KR20100007004U - Apparatus for cutting adhesive tape - Google Patents

Abstract

An adhesive tape cutting device for cutting an adhesive tape used for laminating and bonding a plurality of semiconductor chips is disclosed. A base frame is provided. The supply part continuously supplies the adhesive tape. The transfer unit is installed on the base frame, and picks up the adhesive tape supplied by the supply unit and transfers it to the cutting region by a set length. The cutter is arranged to correspond to the boundary between the conveying portion and the cutting region. The lifting and lowering portion is movable up and down relative to the conveying portion, and is raised in a state in which the adhesive tape conveyed to the cutting region is absorbed and fixed, thereby causing the cutter to cut the adhesive tape to a predetermined length. Accordingly, since the conveying length of the adhesive tape can be precisely controlled, the length of the cut adhesive tape can be constant, and since the position of the adhesive tape is not misaligned during the cutting process, misalignment can be prevented.

Semiconductor, adhesive tape, lamination, cutting

Description

Adhesive tape cutting device {Apparatus for cutting adhesive tape}

The present invention relates to an adhesive tape cutting device for cutting an adhesive tape used to laminate and bond a plurality of semiconductor chips in the manufacture of a semiconductor device.

In general, in the manufacture of semiconductor devices, a chip bonding process refers to a process of bonding a semiconductor chip to a substrate such as a lead frame or a printed circuit board. As the bonding means used in the conventional chip bonding step, a conductive liquid adhesive or an insulating liquid adhesive is used. In this case, a certain amount of the liquid adhesive is dropped on the substrate, and the semiconductor chip is placed thereon to be pressed.

By the way, the liquid adhesive is difficult to control the thickness, when the adhesion of the thin semiconductor chip, bubbles are generated in the liquid adhesive due to the bending deformation of the semiconductor chip, can cause a poor reliability of the semiconductor device.

In particular, in the case of stacking a plurality of semiconductor chips, in addition to the above-described problems, it is difficult to stack a plurality of semiconductor chips having the same or similar size due to the spreadability of the liquid adhesive. Therefore, to solve this problem, a plurality of semiconductor chips are bonded to each other using an adhesive tape and stacked.

In the above-described case, the adhesive tape is continuously conveyed to the cutter while being unwound in the state of being wound on the roller, cut to a certain length by the cutter, and then picked up by the pickup mechanism. Thereafter, the picked up adhesive tape is supplied to a chip bonding apparatus for laminating and bonding semiconductor chips.

By the way, since the adhesive tape is unwound freely and conveyed by the rotation of a roller in the state wound up by the roller, control of a conveyance length is not easy. Therefore, the length of the adhesive tape cut by the cutter may not be constant.

In addition, since the adhesive tape is cut by the falling cutter while being simply pressed by the pickup mechanism, the position of the adhesive tape may be displaced during the cutting process. As a result, misalignment of the cut adhesive tape may occur.

If the adhesive tape is supplied to the chip bonding apparatus in a misalignment state, the stacking failure of the semiconductor chip may occur. Therefore, there may be a problem that an alignment mechanism for aligning the cut adhesive tape must be added separately before feeding to the chip bonding device.

An object of the present invention is to provide an adhesive tape cutting device that can be accurately cut to a certain length when cutting the adhesive tape and can be cut without misalignment.

Adhesive tape cutting apparatus according to the present invention for achieving the above object, the base frame; A supply unit for continuously supplying an adhesive tape; A transfer unit installed on the base frame and configured to pick up the adhesive tape supplied by the supply unit and transfer the adhesive tape to the cutting area by a predetermined length; A cutter disposed corresponding to a boundary between the transfer part and the cutting area; And an elevating portion capable of elevating with respect to the conveying portion, lifting the adhesive tape conveyed to the cutting region in a state of being absorbed and fixed, and causing the cutter to cut the adhesive tape to a predetermined length.

