JPH10303594A - Device for applying lamination tape for adhering electronic component and method for forming cut-out of lamination tape for adhering electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for applying a lamination tape that can maintain the placement accuracy of a cutter and can adhere electronic component that can form a cutout with a specific depth positively on a viscous layer being laminated on a base, and a method for forming the cut-out of the lamination tape for adhering electronic component. SOLUTION: When a cut-out C is formed on a lamination tape for adhering electronic component, the surface of a support member 24 for receiving the lamination tape is magnetized by a magnet 26. Therefore, when a cutter 1 is to be exchanged, the positions of the cutter 1 and the support member 24 can be adjusted while a tool nose 1a of the cutter 1 is sucked by the magnetized support member 24, thus accurately maintaining the degree of parallelization of the surface of the cutter 1 and the tape support 24, forming the cut-out C with a specific depth at the part of viscous layers 2a, and hence positively applying the viscous layer 2a for adhering electronic component to a work.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for attaching a laminated tape for bonding an electronic component to a substrate, and a laminated tape for forming a cutout in the laminated tape for bonding an electronic component. And a method for forming a notch.

[0002]

2. Description of the Related Art As a method for mounting an electronic component on a substrate or the like, there is known a method in which an adhesive such as an anisotropic conductive material is attached to an electrode of a work such as a substrate and a chip is pressed from above. An adhesive material such as an anisotropic conductive material (hereinafter, referred to as “ACF”) has an adhesive property and is difficult to handle. Therefore, it is laminated on a base tape and an electronic material such as an anisotropic conductive tape (hereinafter, referred to as “ACF tape”) is used. A laminated tape for bonding components is used, and the laminated tape for bonding electronic components is wound around a supply reel and handled.

[0003] Hereinafter, the case of an ACF tape will be described as an example. When attaching to the work, A
The CF tape is pulled out, and the ACF side is pressed against the work by the crimping head with the ACF side facing the work surface.
A notch is formed in the ACF portion of the tape. This notch formation in the ACF portion is performed by the ACF
This is performed by a notch forming section provided in the tape feeding path.

[0004] A cutout forming portion of a conventional ACF attaching apparatus will be described below with reference to the drawings. FIG. 9 (a)
FIG. 9B is a partial front view of a notch forming portion of the conventional electronic component bonding tape, and FIG. 9B is a partial plan view of the notch forming portion of the electronic component bonding tape. In FIG. 9A, reference numeral 1 denotes a cutter, which is supported by being sandwiched between a mounting plate 4 and a holding block 5 and fixed by tightening a bolt 6. The cutter 1 is advanced in the direction of arrow a by cutter driving means (not shown), and a notch C is formed in the ACF 2 a of the ACF tape 2 whose back surface is supported by the receiving member 3. 2b is a base tape constituting the ACF tape 2.

[0005]

As described above, the cutter 1
When the notch C is formed, the notch C must be formed in the ACF 2a having a thickness of about 20 microns to prevent the base tape 2b from being cut.
For this reason, the mounting of the cutter 1 requires a high positional accuracy and a high positional accuracy. In particular, together with the stop position accuracy when the cutter 1 is advanced with respect to the tape 2, the cutting edge 1 a of the cutter 1 is placed on the surface of the receiving member 3. High precision is required for the degree of parallelism that maintains parallelism in plan view.

However, in the conventional ACF adhering device, when the cutter 1 is replaced with a new one and is re-set, the cutting edge 1a of the cutter 1 is maintained in an accurate parallelism with the surface of the receiving member 3. It was difficult to match. FIG.
(B) shows a state after the cutter 1 is newly set. Even if the cutting edge 1a of the cutter 1 is aligned along the surface of the tape receiver, the position of the cutting edge 1 is likely to shift when the bolt 6 is tightened for fixing, and as shown in FIG. And the surface of the tape receiver 3 cannot be kept parallel.

If the parallelism is not properly maintained, an accurate notch C cannot be formed.
That is, when the ACF 2a is not completely cut,
Notch defects such as excessive cutting of the base tape 2b occur. As described above, when a notch defect due to a poor mounting accuracy of the cutter occurs, the ACF 2a
This causes problems such as malfunction of sticking to the work.

