JP2002083840A - Method for thermocompression-bonding substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the connection reliability of a flexible substrate (FPC) of which each set of a plurality of sheets is simultaneously and successively thermocompression-bonded to a plasma display panel(PDP) substrate using a long theremocompression-bonding head. SOLUTION: After FPCs 4, 5 to which an anisotropic conductive film(ACF) is tentatively stopped are tentatively stopped to a PDP substrate 3, the FPCs 4, 5 are simultaneously (fully) thermocompression-bonded to the PDP substrate 3 in a rear portion of the FPC 4 by a theremocompression-bonding head 1 so as to form a non-bonding part 2. Next, after FPCs 6, 7 which are tentatively stopped are simultaneously thermocompression-bonded to a position of the PDP substrate 3 which is not affected by temperatures of the non-bonding part, the position of the theremocompression-bonding head 1 is adjusted without forming the non-bonding part 2, and two sheets in each of FPCs 8, 9 and FPCs 10, 11 are sequentially thermocompression-bonded to between the FPC 5 and the FPC 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocompression bonding method for a substrate, and more particularly to a method for thermocompression bonding a panel substrate of a plasma display or a liquid crystal display and a flexible circuit board via an anisotropic conductive film.

[0002]

2. Description of the Related Art Plasma display panels (hereinafter referred to as P
The DP includes a plasma display panel substrate (hereinafter, referred to as a PDP substrate) having a display unit and a circuit board for driving the PDP. As a circuit board, a flexible circuit board (hereinafter, referred to as FPC) is generally used, and the FPC is an anisotropic conductive film (hereinafter, referred to as AC).
F) is electrically connected to the PDP substrate by thermocompression. An example of a method of thermocompression bonding an FPC to a PDP substrate is disclosed in Japanese Patent Application Laid-Open No. H11-297386.

FIG. 7 is a plan view (FIG. 7A) and a cross-sectional view (FIG. 7) for explaining a method of thermocompression bonding of a PDP substrate and an FPC disclosed in Japanese Patent Application Laid-Open No. 11-297386.
(B)). As shown in FIG. 7A, the PDP substrate 10
0, a plurality of PDP electrodes 101 are arranged in parallel with each other.
Are provided at regular intervals. Also, the PDP substrate 100
A plurality of FPC electrodes 103 parallel to each other are provided on a bottom surface of the FPC 102 facing the top surface of the PDP electrode 1.
01 is provided for each of them. FIG. 7 (b)
FIG. 7 is a cross-sectional view showing a cross-sectional structure of the PDP substrate 100 and the FPC 102, and particularly corresponds to a cross-sectional view taken along the line AA ′ of FIG. ACF1 is provided at a portion where the upper surface of the PDP substrate 100 and the bottom surface of the FPC 102 are in contact with each other.
04 is provided. The ACF 104 is a PDP electrode 1
01 and an anisotropic conductive film having conductivity only in the direction in which the FPC electrode 103 extends.
Electrode 101 and FPC electrode 103 are thermo-compressed and electrically connected via conductive particles present in the ACF, and PDP substrate 100 and FPC 102 are physically connected.

[0004] Using the ACF thermocompression bonding technique, PDP
A plurality of FPC boards are thermocompression-bonded one after another on four sides of the board,
The DP is configured.

[0005]

FIG. 8 is a PDP for explaining a step of thermocompression bonding a plurality of FPCs to a PDP substrate.
It is a top view of a board and an FPC board. First, as shown in FIG. 8A, a thermosetting ACF (not shown) is prepared at a temperature of about 70 ° C. for about 5 seconds by using a hot press to temporarily attach FPC4 and FPC5.

[0006] Next, the above-mentioned FPC4 in which the ACF is temporarily fixed.
The temperature of the FPC 5 is set to about 70 ° C. and the pressure is about 5 seconds by using a hot press or a push-up pin so that the terminal of the panel (not shown) and the FPC terminal (not shown) overlap the PDP substrate 3. Temporarily fix. The PDP substrate 3 on which the FPC is temporarily fixed is moved between the pressure bonding heads 1, and the FPCs 4 and 5 are moved by the head 1 to the PDP substrate 3.
At the same time at a temperature of 180 to 200 ° C. Heating for pressure bonding is performed from both sides of the PDP substrate and the FPC.

