JPH01175748A - Apparatus and method for compression-bonding of conductive adhesive film - Google Patents

Abstract

PURPOSE:To obtain an apparatus which feeds a conductive adhesive film to the required positions of a long flexible circuit board continuously and performs bonding work automatically by providing a driving means for feeding the flexible circuit board, a driving means for feeding the conductive adhesive film, a specific compression-bonding means, detecting means and a control means. CONSTITUTION:A first driving means which feeds a long flexible circuit board 1 on which electronic components 4 are mounted, a second driving means which feeds a conductive adhesive film 2, a third driving means 21 which bonds the conductive adhesive films 2 to the flexible circuit board 1 by compression, detecting means 41 and 43 which detect the quality of the electronic components 4 and circuit patterns 5 on the flexible circuit board 1 and a control means which controls the 1st-3rd driving means in accordance with the detection signals from the detecting means 41 and 43 are provided in an apparatus which bonds the conductive adhesive film 2 to the flexible circuit board 1. The quality of the electronic components 4 and the circuit patterns 5 on the flexible circuit board 1 is judged beforehand and, if the quality is satisfactory, the conductive adhesive film 2 is bonded to the circuit pattern 5 by compression.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus and method for pressure-bonding a conductive adhesive film to a long flexible wiring board.

[Prior Art] A conductive adhesive film (hereinafter simply referred to as a conductive film) for use in connection with an external device or circuit may be pressure-bonded onto a wiring pattern provided on a flexible wiring board.

Conventionally, for example, the conductive film 102 laminated with the protective film TOX is cut into required dimensions using a mold or the like, as shown in FIGS. 6(A) and 6(B), respectively. Ta. This requires an extra process,
Further, there is a drawback that the conductive film is wasted and is not economical.

There was also a method of cutting the conductive layer 11i102 together with the protective film 101 into predetermined dimensions, as shown in a plan view and a cross-sectional view in No. 714 (A) and (B), respectively. This method has a problem in that it is not suitable for continuous work by continuously supplying a conductive film to a long flexible circuit board.

[Problems to be Solved by the Invention] The present invention solves the above-mentioned conventional drawbacks, and provides a method for continuously supplying a conductive film to required locations on a long flexible circuit board and automatically performing a crimping operation. The purpose is to provide an apparatus and an efficient crimping method.

[Means for Solving the Problems] In order to achieve such an object, the present invention is an apparatus for pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached. A first driving means for feeding the substrate, a second driving means for feeding the conductive adhesive film, and a means for moving the conductive adhesive film up and down with respect to the flexible circuit board and press-bonding the conductive adhesive film. a third driving means; a detection means for detecting the quality of the electronic components and circuit patterns on the flexible substrate;
Based on the detection signal of the detection means, the first. 2nd and 3rd
1. A pressure bonding device for a conductive adhesive film, comprising: a control means for controlling a driving means.

In the method of press-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached, the device of the present invention identifies the quality of the electronic components and circuit patterns on the flexible circuit board in advance, and If the circuit pattern is normal, a conductive adhesive film is pressure-bonded onto the circuit pattern, and if the electronic component or circuit pattern is defective, the flexible circuit board is transferred without pressure-bonding the conductive adhesive film.

[Function] According to the present invention, both the long flexible circuit board and the long conductive film are fed, and only when the electronic components and circuit patterns on the flexible circuit board are normal, the conductive film is transferred to the flexible circuit. Since the conductive film is crimped at the required locations on the substrate, the conductive film can be used effectively and the efficiency of the crimping work can be improved.

[Example] The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a front view schematically showing a conductive film bonding machine to which a pressure bonding device according to the present invention is applied.

This device is a device for bonding a conductive film 2 to a flexible circuit board 1.

As shown in FIG. 2, the flexible circuit board 1 is provided with perforations 3 at its side ends. on the board
An integrated circuit 4 has already been installed in a predetermined position.

5 and 6 are wiring patterns. By the apparatus shown in FIG. 1, a conductive layer 1i2 of a predetermined size is pasted onto one wiring pattern 5, and necessary terminals of a device such as a liquid crystal display controlled by an integrated circuit 4 are connected in a subsequent process. It is connected to the wiring pattern 5 via this conductive film 2. Note that, as shown in the figure, no conductive film is pasted on the wiring pattern to which no integrated circuit is attached. I
C is a guide film.

The film-like flexible circuit board 1 has a thickness of, for example, 1
Made of polyimide resin with a conductivity of about 00 μI
For example, it is possible to use a thermoplastic resin film having conductivity only in the thickness direction, which is disclosed in JP-A No. 61-55809, in which a conductive film 2 and a protective film 2^ are laminated. can.