According to the present invention, since the conveying length of the adhesive tape can be precisely controlled as compared with simply being unwound and conveyed in the state where the adhesive tape is conventionally wound, the length of the cut adhesive tape can be made constant.

According to the present invention, in the state where the adhesive tape is conventionally simply pressed by the pick-up mechanism, the position of the adhesive tape is not misaligned during the cutting process, as compared with being cut by the falling cutter, so that misalignment can be prevented. .

In addition, since the adhesive tape may be transferred to the pickup mechanism as it is cut, the stacking failure may be prevented in the process of laminating and bonding the semiconductor chips. In addition, the alignment mechanism for aligning the cut adhesive tape does not need to be added separately before feeding to the chip bonding apparatus.

According to the present invention, since the constant tension can be maintained when the adhesive tape is conveyed, the adhesive tape can be accurately conveyed by the set distance. And even if the width of the adhesive tape supplied varies, the adhesive tape can be stably guided to the changed width of the adhesive tape.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the present invention according to a preferred embodiment.

1 is a perspective view of the adhesive tape cutting device according to an embodiment of the present invention from the front, Figure 2 is a perspective view of the adhesive tape cutting device shown in FIG.

1 and 2, the adhesive tape cutting apparatus 100 includes a base frame 110, a supply unit 120, a transfer unit 130, a cutter 140, and a lifting unit 150. It is composed.

The base frame 110 allows the supply unit 120, the transfer unit 130, the cutter 140, and the lift unit 150 to be mounted and supported. The supply unit 120 supplies the adhesive tape to the transfer unit 130 and continuously supplies the adhesive tape.

The transfer unit 130 picks up the adhesive tape supplied by the supply unit 120 and transfers the adhesive tape to the cutting area by a predetermined length. The transfer unit 130 is installed and supported on the base frame 110. The cutting region is a region where the adhesive tape is cut at a predetermined length, and corresponds to the upper region of the lifting unit 150.

Since the adhesive tape may be transported by the set length by the transfer unit 130, the conveying length of the adhesive tape may be accurately controlled as compared with simply being unwound and conveyed in the state where the adhesive tape is conventionally wound. Accordingly, the length of the adhesive tape cut in a later cutting process may be constant, and the adhesive tape having a constant length may be supplied to the chip bonding apparatus.

The cutter 140 is for cutting the adhesive tape transferred to the cutting region, and is disposed to correspond to the boundary between the transfer unit 130 and the cutting region. The cutter 140 may be located at the rear end of the cutting area of the cutter blade based on the conveying direction of the adhesive tape.

The lifting unit 150 operates to move up and down with respect to the transfer unit 130. Then, the lifting unit 150 ascends in a state in which the adhesive tape transferred to the cutting region is absorbed and fixed, thereby causing the cutter 140 to cut the adhesive tape to a predetermined length. That is, when the adhesive tape is transferred to the cutting region, the lifting unit 150 allows the cutter 140 positioned at the rear end of the cutting region to be cut while raising the transferred adhesive tape in a fixed state.

Since the adhesive tape is cut in the state in which the lifting tape 150 is fixed by adsorption, the adhesive tape is cut by the cutter which is lowered in the state of being simply pressed by the pick-up mechanism. Misalignment occurring as the position is shifted can be prevented.

In addition, since the adhesive tape may be transferred to the pickup mechanism 10 (see FIG. 9A) as it is cut, in the process of laminating and bonding the semiconductor chips, the adhesive force between the semiconductor chips becomes weak, or the adhesive tape is a semiconductor. Appearance defects and the like which partially escape between the chips can be prevented. In addition, there may be an advantage that an alignment mechanism for aligning the cut adhesive tape does not need to be added separately before feeding to the chip bonding device.

Meanwhile, the transfer unit 130 may include a transfer support 131 that supports the adhesive tape when the adhesive tape is supplied from the supply unit 120. 3, the transport support 131 may include a transport side suction unit 132. The conveying side adsorption part 132 is for fixing the conveyed adhesive tape by vacuum adsorption.

