200848346 九、發明說明： 【發明所屬之技術領域】 本發明係關於歸膜_裝置、具有其之接著膜黏貼設 備、及使用其之接著膜切割方法及黏貼方法，更加詳細而 言，係關於防止切斷錯誤之接著膜切割裝置、具有其之接 著膜黏貼設備、及使用其之接著膜切割方法及黏貼方法。 【先前技術】 -般而言’液晶顯示裝置具有較薄較輕、消耗電力較小 之優點，主要用於監視器、筆記型電腦、行動電話等中。 此種液晶顯示裝置包含利用液晶之光透過性而顯示圖像之 液晶顯示面板、及西己置於上述液晶㈣面板之下部且對上 述液晶顯示面板提供光之背光模組組裝。 上述液晶顯示面板包含：形成有薄膜電晶體及像素電極 之第1基板；與上述第1基板對向且形成有彩色濾光片及共 通電極之第2基板；介入於上述第丨基板與第2基板之間之 液晶層；及與上述第1基板電性連接且控制上述薄膜電晶 體之可撓性電路基板。 一般而言，上述可撓性電路基板之焊墊部使用包含導電 球之各向異性導電膜且與上述第i基板之焊墊部電性連 接。具體而言，藉由各向異性導電膜黏貼設備將上述各向 異性導電膜黏貼於上述第i基板之焊墊部上後，於上述各 向異性導電膜上黏貼上述可撓性電路基板之焊墊部。 另一方面，上述各向異性導電膜一般以如下方式提供， 即，於一面上黏貼有異形膜之狀態下，捲為滾筒形態。因 123758.doc 200848346 =’為使上述各向異性導電膜黏貼於上述第1基板之焊墊 部上，有時必須切斷上述各向異性導電膜而去除一部分。 上述各向異性導電膜黏貼設備必須包含上述各向異性 導電膜切割裝置。 先前之上述各向異性導電膜切割裝置採用膜切割機於垂 直於上述各向異性導電膜之方向上移動而切斷上述各向里 性導電膜之方法。此時，一般而言，上述各向異性導電膜 切割裝置進而需要擋止單元，該擋止單元之作用在於使上 述膜切割機並不切斷上述異形膜而可選擇性地僅切斷上述 各向異性導電膜。 然而，一般而言，上述膜切割機於上述垂直方向上移動 而切斷上述各向異性導電膜時’上述擋止單元會碰撞至用 :固定上述各向異性導電膜之固定板。此種由於上述擋止 早兀及上述固定板之碰撞而產生之衝擊有時會磨損上述擋 止單元或改變上述擋止單元之位置，因此，存在使利用上 述膜切割機切割上述各向異性導電膜所產生之切割深度發 生變化，從而產生切斷錯誤之擔憂。 【發明内容】 [發明所欲解決之問題] 因此，本發明之技術課題係為解決上述先前之問題點， 本發明之第1目的在於提供一種用以防止由於切斷接著膜 時之衝擊而產生之切斷錯誤的接著膜切割裝置。 本發明之第2目的在於提供一種具有上述接著膜切割裝 置之接著膜黏貼設備。 123758.doc 200848346 本發:月之第3目的在於提供一種使用上述接著膜切割裝 置之接著膜切割方法。 :::之第4目的在於提供一種使用上述接著膜切割設 備之接者膜黏貼方法。 [解決問題之技術手段] 用以實現上述^目的之本發明一實施形態之接著臈切 割裝置包含捲筒膜吸附單元及接著膜切割單元。 、 捲2捲筒膜吸：單元吸附包含接著膜及異形膜兩疊層之 3 、上述接者膜切割單元將上述接著膜自上 之-側向另_侧㈣。 按者膜 上述接著膜切割單元可包含：膜切割部，其具有於_方 1=形Γ之切割負載及結合於上述切割負載之端部的 H機，切割負載支持部，其與上述切割負載結合，支 二ίΓ載;及水平移送部，其與上述切割負載支持 σ〜了精由上述膜切割機切斷接著膜，使上述膜切 割部朝向上述接著膜於水平方向上移送。吏切 早μ、+、始丄 {夕k 此處，較理想的 述膜切割部以將上述接著膜於2處 成對且平行配置。 ⑼時切斷之方式形 且二膜切割單元進而可包含:水平導引部，其 滾筒：二？者膜平行之導引面；及具有導引負載及導引 結合，且於上、f “ 負載係與上述切割負載支持部 導引負= 延長形成’該導引滾筒係與上述 mrr 一邊接觸上述導引面一邊旋轉而沿著自上 。上述另一側之方向導引上述膜切割機。 123758.doc 200848346 又，上述接著膜切割單元進而 部’其結合於上述切割負載，。3 .垂直間隔調節 弓I畜恭夕“ 戰n周即上述切割負載與上述導 於之“彳向的間隔；及垂直間隔彈性部，1配 置於上述切割負載與上述-配 及上述導引負載施加垂直方向之m，對上相割負載 又署上述接著膜切割單元進而可包含垂直密著彈性部， ，、配置於上述切割負載支持部與上述水平移送部之間，以200848346 IX. Description of the Invention: [Technical Field] The present invention relates to a film-forming device, an adhesive film-attaching device having the same, and an adhesive film cutting method and a pasting method using the same, and more particularly, The film cutting device with the cutting off, the film bonding device having the same, and the film cutting method and the bonding method using the same. [Prior Art] In general, a liquid crystal display device has advantages of being thinner and lighter and consumes less power, and is mainly used in monitors, notebook computers, mobile phones, and the like. Such a liquid crystal display device includes a liquid crystal display panel that displays an image by light transmittance of a liquid crystal, and a backlight module that is placed under the liquid crystal (four) panel and that supplies light to the liquid crystal display panel. The liquid crystal display panel includes: a first substrate on which a thin film transistor and a pixel electrode are formed; a second substrate on which the color filter and the common electrode are formed to face the first substrate; and the second substrate and the second substrate are interposed a liquid crystal layer between the substrates; and a flexible circuit board electrically connected to the first substrate and controlling the thin film transistor. Generally, the pad portion of the flexible circuit board is electrically connected to the pad portion of the i-th substrate by using an anisotropic conductive film including a conductive ball. Specifically, after the anisotropic conductive film is adhered to the pad portion of the i-th substrate by an anisotropic conductive film bonding apparatus, the flexible circuit substrate is adhered to the anisotropic conductive film. Pad section. On the other hand, the anisotropic conductive film is generally provided in such a manner that it is wound into a roll form in a state in which a deformed film is adhered to one surface. In order to adhere the anisotropic conductive film to the pad portion of the first substrate, it is necessary to cut the anisotropic conductive film and remove a part thereof. The above anisotropic conductive film bonding apparatus must include the above anisotropic conductive film cutting device. The above-described anisotropic conductive film cutting device is a method in which the above-mentioned respective inward conductive films are cut by a film cutter moving in a direction perpendicular to the anisotropic conductive film. In this case, in general, the anisotropic conductive film cutting device further requires a stopper unit that functions to selectively cut only the above-described each of the film cutters without cutting the irregular film. Anisotropic conductive film. However, in general, when the film cutter moves in the vertical direction to cut the anisotropic conductive film, the stopper unit collides with a fixing plate for fixing the anisotropic conductive film. Such an impact due to the collision of the above-mentioned stopper and the above-mentioned fixing plate sometimes wears the above-mentioned stopper unit or changes the position of the stopper unit, and therefore, the anisotropic conduction is cut by the above-mentioned film cutter. The depth of the cut produced by the film changes, causing a concern of cutting off errors. [Problem to be Solved by the Invention] Therefore, the technical problem of the present invention is to solve the above-mentioned problems. A first object of the present invention is to provide a method for preventing occurrence of an impact due to cutting of a film. The erroneous follow-up film cutting device is cut. A second object of the present invention is to provide an adhesive film bonding apparatus having the above-described adhesive film cutting device. 