JP2000348631A - Flat panel display and glass panel for flat panel display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flat panel display capable of reducing cracks in the vicinity of corner parts of panels at the time of thermo-compression bonding without increasing end-part areas (picture frame areas) of the panels, and to provide special components for the same. SOLUTION: In a plasma display panel having a main structure made up by sealingly together bonding two confronting substantially rectangular glass panels, a back panel 1 and a front panel 2, with a seal material 3 in between, cutout parts 9A to 9H are provided in corner parts of the glass panels positioned in the vicinity of thermo-compression bonded parts 10. Because no local thermal expansion exists in the cutout parts 9A to 9H, stresses can be relaxed, and therefore cracks produced in the vicinity of end parts of the glass panels can be reduced when a plurality of connection terminals 4 provided in picture frame areas D of the back panel 1 are thermo-compression bonded to connection terminals of a flexible printed circuit board(FPC) 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display (PDP), and a field emission display (FED).
More specifically, it relates to the structure of the panel end.

[0002]

2. Description of the Related Art Hereinafter, a plasma display (PDP) will be described.
The conventional technique will be described by taking the case of example as an example.

FIGS. 10 and 11 are a top view and a side view of a conventional plasma display, respectively. This conventional plasma display has a main structure in which a back panel 101 and a front panel 102 are sealed via a sealing material 103, and an end region (a frame region or an end region) of the back panel 101. Is provided with a plurality of connection terminals 104.

A plasma display needs to be supplied with display electric signals generated on a display circuit board 106 (FIG. 12) which is a signal supply circuit for generating and supplying electric signals for display. The display circuit board 106 and the connection terminals 104 of the rear panel 101 are electrically connected by a flexible printed circuit board (FPC) (also referred to as a flexible printed circuit board) 105 (FIG. 12).

As one of the electrical bonding methods, for example, thermocompression bonding (hereinafter, referred to as an anisotropic conductive film (ACF)) is used.
(Also referred to as “ACF connection”). Here, the anisotropic conductive film is formed by dispersing conductive particles having a specific particle size in a binder component such as an epoxy resin having excellent insulating properties and adhesiveness, and forming the film into a film shape.

An example of the ACF connection will be described below. FIG. 12 shows a case where a plurality of connection terminals 104 provided in an end region of the back panel 101 and a flexible printed board 105 are connected by thermocompression bonding via an anisotropic conductive film 107. . As shown in FIG. 12A, first, an anisotropic conductive film 107 is attached on the connection terminal 104 provided in the end region of the back panel 1. Next, as shown in FIG.
T is positioned with respect to the flexible printed circuit board 105, and temporarily press-bonded by the heat tool HT. This temporary crimping is to stick the FPC so that it does not shift.
Perform at 80-100 ° C. Thereafter, the final compression is performed at a compression temperature of 200 ° C. (attained temperature) and a compression pressure of 30 kg / cm ² . Then, by the same thermocompression bonding, the flexible printed circuit board 105 and the back panel 101 in the other frame area D are formed.
Connection can be made. Furthermore, the front panel 1
02, the flexible printed circuit board 105 is connected in the same manner.

[0007] By realizing such a connection,
Flexible printed circuit board 105 and connection terminal 104
, The display electric signal generated in the display circuit board 106 is supplied to both panels 101 and 02, and the display on the plasma display is performed.

[0008]

However, the above-mentioned ACF connection has the following problems.

[0009] Since the above-described high-temperature heat tool is pressed against an end region of the glass panel of the conventional plasma display, thermal stress is locally and rapidly generated in the glass panel. In particular, a large stress is generated in the longitudinal direction of the heat tool.

Here, since the thermal expansion occurring along the longitudinal direction of the heat tool HT is local, the ACF connection at a location far from the top of the panel (for example, the center of one side of the back panel 101) is obtained. In this case, the influence of the thermal expansion on the edge of the glass panel is reduced, and the thermal expansion at the edge is almost eliminated, so that the probability of breaking the glass panel is low.

However, when heating near the top of the panel, thermal expansion occurring along the longitudinal direction of the heat tool HT is not suppressed at the glass end face, so that thermal expansion actually occurs at the end. On the other hand, since the plasma display has a main structure in which two glass panels are sealed with a sealing material, the sealing material tries to suppress this thermal expansion. Since a tensile stress is generated at the top of the sealing material where the two meet, panel cracking (see FIG. 13) is likely to occur from this portion.

In order to prevent such panel cracking, it is conceivable to lower the temperature of the heat tool HT. However, in this case, there is a problem that it takes time to cure the anisotropic conductive film.

It is also conceivable to reduce the stress by enlarging the outer shape of the panel and increasing the distance between the crimping position and the sealing material, that is, the width of the frame region. However, there are problems such as an increase in the area of such a portion, an increase in cost, and an increase in weight.

In view of the above problems, the present invention provides a flat panel display capable of reducing cracks near the top of the panel during thermocompression bonding without increasing the end area (frame area) of the panel. The purpose is to provide a specific part for that.

[0015]

In order to achieve the above object, a flat panel display according to claim 1 is provided.
A flat panel display having a main structure in which two substantially rectangular glass panels facing each other are sealed via a sealant, and a predetermined electric signal is supplied from a signal supply circuit via a printed wiring portion. And a first connection terminal provided in an end region of the at least one glass panel, a second connection terminal provided in the printed wiring portion, the first connection terminal and the second connection terminal. And a thermocompression bonding portion for bonding the thermocompression bonding to each other by thermocompression bonding, wherein a notch portion is provided at a top portion located near the thermocompression bonding portion among the top portions of the glass panel having the first connection terminal. .

According to a second aspect of the present invention, there is provided the flat panel display according to the first aspect, wherein the notch is formed when viewed in a direction perpendicular to an edge of the glass panel connected to the notch. The range is at least the distance from the edge of the glass panel to the center of the thermocompression bonding portion.

According to a third aspect of the present invention, in the flat panel display according to the first or second aspect, the notch is formed by linearly notching a top of the glass panel. It is characterized by the following.

According to a fourth aspect of the present invention, in the flat panel display according to any one of the first to third aspects, the first connection terminal and the second connection terminal are formed of an anisotropic conductive film. Thermocompression bonding via

According to a fifth aspect of the present invention, there is provided the flat panel display according to any one of the first to third aspects, wherein the first connection terminal and the second connection terminal are thermally connected via solder. It is characterized by being crimped.

A glass panel for a flat panel display according to a sixth aspect is a glass panel used as a front panel or a rear panel of a flat panel display, wherein at least one top has a cutout. It is characterized by.

A glass panel for a flat panel display according to a seventh aspect is characterized in that, in the glass panel according to the sixth aspect, the cutout portions are formed at four corners of the glass panel.

[0022]

<First Embodiment> A first embodiment of the present invention will be described with reference to FIGS. In the drawings, the same or corresponding members have the same reference characters allotted.

The first embodiment will be described below with reference to FIGS. 1 to 3 are a top view, a side view, and a cross-sectional view of the plasma display according to the first embodiment, respectively, and show a flexible printed circuit (FPC).
nted Circuit) after thermocompression bonding. FIG. 4 is an enlarged view of the portion A1 in FIG. FIG. 5 is a view for explaining an ACF connection process (described later) performed when manufacturing a plasma display.

As shown in FIGS. 1 and 2, in this plasma display, a back panel 1 and a front panel 2, which are two substantially rectangular glass panels facing each other, are formed of a sealing material 3.
It has a main structure that is sealed through the intermediary. The back panel 1 has a frame region D which is a long end region extending over one side of the rectangular shape on two non-adjacent sides, and the frame region D has a plurality of connection terminals 4. Is provided. The connection terminals 4 are electrically connected to a flexible printed circuit board 5 (FPC), which is a printed wiring section, by thermocompression bonding in a thermocompression bonding section 10. Further, the flexible printed circuit board 5 is electrically connected to a circuit board 6 which is a signal supply circuit for display signals. As described above, the circuit board 6 and the back panel 1 are electrically connected via the flexible printed board 5, and the display electric signal generated on the circuit board 6 is supplied to the flexible printed board 5 and the connection terminal 4. The power is supplied to the rear panel 1 via the above-mentioned device, and the display on the plasma display is performed.

Here, as a specific joining method for realizing electrical connection between the back panel 1 and the flexible printed circuit board 5, an anisotropic conductive film (ACF) is used.
The case of using thermocompression bonding (hereinafter, also referred to as “ACF connection”) via a “ve film” will be described. As shown in the cross-sectional view of FIG. 3, a plurality of connection terminals 8 are also provided on the flexible printed circuit board 5, and these plurality of connection terminals 8 and the plurality of connection terminals 4 on the rear panel 1 side are anisotropic. Thermocompression bonding is performed at the thermocompression bonding section 10 (FIG. 1) via the conductive film 7.

The anisotropic conductive film 7 is obtained by dispersing conductive particles 7a, which are particles having a specific particle size having conductivity, in a binder 7b having a component such as an epoxy resin having excellent insulating and adhesive properties. A variety of products have been developed which are formed into a film shape and in which the composition and thickness of the binder 7b and the material, particle size and shape of the conductive particles 7a are optimized according to the application. In a state where the anisotropic conductive film 7 is thermocompression-bonded, between the overlapping connection terminal 8 and the connection terminal 4,
Electrical interconnection is obtained by the conductive particles 7a sandwiched and crushed, while insulating properties are provided between adjacent electrodes by the binder 7b, which is a main component of the anisotropic conductive film 7.
At the same time, the binder 7b imparts mechanical strength to the joint. Thus, when realizing the electrical connection,
It is used for fine-pitch terminal connection that is impossible with solder connection.

Next, the ACF connection will be further described with reference to FIG. As shown in FIG. 5A, first, the anisotropic conductive film 7 is attached on the plurality of connection terminals 4 provided in the frame region D of the back panel 1. Next, as shown in FIG. 5B, the heat tool HT is positioned with respect to the flexible printed circuit board 5, and the heat tool HT is pressed against the flexible printed circuit board 5 so as to be temporarily compressed. This temporary press-bonding is performed to adhere the flexible printed circuit board 5 to such an extent that the position does not shift, and is lower in temperature than the next main press-bonding (for example, 80 to 100).
C) at low pressure. Thereafter, the same crimping operation is performed under a condition of a higher temperature and a higher pressure than the time of the temporary crimping, so that the final crimping is performed. The crimping conditions for this final crimping are, for example,
Crimping temperature 200 ° C (achieved temperature), Crimping pressure 30kg / c
m ² . Here, the “achieved temperature” means the temperature actually reached by the panel surface, and in order to obtain the predetermined reached temperature, the heat tool temperature is set to be higher than the predetermined reached temperature to perform thermocompression bonding. Is performed. For example, in order to obtain the ultimate temperature of 200 ° C., the heat tool temperature is set at 270 ° C. and thermocompression bonding is performed for 20 seconds.

Referring again to FIG. 1, the back panel 1
Has notches 9A to 9D (referred to collectively as notches “9”) at the four apexes located at both ends of one side thereof.
The top of the back panel 1 is linearly notched so as to have an inclination of about 45 degrees with respect to the edge of the back panel 1. Further, as shown in a partially enlarged view of FIG. 4, the notch 9A of the rear panel 1 has a notch having a width c, and the heat tool HT is located at a distance d from an end of the rear panel 1.
Thermocompression bonding is performed only at a distance. For example, the notch width c = 5 mm and the distance d = 10 mm. The width e of the thermocompression bonding portion 10 formed by the heat tool HT is 4 mm.
The distance b between the joint between the panels 1 and 2 by the sealing material 3 and the heat tool HT (or the thermocompression bonding part 10) is 10 mm.

Further, when viewed in a direction (vertical direction in the figure) perpendicular to the edge of the back panel 1 connected to the notch 9A, the formation range of this notch 9A (c / root)
(2)) is preferably not less than the distance f (= w−b) from the edge of the back panel 1 to the center of the thermocompression bonding section 10.
Here, root (2) represents the square root of 2. In other words, the notch 9A is preferably formed such that the center line CL of the thermocompression bonding portion 10 parallel to the edge of the back panel 1 intersects with the notch 9A.

As described below, the provision of the notch 9 makes it possible to suppress the occurrence of "cracks" during thermocompression bonding. This is because by providing the notch 9 at the top of the back panel 1, even when performing thermocompression bonding in the vicinity of each top, there is no thermal expansion in the cut-off portion when forming the notch 9. Therefore, it is considered that this is based on the fact that the tensile stress at the end of the back panel 1 is reduced.

[0031]

[Table 1]

In order to confirm the effect of preventing cracks in the plasma display according to the first embodiment, thermocompression tests were actually performed at various heat tool temperatures. Table 1 shows the results. In order to confirm the effect of the presence or absence of the notch 9 at the top of the glass panel, measurement was performed by changing the temperature for each of the case where the notch width c of the notch 9 was 5 mm and the case where the notch width c was 1 mm. I have. As for the position of the heat tool HT, the distance d (see FIG. 4) from the end of the glass panel to the heat tool HT is 10 mm.

A small notch width of notch width c = 1 mm is provided for comparison.
In order to facilitate the handling of the glass panel, the top portion is cut out only slightly, but the notch width c = 1 mm corresponds to such a notch. That is, here, when the notch width c = 1 mm,
As a case where there is no cutout portion, this is a comparison target with a case where a useful cutout width (for example, 5 mm) is provided.