Accordingly, the present invention provides a device for attaching a laminated tape for bonding electronic parts, wherein a notch of a predetermined depth can be reliably formed in an adhesive layer laminated on a base tape by maintaining the mounting accuracy of a cutter. An object of the present invention is to provide a method for forming a notch in a laminated tape for bonding electronic components.

[0009]

According to a first aspect of the present invention, there is provided an apparatus for attaching a laminated tape for bonding an electronic component, the supply reel being configured to wind the laminated tape for bonding an electronic component in which an adhesive layer for bonding an electronic component is laminated on a base tape. A notch forming section for cutting the adhesive layer of the laminated tape drawn out from the supply reel, a pressure bonding head which is located downstream of the notch forming section and presses and sticks the adhesive layer to the work, and an adhesive layer. A collecting unit for collecting the separated base tape, and a bonding device for an electronic component bonding laminated tape including a positioning unit that positions the work relative to the pressure bonding head,
The notch forming portion cuts the adhesive layer by receiving and receiving the back surface of the base tape, a cutter provided with the cutting edge opposed to the receiving member, and moving the cutter forward and backward with respect to the receiving member. The cutter driving means, the cutter position adjusting means for adjusting the position of the cutter with respect to the receiving member, and the magnetizing means for magnetizing the receiving member to attract the cutting edge of the cutter with a magnetic force.

According to a second aspect of the present invention, there is provided a method for forming a notch in a laminated tape for bonding an electronic component, wherein the laminated tape for bonding an electronic component, in which an adhesive layer for bonding an electronic component is laminated on a base tape, is pulled out from a supply reel, and a receiving member is provided. After the notch is made in the adhesive layer by advancing the cutter against the laminated tape that has received the back of the base tape, the adhesive layer is attached to the work by pressing the pressure bonding head against the base tape. Prior to this, the cutting edge of the cutter is attracted to the receiving member magnetized by the magnetizing means to adjust the parallelism of the cutting edge to the surface of the receiving member, and to adjust the depth of the notch formed in the adhesive layer. .

[0011]

According to the first aspect of the present invention, when the cutter is replaced, the cutting edge of the cutter is attracted to the receiving member magnetized by the magnetizing means to adjust the position of the cutter and the receiving member. The parallelism of the surface of the receiving member is ensured, a notch of a predetermined depth can be reliably formed in the adhesive layer, and the adhesive layer can be securely attached to the work.

Further, according to the method for forming the cutout of the laminated tape for bonding electronic parts according to the second aspect, when the cutter is replaced, the cutting edge of the cutter is attracted to the receiving member magnetized by the magnetizing means so that the cutter and the receiving member are separated. Since the position adjustment is performed, the parallelism between the cutter and the surface of the receiving member is ensured, and the notch having a predetermined depth can be reliably formed in the adhesive layer.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an apparatus for bonding a laminated tape for electronic component bonding according to an embodiment of the present invention, FIG. 2 is a plan view of a cutout forming portion of the apparatus for bonding a laminated tape for electronic component bonding, and FIG. 4, 5, 6, and 7 are front views of the notch forming portion of the electronic component bonding laminated tape attaching device, and FIG. 8A, FIG. (B), (c), (d) is a partial plan view of the notch forming part of the device for bonding the electronic component bonding laminated tape.

First, the structure of an apparatus for attaching a laminated tape for bonding electronic components will be described with reference to FIG. Reference numeral 11 denotes a main body frame on which elements described below are provided. 13
Denotes a supply reel on which an ACF tape 2 which is a laminated tape for bonding electronic components is wound. ACF tape 2
An ACF 2a, which is an adhesive layer for bonding electronic components, is laminated on a base tape 2b. On the side of the supply reel 13, a roller 14 for pulling out the tape is provided. The roller 14 is driven by a tape pulling motor. Guide rollers 17, 18, and 19 are provided to the left and below the roller 14.

[0015] Between the roller 14 and the guide roller 17,
A tension generator 20 made of a transparent bottomed rectangular parallelepiped is provided. The bottom of the tension generator 20 is connected to a suction device, and the tension generator 20 is pulled by sucking the inside of the tension generator 20.
A predetermined tension is applied to the internally suspended ACF tape 2.
The notch forming part 12 is provided between the guide rollers 17 and 18. The cutter 1 of the notch forming part 12 cuts the notches C at predetermined intervals in the ACF 2 a of the ACF tape 2 supported by the receiving member 24. This notch forming part 1
Details of 2 will be described later.