123758.doc 200848346 The third object of the present invention is to provide an adhesive film cutting method using the above-described adhesive film cutting device. The fourth object of ::: is to provide a method of bonding a film using the above-described adhesive film cutting device. [Means for Solving the Problem] The squeezing apparatus according to the embodiment of the present invention for achieving the above object includes a roll film adsorption unit and an adhesive film dicing unit. The roll 2 film suction: the unit adsorption comprises a laminate of the adhesive film and the shaped film 3, and the above-mentioned film cutting unit applies the above-mentioned adhesive film from the upper side to the other side (four). The film-forming unit may include: a film cutting portion having a cutting load of _ square 1 = shape and a H machine coupled to the end of the cutting load, a cutting load support portion, and the cutting load And a horizontal transfer portion that is cut by the film cutter and cut into a film by the horizontal load transfer unit, and the film cut portion is transferred in the horizontal direction toward the adhesive film.吏 μ μ μ μ 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕 夕(9) The mode of cutting off and the two-film cutting unit may further comprise: a horizontal guiding portion, and a roller: two? The guide film is parallel to the guiding surface; and has a guiding load and a guiding combination, and the upper, f "loading system and the cutting load supporting portion guide negative = extended formation", the guiding roller system is in contact with the above mrr side The guide surface is rotated while being guided from the upper side to the other side of the film cutter. 123758.doc 200848346 Further, the above-mentioned film-cutting unit is further combined with the cutting load, 3. Vertical interval Adjusting the bow I 恭 “ " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " And the upper film cutting unit further includes a vertical adhesion elastic portion, and is disposed between the cutting load supporting portion and the horizontal transfer portion,
=述導引滾筒密著於上述導引面之方式而對上述切割負 載支持部施加垂直方向之彈性力。 用以實現上述第2目的之一實施形態之接著膜黏貼設備 包含：捲筒膜供給滾筒、捲筒膜收納滾筒、接著膜切割裝 置、基板支持台及加壓單元。 ★上述捲筒膜供給㈣供給包含接著膜及異形膜兩層之捲 筒膜。上述捲筒膜收納滾筒離開上述捲筒膜供給滾筒且收 納上述捲筒膜。上述接著膜切割裝置配置於上述捲筒膜供= The elastic force of the vertical direction is applied to the cutting load supporting portion in such a manner that the guiding roller is adhered to the guiding surface. The film bonding apparatus for realizing one embodiment of the second object of the present invention includes a roll film supply roller, a roll film storage roller, a film cutting device, a substrate support table, and a pressurizing unit. ★ The above-mentioned web supply (4) is supplied with a roll film including two layers of a film and a film. The roll film storage drum is separated from the roll film supply drum and receives the roll film. The above-mentioned film cutting device is disposed on the roll film
給滚筒與上述捲筒膜收納滾筒之間，1包含吸附上述捲筒 膜之捲筒膜口及附單&、及將上述接|膜自i述接著膜之一 側向另一側切斷之接著膜切割單元。上述基板支持台配置 於上述接著膜切割裝置與上述捲筒膜收納滚筒之間，於與 上述捲筒膜對向之面配置基板。上述加壓單元以經由上述 捲茼膜而與上述基板支持台對向之方式配置，為將上述所 切斷之接著膜黏貼於上述基板而朝向上述基板加壓上述捲 筒膜。 又上述接者膜黏貼設備進而可包含輔助滾筒，其係為 123758.doc -10- 200848346 防止上述捲筒膜下垂 捲筒膜收納滾筒之間 而配置於上述捲筒臈供給滾筒與上述 H述第3目的之—實施形態之接著膜切割方法包 .配置包含接著膜及異形媒兩層之捲筒膜之步驟； 用接著膜切割單元將上述接著膜自上述接著膜一側向另一 側切斷之步驟。 上述接著膜切割方法進而可選擇性地包括·使用接著膜 去除單元將上述接著膜之切斷的—部分自上述㈣膜分離 之步驟。 用以實現上述第4目的之一實施形態之接著臈黏貼方法 =·㈣接著膜㈣單元將包含異形膜及接著膜兩層之 捲同Μ中之上述接著膜自上述接著膜之—側向另—側切斷 ，步驟’使用接著膜去除單元使所切斷之上述接著膜的一 部分自上述異形膜分離之步驟；及使用加壓單元使殘留於 述〃开y膜上之上述接著膜的其他部分黏貼於基板之步 驟。 此處’較理想的是上述接著膜切割單元包含於—方向上 長形成之切J負載及結合於上述切割負載之端部、且切 斷上述接著膜之膜切割機，上述膜切割機係以不旋轉之方 式而固定於上述切割負載之圓形切割機。 [發明之效果] 藉由此種本發明，膜切割機僅選擇性地將捲筒膜中之接 著膜自接著膜之一側向另一側切斷，藉此可防止由於切斷 接著膜時之衝擊而產生之切斷錯誤。 123758.doc 200848346 【實施方式】 以下，參照圖式更加詳細地說明本發明之較好實施形 態。 / <關於接著膜黏貼設備之實施形態> 圖1係概念性表示本發明一實施形態之接著膜黏貼設備 之圖式，圖2係放大表示圖丨之接著膜黏貼設備中的基板支 持台及加壓單元部位之圖式，圖3係概念性表示圖1之接著 膜黏貼設備中加壓單元加壓捲筒膜之狀態的圖式，圖4係 詳細表示圖3之加壓單元加壓捲筒膜之狀態的圖式，圖$係 詳細表示圖4之加壓單元加壓捲筒膜後之狀態的圖式。 參照圖1、圖2、圖3、圖4及圖5，本實施形態之接著膜 黏貼設備1000包含捲筒膜供給滾筒1〇〇、捲筒膜收納滾筒 200、接著膜切割裝置3〇〇、基板支持台4〇〇及加壓單元 500，進而可選擇性包含辅助滾筒6〇〇。 於捲筒膜供給滾筒100捲取包含異形膜1〇及接著膜2〇該2 層之捲筒膜30，捲筒膜供給滾筒ι〇〇供給用以使接著膜2〇 黏貼於基板50所需之捲筒膜3〇。 作為一例，此處，接著膜20係於接著物質内介入有複數 個導電球22之各向異性導電膜。較理想的是異形膜1〇具有 易於自接著膜20分離之性質，且包含用以防止分離時所產 生之靜電的抗靜電層。另一方面，較理想的是異形膜1〇之 厚度約為50 μηι，接著膜20之厚度約為45 μιη。 捲筒膜收納滾筒200與捲筒膜供給滚筒1〇〇隔離而配置， 收納自捲筒膜供給滾筒1〇〇所供給之捲筒膜3〇。即，捲筒 123758.doc -12- 200848346 膜供給滾筒100於一方向上旌赭；似η 轉而ί、，、、ό捲筒膜3 〇，捲筒膜 收納滾筒200於上述方向上旋轉 W 收納進仃後述切斷及分 離之捲筒膜3 0 ’藉此加以回收。 接著膜切割裝置3〇〇配置於捲筒膜供給滾筒⑽及捲筒膜 收納滾筒之間。接著膜切割裝置3〇〇僅選擇性地切斷捲 筒膜对之接著膜20,將所切斷之接著膜2q的—部分自里 形膜分離去除。其結果為，於接著膜2Q上形成切斷槽Μ。Between the feed roller and the roll film storage roller, 1 includes a roll film opening and a sticker & for adsorbing the roll film, and cutting the film from one side of the film to the other side. This is followed by a film cutting unit. The substrate supporting table is disposed between the adhesive film cutting device and the roll film storage roller, and a substrate is disposed on a surface facing the roll film. The pressurizing unit is disposed to face the substrate supporting table via the winding film, and presses the rolled film toward the substrate by adhering the cut adhesive film to the substrate. Further, the above-mentioned film-adhesive device may further include an auxiliary roller, which is 123758.doc -10- 200848346, which is disposed between the reel film storage drum and the reel supply roller and the H-described A third embodiment of the present invention is a film-cutting method package comprising: a step of arranging a roll film comprising two layers of an adhesive film and a shaped medium; and cutting the adhesive film from the side of the adhesive film to the other side by an adhesive film cutting unit The steps. The above-mentioned film-cutting method may further optionally include a step of separating the portion of the film which is cut by the film-removing unit from the film (4). a bonding method for achieving the above-described fourth object of the fourth aspect of the present invention: (4) a film (4) unit comprising the above-mentioned bonding film in the same layer of the film comprising the irregular film and the bonding film from the side of the bonding film - side cutting, step 'using a film removing unit to separate a portion of the cut film from the irregular film; and using a pressurizing unit to cause the remaining film remaining on the y film The step of partially adhering to the substrate. Here, it is preferable that the above-mentioned film cutting unit includes a cutting J load formed in a long direction and a film cutting machine bonded to an end portion of the cutting load and cutting the bonding film, wherein the film cutting machine is A circular cutter fixed to the above cutting load without rotating. [Effects of the Invention] With the present invention, the film cutter selectively cuts only the adhesive film in the roll film from one side of the adhesive film to the other side, thereby preventing the film from being cut due to the film. The cut-off caused by the impact. 123758.doc 200848346 [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the drawings. / <Embodiment of Adhesive Film Adhesive Apparatus> Fig. 1 is a conceptual view showing an adhesive film sticking apparatus according to an embodiment of the present invention, and Fig. 2 is an enlarged view of a substrate support table in the adhesive film sticking apparatus of Fig. FIG. 3 is a view conceptually showing a state of a pressurizing unit of a pressurizing unit in the film bonding apparatus of FIG. 1, and FIG. 4 is a detailed view showing pressurization of the pressurizing unit of FIG. The figure of the state of the roll film, Fig. $ is a figure which shows the state of the press unit of the press unit of FIG. Referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4 and Fig. 5, the film bonding apparatus 1000 of the present embodiment includes a roll film supply roll 1〇〇, a roll film storage roll 200, and a film cutting device 3, The substrate support table 4 and the pressurizing unit 500 may further include an auxiliary roller 6〇〇. The roll film 30 containing the shaped film 1 〇 and the film 2 〇 is wound on the roll film supply roller 100, and the roll film supply roll 〇〇 is supplied to feed the adhesive film 2 于 to the substrate 50. The roll film is 3 inches. As an example, here, the film 20 is an anisotropic conductive film in which a plurality of conductive balls 22 are interposed in a subsequent substance. It is desirable that the shaped film 1 has a property of being easily separated from the adhesive film 20, and contains an antistatic layer for preventing static electricity generated upon separation. On the other hand, it is desirable that the thickness of the shaped film 1 约为 is about 50 μm, and then the thickness of the film 20 is about 45 μm. The roll film storage drum 200 is disposed apart from the roll film supply roll 1〇〇, and is housed in the roll film 3〇 supplied from the roll film supply roll 1〇〇. That is, the reel 123758.doc -12- 200848346 is supplied with the film supply roller 100 in one direction; like η, 、, ό, ό reel film 3 〇, the reel film accommodating drum 200 is rotated in the above direction W accommodating The roll film 3 0 ' which has been cut and separated, which will be described later, is recovered. Next, the film cutting device 3 is disposed between the roll film supply roll (10) and the roll film storage roll. Next, the film cutting device 3 〇〇 selectively cuts only the film of the film to the film 20, and separates the portion of the film 2q which is cut off from the inner film. As a result, a cut groove is formed on the adhesive film 2Q.
具體而言’接著膜切割裝置鳩將接著膜2()自接著膜2〇 之-側向另-側切斷j_去除。較理想的是接著膜切割裝置 3〇〇於垂直於捲筒膜3〇之長度方向的方向上切斷去除接著 膜20。另一方面，使用其他圖式於後述中更加詳細地說明 接著膜切割裝置300。 基板支持台400配置於接著膜切割裝置3〇〇與捲筒膜收納 滾筒200之間，作為一例，將其配置於捲筒膜3〇之下方。 於基板支持台400之與捲筒膜3〇對向之面上配置基板5〇。 此時，較理想的是，基板50藉由基板移送單元（未圖示）而 裝載於基板支持台400上，進而，自基板支持台4〇〇上卸 載。 加壓單元500經由捲筒膜30而配置於對向於基板支持台 4〇〇之位置。將加壓單元5〇〇以對向於基板支持台4〇〇之方 式而配置於捲疴膜3〇之上方作為一例。加壓單元5〇〇朝向 基板支持台400而加壓捲筒膜30，將接著膜20之殘留之其 他部分20b黏貼於配置於基板支持台400之基板5〇上。其結 果為’接著膜20之其他部分20b黏貼於基板50之焊墊部52 123758.doc -13 - 200848346 上。 輔助滾同600係為防止捲筒膜3〇下垂而配置於捲筒膜供 給滾筒100與捲筒膜收納滾筒2〇〇之間。即，輔助滾筒6〇〇 對捲筒膜30提供張力，從而防止捲筒膜3〇由於重量而下 垂。Specifically, the film cutting device 接着 subsequently removes the film 2 () from the side of the film 2 to the other side. It is preferable that the film-cutting device 3 is cut off to remove the adhesive film 20 in a direction perpendicular to the longitudinal direction of the roll film 3〇. On the other hand, the film cutting device 300 will be described in more detail later, using other drawings. The substrate support table 400 is disposed between the film cutting device 3 and the roll film storage drum 200, and is disposed below the roll film 3〇 as an example. The substrate 5 is placed on the surface of the substrate support table 400 opposite to the roll film 3A. At this time, it is preferable that the substrate 50 is mounted on the substrate supporting table 400 by a substrate transfer unit (not shown), and is further unloaded from the substrate supporting table 4A. The pressurizing unit 500 is disposed at a position facing the substrate support table 4 via the roll film 30. The pressing unit 5 is disposed above the winding film 3A in such a manner as to face the substrate supporting table 4A as an example. The pressurizing unit 5A presses the roll film 30 toward the substrate support table 400, and adheres the remaining portion 20b of the adhesive film 20 to the substrate 5A disposed on the substrate support table 400. The result is that the other portion 20b of the film 20 is adhered to the pad portion 52 123758.doc -13 - 200848346 of the substrate 50. The auxiliary roll 600 is disposed between the roll film supply roll 100 and the roll film storage roll 2 to prevent the roll film 3 from sagging. That is, the auxiliary roller 6 提供 provides tension to the reel film 30, thereby preventing the web film 3 from sagging due to weight.
輔助滾筒600包含供給側辅助滾筒6丨〇及收納側輔助滚筒 620。較理想的是供給側輔助滾筒6丨〇配置於捲筒膜供給滾 筒1〇〇及接著膜切割裝置300之間，且複數個平行地配置。 較理想的是收納側輔助滾筒62〇配置於基板支持台4〇〇與捲 同膜收納滾筒200之間，且複數個平行地配置。 另方面，接者膜黏貼設備1000進而可包含配置於接著 膜切割裝置300與基板支持台4〇〇之間之支持滚筒7〇〇。支 持滾筒700配置於接著膜切割裝置3〇〇與基板支持台4㈧之 間，防止捲筒膜30向下方下垂。 圖6係表不圖丨之接著膜黏貼設備中之接著膜切割裝置的 側視圖，圖7係表示圖6之接著膜切割裝置中之接著膜切割 單元切斷接著膜之狀態的側視圖，圖8係表示圖7之接著膜 切』單70切斷接著膜之狀態的正視圖，圖9係表示圖6之接 著膜切割裝置中之接著膜去除單元將所切斷之接著膜的一 :分自異形膜分離之狀態的側視圖，圖1〇係表示圖9之接 著，去除單元將所切斷之接著膜的—部分自異形膜分離之 狀悲的正視圖，圖u係表示使自圖ig所分離之接著膜的一 口P刀移動之狀態的側視圖。 參照圖6、圖7、圖8、圖9、圖10及圖11，本實施形態之 123758.doc -14- 200848346 接著膜切割裝置300包含捲筒膜吸附單元31〇、接著膜切割 單元320及接著膜去除單元330。 ' ° 捲筒膜吸附單元310配置於捲筒膜供給滾筒1〇〇與基板支 持台400之間，吸附包含異形膜及接著膜2〇該2層之捲筒膜 3〇。此時，捲筒膜吸附單元310與捲筒膜3〇中之異形膜1〇 接觸，且吸附異形膜1 〇。 於捲筒膜吸附單元310上形成用以吸附捲筒膜3〇之吸入 孔312。即，通過捲筒膜吸附單元31〇之吸入孔312而吸入 空氣，藉此將捲筒膜30吸附於捲筒膜吸附單元31〇之一面 3 10a 〇 另一方面，捲筒膜吸附單元310可包含導引突起3 14、第 1導引滾筒316及第2導引滾筒318。 導引突起314自捲筒膜吸附單元31〇之下表面31〇a向下方 突出’且以將捲筒膜30配置於上述下表面31〇a中央之方式 進行導引。第1導引滾筒316及第2導引滾筒318以相互對向 之方式配置於捲筒膜吸附單元31〇之兩端部，且以捲筒膜 3 0可順利地移動之方式進行導引。 接著膜切割單元320僅選擇性地切斷配置於捲筒膜吸附 單元310之下表面3 l〇a之捲筒膜30中的接著膜20。接著膜 切割單το 320將接著膜20自接著膜2〇之一側向另一側切 斷’較理想的是於垂直於捲筒膜3〇之長度方向的方向上切 斷接著膜20。 如此’藉由接著膜切割單元320切斷接著膜20之固定區 間’從而可以所去除之一部分20a及殘留之其他部分20b劃 123758.doc -15 - 200848346 分接著膜20。此時，較理想的是接著膜2〇之所去除的一部 分20a之長度約為20 mm。另一方面，後述中詳細說明接著 膜切割單元320。 接著膜去除單元330使接著膜20中所去除之一部分2〇a自 異形膜ίο分離。具體而言，接著膜去除單元33〇包含垂直 移動本體332及剝離帶334。 垂直移動本體332配置於捲筒膜吸附單元31〇之下方，於 配置於捲筒膜吸附單元310之下表面的捲筒膜3〇之下方於 垂直方向上往復移動。 剝離帶334以包圍對向於捲筒膜3〇之垂直移動本體332之 上表面之方式而配置。垂直移動本體332於捲筒膜3〇之下 方於垂直方向上往復移動時，剝離帶334使接著膜2〇之一 部分20a自異形膜10分離。又，為使接著膜2〇之一部分2〇a 於水平方向上移動，較理想的是剝離帶334可於垂直於垂 直移動本體332之移動方向的方向上移動。 接著’就接著膜切割單元3 2 0加以詳細說明。 本實施形態之接著膜切割單元320包含：膜切割部321、 切割負載支持部322、水平移送部323、水平導引部324、 切割導引部325、垂直間隔調節部326、垂直間隔彈性部 327及垂直密著彈性部328。 膜切割部321自接著膜20之一侧向另一側移動而切斷接 著膜20。具體而言，膜切割部321包含於一方向上延長形 成之切割負載32 la及結合於切割負載32 la之端部的膜切割 機321b 。 123758.doc •16- 200848346 較理想的是膜切割部321以將接著膜20於2處同時切斷之 方式形成對且平行配置。此處，一對膜切割部32〗同時切 斷接著膜20之2處時，可將接著膜2〇劃分為去除之一部分 2〇a及殘留之其他部分2〇b。與此不同，亦可為^固膜切割 部321往復移動2次而切斷接著膜2〇之2處。 較理想的是，膜切割機321b及捲筒膜吸附單元3 1〇之間 之垂直方向的隔離距離了與異形膜1〇之厚度相同、或者小 於異形膜10，從而以使所切斷之接著膜2〇的一部分完全地 分離。作為一例，上述隔離距離T大約為50 μιη以下。 膜切d機321 b之一例為圓形切割機，較理想的是此種圓 形切割機以不旋轉之方式固定於切割負載32u。其原因在 於，可旋轉地設置上述圓形切割機時，由於上述圓形切割 機旋轉，導致膜切割機321b與捲筒膜吸附單元31〇之間之 隔離距離T變動，從而存在接著膜20並未完全切斷之擔 憂0 另一方面，臈切割機3211?為圓形切割機時，經過特定時 間後使其僅旋轉固定角度而使用新刀4，藉此可提高膜切 d機32 lb i體之耐久性。即，上述圓形切割機複數次切斷 ，著膜2〇後，上述圓形切割機之刀尖會部分性變鈍。此 時，使上述圓形切割機僅旋轉固定角度，則將尚未變鈍之 上述圓形切割機之新刀尖用於接著膜2()之切斷。 切割負載支持部322與切割負载321a結合，且支持切割 負載321&。較理想的是切割負載支持部322與切割負載 32U結合，且於垂直於切割負載321a之長度方向的方向上 123758.doc -17- 200848346 延長，作為一例，藉由結合螺釘等而與切割負載321a結 合0 ΓThe auxiliary drum 600 includes a supply side auxiliary drum 6A and a storage side auxiliary drum 620. Preferably, the supply-side auxiliary roller 6 is disposed between the roll film supply roller 1A and the film cutting device 300, and a plurality of them are arranged in parallel. Preferably, the storage-side auxiliary roller 62 is disposed between the substrate support table 4 and the roll-to-film accommodation drum 200, and a plurality of them are arranged in parallel. On the other hand, the film bonding apparatus 1000 may further include a supporting roller 7 disposed between the film cutting device 300 and the substrate supporting table 4A. The support roller 700 is disposed between the film cutting device 3 and the substrate support table 4 (eight) to prevent the roll film 30 from sagging downward. 6 is a side view showing the film-cutting device in the film-attaching device of the adhesive film-attaching device, and FIG. 7 is a side view showing the state in which the film-cutting unit of the film-cutting device of FIG. 8 is a front view showing a state in which the film is cut by a single film 70 in FIG. 7, and FIG. 9 is a view showing a film of the film which is cut by the film removing unit in the film cutting device of FIG. A side view of the state in which the self-shaped film is separated, and FIG. 1 is a front view showing the state in which the removing unit separates the portion of the film which is cut off from the shaped film, and FIG. A side view of the state in which the P-knife of the adhesive film separated by ig is moved. Referring to FIG. 6, FIG. 7, FIG. 8, FIG. 9, FIG. 10 and FIG. 11, the present embodiment, 123758.doc -14-200848346, the film cutting device 300 includes a roll film adsorption unit 31, followed by a film cutting unit 320, and The film removal unit 330 is then followed. The '° roll film suction unit 310 is disposed between the roll film supply roll 1〇〇 and the substrate support table 400, and adsorbs the roll film 3〇 including the irregular film and the film 2. At this time, the roll film adsorption unit 310 comes into contact with the irregular film 1〇 in the roll film 3, and adsorbs the shaped film 1〇. A suction hole 312 for adsorbing the roll film 3 is formed on the roll film adsorption unit 310. That is, air is taken in through the suction hole 312 of the roll film adsorption unit 31, whereby the roll film 30 is adsorbed to one side 3 10a of the roll film adsorption unit 31. On the other hand, the roll film adsorption unit 310 can be The guide protrusion 3 14 , the first guide roller 316 , and the second guide roller 318 are included. The guide projection 314 protrudes downward from the lower surface 31〇a of the roll film suction unit 31, and is guided so that the roll film 30 is disposed at the center of the lower surface 31〇a. The first guide roller 316 and the second guide roller 318 are disposed at opposite ends of the roll film suction unit 31A so as to face each other, and are guided so that the roll film 30 can smoothly move. Next, the film cutting unit 320 selectively cuts only the adhesive film 20 disposed in the roll film 30 of the lower surface 3 l〇a of the roll film adsorption unit 310. Next, the film-cutting single το 320 cuts the film 20 from one side of the film 2 to the other side. It is preferable to cut the film 20 in a direction perpendicular to the length direction of the film 3〇. Thus, by removing the fixing portion of the film 20 by the film cutting unit 320, one of the removed portions 20a and the remaining portion 20b can be separated by the film 20, 758, doc -15 - 200848346. At this time, it is preferable that a portion 20a which is removed by the film 2 is about 20 mm in length. On the other hand, the film-cutting unit 320 will be described in detail later. The film removing unit 330 then separates a portion 2〇a removed from the film 20 from the profile film ίο. Specifically, the film removal unit 33A includes a vertically moving body 332 and a peeling tape 334. The vertically movable body 332 is disposed below the roll film adsorption unit 31, and reciprocates in a vertical direction below the roll film 3〇 disposed on the lower surface of the roll film adsorption unit 310. The peeling tape 334 is disposed to surround the upper surface of the vertically movable body 332 opposed to the web 3 . When the vertically moving body 332 reciprocates in the vertical direction below the roll film 3, the peeling tape 334 separates a portion 20a of the film 2 from the film 10. Further, in order to move a portion 2〇a of the adhesive film 2 in the horizontal direction, it is preferable that the peeling tape 334 is movable in a direction perpendicular to the moving direction of the vertically moving body 332. Next, the film cutting unit 320 will be described in detail. The adhesive film cutting unit 320 of the present embodiment includes a film cutting portion 321, a cutting load supporting portion 322, a horizontal transfer portion 323, a horizontal guiding portion 324, a cutting guide portion 325, a vertical interval adjusting portion 326, and a vertical interval elastic portion 327. And a vertical adhesion elastic portion 328. The film cutting portion 321 is moved from one side of the adhesive film 20 to the other side to cut the film 20. Specifically, the film cutting portion 321 includes a cutting load 32 la which is formed to be elongated in one direction, and a film cutter 321b which is coupled to the end portion of the cutting load 32 la. 123758.doc • 16- 200848346 It is preferable that the film cutting portion 321 is formed in a parallel manner in such a manner that the film 20 is simultaneously cut at two places. Here, when the pair of film cutting portions 32 simultaneously cuts the two portions of the bonding film 20, the bonding film 2〇 can be divided into one portion 2〇a and the remaining portion 2〇b. On the other hand, the solid film cutting portion 321 can be reciprocated twice to cut the two portions of the film 2 . Preferably, the separation distance between the film cutter 321b and the roll film adsorption unit 3 1〇 in the vertical direction is the same as or smaller than the thickness of the shaped film 1〇, so that the cut-off is continued. A portion of the membrane 2〇 is completely separated. As an example, the separation distance T is approximately 50 μm or less. One example of the film cutting machine 321 b is a circular cutting machine, and it is preferable that such a circular cutting machine is fixed to the cutting load 32u without being rotated. The reason for this is that when the circular cutter is rotatably provided, the separation distance T between the film cutter 321b and the roll film adsorption unit 31 is changed due to the rotation of the circular cutter, so that the film 20 is attached. On the other hand, when the boring cutter 3211 is a circular cutter, the new knives 4 are used to rotate only a fixed angle after a certain period of time, thereby improving the membrane cutting machine 32 lb i The durability of the body. That is, the circular cutter is cut off a plurality of times, and after the film is wound 2, the tip of the circular cutter is partially dull. At this time, when the circular cutter is rotated only by a fixed angle, a new cutting edge of the above circular cutter which has not been blunt is used for the cutting of the film 2 (). The cutting load support portion 322 is combined with the cutting load 321a and supports the cutting load 321 & Preferably, the cutting load supporting portion 322 is coupled to the cutting load 32U and is extended in a direction perpendicular to the longitudinal direction of the cutting load 321a by 123758.doc -17-200848346, as an example, by combining a screw or the like with the cutting load 321a. Combined with 0 Γ
水平移送部323與切割負載支持部322結合，且將膜切割 部321朝向接著膜20於向水平方向上移送。具體說明，水 平移送部323包含提供用以移動之動力的移送馬達（未圖 示），水平移送部323藉由上述移送馬達而將膜切割部321 向靠近接著膜20之方向或者其相反方向移送。藉此，膜切 割部3 2 1之膜切割機3 2 1 b可切斷接著膜2 0。 水平導引部324與切割負載32la平行地配置，且具有與 接著膜20平行之導引面324a。即，水平導引部324之導引 面324a係與配置有捲筒膜3〇之捲筒膜吸附單元31〇的下表 面3 l〇a平行，較理想的是其平行度為1〇 μηι以下。另一方 面，水平導引部324以與捲筒膜吸附單元31〇或者其他構成 要素結合且無法活動之方式固定。 切割導引部325與切割負載支持部322結合，沿導引面 324a移動，以膜切割部321於平行於接著膜汕之方向上移 動之方式進行導引。具體而言，切割導引部325包含導引 負載325a及導引滾筒325b。 導引負載325a以與切割負載32 la隔離之狀態與切割負載 支持部322結合，且於切割負載321a之長度方向上延長形 成0 導引滾筒325b結合於導引負載325a，一邊接觸導引面 324&一邊旋轉。即，藉由導引滾筒325b沿導引面324a旋轉 而進仃導引，以使膜切割部321於平行於接著膜2〇之方向 123758.doc 200848346 上移動。較理想的是導引滾筒325b結合於對應於膜切割機 321b之導引負載325a的一端。 另一方面，膜切割機321b與切割負載支持部322之間之 第1隔離距離！^長於導引滾筒325b與切割負載支持部之 間之第2隔離距離乙2。較理想的是第i隔離距離。僅比第2 隔離距離L2長出與接著膜20之寬度相同之距離或者其以 上。 垂直間隔調節部326結合於切割負載321a，調節切割負 載32 la與導引負載325&之間之垂直方向的間隔d。作為一 例較理想的是，垂直間隔調節部326係可精密地調節切割 負載32 la與導引負載325a之間之間隔D的測微計。 再者，垂直間隔調節部326改變切割負載32^與導引負 載325a之間之間隔D時，可使切割負載32u以切割負載支 持部322之結合螺釘為軸旋轉，或者使切割負載321&整體 遠離或靠近導引負載325a。 又，以垂直間隔調節部326結合於切割負載321 a，且調 節切割負載32la與導引負載325a之間之間隔d之結構為一 例進行說明，然而與此不同，亦可為垂直間隔調節部326 結合於導引負載325a，調節切割負載32 la與導引負載325 a 之間之間隔D的結構。 垂直間隔彈性部327配置於切割負載32ia與導引負載 325a之間，對切割負載321a及導引負載325a施加垂直方向 之彈性力。即，垂直間隔彈性部327對切割負載321a及導 引負載325a施加垂直方向之彈性力以保持切割負載321&與 123758.doc -19- 200848346 導引負載325a之間之間隔D。作為一例，較理想的是垂直 間隔彈性部327為彈簧。 另一方面’較理想的是，自切割負載支持部322觀察， 垂直間隔彈性部327配置於垂直間隔調節部326之相反側。 即’較理想的是垂直間隔調節部326以切割負載支持部322 為基準而配置於切割負載支持部322 一側時，垂直間隔彈 性部3 2 7配置於上述一側之相反側。 垂直始、著彈性部328配置於切割負載支持部322與水平移 送部323之間，且對切割負載支持部322施加垂直方向之彈 性力，以使導引滾筒325b密著於水平導引部324之導引面 324b。作為一例，較理想的是垂直密著彈性部328為彈 簧。 如此，藉由本實施形態，膜切割部321之膜切割機32ib 於與接著膜20水平的方向上移動，僅選擇性地切斷捲筒膦 3〇中之接著膜20，藉此，可使切斷接著膜2〇時所產生之衝 擊最小化，可防止切斷錯誤，又，可進—步延長膜切割機 32 lb之耐用時間。尤其是膜切割機32卟為圓形切割機時， 可進一步延長膜切割機3 21 b之耐用時間。 <關於接著膜黏貼方法之實施形態> 參照圖1〜圖11，說明本實施形態之接著膜黏貼方法。 首先，參妝圖1及圖2，將捲筒膜供給滾筒i 〇〇配置於— 側，將捲筒膜收納滾筒200配置於另一側。接著，使捲筒 膜供給滾筒1〇〇内之捲筒膜30經由辅助滾筒6〇〇及支持滾筒 700到達捲筒膜收納滾筒200。此時，輔助滾筒6〇〇及支持 123758.doc -20- 200848346 滾筒700可防止滾筒膜30由於荷重而下垂。此處，捲筒膜 30包含異形膜1〇及接著膜2〇該2層，接著膜2〇作為一例係 包含導電球22之各向異性導電膜。 另一方面，捲筒膜供給滾筒1〇〇及捲筒膜收納滾筒2〇〇旋 轉時，捲筒膜30自捲筒膜供給滾筒1〇〇移動至捲筒膜收納 滾筒200。 ' 接著，參照圖6、圖7及圖8，使用接著膜切割單元32〇將 ❹ 捲筒膜30中之接著膜2〇沿平行於接著膜20之方向，即，自 接著膜2 0之一側向另一側切斷。 此處，較理想的是，沿平行於接著膜2〇之方向切斷之步 驟包括··由捲筒膜吸附單元310吸附捲筒膜3〇而配置之步 驟，及使用接著膜切割單元3 2 〇將所吸附之接著膜2 〇沿平 行於接著膜20之方向切斷之步驟。 更加具體說明，首先，將自捲筒膜供給滾筒i 〇〇所提供 之捲筒膜30於向捲筒膜收納滾筒2〇〇移動之途中吸附於捲 (./ 茼膜吸附單元31 〇。此時，較理想的是於捲筒膜吸附單元 3 1 〇中形成用以吸入捲筒膜30且使捲筒膜3〇黏貼於捲筒膜 吸附單元310之下表面31〇a之吸入槽312。又，較理想的是 捲筒膜吸附單元310進而包含以將捲筒膜3〇向捲筒膜吸附 單元310之下表面3 10a中央導引之方式而形成於捲筒膜吸 附單元310之下表面31〇a的兩端部之導引突起314。 接著’接著膜切割單元320自接著膜20之一側向另一側 移動而切斷接著膜2〇。作為一例，較理想的是接著膜切割 單元320包含膜切割部321、切割負載支持部322、水平移 123758.doc -21 - 200848346 送部323、水平導引部324、切割導引部325、垂直間隔調 節部326、垂直間隔彈性部327及垂直密著彈性部328。 此處，簡單說明切斷接著膜20之具體機構，水平移送部 3 23將結合於切割負載支持部322之膜切割部321移送至捲 筒膜30側，藉此，膜切割部321之膜切割機321b切斷接著 膜20。