JPH057535Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an apparatus for inspecting the bonding condition of thin films, particularly the bonding condition of a conductive adhesive film to a circuit board.

[The problem that the idea aims to solve]

A conductive adhesive film (hereinafter simply referred to as a conductive film) for use in connection with an external device or circuit is sometimes pressure-bonded onto a wiring pattern provided on a flexible circuit board.

FIG. 11 shows the state in which the conductive film 2 is pressed onto the wiring pattern of the flexible circuit board 1.
On the flexible circuit board 1 are wiring patterns 5,
6 is formed, and electronic components 4 such as integrated circuits are formed.
is already installed. In this example, the conductive film 2 is pressure-bonded onto one of the wiring patterns 5. Conventionally, as shown in the figure, a long flexible circuit board 1 is cut along the broken line L shown in the figure, and a conductive film 2 cut to the same width is pasted at a predetermined position. When the attachment of the conductive film 2 is completed, the attachment state is inspected, and those that pass the inspection are sent to the next process.
However, it has been extremely difficult to inspect the state of attachment.

FIG. 12 is a sectional view of the flexible circuit board 1 to which the conductive film 2 is attached. The flexible circuit board 1 has a structure in which a wiring pattern 5 is adhered to a base film BF with an adhesive 5A.
The thickness T of the conductive film 2 is very thin, about 10 μm, and if the part where it contacts the wiring pattern 5 is damaged, the function of the conductive film will deteriorate. Furthermore, the conductive film 2 is semi-transparent and has little difference in brightness from the base film BF, making it difficult to automatically determine whether or not the conductive film 2 is present on the base film BF, making manual inspection difficult. I had no choice but to rely on it. In addition, since there is a layer of adhesive 5A on the base film BF, there are variations in the thickness H _f of the entire film, so even if the total thickness H including the conductive film 2 is measured, the conductive film It was not possible to determine whether or not 2 was pasted correctly.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned conventional drawbacks, to provide a film compression bonding inspection device that can accurately conduct a compression bonding inspection of a conductive film, and is suitable for automation of the inspection.

[Means to solve the problem]

In order to achieve such an object, the present invention includes a plurality of reference bodies fixed to a support body such that the tips of each body form a single plane, and a plurality of reference bodies fixed to the support body,
A sensor whose initial position is on a plane and has a movable probe, which outputs an electrical signal according to the amount of displacement of the probe from the plane, and a sensor that is directed toward the plane formed by the tip. It is characterized by comprising a measuring object mounting table supported by an energized spring, and a member for relatively moving the support body and the measuring object mounting table.

[Effect]

According to the present invention, a plane is formed by a plurality of reference blocks, and the object mounting table is made to follow this plane, so that even if the surface of the object to be measured varies in thickness, It can be suppressed at multiple points on the same plane. Therefore, the bonding state of the membrane can be accurately and automatically inspected using a sensor that can detect irregularities on the surface of the object to be measured with an accuracy of about 1 μm.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

Figure 1 is a side view of the membrane bonding inspection device of the present invention.
2 is a sectional view taken along the line A--A in FIG. 1, FIG. 3 is a front view of the device, and FIG. 4 is a bottom view thereof.

Four reference blocks 101 are fixed to a mounting base 103 so that their lower surfaces form one plane.
A support stand 105 is fixed to the base 104, and a guide 106 is fixed to the support stand 105. The mounting base 103 is fixed to a piston rod 107A of a cylinder 107 fixed to a support base 105 so as to be able to move up and down along this guide 106. Two more sensors 10 are installed on the mounting base 103.
2 is fixed. The position of the tip of the probe 102A at the tip of the sensor 102 is within the plane formed by the four reference blocks 101 during normal operation. When the probe 102A is displaced upward by a predetermined height, a signal to that effect can be taken out from the signal line 102B. As the sensor 102, for example, Baumer Electric AG's sensor with an accuracy of 1 μm is used.
MY-COM can be used.

FIG. 5 shows the arrangement of each reference block and sensor as viewed from the bottom.

