1373813 九、發明說明 【發明所屬之技術領域】 本發明係關於爲了在構成液晶顯示器、電漿顯示器、 有機電致發光（EL)顯示器等平面顯示裝置的顯示面板等 所構成的基板上搭載驅動電路等半導體電路裝置，而在此 基板貼附 ACF( Anisotropic Conductive Film)之用的 ACF貼附裝置及包含藉由此ACF貼附裝置所貼附的ACF 之平面顯示裝置。 【先前技術】 液晶顯示器，例如係於形成液晶封入空間的上下2枚 透明基板所構成的液晶面板上透過半導體電路裝置連接印 刷電路板之構成。此處，半導體電路裝置係驅動電路，此 驅動電路具備內側及外側之電極，內側之電極被導電連接 於構成液晶面板之一方基板，此外外側之電極被導電連接 於印刷電路板。作爲驅動電路之搭載方式之具有代表性者 ，例如有直接把晶片狀的1C封裝連接於液晶面板與印刷 電路板之COG (Chip On Glass)方式，或把在薄膜狀之基 板上搭載驅動電路之TCP ( Tape Carrier Package)連接於 液晶面板與印刷電路板之TAB ( Tape Automated Bonding )方式。 無論哪一種，在構成液晶面板之一方基板的表面，至 少於2邊被形成配線圖案，此配線圖案之電極與驅動電路 之內側電極被導電連接。亦即，於液晶面板以微小間距間 -5- 1373813 隔設有配線圖案，但於被搭載的半導體電路裝置特定數的 電極被形成爲群。此外，於這些複數之電極群，相鄰接的 電極群間成爲空白區域。又，驅動電路也被連接於印刷電 路板，因此於印刷電路板側，也與液晶面板側同樣，特定 數之電極群被形成複數群。此處，構成印刷電路板側之電 極群的配線數目，通常比液晶面板側之電極群之配線數還 要少。 連接作爲半導體電路裝置之驅動電路，與液晶面板或 者印刷電路板時，確實導電連接被排列爲微小間隔的多數 電極間，而且必須要固定驅動電路。因此，使用 ACF。 ACF係於有黏性的黏接樹脂均勻分散微小的導電粒子。藉 由熱壓接此ACF，電極間透過導電粒子被導電連接，而且 藉由加熱使黏接樹脂硬化，使驅動電路固定於液晶面板或 印刷電路板。 例如，在液晶面板之一方基板之設置配線圖案的部位 貼附ACF而且作爲驅動電路之TCP被TAB搭載於此基板 。黏接物質之ACF，透過剝離層被層積於紙帶上，藉此構 成ACF帶。此ACF帶被捲繞於供給捲軸，由此供給捲軸 送出，藉由貼附單元貼附於基板表面。因此，於貼附單元 ，設有裝設供給捲軸之構件，此外爲了使由供給捲軸所供 給的ACF帶沿著特定的路線繞拉，在適當之處所配置有 由導引輥等所構成之導引構件。 對基板之ACF的貼附，有跨基板之一邊的全長連續 貼附之統括貼附，以及分割爲各個之每個電極群，於空白 -6- 1373813 區域不使ACF附著的方式貼附之分割貼附。統括貼 因爲在不必要的空白區域也被貼附ACF所以會產生 的浪費，此外在空白區域構成ACF之具有黏接性的 與導電粒子維持於露出的狀態，所以會對驅動電路搭 之處理或加工造成不便。亦即，以分割貼附較佳。 專利文獻1揭示著於基板之各電極群進行ACF 割貼附之方式。於此專利文獻1，將保持次貼附長度 的ACF之保持部在旋轉體之旋轉方向上複數排列， 持被接合紙帶之ACF帶切斷爲貼附長度，使紙帶被 於保持部。接著，此保持部藉由可出沒地設置於旋轉 軸（shaft )而接觸離開液晶面板。 使構成液晶面板的基板移動，使各個之電極群與 體依序面對的方式定位於各特定之間距間隔。接著， 使連接於保持部的軸伸長，將被吸附於此保持部的 與紙帶之層積帶按壓於基板。接著，藉由保持部將紙 持於吸附狀態，藉由把軸拉入旋轉體側，使ACF由 剝離而被貼附於基板。 〔專利文獻1〕日本專利特開平9-8 3114號公報 【發明內容】 〔發明所欲解決之課題〕 前述之專利文獻1，基板係藉由工作台部而可移 X、Y、P方向地被支撐著，此外於此工作台部設有 承接。ACF之貼附側在框架安裝旋轉體，於此旋轉體 附， 材料 樹脂 載後 的分 份量 將維 吸附 體之 旋轉 藉由 ACF 帶保 紙帶 動於 基板 之外 1373813 周面被設有複數個保持分個的ACF之保持部。接著，使 旋轉體可以升降以及索引旋轉。亦即，可以使工作台部移 動同時使旋轉體旋轉，而且使其下降，藉由對基板承接施 加加壓力，被保持於保持部的ACF被貼附於基板之設置 電極群的各部位。如此般，基板承接被設於工作台部側， 藉由旋轉體於ACF每次被貼附基板與基板承接都一起被 間距長度饋送，所以基板承接至少必須要有及於基板之 ACF貼附部的全長之長度。 如果是小型的基板，基板承接之尺寸也短，在按壓側 之旋轉體與基板承接之間即使稍有尺寸誤差或者組裝誤差 ，也可以保持高的ACF貼附精度，但但是大型的基板從 基板承接之一方的端部起至另一方端部爲止之間會產生誤 差的累積。那樣的話，根據旋轉體之加壓力不會跨ACF 全體爲維持均等，會產生加壓不均，會產生貼附不良。 本發明有鑑於以上之問題，目的在於對基板貼附ACF 時，跨基板之全長作用均等之加壓力。 〔供解決課題之手段〕 爲達成前述目的，本發明之向異性導電膜（ACF )貼 附裝置，係以複數之電極爲群在被形成複數群的基板上對 各個電極群個別的貼附向異性導電膜（ACF )之向異性導 電膜（ACF )阽附裝置，其特徵係由基板支撐台、貼附單 元以及搬送手段所構成；前述基板支撐台將前述基板支撐 於水平狀態；前述貼附單元，係包含ACF帶之供給捲軸 -8- 1373813 被設定，或者將由此供給捲軸所送出的ACF，在 其具有連續性，依對前述基板之各個的電極群之 度份量來切斷ACF之半切割手段，以及把藉由 手段所切斷的ACF壓接於前述基板的表面之壓 述搬送手段，係前述壓接頭定位於被載置於前述 台的前述基板之各 ACF貼附位置而搬送前述貼 前述壓接頭，係由加壓刃，及承接刃所構成，前 係夾著前述基板與此加壓刃對向配置，承接根據 刃對前述 ACF與前述基板之加壓力，這些加壓 刃至少具有前述ACF之貼附尺寸份量之長度； 刃及前述承接刃，具有分別在對基板接近/遠離 獨立驅動的升降驅動手段。 如此般，ACF貼附裝置，係由貼附單元，及 單元朝向基板之電極群的排列方向移動，且於各 附位置上進行定位之搬送手段所構成，於此搬送 而可以設置升降驅動貼附單元之升降驅動部，此 手段可以設於貼附單元，此半切割手段可以移動 置與退避位置。接著，藉由根據升降驅動部而可 附單元，半切割手段配置在動作位置時，能夠以 板間之干涉的方式來設定。進而，於升降驅動部 移動驅動部亦可。 亦即，藉由半切割手段切斷的前後之ACF 貼附對象，所以加壓刃以及承接刃的長度尺寸至: 之貼附尺寸份量。但是，加壓刃及承接刃的長度 該紙帶使 各貼附長 此半切割 接頭；前 基板支撐 附單元； 述承接刃 前述加壓 刃及承接 前述加壓 的方向上 使此貼附 ACF貼 手段，進 外半切割 於動作位 以升降貼 避免與基 設置前後 部位成爲 少爲 ACF 尺寸並不 -9- 限於貼附的ACF的長度，加壓刃可以比被切斷的ACF帶 的長度更長。在此場合，貼附ACF時，加壓刃及承接刃 之多於長度部分被配置於已經完成貼附的紙帶的部位。使 加壓刃比ACF之貼附長度更長的話，對於電極群的長度 尺寸不同的複數種類之基板，或者是對相同的基板，而短 邊側與長邊側電極群的長度不同的場合，也可以對應。 於ACF帶，將構成黏接層的ACF貼附於基板時，必 須要在基板與貼附單元之間進行位置對準，但此位置對準 將基板保持爲固定，而進行貼附單元的位置調整的方式亦 爲可行，此外在支撐基板的基板支撐台側設置位置調整機 構亦可。 構成壓接頭的加壓刃以及承接刃爲分別獨立進行升降 動作之構成。加壓刃在壓接時對 ACF帶施加加壓力。加 壓刃及承接刃可以安裝於分別被升降驅動的升降塊。接著 ’此二升降塊，亦可藉由分別獨立的導引手段來進行升降 驅動，此外也可以設置共通的導引手段。 如以上所述構成A C F貼附裝置，但a C F係將半導體 電路基板搭載於基板，此搭載半導體電路元件之基板，亦 可爲印刷電路板，但在包含液晶顯示器等平面顯示器之面 板，特別是大型的面板上搭載特定數目的驅動電路者，則 更爲適用。 〔發明之效果〕 如以上所述，在基板上貼附ACF時，對此ACF藉由 1373813 於往基板之電極群的每個貼附長度份量在承接刃與加壓刃 之間加壓，對於ACF而言，可以跨幾乎全面施加均勻的 加壓力，可以確實防止貼附不良的產生。 【實施方式】 以下，參照圖面說明本發明之實施型態。首先，於圖 1作爲ACF被貼附的基板之一例顯示液晶面板，此外作爲 透過ACF搭載之半導體電路裝置之一例，顯示於基板被 TAB搭載的TCP所構成的驅動電路。又，基板不僅是構 成液晶面板者，亦可爲其他顯示器用之基板，或其他各種 印刷電路板，此外被搭載於基板者不限於驅動電路，亦可 以適用透過ACF被導電連接的各種半導體電路裝置。 於圖1，1係液晶面板，此液晶面板1，係以由玻璃薄 板所構成的下基板2與上基板3 —起構成，於兩基板2、3 間被封入液晶。下基板2，於其至少2邊，由上基板3僅 伸出特定寬幅份，於此伸出部2a被搭載複數枚在薄膜基 板4a實裝積體電路元件4b之驅動電路4。 於下基板2之伸出部2a，被設有在兩基板2、3被重 疊的部位所形成的TFT (薄膜電晶體）分別連接之配線所 連接的特定數目的電極，這些電極，如圖中之符號5所示 ，於驅動電路4之各搭載部特定數目之電極被形成爲群。 接著，各電極群5之左右兩側被形成對準標記6a、6a。亦 即，相鄰皆的電極群5、5間被形成具有特定寬幅之空白 區域，也就是未被設置電極的部位。另一方面，於驅動電 -11 - 1373813 路4，設有與構成這些電極群5的各電極導電連接的複數 電極，與電極群5連接的電極群以符號7表示》此外，驅 動電路4也在電極群7的左右兩側被形成對準標記6b、6b ，驅動電路4被搭載於液晶面板1時，以這些對準標記爲 基準以構成電極群7的各電極與構成電極群5的各電極成 爲一致的方式調整位置。 驅動電路4透過ACF 8被搭載於液晶面板1。ACF 8 如眾所周知的，係在具有黏接功能的黏接樹脂分散多數微 小的導電粒子者，藉由在驅動電路4與液晶面板1之間加 熱及加壓ACF 8，透過導電粒子使得構成電極群5的各電 極與構成電極群7的各電極成爲電氣導通的狀態，而且藉 由黏接樹脂進行熱硬化，使驅動電路4固接於液晶面板1 。此處，ACF 8被分割於設在下基板2之伸出部2a之電 極群5之各位置，於每長度L份被貼附。藉此，可以無浪 費地使用ACF 8，而且被貼附的ACF幾乎完全藉由驅動電 路4覆蓋* 圖2至圖4顯示在供在下基板2之伸出部2a貼附 ACF 8之用的貼附機構之槪略構成。於這些圖，9係將液 晶面板1保持於水平狀態之支撐基台。液晶面板1，例如 藉由真空吸附手段，安定地被保持於此支撐基台9上。此 處，於支撐基台9液晶面板1係以寬廣的面積抵接，被貼 附ACF 8的下基板2的伸出部2a的下部位置是開放的。 於支撐基台9，可以爲了其與驅動電路4之位置對準等的 用途，設置往X、Y、0方向之位置調整手段。 -12- 1373813 此外，10係ACF 8之往液晶面板1的貼附 貼附單元10係具有設在鉛直方向的安裝板體， 11係可拆裝地被安裝著。ACF 8被層積於紙帶 層上構成ACF帶13，此ACF帶13被捲繞於供 。ACF帶13，沿著安裝於貼附單元10的輥14 成的行進路線被導引前進。進而，18係驅動用輥 ACF 8貼附於液晶面板1之後的紙帶12，以送 1 9的方式被驅動。 輥14、15係ACF帶13之饋送用的導引輥 15被安裝於搖擺臂20，此搖擺臂20係以旋轉朝 心進行擺動。於轉動軸21被連接著馬達等驅動 圖示），使搖擺臂20往箭頭F方向搖動時，由 1 1至少送出1次貼附份，亦即圖1所示之長度 的ACF帶13被送出，滯留輥14、15間。結 ACF帶13時作用的反力總是成爲一定，不會隨 軸Π的捲繞量的差異所導致對饋送力的阻力改變 輥16、17亦如圖5及圖6所示，係將ACF 其行進路線導引於水平方向，規定ACF 8之往液 之1次份量之貼附長度的水平導引輥。水平導引 定ACF 8之貼附開始位置，水平導引輥16規定 貼附終點位置，藉由這些設定ACF 8之貼附區域 引輥16、17由圖6可知係於圓筒部16a、17a之 成鍔部16b、17b者，此鍔部16b、17b之由圓筒 17a突出的部位的高度與ACF帶13之紙帶12的 單元，此 供給捲軸 1 2之剝離 給捲軸1 1 〜1 7所構 ，挾持將 入排出部 ，導引輥 J 21爲中 手段（未 供給捲軸 L之份量 果，饋送 著供給捲 〇 帶13於 晶面板1 輥17規 ACF 8 之 。水平導 兩側部形 部 1 6a、 厚度份量 -13- 1373813 幾乎相同，或者是僅比其稍大的尺寸。 亦即，在水平導引輥16、1 7間ACF 8被貼附於液晶 面板1，其後由紙帶12分離。接著，在比水平導引軌17 更爲下游側的位置，剝離ACF 8後的紙帶12被回收。比 藉由水平驅動輥16、17所區隔的ACF 8之貼附區域更下 游側的位置設有驅動用輥18。驅動用輥18係由驅動輥 18a與間距輥i8b所構成，紙帶12被挾持於這些驅動輥 18a與間距輥i8b之間。藉由旋轉驅動驅動輥18a，使 ACF帶12每長度L份量地被斷續饋送。 由圖3可知，貼附單元1〇被安裝於升降驅動部22， 此升降驅動部22被安裝於前後驅動部23，進而前後驅動 部23被安裝於構成搬送手段的平行移動驅動部24。藉由 這些機構，可以使藉由ACF帶13之拉繞路徑之水平導引 輥16〜1 7間（參照圖2 )所規定的ACF 8的貼附區域在 上下方向，亦即Z軸方向，在水平面則可以在X軸方向（ 與電極群5的排列直交的方向）與γ軸方向（電極群5之 排列方向）上移動及調整位置。另一方面，液晶面板1藉 由真空吸附被固定地保持於支撐基台9上。 此處，有必要調整水平導引輥16〜17間之ACF帶13 與下基板2之電極群5之相對位置，但前後移動驅動部23 ，係使貼附區域對液晶面板1移動於接近/遠離的方向者 ’平行移動驅動部24係移動於液晶面板1之與電極群5 的排列方向平行的方向，亦即係於γ軸方向使貼附區域移 動者，所以雖可在貼附單元1 0側可進行位置調整，但如 -14- 1373813 前所述，於支撐基台9設有往χ、γ、0方向的位置調整 手段的場合，在這支撐基台9側對ACF帶13可以進行位 置對準。 升降驅動部22，具有傾斜塊30、及使此傾斜塊3〇移 動於前後方向之用的汽缸31 (或者馬達）。此外，於貼附 單元10被連結著卡合於傾斜塊30的傾斜面之滑動構件32 ’此滑動構件32具有與傾斜塊30 —致的傾斜面，藉由限 制桿33而成爲除上下方向以外無法位移之構成。藉此， 驅動汽缸31的話，貼附單元1〇可以在上下方向上位移。 