The horizontal transfer unit 323 is coupled to the cutting load supporting unit 322, and transfers the film cutting unit 321 toward the adhesive film 20 in the horizontal direction. Specifically, the horizontal transfer unit 323 includes a transfer motor (not shown) that supplies power for moving, and the horizontal transfer unit 323 transfers the film cutting unit 321 toward the film 20 in the opposite direction or the opposite direction by the transfer motor. . Thereby, the film cutter 3 2 1 b of the film cutting portion 3 2 1 can cut the adhesive film 20. The horizontal guiding portion 324 is disposed in parallel with the cutting load 32la, and has a guiding surface 324a parallel to the film 20 next. That is, the guiding surface 324a of the horizontal guiding portion 324 is parallel to the lower surface 3 l〇a of the web adsorption unit 31A on which the reel film 3 is disposed, and preferably has a parallelism of 1 〇μηι or less. . On the other hand, the horizontal guide portion 324 is fixed in such a manner as to be combined with the roll film adsorption unit 31 or other constituent elements and incapable of moving. The cutting guide portion 325 is coupled to the cutting load supporting portion 322, moves along the guiding surface 324a, and is guided so that the film cutting portion 321 moves in a direction parallel to the film loop. Specifically, the cutting guide 325 includes a guiding load 325a and a guiding roller 325b. The guiding load 325a is combined with the cutting load supporting portion 322 in a state of being isolated from the cutting load 32 la, and is extended in the longitudinal direction of the cutting load 321a to form a 0. The guiding roller 325b is coupled to the guiding load 325a while contacting the guiding surface 324 &; rotate while rotating. That is, the guide roller 325b is guided to rotate along the guide surface 324a to move the film cutting portion 321 in a direction parallel to the film 2 123 123758.doc 200848346. Preferably, the guide roller 325b is coupled to one end of the guide load 325a corresponding to the film cutter 321b. On the other hand, the first isolation distance between the film cutter 321b and the cutting load supporting portion 322! ^ is longer than the second isolation distance B between the guide roller 325b and the cutting load support portion. More desirable is the ith isolation distance. It is only longer than the second isolation distance L2 by a distance equal to or greater than the width of the adhesive film 20. The vertical interval adjusting portion 326 is coupled to the cutting load 321a to adjust the interval d between the cutting load 32 la and the guiding load 325 & As an example, it is preferable that the vertical interval adjusting portion 326 is a micrometer capable of precisely adjusting the interval D between the cutting load 32 la and the guiding load 325a. Furthermore, when the vertical interval adjusting portion 326 changes the interval D between the cutting load 32 and the guiding load 325a, the cutting load 32u can be rotated about the joint screw of the cutting load supporting portion 322, or the cutting load 321 & Move away from or near the pilot load 325a. Further, a configuration in which the vertical interval adjusting portion 326 is coupled to the cutting load 321a and the interval d between the cutting load 32la and the guide load 325a is adjusted is described as an example. However, the vertical interval adjusting portion 326 may be used. In conjunction with the pilot load 325a, the structure of the interval D between the cutting load 32la and the pilot load 325a is adjusted. The vertical interval elastic portion 327 is disposed between the cutting load 32ia and the guide load 325a, and applies a vertical elastic force to the cutting load 321a and the guide load 325a. That is, the vertical interval elastic portion 327 applies a vertical elastic force to the cutting load 321a and the guide load 325a to maintain the interval D between the cutting load 321 & and the 123758.doc -19 - 200848346 pilot load 325a. As an example, it is preferable that the vertical interval elastic portion 327 is a spring. On the other hand, it is preferable that the vertical interval elastic portion 327 is disposed on the opposite side of the vertical interval adjusting portion 326 as viewed from the cutting load supporting portion 322. That is, it is preferable that the vertical interval adjusting portion 326 is disposed on the side of the cutting load supporting portion 322 with respect to the cutting load supporting portion 322, and the vertical interval elastic portion 327 is disposed on the opposite side of the one side. The vertical start and elastic portion 328 is disposed between the cutting load supporting portion 322 and the horizontal transfer portion 323, and applies a vertical elastic force to the cutting load supporting portion 322 so that the guiding roller 325b is adhered to the horizontal guiding portion 324. Guide surface 324b. As an example, it is preferable that the vertical adhesive elastic portion 328 is a spring. As described above, according to the present embodiment, the film cutter 32ib of the film cutting unit 321 moves in the horizontal direction with the film 20, and only the film 20 in the roll phosphine is selectively cut, whereby the film can be cut. The impact generated by breaking the film 2 最小 is minimized, the cutting error can be prevented, and the durability of the film cutter 32 lb can be further advanced. In particular, when the film cutter 32 is a circular cutter, the durability of the film cutter 3 21 b can be further extended. <Embodiment of Adhesive Film Adhesion Method> A method of adhering the adhesive film of the present embodiment will be described with reference to Figs. 1 to 11 . First, in Fig. 1 and Fig. 2, the roll film supply roller i is placed on the side, and the roll film storage roll 200 is placed on the other side. Next, the web 30 of the roll film supply roller 1 is passed to the roll film storage roll 200 via the auxiliary roll 6 and the support roll 700. At this time, the auxiliary roller 6 〇〇 and the support 123758.doc -20- 200848346 The roller 700 can prevent the roller film 30 from sagging due to the load. Here, the roll film 30 includes the irregular film 1 and the film 2, and the film 2 is an anisotropic conductive film containing the conductive balls 22 as an example. On the other hand, when the roll film supply roller 1A and the roll film storage drum 2 are rotated, the roll film 30 is moved from the roll film supply roll 1 to the roll film storage roll 200. Next, referring to Fig. 6, Fig. 7, and Fig. 8, the film 2 in the ❹ roll