CN109426016B

CN109426016B - Tape application apparatus and tape application method

Info

Publication number: CN109426016B
Application number: CN201810554267.3A
Authority: CN
Inventors: 浜田隆二; 足立聪
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2017-09-04
Filing date: 2018-05-31
Publication date: 2023-04-11
Anticipated expiration: 2038-05-31
Also published as: JP2019046982A; CN109426016A; JP6970869B2

Abstract

The invention provides a tape sticking device, comprising: a support table (15) that supports the end region of the substrate (3) by an upper surface (15 a), and through which a plurality of suction ports (16) formed in the upper surface (15 a) penetrate to a communication space (17); a shaft member (18) inserted into the communication space (17); a suction mechanism which is communicated with the communication space (17) and sucks the lower surface of the substrate (3) through a suction port (16); and a tape attaching unit (attaching mechanism 5) that presses and attaches the tape cut piece (2 b 1) and the diaphragm (2 a) together to the substrate (3), and pulls and peels the diaphragm (2 a) from the attached tape cut piece (2 b 1). The support table (15) can change the length (Lv) of the adsorption region for adsorbing the substrate (3) by changing the insertion amount of the shaft member (18) into the communication space (17).

Description

Tape application apparatus and tape application method

Technical Field

The present invention relates to a tape joining apparatus and a tape joining method for joining a cut tape for joining a component to an end region of a substrate made of a film-like member.

Background

In a production line of a liquid crystal panel, before mounting components such as a driver circuit on electrodes provided in an end region of a substrate, a tape bonding operation of bonding a tape cut piece of ACF (Anisotropic Conductive Film) for component bonding to the electrodes is performed. A tape bonding apparatus that performs a tape bonding operation is configured to repeat an operation of pressing and bonding a cut tape piece together with a diaphragm attached to an upper surface of the cut tape piece after supporting a lower surface of an end region of a substrate by a support table, and pulling and peeling the diaphragm from the cut tape piece (see, for example, patent document 1).

Prior art documents

Patent document

Patent document 1: japanese patent laid-open No. 2014-107524

Disclosure of Invention

However, in the prior art including patent document 1, the support table supports only the lower surface of the end region of the substrate. Therefore, in the case where the substrate is not a glass substrate but a flexible substrate or the like, and includes a film-like member having small rigidity, there is a problem that when the separator is cut and pulled from the tape attached to the substrate, the end region of the substrate is pulled up, and this portion (end region of the substrate) may be deformed.

Accordingly, an object of the present invention is to provide a tape joining apparatus and a tape joining method capable of preventing a situation in which an end region of a substrate is pulled up and the portion is deformed when a separator is pulled up from a tape cut piece bonded to the substrate made of a film-like member.

The tape joining device of the present invention includes: a support table having a plurality of suction ports formed at predetermined intervals on an upper surface thereof, a communication space extending in a longitudinal direction and having one end opened from a side surface to an outside being formed inside, the plurality of suction ports penetrating from the upper surface to the communication space, and an end region of the substrate made of the film-like member being supported by the upper surface; a shaft member inserted from an opening of the communication space; a suction mechanism that communicates with the communication space and sucks a lower surface of the end region of the substrate through the suction port; and a tape attaching unit that presses and attaches a tape cut piece for component bonding and a diaphragm attached to the tape cut piece together to the end region of the substrate, and pulls and peels the diaphragm from the attached tape cut piece, wherein the support table can change a length of an adsorption region that adsorbs the end region of the substrate by changing an insertion amount of the shaft member into the communication space.

A tape attaching method according to the present invention is a tape attaching method for attaching a cut tape for joining components to an end region of a substrate made of a film-like member, the tape attaching method including: an adsorption region setting step of setting, in a support table in which the length of an adsorption region for adsorbing a substrate placed on an upper surface is variable, the length of the adsorption region in accordance with the length of an end region of the substrate placed on the upper surface; a substrate mounting step of mounting the substrate on the support table so that an end region of the substrate is placed in the set adsorption region; a substrate adsorption step of adsorbing the substrate placed thereon; a tape bonding step of pressing and bonding a tape cut piece for component bonding and a separator attached to the tape cut piece together toward the end region of the substrate; and a separator peeling step of lifting and peeling the separator from the tape cut piece.

