JP3868863B2 - Laminator for substrate and laminating method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate laminator and a laminating method in which a film such as a photosensitive dry film is pressure-bonded to both sides and / or one side of a substrate.
[0002]
[Prior art]
Conventionally, in order to form a wiring pattern on a substrate, the pattern formed on the photomask is exposed and transferred onto a photosensitive dry film laminated on both sides or one side of the substrate.
In general, a substrate laminator for laminating a photosensitive dry film on a substrate is sandwiched between a substrate and a photosensitive dry film by a pair of pressure rollers and pressed (or heated at the same time as pressing) to be bonded to the surface of the substrate. What laminates a dry film (it may only be called a film hereafter) is known.
The pair of pressure rollers has an outer peripheral surface made of an elastic member such as rubber, and is formed in a columnar shape having substantially the same diameter over the axial direction. When heating is performed simultaneously with pressing, a heater is built in the axial direction of the pressure roller.
[0003]
By the way, recently, the wiring pattern has been increased in density and accuracy, so when the photomask pattern is transferred onto the substrate on which the film is laminated, the photomask and the substrate are accurately aligned. Need to be. For alignment between the substrate and the photomask, alignment marks arranged on the substrate and the photomask are used.
An example of such an alignment mark is shown in FIGS. The alignment marks 15 shown in FIGS. 6A and 6B are concave portions on both sides of the substrate 30 so that the substrate 30 having the film 20 laminated on both sides can be positioned on both sides of the substrate 30. It is formed in [FIG. 6A] or in a through hole [FIG. 6B] that penetrates the substrate 30 and is opened on both surfaces of the substrate 30.
[0004]
Further, the alignment mark 15 shown in FIGS. 6 (c) and 6 (d) is used to position the substrate 30 on which the film 20 is laminated on one side so that the substrate 30 can be positioned from the laminated surface side of the film 20 of the substrate 30. Are formed in the recesses [FIG. 6C] on the laminate surface side or in the through holes [FIG. 6D] opened on both surfaces of the substrate 30.
The position where the alignment mark 15 is disposed on the substrate 30 is usually around the product region 30a as shown in FIG. 2, and is a non-product region 30b that is finally cut off.
In this way, in an exposure apparatus that exposes a photomask pattern on a film 20 in which both surfaces or one surface of a substrate 30 having an alignment mark 15 formed at a predetermined position is laminated, first, the substrate 30 covered with the film 20 is exposed. The reflected light or transmitted light is irradiated to the position where the alignment mark 15 will be present, the brightness of the light is recognized by the CCD camera, and the position of the alignment mark 15 is confirmed. Next, alignment of the photomask and the substrate 30 laminated with the film 20 is performed according to the calculation result based on the read data.
[0006]
[Problems to be solved by the invention]
However, when the film 20 is laminated on the substrate 30 using a conventional laminator, the entire surface of the substrate 30 on which the film 20 is superimposed is uniformly pressed (or heated and pressed) by a pair of pressure rollers. For this reason, the same pressing force (or the same pressing force and heating force) as the other portions also acts on the alignment mark 15 and the film 20 covering the vicinity of the periphery thereof. Due to the pressing force or the like, a part of the resin forming the film 20 that covers the vicinity of the periphery of the alignment mark 15 enters the alignment mark 15.
As the resin enters the alignment mark 15, as shown in FIGS. 6A and 6C, the recess as the alignment mark 15 is filled with resin (portion indicated by 20 a). 6 (b) and FIG. 6 (d), the resin portion 20b may be formed in an annular shape along the opening edge of the through hole as the alignment mark 15.
[0007]
When the concave portion as the alignment mark 15 is filled with the resin component of the film 20 (FIGS. 6A and 6C), when the alignment mark 15 is irradiated with reflected light, FIG. As shown in FIG. 5B, the inside of the opening 15a becomes dark like the surroundings, and the outline of the opening 15a does not appear clearly.
In addition, when a part of the resin of the film 20 enters the through hole of the alignment mark 15 (FIGS. 6B and 6D), when the alignment mark 15 is irradiated with transmitted light, FIG. ), The contour of the opening 15a is blurred double or triple due to the influence of the annular resin portion.
