CN100452276C - Method for mfg. plasma display - Google Patents
Method for mfg. plasma display Download PDFInfo
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- CN100452276C CN100452276C CNB2005100417970A CN200510041797A CN100452276C CN 100452276 C CN100452276 C CN 100452276C CN B2005100417970 A CNB2005100417970 A CN B2005100417970A CN 200510041797 A CN200510041797 A CN 200510041797A CN 100452276 C CN100452276 C CN 100452276C
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Abstract
The present invention discloses a method for manufacturing plasma displays. An ACF is glued on a printing electrode of a glass base plate, the glass base plate glued with the ACF is put on a compression joint machine to be pressed at low temperature in advance, the upper part and the lower part of the glass base plate are heated simultaneously, an upper layer of the ACF is peeled off, and an adhesive layer of the ACF is retained. An ACF and an FPC film are glued on the printing electrode of the glass base plate, the upper part and the lower part of the glass base plate are heated simultaneously again, a place where the FPC film is glued is put on the compression joint machine to be compressed tightly, and the FPC film is sealed on the glass base plate by noncorrosive glue finally. The present invention can safely, reliably and evenly glue FPCs on the glass base plate by using the mode that the upper surface and the lower surface of the glass base plate which is glued with the ACF are evenly distributed simultaneously, and compression joint points are compressed and jointed at two times. The present invention increases compression joint efficiency and success rate.
Description
Technical field
The present invention relates to a kind of manufacture method of plasma scope.
Background technology
In the last few years, plasm display device attracted people's attention as visual remarkable display screen, to high-precision refinement and the development of big picture aspect.
In plasm display device, roughly can be divided into AC type and DC type as type of drive, as discharge type two kinds of surface discharge type and opposed discharge-types be arranged.AC type, surface discharge type plasma display unit account for main flow at present, and its developing direction is gradually to high-precision refinement and big picture development.
Existing plasma manufacture method just heats at the glass substrate face that pastes fpc film, and heats inhomogeneous; Some technology is not carried out precompressed, just directly the ACF film is attached on the glass substrate just directly to carry out real pressure later.Cause the glass substrate fragmentation like this in the time of crimping easily, the effect of crimping is bad, and is insecure, and the resistivity of crimping point is bigger, and success rate is lower.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of plasma scope, make fpc film to be bonded on the glass substrate safely, reliably, uniformly, method is easy, and can improve crimping efficient and success rate.
A kind of manufacture method of plasma display panel (PDP), this manufacture method has following operation:
At first, Anisotropically conductive film ACF film is sticked on the printing electrode of glass substrate;
Then, the glass substrate that pastes Anisotropically conductive film ACF film is placed on low temperature precompressed on the press-connection machine, to up and down simultaneously heating of glass substrate, temperature is 70～130 ℃, and pressure is 4～6Kg/cm
2Secondly, Anisotropically conductive film ACF film upper strata is thrown off, keep the adhesion coating of Anisotropically conductive film ACF film; Paste Anisotropically conductive film ACF film printing electrode of glass substrate and stick flexible PCB film fpc film, glass substrate is heated up and down simultaneously again, temperature is 70～130 ℃, and pressure is 4～6Kg/cm
2The place of pasting the flexible PCB fpc film is placed on real pressure the on the press-connection machine, and temperature is 170～220 ℃, and pressure is 5～7Kg/cm
2
At last, with non-corrosiveness glue the flexible PCB fpc film is enclosed on the glass substrate.Said non-corrosiveness glue can be silica gel, glass cement or PUR.
Identical or its temperature error of the temperature of upper and lower two zones of heating of plasma glass substrate is no more than ± and 20 ℃.
When article on plasma body glass substrate heats, on heated glass substrate, place cushion film with elastic property.Said cushion film with elastic property can be caoutchouc elasticity cushion film or plastic cement elastic cushion sheet.
The present invention has carried out twice crimping by adopting the glass substrate above and below of posting ACF film homogeneous heating simultaneously to the crimping point so that fpc film can be safely, reliably, be bonded on the glass substrate uniformly, and can improve crimping efficient and success rate.Because the elastic reaction of cushion film, when pressurizeing on the glass substrate that posts FPC, make fpc film bonding evenly, the elasticity by pad absorbs the local stress to the display screen glass substrate, prevents that display screen is destroyed.
Under the effect of ACF film, glass substrate and the fpc film of plasma is pasted together closely, and guarantees in taping process, glass not to be had injury, sticking strength is big.
