JP2002028896A - Die with see-through optical system and positioning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with the positioning mark printing and boring on the surface by using the function of a see-through optical system in the die-cutting of a laminated film material having circuits or the like on an inner layer for an IC card or the like. SOLUTION: Light is applied from a light source 9 to a nontransparent laminated sheet 1 from below inner marks in Fig. 4, the mark 12 is detected by a camera 10 and automatically matched with the mark 16 for positioning at the same time, and punching is applied by the shearing of an upper die 3 and a lower die 2 after the camera 10 is moved to the outside. A printing process of the positioning mark and a boring process on the surface of the sheet material can be omitted, and the card with high-quality inner layer can be manufactured by applying high-precision see-through positioning.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an IC card and the like.
The present invention relates to a method for manufacturing a multilayer film having an electronic circuit therein, another sheet material, or the like.

[0002]

2. Description of the Related Art Recently, as one of information management tendencies, cards with a built-in small IC chip and the like are rapidly spreading. The number of types is also increasing, such as close contact, close proximity, and long distance, and there are many fields that require high reliability such as payment of fees,
Other applications are also expected to expand. In the production of such cards and the like, a conductive circuit is printed on a sheet material serving as a substrate, a thin IC is mounted and connected, then laminated with a non-transparent film (sheet) or the like, and cut and cut into individual cards. It is generally performed by printing a picture. In general, the number of issued sheets is very large, and high production capacity is required. Further, the sheets to be laminated are performed in units of several tens of sheets per sheet, and the sheets are often cut for each card.

[0003]

SUMMARY OF THE INVENTION In the present invention, when laminated with a non-transparent sheet such as an IC card, the cost can be reduced by omitting a printing step and a punching step of a positioning mark in a later step. To provide a highly confidential card or the like with high quality.

[0004]

In order to cut a card or the like having a circuit or the like inside laminated with a non-transparent sheet or the like, it is necessary to see through the printed pattern inside.

[0005] A card in which a high-quality sheet is laminated is provided by incorporating a light source having high transparency to the sheet into a die for cutting and ensuring the alignment.

[0006] Since the sheet is often made of a non-transparent material in which the internal circuit is not visible, when cutting, it is necessary to previously perform a step of forming a positioning hole and printing a position mark after lamination. Become. Generally, a method of printing a + mark (register mark) on both ends of a card or the like, detecting the mark with a sensor, and determining a cutting position is often used.

There is an example in which the inside can be observed with a transparent sheet. For example, in Japanese Patent Application Laid-Open No. 08-025604 (method of manufacturing a decorative sheet), in a multilayer sheet, an opaque pattern on the front and back of a transparent film and a light reflective pattern are combined to provide a sheet having a three-dimensional effect in the thickness direction. It has been proposed. However, these cannot be used for an IC card or the like using a highly confidential non-transparent sheet having a circuit inside.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic diagram of a mold with a see-through optical system.

The upper die 3 and the lower die 2 punched for a card are
The die set 6 is fixed on a press device. A base 4 incorporating the upper mold 3 is held by a press head through a shank 5 and moves up and down by a four-point guide.
There is no limitation on which of the upper die 3 and the lower die 2 becomes the die or punch die. The press device uses a hydraulic press having a capacity of about 5 tons. The laminate sheet 1 is automatically fed between the upper and lower molds. The parallelism in the traveling direction is determined by the guides 7 on both sides. Holes 9 are provided at two locations on the outer diagonal direction of the cut portion of the lower die, and a light source (infrared light) 8 for see-through is provided from below. Between the upper die 3 and the lower die 2, while the press is stopped, the movable camera is automatically moved and positioned directly above the LED. Light source 8
Is designed to supply power to the inside of the groove in the die set with a cord (the light source is not limited to infrared light, but may be X-ray or ultraviolet light in some cases).

FIG. 2 shows an outline of the mobile camera. The camera 10 is composed of two cameras corresponding to two diagonal places so as to see the respective transparent parts, and the fixed part 11 is reciprocated by the guide 13 by air cylinder driving. When the camera 10 captures the + mark 12 in the film from below, the camera 10 outputs the image to each monitor.

The press requires an interlock that does not operate when the camera 10 is positioned in the upper and lower dies. Next, a screen output from this camera is shown in FIG. The + mark detected through the sheet is shown as a target mark (16, which is a double circle mark attached to the upper mold when matching with the upper mold, and as a mark in the monitor when it is on the monitor). Position is displayed). This detection mark is detected by the image processing device,
The position of the sheet is controlled by the controller of the sheet feeding stage, and the alignment is performed simultaneously. In this case, the center of the + mark in the inner layer of the sheet is aligned with the center of the double circle mark for positioning.

Next, FIG. 4 is a sectional view showing a case where the sheet is positioned and cut.