According to the present invention, when the separator is pulled up from the tape piece attached to the substrate made of the film-like member, the end region of the substrate is pulled up, and the deformation of the portion can be prevented.

Drawings

Fig. 1 (a) and (b) are perspective views of a tape application device according to an embodiment of the present invention.

Fig. 2 (a) and (b) are explanatory views of the structure of the support base provided in the tape application device according to the embodiment of the present invention.

Fig. 3 (a) and (b) are explanatory views of the structure of the support base provided in the tape application device according to the embodiment of the present invention.

Fig. 4 (a), (b), and (c) are process explanatory views of the tape application work performed by the tape application device according to the embodiment of the present invention.

Fig. 5 is a diagram showing a flow of a tape application method according to an embodiment of the present invention.

Description of the reference numerals

1. Tape adhering device

2a diaphragm

2b1 strip section

3. Substrate

5. Attaching mechanism (with pasting unit)

15. Supporting table

15a upper surface

16. Suction port

17. Communicating space

17a opening communicating with the space

17b inner wall of the communicating space

18. Shaft member

20. Vacuum pump (suction mechanism)

22. Scale plate (adsorption zone length display unit)

23. Indicating mark (adsorption area length display unit)

Length of end region of Lb

Amount of Li insertion

Length of Lv adsorption zone

Detailed Description

An embodiment of the present invention will be described in detail below with reference to the drawings. The structure, shape, and the like described below are examples for explanation, and can be changed as appropriate according to the specification of the tape application apparatus. In the following, corresponding elements are denoted by the same reference numerals throughout the drawings, and redundant description thereof will be omitted. Fig. 1 and a part described later show an X direction (a left-right direction in fig. 2 a) and a Y direction (a front-back direction in fig. 2 a) orthogonal to the X direction as 2-axis directions orthogonal to each other in a horizontal plane. In fig. 1 and a part described later, the Z direction is shown as a height direction orthogonal to a horizontal plane.

Next, the structure of the tape application apparatus 1 will be described with reference to fig. 1. The tape application device 1 has a function of applying a tape cut piece 2b1 obtained by cutting an ACF tape 2b (see fig. 4) into a given length to a substrate 3 including a thin and easily deformable film-like member. In the tape bonding apparatus 1, a substrate positioning mechanism 4 and a bonding mechanism 5 are provided on a base 1a in parallel in the Y direction. The substrate positioning mechanism 4 is configured by stacking an X-axis table 6X and a Y-axis table 6Y in layers, and further by providing a moving table 7 on the Y-axis table 6Y. By driving the X-axis table 6X, the Y-axis table 6Y is moved in the X direction. By driving the Y-axis table 6Y, the moving table 7 moves in the Y direction.

A plurality of (two in this case) substrate holding tables 8 are provided in parallel in the X direction on the movable stage 7, and hold the substrate 3 carried in from the outside of the apparatus (see fig. 1 a). By driving the table lifting mechanism, each substrate holding table 8 is lifted and lowered independently of the moving table 7. Each driving unit of the substrate positioning mechanism 4 is controlled by a control unit C provided in the tape application device 1. The controller C controls the X-axis table 6X, Y and the table lifting mechanism to move the substrate 3 held by the substrate holding table 8 in the XYZ-direction and position the substrate at a predetermined position (see fig. 1 (b)).

The sticking mechanism 5 has a plurality of (here, two) substrate plates 9 arranged in parallel in the X direction. A plate moving mechanism 10 extending in the X direction is attached to the rear surface of each base plate 9. The board moving mechanism 10 is controlled by the controller C, and the base boards 9 are moved in the X direction individually by driving the board moving mechanism 10.

The tape supply reel 11 is detachably attached to a position above the front surface of each base plate 9. As shown in fig. 4, the tape supply reel 11 winds and accommodates the tape member 2 having a structure in which the ACF tape 2b is laminated on the separator 2a, and is rotationally driven by a reel drive mechanism controlled by the control unit C.