Before explaining the present invention in detail, the apparatus shown in the first figure will be briefly explained.

In the figure, 11 is the main body of the device. The flexible circuit board 1 is wound around the supply reel 12 in an overlapping manner with a protective film IA for protecting the attached integrated circuit. The rotating shaft 12^ of the supply reel 12 is driven to move the flexible circuit board 1 to the idler 13. It is sent to the working position A via the tension roller 14 and the guide roller 15, and further guided to the sprocket 16 via the section A. At this time, the protective film IA is placed on the idler 17. It is wound onto a take-up reel 20 via a tension roller 18 and an idler 19. A base 20 is equipped with a pressure bonding pad 21 for bonding the conductive film 2 to the flexible circuit board 1 and a cutter for cutting the conductive film 2 to a certain size, and is movable up and down on the frame 22 of the main body 11. . The conductive film 2 is wound around the supply reel 23 in a laminated state with the protective film 2A. Rotating shaft 23A of reel 23
is driven to send out the conductive film 2 together with the protective film 2A. The conductive film 2 sent out passes through an idler 24, 25, a tension roller 26, and a guide roller 27, and then reaches the pressure bonding head 2.
Reach 1. After the bonding of the conductive film and the flexible circuit board is completed, the protective film 2A is pulled up by the feed roller 28, and the protective film 2A is pulled up by the guide roller 29. Eye Trolla 30.3
1 and the take-up reel 33 via the tension roller 32.
It is wound up.

The flexible circuit board that has been pasted is supplied to the next unit, for example, a press unit 36, via a tension roller 34 and a guide roller 35.

In the process of transferring the flexible circuit board and conductive film, each film or film is moved by tension rollers 14, 18, 26 so that the tension caused by the difference between the feeding speed and the winding speed is balanced with the strength of the film or film. ．．
32 and 34. for example,
The tension roller 14 is supported at one end of a swingable arm 14B by a shaft 14A, and a counterweight 14G is fixed to the other end of the arm 14B, so that the tension roller 14 moves up and down as the tension changes. shafts 18^, 26^ for tension rollers 18, 26 and 34;
34^, arm 188, 268゜348 and counterweight 18C, 26G, 34G each have 1 function.
4^, 14B and 14C. Although not shown, the tension roller 32 operates in exactly the same way as the other tension rollers.

In this device, a flexible circuit board with a guide film connected to it as in the conventional example is attached to the sensor 40.
After first positioning the work area using the sensor 50 and finely adjusting the position using the sensor 50, the crimping head 21
The conductive film 2 is bonded by the following method. After that, the conductive film 2 is cut with a cutter, and the bonding condition is inspected by the bonding inspection device 60, and then the next step is performed.

The above series of operations and the adjustment of the feeding and winding speeds of each film and membrane can be controlled by a single controller, for example a microprocessor.

FIG. 3 shows an enlarged view of the apparatus shown in FIG. 1 near the working position.

Reference numeral 11^ denotes a stand forming a part of the main body 11, to which a frame 22 is fixed. 16A is a holding roller, 22A is a cylinder for moving the base 20, and 22B is a guide thereof. 70 is a cutter not shown in FIG. 1, 70A is a cylinder for moving the cutter 70 on the base 20, and 70B is a guide thereof.

The sensor 40 shown in FIG. 1 is installed on the pedestal 11B, which is attached to the pedestal 11A. More specifically, the sensor 40 consists of a first sensor 41 for detecting an integrated circuit, a second sensor 42 for detecting perforations, a third sensor 43 for detecting defective chips, and a mounting base 44 for mounting them. ing.

The sensors 41, 42, and 43 each consist of a light-emitting component such as an LED and a light-receiving component such as a phototransistor.
In this example, the presence or absence of the detection object is detected by irradiating light emitted from the light-emitting component onto the detection object and detecting the presence or absence of reflected light.

The positions at which the sensors 41 and 42 detect the electronic component 4 and the perforations, respectively, are positions one electronic component before the position where the conductive film 2 is pressed onto the flexible circuit board 1, that is, the preparation position. The flexible circuit board 1 is positioned when the electronic component 4 comes to this position, is fed a predetermined distance to the working position, and the position is accurately adjusted by the sensor 50, and the conductive film is crimped.

However, in the present invention, it is checked whether the electronic component 4 and the wiring patterns 5 and 6 are normal in this preparation position, and the subsequent operation is changed according to the result.