A movable table 26 is provided below the main body frame 11. The movable table 26 has a motor M
It comprises an X table 26A driven by x and a Y table 26B driven by the motor My. A substrate holder 27 is placed on the Y table 26B, and a substrate 28 as a work is placed on the substrate holder 27. When the movable table 26 is driven, the substrate 28 moves in an arbitrary direction in a horizontal plane, and its position is adjusted. That is, the movable table 26 serves as a positioning portion that positions the substrate 28 relative to a pressure bonding head (described later).

A pressure bonding head 30 is provided between the guide rollers 18 and 19. Crimping head 30 is cylinder 3
It is connected to one rod 31a. When the rod 31a of the cylinder 31 protrudes and retracts, the pressure bonding head 30 moves up and down. The pressure bonding head 30 applies the ACF tape 2 to the substrate 28
And the ACF 2a is attached to the substrate 28.

Above the guide roller 19, a feed amount detecting roller 32 and a receiving roller 33 are arranged side by side, and further above the tape feed roller 37 and a clamp roller 38. The clamp roller 38 has a spring 39
To press the base tape 2b against the tape feed roller 37. The base tape 2b is guided by these rollers to form a tape take-up reel 4 which is a collection unit of the base tape.
Wound to zero. Reference numeral 41 denotes a base tape peeling pin, which is horizontally driven by a motor and strips only the base tape 2b from the ACF tape 2 pressed against the substrate 28.

Next, the notch forming portion 12 will be described with reference to FIGS. 2 and 3,
Reference numeral 50 denotes a support plate, and the main body frame 11 (FIG. 1)
Mounted on the front of the. A guide rail 51 is provided on the upper surface of the support plate 50.
, A slide guide 52 is slidably fitted. The slide guide 52 is mounted on the lower surface of the mounting plate 53 of the cutter 1. The mounting plate 53 has a screw hole 55. The cutter 1 sandwiched between the holding block 54 and the mounting plate 53 is fixed by tightening a bolt 56 screwed into the screw hole 55.

On the upper surface of the support plate 50, a cylinder 23 serving as a cutter driving means is provided.
Is connected to the mounting plate 53. Therefore, when the rod 23a of the cylinder 23 protrudes and retracts, the cutter 1 fixed to the mounting plate 53 moves forward and backward. In the forward direction of the cutter 1, the cutting edge 1 of the cutter 1
The receiving member 24 is disposed so as to face the position a. The receiving member 24 is made of a rectangular block-shaped magnetic metal, and has a flat surface facing the cutter 1.
The receiving member 24 has a magnet 2 as a magnetizing means.
6 are buried. By moving the cutter 1 forward and backward with respect to the receiving member 24, a notch C is formed in the ACF tape 2 whose back surface is supported by the receiving member 24. Cutter 1
The cutting edge 1a is linear in the width direction of the ACF tape 2.

A bracket 57 is mounted on a side surface of the mounting plate 53. A micrometer head 58 is mounted on the bracket 57. Therefore,
When the mounting plate 53 is driven by the cylinder 23 to move forward and backward, the micrometer head 58 also moves forward and backward. A stopper block 59 is provided on the upper surface of the support plate 50 in the direction in which the micrometer head 58 advances. When the micrometer head 58 moves forward, the tip 58 a of the micrometer head 58 comes into contact with the side surface of the stopper block 59.

By rotating the micrometer head 58 to change the protruding length of the tip 58a, it is possible to change the stop position when the mounting plate 53 moves forward, and hence when the cutter 1 moves forward. That is, the position of the cutter 1 with respect to the receiving member 24 can be adjusted by adjusting the protruding length of the distal end portion 58a of the micrometer head 58, and the micrometer head 58 and the stopper block 59 are provided with cutter position adjusting means. Has become.

The ACF pasting apparatus has the above-described configuration, and the operation of the ACF pasting apparatus will be described below. In FIG. 1, first, the ACF tape 2 wound on the supply reel 13 is pulled out by a pull-out roller 14, and the ACF 2 of the ACF tape 2 is
A notch C is formed in the portion a. Then, the ACF tape 2 of a required length is attached by the tape feed roller 37.
Is sent, and the notch C is formed in the ACF tape 2 again. The notch C is aligned with the edge position 30a on the upstream side of the pressure bonding head 30, which is a reference position for alignment. In addition, the movable table 26 is driven in parallel with this,
The substrate 28 is positioned below the pressure bonding head 30. FIG.
The notch C is formed in this manner, and the notch C
2 shows a state in which the positioning of the substrate 28 and the positioning of the substrate 28 are completed.