As shown in Table 1, no crack occurred at the top of any panel when the heat tool temperature was T = 230 ° C., but when T = 250 ° C. and 270 ° C., the crack was clearly prevented. The effect was seen. For example, T = 25
At 0 ° C., when the notch width c = 1 mm, the crack occurrence rate is 3.8%, whereas when the notch width c = 5 mm, the crack occurrence rate decreases to 0.0%. ing. Further, at T = 270 ° C., the crack occurrence rate is 15.6% when the notch width c = 1 mm, whereas the crack occurrence rate is 0.0 when the notch width c = 5 mm. %.

As described above, in order to obtain the ultimate temperature of 200 ° C., the thermocompression bonding operation may be performed by performing thermocompression bonding at a temperature of 270 ° C. for 20 seconds. In the case of performing thermocompression bonding, the effect of suppressing the crack generation rate as shown in Table 1 can be obtained.

[0036]

[Table 2]

Table 2 shows the positional dependence of the heat tool HT and the notch 9. The heat tool HT is arranged at the positions of the distance d = 10 mm and the distance d = 0 mm. The experimental result when performing thermocompression bonding is shown. Note that the heat tool temperature T is set to 230 ° C. When d = 0 mm, the heat tool HT is disposed at a position that also covers the notch 9.

As shown in Table 2, the notch width c = 1 mm
In the case of, the crack occurrence rate was 0.0% when d = 10 mm, and becomes 93.8% when d = 0 mm. That is, the smaller the distance d, the higher the rate of cracking during thermocompression bonding, indicating that the position of the heat tool HT has a greater effect. Therefore, when performing thermocompression bonding in the vicinity of the top of the glass panel, the effect of reducing the crack generation rate by providing the notch 9 can be particularly obtained. In other words, it can be seen that the above effect can be efficiently obtained by providing the notch 9 at the top of the glass panel located near the thermocompression bonding section 10.

In the above description, the thermocompression bonding operation in the thermocompression bonding portion 10 near the notch 9A is shown, but the same thermocompression bonding operation is performed in the thermocompression bonding portion 10 near the other notches 9B to 9D. Thereby, a similar effect can be obtained.

The flexible printed circuit board 105 is connected to the front panel 2 in the same manner. Also,
Notches 9 at the four tops of front panel 2
(9E to 9H) are provided, and these notches 9E to 9H make it possible to suppress the occurrence of “cracks” during thermocompression bonding.

As described above, since the notch 9 in which a part of the top is cut off in advance is provided at the top located in the vicinity of the thermocompression bonding portion 10, the influence of local thermal stress during thermocompression is suppressed. be able to. Therefore, the crack generation rate near the top of the glass panel can be reduced without increasing the width w (see FIG. 4) of the end region (frame region) of the glass panel.

When viewed in a direction perpendicular to the edge of the glass panel (rear panel 1) connected to the notch 9 (see FIG. 4), the range of formation of the notch 9 is from the edge of the glass panel by thermocompression. Since the distance to the center of the portion 10 is longer than the distance f, it is possible to particularly efficiently capture and buffer heat transmitted in a direction parallel to the edge of the glass panel of the thermocompression bonding portion.

Further, since the notch 9 is formed by linearly notching the top of the glass panel, it can be easily processed.

Here, as a glass panel used for the flat panel display (plasma display panel), a glass panel for a flat panel display having cutouts formed at four corners of the glass panel is prepared in advance. It can be used for assembling the flat panel display according to the first embodiment. In the first embodiment, notches are provided at all four corners of the glass panel. However, the present invention is not limited to this, and a notch is provided at the top where thermocompression bonding is not performed in the vicinity. It is not necessary. And even in such a case, the notch is formed by the 4
If the glass panels provided in all the corners are prepared in advance, it is possible to suppress the occurrence of cracks as described above even when performing thermocompression bonding near any of the tops. That is, the glass panel having the cutouts at the four corners can be used for general purposes regardless of which end region of the glass panel the printed wiring portion is thermocompression-bonded.

<Embodiment 2> Next, Embodiment 2 will be described with reference to FIG.
This will be described with reference to FIG. In each drawing, the same or corresponding members as those described in the first embodiment are denoted by the same reference numerals.