film 30 is used in the direction parallel to the film 20, i.e., one from the film 20, using the film-cutting unit 32. Cut laterally to the other side. Here, it is preferable that the step of cutting in a direction parallel to the film 2 of the bonding film includes a step of arranging the roll film 3 by the roll film adsorption unit 310, and using the film cutting unit 3 2 The step of cutting the adsorbed film 2 〇 in a direction parallel to the film 20 is cut. More specifically, first, the roll film 30 supplied from the roll film supply roller 〇〇 is adsorbed to the roll (./ 茼 film adsorption unit 31 途) while moving toward the roll film storage roll 2 〇. In this case, it is preferable to form the suction groove 312 for sucking the roll film 30 and adhering the roll film 3 to the lower surface 31〇a of the roll film adsorption unit 310 in the roll film adsorption unit 3 1 . Further, it is preferable that the roll film adsorption unit 310 further includes a lower surface of the roll film adsorption unit 310 formed to guide the roll film 3 to the center of the lower surface 3 10a of the roll film adsorption unit 310. The guide protrusions 314 at both end portions of 31〇a. Next, the film cutting unit 320 is moved from one side of the adhesive film 20 to the other side to cut the film 2〇. As an example, it is preferable to follow the film cutting. The unit 320 includes a film cutting portion 321, a cutting load supporting portion 322, a horizontal shift 123758.doc -21 - 200848346, a feeding portion 323, a horizontal guiding portion 324, a cutting guiding portion 325, a vertical spacing adjusting portion 326, and a vertical spacing elastic portion 327. And a vertical close elastic portion 328. Here, a brief description of the cut In the specific mechanism of the film 20, the horizontal transfer portion 323 transfers the film cutting portion 321 coupled to the cutting load supporting portion 322 to the side of the roll film 30, whereby the film cutter 321b of the film cutting portion 321 cuts the film 20 .
再者，將膜切割部321移動至捲筒膜30側時，與切割負 載支持部322結合之切割導引部325沿水平導引部324之導 引面324a移動，藉此，膜切割部321之膜切割機321b可沿 平行於接著膜20之方向切斷接著膜2〇。 另一方面，較理想的是，使用接著膜切割單元320切斷 接著膜20之前，以僅切斷捲筒膜3〇中之接著膜2〇之方式調 整膜切割機321b與捲筒膜吸附單元3 1〇之下表面31〇&之間 的距離。 又，較理想的是接著膜切割單元320同時切斷接著膜2〇 之2處。即，較理想的是膜切割部321以同時切斷接著膜2〇 :2處之方式形成對且平行配置。如此，藉由接著膜切割 單元32G切斷接著膜2G之固定區間，而可將接著膜_分 為去除之一部分20a及殘留之其他部分20b。 另 ，針對接著膜切割單元32〇之各構成要素之盆 他詳：說明參照接著膜黏貼設備之實施形態。 - 接：=“、、圖9、圖1〇及圖11，接著膜切割單元320切斷 2 後，將接著膜2〇中所去除之一部分加自異形膜 刀離且去除。藉此，於接著膜20上形成切斷槽24。 123758.doc -22- 200848346 具體說明去除接著臈20之所去除的一部分2〇a之步驟， 將接著膜切割單元320向遠離捲筒膜3〇之方向移動後，使 接著膜去除單元330向配置於捲筒臈吸附單元31〇之下表面 310a之捲筒膜30上升。 此時，較理想的是，接著膜去除單元33〇包含：垂直移 動本體3 32，該垂直移動本體332於垂直於捲筒膜3〇之方向 上往復移動；及剝離帶334，該剝離帶334以包圍對向於捲 筒膜30之垂直移動本體332的一面之方式而配置。即，垂 直移動本體332於垂直於捲筒膜3〇之方向上往復移動時， 剝離帶334黏貼於接著膜20，從而自異形膜1〇分離接著膜 20之一部分20a。如圖11所示，此種剝離帶334向橫方向移 動’移動所黏貼之接著膜20的一部分20a。其結果為，剝 離帶334可再次實施接著膜去除作業。 最後，參照圖3、圖4及圖5，使殘留於異形膜1 〇之接著 膜20的其他部分20b黏貼於基板50。即，去除接著膜2〇之 一部分20a後，使用加壓單元500將殘留之接著膜20的其他 部分20b黏貼於基板50之焊墊部52上。 具體說明使接著膜20之其他部分20b黏貼於基板50之步 驟，於基板支持台400上配置基板50後，使用加壓單元500 朝向基板50加壓捲筒膜30，使接著膜20之其他部分2〇b黏 貼於基板50之焊墊部52上。 其結果為，加壓單元500返回到加壓捲筒膜30前之原來 位置時，接著膜20之其他部分20b自異形膜10分離，黏貼 於基板50之焊塾部52上。此時，較理想的是實施接著膜2〇 123758.doc -23 - 200848346 之其他部分20b與基板50之焊墊部52的對準過程，以使接著 膜20之其他部分20b準確地黏貼於基板5〇之烊塾部52上。 另一方面，較理想的是黏貼有接著膜2〇之其他部分2〇b 的基板50藉由基板移送單元（未圖示）而卸載，將新基板裝 載於基板支持台400上。 最後，將接著膜20之其他部分2〇b黏貼於基板5〇，則捲 筒膜30中僅殘留異形膜10，使此種捲筒膜3〇向捲筒膜收納 滾筒200移動並進行收納。 如此，根據本實施形態，將捲筒膜3〇中之接著膜2〇自接 著膜20之一側向另一側切斷，藉此使切斷接著膜2〇時所產 生之衝擊最小化，從而可防止切斷錯誤。 [產業上之可利用性] 根據上述本發明，膜切割部之膜切割機自接著膜之一側 向另一側移動’僅選擇性地切斷捲筒膜中之接著膜，藉此 可使切斷接著膜時所產生之衝擊最小化，從而可防止切斷 錯誤。 又，如本發明所示，膜切割機自接著膜之一側向另一側 移動而切斷接著膜時膜切割機於平行於接著膜之方 向移動而切断接著膜時，與先前膜切割機於垂直於接著 膜之方向上移動而切斷接著膜之情形相比，可進一步延長 '幾之耐用日寺間’ X其是膜切割機為圓形切割機時， Τ進步延長臈切割機之耐用時間。 、、上藉由本發明之實施例而加以詳細說明，但本發明 並不限於此’於本發明所屬之技術領域中，若為具有通常 123758.doc -24- 200848346 知識者，則於未脫離本發明之思想與精神之範圍内均可加 以修正或者變更。 【圖式簡單說明】 圖1係概念性表示本發明一實施形態之接著膜黏貼設備 之圖式。 圖2係放大圖1之接著膜黏貼設備中的基板支持台及加壓 單元部位而顯示之圖式。 圖3係概念性表示圖i之接著膜黏貼設備中加壓單元加壓 捲筒膜之狀態的圖式。 圖4係詳細表示圖3十加壓单元加壓捲筒膜之狀態的圖 式0 圖5係洋細表不圖4中力厭留；|两 式 口 —甲加Μ早το加壓捲筒膜後之狀態的圖 圖6係表示圖1之接著膜透 侧視圖。 接者膜黏貼叹備中之接著膜切割裝置的 切割單元切斷 ，7係表示圖6之接著膜切割裝置中接著膜 接著膜之狀態的側視圖。 、 視圖 圖8係表示圖7之接著膜切割單元切斷接著 膜之狀態的正 圖9係表示圖6之接著膜切割 著膜之切斷部分自異形膜分離之狀者膜去除單元將接 圖1。係表示圖9之接著膜去除單:：侧視圖。 自異形膜分離之狀態的正視_⑦將接著膜之切斷部分 圖1 1係表示使圖10中所分離 之接著膜的切斷部分移動之 123758.doc -25- 200848346 狀態的側視圖。 【主要元件符號說明】 10 異形膜 20 接著膜 30 捲筒膜 50 基板 100 捲筒膜供給滾筒 200 捲筒膜收納滾筒 300 接著膜切割裝置 310 捲筒膜吸附單元 320 接著膜切割單元 321 膜切割部 322 切割負載支持部 323 水平移送部 324 水平導引部 325 切割導引部 326 垂直間隔調節部 327 垂直間隔彈性部 328 垂直密著彈性部 330 接著膜去除單元 400 基板支持台 500 加壓單元 600 辅助滾筒 700 支持滾筒 1000 接著膜黏貼設備 123758.doc -26-Further, when the film cutting portion 321 is moved to the side of the roll film 30, the cutting guide portion 325 combined with the cutting load supporting portion 322 is moved along the guiding surface 324a of the horizontal guiding portion 324, whereby the film cutting portion 321 The film cutter 321b can cut the film 2 沿 in a direction parallel to the film 20 in the film. On the other hand, it is preferable to adjust the film cutter 321b and the roll film adsorption unit in such a manner as to cut only the film 2 in the roll film 3 before using the film cutting unit 320 to cut the film 20 3 1〇 The distance between the surface 31〇 & Further, it is preferable that the film cutting unit 320 is simultaneously cut at two places of the film 2 接着. That is, it is preferable that the film cutting portion 321 is formed in parallel and arranged in parallel so as to cut off the film 2:2 at the same time. Thus, by adhering the film cutting unit 32G to the fixed section of the bonding film 2G, the bonding film _ can be divided into one portion 20a and the remaining portion 20b. Further, the details of the constituent elements following the film cutting unit 32 are described in detail with reference to the embodiment of the film bonding apparatus. - 接: = ",, Fig. 9, Fig. 1 and Fig. 11, and after the film cutting unit 320 cuts 2, one of the portions removed in the film 2 is removed from the film and removed. Next, a cutting groove 24 is formed on the film 20. 