In fig. 1, on both sides of the lower end portion of the base plate 9, a 1 st guide roller 12 and a 2 nd guide roller 13 are disposed at a horizontal position. The tape member 2 is wound around the first guide roller 1 12, and the ACF tape 2b is guided in a downward posture from upstream to downstream in a horizontal direction.

A pressure bonding tool 14 which is raised and lowered by a tool raising and lowering mechanism 14a controlled by the control unit C is provided between the two

guide rollers

12 and 13 and above the horizontal feed path of the belt member 2. A cutting unit (not shown) controlled by the control unit C for cutting the ACF tape 2b in accordance with the length of the electrode unit 3a formed on the upper surface of the substrate 3 is provided upstream of the pressure bonding tool 14. Below the crimping tool 14, the tape cut piece 2b1 cut into a given length by the cutting section is fed. The tape cut piece 2b1 is attached to the substrate 3, and the tape member 2 serving as only the separator 2a is guided upward around the 2 nd guide roller 13 and is collected in the tape collecting unit.

In fig. 1, a support table 15 having a horizontal surface (upper surface) extending in the X direction is provided below the crimping tool 14. The support table 15 supports an end region including the electrode portion 3a formed on the substrate 3 from below.

Next, the structure of the support table 15 will be described with reference to fig. 2 and 3. In fig. 2, a plurality of suction ports 16 are formed at predetermined intervals in the X direction on the upper surface 15a of the support table 15. A columnar communication space 17 extending in the X direction is formed inside the support table 15. Each of the plurality of suction ports 16 penetrates from the upper surface 15a of the support table 15 to the communication space 17.

An opening 17a of a communication space in which the communication space 17 is opened to the outside is formed in one side surface 15b of the support table 15. A cylindrical shaft member 18 is inserted into the communicating space 17 from the opening 17a of the communicating space (see fig. 3). In the shaft member 18, an O-ring 18a is attached near an end portion inserted into the communication space 17, and a grip portion 18b is attached at an opposite end portion. The O-ring 18a is a sealing unit that abuts against the inner wall 17b of the communication space to seal the communication space 17. A shaft support portion 19 is provided on a side of the one side surface 15b of the support base 15. The shaft support portion 19 includes a bearing 19a that supports a side surface of the shaft member 18, and supports the shaft member 18 inserted into the opening 17a of the communicating space.

Fig. 3 shows a state where the shaft member 18 is inserted into the communication space 17, and the bearing 19a is omitted for convenience. In fig. 3, a suction connection portion 17c for vacuum-sucking the communication space 17 is formed on the other side surface 15c of the support table 15. The vacuum pump 20 controlled by the control unit C is connected to the suction connection portion 17C via a pipe 21.

When the vacuum pump 20 is operated in a state where the end region of the substrate 3 is placed on the upper surface 15a of the support table 15 (see fig. 4), the lower surface of the substrate 3 is sucked from the suction port 16 communicating with the communication space 17 sealed by the O-ring 18 a. That is, the vacuum pump 20 is a suction mechanism that communicates with the communication space 17 and sucks the lower surface of the end region of the substrate 3 through the suction port 16.

In fig. 3, the support table 15 can change the number of suction ports 16 for suction by changing the insertion amount Li of the shaft member 18 into the communication space 17 and changing the position of the O-ring 18 a. Thereby, the support table 15 can change the length Lv of the suction region that sucks the end region of the substrate 3. A scale plate 22 is provided on the base 1 a. The grip 18b is provided with an indication mark 23. The position of the scale plate 22 indicated by the indication mark 23 when the shaft member 18 is inserted into the communication space 17 indicates the length Lv of the adsorption region. That is, the scale 22 and the indication mark 23 are adsorption region length display means for displaying the set adsorption region length Lv corresponding to the insertion amount Li.

In this manner, the support base 15 that supports the end region of the substrate 3 made of a film-like member by the upper surface 15a has a plurality of suction ports 16 formed at predetermined intervals on the upper surface 15a, a communication space 17 extending in the longitudinal direction (X direction) and having one end opened from the side surface (one side surface 15 b) to the outside is formed inside, and the plurality of suction ports 16 penetrate from the upper surface 15a to the communication space 17.