While the adhesive tape is being conveyed, no vacuum pressure is applied to the conveying side adsorption part 132, but a vacuum pressure may be applied to the conveying side adsorption part 132 until the cutting is performed immediately after the adhesive tape is transferred to the cutting area. Accordingly, since the adhesive tape can be fixed at both sides of the portion to be cut in the process of cutting, the position of the adhesive tape can be prevented from being misaligned. The transfer side suction unit 132 is preferably disposed corresponding to the transfer end position of the adhesive tape. This is to allow the adhesive tape to be adsorbed and fixed by the transfer side adsorption part 132 as soon as the transfer of the adhesive tape is completed.

In addition, the transfer unit 130 may include a tape picker 1300 for picking up the adhesive tape. The tape picker 1300 may include a picker head 1310, a pickup lift driver 1320, a lift guide 1330, a pickup horizontal reciprocating drive 1340, and a horizontal reciprocating guide 1350. .

The picker head 1310 may be provided with the pick-up adsorption part 1311 which vacuum-adsorbs an adhesive tape. During the transfer of the adhesive tape, a vacuum pressure is applied to the pick-up suction unit 1311 so that the adhesive tape may be transferred while being vacuum-adsorbed to the picker head 1310. When the transfer of the adhesive tape is completed, the vacuum pressure applied to the pickup adsorption unit 1311 may be removed, and the adhesive tape may be separated from the picker head 1310.

The pickup lift driver 1320 is for lifting the picker head 1310. The pickup lift driver 1320 lifts the picker head 1310 while the adhesive tape is being transferred so that the picker head 1310 can be smoothly transferred while the adhesive tape is adsorbed. The pickup lift driver 1320 lowers the picker head 1310 immediately after the transfer of the adhesive tape is completed so that the adhesive tape can be seated.

The pick-up lifting driver 1320 may raise the picker head 1310 after the adhesive tape is seated to smoothly return to the transfer start position of the adhesive tape and wait in a state spaced apart from the adhesive tape.

The elevating guide 1330 guides the elevating of the pickup head 1310. The lifting guide 1330 may be inserted into a groove formed in the pickup head 1310 or the head support 1312 supporting the pickup head 1310 to guide the lifting of the pickup head 1310.

The pickup horizontal reciprocating drive unit 1340 is for horizontally reciprocating the picker head 1310 in the transfer direction of the adhesive tape. The pickup horizontal reciprocating drive unit 1340 horizontally moves the picker head 1310 by the set length of the adhesive tape, and then returns to the transfer start position of the adhesive tape to wait for the next transfer of the adhesive tape.

The horizontal reciprocating guide 1350 guides the horizontal reciprocation of the picker head 1310. The horizontal reciprocating guide 1350 may be fitted to a rail formed in the base frame 110 and connected to the lifting guide 1330 to guide the horizontal reciprocation of the pickup head 1310.

On the other hand, the picker head 1310 may be detachably installed to the head support 1312 by a screw or the like. This is to facilitate the replacement of the picker head 1310 in accordance with the change in the width of the adhesive tape.

The pickup lift driver 1320 may be configured as shown in FIG. 4, for example. Referring to FIG. 4, the pickup lift driver 1320 includes a first rotary motor 1321, a first eccentric drive cam 1322, a first driven cam 1323, and a first elastic member 1324. do.

The first rotary motor 1321 is supported by the horizontal reciprocating guide 1350. Accordingly, the first rotary motor 1321 may move horizontally reciprocating with the picker head 1310 even when the picker head 1310 moves horizontally. The first rotary motor 1321 may be configured to be forward and reverse rotation. The first eccentric drive cam 1322 is coupled to the rotation axis of the first rotary motor 1321. The first driven cam 1323 contacts the first eccentric drive cam 1322 on the lower side of the first eccentric drive cam 1322 and is rotatably installed in the pickup head 1310, thereby providing a first eccentric drive cam 1322. Rotate together during the rotation.