123758.doc -22- 200848346 Specifically, the step of removing a portion of the 2〇a removed by the crucible 20 is performed, and the film cutting unit 320 is moved away from the web 3〇. Thereafter, the film removal unit 330 is caused to rise toward the roll film 30 disposed on the lower surface 310a of the roll suction unit 31. At this time, it is preferable that the film removal unit 33 includes: vertically moving the body 3 32 The vertically moving body 332 reciprocates in a direction perpendicular to the roll film 3〇; and a peeling tape 334 disposed to surround a side of the vertically moving body 332 facing the roll film 30. That is, when the vertically moving body 332 reciprocates in a direction perpendicular to the roll film 3, the peeling tape 334 is adhered to the adhesive film 20, thereby separating the portion 20a of the film 20 from the film 11 。. As shown in FIG. Such a peeling belt 334 moves in the lateral direction to move A part 20a of the adhesive film 20 is adhered. As a result, the peeling tape 334 can perform the film removal operation again. Finally, referring to Fig. 3, Fig. 4 and Fig. 5, the remaining portion of the film 20 remaining on the film 11 is formed. 20b is adhered to the substrate 50. That is, after removing one portion 20a of the adhesive film 2, the remaining portion 20b of the remaining adhesive film 20 is adhered to the pad portion 52 of the substrate 50 by using the pressing unit 500. The other portion 20b is adhered to the substrate 50. After the substrate 50 is placed on the substrate support table 400, the roll film 30 is pressed toward the substrate 50 by the pressurizing unit 500, and the other portion 2b of the adhesive film 20 is adhered to the substrate. As a result, when the pressurizing unit 500 returns to the original position before the pressurized web 30, the other portion 20b of the film 20 is separated from the deformed film 10, and the solder is adhered to the substrate 50. At the portion 52. At this time, it is preferable to perform the alignment process of the other portion 20b of the bonding film 2〇123758.doc -23 - 200848346 and the pad portion 52 of the substrate 50 so that the other portion 20b of the bonding film 20 is accurate. Adhered to the top 52 of the substrate 5 On the other hand, it is preferable that the substrate 50 to which the other portion 2〇b of the bonding film 2 is pasted is unloaded by the substrate transfer unit (not shown), and the new substrate is mounted on the substrate supporting table 400. Finally, When the other portion 2〇b of the adhesive film 20 is adhered to the substrate 5, only the shaped film 10 remains in the roll film 30, and the roll film 3 is moved to the roll film storage roll 200 and stored. According to the present embodiment, the adhesive film 2〇 in the roll film 3〇 is cut from one side of the adhesive film 20 to the other side, thereby minimizing the impact generated when the film 2 is cut. Prevent cutting off errors. [Industrial Applicability] According to the present invention described above, the film cutter of the film cutting portion moves from one side of the adhesive film side to the other side to selectively cut only the adhesive film in the roll film, whereby The impact generated when the film is cut off is minimized, so that the cutting error can be prevented. Further, as shown in the present invention, the film cutter moves from one side of the film to the other side to cut the film, and when the film cutter moves in a direction parallel to the film to cut the film, the film cutter is used with the previous film cutter. Compared with the case where the film is cut perpendicularly to the direction of the film and the film is cut off, the 'several day between the temples' can be further extended. X When the film cutting machine is a circular cutting machine, the Τ progressively extends the 臈 cutting machine. Durable time. And the present invention is described in detail by way of embodiments of the present invention, but the present invention is not limited thereto. In the technical field to which the present invention pertains, if it is a person having the usual knowledge of 123758.doc -24-200848346, Modifications or changes may be made within the scope of the inventive idea and spirit. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view conceptually showing an adhesive film sticking apparatus according to an embodiment of the present invention. Fig. 2 is a view showing an enlarged view of a substrate supporting table and a pressurizing unit portion in the film bonding apparatus of Fig. 1. Fig. 3 is a view conceptually showing a state in which the pressurizing unit pressurizes the roll film in the film bonding apparatus of Fig. i. Figure 4 is a diagram showing in detail the state of the pressurizing reel film of the tenth pressurizing unit of Fig. 3; Fig. 5 is a fine gauge of the top ten in FIG. 4; | two-port-a-clamping early το pressurizing reel Fig. 6 of the state after the film shows a side view of the film of Fig. 1 . The cutting film of the film-cutting device is cut in the film smear, and the 7-series shows a side view of the state in which the film is next to the film in the film-cutting device of Fig. 6. FIG. 8 is a front view showing the state in which the film-cutting unit of FIG. 7 is cut and the film is attached. FIG. 9 is a view showing the film-removing unit in which the cut-off portion of the film is cut from the film of FIG. 1. It is indicated by the film removal sheet of Fig. 9: side view. The front view of the state in which the self-shaped film is separated _7 will be the cut-off portion of the film. Fig. 11 is a side view showing the state of 123758.doc -25-200848346 in which the cut portion of the film which is separated in Fig. 10 is moved. [Description of main component symbols] 10 Shaped film 20 Next film 30 Roll film 50 Substrate 100 Roll film supply roll 200 Roll film storage roll 300 Next film cutting device 310 Roll film adsorption unit 320 Next film cutting unit 321 Film cutting portion 322 cutting load support portion 323 horizontal transfer portion 324 horizontal guide portion 325 cutting guide portion 326 vertical interval adjustment portion 327 vertical interval elastic portion 328 vertical adhesion elastic portion 330 followed by film removal unit 400 substrate support table 500 press unit 600 auxiliary The drum 700 supports the drum 1000 and then the film sticking device 123758.doc -26-