As the length of the head 1 increases with the variety of PDPs, a long head longer than two FPCs is used for the purpose of improving efficiency, and two or more FPCs are simultaneously pressed.
FIG. 8 shows a case in which the head 1 capable of pressing two FPCs at the same time is used.

FIG. 8B and FIG.
FPC6 and FPC are successively provided on the PDP substrate 3 as shown in FIG.
7. FPC8 and FPC9 are crimped. In this case, since the head 1 is longer than two FPCs, FIGS.
As shown in (c), a blank hit portion 2 is generated. The surface temperature of the panel (PDP substrate 3) of the blanking portion 2 is 180 to 2 at the time of pressure bonding.
The temperature is lowered to 00 ° C, 125 to 130 ° C 20 seconds after the completion of the pressure bonding, and 75 to 80 ° C 60 seconds after the completion of the pressure bonding.

When the FPCs are successively thermocompression-bonded to the PDP substrate 3 by the above operations, the PDP
When the surface temperature of the substrate 3 exceeds 80 ° C. and the FPC is temporarily fixed to the PDP substrate 3, the ACF temporarily fixed to the FPC requires the thrust, temperature and time required for secure connection. There is a disadvantage that the adhesive is hardened beforehand, and the adhesion between the PDP substrate and the ACF or the ACF and the FPC in the blank portion is reduced in the final press bonding, so that long-term reliability of the PDP cannot be ensured.

Accordingly, an object of the present invention is to provide a PDP substrate and an FPC via an ACF that solve the above-mentioned problems of the prior art.
To provide a method for thermocompression bonding.

[0011]

According to the method of thermocompression bonding of a substrate of the present invention, a first substrate having an anisotropically conductive film temporarily fixed on one surface thereof is bonded to the first substrate via the anisotropically conductive film. Temporarily fixing to a second substrate having a larger size;
Repeating the steps of heating and pressurizing the first substrate and the second substrate from both sides with a thermocompression head and thermocompression bonding the first substrate to the second substrate via the anisotropic conductive film. Connecting a plurality of the first substrates side by side to the second substrate at a predetermined constant interval, wherein the first substrate is temporarily fixed to the second substrate via the anisotropic conductive film. 2, the surface temperature of the substrate is lower than the thermosetting temperature of the anisotropic conductive film, and the first substrate is formed on the second substrate at a temperature lower than the thermosetting temperature of the anisotropic conductive film. After being temporarily fixed via an anisotropic conductive film, the thermocompression bonding is performed.

In the configuration of the present invention, one or more first substrates are simultaneously subjected to the temporary fixing and the thermocompression bonding to the second substrate via the anisotropic conductive film.

In the above structure of the present invention, n sheets (n: an integer equal to or more than 1) of the first substrate simultaneously thermocompression-bonded to the second substrate via the anisotropic conductive film; Assuming that the width of the first substrate is X and the interval between the first substrates to be thermocompression-bonded is Z, a thermocompression bonding head having a width Y given by the following equation (1) is used. be able to.

[0014]

(Equation 2)

In the configuration of the present invention, n sheets of the first group of the first substrates are simultaneously thermocompression-bonded at one time from the predetermined position on the second substrate in one direction at the interval Z, The thermocompression bonding of the first substrate of the first group can be performed such that a blank portion of the thermocompression bonding head is formed on the surface of the second substrate behind the first group in the one direction. .

Further, after the first group of the first substrates is thermocompression-bonded on the second substrate, the next second group of n first substrates is moved from the first group to nX. And (n + 1) Z or 2nX and (2n + 1) Z on the second substrate in the one direction at a distance Z. By thermocompression bonding of the second group of first substrates in this manner, the next group of first substrates is formed in the blanking portion generated by thermocompression of the first group of first substrates. When temporarily fixed, the temperature of the second substrate surface falls below the thermosetting temperature of the anisotropic conductive film due to natural cooling, and the thermosetting progress of the anisotropic conductive film during the temporary fixing can be suppressed. .

In the configuration of the present invention, n sheets of the first group of the first substrates are simultaneously thermocompression-bonded at one time from the predetermined position on the second substrate in one direction at the interval Z. At this time, thermocompression bonding of the first substrate of the first group is performed such that a blank portion of the thermocompression bonding head is formed on the surface of the second substrate in front of the first group in the one direction. You can also. In this case, the n second substrates of the second group are separated from the first group by the distance of the interval Z or nX and (n +
1) The thermocompression bonding can be performed on the second substrate at a distance of the sum of Z, side by side in the one direction and at the interval Z.