When the resin enters the recess or the through hole as the alignment mark 15 as described above, the alignment mark 15 with an unclear outline is not accurately detected by the CCD camera even if the reflected light or transmitted light is irradiated. Therefore, the alignment between the substrate 30 and the photomask cannot be performed with high accuracy.
[0008]
Accordingly, an object of the present invention is to provide an alignment formed on the substrate in a concave shape or a through-hole shape so that an optical reader such as a CCD camera can accurately read the alignment mark of the substrate laminated with the film. It is an object of the present invention to provide a laminator for a substrate and a laminating method that can satisfactorily laminate a substrate with a film without entering or filling a film or a part of the film.
[0009]
[Means for Solving the Problems]
In order to prevent the resin forming the film from entering the alignment mark when the substrate is laminated with the film, the inventor does not apply the same pressing force to the alignment mark by the pressure roller. The present inventors have completed the present invention by thinking that it would be good to do so.
[0010]
That is, according to the present invention, a film is applied to one side or both sides of a substrate on which an alignment mark consisting of a through hole and / or a recess is formed, and the film is pressure-bonded with a pressure roller. In the laminator for a substrate for laminating a film, a reduced diameter portion is formed on the pressure roller so as not to substantially press a portion of the film covering the through hole or the opening of the concave portion as the alignment mark. Features.
[0011]
Further, the present invention provides a film deposited on one side or both sides of the substrate when laminating the film on one side or both sides of the substrate on which an alignment mark consisting of a through hole and / or a recess is formed. The laminating method is characterized by pressing and pressing a film portion covering the through hole or the opening of the recess as the alignment mark without substantially pressing.
[0012]
In the present invention, by forming the reduced diameter portion of the pressure roller wider than the through hole or the opening of the recess as the alignment mark, the resin that forms the film surely enters the alignment mark. Can be prevented.
[0013]
Furthermore, in the laminating method according to the present invention, a pair of pressure rollers is used when pressure bonding between the substrate and the film, and the through holes or the openings of the recesses as the alignment marks are covered as the pair of pressure rollers. In order not to substantially press the film portion, the non-product region located outside the product region for forming the wiring pattern or the like is used as the substrate, using a pressure roller formed with a reduced diameter portion. Using a substrate that is provided in a strip shape parallel to the substrate insertion direction to the pair of pressure rollers, and in which through holes and / or recesses as alignment marks are linearly formed in the non-product region. Features. Thereby, a product area | region is not pressed by a reduced diameter part, but the board | substrate and film of a product area | region can be crimped | bonded favorably.
[0014]
According to the present invention, when the substrate and the film are sandwiched by the rotating pressure roller, since the reduced diameter portion is formed on the pressure roller, the film is substantially formed on the substrate on which the film is applied. The part which is not pressed can be made into a strip shape. And since the alignment mark is provided in the strip | belt-shaped part, the film on an alignment mark is not pressurized more than necessary, and a part of resin which forms a film enters into an alignment mark. There is nothing.
In the present invention, “does not substantially press the part of the film covering the through hole or the opening of the recess as the alignment mark” means that a part of the resin forming the film presses the film. It means that it does not enter the inside of a through-hole and / or a recessed part by pressure.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
First, an example of a substrate laminator according to the present invention is shown in FIGS. The laminator 10 shown in FIG. 4 is a double-sided laminator for laminating the film 20 on both sides of the substrate 30, and FIG. 4 (a) is a schematic diagram for explaining the state of the laminator immediately before the start of lamination. ) Is a schematic diagram illustrating the state of a laminator during lamination.
[0016]
A roll (not shown) in which a film 20 as a photosensitive dry film is wound in a roll shape with its resist surface covered with a cover film on the upper and lower portions of the laminator 10 shown in FIG. Is arranged.
In addition, the laminator 10 guides the films 20 and 20 drawn from the roll, and at the start of lamination, the leading ends of the films 20 and 20 are fed by conveyor rollers 25 and 25 as shown in FIG. 4A. Temporary plates 22 and 22 are provided for temporary attachment to the tip of the substrate 30 having a predetermined length. Furthermore, the laminator 10 is provided immediately before the pair of pressure rollers 11, 11, and guides the films 20, 20 to the pair of pressure rollers 11, 11, and the length of the substrate 30. Cutters 24 and 24 and cutter backups 21 and 21 having round blades for cutting the films 20 and 20 are provided.