The first elastic member 1324 applies an elastic force to the pickup head 1310 in a direction opposite to the downward direction of the pickup head 1310. The first elastic member 1324 may be formed of a plurality of tension coil springs. In this case, the tension coil springs are placed vertically, one end is fixed to the pickup head 1310, the other end may be fixed to the bracket for supporting the first rotary motor 1321.

As the pickup elevating driving unit 1320 has the above-described configuration, when the first eccentric driving cam 1322 pushes the first driven cam 1323 down, the pickup head 1310 together with the first driven cam 1323. ) Can descend. When the first eccentric driving cam 1322 is moved out of the state in which the first driven cam 1323 is pushed down, the pickup head 1310 may be raised by the elastic force of the first elastic member 1324.

A stopper 1325 may be provided to limit the lifted position of the pickup head 1310 so that the pickup head 1310 does not rise above the set height by the first elastic member 1324. In addition, the pickup lift driver 1320 may include a position detecting means for detecting and controlling a lifting position of the pickup head 1310.

The pickup horizontal reciprocating drive unit 1340 may be configured as shown in FIG. 5, for example. Referring to FIG. 5, the pickup horizontal reciprocating drive unit 1340 may include a second rotary motor 1341, a second eccentric drive cam 1342, a second driven cam 1343, and a second elastic member 1344. Equipped.

The second rotary motor 1341 is supported by the base frame 110 and is installed such that the rotary shaft is positioned in the width direction of the adhesive tape. The second rotary motor 1341 may be configured to be forward and reverse rotation. The second eccentric drive cam 1342 is coupled to the rotation axis of the second rotary motor 1341. The second driven cam 1343 is disposed in front of the second eccentric drive cam 1342 based on the conveying direction of the adhesive tape. In addition, the second driven cam 1343 contacts the second eccentric drive cam 1342 and is rotatably installed in the horizontal reciprocating guide 1350, thereby rotating together with the rotation of the second eccentric drive cam 1342.

The second elastic member 1344 applies an elastic force to the horizontal reciprocating guide 1350 in a direction opposite to the conveying direction of the adhesive tape. The second elastic member 1344 may be formed of a plurality of tension coil springs. In this case, the tension coil springs are laid horizontally, one end is fixed to the pickup head 1310, the other end may be fixed to the base frame 110.

As the pickup horizontal reciprocating drive unit 1340 has the above-described configuration, when the second eccentric drive cam 1342 pushes the second driven cam 1343 forward, the pickup head 1310 together with the second driven cam 1343. ) Can move forward. When the second eccentric drive cam 1342 moves the second driven cam 1343 forward, the pickup head 1310 may be retracted by the elastic force of the second elastic member 1344.

A stopper 1345 may be provided to limit the backward position of the pickup head 1310 so that the pickup head 1310 does not backward by the second elastic member 1344 or more. In addition, the pickup horizontal reciprocating drive unit 1340 may be provided with a position detecting means for detecting and controlling the horizontal reciprocating position of the pickup head 1310.

On the other hand, the lifting unit 150 may be configured as shown in Figure 6 and 7, for example. 6 and 7, the lifting unit 150 includes a lifting block 151, a third rotary motor 153, a third eccentric drive cam 154, a third driven cam 155, and The third elastic member 156 is provided.

The lifting block 151 is supported by the base frame 110 so as to be able to lift and lower. And the lifting block 151 is provided with the lifting side adsorption | suction part 152 (refer FIG. 3) which vacuum-adsorbs the adhesive tape conveyed to the upper area | region which is a cutting | disconnection area. When the adhesive tape is transferred on the lifting block 151, a vacuum pressure is applied to the lifting side suction unit 152. Then, the vacuum pressure applied to the lift side suction unit 152 can be maintained until the transferred adhesive tape is cut and vacuum-adsorbed by the pick-up mechanism 20 after cutting. Accordingly, the adhesive tape can be delivered to the pickup mechanism 20 as it is, without being misaligned.