[0018]

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a plan view of a main part of a substrate press-bonding for explaining a process sequence of a substrate press-bonding method according to a first embodiment of the present invention.

As the head 1, a long head capable of simultaneously pressing one or more FPCs at the same time is used. In this case, the horizontal width of the thermocompression bonding surface of the head is Y, the horizontal width of the FPC is X, the interval between the FPCs bonded to the PDP substrate 3 is Z, and the number of FPCs simultaneously bonded to the PDP substrate 3 is n (n: 1). Integer greater than or equal to)
Then, there is a relationship represented by the following equation (1).

[0021]

(Equation 3)

FIG. 1 shows a case where two FPCs are simultaneously bonded to the PDP substrate 3. First, a thermosetting ACF on one side
A predetermined number of FPCs (not shown) temporarily fixed to the terminals at a temperature of about 70 ° C. are prepared. Temporarily fixed F of this ACF
The PC4 and the FPC5 are temporarily fixed to the PDP substrate 3 at a temperature of about 70 ° C. at an interval Z, and the terminals (not shown) of the PDP substrate 3 and the terminals (not shown) of each FPC are temporarily fixed so as to overlap. Heat-pressing machine (not shown)
The PDP substrate 3 is moved between the thermocompression bonding boards of the head 1 (also referred to as a thermocompression bonding head) having a head, and the front end (left side of the paper piece) of the thermocompression bonding board of the head 1 is positioned at the front side of the FPC 4 (the paper piece). (Left side), the two Fs at a temperature of 180 to 200 ° C. by the head 1.
The PC is simultaneously pressed on the PDP substrate 3.

In this case, since the head 1 is longer than the two FPCs, the blanking portion 2 is formed on the PDP substrate 3 separated by the space Z of the FPC 5 (FIG. 1A).

Next, after moving the PDP substrate 3 from the head 1, as shown in FIG.
The next two ACs are placed on the PDP substrate 3 separated by the distance of the sum of Xs.
The temporarily fixed FPCs of F (indicated by FPC6 and FPC7) are temporarily fixed side by side at an interval Z at a temperature of about 70 ° C.

Next, the PD is again placed between the heat-pressing plates of the head 1.
The P substrate 3 is moved, and the other end in the width direction of the thermocompression bonding machine is F
After the PC 7 is positioned so as to coincide with the rear side (right side of the paper piece), the two FPCs are simultaneously bonded to the PDP substrate 3 at a temperature of 180 to 200 ° C. by the head 1.
In that case, since the head 1 is longer than two FPCs, the FPC
The blanking portion 2 is formed on the PDP substrate 3 separated from the FPC 6 on the 6 side by a distance Z.

The thermocompression bonding positions of FPC6 and FPC7 are as follows:
Since the FPC 6 and the FPC 7 are temporarily fixed to the PDP substrate 3 because the distance is away from the blanking portion 2 generated in FIG. 1A, the progress of the thermosetting of the ACF temporarily fixed to the FPC 6 and the FPC 7 can be suppressed. .

Next, after moving the PDP substrate 3 from the head 1, as shown in FIG.
The two FPCs (represented by FPC8 and FPC9) of which ACFs are temporarily fixed are temporarily fixed on the PDP substrate 3 separated by a distance Z from the above by the same operation as described above.

Next, the PD is again placed between the heat-pressing plates of the head 1.
The P substrate 3 is moved, and the other end in the width direction of the thermocompression bonding machine is F
After the PC 9 is positioned so as to coincide with the rear side (right side of the paper piece), the two FPCs are simultaneously bonded to the PDP substrate 3 by the head 1 at a temperature of 180 to 200 ° C.
In that case, since the head 1 is longer than two FPCs, the FPC
On the rear side of No. 5, a portion where the head 1 is completely press-bonded twice (indicated by the double step portion 12) is generated, but almost no decrease in the adhesion between the FPC and the ACF and between the ACF and the PDP substrate is observed. In the third press-bonding step, the surface temperature of the PDP substrate 3 in the blanked portion generated near the FPC 5 in the first press-bonding step has dropped to 80 ° C. or less.
When the PC 9 is temporarily fixed to the PDP substrate 3, the progress of thermosetting of the ACF temporarily fixed to the FPC can be suppressed.