Next, the pressure bonding head 30 is lowered, and the ACF tape 2 is pressed against the substrate 28 as shown in FIG.
F2a is attached to the surface of the substrate 28. Next, the crimping head 3
When 0 rises, the tape peeling pin 41 moves horizontally in the direction shown by the arrow b as shown in FIG. 6, and peels off the base tape 2b from the ACF tape 2 that has been pasted. Next, as shown in FIG. 7, the tape peeling pin 41 moves horizontally in the direction indicated by the arrow c and returns to the original position, and the attaching operation of the ACF 2a is completed.

Next, the ACF is formed by the notch forming portion 12.
A method for forming the notch C in the tape 2 will be described with reference to FIG. First, the replacement of the cutter 1 will be described. In FIG. 8A, the rod 23a of the cylinder 23
Project in the direction of arrow d, and the mounting plate 53 is in a state of being advanced. The used cutter 1 is removed from between the mounting plate 53 and the holding block 54, and the bolt 56 is in a loosened state. In this state, a new cutter 1 for replacement is sandwiched between the mounting plate 53 and the holding block 54 and mounted as shown in FIG.

Next, as shown in FIG.
The position of the cutting edge 1a is adjusted with respect to the surface of the receiving member 24. At this time, since the magnet 26 is embedded in the receiving member 24 and the surface is magnetized, the cutting edge 1a of the cutter 1 is automatically attracted to the flat surface of the receiving member 24 by the magnetic force, thereby the cutting edge 1a of the cutter 1 Is completely parallel to the surface of the receiving member 24. Then, in this state, the bolt 56
And tighten the cutter 1 to the plate 5
3 and the holding block 54 so as to be fixed.
At this time, since the cutting edge 1a of the cutter 1 is attracted to the flat surface of the receiving member 24 by magnetic force, the cutting edge 1a of the cutter 1 and the receiving member 24 are tightened by tightening the bolt 56.
The parallelism with the surface does not shift.

Next, the position of the cutter 1 with respect to the receiving member 24 is adjusted. In the state shown in FIG. 8C, that is, in a state where the cutter 1 is newly replaced and the cutting edge 1a of the cutter 1 is in contact with the flat surface of the receiving member 24, the rod 23a of the cylinder 23 is in a protruding state. The tip 58 a of the micrometer head 58 is in contact with the stopper block 59. In this state, when the micrometer head 58 is rotated so that the tip end portion 58a of the micrometer head 58 slightly protrudes, a slight gap between the cutter 1 and the receiving member 24 as shown in FIG. A clearance δ occurs.

The micrometer head 58 is rotated while reading the scale so that the clearance δ becomes equal to the desired remaining thickness of the base tape 2b. As a result,
The rod 23 a of the cylinder 23 performs a projecting operation, and the tip end 58 a of the micrometer head 58 is
9, the cutting edge 1a of the cutter 1 and the receiving member 2
The position of the cutter 1 is adjusted so as to maintain a desired clearance δ from the surface of the cutter 4.

The notch C is formed by the cutter 1 mounted while maintaining the clearance δ and the parallelism with the receiving member 24 as described above. That is, when the cylinder 23 is driven to advance the cutter 1 with respect to the ACF tape 2 received by the receiving member 24, the notch C is formed except for the base tape 2b corresponding to the clearance δ. In this case, since the parallelism of the cutting edge 1a of the cutter 1 is accurately maintained, the notch shortage where the portion of the ACF 2a is not completely cut out or the base tape 2
No notch defect such as excessive notch that the notch C excessively extends to the part b does not occur.

The present invention is not limited to the above embodiment. For example, in the above embodiment, the magnet 26 is embedded in the receiving member 24.
By magnetizing the surface of the cutting member 1, the cutting edge 1 a of the cutter 1 may be attracted by magnetic force. For example, a magnet 26 may be attached to the back of the receiving member 24, or the magnet 26 itself may be used as the receiving member 24. It may be used. Further, in the above embodiment, the cutter 1 is mounted singly on the mounting plate 53, but a plurality of cutters 1 may be mounted on the upper surface and the lower surface of the mounting plate 53 one by one. It is.

