JP2008126400A - Adhesive film cutting device, adhesive film adhesion equipment with adhesive film cutting device, and adhesive film cutting and adhesion method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive film cutting device capable of preventing a cutting error to an adhesive film, an adhesive film adhesion equipment having the cutting device, and an adhesive film cutting method and adhesive film adhesion method using the same. <P>SOLUTION: The adhesive film cutting device includes a roll film adsorption unit 310 and an adhesive film cutting unit 320. The roll film adsorption unit adsorbs a roll film 30 which consists of two layers of films, an adhesive film 20 and a deformed film 10. The adhesive film cutting unit 320 cuts from one side of the adhesive film 20 toward the other. In this manner, the adhesive film 30 is cut from its one side to the other, thereby any shock occurring at the time of cutting is minimized so that a cutting error can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an adhesive film cutting device, an adhesive film attaching device having the same, and an adhesive film cutting method and an attaching method using the same, and more particularly, an adhesive film cutting device that prevents a cutting error, and an adhesive having the same The present invention relates to a film attaching apparatus, and an adhesive film cutting method and an attaching method using the same.

  In general, a liquid crystal display device is advantageous in that it is thin and light and consumes less power, and is mainly used for monitors, notebook computers, mobile phones and the like. Such a liquid crystal display device includes a liquid crystal display panel that displays an image using light transmittance of liquid crystal, and a backlight assembly that is disposed under the liquid crystal display panel and provides light to the liquid crystal display panel.

  The liquid crystal display panel includes a first substrate on which a thin film transistor and a pixel electrode are formed, a second substrate on which a color filter and a common electrode are formed opposite to the first substrate, and between the first substrate and the second substrate. And a flexible circuit board that is electrically connected to the first substrate and controls the thin film transistor.

  In general, the pad portion of the flexible circuit board is electrically connected to the pad portion of the first substrate using an anisotropic conductive film including conductive balls. Specifically, after the anisotropic conductive film is attached onto the pad portion of the first substrate by an anisotropic conductive film attachment facility, the pad portion of the flexible circuit board is placed on the anisotropic conductive film. Is attached.

  On the other hand, the anisotropic conductive film is generally provided by being wound in a roll form with a deformed film attached to one surface. Therefore, in order to adhere the anisotropic conductive film onto the pad portion of the first substrate, it is necessary to cut the anisotropic conductive film and remove a part thereof. That is, the anisotropic conductive film deposition facility must include the anisotropic conductive film cutting device.

  The conventional anisotropic conductive film cutting apparatus employs a method in which a film cutter moves in a direction perpendicular to the anisotropic conductive film to cut the anisotropic conductive film. In this case, generally, the anisotropic conductive film cutting apparatus includes a stopper unit for enabling the film cutter to selectively cut only the anisotropic conductive film without cutting the deformed film. Need more.

  However, generally, when the film cutter moves in the perpendicular direction to cut the anisotropic conductive film, the stopper unit collides with a fixing plate for fixing the anisotropic conductive film. . The impact caused by the collision between the stopper unit and the fixing plate may wear the stopper unit or change the position of the stopper unit. There is a risk of changing the cutting depth and causing a cutting error.

  Therefore, the technical problem of the present invention is to solve such a conventional problem, and the first object of the present invention is to bond to prevent a cutting error caused by an impact at the time of cutting the adhesive film. It is to provide a film cutting apparatus.

  A second object of the present invention is to provide an adhesive film attachment facility having the adhesive film cutting device.

  A third object of the present invention is to provide an adhesive film cutting method using the above-described adhesive film cutting apparatus.

  A fourth object of the present invention is to provide an adhesive film attaching method using the above-described adhesive film cutting equipment.

  An adhesive film cutting apparatus according to an embodiment of the present invention for achieving the first object includes a roll film adsorption unit and an adhesive film cutting unit.

  The roll film adsorption unit adsorbs a roll film composed of a double layer of an adhesive film and a deformed film. The adhesive film cutting unit cuts the adhesive film from one side of the adhesive film toward the other side.

  The adhesive film cutting unit includes a cutting load having a cutting load extending in one direction and a film cutter coupled to an end of the cutting load, and a cutting load coupled to the cutting load and supporting the cutting load. A support unit; and a horizontal transfer unit coupled to the cutting load support unit and configured to transfer the film cutting unit in a horizontal direction toward the adhesive film so that the adhesive film is cut by the film cutter. it can. Here, it is preferable that the film cutting portions are arranged in parallel so as to form a pair so that the adhesive film is simultaneously cut at two locations.

  The adhesive film cutting unit is coupled to a horizontal guide portion having a guide surface parallel to the adhesive film, a guide load coupled to the cutting load support portion and extending in the one direction, and the guide load. And a cutting guide portion having a guide roller that rotates while contacting the guide surface and guides the adhesive film along a direction from one side to the other side of the adhesive film.