On the other hand, a reference stand 108 is fixed to the base 104 so that its surface remains parallel to the plane formed by the four reference blocks 101. That is,
A cross shaft 111 is attached to a bracket 109 fixed to a reference stand 108 via a bearing 110, and this cross shaft 111 is attached to a base 10 via a bearing 112.
It is attached to 4. Thus, the reference stand 108 is rotatable around the two orthogonal axes of the cross shaft 111. Furthermore, the reference stand 108 has four springs 10 provided between the base 104 and the reference stand 108.
8A, it is urged to be parallel to the plane formed by the four reference blocks 101.

Place the object to be measured on the reference stand 108 and move the cylinder 1
07 to lower the mounting base 103 and bring the four reference blocks 101 into contact with the surface of the object to be measured. The reference stand 108 is a spring 108A
The four reference blocks 101 can be rotated around the intersection center 111A of the two cross axes, so even if the thickness of the object to be measured is not uniform, the four reference blocks 101 can be The sensor 102 contacts the object to be measured on one plane, and the sensor 102 receives the probe 102 from that plane.
The presence or absence of the conductive film can be detected based on the displacement of A.

FIG. 6 shows an example of a long flexible circuit board on which a conductive film is crimped. The flexible circuit board 1 is provided with a perforation 3 at the side end. An integrated circuit 4 is already mounted at a predetermined position on the substrate 1. 5 and 6 are wiring patterns. A conductive film 2 having a predetermined size is bonded onto one of the wiring patterns 5, and necessary terminals of a device such as a liquid crystal display controlled by the integrated circuit 4 are formed on this conductive film in a later process. It is connected to the wiring pattern 5 via 2. Note that, as shown in the figure, no conductive film is bonded to the wiring pattern to which no integrated circuit is attached. IC is a guide film.

The film-like flexible circuit board 1 is made of polyimide resin with a thickness of about 100 μm, for example, and the conductive film 2 is made of thermoplastic material having conductivity only in the thickness direction, as disclosed in, for example, Japanese Patent Laid-Open No. 61-55809. It is possible to use a resin film in which a conductive film 2 and a protective film 2A are laminated.

The flexible circuit board is sent onto the reference stand 108 by a sprocket, and the bonding state of each conductive film can be continuously and automatically inspected.

The portion to be inspected of the flexible circuit board sent onto the reference stand 108 is shown in FIG. 101A is a contact point with the reference block 101, and 102C is a measurement point. When the thickness of the conductive film 2 is 10 μm, for example, if the displacement amount of the probe 102A of the sensor 107 is 8 μm or more, the sensor outputs ON, and if it is less than 8 μm, the sensor outputs ON.
Set the OFF output to be output to the signal line 102B. Therefore, as shown in FIG. 8, when the conductive film is attached by pressure, an ON signal is output from the two sensors 107, and when the conductive film is attached, as shown in FIG. 9, an ON signal is output from one sensor. Since the OFF signal is output, it is possible to automatically and reliably inspect whether the pasting condition is good or bad.

Although the membrane bonding inspection device of the present invention can be used as a stand-alone device, it can exhibit its functions even better by incorporating it into a conductive film pressure bonding device.

FIG. 10 is a front view schematically showing a conductive film bonding machine to which the film bonding inspection device according to the present invention is applied.