Embodiment
Embodiment 1
At first, Anisotropically conductive film ACF film is sticked on the printing electrode of glass substrate; Then, the glass substrate that pastes Anisotropically conductive film ACF film is placed on low temperature precompressed on the press-connection machine, to up and down simultaneously heating of glass substrate, temperature is 100 ℃, and pressure is 5Kg/cm
2Secondly, Anisotropically conductive film ACF film upper strata is thrown off, keep the adhesion coating of Anisotropically conductive film ACF film; Paste Anisotropically conductive film ACF film printing electrode of glass substrate and stick flexible PCB film fpc film, glass substrate is heated up and down simultaneously again, temperature is 80 ℃, and pressure is 4～6Kg/cm
2When the plasma glass substrate heats, be placed with the caoutchouc elasticity cushion film at heated glass substrate.The place of pasting the flexible PCB fpc film is placed on real pressure the on the press-connection machine, and temperature is 200 ℃, and pressure is 6Kg/cm
2At last, with silica gel the flexible PCB fpc film is enclosed on the glass substrate.
Under the effect of ACF film, glass substrate and fpc film can be bonded together closely, and not affect its electric conductivity.The fail safe of glass when it can also improve crimping improves crimping efficient, reduces production cost greatly.
Embodiment 2:
At first, Anisotropically conductive film ACF film is sticked on the printing electrode of glass substrate; Then, the glass substrate that pastes Anisotropically conductive film ACF film is placed on low temperature precompressed on the press-connection machine, to up and down simultaneously heating of glass substrate, temperature is 80 ℃, and pressure is 6Kg/cm
2Secondly, Anisotropically conductive film ACF film upper strata is thrown off, keep the adhesion coating of Anisotropically conductive film ACF film; Paste Anisotropically conductive film ACF film printing electrode of glass substrate and stick flexible PCB film fpc film, glass substrate is heated up and down simultaneously again, temperature is 100 ℃, and pressure is 4～6Kg/cm
2When the plasma glass substrate heats, be placed with the caoutchouc elasticity cushion film at heated glass substrate.The place of pasting the flexible PCB fpc film is placed on real pressure the on the press-connection machine, and temperature is 180 ℃, and pressure is 5Kg/cm
2At last, with glass cement the flexible PCB fpc film is enclosed on the glass substrate.
Embodiment 3:
At first, Anisotropically conductive film ACF film is sticked on the printing electrode of glass substrate; Then, the glass substrate that pastes Anisotropically conductive film ACF film is placed on low temperature precompressed on the press-connection machine, to up and down simultaneously heating of glass substrate, temperature is 110 ℃, and pressure is 4Kg/cm
2Secondly, Anisotropically conductive film ACF film upper strata is thrown off, keep the adhesion coating of Anisotropically conductive film ACF film; Paste Anisotropically conductive film ACF film printing electrode of glass substrate and stick flexible PCB film fpc film, glass substrate is heated up and down simultaneously again, temperature is 110 ℃, and pressure is 4～6Kg/cm
2When the plasma glass substrate heats, be placed with plastic cement elastic cushion sheet at heated glass substrate.The place of pasting the flexible PCB fpc film is placed on real pressure the on the press-connection machine, and temperature is 210 ℃, and pressure is 7Kg/cm
2At last, with PUR the flexible PCB fpc film is enclosed on the glass substrate.
Claims (8)
1, a kind of manufacture method of plasma scope, Anisotropically conductive film ACF film is sticked on the printing electrode of glass substrate, it is characterized in that, follow-up method is carried out according to the following steps, the glass substrate that pastes Anisotropically conductive film ACF film is placed on low temperature precompressed on the press-connection machine, to up and down simultaneously heating of glass substrate, temperature is 70～130 ℃, and pressure is 4～6Kg/cm
2Anisotropically conductive film ACF film upper strata is thrown off, keep the adhesion coating of Anisotropically conductive film ACF film; Adhesion coating at Anisotropically conductive film ACF film pastes flexible PCB film fpc film, glass substrate is heated up and down simultaneously again, and temperature is 70～130 ℃, and pressure is 4～6Kg/cm
2The place of pasting flexible PCB film fpc film is placed on real pressure the on the press-connection machine, and temperature is 170～220 ℃, and pressure is 5～7Kg/cm
2At last, with non-corrosiveness glue flexible PCB film fpc film is enclosed on the glass substrate.
2, the manufacture method of plasma scope according to claim 1 is characterized in that, identical or its temperature error of the above and below heating-up temperature of plasma glass substrate is no more than ± and 20 ℃.
3, the manufacture method of plasma scope according to claim 1 is characterized in that, when article on plasma body glass substrate heats, places the cushion film with elastic property on heated glass substrate.
4, the manufacture method of plasma scope according to claim 1 is characterized in that, described non-corrosiveness glue is meant silica gel, glass cement or PUR.
5, the manufacture method of plasma scope according to claim 3 is characterized in that, the cushion film of described elastic property is meant caoutchouc elasticity cushion film or plastic cement elastic cushion sheet.