Next, the tape attaching operation by the attaching mechanism 5 will be described with reference to fig. 4. In the tape sticking operation, first, as shown in fig. 3, the insertion amount Li of the shaft member 18 is adjusted so that the length Lv of the suction region of the support table 15 is set to match the length Lb of the end region of the substrate 3 (see fig. 1 a). Next, as shown in fig. 1 (b), the substrate positioning mechanism 4 is driven to move the movable stage 7 in a predetermined direction, and the end regions of the substrates 3 held on the plurality of substrate holding tables 8 are positioned on the support stage 15. Next, the vacuum pump 20 is operated to suck the lower surface of the end region of the substrate 3 onto the upper surface 15a of the support table 15.

Next, as shown in fig. 4 (a) and (b), the pressure bonding tool 14 is lowered (arrow a) while the cut tape piece 2b1 is aligned above the electrode portion 3a of the substrate 3, and the cut tape piece 2b1 is pressed against the electrode portion 3a together with the separator 2a to be bonded. After the tape cut piece 2b1 is attached, as shown in fig. 4 c, the pressure bonding tool 14 is raised (arrow b), and the reel drive mechanism is rotationally driven to collect the separator 2a in the tape collection unit. Thereby, the separator 2a is pulled and peeled from the tape cut piece 2b1.

In this manner, the sticking mechanism 5 is a tape sticking unit that presses the tape cut piece 2b1 for joining components together with the separator 2a stuck to the upper surface thereof toward the end region of the substrate 3 to stick them, and pulls up and peels the separator 2a from the stuck tape cut piece 2b1. When the diaphragm 2a is peeled off, the substrate 3 is adsorbed on the upper surface 15a of the support table 15. Thus, even the substrate 3 including a thin membrane-like member is not pulled upward together with the separator 2 a.

Next, a tape joining method of joining the tape cut piece 2b1 for component bonding to the end region of the substrate 3 made of the film-like member, which is performed by the tape joining apparatus 1, will be described with reference to fig. 1 and 4 along the flow of fig. 5. In fig. 5, first, the length Lv of the suction region is set by changing the insertion amount Li of the shaft member 18 in accordance with the length Lb of the end region of the substrate 3 of the adhesive tape cut piece 2b1 (ST 1: suction region setting step) (see fig. 4 (a)). That is, in the support table 15 in which the length Lv of the suction region to suck the substrate 3 placed on the upper surface 15a is variable, the length Lv of the suction region is set in accordance with the length Lb of the end region of the substrate 3 placed on the upper surface 15a.

In fig. 5, the substrate 3 to be worked is carried into the substrate holding table 8 and held (ST 2: substrate carrying-in step) (see fig. 1 a). Next, the substrate positioning mechanism 4 is driven to position and place the end region of the substrate 3 on the support table 15 (ST 3: substrate placement step) (see fig. 1 (b)). That is, the substrate 3 is placed on the support table 15 such that the end region of the substrate 3 is placed in the set suction region. Next, the vacuum pump 20 (suction mechanism) is operated to suck the mounted substrate 3 (ST 4: substrate suction step) (see fig. 4 (a)).

Next, the cut tape piece 2b1 for component bonding is pressed and bonded together with the separator 2a attached to the upper surface thereof to the end region of the substrate 3 (ST 5: tape bonding step) (see fig. 4 (b)). Then, the separator 2a is pulled and peeled from the tape cut piece 2b1 (ST 6: separator peeling step) (see fig. 4 (c)). Then, the operation of the vacuum pump 20 is stopped, and the substrate 3 is released (ST 7: substrate releasing step). Then, the substrate positioning mechanism 4 is driven to move the substrate 3 to the carrying-out position and carry it out (ST 8: substrate carrying-out step).

In fig. 5, when the operation for a given number of substrates 3 has not been completed (no in ST 9), the process returns to the substrate loading step (ST 2) and the next substrate 3 to be operated is loaded. When the operation for the given number of substrates 3 is finished (yes in ST 9), the tape attaching operation is terminated.