The third rotary motor 153 is supported by the base frame 110. The third rotary motor 153 may be configured to be forward and reverse rotation. The third eccentric drive cam 154 is coupled to the rotation axis of the third rotary motor 153. The third driven cam 155 abuts against the third eccentric drive cam 154 on the upper side of the third eccentric drive cam 154 and is rotatably installed in the lifting block 151, whereby the third eccentric drive cam 154 is provided. Rotate together during the rotation.

The third elastic member 156 applies an elastic force to the lifting block 151 in a direction opposite to the rising direction of the lifting block 151. The third elastic member 156 may be formed of a plurality of tension coil springs. In this case, the tension coil springs are placed vertically, one end is fixed to the lifting block 151, the other end may be fixed to the base frame 110.

As the lifting unit 150 has the above-described configuration, when the third eccentric driving cam 154 pushes the third driven cam 155 upward, the lifting block 151 together with the third driven cam 155 is provided. You can ascend. Then, when the third eccentric drive cam 154 deviates from the state in which the third driven cam 155 is pushed upward, the lifting convex 151 may be lowered by the elastic force of the third elastic member 156.

A stopper 157 may be provided to limit the lowering position of the elevating block 151 so that the elevating block 151 does not descend by the third elastic member 156 below the set height. In addition, the lifting unit 150 may be provided with a position detecting means for detecting and controlling the lifting position of the lifting block 151.

Meanwhile, referring again to FIGS. 1 and 2, the cutter 140 may be installed on the transfer support 131 with the cutter blade facing downward, so that the adhesive tape may be cut when the lifting unit 150 is raised. In addition, the cutter 140 may be installed on the transfer support 131 so that the adhesive tape passes between the cutter 140 and the transfer support 131. Here, if the gap between the cutter 140 and the transfer support 131 is as small as possible in the range that can pass the adhesive tape, the effect of supporting the adhesive tape in the process of cutting the adhesive tape by the cutter 140 will be increased. Can be.

The supply unit 120 may include a supply roller 121, a rotation support 122, and a torque adjusting unit 123. The feed roller 121 allows the tape reel 20 on which the adhesive tape is wound to be mounted. Rotating support 122 is for supporting the rotation of the supply roller 121, it may be fixed to the base frame (110).

The torque adjusting unit 123 is for adjusting the torque of the supply roller 121. That is, the torque adjusting unit 123 maintains a constant tension when the adhesive tape released from the tape reel 20 is transferred by the transfer unit 130, thereby enabling the adhesive tape to be accurately conveyed by a set distance. The torque adjusting unit 123 may be configured in various ways, for example, it may include an adjustment screw and a spring, and may be installed to adjust the tightening degree between the rotation shaft and the bearing at the rotational portion of the supply roller 121.

Meanwhile, the adhesive tape T may be wound together with the spacer tape S on the tape reel 20. The spacer tape S can prevent the adjacent portions from adhering to each other in a state where the adhesive tape T having adhesiveness on both surfaces is wound. When the adhesive tape T and the spacer tape S wound together on the tape reel 20 are supplied while being released, the adhesive tape T and the spacer tape S can be separated by the separating roll 124. have. A discharge part (not shown) is provided at the side where the spacer tape S is separated, and the separated spacer tape S may be sucked out and discharged. In addition, static electricity may be generated while the spacer tape S is separated, and an antistatic part may be provided to prevent this.

On the other hand, the base frame 110 may be movable in the width direction of the adhesive tape on the fixing frame 101. This is to allow the position of the base frame 110 to be changed in accordance with the position of the pickup mechanism 10 for picking up the cut adhesive tape. That is, to accurately adjust the position of the adhesive tape to be cut in the cutting area according to the position of the pickup mechanism (10). The base frame 110 may slide in the width direction of the adhesive tape by receiving the guide rails 102 installed on the fixing frame 101.

