing. The second information storage processing unit 53 is not limited to RFID, and may use a medium capable of storing information, such as a microcomputer board or an optical disk.

  Next, the inspection method in this embodiment will be described. The operation of attaching the adhesive sheet S to the wafer W is substantially the same as the operation disclosed in Japanese Patent Application No. 2005-198806. Therefore, a description will be given after the wafer W stored in the case 60 is used, the adhesive sheet S is attached to the wafer W by the attaching table 18, and the cutting of the adhesive sheet S is completed according to the shape of the wafer W. . The average thickness of each wafer W stored in the case 60 is measured in another process (not shown), and the data is distinguished for each storage stage of the case 60 and stored in the second information storage processing unit 53. It is assumed that

  First, a case where the adhesive sheet S is attached to the first-stage wafer W will be described. When the cutting of the adhesive sheet S is completed in accordance with the shape of the wafer W on the pasting table 18, the robot 14 accommodates the cutter blade 15 on the free end side in the first stocker 17A and the second stocker 17B. Change to suction arm 16. Then, the wafer W on which the sheet is pasted is transferred to the inspection table 50 side and transferred.

  In the inspection table 50, a substantially V-shaped notch N provided on the outer periphery showing the crystal orientation is detected by the optical sensor 51, and the inner table 56 is rotated by a predetermined angle based on the detection result, so that the notch N is a reference. Alignment is performed so as to be positioned on the position P (see FIG. 3), and the preparation operation for wafer inspection is completed. Here, for convenience of illustration, the reference position is a position along the radial direction at a position advanced about 90 degrees along the rotation direction of the inner table 56 from the position of the inspection means.

  When alignment is completed on the inspection table 50, the inner table 56 rotates at a constant speed, and at the same time, the optical sensor 51 irradiates laser light, and the light projecting / receiving position of the optical sensor 51 at the circumferential position D is set as a predetermined position. The distance from the position to the sheet S is continuously measured, and the detected data is output to the first information storage processing unit 52. The first information storage processing unit 52 subtracts the detection data from the distance data from the predetermined position of the optical sensor 51 measured in advance to the upper surface of the inspection table 50 to thereby reduce the adhesive sheet S to the thickness of the wafer W. The total thickness is calculated by adding the thickness, and the average value is further calculated.

  Next, the robot 14 operates to suck and hold the inspected wafer W, and accommodates the wafer W in the case 60 where the wafer W is taken out, that is, the first stage. At this time, the second information storage processing unit 53 adds the average thickness of the first-stage wafer W stored in advance from the first information storage processing unit 52 via the R / W device 61. Thus, the average value of the total thickness of the wafer W and the adhesive sheet S calculated as described above is added. Thus, in the subsequent process, when the wafer W accommodated in the first stage is taken out from the case 60 and the back surface grinding or the like is performed, how much grinding is performed with reference to the thickness data of the sheet S and the thickness data of the wafer W. It is possible to automatically calculate and control whether or not to do.

  Thereafter, in the same manner, the wafers W are continuously inspected, and after the wafers W are accommodated in the accommodation positions in the case 60, the wafers W are transferred to the post process or another process integrally with the case 60. The

  Therefore, according to such an embodiment, by calculating the thickness from the detected distance, it can be used as a reference when performing back surface grinding of the wafer W, and the grinding depth of the grinder is adjusted to adjust the wafer W. It becomes possible to grind with high precision.

  In the above description, the case of detecting the total thickness of the wafer W and the adhesive sheet S has been shown and described. However, as shown in FIG. 4, the camera 70 detects the surface state of the adhesive sheet S instead of the optical sensor. Are used as inspection means. The camera 70 has a function of inspecting the imaging region A on the upper surface of the adhesive sheet S, and rotates the inner table 56 at a predetermined speed to perform imaging at predetermined intervals. Here, for example, when the adhesive sheet S is attached to the wafer W as shown in FIG. 4, when the bubble mixed portion a and the scratch b are included, the bubble mixed portion a and the scratch b are in relation to the reference line P. And the information that the bubble mixing part a and the scratch b exist in the areas θ1 and θ2, respectively, is output to the first information storage processing unit 52, and The surface state of the adhesive sheet S can be stored in association with the wafer W that is output from the first information storage processing unit 52 to the second information storage processing unit 53 and accommodated in the case 60.