[0017]
The temporary plates 22 and 22 are provided so as to be movable toward and away from the substrate 30, and the cutters 24 and 24 and the cutter backups 21 and 21 are provided so as to be movable along the films 20 and 20. Furthermore, the cutters 24 and 24 are provided so as to be able to reciprocate also in the width direction of the film.
Moreover, the suction plates 22 and 22, the cutter backups 21 and 21, and the film guides 23 and 23 are provided with a plurality of suction holes that communicate with a vacuum pump as a vacuum source as suction means for sucking the film 20. . The suction and release of the films 20 and 20 by the suction means are controlled by turning on and off the vacuum pump.
[0018]
A pair of pressure-bonding rollers 11 and 11 used in the laminator 10 shown in FIG. 4 is a cylindrical roller whose outer peripheral surface is formed of an elastic member such as rubber and is formed to have substantially the same diameter in the axial direction. As shown in FIG. 1, the diameter-reduced portions 13, 13 are formed over one circumference of the elastic member. The pair of pressure rollers 11 and 11 is also a heating roller in which a heater is built in the axial direction.
The pair of pressure rollers 11 and 11 are incorporated so that the reduced diameter portions 13 formed in the respective rollers coincide with each other, and the substrate 30 and the films 20 and 20 sandwiched between the pressure rollers 11 and 11 are connected. The pressure is pressed by a pressurizing device such as an air cylinder so as to press uniformly on the outer peripheral surface excluding the reduced diameter portion 13.
[0019]
Further, as shown in FIG. 2, the reduced diameter portions 13 and 13 are supplied to the pair of pressure rollers 11 and 11 in a state where the films 20 and 20 are disposed on both surfaces of the substrate 30, and , 20 are laminated on the pair of pressure rollers 11, 11 so as to correspond to the region of the substrate 30 on which the alignment mark 15 is formed.
The substrate 30 shown in FIG. 2 is a copper clad laminate, and the alignment mark 15 is formed in a frame-like non-product region 30b formed around the product regions 30a and 30a where the wiring pattern is formed. . The alignment mark 15 is formed in a through-hole that penetrates the substrate 30 and is opened on both surfaces of the substrate 30.
[0020]
The alignment mark 15 has a plurality of alignment marks 15, 15... Formed in a row in the substrate insertion direction (arrow D direction) for supplying the substrate 30 to the pair of pressure rollers 11, 11. Three rows of alignment marks 15, 15... Are formed in parallel with the arrow D direction.
For this reason, each of the pair of pressure-bonding rollers 11 and 11 shown in FIG. 2 has reduced-diameter portions 13, 13, and 13 formed at three locations corresponding to the substrate 30 shown in FIG. 2.
[0021]
The reduced diameter portion 13 may have a semi-elliptical inverted crown shape as shown in FIG. 1A, or a trapezoidal shape as shown in FIG. May be. Furthermore, it is preferable that the width 13 b of the reduced diameter portion 13 is wider than the opening diameter of the recess or the through hole as the alignment mark 15.
Here, as the alignment marks 15, 15... Formed on the substrate 30, only through holes or recesses may be formed, but the through holes and recesses may be mixed.
[0022]
Next, the operation of the laminator 10 having the above configuration will be described.
The substrate 30 supplied to the conveyor rolls 25 and 25 is transported and stopped so that the front end portion comes to the front of the press rollers 11 and 11.
The films 20 and 20 are moved in the directions of arrows B and B through a film tension mechanism (not shown) with the resist surface facing the substrate 30 side while the cover film on the surface is peeled off from the upper and lower rolls. It is drawn to. The drawn films 20 and 20 are temporarily attached to the front end portion of the substrate 30 while being vacuum-sucked and held by the temporary attachment plates 22 and 22 that advance toward the stopped substrate 30.