Meanwhile, the transfer unit 130 may include a tape guide 133. The tape guide 133 is installed on the transfer support 131 to guide the transfer of the adhesive tape. In order to stably guide the transfer of the adhesive tape, the tape guide 133 is preferably formed to have a length corresponding to at least the length of the horizontal reciprocating section of the pickup head 1310.

As shown in FIG. 8, it is preferable that the tape guide 133 be able to change a distance from the adhesive tape T in accordance with the width of the adhesive tape T to be conveyed. When the width of the adhesive tape T supplied from the supply unit 120 is changed, the tape guide 133 is brought close to the adhesive tape T to change the width of the adhesive tape T to transfer the adhesive tape T. To guide stably. The tape guide 133 may be supported to slide in the width direction of the adhesive tape T. Movement of the tape guide 133 is preferably finely controlled by a micrometer regulator.

An operation example of the adhesive tape cutting device 100 according to an embodiment of the present invention having the above configuration will be described below with reference to FIGS. 9A to 9E.

First, as shown in FIG. 9A, the picker head 1310 is held in an elevated state. The adhesive tape T is supplied from the supply unit 120 to the transport support 131. At this time, the adhesive tape T is passed between the cutter 140 and the transfer support 131, and the tip of the adhesive tape T is positioned to coincide with the tip of the transfer support 131. Thereafter, as illustrated in FIG. 9B, a vacuum pressure is generated on the pick-up adsorption unit 1311 of the picker head 1310 to adsorb the adhesive tape T, and then the lifting tape is lifted by a predetermined length. The picker head 1310 is horizontally moved to be transported onto 151.

Thereafter, as shown in FIG. 9C, the picker head 1310 is lowered to seat the adhesive tape T on the transfer support 131. At this time, a vacuum pressure is generated in the transport side adsorption part 132 and the lifting side adsorption part 152 to fix the adhesive tape T. Thereafter, as shown in 9d, the vacuum pressure applied to the pick-up adsorption unit 1311 of the picker head 1310 is released, the picker head 1310 is raised, and then horizontally moved to the first standby position to stand by.

Then, as shown in 9e, the lifting block 151 is raised to cut the adhesive tape T by the cutter 140. Then, the cut tape T 'is picked up by the pickup mechanism 20 and supplied to the chip bonding apparatus. When the above process is repeated, the tape T 'cut by the chip bonding apparatus can be continuously supplied.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Figure 1 is a perspective view of the adhesive tape cutting apparatus according to an embodiment of the present invention from the front.

Figure 2 is a perspective view of the adhesive tape cutting device shown in FIG.

3 is a plan view of the conveying side adsorption unit and the lifting side adsorption unit in FIG. 1;

4 is a rear view of the pickup lift drive in FIG. 1;

5 is a front view of the pickup horizontal reciprocating drive unit in FIG.

6 and 7 are front views for explaining an operation example of the lift unit in FIG.

8 is a plan view for explaining an operation example of a tape guide in FIG.

9A to 9E are views for explaining an operation example of the adhesive tape cutting device of FIG.

<Brief description of the major symbols in the drawings>

110. Base frame 120. Supply part

130. Transfer unit 132. Transfer side adsorption unit

133 tape guide 140 cutter

150..Elevation Unit 151..Elevation Block

152. Lift side adsorption unit 1300 Picker

1310 Picker head 1320 Pick-up lift drive

1340. Pick-up horizontal reciprocating drive T. Adhesive tape

Claims (13)