  The adhesive film cutting unit is coupled to the cutting load and adjusts a vertical distance between the cutting load and the guide load, and between the cutting load and the guide load. It may further include a vertically spaced elastic part disposed and exerting a vertical elastic force on the cutting load and the guide load.

  The adhesive film cutting unit is disposed between the cutting load support unit and the horizontal transfer unit, and an elastic force in a vertical direction to the cutting load support unit so that the guide roller is in close contact with the guide surface. It is further possible to further include a vertical contact elastic part that exerts the following.

  An adhesive film attachment facility according to an embodiment for achieving the second object includes a roll film supply roller, a roll film storage roller, an adhesive film cutting device, a substrate support base, and a pressure unit.

  The roll film supply roller supplies a roll film composed of two layers of an adhesive film and a deformed film. The roll film storage roller is separated from the roll film supply roller, and stores the roll film. The adhesive film cutting device is disposed between the roll film supply roller and the roll film storage roller, and a roll film adsorption unit that adsorbs the roll film, and the adhesive film from one side to the other side Includes an adhesive film cutting unit that cuts toward The said board | substrate support stand is arrange | positioned between the said adhesive film cutting apparatus and the said roll film storage roller, and a board | substrate is arrange | positioned on the surface facing the said roll film. The pressurizing unit is disposed to face the substrate support through the roll film, and pressurizes the roll film toward the substrate in order to attach the cut adhesive film to the substrate. .

  The adhesive film attachment facility may further include an auxiliary roller disposed between the roll film supply roller and the roll film storage roller to prevent the roll film from dripping.

  An adhesive film cutting method according to an embodiment for achieving the third object includes a step of disposing a roll film composed of two layers of an adhesive film and a deformed film, and the adhesive film using an adhesive film cutting unit. Cutting from one side of the adhesive film to the other side.

  The adhesive film cutting method may further include selectively separating the cut portion of the adhesive film from the deformed film using an adhesive film removing unit.

  According to one embodiment of the present invention for achieving the fourth object, an adhesive film attachment method includes: a roll film composed of two layers of a deformed film and an adhesive film; and the adhesive film using the adhesive film cutting unit. Cutting from one side to the other side, separating a part of the cut adhesive film from the deformed film using an adhesive film removing unit, and the adhesive film left on the deformed film Attaching the other part to the substrate using a pressure unit.

  Here, the adhesive film cutting unit includes a cutting load extending in one direction and a film cutter that is coupled to an end of the cutting load and cuts the adhesive film so that the film cutter does not rotate. A circular cutter fixed to the cutting load is desirable.

  According to the present invention, the film cutter selectively cuts only the adhesive film of the roll film from one side of the adhesive film to the other side, thereby preventing a cutting error caused by an impact at the time of cutting the adhesive film. Can be prevented.

  Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the drawings.

<Embodiment related to adhesive film adhesion equipment>
FIG. 1 is a view conceptually showing an adhesive film attaching facility according to an embodiment of the present invention, and FIG. 2 is an enlarged view of a substrate support base and a pressure unit part of the adhesive film attaching facility of FIG. FIG. 3 is a diagram conceptually showing a state in which the pressure unit presses the roll film in the adhesive film attaching facility of FIG. 1, and FIG. 4 is a diagram showing the pressure unit in FIG. FIG. 5 is a diagram illustrating in detail a state in which the film is pressed, and FIG. 5 is a diagram illustrating in detail a state after the pressing unit in FIG. 4 presses the roll film.

  1, 2, 3, 4, and 5, the adhesive film attachment facility 1000 according to the present embodiment includes a roll film supply roller 100, a roll film storage roller 200, an adhesive film cutting device 300, and a substrate support base. 400 and the pressure unit 500, and may optionally further include an auxiliary roller 600.

  A roll film 30 composed of two layers of a deformed film 10 and an adhesive film 20 is wound around the roll film supply roller 100, and the roll film supply roller 100 is a roll film necessary for attaching the adhesive film 20 to the substrate 50. 30 is supplied.

  Here, the adhesive film 20 is, for example, an anisotropic conductive film in which a plurality of conductive balls 22 are interposed in an adhesive substance. The deformed film 10 has a property of being easily separated from the adhesive film 20 and desirably includes an antistatic layer for preventing static electricity generated during the separation. On the other hand, it is desirable that the deformed film 10 has a thickness of about 50 μm and the adhesive film 20 has a thickness of about 45 μm.

  The roll film storage roller 200 is disposed separately from the roll film supply roller 100 and stores the roll film 30 supplied from the roll film supply roller 100. That is, the roll film supply roller 100 rotates in one direction to supply the roll film 30, and the roll film storage roller 200 rotates in the one direction to store the roll film 30 that has been cut and separated, which will be described later. To collect.

  The adhesive film cutting device 300 is disposed between the roll film supply roller 100 and the roll film storage roller 200. The adhesive film cutting apparatus 300 selectively cuts only the adhesive film 20 in the roll film 30 and separates and removes a part of the cut adhesive film 20 from the deformed film. As a result, the cutting groove 24 is formed in the adhesive film 20.

  Specifically, the adhesive film cutting apparatus 300 removes the adhesive film 20 by cutting the adhesive film 20 from one side to the other side. Desirably, the adhesive film cutting apparatus 300 cuts and removes the adhesive film 20 in a direction perpendicular to the length direction of the roll film 30. Meanwhile, a more detailed description of the adhesive film cutting apparatus 300 will be described later with reference to a separate drawing.

  The board | substrate support stand 400 is arrange | positioned between the adhesive film cutting apparatus 300 and the roll film storage roller 200, and is arrange | positioned under the roll film 30 as an example. A substrate 50 is disposed on the surface of the substrate support 400 that faces the roll film 30. At this time, the substrate 50 is preferably loaded onto the substrate support base 400 by a substrate transfer unit (not shown) and further unloaded from the substrate support base 400.

  The pressure unit 500 is disposed at a position facing the substrate support base 400 with the roll film 30 interposed therebetween. As an example, the pressure unit 500 is disposed above the roll film 30 so as to face the substrate support base 400. The pressurizing unit 500 pressurizes the roll film 30 toward the substrate support base 400 and attaches the remaining portion 20 b of the adhesive film 20 to the substrate 50 disposed on the substrate support base 400. As a result, the other portion 20 b of the adhesive film 20 is attached onto the pad portion 52 of the substrate 50.

  The auxiliary roller 600 is disposed between the roll film supply roller 100 and the roll film storage roller 200 in order to prevent the roll film 30 from dripping. That is, the auxiliary roller 600 provides tension to the roll film 30 to prevent the roll film 30 from drooping due to the weight.

  The auxiliary roller 600 includes a supply side auxiliary roller 610 and a storage side auxiliary roller 620. The supply side auxiliary roller 610 is disposed between the roll film supply roller 100 and the adhesive film cutting device 300, and a plurality of supply side auxiliary rollers 610 are preferably disposed in parallel. The storage-side auxiliary roller 620 is preferably disposed between the substrate support base 400 and the roll film storage roller 200, and a plurality of storage-side auxiliary rollers 620 are disposed in parallel.

  Meanwhile, the adhesive film attachment facility 1000 may further include a support roller 700 disposed between the adhesive film cutting apparatus 300 and the substrate support base 400. The support roller 700 is disposed between the adhesive film cutting device 300 and the substrate support base 400, and prevents the roll film 30 from drooping downward.

  6 is a side view showing an adhesive film cutting apparatus in the adhesive film attaching apparatus of FIG. 1, and FIG. 7 shows a state in which the adhesive film cutting unit in the adhesive film cutting apparatus of FIG. 6 cuts the adhesive film. 8 is a front view showing a state in which the adhesive film cutting unit of FIG. 7 cuts the adhesive film, and FIG. 9 is a view of the adhesive film removing unit in the adhesive film cutting apparatus of FIG. FIG. 10 is a side view showing a state where a part of the adhesive film is separated from the deformed film, and FIG. 10 is a state where the adhesive film removing unit of FIG. 9 separates a part of the cut adhesive film from the deformed film. 11 is a front view shown, and FIG. 11 moves a part of the adhesive film separated from FIG. Is a side view showing a state in which.

  Referring to FIGS. 6, 7, 8, 9, 10, and 11, the adhesive film cutting apparatus 300 according to the present embodiment includes a roll film suction unit 310, an adhesive film cutting unit 320, and an adhesive film removal unit 330. Including.

  The roll film adsorption unit 310 is arranged between the roll film supply roller 100 and the substrate support base 400 and adsorbs the roll film 30 composed of two layers of the deformed film and the adhesive film 20. At this time, the roll film adsorption unit 310 contacts the irregular film 10 in the roll film 30 and adsorbs the irregular film 10.

  The roll film adsorption unit 310 is formed with a suction hole 312 for adsorbing the roll film 30. That is, by sucking air through the suction hole 312 of the roll film suction unit 310, the roll film 30 is sucked onto the one surface 310 a of the roll film suction unit 310.

  Meanwhile, the roll film adsorption unit 310 may include a guide protrusion 314, a first guide roll 316, and a second guide roll 318.

  The guide protrusion 314 protrudes downward from the lower surface 310a of the roll film adsorption unit 310, and guides the roll film 30 to be disposed at the center of the lower surface 310a. The first guide roller 316 and the second guide roller 318 are disposed at both ends of the roll film adsorption unit 310 so as to face each other, and guide the roll film 30 so that it can move smoothly.

  The adhesive film cutting unit 320 selectively cuts only the adhesive film 20 among the roll films 30 arranged on the lower surface 310 a of the roll film adsorption unit 310. The adhesive film cutting unit 320 cuts the adhesive film 20 from one side to the other side, and preferably cuts the adhesive film 20 in a direction perpendicular to the length direction of the roll film 30.

  As described above, the adhesive film cutting unit 320 cuts a predetermined section of the adhesive film 20, so that the adhesive film 20 can be divided into a part 20a to be removed and another part 20b to be left. At this time, the length of the part 20a to be removed of the adhesive film 20 is preferably about 20 mm. Meanwhile, a detailed description of the adhesive film cutting unit 320 will be described later.

  The adhesive film removing unit 330 separates the removed portion 20 a of the adhesive film 20 from the deformed film 10. Specifically, the adhesive film removing unit 330 includes a vertical moving body 332 and a peeling tape 334.

  The vertical moving body 332 is disposed below the roll film suction unit 310 and reciprocates in the vertical direction below the roll film 30 disposed on the lower surface of the roll film suction unit 310.

  The release tape 334 is disposed so as to surround the upper surface of the vertical movement main body 332 facing the roll film 30. The peeling tape 334 separates the part 20 a of the adhesive film 20 from the deformed film 10 when the vertical moving body 332 reciprocates in the vertical direction below the roll film 30. Further, it is desirable that the peeling tape 334 is movable in a direction perpendicular to the moving direction of the vertical moving body 332 in order to move the portion 20a of the adhesive film 20 in the horizontal direction.

  Next, the adhesive film cutting unit 320 will be described in detail.

  The adhesive film cutting unit 320 according to the present embodiment includes a film cutting unit 321, a cutting load support unit 322, a horizontal transfer unit 323, a horizontal guide unit 324, a cutting guide unit 325, a vertical interval adjustment unit 326, a vertical interval elastic unit 327, and a vertical. A close contact elastic portion 328 is included.

  The film cutting unit 321 moves from one side of the adhesive film 20 toward the other side and cuts the adhesive film 20. Specifically, the film cutting unit 321 includes a cutting load 321a formed to extend in one direction and a film cutter 321b coupled to an end of the cutting load 321a.

  The film cutting portions 321 are desirably arranged in parallel so as to form a pair so that the adhesive film 20 is cut simultaneously at two locations. Here, when a pair of film cutting part 321 cut | disconnects two places of the adhesive film 20 simultaneously, the adhesive film 20 can be divided into the part 20a removed and the other part 20b left. Unlike this, one film cutting part 321 can reciprocate twice to cut two portions of the adhesive film 20.

  The vertical separation T between the film cutter 321a and the roll film suction unit 310 is equal to or greater than the thickness of the deformed film 10 so that a part of the cut adhesive film 20 is completely separated. Small is desirable. As an example, the separation distance T is about 50 μm or less.

  The film cutter 321a is a circular cutter as an example, and it is desirable that the circular cutter is fixed to the cutting load 321b so as not to rotate. This is because when the circular cutter is rotatably provided, the separation distance T between the film cutter 321a and the roll film suction unit 310 varies due to the rotation of the circular cutter, and the adhesive film 20 may not be completely cut. Because there is.

  On the other hand, when the film cutter 321a is a circular cutter, the durability of the film cutter 321a as a whole can be increased by rotating the film cutter 321a after a predetermined period and using a new cutting edge. That is, when the circular cutter cuts the adhesive film 20 a plurality of times, the cutting edge of the circular cutter is partially blunted. At this time, when the circular cutter is rotated by a certain angle, a new cutting edge of the circular cutter that has not yet become dull is used for cutting the adhesive film 20.

  The cutting load support part 322 is coupled to the cutting load 321a and supports the cutting load 321a. The cutting load support part 322 is preferably coupled to the cutting load 321a and extended in a direction perpendicular to the length direction of the cutting load 321a. For example, the cutting load support 322 is coupled to the cutting load 321a by a coupling screw or the like.

  The horizontal transfer unit 323 is coupled to the cutting load support unit 322 and transfers the film cutting unit 321 toward the adhesive film 20 in the horizontal direction. Specifically, the horizontal transfer unit 323 includes a transfer motor (not shown) that provides power for movement, and the horizontal transfer unit 323 causes the film cutting unit 321 to approach the adhesive film 20 by the transfer motor. In the opposite direction or vice versa. Thereby, the film cutter 321b of the film cutting unit 321 can cut the adhesive film 20.

  The horizontal guide portion 324 is disposed in parallel with the cutting load 321 a and has a guide surface 324 a parallel to the adhesive film 20. That is, the guide surface 324a of the horizontal guide portion 324 is parallel to the lower surface 310a of the roll film suction unit 310 on which the roll film 30 is disposed, and desirably the parallelism is 10 μm or less. on the other hand. The horizontal guide part 324 is combined with the roll film suction unit 310 or other components and fixed so as not to move.

  The cutting guide part 325 is coupled to the cutting load support part 322 and moves along the guide surface 324 a to guide the film cutting part 321 so as to move in a direction parallel to the adhesive film 20. Specifically, the cutting guide unit 325 includes a guide load 325a and a guide roller 325b.

  The guide load 325a is coupled to the cutting load support portion 322 while being separated from the cutting load 321a, and is extended and formed in the length direction of the cutting load 321a.

  The guide roller 325b is coupled to the guide load 325a and rotates while being in contact with the guide surface 324a. That is, when the guide roller 325b rotates along the guide surface 324a, the film cutting part 321 is guided so as to move in a direction parallel to the adhesive film 20. The guide roller 325b is preferably coupled to one end of a guide load 325a corresponding to the film cutter 321b.

  On the other hand, the first separation distance L1 between the film cutter 321b and the cutting load support portion 322 is longer than the second separation distance L2 between the guide roller 325b and the cutting load support portion 322. Desirably, the first separation distance L1 is longer than the second separation distance L2 by the same distance as the width of the adhesive film 20 or longer.

  The vertical distance adjusting unit 326 is coupled to the cutting load 321a and adjusts the vertical distance D between the cutting load 321a and the guide load 325a. As an example, the vertical distance adjusting unit 326 is preferably a micrometer that can precisely adjust the distance D between the cutting load 321a and the guide load 325a.

  When the vertical distance adjusting unit 326 changes the distance D between the cutting load 321a and the guide load 325a, the cutting load 321a rotates about the coupling screw of the cutting load support unit 322 or the entire cutting load 321a It is possible to move away from or approach the guide load 325a.

  Further, the vertical distance adjusting unit 326 is coupled to the cutting load 321a to adjust the distance D between the cutting load 321a and the guide load 325a as an example, but unlike this, the vertical distance adjusting unit 326 is different. Is also coupled to the guide load 325a to adjust the distance D between the cutting load 321a and the guide load 325a.

  The vertical spacing elastic part 327 is disposed between the cutting load 321a and the guide load 235a, and exerts an elastic force in the vertical direction on the cutting load 321a and the guide load 325a. That is, the vertical interval elastic portion 327 exerts an elastic force in the vertical direction on the cutting load 321a and the guide load 325a so that the interval D between the cutting load 321a and the guide load 325a is maintained. As an example, the vertically spaced elastic part 327 is preferably a spring.

  On the other hand, it is desirable that the vertical interval elastic portion 327 is disposed on the opposite side of the vertical interval adjustment portion 326 when viewed from the cutting load support portion 322. That is, when the vertical interval adjusting unit 326 is disposed on one side with respect to the cutting load support unit 322, the vertical interval elastic unit 327 is preferably disposed on the opposite side of the one side.

  The vertical contact elastic part 328 is disposed between the cutting load support part 322 and the horizontal transfer part 323 and is perpendicular to the cutting load support part 322 so that the guide roller 325b is in close contact with the guide surface 324b of the horizontal guide part 324. Exerts the elastic force of. As an example, it is desirable that the vertical contact elastic portion 328 is a spring.

  As described above, according to the present embodiment, the film cutter 321b of the film cutting unit 321 moves in the horizontal direction with respect to the adhesive film 20, and the adhesive film 20 is selectively cut out of the roll film 30. The impact generated when cutting 20 can be minimized to prevent a cutting error, and the useful life of the film cutter 321b can be further extended. In particular, when the film cutter 321b is a circular cutter, the service life of the film cutter 321b can be further extended.

<Embodiment relating to adhesive film adhesion method>
With reference to FIGS. 1-11, the adhesive film adhesion method by this embodiment is demonstrated.

  First, referring to FIG. 1 and FIG. 2, the roll film supply roller 100 is disposed on one side and the roll film storage roller 200 is disposed on the other side. Subsequently, the roll film 30 in the roll film supply roller 100 reaches the roll film storage roller 200 via the auxiliary roller 600 and the support roller 700. At this time, the auxiliary roller 600 and the support roller 700 can prevent the roller film 30 from dripping due to a load. Here, the roll film 30 includes two layers of the deformed film 10 and the adhesive film 20, and the adhesive film 20 is an anisotropic conductive film including the conductive balls 22 as an example.

  On the other hand, when the roll film supply roller 100 and the roll film storage roller 200 rotate, the roll film 30 is moved from the roll film supply roller 100 to the roll film storage roller 200.

  Subsequently, referring to FIGS. 6, 7, and 8, the adhesive film 20 of the roll film 30 is moved along the direction parallel to the adhesive film 20 using the adhesive film cutting unit 320, that is, the adhesive film 20. Cut from one side to the other.

  Here, the step of cutting along the direction parallel to the adhesive film 20 includes the step of adsorbing the roll film 30 to the roll film adsorption unit 310 and disposing the adsorbed adhesive film 20 on the adhesive film cutting unit 310. It is desirable to include using and cutting along a direction parallel to the adhesive film 20.

  More specifically, first, the roll film 30 provided from the roll film supply roller 100 is adsorbed by the roll film adsorption unit 310 while being moved toward the roll film storage roller 200. At this time, the roll film suction unit 310 is preferably formed with a suction groove 312 for sucking the roll film 30 and attaching it to the lower surface 310 a of the roll film suction unit 310. The roll film adsorption unit 310 further includes guide protrusions 314 formed at both ends of the lower surface 310a of the roll film adsorption unit 310 so that the roll film 30 is guided to the center of the lower surface 310a of the roll film adsorption unit 310. It is desirable.

  Subsequently, the adhesive film cutting unit 320 moves from one side of the adhesive film 20 toward the other side and cuts the adhesive film 20. For example, the adhesive film cutting unit 320 includes a film cutting unit 321, a cutting load support unit 322, a horizontal transfer unit 323, a horizontal guide unit 324, a cutting guide unit 325, a vertical interval adjustment unit 326, a vertical interval elastic unit 327, and a vertical contact. It is desirable to include the elastic part 328.

  Here, the specific mechanism by which the adhesive film 20 is cut will be briefly described. The horizontal transfer unit 323 transfers the film cutting unit 321 combined with the cutting load support unit 322 to the roll film 30 side. The film cutter 321 b of the cutting unit 321 cuts the adhesive film 20.

  When the film cutting unit 321 is moved to the roll film 30 side, the cutting guide unit 325 coupled to the cutting load support unit 322 moves along the guide surface 324a of the horizontal guide unit 324, so that the film cutting unit The film cutter 321 b of 321 can cut the adhesive film 20 along a direction parallel to the adhesive film 20.

  On the other hand, prior to cutting the adhesive film 20 using the adhesive film cutting unit 310, only the adhesive film 20 is cut by the roll film 30 between the film cutter 321b and the lower surface 310a of the roll film adsorption unit 310. It is desirable to adjust the distance.

  Moreover, it is desirable that the adhesive film cutting unit 320 cuts two portions of the adhesive film 20 simultaneously. That is, it is desirable that the film cutting portions 321 are arranged in parallel so as to form a pair so that two portions of the adhesive film 20 can be cut simultaneously. As described above, the adhesive film cutting unit 320 cuts a predetermined section of the adhesive film 20, so that the adhesive film 20 can be divided into a part 20a to be removed and another part 20b to be left.

  On the other hand, the other detailed description with respect to each component of the adhesive film cutting unit 320 refers to the embodiment of the adhesive film attachment facility.

  9, 10, and 11, after the adhesive film cutting unit 320 cuts the adhesive film 20, the removed portion 20 a of the adhesive film 20 is separated from the deformed film 10 and removed. Thereby, the cutting groove 24 is formed in the adhesive film 20.

  The step of removing the removed portion 20a of the adhesive film 20 will be described in detail. After the adhesive film cutting unit 320 is moved away from the roll film 30, the adhesive film removal unit 330 is moved to the roll film adsorption unit 310. It raises toward the roll film 30 arrange | positioned at the lower surface 310a.

  At this time, the adhesive film removing unit 330 includes a vertical moving body 332 that reciprocates in a direction perpendicular to the roll film 30 and a release tape 334 that is disposed so as to surround one surface of the vertical moving body 332 that faces the roll film 30. It is desirable to include. That is, the peeling tape 334 is attached to the adhesive film 20 when the vertical moving main body 332 reciprocates in the direction perpendicular to the roll film 30, and separates a part 20 a of the adhesive film 20 from the deformed film 10. Such a peeling tape 334 moves a part 20a of the adhesive film 20 attached by moving in the lateral direction as shown in FIG. As a result, the release tape 334 can perform the adhesive film removing operation again.

  Finally, referring to FIGS. 3, 4 and 5, the other part 20 b of the adhesive film 20 left on the deformed film 10 is attached to the substrate 50. That is, the other part 20 b of the adhesive film 20 left after the part 20 a of the adhesive film 20 is removed is attached onto the pad part 52 of the substrate 50 using the pressure unit 500.

  The step of attaching the other part 20 b of the adhesive film 20 to the substrate 50 will be described in detail. After the substrate 50 is arranged on the substrate support base 400, the roll film 30 is attached to the substrate 50 using the pressure unit 500. The other portion 20 b of the adhesive film 20 is attached onto the pad portion 52 of the substrate 50 by applying pressure.

  Eventually, when the pressing unit 500 returns to the original position before pressing the roll film 30, the other portion 20 b of the adhesive film 20 is separated from the deformed film 10 and attached onto the pad portion 52 of the substrate 50. At this time, a process of aligning the other portion 20b of the adhesive film 20 and the pad portion 52 of the substrate 50 is performed so that the other portion 20b of the adhesive film 20 is accurately attached onto the pad portion 52 of the substrate 50. It is desirable that

  Meanwhile, it is preferable that the substrate 50 on which the other portion 20 b of the adhesive film 20 is attached is unloaded by a substrate transfer unit (not shown), and a new substrate is loaded on the substrate support 400.

  Finally, when the other part 20 b of the adhesive film 20 is attached to the substrate 50, only the deformed film 10 remains on the roll film 30, and such a roll film 30 is moved and stored in the roll film storage roller 200. The

  As described above, according to the present embodiment, the adhesive film 20 of the roll film 30 is cut from one side of the adhesive film 20 toward the other side so that the impact generated when the adhesive film 20 is cut is minimized. Mistakes can be prevented.

  According to the present invention, when the film cutter of the film cutting part moves from one side of the adhesive film toward the other side and selectively cuts only the adhesive film of the roll film, the adhesive film is cut. The generated impact can be minimized to prevent cutting mistakes.

  Further, as in the present invention, when the film cutter moves from one side of the adhesive film toward the other side to cut the adhesive film, that is, the film cutter moves in a direction parallel to the adhesive film. In the case of cutting the film cutter, the life of the film cutter can be extended as compared with the conventional case where the film cutter moves in the direction perpendicular to the adhesive film to cut the adhesive film. When the cutter is a circular cutter, the lifetime of the film cutter can be further extended.

  As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited to the embodiments, and any ordinary knowledge in the technical field to which the present invention belongs can be used without departing from the spirit and spirit of the present invention. The present invention can be modified or changed.

FIG. 1 is a view conceptually showing an adhesive film deposition facility according to an embodiment of the present invention. It is drawing which expanded and showed the board | substrate support stand and the pressurization unit site | part in the adhesive film adhesion installation of FIG. It is drawing which showed notionally the state in which a pressurization unit pressurizes a roll film in the adhesive film adhesion installation of FIG. It is drawing which showed in detail the state in which a pressurization unit pressurizes a roll film in FIG. It is drawing which showed in detail the state after a pressurization unit pressurized the roll film in FIG. It is the side view which showed the adhesive film cutting apparatus in the adhesive film adhesion equipment of FIG. FIG. 7 is a side view showing a state in which the adhesive film cutting unit cuts the adhesive film in the adhesive film cutting apparatus of FIG. 6. It is the front view which showed the state which the adhesive film cutting unit of FIG. 7 cut | disconnects an adhesive film. FIG. 7 is a side view showing a state in which the adhesive film removing unit separates the cut portion of the adhesive film from the deformed film in the adhesive film cutting apparatus of FIG. 6. It is the front view which showed the state which the adhesive film removal unit of FIG. 9 isolate | separated the cut part of the adhesive film from the deformed film. It is the side view which showed the state which moves the cut part of the adhesive film isolate | separated in FIG.

Explanation of symbols

10 deformed film,
20 adhesive film,
30 roll film,
50 substrates,
100 roll film supply roller,
200 roll film storage roller,
300 adhesive film cutting device,
310 roll film adsorption unit,
320 adhesive film cutting unit,
321 film cutting part,
322 Cutting load support,
323 horizontal transfer section,
324 horizontal guide,
325 cutting guide,
326 vertical interval adjuster,
327 vertical spacing elastic part,
328 vertical adhesion elastic part,
330 adhesive film removal unit,
400 substrate support,
500 pressure unit,
600 auxiliary rollers,
700 support rollers,
1000 Adhesive film attachment equipment.

Claims (30)

A roll film adsorption unit for adsorbing a roll film composed of two layers of an adhesive film and a deformed film;
An adhesive film cutting unit for cutting the adhesive film from one side to the other side of the adhesive film;
An adhesive film cutting device comprising: The adhesive film cutting unit is
A film cutting portion having a cutting load extending in one direction and a film cutter coupled to an end of the cutting load;
A cutting load support unit coupled to the cutting load and supporting the cutting load;
A horizontal transfer unit coupled to the cutting load support unit and configured to horizontally transfer the film cutting unit toward the adhesive film so that the adhesive film is cut by the film cutter. Item 2. An adhesive film cutting apparatus according to item 1.   3. The adhesive film cutting apparatus according to claim 2, wherein the film cutting portions are arranged in parallel so as to form a pair so that the adhesive film is simultaneously cut at two locations.   The adhesive film cutting apparatus according to claim 2, wherein a vertical separation distance between the film cutter and the roll film adsorption unit is equal to or less than a thickness of the deformed film. The adhesive film cutting unit is
A horizontal guide portion having a guide surface parallel to the adhesive film;
A guide load coupled to the cutting load support portion and extending in one direction, and coupled to the guide load, and rotates while contacting the guide surface to move the film cutter from the one side to the other side. The adhesive film cutting apparatus according to claim 2, further comprising a cutting guide portion having a guide roller that guides along a direction in which it heads.   The adhesive film cutting apparatus according to claim 5, wherein the horizontal guide unit is coupled to the roll film adsorption unit.   6. The adhesive film cutting apparatus according to claim 5, wherein the guide roller is coupled to one end of the guide load corresponding to the film cutter.   The adhesion according to claim 7, wherein a first separation distance between the film cutter and the cutting load support part is longer than a second separation distance between the guide roller and the cutting load support part. Film cutting device.   The adhesive film cutting apparatus according to claim 8, wherein a difference between the first separation distance and the second separation distance is equal to or greater than a width of the adhesive film. The adhesive film cutting unit is
A vertical distance adjusting unit coupled to the cutting load and configured to adjust a vertical distance between the cutting load and the guide load;
The adhesive film according to claim 5, further comprising a vertically spaced elastic part disposed between the cutting load and the guide load and exerting an elastic force in a vertical direction on the cutting load and the guide load. Cutting device. The adhesive film cutting unit is
A vertical contact elastic part disposed between the cutting load support part and the horizontal transfer part and exerting a vertical elastic force on the cutting load support part so that the guide roller is in close contact with the guide surface; The adhesive film cutting apparatus according to claim 10.   The adhesive film cutting apparatus according to claim 10, wherein the vertical interval adjusting unit and the vertical interval elastic unit are disposed on opposite sides when viewed from the cutting load support unit.   The adhesive film cutting apparatus according to claim 10, wherein the vertical distance adjusting unit is a micrometer capable of precisely adjusting a distance between the cutting load and the guide load.   The adhesive film cutting apparatus according to claim 2, wherein the film cutter is a circular cutter.   The adhesive film cutting apparatus according to claim 1, further comprising an adhesive film removing unit that separates a part of the adhesive film cut by the adhesive film cutting unit from the deformed film. The adhesive film removing unit is
A vertically moving main body disposed below the roll film adsorption unit and reciprocally moved in a direction perpendicular to the roll film;
The release tape is disposed so as to surround one surface of the vertically moving main body facing the roll film, and separates and removes a part of the adhesive film from the deformed film. Adhesive film cutting device.   The adhesive film cutting apparatus according to claim 1, wherein a suction hole for adsorbing the roll film is formed in the roll film adsorption unit.   The adhesive film cutting apparatus according to claim 1, wherein the adhesive film is an anisotropic conductive film including a conductive ball. A roll film supply roller for supplying a roll film composed of two layers of an adhesive film and a deformed film;
A roll film storage roller that is spaced apart from the roll film supply roller and stores the roll film;
A roll film adsorbing unit that is disposed between the roll film supply roller and the roll film storage roller and adsorbs the roll film, and adhesive film cutting that cuts the adhesive film from one side to the other side An adhesive film cutting device having a unit;
A substrate support that is disposed between the adhesive film cutting device and the roll film storage roller, and a substrate is disposed on a surface facing the roll film;
A pressure unit that is arranged to face the substrate support via the roll film and presses the roll film toward the substrate in order to attach the cut adhesive film to the substrate; An adhesive film attachment facility comprising:   20. The adhesive film attachment facility according to claim 19, further comprising an auxiliary roller disposed between the roll film supply roller and the roll film storage roller to prevent the roll film from dripping. The auxiliary roller is
A supply side auxiliary roller disposed between the roll film supply roller and the adhesive film cutting device;
21. The adhesive film adhesion facility according to claim 20, further comprising: a storage side auxiliary roller disposed between the substrate support and the roll film storage roller. Placing a roll film comprising two layers of an adhesive film and a deformed film;
Cutting the adhesive film from one side to the other side of the adhesive film using an adhesive film cutting portion. An adhesive film cutting method comprising: Cutting the adhesive film comprises:
Moving the adhesive film cutting part from the one side to the other side to cut the adhesive film;
The adhesive film cutting method according to claim 22, further comprising: moving the film cutting portion from the other side to the one side. The adhesive film cutting part is
A cutting load formed in one direction,
24. The adhesive film cutting method according to claim 23, further comprising: a film cutter coupled to an end of the cutting load and cutting the adhesive film.   25. The adhesive film cutting method according to claim 24, wherein the roll film is adsorbed by a roll film adsorption unit and disposed on a lower surface of the roll film adsorption unit. Cutting the adhesive film comprises:
The adhesion according to claim 25, further comprising adjusting a distance between the film cutter and the lower surface of the roll film adsorption unit so that only the adhesive film of the roll film is cut. Film cutting method.   The adhesive film cutting method according to claim 24, wherein the film cutter is a circular cutter fixed to the cutting load so as not to rotate.   The adhesive film cutting method according to claim 22, further comprising the step of separating a part of the cut adhesive film from the deformed film using an adhesive film removing unit. Cutting the adhesive film out of a roll film consisting of two layers of a deformed film and an adhesive film, from one side of the adhesive film to the other side using an adhesive film cutting unit;
Separating a portion of the cut adhesive film from the deformed film using an adhesive film removal unit;
Adhering another part of the adhesive film left on the deformed film to a substrate using a pressure unit.   30. The method of adhering an adhesive film according to claim 29, wherein the adhesive film is an anisotropic conductive film including a conductive ball.

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