6, the manufacture method of plasma scope according to claim 1, it is characterized in that, described twice heating pressurization, and real temperature, pressure of pressing is on the last press-connection machine: after sticking Anisotropically conductive film ACF film glass substrate is heated up and down simultaneously, temperature is 100 ℃, and pressure is 5Kg/cm
2After sticking flexible PCB film fpc film glass substrate is heated up and down simultaneously, temperature is 80 ℃, and pressure is 4～6Kg/cm
2The place of pasting flexible PCB film fpc film is placed on real pressure the on the press-connection machine, and temperature is 200 ℃, and pressure is 6Kg/cm
2
7, the manufacture method of plasma scope according to claim 1, it is characterized in that, described twice heating pressurization, and real temperature, pressure of pressing is on the last press-connection machine: after sticking Anisotropically conductive film ACF film glass substrate is heated up and down simultaneously, temperature is 80 ℃, and pressure is 6Kg/cm
2After sticking flexible PCB film fpc film glass substrate is heated up and down simultaneously, temperature is 100 ℃, and pressure is 4～6Kg/cm
2The place of pasting flexible PCB film fpc film is placed on real pressure the on the press-connection machine, and temperature is 180 ℃, and pressure is 5Kg/cm
2
8, the manufacture method of plasma scope according to claim 1, it is characterized in that, described twice heating pressurization, and real temperature, pressure of pressing is on the last press-connection machine: after sticking Anisotropically conductive film ACF film glass substrate is heated up and down simultaneously, temperature is 110 ℃, and pressure is 4Kg/cm
2After sticking flexible PCB film fpc film glass substrate is heated up and down simultaneously, temperature is 110 ℃, and pressure is 4～6Kg/cm
2The place of pasting flexible PCB film fpc film is placed on real pressure the on the press-connection machine, and temperature is 210 ℃, and pressure is 7Kg/cm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100417970A CN100452276C (en) | 2005-03-14 | 2005-03-14 | Method for mfg. plasma display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100417970A CN100452276C (en) | 2005-03-14 | 2005-03-14 | Method for mfg. plasma display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1719571A CN1719571A (en) | 2006-01-11 |
| CN100452276C true CN100452276C (en) | 2009-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100417970A Expired - Fee Related CN100452276C (en) | 2005-03-14 | 2005-03-14 | Method for mfg. plasma display |
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| CN (1) | CN100452276C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4392766B2 (en) * | 2007-08-21 | 2010-01-06 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
| CN102184680A (en) * | 2010-09-30 | 2011-09-14 | 四川虹欧显示器件有限公司 | Method and device for bonding flat-panel display |
| CN103294320A (en) * | 2013-06-06 | 2013-09-11 | 敦泰科技有限公司 | Capacitive touch screen and manufacturing method thereof |
| CN106371250A (en) * | 2016-10-21 | 2017-02-01 | 芜湖赋兴光电有限公司 | Anisotropic conductive film (ACF) adhesive hot-pressing process |
| CN109041448B (en) * | 2018-09-26 | 2020-05-12 | 深圳市致竑光电有限公司 | Bonding method of FPC (Flexible printed Circuit) of luminescent glass |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195899A (en) * | 1998-12-24 | 2000-07-14 | Sony Corp | Manufacture of semiconductor device |
| JP2002083840A (en) * | 2000-09-07 | 2002-03-22 | Nec Kagoshima Ltd | Method for thermocompression-bonding substrate |
| JP2003178686A (en) * | 2001-12-13 | 2003-06-27 | Nec Kagoshima Ltd | Plasma display and manufacturing method thereof |
| JP2003283119A (en) * | 2002-03-22 | 2003-10-03 | Seiko Epson Corp | Image display device, method of manufacturing the same, and electronic equipment |
| CN1475836A (en) * | 2002-07-30 | 2004-02-18 | 阿尔卑斯电气株式会社 | Liquid crystal display device |
-
2005
- 2005-03-14 CN CNB2005100417970A patent/CN100452276C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195899A (en) * | 1998-12-24 | 2000-07-14 | Sony Corp | Manufacture of semiconductor device |
| JP2002083840A (en) * | 2000-09-07 | 2002-03-22 | Nec Kagoshima Ltd | Method for thermocompression-bonding substrate |
| JP2003178686A (en) * | 2001-12-13 | 2003-06-27 | Nec Kagoshima Ltd | Plasma display and manufacturing method thereof |
| JP2003283119A (en) * | 2002-03-22 | 2003-10-03 | Seiko Epson Corp | Image display device, method of manufacturing the same, and electronic equipment |
| CN1475836A (en) * | 2002-07-30 | 2004-02-18 | 阿尔卑斯电气株式会社 | Liquid crystal display device |
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| CN1719571A (en) | 2006-01-11 |
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Owner name: SICHUAN SHIJI SHUANGHONG DISPLAY DEVICES CO., LTD Free format text: FORMER OWNER: IRICO GROUP ELECTRONICS CO., LTD. Effective date: 20070622 |
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Effective date of registration: 20070622 Address after: 621000, Zhou Yonghong, No. 35 Tung Hing East Road, hi tech Zone, Sichuan, Mianyang Applicant after: Sichuan Sterope Orion Display Co., Ltd. Address before: 712021 No. 1 Rainbow Road, Shaanxi, Xianyang Applicant before: IRICO Group Electronics Co., Ltd. |
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