Next, as shown in FIG. 1 (d), the next two FPCs (FPC1
0, FPC11) is pressed onto the PDP substrate 3 so as to be arranged side by side on the FPC9. In this case, the front end (the left side of the paper sheet) of the head 1 in the width direction of the thermocompression bonding machine is the FPC 1
After the alignment is performed so as to coincide with the front horizontal side of 0 (the left side of the piece of paper), pressure bonding is performed. Since the surface temperature of the PDP substrate of the blank portion 2 generated on the FPC 6 side in the second pressure bonding step has been reduced to 80 ° C. or less, the ACF on the FPC when the FPC 10 and the FPC 11 are temporarily fixed to the PDP substrate 3 The progress of thermosetting is suppressed.

By the above operation, FDP is placed on the PDP substrate 3.
FPC by suppressing the progress of thermal curing of ACF during temporary fixing of PC
Nos. 4 to 11 can be securely press-bonded to ensure long-term reliability of the PDP.

Next, a method for crimping a substrate according to a second embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a plan view of a main part of the substrate press-bonding for explaining a substrate press-bonding method according to a second embodiment of the present invention. 2 indicate the order of pressure bonding of the FPC to the PDP substrate. In this embodiment, similarly to the first embodiment, the lateral width of the pressure-bonded portion of the head is represented by Y, the lateral width of the FPC is represented by X, and the distance between the FPCs to be pressure-bonded to the PDP substrate 3 by the above equation (1). Z, F which is simultaneously pressed onto the PDP substrate 3
The relationship of the number of PCs n (n: an integer of 1 or more) is given,
FIG. 2 shows the case where n = 2.

In the first embodiment, the FPC 6 and the FPC 7 are pressure-bonded to the PDP substrate 3 so that the blank portion 12 is formed on the FPC 6 side. In the present embodiment, the blank portion is bonded to the FPC 7 side. After the FPC 6 and the FPC 7 are pressure-bonded on the PDP substrate 3,
The FPC 8 and the FPC 9 are separated from the FPC 6 by a distance Z so that the step portion 12 is formed twice in the crimping portion between the CPC 6 and the PDP substrate 3.
Was crimped. Next, as shown in FIG. 2A or FIG. 2B, the FPC 10 and the FPC 11 are
Crimping between C8. FIG. 2A shows the case where the position of the head 1 is adjusted so that the step portion 12 is formed twice on the crimp portion of the FPC 8, and FIG. 2B shows the case where the double step portion 12 is formed on the crimp portion of the FPC 5. This is the case where the head 1 is adjusted so as to be able to perform the pressure bonding. Also in the present embodiment, FPC4
At the time of pressure bonding of the FPC 5 and the FPC 5, a blank portion is formed on the PDP substrate 3 on the FPC 5 side.
At the time of temporary fixing of the FPC 11 and 11 on the PDP substrate 3, since the surface temperature of the PDP substrate of the blanking portion has dropped to 80 ° C. or less, the FPC 10 and the FPC 11 are temporarily fixed on these FPCs at the time of temporary fixing. The progress of thermosetting of the ACF can be suppressed.

Next, a method for crimping a substrate according to a third embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a plan view of a main part of a substrate press-bonding for explaining a substrate press-bonding method according to a third embodiment of the present invention. Symbols 〜 in FIG. 3 indicate the order of pressure bonding of the FPC to the PDP substrate. In this embodiment, similarly to the first embodiment, the lateral width of the pressure-bonded portion of the head is represented by Y, the lateral width of the FPC is represented by X, and the distance between the FPCs to be pressure-bonded to the PDP substrate 3 by the above equation (1). Z, F which is simultaneously pressed onto the PDP substrate 3
The number of PCs is given a relationship of n (n: an integer of 1 or more), and FIG. 3 shows a case where n = 2.