[0031]

According to the present invention, the position of the cutter and the receiving member is adjusted by adsorbing the cutting edge of the cutter to the receiving member magnetized by the magnetizing means when replacing the cutter for forming the notch in the laminated tape for bonding electronic components. This ensures that the cutter and the surface of the receiving member are parallel, and that a notch with a predetermined depth can be reliably formed in the adhesive layer portion laminated on the base tape. Adhesive layer can be attached. In addition, since the cutter is automatically attracted to the surface of the receiving member by the magnetic force, an adjustment operation requiring precision when replacing the cutter is simplified, and the cutter can be replaced quickly.

[Brief description of the drawings]

FIG. 1 is a front view of an apparatus for bonding a laminated tape for bonding electronic components according to an embodiment of the present invention.

FIG. 2 is a plan view of a notch forming portion of the device for bonding a laminated tape for bonding electronic components according to an embodiment of the present invention.

FIG. 3 is a side view of a notch forming portion of the device for bonding a laminated tape for bonding electronic components according to an embodiment of the present invention.

FIG. 4 is a front view of an apparatus for attaching a laminated tape for bonding electronic components according to an embodiment of the present invention;

FIG. 5 is a front view of an apparatus for attaching a laminated tape for bonding electronic components according to an embodiment of the present invention.

FIG. 6 is a front view of a device for attaching a laminated tape for bonding electronic components according to an embodiment of the present invention;

FIG. 7 is a front view of a device for attaching a laminated tape for bonding electronic components according to an embodiment of the present invention;

FIG. 8 (a) is a partial plan view of a cutout forming portion of an apparatus for bonding an electronic component bonding tape according to an embodiment of the present invention; and (b) an electronic component bonding tape according to an embodiment of the present invention. (C) Partial plan view of a notch forming part of the bonding device for an electronic component bonding laminated tape according to one embodiment of the present invention (c) One embodiment of the present invention Plan view of a notch forming portion of a bonding device for a laminated tape for bonding electronic components in a form

9A is a partial front view of a notch forming portion of a conventional electronic component bonding tape for bonding a laminated tape, and FIG. 9B is a partial plan view of a notch forming portion of a conventional electronic component bonding tape for bonding a laminated tape.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 cutter 2 ACF tape 2a ACF (adhesive layer) 2b base tape 3 receiving member 11 main body frame 12 notch forming part 13 supply reel 14 draw-out roller 23 cylinder (cutter driving means) 24 receiving member 26 magnet (magnetizing means) 27 movable Table (positioning part) 28 Substrate (work) 30 Crimping head 31 Cylinder 37 Tape feed roller 40 Take-up reel C Notch

Claims (2)

[Claims] 1. A supply reel for winding a laminated tape for bonding an electronic component obtained by laminating an adhesive layer for bonding an electronic component to a base tape, and a notch for cutting the adhesive layer of the laminated tape pulled out from the supply reel. Notch forming part, a pressure bonding head that is located downstream of the notch forming part and presses the adhesive layer against the work, and a collecting part that collects the base tape from which the adhesive layer has been peeled off, And a positioning portion for relatively positioning the electronic component bonding tape, wherein the notch forming portion receives the back surface of the base tape, and the cutting edge faces the receiving member. The cutter provided, cutter driving means for making a cut in the adhesive layer by moving the cutter forward and backward with respect to the receiving member, and adjusting the position of the cutter with respect to the receiving member. A cutter position adjusting means receives electronic component adhesive laminate tape joining apparatus for the cutting edge of the cutter, characterized in that it consists magnetizing means for adsorbing magnetically by magnetizing the members. 2. A laminated tape for bonding an electronic component, in which an adhesive layer for bonding an electronic component is laminated on a base tape, is pulled out from a supply reel, and the cutter is advanced with respect to the laminated tape on which the back surface of the base tape is received by a receiving member. After the notch is made in the adhesive layer, the cutting edge of the cutter is fixed to the receiving member magnetized by the magnetizing means before executing the attaching step of attaching the adhesive layer to the work by pressing the pressure bonding head against the base tape. A notch forming method for a laminated tape for bonding electronic components, wherein the degree of parallelism of a cutting edge with respect to the surface of a receiving member is adjusted by suction, and the depth of a notch formed in an adhesive layer is adjusted.