接著，前後移動驅動部23，係供使安裝傾斜塊30的 台座34前後移動之用者，此台座之往復移動係藉由汽缸 、馬達等所構成的驅動手段35來進行的。接著，水平移 動驅動部24’具有台座34以及安裝了其驅動手段35之搬 送台36’搬送台36藉由以馬達38旋轉驅動構成滾珠螺桿 饋送手段的滾珠螺桿37，而使貼附單元1〇可以移動於液 晶面板1之與電極群5的排列方向平行的方向上。 於安裝於貼附單元10的ACF帶12之行進路線，如 圖8所示’在比水平導引輥1 6的位置稍微下游側的位置 設有半切割手段40，此半切割手段40係對貼附單元10的 表面可在前後方向往復移動地被安裝著。此半切割手段40 如圖1所示，具備切刀41與切刃承接42，切刃41如該圖 箭頭所示，以軸43爲中心在接近/遠離切刃承接42的方 向上可以轉動》總是藉由作用於切刃41的彈簧44之彈力 保持離開切刃承接42的狀態，藉由設在汽缸45的壓動輥 -15-[Technical Field] The present invention relates to mounting a drive circuit on a substrate formed of a display panel or the like constituting a flat display device such as a liquid crystal display, a plasma display, or an organic electroluminescence (EL) display. In the case of a semiconductor circuit device, an ACF attaching device for ACF (Anisotropic Conductive Film) and a flat display device including the ACF attached by the ACF attaching device are attached to the substrate. [Prior Art] A liquid crystal display is connected to a printed circuit board through a semiconductor circuit device, for example, on a liquid crystal panel formed by two upper and lower transparent substrates forming a liquid crystal sealing space. Here, the semiconductor circuit device is a drive circuit having electrodes on the inner side and the outer side, the inner electrodes are electrically connected to one side of the liquid crystal panel, and the outer electrodes are electrically connected to the printed circuit board. As a representative of the mounting method of the driving circuit, for example, a COG (Chip On Glass) method in which a wafer-shaped 1C package is directly connected to a liquid crystal panel and a printed circuit board, or a driving circuit is mounted on a film-shaped substrate. TCP ( Tape Carrier Package) is connected to the TAB ( Tape Automated Bonding) method of the liquid crystal panel and the printed circuit board. In either case, a wiring pattern is formed on less than two sides of the surface constituting one of the liquid crystal panels, and the electrode of the wiring pattern and the inner electrode of the driving circuit are electrically connected. In other words, the wiring pattern is interposed between the liquid crystal panels with a fine pitch of -5 - 1373813, but the number of electrodes of the mounted semiconductor circuit device is formed in a group. Further, in these plural electrode groups, a gap region is formed between adjacent electrode groups. Further, since the drive circuit is also connected to the printed circuit board, a specific number of electrode groups are formed in a plurality of groups on the side of the printed circuit board as well as on the liquid crystal panel side. Here, the number of wirings constituting the electrode group on the side of the printed circuit board is usually smaller than the number of wirings of the electrode group on the liquid crystal panel side. When a driving circuit as a semiconductor circuit device is connected, and a liquid crystal panel or a printed circuit board is provided, it is sure that the conductive connection is arranged between a plurality of electrodes which are minutely spaced, and the driving circuit must be fixed. Therefore, use ACF. ACF is a viscous adhesive resin that evenly disperses tiny conductive particles. By thermally bonding the ACF, the electrodes are electrically connected through the conductive particles, and the bonding resin is hardened by heating to fix the driving circuit to the liquid crystal panel or the printed circuit board. For example, the ACF is attached to a portion of the liquid crystal panel where the wiring pattern is provided, and the TCP as the drive circuit is mounted on the substrate by the TAB. The ACF of the adhesive substance is laminated on the paper web through the release layer, thereby forming an ACF tape. This ACF tape is wound around a supply reel, whereby the supply reel is fed out and attached to the surface of the substrate by the attaching unit. Therefore, in the attaching unit, a member for mounting the supply reel is provided, and in order to guide the ACF belt supplied from the supply reel along a specific route, a guide constituted by a guide roller or the like is disposed where appropriate. Leading member. Attachment of the ACF to the substrate is performed by attaching the entire length of one side of the substrate to the entire length of the substrate, and dividing into each of the electrode groups, and attaching the ACF in a blank area of the gap -6-1373813 Attached. As a result, the ACF is attached to the ACF in an unnecessary blank area, and the adhesive is generated in the blank area. The conductive particles are kept in an exposed state, so that the driving circuit is processed or Processing is inconvenient. That is, it is preferable to attach by splitting. Patent Document 1 discloses a method of performing ACF cutting on each electrode group of a substrate. In Patent Document 1, the holding portions of the ACF holding the sub-attachment length are arranged in plural in the rotation direction of the rotating body, and the ACF tape holding the bonded paper tape is cut into the attaching length to cause the paper tape to be placed on the holding portion. Then, the holding portion comes into contact with the liquid crystal panel by being disposed on the rotating shaft. The substrate constituting the liquid crystal panel is moved so that the respective electrode groups and the body face each other in a predetermined interval. Next, the shaft connected to the holding portion is extended, and the laminated tape with the paper tape adsorbed to the holding portion is pressed against the substrate. Then, the holding portion holds the paper in the suction state, and the ACF is peeled off and attached to the substrate by pulling the shaft into the rotating body side. [Problem to be Solved by the Invention] In the above-mentioned Patent Document 1, the substrate can be moved in the X, Y, and P directions by the table portion. It is supported, and it is also supported by this workbench. The attachment side of the ACF is attached to the rotating body of the frame, and the rotating body is attached. The component of the material resin is loaded, and the rotation of the adsorbent body is carried by the ACF tape to the substrate. 1373813 is provided with a plurality of holdings. A separate ACF retention department. Next, the rotating body can be raised and lowered and the index rotated. In other words, the table portion can be moved while the rotating body is rotated, and the rotating body can be lowered. By applying pressure to the substrate, the ACF held by the holding portion is attached to each portion of the set electrode group of the substrate. In this way, the substrate receiving portion is disposed on the side of the table portion, and the rotating body is fed by the pitch length along with the substrate in the ACF. The substrate receiving portion must have at least the ACF attaching portion of the substrate. The length of the full length. If it is a small substrate, the size of the substrate is also short, and even if there is a slight dimensional error or assembly error between the rotating body on the pressing side and the substrate, a high ACF attaching precision can be maintained, but a large substrate is used as the substrate. Accumulation of errors occurs between the end of one of the ends and the end of the other. In this case, the pressing force of the rotating body does not maintain uniformity across the entire ACF, and uneven pressurization occurs, resulting in poor adhesion. The present invention has been made in view of the above problems, and an object thereof is to apply equal pressure to the entire length of the substrate when the ACF is attached to the substrate. [Means for Solving the Problem] In order to achieve the above object, the anisotropic conductive film (ACF) attaching device of the present invention has a plurality of electrodes as a group and is attached to each electrode group on a substrate on which a plurality of groups are formed. An anisotropic conductive film (ACF) anisotropic conductive film (ACF) attaching device, characterized by a substrate supporting table, a attaching unit, and a conveying means; the substrate supporting table supports the substrate in a horizontal state; the attaching The unit, the supply reel -8-1373813 including the ACF tape is set, or the ACF fed from the supply reel is provided with continuity, and the half of the ACF is cut according to the degree of the electrode group of each of the substrates. The cutting means and the transfer conveying means for pressing the ACF cut by the means to the surface of the substrate, wherein the press fitting is positioned at each ACF attaching position of the substrate placed on the stage, and the transfer is performed. The pressing joint is formed by a pressing blade and a receiving blade, and the front plate is disposed opposite to the pressing blade with the substrate interposed therebetween, and receives the ACF and the substrate according to the edge pair Pressing force, the pressing edge has a length of at least the size of the weight of the patch of the ACF; blade and the receiving blade, respectively having a pair of substrates close to / away from the lifting drive means for independently driven. In this manner, the ACF attaching device is configured by a attaching unit and a transporting means for moving the unit toward the electrode group of the substrate, and positioning is performed at each of the attached positions, and the lifting and attaching can be provided for the transport. The lifting and lowering driving unit of the unit may be provided on the attaching unit, and the half cutting means may be moved to the retracted position. Then, by attaching the unit to the elevation drive unit, when the half-cutting means is disposed at the operation position, it can be set by interference between the plates. Further, the driving unit may be moved by the elevation driving unit. That is, the ACF attached to the front and back by the half-cutting means attaches the object, so the length of the pressing blade and the receiving blade is up to: However, the length of the pressing blade and the receiving blade is such that the tape is attached to each of the half-cut joints; the front substrate supports the attachment unit; the receiving blade is in the direction of the pressing blade and the direction of the pressing is applied to attach the ACF sticker. Means, the outer half cut in the action position to lift the stick to avoid the front and rear parts of the base to be less ACF size and not -9- limited to the length of the attached ACF, the pressure blade can be longer than the length of the cut ACF tape long. In this case, when the ACF is attached, the more than the length portion of the pressing blade and the receiving blade is disposed at the portion where the attached tape is completed. When the length of the bonding edge is longer than the length of the ACF, the length of the electrode group differs from the length of the substrate, or the length of the short side and the long side electrode group are different for the same substrate. It can also correspond. In the ACF tape, when the ACF constituting the adhesive layer is attached to the substrate, it is necessary to perform alignment between the substrate and the attaching unit, but the positional alignment keeps the substrate fixed, and the position of the attaching unit is adjusted. It is also possible to provide a position adjustment mechanism on the substrate support table side of the support substrate. The pressing blade and the receiving blade that constitute the pressure joint are configured to independently perform the lifting operation. The pressure blade applies a pressure to the ACF tape during crimping. The pressing blade and the receiving blade can be attached to the lifting blocks that are respectively driven by the lifting and lowering. Then, the two lifting blocks can be lifted and driven by independent guiding means, and a common guiding means can be provided. Although the ACF attaching device is configured as described above, the a CF system mounts the semiconductor circuit board on the substrate, and the substrate on which the semiconductor circuit element is mounted may be a printed circuit board. However, a panel including a flat panel display such as a liquid crystal display is particularly It is more suitable for a specific number of drive circuits on a large panel. [Effects of the Invention] As described above, when the ACF is attached to the substrate, the ACF is pressed between the receiving blade and the pressing blade by the length of each of the electrode groups of the 1373813 on the substrate. In the case of ACF, it is possible to apply a uniform pressing force almost completely, and it is possible to surely prevent the occurrence of poor adhesion. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, a liquid crystal panel is shown as an example of a substrate to which an ACF is attached, and a driving circuit including a TCP mounted on a substrate by TAB is shown as an example of a semiconductor circuit device mounted on the ACF. Further, the substrate may be not only a liquid crystal panel but also a substrate for other displays or other various printed circuit boards, and the substrate to be mounted on the substrate is not limited to a driving circuit, and various semiconductor circuit devices electrically connected by ACF may be applied. . In Fig. 1, a liquid crystal panel 1 is composed of a lower substrate 2 composed of a glass plate and an upper substrate 3, and a liquid crystal is sealed between the substrates 2 and 3. The lower substrate 2 has only a certain wide portion extending from the upper substrate 3 on at least two sides thereof, and the extension portion 2a is mounted with a plurality of drive circuits 4 on which the integrated circuit component 4b is mounted on the film substrate 4a. The protruding portion 2a of the lower substrate 2 is provided with a specific number of electrodes connected to the wirings respectively connected to the TFTs (thin film transistors) formed at the portions where the two substrates 2 and 3 are overlapped, and these electrodes are as shown in the figure. As indicated by reference numeral 5, a specific number of electrodes are formed in a group on each of the mounting portions of the drive circuit 4. Next, alignment marks 6a and 6a are formed on the left and right sides of each electrode group 5. That is, the adjacent electrode groups 5, 5 are formed with a specific wide blank area, that is, a portion where the electrode is not provided. On the other hand, a plurality of electrodes electrically connected to the respective electrodes constituting the electrode group 5 are provided on the drive circuit 11 - 1373813, and the electrode group connected to the electrode group 5 is indicated by reference numeral 7. Further, the drive circuit 4 is also When the alignment marks 6b and 6b are formed on the left and right sides of the electrode group 7, and the drive circuit 4 is mounted on the liquid crystal panel 1, the electrodes constituting the electrode group 7 and the respective electrode groups 5 are formed based on the alignment marks. The electrodes are adjusted in a consistent manner. The drive circuit 4 is mounted on the liquid crystal panel 1 through the ACF 8. As is well known, ACF 8 is formed by dispersing a plurality of minute conductive particles in a bonding resin having a bonding function, and heating and pressurizing ACF 8 between the driving circuit 4 and the liquid crystal panel 1 to form an electrode group through the conductive particles. Each of the electrodes of 5 and each of the electrodes constituting the electrode group 7 is electrically connected to each other, and is thermally cured by an adhesive resin to fix the drive circuit 4 to the liquid crystal panel 1. Here, the ACF 8 is divided at each position of the electrode group 5 provided in the overhang portion 2a of the lower substrate 2, and is attached at L portions per length. Thereby, the ACF 8 can be used without waste, and the attached ACF is almost completely covered by the drive circuit 4 * FIG. 2 to FIG. 4 show the sticker for attaching the ACF 8 to the extension 2a of the lower substrate 2. The strategic structure of the attached institution. In these figures, the 9 series holds the liquid crystal panel 1 in a horizontal support base. The liquid crystal panel 1 is stably held on the support base 9 by, for example, a vacuum suction means. Here, the liquid crystal panel 1 on the support base 9 abuts on a wide area, and the lower portion of the extension portion 2a of the lower substrate 2 to which the ACF 8 is attached is open. The support base 9 can be provided with position adjustment means in the X, Y, and 0 directions for the purpose of alignment with the position of the drive circuit 4. -12- 1373813 In addition, the attaching unit 10 of the 10A ACF 8 to the liquid crystal panel 1 has a mounting plate body provided in the vertical direction, and the 11 series is detachably attached. The ACF 8 is laminated on the paper layer to form an ACF tape 13, and the ACF tape 13 is wound around. The ACF tape 13 is guided forward along the traveling path formed by the rollers 14 attached to the attaching unit 10. Further, the 18-series driving roller ACF 8 is attached to the paper tape 12 after the liquid crystal panel 1, and is driven to be fed by 19. The guide rollers 15 for feeding the rollers 14, 15 to the ACF tape 13 are attached to the swing arm 20, and the swing arm 20 is swung by the center of rotation. When the swing shaft 21 is connected to the motor or the like, and the swing arm 20 is rocked in the direction of the arrow F, at least one attaching portion is fed by 1 1 , that is, the length of the ACF tape 13 shown in Fig. 1 is sent out. , between the retention rollers 14, 15. The reaction force acting when the ACF belt 13 is knotted is always constant, and the resistance to the feed force is not changed as the winding amount of the shaft turns. The rollers 16, 17 are also shown in Figs. 5 and 6, and the ACF is used. The travel route is guided in the horizontal direction, and the horizontal guide roller of the attached length of the ACF 8 is specified. The horizontal guide guides the attachment position of the ACF 8, and the horizontal guide roller 16 defines the attachment end position. The attachment rollers 16 and 17 of the attachment area ACF 8 are shown in Fig. 6 to be attached to the cylindrical portions 16a, 17a. The crotch portions 16b, 17b, the height of the portion of the crotch portion 16b, 17b protruding from the cylinder 17a and the unit of the paper tape 12 of the ACF tape 13, the supply reel 12 is peeled off to the reel 1 1 to 17 The structure is held into the discharge portion, and the guide roller J 21 is a medium means (the amount of the unloaded reel L is fed, and the supply winding tape 13 is fed to the wafer panel 1 roller 17 gauge ACF 8 . The portion 1 6a, the thickness portion -13 - 1373813 is almost the same, or is only slightly larger than the size. That is, the ACF 8 is attached to the liquid crystal panel 1 between the horizontal guide rollers 16, 17 and thereafter by the paper The belt 12 is separated. Then, at a position further downstream than the horizontal guide rail 17, the paper tape 12 after peeling off the ACF 8 is recovered. The attachment area of the ACF 8 which is separated by the horizontal driving rollers 16, 17 The drive roller 18 is provided at a position on the downstream side. The drive roller 18 is composed of a drive roller 18a and a spacer roller i8b, and the paper tape 12 is provided. It is held between the driving roller 18a and the spacing roller i8b. By rotationally driving the driving roller 18a, the ACF tape 12 is intermittently fed by the length L. As can be seen from Fig. 3, the attaching unit 1 is mounted on the lift The drive unit 22 is attached to the front and rear drive unit 23, and the front and rear drive unit 23 is attached to the parallel movement drive unit 24 constituting the transport means. By these mechanisms, the ACF belt 13 can be pulled. The attachment area of the ACF 8 defined by the horizontal guide rollers 16 to 17 of the path (refer to FIG. 2) is in the up and down direction, that is, the Z-axis direction, and in the horizontal plane in the X-axis direction (in alignment with the electrode group 5) The direction of the orthogonal direction is shifted and adjusted in the γ-axis direction (the direction in which the electrode groups 5 are arranged). On the other hand, the liquid crystal panel 1 is fixedly held on the support base 9 by vacuum suction. Here, it is necessary to adjust The relative positions of the ACF tape 13 between the horizontal guide rollers 16 to 17 and the electrode group 5 of the lower substrate 2, but the driving portion 23 is moved forward and backward so that the attachment region moves parallel to the direction in which the liquid crystal panel 1 moves closer to/away from The mobile drive unit 24 moves to the liquid crystal The direction in which the panel 1 is parallel to the direction in which the electrode groups 5 are arranged, that is, the attachment region is moved in the γ-axis direction. Therefore, the position adjustment can be performed on the side of the attachment unit 10, but before -14- 1373813 In the case where the support base 9 is provided with the position adjustment means in the χ, γ, and 0 directions, the ACF tape 13 can be aligned on the support base 9 side. The elevation drive unit 22 has the tilt block 30. And a cylinder 31 (or a motor) for moving the tilting block 3〇 in the front-rear direction. Further, the attaching unit 10 is coupled to the sliding member 32 that is engaged with the inclined surface of the inclined block 30. The sliding member 32 has an inclined surface that is identical to the inclined block 30, and is restricted by the restricting lever 33. The composition of the inability to shift. Thereby, when the cylinder 31 is driven, the attaching unit 1 can be displaced in the up and down direction. Next, the front and rear moving drive unit 23 is used to move the pedestal 34 to which the tilt block 30 is attached to the front and rear. The reciprocating movement of the pedestal is performed by a driving means 35 composed of a cylinder, a motor or the like. Next, the horizontal movement drive unit 24' has the pedestal 34 and the transfer table 36' to which the drive means 35 is attached. The transfer table 36 is rotated by driving the ball screw 37 constituting the ball screw feeding means by the motor 38, so that the attaching unit 1 is 〇 It is possible to move in a direction parallel to the arrangement direction of the electrode group 5 of the liquid crystal panel 1. In the traveling path of the ACF tape 12 attached to the attaching unit 10, as shown in FIG. 8, a half-cutting means 40 is provided at a position slightly downstream of the position of the horizontal guiding roller 16, and the half-cutting means 40 is paired. The surface of the attaching unit 10 can be mounted reciprocally in the front-rear direction. As shown in FIG. 1, the half-cutting means 40 is provided with a cutter 41 and a cutting edge receiving member 42, and the cutting edge 41 is rotatable in the direction of approaching/away from the cutting edge receiving member 42 as shown by the arrow in the figure. The state of leaving the cutting edge receiving member 42 is always maintained by the elastic force of the spring 44 acting on the cutting edge 41, by the pressing roller 15- provided in the cylinder 45.
1373813 46將切刃41壓動於抵抗彈簧44的方向上’ 移於接近切刃承接42的方向。接著，切刃 刃承接42的位置，其間被形成爲與ACF帶 的厚度相同，或者比其稍微短的間隔。藉此 被半切割。 進而，爲了使ACF 8貼附於下基板2 ACF帶13在水平導引輥16、17間的位置， 被壓接於下基板2的表面。因此，在貼附單 及圖9所示，設有壓接頭50。此處，液晶® 於支撐基台9上，但其下基板2之伸出部2; 伸出，壓接頭50成爲由上下挾持此伸出部右 壓接頭50係由加壓刃51與承接刃52 加壓刃51與承接刃52分別被安裝於升降塊 升降塊5 3、54沿著設在貼附單元1 〇之一業 於上下方向位移地被安裝著。加壓刃51與j 著液晶面板1被配置於上下，被形成爲相同 壓刃5 1，被導引於水平導引軌1 6、1 7間而 平方向上移動的ACF帶13更爲上方的位置 安裝承接刃52的升降塊54，藉由汽缸 程長度之升降勖作。亦即，使汽缸56爲縮 接刃52下降，成爲被配置在遠離液晶面板 ，使汽缸45伸長的話，承接刃52抵接於液 面。另一方面’在安裝加壓刃51的升降塊 57被連結設置。圖示之加壓手段57，係具 而使其擺動位 41在最接近切 :13之紙帶12 ，僅有 ACF 8 之伸出部2a， 藉由特定壓力 元10，如圖8 ;板1係被載置 a由支撐基台9 Ϊ的構成。 所構成，這些 53 、 54 。這些 才導引軌55可 民接刃5 2係夾 長度。接著加 被配置在比水 〇 56進行特定行 小狀態時，承 1的下方位置 晶面板1之下 5 3，加壓手段 有以馬達驅動 -16- 1373813 的饋送螺桿57a，構成所謂的千斤頂（jack)。此加壓手 ， 段57，使連結於加壓刃51而設的升降塊53沿著導引軌 55上下移動，使被承接於承接刃52上的液晶面板1由上 方被作用特定的加壓力。接著，加壓刃51與承受刃52係 以正確地保持平行度的方式構成的。此外，支撐承接承接 刃52的汽缸56，至少在上升行程端位置，不會因加壓手 段57所作用的加壓力而無謂地移動，被導入可以保持伸 φ 長狀態之壓力。 於構成壓接頭50的加壓刃51，或者於加壓刃51及承 接刃52雙方內藏著未圖示之加熱器，藉由此壓接頭50將 ACF帶13熱壓接於液晶面板1。加熱的程度係ACf 8之 黏接樹脂稍微軟化的程度之比較低的溫度，不使其喪失黏 接力。接著，構成壓接頭50的加壓刃51以及承接刃52, 具有可充分對應ACF帶13的寬幅之寬幅尺寸，而且於長 度方向之尺寸至少具有ACF 8之貼附長度L。 # 如以上所述，於貼附單元1 〇，被安裝有供給捲軸11 、由此供給捲軸1 1供給的ACF帶13之行進路線、半切 割手段40及壓接頭50。藉由此ACF貼附裝置，在液晶面 板1之下基板2的伸出部2a對被形成特定數目的電極群5 被貼附供進行TAB搭載驅動電路4之用所必要的ACF 8。 於支撐基板9上被貼附ACF 8的液晶面板1於特定位 置被水平狀態地配置被吸附保持。在此狀態，於液晶面板 1之下基板2，圖4所示之伸出部2a由支撐基台9突出， 於此伸出部2a被搭載特定枚數之驅動電路4。因此，藉由 -17- 1373813 滾珠螺桿7而被安裝貼附機構的貼附單元10以每隔圖1 所示之間距P在箭頭方向上被間斷饋送。 於液晶面板1被依序貼附長度L份量之ACF 8，因此 構成平行移動驅動部24之搬送台36被驅動，而貼附單元 10被位移至特定的貼附區域。此時，如圖8及圖9之箭頭 所示，藉由升降驅動部22使貼附單元10保持於上升位置 。構成壓接頭50的加壓刃51保持於上升位置，承受刃52 保持於下降位置。藉此，這些加壓刃51及承接刃52係與 液晶面板1保持在非接觸狀態，貼附單元1 〇之移動圓滑 地進行，不會產生對液晶面板1等同於造成損傷的情況。 此外，ACF帶13成爲由液晶面板1離開，即使讓半切割 手段40由貼附單元10的表面往前方突出，也不會與液晶 面板1產生干涉。亦即，進行ACF帶13之半切割。藉由 進行此半切割，ACF帶1 3之被半切割的位置成爲貼附終 點位置，貼附前次ACF 8的端部係貼附開始位置。亦即， 水平導引輥1 7被配置於比貼附開始位置更前方的位置， 此外水平導引輥1 6被配置於比貼附終點位置更後方的位 置。 其後，在使半切割手段40避讓之後，如圖1 0、圖1 1 箭頭所示，藉由升降驅動部22使貼附單元10下降，使 ACF帶13之中，水平導引軌16、17間的部位配置於接近 液晶面板1之下基板2的表面的位置。其後，使汽缸5 6 洞做，使升降塊54上升，如圖12、13所示，使承接刃52 抵接於液晶面板1之內面。在此，承接刃52並未及於液 -18- 1373813 晶面板1之全長，1次的動作使ACF 8被限定於貼附的區 域所對應的位置。接著，如圖14、15之箭頭所示，藉由 使加壓手段57動作，使加壓刃51下降，藉由壓動ACF 帶13之紙帶12，使ACF 8壓接於下基板2。於此壓接時 ，加壓刃51藉由半切割手段40使其基端側之角落部與被 半切割的ACF之貼附終點位置一致。 接著，驅動構成加壓手段57之給送螺桿57a，對液晶 面板1施加特定的加壓力。在此，液晶面板1之下基板2 係由薄的玻璃板所構成，容許某種程度的變形，而且被挾 持於長度相同，而且被正確保持平行度之加壓刃51與承 接刃52之間。亦即，於此挾持時，液晶面板1之中之被 挾持的部位成爲仿效這些加壓刃51與承接刃52所構成的 壓接頭50。接著，加壓刃51或者承接刃52也包含ACF 帶13之貼附起點位置起至終點位置爲止，於ACF帶13 對往加壓刃51之抵接部全體作用均等之加壓力。此外， 加壓刃5 1之端部的位置，與被半切割的貼附終點位置一 致，所以比AC F 8存在的被半切割的貼附終點位置更靠近 基端側不會受到加壓力的作用。又，在A C F 8之前一次貼 附結束，不存在ACF8而僅有紙帶1 2之比貼附開始位置 更爲前方側即使加壓刃51或承接刃52突出，也不會有什 麼問題。 ACF8被壓接於下基板2時，解除根據壓接頭50之對 ACF帶13之加壓力。接著，驅動汽缸56，使承接刃52 位移至下降位置。其後，使升降驅動部22上升，但此時 -19- 1373813 如圖16之箭頭所示，與升降驅動部22 一起驅動前後移動 驅動部23,使對ACF帶12之寬幅方向被拉上至斜上方的 方式使其動作的話，紙帶12以由ACF8滑切的方式被剝 離。 藉由以上，結束對下基板2伸出部2a之1個電極群5 之ACF 8的貼附。保持貼附單元10於使其上升的位置， 使驅動用輥18動作，由供給捲軸11拉出ACF帶13而僅 饋送1個間距份量。接著，使平行移動驅動部24動作， 使貼附單元10移動1個間距的份量，亦如圖1使其移動 僅間隔P所示之份量。接著，保持液晶面板1之基板支撐 台9不移動。在此狀態藉由反覆進行與前述同樣的動作， 依序對電極群5進行ACF8之貼附。總之，於液晶面板1 之各電極群5之每個配設，幾乎限定於其長度L份量，壓 接ACF8，而這成爲依序反覆進行。 此處，壓接頭50，係由加壓刃51與承接刃52所構成 ，這些加壓刃51及承接刃52分別藉由升降塊53,54而被 升降驅動，這些升降塊53,54沿著設於貼附單元10的導 引軌55上下移動，在加壓刃51與承接刃52總是正確保 持平行度的狀態下由上下挾持基板2。電極群5在液晶面 板1被形成η個處所的場合，也隔離著由最初之ACF 8之 貼附位置至最終之ACF 8之貼附位置爲止之距離（η · Ρ )份量，但全部都是以幾乎相同的條件壓接ACF 8。亦即 ，不論是小尺寸者，或者是大型的液晶面板1，對所有的 電極群5都可以藉由均等的加壓力貼附ACF 8，不會發生 -20- 1373813 壓接不良。又，使兩升降塊53,54被導引於相同的導軌55 ，但是沒有共用導軌55的必要。 在此，在液晶面板1之下基板2的伸出部2a貼附 ACF 8時，於ACF帶13之行進路線，加壓刃之基端側的 端部位置，有必要與被半切割的貼附終點位置一致，但是 使加壓刃位於貼附起點位置則不是必須的。亦即，圖1 7 所示之加壓刃151以及承接刃152可以越過ACF 8之貼附 起點位置，進而往前方再延長至長度α份量。此處，比貼 附起點位置更爲前方側，已經結束了 ACF 8之前一次貼附 ，不存在著ACF8，而僅有紙帶12。也就是，即使藉由加 壓刃151與承接刃152挾持此部位，也不會有任何問題， 此外於此部位不存在著ACF 8，所以不會損及對被貼附的 部位之A C F 8的加壓均等性。 於液晶面板1，在短邊側與長邊側被搭載驅動電路4 ，在短邊側之電極群與長邊側的電極群，其全長可能會有 不同。在此，藉由使加壓刃151以及承接刃152之全長， 比短邊側電極群與長邊側電極群之中較長的一方的尺寸更 長，不論在貼附ACF 8於這些短邊部，或者將ACF 8貼附 於長邊部時，都可以使用同一貼附機構。此外在對不同畫 面尺寸的液晶面板進行ACF貼附時也可以適用。 【圖式簡單說明】 圖1係顯示作爲被貼附ACF的基板之液晶胞，與被 搭載於此基板的驅動電路之重要部位平面圖。 -21 - 1373813 圖2係顯示ACF貼附機之槪略構成之正面圖° 圖3爲圖2之左側面圖。 圖4爲圖2之平面圖。 圖5係水平饋送輥之構成說明圖。 圖6係顯示水平饋送輥的構成之側面圖。 圖7係切割單元之構成說明圖。 圖8係顯示ACF帶之半切割狀態之ACF貼附機之重 要部位擴大正面圖。 圖9爲圖8之左側面圖。 圖1 0係顯示貼附單元的下降狀態之ACF貼附機的重 要部位的擴大正面圖。 圖1 1爲圖1 〇之左側面圖》 圖12係顯示承接刃的上昇狀態之ACF帶貼附機之重 要部位擴大正面圖。 圖13爲圖12之左側面圖。 圖14係顯示ACF帶之壓接狀態之ACF貼附機之重要 部位擴大正面圖。 圖15爲圖14之左側面圖。 圖1 6係顯示剝離ACF帶之紙帶的狀態之說明圖。 圖1 7係顯示加壓刃，與藉由此加壓刃貼附的ACF之 尺寸關係之ACF貼附機的重要部位的擴大正面圖。 【主要元件之符號說明】 1 :液晶面板 -22- 1373813 2 :下基板 - 2a :伸出部 3 :上基板 4 :驅動電路 5 :電極群1373813 46 moves the cutting edge 41 in the direction against the spring 44 to move in a direction close to the cutting edge receiving 42. Next, the cutting edge receives the position of 42 which is formed to be the same as or slightly shorter than the thickness of the ACF tape. This is half cut. Further, in order to attach the ACF 8 to the lower substrate 2, the ACF tape 13 is pressed between the horizontal guide rollers 16, 17 and is pressed against the surface of the lower substrate 2. Therefore, a press fitting 50 is provided on the attaching sheet and as shown in Fig. 9 . Here, the liquid crystal® is on the support base 9, but the projecting portion 2 of the lower substrate 2 is extended, and the crimping joint 50 is held by the upper and lower portions. The right crimping joint 50 is pressed by the pressing blade 51 and the receiving blade. The pressurizing blade 51 and the receiving blade 52 are attached to the elevating block elevating blocks 513 and 54, respectively, and are mounted to be displaced in the vertical direction along one of the attaching units 1 . The pressure blade 51 and the liquid crystal panel 1 are disposed on the upper and lower sides, and are formed so that the same pressing edge 5 1 is guided above the horizontal guide rails 16 and 17 and the ACF belt 13 is moved upward in the square direction. The lifting block 54 of the receiving blade 52 is mounted by the lifting and lowering of the cylinder length. That is, when the cylinder 56 is lowered by the contraction blade 52 and is disposed away from the liquid crystal panel to extend the cylinder 45, the receiving blade 52 abuts against the liquid surface. On the other hand, the lifting block 57 to which the pressing blade 51 is attached is connected. The pressing means 57 shown in the figure is provided with the swinging position 41 of the paper strip 12 closest to the cut: 13 and only the extension 2a of the ACF 8 by a specific pressure element 10, as shown in Fig. 8; The structure a is placed on the support base 9 Ϊ. The composition of these 53 , 54 . These guide rails 55 can be used to extend the length of the clip. Then, when it is disposed in a specific row small state than the water raft 56, the lower position of the bearing 1 is below the crystal plate 1 5 3 , and the pressing means has a feeding screw 57a driven by a motor -16 - 1373813 to constitute a so-called jack ( Jack). The pressing hand, the segment 57, moves the lifting block 53 connected to the pressing blade 51 up and down along the guiding rail 55, so that the liquid crystal panel 1 received by the receiving blade 52 is subjected to a specific pressing force from above. . Next, the pressing blade 51 and the receiving blade 52 are configured to accurately maintain the parallelism. Further, the cylinder 56 supporting the receiving blade 52 is unnecessarily moved at least at the position of the rising stroke end without being applied by the pressing force applied by the pressing means 57, and is introduced into a pressure which can maintain the state of being extended by φ. A heater (not shown) is housed in the pressurizing blade 51 constituting the press fitting 50 or both of the pressurizing blade 51 and the receiving blade 52, and the ACF tape 13 is thermocompression-bonded to the liquid crystal panel 1 by the press fitting 50. The degree of heating is such that the adhesive resin of ACf 8 is slightly softened to a relatively low temperature, so that it does not lose its adhesive force. Next, the pressing blade 51 and the receiving blade 52 constituting the crimping joint 50 have a wide width which can sufficiently correspond to the width of the ACF tape 13, and have a bonding length L of at least ACF 8 in the dimension in the longitudinal direction. # As described above, the feeding path, the half-cutting means 40, and the crimping joint 50 of the ACF tape 13 supplied from the supply reel 1 1 are attached to the attaching unit 1 。. By the ACF attaching device, the ACF 8 necessary for the TAB mounting drive circuit 4 is attached to the projecting portion 2a of the substrate 2 below the liquid crystal panel 1 to which a specific number of electrode groups 5 are formed. The liquid crystal panel 1 to which the ACF 8 is attached on the support substrate 9 is adsorbed and held at a specific position in a horizontal state. In this state, on the lower substrate 2 of the liquid crystal panel 1, the projecting portion 2a shown in Fig. 4 is protruded from the support base 9, and the projecting portion 2a is mounted with a specific number of drive circuits 4. Therefore, the attaching unit 10 to which the attaching mechanism is attached by the ball screw 7 of -17- 1373813 is intermittently fed in the direction of the arrow in the interval P as shown in Fig. 1. The liquid crystal panel 1 is sequentially attached with the ACF 8 of the length L. Therefore, the transfer table 36 constituting the parallel movement drive unit 24 is driven, and the attaching unit 10 is displaced to a specific attachment area. At this time, as shown by the arrows in Figs. 8 and 9, the attaching and lowering unit 10 is held at the raised position by the elevation drive unit 22. The pressing blade 51 constituting the press fitting 50 is held at the raised position, and the receiving blade 52 is held at the lowered position. As a result, the pressing blade 51 and the receiving blade 52 are kept in a non-contact state with the liquid crystal panel 1, and the movement of the attaching unit 1 is smoothly performed without causing damage to the liquid crystal panel 1. Further, the ACF tape 13 is separated from the liquid crystal panel 1, and even if the half-cutting means 40 is protruded forward from the surface of the attaching unit 10, it does not interfere with the liquid crystal panel 1. That is, the half cut of the ACF tape 13 is performed. By performing this half-cutting, the half-cut position of the ACF tape 13 becomes the attachment end position, and the end portion of the previous ACF 8 is attached to the start position. That is, the horizontal guide roller 17 is disposed at a position further forward than the attachment start position, and the horizontal guide roller 16 is disposed at a position rearward of the attachment end position. Thereafter, after the half-cutting means 40 is avoided, as shown by the arrows in FIG. 10 and FIG. 11 , the attaching and lowering unit 10 is lowered by the elevation driving unit 22, and the horizontal guiding rail 16 is placed in the ACF tape 13, The 17 places are disposed at positions close to the surface of the substrate 2 below the liquid crystal panel 1. Thereafter, the cylinder 56 is made to have a hole, and the lifting block 54 is raised. As shown in Figs. 12 and 13, the receiving blade 52 is brought into contact with the inner surface of the liquid crystal panel 1. Here, the receiving blade 52 does not correspond to the entire length of the liquid -18-1373813 crystal panel 1, and the primary operation causes the ACF 8 to be limited to the position corresponding to the attached region. Next, as shown by the arrows in Figs. 14 and 15, the pressing means 57 is operated to lower the pressing blade 51, and the ACF 8 is pressure-bonded to the lower substrate 2 by pressing the paper tape 12 of the ACF tape 13. At the time of the crimping, the pressing blade 51 has its corner portion on the proximal end side coincident with the end position of the half-cut ACF by the half-cutting means 40. Next, the feed screw 57a constituting the pressurizing means 57 is driven to apply a specific pressing force to the liquid crystal panel 1. Here, the lower substrate 2 of the liquid crystal panel 1 is composed of a thin glass plate, which allows a certain degree of deformation, and is held between the pressing blade 51 and the receiving blade 52 which are the same length and which are correctly maintained in parallel. . That is, at the time of holding, the portion to be held in the liquid crystal panel 1 serves as a press fitting 50 which is formed by the pressing blade 51 and the receiving blade 52. Next, the pressing blade 51 or the receiving blade 52 also includes the pressing force from the attachment start position of the ACF tape 13 to the end position, and the ACF tape 13 acts equally on the abutting portion of the pressing blade 51. Further, the position of the end portion of the pressing blade 51 is identical to the position of the half-cut attachment end point, so that the base end side is not subjected to the pressing force more than the half-cut attachment end position of the AC F 8 effect. Further, the attachment is completed once before A C F 8 , and there is no ACF 8 and only the tape 1 2 is attached to the start position. Even if the pressing blade 51 or the receiving blade 52 protrudes from the front side, there is no problem. When the ACF 8 is crimped to the lower substrate 2, the pressing force of the ACF tape 13 according to the press fitting 50 is released. Next, the cylinder 56 is driven to displace the receiving blade 52 to the lowered position. Thereafter, the elevation drive unit 22 is raised, but at this time, -19-1373813 drives the front and rear movement drive unit 23 together with the elevation drive unit 22 as shown by the arrow in Fig. 16, so that the wide direction of the ACF tape 12 is pulled up. When it is moved to the obliquely upward manner, the tape 12 is peeled off by the ACF 8 to be slid. Thereby, the attachment of the ACF 8 to one electrode group 5 of the projecting portion 2a of the lower substrate 2 is completed. The attaching unit 10 is held at the position where it is raised, the driving roller 18 is operated, and the ACF tape 13 is pulled out by the supply reel 11 to feed only one pitch amount. Next, the parallel movement drive unit 24 is operated to move the attaching unit 10 by the amount of one pitch, and as shown in Fig. 1, it is moved by the amount indicated by the interval P. Next, the substrate supporting table 9 of the liquid crystal panel 1 is kept not moved. In this state, the same operation as described above is repeated, and the electrode group 5 is attached to the ACF 8 in order. In short, each of the electrode groups 5 of the liquid crystal panel 1 is disposed so as to be almost limited to the length L portion thereof, and the ACF 8 is pressed, and this is repeated in order. Here, the press fitting 50 is constituted by the pressing blade 51 and the receiving blade 52. The pressing blade 51 and the receiving blade 52 are respectively driven up and down by the lifting blocks 53, 54 which are along the lifting blocks 53, 54 along The guide rail 55 provided in the attaching unit 10 moves up and down, and the substrate 2 is held up and down in a state where the pressing blade 51 and the receiving blade 52 are always correctly parallelized. When the liquid crystal panel 1 is formed in n places, the electrode group 5 also isolates the distance (η · Ρ) from the attachment position of the first ACF 8 to the final attachment position of the ACF 8, but all of them are The ACF 8 is crimped under almost the same conditions. That is, whether it is a small size or a large liquid crystal panel 1, the ACF 8 can be attached to all the electrode groups 5 by equal pressing force, and the -20- 1373813 crimp failure does not occur. Further, the two lifting blocks 53, 54 are guided to the same guide rail 55, but there is no need to share the guide rail 55. Here, when the ACF 8 is attached to the projecting portion 2a of the substrate 2 below the liquid crystal panel 1, the end position of the base end side of the pressing blade on the traveling path of the ACF tape 13 is necessary to be half-cut. The end position is the same, but it is not necessary to have the pressing edge at the attachment starting position. That is, the pressing blade 151 and the receiving blade 152 shown in Fig. 17 can be moved over the attachment start position of the ACF 8, and further extended to the length α by the forward direction. Here, the front side of the attachment starting position is already attached, and the ACF 8 has been attached one time before, and there is no ACF 8 but only the paper tape 12. That is, even if the portion is held by the pressing blade 151 and the receiving blade 152, there is no problem, and the ACF 8 does not exist in this portion, so that the ACF 8 of the attached portion is not damaged. Pressurization equalization. In the liquid crystal panel 1, the drive circuit 4 is mounted on the short side and the long side, and the total length of the electrode group on the short side and the electrode group on the long side may differ. Here, the total length of the pressing blade 151 and the receiving blade 152 is longer than the longer one of the short-side electrode group and the long-side electrode group, regardless of whether the ACF 8 is attached to these short sides. The same attachment mechanism can be used when attaching the ACF 8 to the long side. In addition, it can also be applied to ACF attachment of liquid crystal panels of different screen sizes. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an important part of a liquid crystal cell as a substrate to which an ACF is attached and a drive circuit mounted on the substrate. -21 - 1373813 Fig. 2 is a front view showing the schematic configuration of the ACF attaching machine. Fig. 3 is a left side view of Fig. 2. Figure 4 is a plan view of Figure 2. Fig. 5 is an explanatory view showing the configuration of a horizontal feed roller. Fig. 6 is a side view showing the configuration of a horizontal feed roller. Fig. 7 is an explanatory view showing the configuration of the cutting unit. Fig. 8 is an enlarged front elevational view showing the essential part of the ACF attaching machine in the half-cut state of the ACF tape. Figure 9 is a left side view of Figure 8. Fig. 10 is an enlarged front elevational view showing the important portion of the ACF attaching machine in the lowered state of the attaching unit. Fig. 11 is a left side view of Fig. 1 and Fig. 12 is an enlarged front view showing an important part of the ACF tape attaching machine in which the receiving blade is raised. Figure 13 is a left side view of Figure 12. Fig. 14 is an enlarged front elevational view showing an important part of the ACF attaching machine showing the crimped state of the ACF tape. Figure 15 is a left side view of Figure 14. Fig. 16 is an explanatory view showing a state in which the paper tape of the ACF tape is peeled off. Fig. 1 is an enlarged front view showing an important portion of the ACF attaching machine in which the pressure blade is in a dimensional relationship with the ACF attached by the pressing blade. [Description of Symbols of Main Components] 1 : Liquid crystal panel -22- 1373813 2 : Lower substrate - 2a : Extension 3 : Upper substrate 4 : Drive circuit 5 : Electrode group
8 : ACF 9 :支撐基台 φ 1 1 :供給捲軸 1 2 :紙帶 1 3 : ACF 帶 16,17 :水平導引輥 22 :升降驅動部 2 3 :前後移動驅動部 24 :平行移動驅動部 36 :搬送台 • 4〇 :切割單元 41 :切刃 5 0 :壓接頭 1 5 1 :加壓刃 152 :承接刃 5 3,5 4 :升降塊 55 :導引軌 56 :汽缸 5 7 :加壓手段 -23-8 : ACF 9 : support base φ 1 1 : supply reel 1 2 : paper tape 1 3 : ACF belt 16, 17 : horizontal guide roller 22 : elevation drive unit 2 3 : front and rear movement drive unit 24 : parallel movement drive unit 36: Transfer table • 4〇: Cutting unit 41: Cutting edge 5 0: Pressing joint 1 5 1 : Pressurizing blade 152: Receiving blade 5 3, 5 4 : Lifting block 55: Guide rail 56: Cylinder 5 7 : Add Pressure means -23-