In the first embodiment, the distance between the FPC 6 and the FPC 5 is set to 4X + 4Z so that the FPC 6
And FPC 7 were pressed on PDP substrate 3 at the same time,
In the present embodiment, the pressure bonding is performed so that the blank portion 12 is formed on the side of the space FPC6. However, in the present embodiment, the space between the FPC6 and the FPC5 is set to 2X + 3Z so that the FPC6 is formed.
And FPC 7 are simultaneously pressed onto PDP substrate 3. FIG. 3A shows FPC6 and FPC7 as FPCs.
Then, the next two FPCs 8 and 9 are placed between the FPC 5 and the FPC 6,
Crimped so that the step 12 is formed twice on the side, and then FP
This is a case where C10 and FPC11 are pressure-bonded to the FPC7 side so as to form a blank portion on the FPC11 side.

FIG. 3B shows a state in which the FPC 8 and the FPC 9 are crimped so that the stepped portion 12 can be formed on the FPC 6 side twice.
In order to make a blank hit part on the FPC 7 side after the next FPC,
In this case, after the FPC 6 and the FPC 7 are crimped on the PDP substrate 3, the FPC 10 and the FPC 11 are crimped so that a blank portion is formed on the FPC 7 side on the FPC 11 side.

FIG. 3C shows a case where the FPC 10 and FPC 11 of FIG. 3A are crimped to the FPC 7 side so that the step portion 12 is formed twice, and FIG. 3D shows a case where FPC of FIG.
PC10 and FPC11 are stepped twice on the FPC7 side.
This is the case where they are crimped so as to make No. 2. 3A to 3C, FPC4, FPC5 and FPC
6. When the FPC 7 is pressure-bonded, blanking portions are formed on the PDP substrate 3. At the time when the FPC is temporarily fixed to these blanking portions, the surface temperature of the blanking portion has dropped to 80 ° C. or less. , AC temporarily fixed to FPC during temporary fixing of FPC
The thermosetting progress of F can be suppressed.

Next, a method for crimping a substrate according to a fourth embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 4 is a plan view of a main part of a substrate press-bonding for explaining a substrate press-bonding method according to a fourth embodiment of the present invention. 4 indicate the order of pressure bonding of the FPC to the PDP substrate. In this embodiment, similarly to the above-described embodiment of the present invention, the width of the pressure-bonded portion of the head is represented by Y, the width of the FPC is represented by X, and the distance between the FPCs to be pressure-bonded to the PDP substrate 3 by the above equation (1). , And the number of FPCs simultaneously pressed on the PDP substrate 3 is given by n (n: an integer of 1 or more), and FIG. 4 shows a case where n = 2.

In this embodiment, the FPC crimping positions at the time of the third and fourth crimping of the FPC in the second embodiment are interchanged. This is the case where it does not occur. FIG.
FIGS. 4A and 4B show a case where an empty strike portion is generated on the FPC 7 side at the time of the second pressure bonding of the FPC, and FIG.
And FIG. 4D shows the FPC at the time of the second crimping of the FPC.
This is a case where a blank hit portion is formed on the side 6.

FIGS. 4A to 4D show the first FPC.
In the first and second crimping, blanking portions are formed. When these blanking portions are temporarily fixed before the third or fourth crimping of the FPC, the surface of the PDP substrate 3 in the blanking portion is formed. The temperature is reduced to 80 ° C. or less, and the thermal curing of the ACF during the temporary fixing of the FPC can be suppressed.

Next, a method for crimping a substrate according to a fifth embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 5 is a plan view of a main part of a substrate press-bonding for explaining a substrate press-bonding method according to a fifth embodiment of the present invention. In the present embodiment, FPC is applied during the first crimping of the FPC.
This is a case where the position of the head 1 is adjusted so that a blank hit portion is formed on the PC 4 side. Symbols in FIG.
Indicates the order of pressure bonding to the substrate. In this embodiment, similarly to the above-described embodiment of the present invention, the width of the pressure-bonded portion of the head is represented by Y, the width of the FPC is represented by X, and the distance between the FPCs to be pressure-bonded to the PDP substrate 3 by the above equation (1). Is Z, and the number of FPCs simultaneously bonded to the PDP substrate 3 is n (n: an integer of 1 or more)
Is given. FIG. 5 shows the case where n = 2.

FIG. 5 (a) shows that after the first crimping of the FPCs 4 and 5 is performed so that a blanking portion is formed on the FPC 4 side, the second to fourth crimping of the FPCs are performed at intervals Z. This is a case in which crimping is performed one after another so that no part is formed.
FIG. 5 (b) shows the FP so that a blank portion is formed on the FPC 4 side.
After the first crimping of C4 and FPC5, FP
The second press bonding of the FPC is performed so that the gap between C5 and FPC6 is 2X + 3Z, and a blank portion is formed on the FPC7 side.
FPC5 and FPC so that a stepped portion occurs twice on PC6
This is the case where the next third FPC is pressure-bonded between 6. FIG. 5C shows a case where the next third FPC is crimped between the FPC 5 and the FPC 6 so that the step portion is generated twice on the FPC 5 side. 5 (a) to 5 (c), a vacant portion is formed when the FPC is crimped, but when the next FPC is temporarily fixed to the vacant portion, as in the above-described embodiment, The temperature of the surface of the PDP substrate in the blank portion is 8
The temperature is reduced to 0 ° C. or lower, and the progress of the thermosetting of the ACF temporarily fixed on the FPC during the FPC temporary fixing can be suppressed. As a result, the FPCs 4 to 11 can be securely press-bonded, and the long-term reliability of the PDP can be secured.

FIG. 6 is an overall plan view of a PDP after FPC compression, showing an application example of the substrate compression method of the fifth embodiment. In the figure, the symbols 〜 indicate the order of crimping of the FPC. 6, the first terminal electrode group connection FPCs 13 to 23 in FIG.
The above-described substrate crimping method of the fifth embodiment is applied to crimping of the second terminal electrode group connection FPCs 24 to 34 and the fourth terminal electrode group connection FPCs 38 to 41. The first terminal electrode group connection FPCs 13 to 23 and the second terminal electrode group connection FPCs 24 to 34 are simultaneously crimped two by two,
The fourth terminal electrode group connection FPCs 38 to 41 are pressure-bonded one by one. In addition, the third terminal electrode group connection FPC3
In Nos. 5 to 37, the head length is exactly the sum of the width of two FPCs and the FPC interval, and the first pressure bonding of the FPC is performed simultaneously on two FPCs 35 and 36. In the second crimping of the next FPC, the step portion 1 is applied to the FPC 36 twice.
2, one FPC 37 is crimped. FIG.
In the above, the blanking portion 2 is formed at the time of the first crimping of the FPC, but the crimping order is taken into consideration so that the crimping of the FPC to the blanking portion 2 becomes the last. The heat curing of the ACF temporarily fixed to the FPC inside is prevented. As shown in FIG. 6, in a normal PDP, the length of the FPC on each side is different, but a head having the same head length is used to improve production efficiency.

In the above-described embodiment of the present invention, the method of thermocompression bonding between a PDP substrate and an FPC has been described. However, the invention can be applied to thermocompression bonding between a panel substrate of a liquid crystal display device and an FPC.

[0048]

As described above, according to the present invention, the FPC
The surface temperature of the blanked portion generated on the PDP substrate by the thermocompression bonding head is controlled to the thermosetting temperature of the ACF by controlling the pressure bonding position of the FPC to the PDP substrate, and the FPC temporarily fixed to this blanked portion
This has the effect of suppressing the progress of thermal curing of the temporarily fixed ACF. As a result, the long-term connection reliability of the FPC press-bonded to the PDP substrate via the ACF can be improved.

The present invention can be applied not only to thermocompression bonding between a PDP substrate and an FPC but also to thermocompression bonding between a panel substrate of a liquid crystal display device and an FPC.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a substrate press-bonding for explaining a process order of a substrate press-bonding method according to a first embodiment of the present invention.

FIG. 2 is a plan view of a main part of a substrate press-bonding for explaining a substrate press-bonding method according to a second embodiment of the present invention.

FIG. 3 is a plan view of a main part of a substrate press-bonding for explaining a substrate press-bonding method according to a third embodiment of the present invention.

FIG. 4 is a plan view of a main portion of a substrate press-bonding for explaining a substrate press-bonding method according to a fourth embodiment of the present invention.

FIG. 5 is a plan view of a main part of a substrate press-bonding for explaining a substrate press-bonding method according to a fifth embodiment of the present invention.

FIG. 6 is an overall plan view of a PDP substrate and an FPC after pressure bonding, showing an application example of a substrate pressure bonding method according to a fifth embodiment of the present invention.

7A and 7B are views for explaining a conventional thermocompression bonding method between a PDP substrate and an FPC, wherein FIG.
(B) is a sectional view taken along line AA 'of (a).

FIG. 8 is a plan view of a main part of a substrate for explaining a conventional thermocompression bonding process between a PDP substrate and an FPC.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head 2 Blanking part 3 PDP board 4-11 FPC 12 Double stepping part 13-23 First terminal electrode group connection FPC 24-34 Second terminal electrode group connection FPC 35-37 Third terminal electrode FPC for group connection 38 to 41 FPC for fourth terminal electrode group connection 100 PDP substrate 101 PDP electrode 102 FPC 103 FPC electrode 104 ACF

Claims (10)

[Claims] 1. A step of temporarily fixing a first substrate having an anisotropic conductive film temporarily fixed on one surface thereof to a second substrate having a size larger than the first substrate via the anisotropic conductive film. Heating and pressing the first substrate and the second substrate from both sides by a thermocompression bonding head to thermocompress the first substrate to the second substrate via the anisotropic conductive film; Repeating the step of connecting a plurality of the first substrate side by side at a predetermined interval to the second substrate,
The surface temperature of the temporarily fixed second substrate of the first substrate via the anisotropic conductive film is lower than the thermosetting temperature of the anisotropic conductive film, and the first substrate is The thermocompression bonding is performed after temporarily fixing the second substrate through the anisotropic conductive film at a temperature lower than the thermosetting temperature of the anisotropic conductive film. Crimping method. 2. The method according to claim 1, wherein the temporary fixing and the thermocompression bonding of one or more sheets of the first substrate are simultaneously performed on the second substrate via the anisotropic conductive film.
A thermocompression bonding method for a substrate as described in the above. 3. The method for thermocompression bonding of a substrate according to claim 1, wherein the number of said thermocompression bonding of said first substrate to said second substrate via said anisotropic conductive film is n (n:
If the width of the first substrate is X and the distance between the first substrates to be thermocompression-bonded is Z, the following expression (1) is obtained.
The thermocompression bonding method for a substrate, wherein the thermocompression bonding head having a lateral width Y given by the above is used. (Equation 1) 4. The method for thermocompression bonding of substrates according to claim 3, wherein the first group of first substrates are simultaneously arranged in the first direction from the predetermined position on the second substrate in one direction. n sheets of the first substrate of the first group are heat-pressed so that the blank portion of the thermocompression bonding head is formed on the surface of the second substrate behind the first group in one direction. A thermocompression bonding method for a substrate, wherein the thermocompression bonding is performed. 5. The method for thermocompression bonding of substrates according to claim 4, wherein after the first group of first substrates is thermocompression-bonded on the second substrate, the next second group of n substrates is thermocompressed. The first substrate is a distance of the sum of nX and (n + 1) Z from the first group or 2
A thermocompression bonding method for a substrate, wherein the thermocompression bonding is performed on the second substrate at a distance equal to the sum of nX and (2n + 1) Z in the one direction at a distance Z. 6. The method of thermocompression bonding of a substrate according to claim 5, wherein the second group between the first group of the first substrates and the first group.
A thermocompression bonding method for a substrate in which n first substrates of the next group are simultaneously thermocompression-bonded on the substrate so as not to generate a blank portion of the thermocompression bonding head. 7. The method for thermocompression bonding of substrates according to claim 3, wherein the first group of first substrates are simultaneously arranged in the first direction from the predetermined position on the second substrate in one direction. n sheets of the first substrate of the first group are heat-pressed so that the blank portion of the thermocompression bonding head is formed on the surface of the second substrate in front of the first group in one direction. A thermocompression bonding method for a substrate, wherein the thermocompression bonding is performed. 8. The method for thermocompression bonding of substrates according to claim 7, wherein the first group of first substrates is thermocompression-bonded on the second substrate, and then the next second group of n substrates is thermocompressed. The first substrate is separated from the first group by the distance of the interval Z or nX and (n +
1) A thermocompression bonding method for a substrate, wherein the thermocompression bonding is performed on the second substrate at a distance equal to the sum of Z in the one direction and at the interval Z. 9. The method according to claim 1, wherein the first substrate is a flexible circuit board, and the second substrate is a panel substrate of a plasma display or a liquid crystal display device. Thermocompression bonding method for substrates. 10. The thermocompression bonding method for a substrate according to claim 1, wherein the anisotropic conductive film is thermosetting.