  Therefore, by inspecting the sticking state of the adhesive sheet S using such a camera 70, the back surface grinding of the wafer W including abnormalities such as the bubble mixing portion a can be temporarily suspended, and the wafer W Therefore, it is possible to take a corrective action such as turning the adhesive sheet S to the work for re-attaching, and to prevent the wafer W from being cracked or damaged. Such an effect becomes more prominent when bumps are present on the surface of the wafer W.

  In addition, this invention does not prevent combining using so that the distance detection by the optical sensor 51 mentioned above and the simultaneous test | inspection of the adhesive sheet S using the camera 70 may be performed using one test | inspection table.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  Furthermore, the plate-like member according to the present invention is not limited to the semiconductor wafer W, and other plate-like members such as glass, a steel plate, or a resin plate to which a sheet is attached can also be targeted. The inspection means is a laser sensor, but is not limited thereto, and the distance may be detected using a sensor using ultrasonic waves, a contact-type sensor, or the like.

  In addition, the wafer W is placed on the inspection table 50 before the adhesive sheet S is pasted, the distance to the wafer W is detected, and after the adhesive sheet S is pasted, the wafer is again placed on the inspection table. The thickness of the sheet S may be calculated by detecting the distance to the attached sheet S and placing the difference on the first information storage processing unit 52. . In this case, the thickness of the sheet S can be calculated by the sheet pasting apparatus 10 even if the thickness of the wafer W is not input to the second information storage processing unit 53 in advance as in the present embodiment.

10 Sheet pasting device 50 Inspection table (supporting means for inspection)
51 Optical sensor (inspection means)
52 first information storage processing means 53 second information storage processing means 60 case 70 camera (inspection means)
L Original fabric PS Release sheet S Adhesive sheet W Semiconductor wafer (plate-like member)

Claims (8)

An inspection means for inspecting a plate-like member supported by the support means for inspection or a plate-like member to which an adhesive sheet is attached;
The inspection apparatus detects the surface state of the adhesive sheet from a predetermined position of the inspection means. The inspection apparatus according to claim 1, further comprising a first information storage processing unit that receives an output of the inspection unit. The case includes a case for accommodating the plate-like member, and the case is provided with second information storage processing means for storing the surface state of the adhesive sheet in association with the plate-like member to be accommodated. 3. The inspection apparatus according to claim 2, wherein the processing means outputs the surface state of the adhesive sheet as data to the second information storage processing means with reference to a preset position. The plate-like member is a semiconductor wafer, and the inspection means detects a portion indicating a crystal orientation provided on the semiconductor wafer and has a semiconductor wafer alignment function in cooperation with the inspection support means. The inspection apparatus according to claim 1, 2, or 3. In an apparatus for attaching an adhesive sheet to a plate-like member,
An inspection apparatus including an inspection unit that inspects a plate member supported by the inspection support unit or a plate member attached with an adhesive sheet,
The sheet pasting device, wherein the inspection unit detects a surface state of the adhesive sheet from a predetermined position of the inspection unit. The inspection apparatus includes an inspection unit that detects the surface state, a first information storage processing unit that stores the surface state by using detection data from the inspection unit as input, and a first information storage process. Second information storage processing means for receiving the output of the means,
6. The sheet sticking according to claim 5, wherein the second information storage processing means is provided in a case that accommodates the plate-like member, and stores the surface state in association with the plate-like member in the case. apparatus. The said plate-shaped member is a semiconductor wafer, The said inspection apparatus detects the site | part which shows the crystal orientation provided in the said semiconductor wafer, The alignment function of the said semiconductor wafer is included. Sheet sticking device. The adhesive sheet has a size that protrudes from the plate-like member, and after cutting the adhesive sheet to fit the shape of the plate-like member after sticking the adhesive sheet on the surface of the plate-like member, and a plate The sheet sticking apparatus according to any one of claims 5 to 7, further comprising a robot having a function of transferring or transporting the shaped member.

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