The sheet 1 is fed onto the lower mold 2, and at the same time, the camera 10 moves to the position detecting section between the molds. From below, the infrared light source 8 outputs infrared light upward through the hole 9. A double circle mark 16 for reference is attached to the upper mold, and the upper and lower detection images are switched by a camera at a constant frequency, so that the plus mark on the inner layer of the sheet and the double circle mark on the upper mold are switched. Are superimposed on the monitor, and the degree of matching is monitored. The image processing device calculates the shift of the + mark, corrects the feed stage, and makes it coincide. When the correction is completed, the camera moves out of the mold, the upper mold descends,
The laminate sheet 1 is cut into a card shape. In this case, the spring material 17 is interposed between the upper and lower fixing portions to have elasticity, thereby preventing the adhesive sandwiched between the sheets from being exposed. Further, in order to prevent the generation of burrs at the cross section of the cutting, it is effective to set the clearance between the upper and lower molds to about 10 μm. After the upper mold is lowered and the cutting is performed, the upper mold is raised again and the cutting is completed. After that, with a certain stroke, the laminate sheet is sent, similarly positioned,
Make a cut.

Next, positioning is performed by seeing through. FIG. 5 shows a cross section of the laminate sheet material. This is applied to an IC card or the like. The structure shown in FIG. 18 is obtained by sandwiching a printed circuit 22 on a sheet material 20 such as PET using an adhesive 21 therebetween. To form a two-layer structure. + Of positioning mark
Are also printed at the same time as printing. The thickness is the sheet material 20
The thickness A of the adhesive is 125 μm, the thickness B of the adhesive is 200 μm, and the total thickness C of the laminate is 425 μm. In the internal printing unit 22, the sheet material 20 is not transparent and cannot be seen. The structure of No. 19 is a three-layer structure using three sheets, and an intermediate sheet (F thickness is 50 μm).
m) is laminated with the two outer sheets 20 with the adhesive layer 21 interposed therebetween (D thickness: 250 μm, total thickness: 760 μm). Both 18, 19, from the bottom,
When irradiating infrared light, the monitor can be more clearly monitored with the print surface 22 facing upward.

FIG. 6 shows a print + mark used for alignment. The length is about 5 × 5 mm, and the monitor can be observed well at 10 ×.

FIG. 7 shows characteristics with respect to wavelength.

Reference numeral 23 denotes an infrared light intensity distribution, and the peak is
880 nm.

Reference numerals 24 and 25 denote the reflectance and the transmittance of the sheet material. The reflectance at 880 nm is about 85% and the transmittance is about 12%. From this, it can be said that the absorption rate is about 3%. The transmittance of the printed portion is considered to be 1% or less in the case of a silver paste material, and when infrared light is applied from below and detection is performed with a CCD camera, it is possible to sufficiently detect the difference in density. However, since light is attenuated by reflection and absorption between the sheet material and the adhesive, this difference in transmittance is an important factor in performing fluoroscopy.

[0020]

According to the present invention, when laminating with a non-transparent sheet such as an IC card, the printing of a positioning mark and the drilling step in the subsequent steps can be omitted.
The cost can be reduced, and a highly confidential card or the like can be provided with high quality.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a mold with a see-through optical system showing an embodiment of the present invention.

FIG. 2 is a diagram showing a movable camera in the see-through optical system.

FIG. 3 is a diagram showing a monitor that outputs a fluoroscopic part detection screen.

FIG. 4 is a sectional view of a mold with a see-through optical system.

FIG. 5 is a cross-sectional view of a laminate sheet to be viewed.

FIG. 6 is a detailed view of a mark on a sheet to be subjected to perspective detection.

FIG. 7 is a view showing light source characteristics with respect to wavelength and reflection and transmission characteristics of a film.

[Explanation of symbols]

1 ... Laminated film, 2 ... Lower mold, 3 ... Upper mold, 4
... upper mold holding plate, 5 ... holding shank, 6 ... die set, 7 ... guide, 8 ... light source, 9 ... hole for light source, 10 ... camera, 11 ... camera fixing part, 12 ... detection mark, 13 ... air cylinder movement Part, 14 monitor, 15 stripper plate, 16 upper mark, 17 spring material, 18 2
Layer film, 19: three-layer film, 20: non-transparent sheet, 21: adhesive, 22: paste printing part, 23: light source intensity distribution, 24: sheet reflectance, 25: sheet transmittance.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Shinichi Wai 1 Horiyamashita, Hadano-shi, Kanagawa F-term (reference) 2C005 MA18 MA40 PA04 PA15 PA18 RA09 3C024 FF02 FF03

Claims (2)

[Claims] 1. A mold having a light source incorporated in at least one of upper and lower molds used for cutting, and a mold having a position detection mark on the other, and an inner layer of a non-transparent laminate sheet. An alignment method and a mold, wherein alignment is performed by detecting a mark through perspective. 2. A printed alignment mark using a material having a transmittance of a sheet and an adhesive at least twice that of an internal printed pattern of a laminate sheet at a wavelength of a light source used for fluoroscopy. A positioning method characterized by using: