CN101393332A - ACF paste device and flat panel display - Google Patents
ACF paste device and flat panel display Download PDFInfo
- Publication number
- CN101393332A CN101393332A CNA2008102142336A CN200810214233A CN101393332A CN 101393332 A CN101393332 A CN 101393332A CN A2008102142336 A CNA2008102142336 A CN A2008102142336A CN 200810214233 A CN200810214233 A CN 200810214233A CN 101393332 A CN101393332 A CN 101393332A
- Authority
- CN
- China
- Prior art keywords
- acf
- mentioned
- substrate
- pressurization
- sword
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
Abstract
The invention provides a ACF pasting device which pastes ACF to a substrate for applying equal press along the whole length of the substrate. In a pasting mechanism (10), a bonding head (50) is arranged between guide rollers (16) and (17) of a guide ACF tape (13), the bonding head (50) is configured to clamp the liquid crystal panel (1), and the bonding head (50) which has same length is formed of a press edge (51) and a support edge (52) which are arranged on lifting blocks (53) and (54) capable of moving along a guide rail (55) up and down. The support edge (52) is driven by a air cylinder (56), the press edge (51) is driven by the press mechanism (57), both of which can be driven to lift independently. When pushing a hard paper tape (12) of a ACF tape (13), for each electrode group (5) arranged on the liquid crystal panel (1), a ACF (8) corresponding to the length L is bonded to a lower substrate (2).
Description
Technical field
The present invention relates to for the semiconductor circuit arrangement of driving circuit etc., lift-launch is on the substrate that is made of display board etc., and the panel display apparatus that ACF (Anisotropic Conductive Film) is pasted the ACF sticker on this substrate and comprises the ACF that pastes with this ACF sticker, described display board constitutes the panel display apparatus of LCD, plasma display, OLED display etc.
Background technology
For example, LCD is connected to tellite on the liquid crystal board by semiconductor circuit arrangement and constitutes, and this liquid crystal board is enclosed 2 transparency carriers up and down in space and constituted by having formed liquid crystal.Here, semiconductor circuit arrangement is a driving circuit, and this driving circuit has the electrode in inboard and the outside, and inboard electrode is electrically connected with the side's substrate that constitutes liquid crystal board, and the electrode and the tellite in the outside are electrically connected.The mounting means of driving circuit, representational have COG (Chip on Glass) mode and TAB (Tape Automated Bonding) mode.The COG mode is IC assembly (the IC パ Star ケ-ジ) directly be connected with tellite with liquid crystal board shaped like chips; The TAB mode is that the TCP (Tape Carrier Package) that is carrying driving circuit on the film like substrate is connected with tellite with liquid crystal board.
No matter which kind of mode all is on the surface of the side's substrate that constitutes liquid crystal board, forms Wiring pattern at least on 2 limits, and the inboard electrode of electrode in this Wiring pattern and driving circuit is electrically connected.Therefore, on liquid crystal board, Wiring pattern is being set, on each semiconductor circuit arrangement that is installed with, is forming the electrode group of specified quantity with small interval.In addition, in these several electrode groups, be white space between the adjacent electrode group.In addition, driving circuit also is connected with tellite, therefore, in the tellite side, also with the liquid crystal board side similarly, formed a plurality of electrode groups of specified quantity.Here, constitute the distribution number of the electrode group of tellite side, the distribution number than the electrode group of liquid crystal board side lacks usually.
When connecting as the driving circuit of semiconductor circuit arrangement and liquid crystal board, tellite, be electrically connected effectively between a plurality of electrodes that arrange with slight gap, and, driving circuit must be fixed.For this reason, adopt ACF.This ACF is small conducting particles is evenly dispersed in the binder resin with cementability and forms.By this ACF is carried out thermo-compressed, be electrically connected by conducting particles between electrode, and, make the binder resin sclerosis by heating, driving circuit is fixed on liquid crystal board, the tellite.
For example, ACF is sticked on the position that is provided with Wiring pattern in side's substrate of liquid crystal board, and, the TCP as driving circuit is carried on this substrate with the TAB mode.As the ACF of adhesive substance, be stacked on the cardboard band by peel ply, constituted the ACF band thus.This ACF tape wrapping is sent from this feed roller on feed roller, pastes substrate surface by labelling machine.Therefore, on labelling machine, be provided with the parts that set up feed roller.In addition, in order to make the path walking of the ACF band supplied with from feed roller, disposed the guiding part that constitutes by deflector roll etc. at suitable position along regulation.
ACF is pasted method on the substrate, the paste List method is arranged and cut apart mounting method.The paste List method is to paste continuously along substrate total length on one side; Cutting apart mounting method is, each electrode group is pasted respectively, does not paste ACF at white space.In the paste List method, unwanted white space has also been pasted ACF, so, caused the waste of material, and, at white space, the resin with cementability and the conducting particles that constitute ACF expose, so, have problems sometimes in the processing of after driving circuit is installed, carrying out, the processing.Therefore, preferably mounting method is cut apart in employing.
The substrate that constitutes liquid crystal board is moved, with each electrode group to position with the compartment of terrain of rotary body mode in opposite directions successively every regulation.When making the elongate axis that is connected on the maintaining part, the ACF, cardboard band and the laminated tape that are adsorbed on this maintaining part are pressed against on the substrate.Then, maintaining part remains adsorbed state with the cardboard band, and axle is pulled into the rotation side, like this, ACF is stripped down, pastes on the substrate from the cardboard band.
Patent documentation 1: Japanese kokai publication hei 9-83114 communique
In above-mentioned patent documentation 1, substrate can support towards X, Y, θ direction movably by platform portion, and this one is provided with the substrate bottom bracing.Stickup side for ACF is installed in rotary body on the framework, at the outer peripheral face of this rotary body, is provided with the maintaining part of the ACF that several maintenances cut apart.Can make the rotation of rotary body lifting and calibration.Therefore,,, plus-pressure is acted on the substrate bottom bracing, like this, remain on the ACF on the maintaining part, be adhered to each position that is provided with electrode group on the substrate Yi Bian make rotary body rotation and decline Yi Bian platform portion is moved.Because the substrate bottom bracing is arranged on platform portion side, when rotary body was pasted ACF, the substrate bottom bracing was transported a segment distance with substrate, so the substrate bottom bracing must have the length of the ACF paste section total length that reaches substrate at least.
If small-sized substrate, the size of substrate bottom bracing is also short, so, between rotary body and substrate bottom bracing,, also can keep the stickup precision of ACF than the highland even some scale errors or assembly error are arranged as the pushing side.But, if large-scale substrate, then from an end of substrate bottom bracing to the other end, produce the accumulation of error sometimes.So the plus-pressure of rotary body is all unequal to ACF, produce the pressurization deviation, cause stickup bad.
Summary of the invention
The present invention is exactly in view of the above problems and proposes, and its objective is, when pasting ACF on the substrate, along the plus-pressure of the total length effect equalization of substrate.
To achieve these goals, ACF sticker of the present invention, each electrode group on the substrate that is formed with a plurality of electrode groups is pasted ACF respectively, described electrode group with a plurality of electrodes as a group, it is characterized in that, constitute by substrate supporting platform, the labelling machine that comprises half-cutting mechanism and crimp head and conveyer; The aforesaid substrate supporting station is horizontality with the aforesaid substrate supporting; The above-mentioned labelling machine that comprises half-cutting mechanism and crimp head, be provided with the feed roller of ACF band, above-mentioned half-cutting mechanism, only cuts into ACF the length on each electrode group that will paste aforesaid substrate to the ACF band of sending from this feed roller with making its cardboard band maintenance continuity; Above-mentioned crimp head is crimped on the ACF that has been cut off by this half-cutting mechanism on the surface of aforesaid substrate; Above-mentioned conveyer makes above-mentioned labelling machine locate each the ACF paste position that is transported to aforesaid substrate to above-mentioned crimp head, and described substrate-placing is on the aforesaid substrate supporting station; Above-mentioned crimp head constitutes above-mentioned pivot edge by pressurization sword and pivot edge, clip with the pressurization sword that aforesaid substrate is relative to be disposed, support that above-mentioned pressurization sword applies, the above-mentioned ACF plus-pressure to aforesaid substrate, these pressurization sword and pivot edges have the length of the stickup size of above-mentioned ACF at least; Above-mentioned pressurization sword and above-mentioned pivot edge have the lift drive mechanism that leaves the direction drive of substrate towards approaching respectively.
Like this, the ACF sticker is made of labelling machine and conveyer, and this conveyer moves the orientation of the electrode group of above-mentioned labelling machine on the substrate, and is positioned at each ACF paste position.On this conveyer, the lifting drive division that lifting drives labelling machine can be set, in addition, half-cutting mechanism can be arranged on the labelling machine, and this half-cutting mechanism can be indexed to operating position and retreating position.The lifting drive division can make the labelling machine lifting, like this, when half-cutting mechanism is configured in operating position, can avoid setting with substrate with interfering.In addition, the moving drive division in front and back also can be set on the lifting drive division.
Therefore, for the position of the front and back ACF that has cut off by half-cutting mechanism as pasting object, the length dimension of pressurization sword and pivot edge is the stickup size of ACF at least.But the length dimension of pressurization sword and pivot edge is not limited to the length of the ACF that will paste, and the pressurization sword also can be than cut ACF belt length.At this moment, when pasting ACF, the unnecessary length part of pressurization sword and pivot edge is configured in the position of pasting the cardboard band after finishing.When the pressurization sword is grown than the stickup length of ACF, for some kinds of different substrates of electrode group length dimension, or same substrate, also can be applicable in the short brink situation different with the length of long side, electrode group.
In the ACF band, when pasting the ACF that constitutes adhesive linkage on the substrate, must be with aligned position between substrate and the labelling machine, for aligned position, substrate can be maintained regularly, regulate the position of labelling machine, also can position adjusting mechanism be set in the substrate supporting platform side of supporting substrates.
Constitute the pressurization sword and the pivot edge of crimp head, carry out lifting action respectively independently.The pressurization sword when crimping to ACF band effect plus-pressure.Pressurization sword and pivot edge can be installed in respectively on the elevator that is driven by lifting.These two elevators can also can be provided with common guide mechanism respectively by independently guide mechanism lifting driving.
As constitute the ACF sticker above-mentionedly, ACF is used for semiconductor circuit components is carried at substrate, the substrate of this semiconductor circuit components is installed, it can be tellite etc., but, more be applicable to driving circuit, be installed on the plate of the flat-panel monitor that comprises LCD etc., the especially large-scale plate specified quantity.
The invention effect
As mentioned above, when pasting ACF on the substrate, between pivot edge and pressurization sword,, the ACF of stickup length is pasted on the electrode group of substrate, like this, can prevent to paste bad conscientiously the ACF plus-pressure of even action all sidedly roughly to ACF pressurization.
Description of drawings
Fig. 1 be expression as the liquid crystal cell of the substrate of pasting ACF and be contained in driving circuit on this substrate want portion's vertical view.
Fig. 2 is the front elevation of the general structure of expression ACF labelling machine.
Fig. 3 is the left side view of Fig. 2.
Fig. 4 is the vertical view of Fig. 2.
Fig. 5 is the structure key diagram that level is transported roller.
Fig. 6 is the side view that the expression level is transported the structure of roller.
Fig. 7 is the structure key diagram of shut-off mechanism.
Fig. 8 be expression ACF the half cut-off state the ACF labelling machine want portion's amplification front elevation.
Fig. 9 is the left side view of Fig. 8.
Figure 10 be the expression labelling machine the decline state the ACF labelling machine want portion's amplification front elevation.
Figure 11 is the left side view of Figure 10.
Figure 12 be the expression pivot edge propradation the ACF labelling machine want portion's amplification front elevation.
Figure 13 is the left side view of Figure 12.
Figure 14 be expression ACF band crimped status the ACF labelling machine want portion's amplification front elevation.
Figure 15 is the left side view of Figure 14.
Figure 16 is the key diagram of the state of the expression cardboard band of peeling off ACF band.
Figure 17 be expression pressurization sword and with the size relationship of the ACF of this pressurization sword stickup, the ACF labelling machine want portion's amplification front elevation.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 1 represents liquid crystal board and driving circuit, and this liquid crystal board is as an example of the substrate of pasting ACF; This driving circuit is to be made of the TCP that is contained on the substrate with the TAB mode as an example of the semiconductor circuit arrangement of installing by ACF.In addition, substrate not necessarily constitutes the structure of liquid crystal board, also can be substrate, other various printed circuit board (PCB)s that other display is used.In addition, being installed in not limiting on this substrate is driving circuit, can adopt the various semiconductor circuit arrangements that are electrically connected by ACF.
In Fig. 1, the 1st, liquid crystal board, this liquid crystal board 1 is by all being to be made of infrabasal plate 2 and upper substrate 3 that sheets of glass forms.Between two substrates 2,3, enclosed liquid crystal.Infrabasal plate 2, at least on its 2 limit, the amount from upper substrate 3 stretches out Rack is installed with several driving circuits 4 on this extension 2a.Driving circuit 4 is integrated circuit component 4b is installed in that film substrate 4a goes up and constitutes.
On the extension 2a of infrabasal plate 2, be provided with the electrode of specified quantity, these electrodes are connected with following distribution, and described distribution is connected with the TFT (Thin Film Transistor) that is formed on the position that two substrates 2,3 overlaps respectively.These electrodes, shown in mark among the figure 5, at the installation portion of each driving circuit 4, the electrode of specified quantity forms a group.In the left and right sides of each electrode group 5, be formed with alignment mark 6a, 6a.Therefore, between adjacent electrode group 5,5, formed white space, that is, the position of electrode has not been set with Rack.On the other hand, on driving circuit 4, be provided with a plurality of electrodes that are electrically connected with each electrode that constitutes these electrode groups 5, the electrode group that is connected with electrode group 5 is represented with mark 7.In addition, on driving circuit 4, in the left and right sides of electrode group 7, also be formed with alignment mark 6b, 6b, when driving circuit 4 carries on the liquid crystal board 1, be benchmark with these alignment marks, constitute each electrode of electrode group 7 and constitute each electrode adjustment position of electrode group 5 and consistent.
Fig. 2 to Fig. 4 represents ACF8 is pasted the general structure of the labelling machine on the extension 2a of infrabasal plate 2.In these figure, the 9th, liquid crystal board 1 is remained the supporting base of horizontality.Liquid crystal board 1 for example by the vacuum suction mechanism stable remain on this supporting base 9.Here, though liquid crystal board 1 joins with supporting base 9 in large area, the lower position of extension 2a of having pasted the infrabasal plate 2 of ACF8 is open.In order to aim at driving circuit 4 etc., the position adjusting mechanism of X, Y, θ direction can be set on supporting base 9.
In addition, the 10th, ACF8 is pasted labelling machine on the liquid crystal board 1, this labelling machine 10 has the installation plate body of the vertical direction of being located at, and feed roller 11 releasably is installed.ACF8 is stacked on the peel ply of cardboard band 12, has constituted ACF and has been with 13, and this ACF is with 13 to be wound on the feed roller 11.ACF is with 13, along the walking path that is made of the roller 14～17 that is installed on the labelling machine 10, is directed walking.The 18th, drive and to use roller, clamping cardboard band 12 after pasting ACF8 on the liquid crystal board 1, send into discharge portion 19.
Roller the 14, the 15th is supplied with the deflector roll of ACF with 13 usefulness, and deflector roll 15 is installed on the swing arm 20.Swing arm 20 is the center swing with rotation axis 21.The driving mechanism (not shown) that is connecting motor etc. on rotation axis 21 makes swing arm 20 when arrow F direction is swung, and sends at least from feed roller 11 and once pastes length, and the ACF that promptly sends length L shown in Figure 1 is with 13, and supplies between the roller 14,15.As a result, carrying ACF to keep certain with the counter-force of effect in 13 o'clock is total, can be because of the resistance change that causes transport force that differs from of the coiling amount of feed roller 11.
As shown in Figure 5 and Figure 6, roller the 16, the 17th, horizontal guide roller is with 13 to guide towards horizontal direction in its walking path ACF, and regulation ACF8 is toward liquid crystal panel 1 last length of pasting.The stickup initiating terminal position of horizontal guide roller 17 regulation ACF8, the stickup terminal location of horizontal guide roller 16 regulation ACF8, like this, the sticking area of ACF8 is set.As shown in Figure 6, horizontal guide roller 16,17 in the both sides of cylindrical portion 16a, 17a, is formed with the 16b of blade of a sword portion, 17b, the 16b of blade of a sword portion, 17b, from the height at the outstanding position of cylindrical portion 16a, 17a, with the thickness roughly the same or slightly bigger point of ACF with the cardboard band 12 in 13.
Therefore, between horizontal guide roller 16,17, ACF8 is adhered on the liquid crystal panel 1, then, separates with cardboard band 12, and the position in horizontal guide roller 17 downstreams has been peeled off the cardboard band 12 behind the ACF8 and has been recovered.In position, sticking area downstream, be provided with to drive and use roller 18 by horizontal guide roller 16,17 ACF8 that divided.Driving has driven roller 18a and pinch roll 18b with roller 18, and cardboard band 12 is clamped between driven roller 18a and the pinch roll 18b.By with driven roller 18a driven in rotation, can one section one section ground ACF of sending (the ピ Star チ send り) length L be with 12.
As shown in Figure 3, labelling machine 10 is installed on the lifting drive division 22, and on the moving drive division 23, the moving drive division 23 in front and back was installed on the parallel moving drive division 24 before and after this lifting drive division 22 was installed in, and described parallel moving drive division 24 constitutes conveyer.By these mechanisms, can make ACF with in 13 walking paths, by the sticking area of the ACF8 of (see figure 2) regulation between the horizontal guide roller 16-17, at above-below direction, be Z-direction and mobile and carry out the position adjustment in the X-direction of surface level (with the direction of the orientation orthogonal of electrode group 5) and Y direction (orientation of electrode group 5).On the other hand, liquid crystal board 1 usefulness vacuum suction remains on the supporting base 9 regularly.
Here, must adjust between horizontal guide roller 16-17 ACF with 13 with infrabasal plate 2 in the relative position of electrode group 5, the moving drive division 23 in front and back makes sticking area towards moving near the direction of leaving liquid crystal board 1, parallel moving drive division 24 make sticking area towards with liquid crystal board 1 in the parallel direction of orientation of electrode group 5, be that Y direction moves, so, can carry out position adjustments in labelling machine 10 sides, but as previously mentioned, if on supporting base 9, be provided with X, Y, the position adjusting mechanism of θ direction then also can be with 13 to aim at respect to ACF in these supporting base 9 sides.
Lifting drive division 22 have tilted block 30 and make this tilted block 30 towards front and back to the cylinder 31 (perhaps motor) that moves.In addition, on labelling machine 10, connecting the slide unit 32 that engages with the dip plane of tilted block 30.Slide unit 32 has the dip plane consistent with tilted block 30, by limit rod 33, and all can not displacement except above-below direction.Therefore, when driving cylinder 31, labelling machine 10 is in the above-below direction displacement.
Then, front and back drive division 23 moves forward and backward the pedestal 34 that tilted block 30 is installed.Moving back and forth of this pedestal 34 is that driving mechanism 35 by cylinder, motor etc. constitutes carries out.Parallel moving drive division 24, have pedestal 34 and driving mechanism 35 thereof be installed transport platform 36.When driving ball-screw 37 rotations that constitute the ball-screw conveyers with motor 38, transport platform 36 can make labelling machine 10 be parallel to the electricity level group 5 in the liquid crystal board 1 orientation move.
ACF on being installed in labelling machine 10 is with in 13 the walking path, as shown in Figure 8, position, downstream slightly in the position of horizontal guide roller 16 is provided with half-cutting mechanism 40, and this half-cutting mechanism 40 can be yearned for multiple being installed in movably on the surface of labelling machine 10 towards front and back.As shown in Figure 1, this half-cutting mechanism 40 has cutting knife 41 and cutter support 42, and cutting knife 41 can be that the center is towards rotating near the direction of leaving cutter support 42 with axle 43 shown in arrow among the figure.By the elastic force of the spring 44 that acts on cutting knife 41 always, keeping leaving the state of cutter support 42.Be located at promotion roller 46 on the cylinder 45 with cutting knife 41 when the direction of antagonistic spring 44 promotes, cutting knife 41 is towards the direction swing displacement near cutter support 42.At cutting knife 41 near the position of cutter support 42, between them, formed with ACF with identical or a little bit smaller slightly closely-spaced of the thickness of 13 cardboard band 12.Like this, can only carry out half cut-off to ACF8.
On the extension 2a that ACF8 is pasted infrabasal plate 2, the position between horizontal guide roller 16,17, ACF is crimped on the surface of infrabasal plate 2 with 13 plus-pressures that are prescribed.For this reason, as Fig. 8 and shown in Figure 9, on labelling machine 10, be provided with crimp head 50.Here, liquid crystal board 1 is positioned on the supporting base 9, but the extension 2a of its infrabasal plate 2 stretches out from supporting base 9, and crimp head 50 is from clamping the position that this stretches out up and down.
Crimp head 50 is made of pressurization sword 51 and pivot edge 52.These pressurization swords 51 and pivot edge 52 are installed in respectively on the elevator 53,54.These elevators 53,54 can along be located at pair of guide rails 55 on the labelling machine 10 towards upper and lower to displacement.These pressurization sword 51 and pivot edges 52 clip liquid crystal board 1 ground and dispose up and down, form identical length.Pressurization sword 51 be disposed between horizontal guide roller 16,17, be guided and the ACF of along continuous straight runs walking with 13 top position.
The elevator 54 of pivot edge 52 is installed,, carries out lifting action with prescribed stroke by cylinder 56.That is, when making cylinder 56 become deflated state, pivot edge 52 descends, and is configured to the lower position that leaves liquid crystal board 1.When making cylinder 56 elongations, pivot edge 52 joins below liquid crystal board 1.On the other hand, on the elevator 53 that pressurization sword 51 is installed, connecting pressing mechanism 57.Illustrated pressing mechanism 57, have by motor driven transport screw rod 57a, constitute so-called lifting jack.Make the elevator 53 that is connecting sword 51 settings of pressurizeing along guide rail 55 knee-actions, 57 pairs of this pressing mechanisms are bearing in the liquid crystal board 1 on the pivot edge 52, from the plus-pressure of top effect regulation.Pressurization sword 51 and pivot edge 52 are correctly keeping the depth of parallelism.In addition, the cylinder 56 of supporting pivot edge 52 at least at the upward stroke end position, can not touched because of the plus-pressure of pressing mechanism 57 effects, can import the pressure that can keep elongation state.
In constituting the pressurization sword 51 of crimp head 50 or at pressurization sword 51 and pivot edge 52 in the two, the well heater that built-in figure does not show, like this, crimp head 50 is with ACF 13 thermo-compressed on liquid crystal board 1.The degree of heating is lower, is some the softening degree of binder resin that makes ACF8, makes it not lose bonding force.In addition, constitute the pressurization sword 51 of crimp head 50 and the width dimensions of pivot edge 52, can fully cover ACF with 13 width, and the size of its length direction has the stickup length L of ACF8 at least.
As mentioned above, the ACF that on labelling machine 10, feed roller 11 is installed, supplies with from this feed roller 11 is with 13 walking path, half-cutting mechanism 40 and crimp head 50.With this ACF sticker, carry the required ACF8 of driving circuit 4 in the TAB mode, paste on the electrode group 5 of specified quantity, the electrode group 5 of this specified quantity is formed on the extension 2a of infrabasal plate 2 of liquid crystal board 1.
Paste the liquid crystal board 1 of ACF8, be adsorbed the assigned position that remains on the supporting base 9 with horizontality.Under this state, in the infrabasal plate 2 of liquid crystal board 1, extension 2a shown in Figure 4 stretches out from supporting base 9, on this extension 2a, is carrying the driving circuit 4 of regulation sheet number.Therefore, the labelling machine 10 of sticker is installed, is transported by one section one section ground of interval P shown in Figure 1 towards the direction of arrow by ball-screw 37.
The ACF8 of length L sticks on the liquid crystal board 1 successively, and for this reason, the platform 36 that transports that constitutes parallel moving drive division 24 is driven, and labelling machine 10 is indexed to the sticking area of regulation.At this moment, shown in the arrow among Fig. 8 and Fig. 9, lifting drive division 22 remains on lifting position with labelling machine 10.The pressurization sword 51 that constitutes crimp head 50 remains on lifting position, and pivot edge 52 remains on down position.Like this, these pressurization swords 51 and pivot edge 52 are keeping contactless state with liquid crystal board 1, and labelling machine 10 can move neatly, can not produce the situation of damage liquid crystal board 1 grade.In addition because ACF is with 13 to separate with liquid crystal board 1, so, even half-cutting mechanism 40 is forwards stretched out from the surface of labelling machine 10, also can with liquid crystal board 1 interference.Therefore, can carry out ACF with 13 half cut-off.After having carried out this half cut-off, ACF is to paste terminal location with 13 the position by half cut-off, and the end of having pasted previous ACF8 is to paste the initiating terminal position.That is, horizontal guide roller 17 is configured in the anterior position of pasting the initiating terminal position, and horizontal guide roller 16 is configured in the rear position of pasting terminal location.
Then, after half-cutting mechanism 40 was kept out of the way, shown in arrow among Figure 10, Figure 11, lifting drive division 22 descended labelling machine 10, and ACF with position in 13, between the horizontal guide roller 16,17, is configured in the position near infrabasal plate 2 surfaces of liquid crystal board 1.Then, make cylinder 56 actions, elevator 54 is risen, shown in Figure 12,13, the pivot edge 52 and the back side of liquid crystal board 1 are joined.At this, the length of pivot edge 52 does not reach the total length of liquid crystal board 1, in action once, is limited to and the regional corresponding position of pasting ACF8.Then, shown in arrow among Figure 14, Figure 15, make pressing mechanism 57 action, pressurization sword 51 is descended, promote ACF, like this, ACF8 is crimped on the infrabasal plate 2 with 13 cardboard band 12.When this crimping, pressurization sword 51 makes the bight of its base end side, and is consistent with the stickup terminal location of the ACF that has been cut off by half-cutting mechanism 40.
The screw rod 57a that transports that constitutes pressing mechanism 57 is driven, to the plus-pressure of liquid crystal board 1 effect regulation.Here, the infrabasal plate of liquid crystal board 12 is made of thin glass plate, allow distortion to a certain degree, and length is identical, is clamped between the pressurization sword 51 and pivot edge 52 that keeps the correct depth of parallelism.Therefore, when this clamping, the position that is held in the liquid crystal board 1, similar with the shape of the crimp head 50 that constitutes by pressurization sword 51 and pivot edge 52.Because pressurization sword 51 and pivot edge 52 comprise from ACF with 13 stickup initiating terminal position to terminal location, so, to ACF with on 13, with the whole linking part that pressurization sword 51 joins, acting on impartial plus-pressure.In addition because the position of end of pressurization sword 51, with half cut-off the stickup terminal location consistent, so, exist at ACF8, by the base end side of the stickup terminal location of half cut-off, do not act on plus-pressure.In addition, after the stickup of ACF8 was last time finished, ACF8 did not exist, and at the front side of the stickup initiating terminal position of remaining cardboard band 12 only, even pressurization sword 51, pivot edge 52 are outstanding, did not have what problem yet.
When ACF8 is crimped on the infrabasal plate 2, remove 50 couples of ACF of crimp head with 13 plus-pressure.Then, drive cylinder 56, make pivot edge 52 be indexed to down position.Then, lifting drive division 22 is risen, at this moment, shown in arrow among Figure 16, the moving drive division 23 in front and back is driven with lifting drive division 22, it is moved with the square obliquely pull-up of 12 Width ground with respect to ACF, like this, cardboard band 12 is peeled off in the mode of tearing from ACF8.
Through above-mentioned action, the stickup of the ACF8 of an electrode group 5 on the extension 2a of infrabasal plate 2 is finished.Labelling machine 10 is remained on the position of rising, make to drive, extract ACF out from feed roller 11 and be with 13, one sections one section ground to send with roller 18 actions.Then, make parallel moving drive division 24 actions, labelling machine 10 is moved a segment length, is the length shown in the P of interval among Fig. 1.Keep the substrate supporting platform 9 of liquid crystal board 1 motionless.Under this state, carry out repeatedly and aforementioned same action, in turn electrode group 5 is carried out the stickup of ACF8.That is, to being provided in each electrode group 5 on the liquid crystal board 1, according to its length L ground roughly limit, crimping ACF8, successively repeatedly should action.
Here, crimp head 50 is made of pressurization sword 51 and pivot edge 52, and these pressurization swords 51 and pivot edge 52 drive lifting by elevator 53,54 respectively.These elevators 53,54 are moving up and down along the guide rail 55 that is located on the labelling machine 10, always keeping under the state of the correct depth of parallelism at pressurization sword 51 and pivot edge 52, from clamping infrabasal plate 2 up and down.When electrode group 5 is formed on n position on the liquid crystal board 1, though also separate, all use roughly the same condition crimping ACF8 from the distance (np) of initial ACF8 paste position ACF8 paste position to the end.Therefore, undersized liquid crystal board needless to say, even large-scale liquid crystal board 1 also can paste ACF8 on whole electrode group 5 with the pressure of equalization, it is bad can not produce crimping.In addition, though two elevators the 53, the 54th, by identical guide rail 55 guiding, a shared guide rail 55 not necessarily wanted.
Here, in the time of on the extension 2a of the infrabasal plate 2 that ACF8 is pasted liquid crystal board 1, ACF with 13 walking path in, the position of base end side end of pressurization sword, must be consistent with the stickup terminal location after the half cut-off, but being positioned at, the pressurization sword pastes the initiating terminal position.That is, pressurization sword 151 shown in Figure 17 and pivot edge 152, the stickup initiating terminal position that can cross ACF8, extension elongation α forwards again.Here, for the front side of pasting the initiating terminal position, after the stickup of ACF8 was last time finished, ACF8 did not exist, only remaining cardboard band 12.Therefore, promptly use pressurization sword 151 and pivot edge 152 to clamp this position, also without any problem.Because there is not ACF8 in this position, so, can not impair pressurization homogeneity to the ACF8 that pastes the position.
On liquid crystal board 1, driving circuit 4 carries at short brink and long side, the electrode group of short brink and the electrode group of long side, and its total length is inequality sometimes.For this reason, make the total length of pressurization sword 151 and pivot edge 152, longer than the side that the length in short brink electrode group and the long side electrode group is big, like this, when pasting on the short leg and when pasting on the long leg, can use same labelling machine to ACF8 to ACF8.In addition, when the liquid crystal board of different pictures size is pasted ACF, also can be suitable for.
Claims (5)
1. ACF sticker, each electrode group on the substrate that is formed with a plurality of electrode groups is pasted ACF respectively, described electrode group, is characterized in that as a group with a plurality of electrodes, is made of substrate supporting platform, the labelling machine that comprises half-cutting mechanism and crimp head and conveyer;
The aforesaid substrate supporting station is horizontality with the aforesaid substrate supporting;
The above-mentioned labelling machine that comprises half-cutting mechanism and crimp head, be provided with the feed roller of ACF band, above-mentioned half-cutting mechanism, only cuts into ACF the length on each electrode group that will paste aforesaid substrate to the ACF band of sending from this feed roller with making its cardboard band maintenance continuity; Above-mentioned crimp head is crimped on the ACF that has been cut off by this half-cutting mechanism on the surface of aforesaid substrate;
Above-mentioned conveyer makes above-mentioned labelling machine locate each the ACF paste position that is transported to aforesaid substrate to above-mentioned crimp head, and described substrate-placing is on the aforesaid substrate supporting station;
Above-mentioned crimp head constitutes above-mentioned pivot edge by pressurization sword and pivot edge, clip with the pressurization sword that aforesaid substrate is relative to be disposed, support that above-mentioned pressurization sword applies, the above-mentioned ACF plus-pressure to aforesaid substrate, these pressurization sword and pivot edges have the length of the stickup size of above-mentioned ACF at least;
Above-mentioned pressurization sword and above-mentioned pivot edge have the lift drive mechanism that leaves the direction drive of substrate towards approaching respectively.
2. ACF sticker as claimed in claim 1 is characterized in that, on above-mentioned conveyer, is provided with the lifting drive division that makes above-mentioned labelling machine knee-action.
3. ACF sticker as claimed in claim 1 is characterized in that, above-mentioned pressurization sword and pivot edge are installed in respectively on the elevator, and these two elevators can be distinguished knee-action independently along common guide rail.
4. ACF sticker as claimed in claim 1 is characterized in that, the length of joining of above-mentioned pressurization sword and above-mentioned ACF band is, from the half cut-off position of above-mentioned ACF, to carriage direction the place ahead, promptly pasted and finish and only be left the length at the position of cardboard band.
5. a panel display apparatus is characterized in that, the ACF by the ACF sticker of claim 1 is pasted is equipped with semiconductor circuit components, is made of the fpd panel that above-mentioned semiconductor circuit components is carried on aforesaid substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-214893 | 2007-08-21 | ||
| JP2007214893 | 2007-08-21 | ||
| JP2007214893 | 2007-08-21 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102473622A Division CN101916001B (en) | 2007-08-21 | 2008-08-21 | ACF attaching method and ACF attaching apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101393332A true CN101393332A (en) | 2009-03-25 |
| CN101393332B CN101393332B (en) | 2010-09-15 |
Family
ID=40493689
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102473622A Expired - Fee Related CN101916001B (en) | 2007-08-21 | 2008-08-21 | ACF attaching method and ACF attaching apparatus |
| CN2008102142336A Expired - Fee Related CN101393332B (en) | 2007-08-21 | 2008-08-21 | ACF paste device and flat panel display |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102473622A Expired - Fee Related CN101916001B (en) | 2007-08-21 | 2008-08-21 | ACF attaching method and ACF attaching apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (3) | JP4392766B2 (en) |
| KR (1) | KR101011178B1 (en) |
| CN (2) | CN101916001B (en) |
| TW (1) | TW200926324A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710573B (en) * | 2009-09-30 | 2011-05-25 | 日东电子科技(深圳)有限公司 | Clamping device for precalibration of COG chip |
| CN101714500B (en) * | 2009-09-30 | 2012-02-01 | 日东电子科技(深圳)有限公司 | COG chip inversion bonding device |
| CN104246998A (en) * | 2012-06-06 | 2014-12-24 | 夏普株式会社 | Component press-bonding device |
| CN105751270A (en) * | 2016-03-25 | 2016-07-13 | 深圳市华星光电技术有限公司 | ACF (anisotropic conductive film) adhesion equipment and cutting device thereof |
| CN109426016A (en) * | 2017-09-04 | 2019-03-05 | 松下知识产权经营株式会社 | With sticker and with method of attaching |
| CN111421676A (en) * | 2019-01-09 | 2020-07-17 | 三星钻石工业股份有限公司 | End material removing device |
| CN111801720A (en) * | 2018-03-12 | 2020-10-20 | 堺显示器制品株式会社 | Hot press bonding device |
| WO2023019775A1 (en) * | 2021-08-17 | 2023-02-23 | 江苏特丽亮镀膜科技有限公司 | Manufacturing apparatus and manufacturing process for acf adhesive film bonded structure |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101220316B1 (en) * | 2010-07-28 | 2013-01-09 | 현정 주식회사 | film's binding device |
| KR102138746B1 (en) * | 2013-05-15 | 2020-07-29 | 삼성디스플레이 주식회사 | Film treating apparatus and method for film treating using the same |
| CN104914595B (en) * | 2014-03-10 | 2018-01-09 | 旭东机械工业股份有限公司 | Substrate briquetting machine |
| KR101604069B1 (en) * | 2015-10-06 | 2016-03-16 | 주식회사 씨앤와이테크 | Press Machine for Multi-layer Sheets |
| CN112550876A (en) * | 2020-09-17 | 2021-03-26 | 深圳市联得自动化装备股份有限公司 | Automatic film pasting device and film pasting method |
| CN113795086B (en) * | 2021-10-19 | 2023-04-14 | 重庆新固兴科技有限公司 | Double-sided false sticking machine |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3206331B2 (en) * | 1994-10-06 | 2001-09-10 | 松下電器産業株式会社 | Apparatus for attaching anisotropic conductive tape and method for attaching anisotropic conductive tape |
| JP3484896B2 (en) * | 1996-10-04 | 2004-01-06 | セイコーエプソン株式会社 | Method and apparatus for attaching adhesive tape to liquid crystal panel substrate |
| JP3909816B2 (en) * | 2001-10-31 | 2007-04-25 | オプトレックス株式会社 | Device for connecting circuit components to a liquid crystal display panel |
| JP4037649B2 (en) | 2001-12-28 | 2008-01-23 | 松下電器産業株式会社 | Pressurizing device |
| JP2003057681A (en) * | 2002-07-22 | 2003-02-26 | Seiko Epson Corp | Method for sticking adhesive tape to substrate of liquid crystal panel |
| CN2606369Y (en) * | 2003-04-07 | 2004-03-10 | 深圳深辉技术有限公司 | Liquid-crystal display device module |
| KR100633159B1 (en) * | 2004-11-26 | 2006-10-11 | 삼성전자주식회사 | Anisotropic Conductive Film Feeding Device |
| CN100452276C (en) * | 2005-03-14 | 2009-01-14 | 四川世纪双虹显示器件有限公司 | Method for mfg. plasma display |
| JP4632037B2 (en) * | 2005-04-01 | 2011-02-16 | 株式会社日立ハイテクノロジーズ | Thermocompression bonding apparatus and semiconductor device mounting apparatus |
| JP4539856B2 (en) | 2005-08-25 | 2010-09-08 | 株式会社日立ハイテクノロジーズ | ACF pasting method and ACF pasting apparatus |
| JP2007123344A (en) * | 2005-10-25 | 2007-05-17 | Toshiba Matsushita Display Technology Co Ltd | Liquid crystal display device |
| JP4818008B2 (en) * | 2006-07-20 | 2011-11-16 | 株式会社東芝 | Anisotropic conductive tape sticking apparatus and method of manufacturing electrical equipment |
| JP2008153595A (en) * | 2006-12-20 | 2008-07-03 | Shibaura Mechatronics Corp | Wiring substrate inspection device and wiring substrate inspection method, and anisotropic conductor sticking device and anisotropic conductor sticking method |
| JP4370341B2 (en) * | 2007-03-29 | 2009-11-25 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
| JP5096835B2 (en) * | 2007-08-21 | 2012-12-12 | 株式会社日立ハイテクノロジーズ | ACF pasting device and flat panel display manufacturing device |
-
2008
- 2008-07-30 JP JP2008195729A patent/JP4392766B2/en not_active Expired - Fee Related
- 2008-08-20 TW TW097131735A patent/TW200926324A/en not_active IP Right Cessation
- 2008-08-20 KR KR1020080081547A patent/KR101011178B1/en not_active IP Right Cessation
- 2008-08-21 CN CN2010102473622A patent/CN101916001B/en not_active Expired - Fee Related
- 2008-08-21 CN CN2008102142336A patent/CN101393332B/en not_active Expired - Fee Related
-
2009
- 2009-07-22 JP JP2009171001A patent/JP4453849B2/en not_active Expired - Fee Related
- 2009-07-22 JP JP2009171000A patent/JP4501036B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101710573B (en) * | 2009-09-30 | 2011-05-25 | 日东电子科技(深圳)有限公司 | Clamping device for precalibration of COG chip |
| CN101714500B (en) * | 2009-09-30 | 2012-02-01 | 日东电子科技(深圳)有限公司 | COG chip inversion bonding device |
| CN104246998A (en) * | 2012-06-06 | 2014-12-24 | 夏普株式会社 | Component press-bonding device |
| CN105751270A (en) * | 2016-03-25 | 2016-07-13 | 深圳市华星光电技术有限公司 | ACF (anisotropic conductive film) adhesion equipment and cutting device thereof |
| CN109426016A (en) * | 2017-09-04 | 2019-03-05 | 松下知识产权经营株式会社 | With sticker and with method of attaching |
| CN109426016B (en) * | 2017-09-04 | 2023-04-11 | 松下知识产权经营株式会社 | Tape application apparatus and tape application method |
| CN111801720A (en) * | 2018-03-12 | 2020-10-20 | 堺显示器制品株式会社 | Hot press bonding device |
| CN111421676A (en) * | 2019-01-09 | 2020-07-17 | 三星钻石工业股份有限公司 | End material removing device |
| CN111421676B (en) * | 2019-01-09 | 2024-04-19 | 三星钻石工业股份有限公司 | End material removing device |
| WO2023019775A1 (en) * | 2021-08-17 | 2023-02-23 | 江苏特丽亮镀膜科技有限公司 | Manufacturing apparatus and manufacturing process for acf adhesive film bonded structure |
| US11845251B2 (en) | 2021-08-17 | 2023-12-19 | Jiangsu Telilan Coating Technology Co., Ltd. | Preparation device and process for anisotropic conductive film (ACF) bonding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010004051A (en) | 2010-01-07 |
| TW200926324A (en) | 2009-06-16 |
| JP2009071282A (en) | 2009-04-02 |
| CN101916001B (en) | 2012-10-10 |
| CN101916001A (en) | 2010-12-15 |
| JP4392766B2 (en) | 2010-01-06 |
| JP2009276775A (en) | 2009-11-26 |
| JP4453849B2 (en) | 2010-04-21 |
| CN101393332B (en) | 2010-09-15 |
| KR101011178B1 (en) | 2011-01-26 |
| JP4501036B2 (en) | 2010-07-14 |
| TWI373813B (en) | 2012-10-01 |
| KR20090019738A (en) | 2009-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101393332B (en) | ACF paste device and flat panel display | |
| CN101373284B (en) | ACF paste device, manufacturing device of flat panel display and flat panel display | |
| CN100591196C (en) | ACF paste device and flat panel display | |
| KR100836588B1 (en) | Apparatus for polarizer adhesive on glass panel | |
| KR101293999B1 (en) | Adhesive film cutting machine, adhesive film sticking equipment having the cutting machine and adhesive film cutting ＆ sticking method by using the cutting machine | |
| KR101933298B1 (en) | Adhesive sheet attaching apparatus for adhesive film | |
| CN108218212A (en) | Substrate dividing apparatus | |
| KR20100007004U (en) | Apparatus for cutting adhesive tape | |
| CN115557043A (en) | Photovoltaic module insulating small material placing and labeling integrated equipment and process method | |
| CN101373285B (en) | ACF paste device, manufacturing device of flat panel display | |
| JP2013138141A (en) | Conductive film separator peeling device and solar cell module assembly device | |
| CN102346319A (en) | AFC pasting device of FPD assembly | |
| TWI815370B (en) | Electronic parts mounting device | |
| CN220511332U (en) | Automatic laminating and feeding equipment for FPC | |
| TWI834137B (en) | Electronic parts mounting device | |
| CN116744561A (en) | Automatic laminating and feeding equipment for FPC | |
| JP2012134292A (en) | Assembly apparatus of fpd module | |
| CN115148616A (en) | Electronic component mounting apparatus | |
| JP2022158937A (en) | Electronic component mounting device | |
| CN115561924A (en) | ACF attaching equipment | |
| KR20140083635A (en) | Flexible drive integrated circuit and cutting equipment for drive integrated circuit thereof | |
| JP2011003821A (en) | Acf sticking apparatus and display panel | |
| KR20100059249A (en) | Unit for separating a acf layer from a acf tape and apparatus for bonding a acf having the unit | |
| JP2011009513A (en) | Mounting device and mounting method of electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100915 Termination date: 20140821 |
|
| EXPY | Termination of patent right or utility model |