As described above, the tape application device 1 of the present embodiment includes: a support table 15 having a plurality of suction ports 16 formed at predetermined intervals on an upper surface 15a, a communication space 17 formed therein and extending in a longitudinal direction and having one end opened from a side surface 15b to the outside, the suction ports 16 penetrating from the upper surface 15a to the communication space 17, and an end region of the substrate 3 made of a film-like member supported by the upper surface 15 a; a shaft member 18 inserted from the opening 17a of the communication space; a suction mechanism (vacuum pump 20) which communicates with the communication space 17 and sucks the lower surface of the end region of the substrate 3 through the suction port 16; and a tape attaching unit (attaching mechanism 5) that presses the tape cut piece 2b1 and the separator 2a attached to the tape cut piece 2b1 for component bonding together against the end region of the substrate 3 to attach them, and pulls up and peels the separator 2a from the attached tape cut piece 2b1.

In the tape application device 1, the support table 15 can change the length Lv of the suction region that sucks the end region of the substrate 3 by changing the insertion amount Li of the shaft member 18 into the communication space 17. This prevents the end region of the substrate 3 from being pulled up and the portion from being deformed when the separator 2a is pulled up from the tape cut piece 2b1 attached to the substrate 3 made of a film-like member.

The tape application device 1 is not limited to the structure including two sets of the pressure bonding tools 14 and the support base 15, and may be a structure including 1 set or 3 or more sets of the pressure bonding tools 14 and the support base 15. The tape application device 1 is not limited to a separate device, and may be a device constituting a part of the component mounting device, and may be provided in the component mounting device in parallel with a component mounting device that mounts a component on the substrate 3 and a component pressure bonding device that pressure bonds a component to the substrate 3.

Industrial applicability

The tape joining apparatus and the tape joining method according to the present invention have an effect of preventing a situation in which an end region of a substrate is pulled up and the portion is deformed when a separator is pulled up from a tape cut piece bonded to the substrate made of a film-like member, and are useful in a field of mounting a component on the substrate.

Claims

1. A tape sticking apparatus is provided with:

a support table having a plurality of suction ports formed at predetermined intervals on an upper surface thereof, a communication space extending in a longitudinal direction and having one end opened from a side surface to an outside being formed inside, the plurality of suction ports penetrating from the upper surface to the communication space, and an end region of the substrate made of the film-like member being supported by the upper surface;

a shaft member inserted from an opening of the communication space;

a suction mechanism that communicates with the communication space and sucks a lower surface of the end region of the substrate through the suction port; and

a tape attaching unit that presses and attaches a tape cut piece for component bonding and a separator attached to the tape cut piece together to the end region of the substrate, and pulls and peels the separator from the attached tape cut piece,

the support table can change the length of an adsorption region for adsorbing the end region of the substrate by changing the insertion amount of the shaft member into the communication space,

the tape sticking apparatus further includes an adsorption region length display unit that displays the set length of the adsorption region in accordance with the insertion amount.

2. A tape application device according to claim 1,

the shaft member has a sealing unit that abuts against an inner wall of the communication space to seal the communication space.

3. A tape attaching method for attaching a cut tape for bonding a component to an end region of a substrate composed of a film-like member, the tape attaching method comprising:

an adsorption region setting step of setting, in a support table in which the length of an adsorption region for adsorbing a substrate placed on an upper surface is variable, the length of the adsorption region in accordance with the length of an end region of the substrate placed on the upper surface;

a substrate mounting step of mounting the substrate on the support table so that an end region of the substrate is placed in the set adsorption region;

a substrate adsorption step of adsorbing the mounted substrate;

a tape bonding step of pressing and bonding a tape cut piece for component bonding and a separator attached to the tape cut piece together toward the end region of the substrate; and

a separator peeling step of lifting and peeling the separator from the tape piece,

in the support table, a plurality of suction ports are formed at a predetermined interval on an upper surface, a communication space extending in a longitudinal direction and having one end opened from a side surface to an outside is formed inside, the plurality of suction ports penetrate from the upper surface to the communication space, and the length of the suction region can be changed by changing an insertion amount of a shaft member inserted from the opening to the communication space,

in the suction region setting step, the length of the suction region is set by changing the insertion amount.

4. A tape application method according to claim 3,