[0023]
Thereafter, the temporary attachment plates 22 and 22 stop the vacuum suction of the films 20 and 20 and retreat from the substrate 30 again (see FIG. 4B). The substrate 30 is sent between the pressure rollers 11 and 11 together with the temporarily attached films 20 and 20 by a conveying means.
The substrate 30 and the films 20 and 20 are sandwiched between the pressure rollers 11 and 11, and are conveyed rightward in FIG. 4 by the rotation of the pressure rollers 11 and 11. At this time, since the pressure rollers 11 and 11 heat and press the substrate 30 and the films 20 and 20, the substrate 30 is laminated with the film 20 sequentially from the front end portion to the rear end portion on both sides.
At this time, since the film guides 23 and 23 guide the films 20 and 20 to the pressure rollers 11 and 11 side by vacuum suction, air enters between the film 20 and the substrate 30, or the film 20 is wrinkled. There is nothing to do.
[0024]
In this way, while the substrate 30 is laminated with the film 20, the temporary attachment plates 22 and 22, the cutters 24 and 24, and the cutter backups 21 and 21 are at the same speed as the conveying speed of the films 20 and 20. Approach. In this state, the cutters 24 and 24 having rotating round blades move in the width direction of the film 20 along the cutter backups 21 and 21, thereby cutting the films 20 and 20 into a predetermined length. it can.
Thus, both surfaces of the substrate 30 are simultaneously laminated by the films 20 and 20.
[0025]
In the laminator 10 having such a configuration, when the substrate 30 and the film 20 are sandwiched by the pressure rollers 11, 11, the both sides of the substrate 30 and the film 20 are substantially formed in three rows of strips corresponding to the positions of the reduced diameter portions 13. It will have an area which is not pressed by.
Accordingly, the alignment mark 15 is aligned with the strip-shaped region by inserting the substrate 30 between the pressure rollers 11 and 11 with the three rows of the openings 15a corresponding to the three reduced diameter portions 13 respectively. 15 comes to be located. As a result, the film portion covering the opening 15a of the alignment mark 15 is not substantially pressed.
[0026]
Thus, as shown in FIG. 3B, a part of the resin forming the film 20 does not enter the through hole, and the alignment mark 15 in a good state can be formed.
When the alignment mark 15 shown in FIG. 3 (b) is irradiated with transmitted light, the contour of the opening 15a appears clearly as shown in FIG. 3 (f). The alignment mark 15 having a bright and dark clear outline can be read with high accuracy by the CCD camera of the exposure apparatus, and alignment with the photomask can be performed accurately.
[0027]
As described above, the present invention has been described in various ways with reference to preferred embodiments, but the present invention is not limited to these embodiments.
In the above description, a pressure roller having a heater disposed therein has been described. However, a pressure type pressure roller without a heater may be used.
In addition, the pressure roller may have a crown shape or the like so that the entire surface of the substrate is uniformly heated and pressed, but in this case as well, a reduced diameter portion is provided in the same manner as the cylindrical pressure roller. be able to. Here, the crown shape refers to a shape in which the outer diameter of the pressure roller gradually increases from both ends in the axial direction toward the center.
[0028]
Further, even when the alignment mark 15 is not formed in the through hole shape, but is formed in a recessed shape at positions facing each other on both surfaces of the substrate 30 as shown in FIG. The laminator for substrates and the laminating method described in the embodiment can be used. Also in this case, since the portion of the film covering the opening 15a of the concave portion is not substantially pressed by providing the reduced diameter portion, as shown in FIG. 3A, a part of the resin forming the film Can be satisfactorily laminated to the substrate without entering the recess. When the reflected light is irradiated onto the alignment mark 15 as shown in FIG. 3A, the outline of the opening 15a appears clearly as shown in FIG. 3E, so that it can be read accurately by the CCD camera. it can.
[0029]
In addition, a laminator in which film rolls are disposed on the upper and lower sides and both surfaces of the substrate are laminated at the same time has been described. However, the present invention can also be applied to a laminator that laminates only one surface. In this case, the alignment mark 15 is formed in the through hole (FIG. 6D) or the concave portion (FIG. 6C), but the reduced diameter portion is preferably provided only on the pressure roller in contact with the film surface. Thereby, as shown in FIGS. 3C and 3D, it is possible to obtain the alignment mark 15 that can be accurately recognized by the CCD camera without entering part of the resin forming the film.
[0030]
Further, there are cases where the alignment marks 15 of the recesses are formed on both surfaces of the substrate 30, and the recesses are not provided at the opposite positions as shown in FIG. In this case, when the substrate 30 is sandwiched between the pressure rollers 11, 11, a pair of pressure rollers is provided so that the openings 15a, 15a provided on both surfaces face the reduced diameter portions 13, 13 via the film 20, respectively. It is preferable to provide a reduced diameter portion 13 at each of 11 and 11 positions.
Thus, the number and position of the reduced diameter portions are appropriately provided according to the position and number of the alignment marks on the substrate.
[0031]
The present invention can be applied not only to a photosensitive dry film but also to a wide range of films.
Further, even if the opening shape of the alignment mark is a cross shape or other polygonal shape, the laminator and laminating method according to the present invention can be used even if the alignment mark is a substrate in which a concave shape and a through hole shape are mixed. Of course, it can be applied.
[0032]
【The invention's effect】
According to the laminator for a substrate and the laminating method of the present invention, the film or a part of the film does not enter or fill into the alignment mark formed in the concave shape or the through hole shape on the substrate.
Therefore, since the outline of the opening appears clearly when the reflected light or transmitted light is irradiated, it is possible to prevent erroneous recognition of an optical reading device such as a CCD camera. Thereby, alignment of a board | substrate and a photomask can be performed with high precision.
[Brief description of the drawings]
FIG. 1 is a front view showing a shape of a reduced diameter portion of a pressure roller.
FIG. 2 is an explanatory diagram showing positions of alignment marks between a pressure roller and a substrate.
FIG. 3 is a cross-sectional view and an explanatory view showing a state of an alignment mark when a substrate is laminated using the laminator of the present invention.
FIG. 4 is an explanatory diagram for explaining the operation of a laminator.
FIG. 5 is a cross-sectional explanatory view when a substrate and a film are sandwiched between pressure rollers.
6A and 6B are a cross-sectional view and an explanatory view showing a state of an alignment mark when a substrate is laminated using a conventional laminator.
[Explanation of symbols]
10 Laminator 11 Pressure roller 13 Reduced diameter portion 15 Position alignment mark 20 Film 30 Substrate

Claims (5)

For a substrate in which a film is applied to one or both sides of a substrate on which an alignment mark consisting of a through hole and / or a recess is formed, and is bonded with a pressure roller, and the film is laminated on one or both sides of the substrate. In the laminator
The substrate laminator is characterized in that a reduced diameter portion is formed on the pressure roller so as not to substantially press a portion of the film covering the through hole or the opening of the concave portion as the alignment mark. 2. The laminator for a substrate according to claim 1, wherein the reduced diameter portion of the pressure roller is formed wider than the opening of the through hole or the concave portion as the alignment mark. When laminating a film on one or both sides of a substrate on which an alignment mark consisting of a through hole and / or a recess is formed,
The film attached to one side or both sides of the substrate is pressed and pressed without substantially pressing a portion of the film covering the through hole or the opening of the recess as the alignment mark. Lamination method. When pressure bonding between the substrate and the film, a pressure roller is used so that the pressure roller does not substantially press the part of the film covering the through hole or the opening of the recess as the alignment mark. 4. The laminating method according to claim 3, wherein a pressure roller having a reduced diameter portion is used. When the substrate and the film are pressure-bonded, a pair of pressure-bonding rollers are used, and as the pair of pressure-bonding rollers, a portion of the film covering the through-hole as the alignment mark or the opening of the recess is substantially pressed. Use a pressure-bonding roller with a reduced diameter part,
As the substrate, a non-product region located outside a product region for forming a wiring pattern or the like is provided in a strip shape parallel to the substrate insertion direction to the pair of pressure rollers, and a through hole as an alignment mark 5. The laminating method according to claim 3 or 4, wherein a substrate in which concave portions are linearly formed in the non-product region is used.

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