In the figure, 11 is the main body of the device. The flexible circuit board 1 is wound around the supply reel 12 in a layered manner with a protective film 1A for protecting the attached integrated circuit. The rotating shaft 12A of the supply reel 12 is driven to send the flexible circuit board 1 through an idler 13, a tension roller 14, and a guide roller 15 to a working position A, and further to a sprocket 16 through a section A. At this time, the protective film 1A is the idler 17
A, tension roller 18 and idler 17
B and is wound onto the take-up reel 19. Reference numeral 20 denotes a base on which is mounted a pressure bonding head 21 for bonding the conductive film 2 to the flexible circuit board 1 and a cutter for cutting the conductive film 2 to a predetermined size.
It is possible to move up and down on the frame 22 of 1. The conductive film 2 is wound around the supply reel 23 in a laminated state with the protective film 2A. The rotating shaft 23A of the reel 23 is driven to send out the conductive film 2 together with the protective film 2A. The conductive film 2 sent out passes through idlers 24 and 25, a tension roller 26, and a guide roller 27, and reaches the pressure bonding head 21. After the bonding of the conductive film and the flexible circuit board is completed, the protective film 2A is pulled up by the feed roller 28, and the protective film 2A is pulled up by the guide roller 29 and the idlers 30, 3.
1 and a tension roller 32, and then wound onto a take-up reel 33. The flexible circuit board that has been pasted is supplied to the next unit, for example, a press unit 36, via a tension roller 34 and a guide roller 35.

During the process of transferring the flexible circuit board and conductive film, each film or film is moved by a tension roller 14, so that the tension caused by the difference between the feeding speed and the winding speed is balanced with the strength of the film or film. 18, 26, 32 and 34. For example, the tension roller 14 has an arm 1 that is swingable by a shaft 14A.
A counterweight 14C is fixed to the other end of the arm 14B, and the tension roller 14 moves up and down as the tension changes.
Axes 18A, 26A, 34A, arms 18B, 26 for tension rollers 18, 26 and 34
B, 34B and counterweight 18C, 2
The functions of 6C and 34C are exactly the same as those of 14A, 14B and 14C, respectively. Although not shown, the tension roller 32 operates in exactly the same way as the other tension rollers.

In this device, a flexible circuit board to which a guide film is connected at the top in the same manner as in the conventional example is used to first position the work area using a sensor 40, and finely adjust the position using a sensor 50. Thereafter, the conductive film 2 is bonded using the pressure bonding head 21. After that, the conductive film 2 is cut with a cutter, and the bonding condition is inspected by the bonding inspection device 60 according to the present invention shown in FIGS. 1 to 5, and then the next step is performed.

The series of operations described above and the adjustment of the supply and winding speeds of each film and membrane can be controlled by a single controller, for example a microprocessor.

[Effect of idea]

As explained above, according to the present invention, a plane is formed by a plurality of reference blocks, and the workpiece mounting table is made to follow this plane. Even if there is a problem, it can be suppressed by using multiple points on the same plane. Therefore, the bonding state of the membrane can be accurately and automatically inspected using a sensor that can detect irregularities on the surface of the object to be measured with an accuracy of about 1 μm.

Therefore, the present invention is not only useful when used alone, but is even more effective when introduced into the inspection process of a bonding machine that automatically pressure-bonds a conductive film onto a long flexible circuit board.

[Brief explanation of the drawing]

Fig. 1 is a side view of an embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is a front view, and Fig. 4 is a bottom view.
FIG. 5 is a layout diagram of the reference block and sensor, FIG. 6 is a plan view of the flexible circuit board, FIG. 7 is a diagram explaining the inspection method using the device of the present invention, and FIGS. Diagram showing the bonded state, No. 10
The figure is a front view of a conductive film bonding machine to which the film bonding inspection device of the present invention is applied, and FIGS. 11 and 12 are a plan view and a sectional view, respectively, of a flexible circuit board. 1... Flexible circuit board, 2... Conductive film,
5...Wiring pattern, 5A...Adhesive, 101...
...Reference block, 102...Sensor, 102A...
... Measuring head, 108... Reference stand, 108A... Spring.

Claims (1)

[Claims for Utility Model Registration] A plurality of reference bodies fixed to a support body such that their tips form one plane; and a plurality of reference bodies fixed to the support body, whose initial position is on the plane, and which are movable. a sensor that outputs an electrical signal according to the amount of displacement of the measuring point from the plane; and a sensor supported by a spring biased toward the plane formed by the tip. What is claimed is: 1. A film bonding inspection apparatus comprising: a measuring object mounting table; and a member for relatively moving the support and the measuring object mounting table.