FIG. 4 shows the defect display hole ID for checking defective products. Before being supplied to the apparatus shown in FIG.
and 6 are checked to see if they are normal, and if the electronic components or wiring patterns are defective, a defect indicator hole 10 is drilled at a predetermined position in the flexible circuit board.

The sensor 43 detects the presence or absence of the defective display hole ID and outputs a detection signal indicating whether or not a conductive film should be crimped onto each electronic component.

The present invention will be described in detail with reference to the flowchart of FIG.

In step Sl, the control device drives the supply sole 12 and sprocket 16 shown in FIG. 1 to feed the flexible circuit board 1, and in step S2,
, 42, the feeding continues until it is determined that the electronic component has reached the preparation position. When the electronic component reaches the preparation position, the sensor 43 detects the presence or absence of a defective display hole 10. If the hole ID is detected, "1" is written in the shift register in the slot S4, and if it is not detected, "1" is written in the shift register.
0" and feeds the flexible board 1 so that the electronic component reaches the working position (step 55). When the electronic component reaches the working position, the control device reads the value of the shift register (step S6), If the value is "1", it is determined to be defective, and the flexible circuit board is fed without crimping the conductive film until the next electronic component is at the preparation position.The defect indicator hole IO is not detected, If it is determined that the electronic components and circuit pattern are normal, step S7
Proceed to. Here, the control device drives the supply reel 23 and the feed roller 28 to feed the laminate of the conductive film 2 and the protective film 2A to the lower surface of the pressure bonding head 21. Next, in S8, the control device sends a fluid such as air to the cylinder 22A fixed to the frame 22, and the base 20 and the crimp head 21 fixed to the base 20 via the seat 20^ are fixed to the frame 22, but not to the guide 22B. The conductive film 2 is pressed onto a predetermined position on the flexible circuit board.

The crimping head 21 is heated to 100 to 150°C,
The conductor 1ij2 made of thermoplastic resin is well adhered onto the flexible circuit board. Next, in step S9, when the cutter 70 is operated to cut the conductive llI2 and the crimping head 21 is raised, the conductive film 2 is separated from the protective film 2^ made of Teflon, and one bonding operation is completed.

Thereafter, in step 510, the same operation is repeated while advancing the position of the electronic components one by one until it is determined that all bonding is completed.

[Effects of the Invention] As explained above, both the long flexible circuit board and the long conductive film are fed, and the conductive film is fed only when the electronic components and circuit patterns on the flexible circuit board are normal. Since the film is crimped to the desired location on the flexible circuit board, the conductive film can be used effectively and the efficiency of the crimping work can be improved.

[Brief explanation of the drawing]

Fig. 1 is a front view of a conductive film laminating machine to which the conductive adhesive film crimping device of the present invention is applied, Fig. 2 is a plan view of a flexible circuit board, and Fig. 3 is a partially enlarged view of the conductive film laminating machine. , FIG. 4 is a plan view showing a defective indicator hole, FIG. 5 is a flowchart explaining the present invention in detail, and FIGS. 6 and 7 are views showing a conventional conductive adhesive film. DESCRIPTION OF SYMBOLS 1... Flexible circuit board, 2... Conductive film, 3... Perforation, 3^... Edge of perforation, 4... Electronic component, 16... Sprocket, 21... Crimping head, 22A...Cylinder, 40...Sensor, 41...Sensor for electronic parts, 42...Sensor for perforation, 70...Cutter. 6 Shirotsu Reki no ＼? Ku〉 Figure 2 Figure 4 v, Figure 3 101 A fill disaster package〒 ・7 WITH 774 Σ

Claims (1)

[Scope of Claims] 1) An apparatus for pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached, comprising: a first driving means for feeding the flexible circuit board; a second driving means for feeding the conductive adhesive film; a third driving means for moving the conductive adhesive film up and down with respect to the flexible circuit board and press-bonding the conductive adhesive film on the flexible circuit board; and a control means for controlling the first, second, and third drive means based on the detection signal of the detection means. Pressing device for conductive adhesive film. 2) In the method of pressure-bonding a conductive adhesive film to a long flexible circuit board on which electronic components are attached, the quality of the electronic components and circuit patterns on the flexible circuit board is identified in advance, and the electronic components and circuit patterns are If the circuit pattern is normal, the conductive adhesive film is pressed onto the circuit pattern, and if the electronic component or the circuit pattern is defective, the flexible circuit board is transferred without pressing the conductive adhesive film. A method for crimping a conductive adhesive film.