Base frame; A supply unit for continuously supplying an adhesive tape; A transfer unit installed on the base frame and configured to pick up the adhesive tape supplied by the supply unit and transfer the adhesive tape to the cutting area by a predetermined length; A cutter disposed corresponding to a boundary between the transfer part and the cutting area; And An elevating portion capable of elevating with respect to the conveying portion, the elevating portion for raising the state in which the adhesive tape conveyed to the cutting region is absorbed and fixed and causing the cutter to cut the adhesive tape to a predetermined length; Adhesive tape cutting device having a. The method of claim 1, The transfer unit; A transfer support for supporting the adhesive tape during the transfer of the adhesive tape supplied from the supply unit; And a conveying side adsorption portion formed on the conveying support to vacuum-adsorb and fix the conveyed adhesive tape. The method of claim 2, The conveying portion has a tape picker for picking up an adhesive tape; The tape picker is: A picker head having a pick-up suction part for vacuum suction of an adhesive tape; A pickup lift driver for lifting the picker head up and down; A lifting guide for guiding the lifting of the pickup head; Pick-up horizontal reciprocating drive unit for reciprocating the picker head horizontally back and forth in the transfer direction of the adhesive tape, and Adhesive tape cutting device, characterized in that it comprises a horizontal reciprocating guide for guiding the horizontal reciprocation of the picker head and the lifting guide. The method of claim 3, The pickup lift drive unit: A first rotary motor supported by the horizontal reciprocating guide, A first eccentric drive cam coupled to a rotating shaft of the first rotary motor; A first driven cam rotatably installed at the pickup head at a lower side of the first eccentric drive cam, and rotating together with the rotation of the first eccentric drive cam; And a first elastic member for applying an elastic force to the pickup head in a direction opposite to the downward direction of the pickup head. The method according to claim 3 or 4, The pickup horizontal reciprocating drive unit: A second rotary motor supported by the base frame and installed so that the rotating shaft is positioned in the width direction of the adhesive tape; A second eccentric drive cam coupled to the rotating shaft of the second rotary motor; A second driven cam rotatably installed on the horizontal reciprocating guide at the front of the second eccentric drive cam based on the conveying direction of the adhesive tape, and rotating together with the rotation of the second eccentric drive cam; And a second elastic member for applying an elastic force to the horizontal reciprocating guide in a direction opposite to the conveying direction of the adhesive tape. The method of claim 2, The transfer unit is an adhesive tape cutting device characterized in that it further comprises a tape guide is installed on the transfer support to guide the transfer of the adhesive tape. The method of claim 6, The tape guide is an adhesive tape cutting device, characterized in that the gap with the adhesive tape can be changed to match the width of the adhesive tape to be transferred. The method of claim 1, The lifting unit: An elevating block having an elevating side adsorption portion for vacuum-adsorbing the adhesive tape supported by the base frame so as to be elevable and transported to the cutting region; A third rotary motor supported by the base frame; A third eccentric drive cam coupled to the rotary shaft of the third rotary motor; A third driven cam rotatably installed on the elevating block above the third eccentric drive cam and rotating together when the third eccentric drive cam is rotated, and And a third elastic member for applying an elastic force to the elevating block in a direction opposite to the elevating direction of the elevating block. The method of claim 1, The cutter is an adhesive tape cutting device, characterized in that the cutter blade is installed downward on the transfer support so that the adhesive tape passes between the transfer support and the support. The method of claim 1, The supply unit: A feed roller to which a tape reel on which the adhesive tape is wound is mounted, A rotation support for supporting rotation of the feed roller and fixed to the base frame; Adhesive tape cutting device characterized in that it comprises a torque adjusting unit for adjusting the torque of the supply roller. The method of claim 1, Adhesive tape cutting apparatus further comprises a discharge portion for sucking and discharge the spacer tape is separated while the adhesive tape is supplied from the supply. The method of claim 11, Adhesive tape cutting apparatus further comprises a static eliminator for removing the static electricity generated when the spacer tape is separated from the supply. The method of claim 1, The base frame is movable on the fixing frame in the width direction of the adhesive tape, the adhesive tape cutting apparatus characterized in that the position can be changed in accordance with the position of the pickup mechanism for picking up the cut adhesive tape.

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