The plasma display according to the first embodiment
It has the same configuration as However, in the first embodiment, thermocompression bonding is performed using the anisotropic conductive film 7, but in the second embodiment, “solder” is performed without using the anisotropic conductive film 7.
In that they are thermocompression bonded using

As shown in the sectional view of FIG. 6, the plurality of connection terminals 8 provided on the flexible printed circuit board 5 are plated with solder 11 in advance, and the connection terminals 8 and the plurality of connection terminals 8 provided on the back panel 1 are provided. Is soldered by thermocompression bonding. Further, the thermocompression bonding is different from the first embodiment in that the heat tool temperature is set at 290 ° C. The melting point of the solder used is 21
6 ° C, such a heat tool temperature (290 ° C)
By performing thermocompression bonding, the panel surface temperature can reach the melting point or higher.

[0048]

[Table 3]

Table 3 shows the experimental results at this time. As shown in Table 3, also in this case, when a notch having a width of 5 mm was provided, the crack occurrence rate was reduced to 9.1%, but was not zero. Therefore, when the notch width was set to 10 mm, the number of evaluations was improved to "no crack" with respect to 30. That is, it is understood that the larger the notch width, the greater the effect of preventing cracking.

As described above, even in the case of performing the solder connection, the same effect as in the first embodiment can be obtained by providing the notch 9 in which a part of the top of the glass panel is cut in advance. it can.

<Embodiment 3> Embodiment 3 of the present invention
Will be described with reference to FIG. 7 and FIG. In the drawings, the same or corresponding members have the same reference characters allotted.

In the first and second embodiments, the case where the present invention is applied to a plasma display (PDP) has been described. In the third embodiment, a case where the present invention is applied to a liquid crystal display (LCD) will be described. I do. In the third embodiment, a case is shown in which a tape carrier package (TCP: Tape Carrier Package) is thermocompression-bonded to a glass panel instead of a flexible printed circuit board (FPC). In this case, it is needless to say that the FPC may be used as in the first and second embodiments.

FIGS. 7 and 8 are a top view and a side view of the liquid crystal display according to the third embodiment, respectively.
This shows an aspect after the thermocompression bonding of the CP.

As shown in FIGS. 7 and 8, in this liquid crystal display, a rear panel 21 and a front panel 22, which are two substantially rectangular glass panels facing each other, are made of a sealing material 2.
3 has a main structure which is sealed. The rear panel 21 has a frame region D on two adjacent sides, and a plurality of connection terminals 24 are provided in the frame region D. The connection terminals 24 are electrically connected to a tape carrier package (TCP) 25 by being bonded by thermocompression at a thermocompression unit 30.

According to the tape carrier package 25, a driving IC disposed on a flexible tape is used.
(Not shown) can be electrically connected to the glass panel. In addition, this tape carrier package 2
Reference numeral 5 is further electrically connected to a circuit board 26 which is a power supply / signal supply circuit. As described above, the circuit board 26 and the back panel 21 are electrically connected via the tape carrier package 25, and the display electric signal from the circuit board 26 and the tape carrier package 25 is transmitted to the connection terminal 24 or the like. Is supplied to the rear panel 21 via the LCD and is displayed on a liquid crystal display.

The rear panel 21 has cutouts 29A to 29C (collectively referred to as cutouts "29") at three tops in the frame area D, respectively.

The provision of the cutout portions 29 makes it possible to suppress the occurrence of "cracks" during thermocompression bonding as in the above embodiments.

In this case, the notch 29 is not provided on the other top of the rear panel 21 and on each of the tops of the front panel 22. This is because thermocompression bonding is not performed in the vicinity of each apex, and no crack is generated at the glass panel end in the vicinity thereof, so that there is no need to provide a notch. Of course, it goes without saying that the notch may be formed at the top of the glass panel other than the vicinity of the thermocompression bonding section.

<Other Modifications> In each of the above embodiments, the shape of the cutout 9 (29) has a shape in which the top is cut off with one straight line, but is not limited to this. Not done. For example, the top may be cut off by two or more straight lines (that is, broken lines), or the top of back panel 1 may be cut out in an arc shape as shown in a partially enlarged view of FIG. With this, the same effect can be obtained.

In each of the above embodiments, the flexible printed circuit board 5 (FPC)
And a tape carrier package (TCP) are illustrated, but the present invention is not limited to this. Any connection may be used as long as the connection terminal on the glass panel is connected to another circuit provided separately from the glass panel by thermocompression bonding. .

Further, in each of the above embodiments, the plasma display (PDP) and the liquid crystal display (L
Although the case of CD) has been described, it is a flat panel display (FPD) having a main structure in which two glass panels are sealed via a sealing material, and a display circuit board and the like are mounted on the FPD glass panel. It goes without saying that the same effect can be expected by applying the present invention to other FPDs in which local heating is performed on the connection terminals in the connection step.

The above embodiments can be appropriately combined as long as they do not contradict each other.

[0063]

As described above, according to the flat panel display of the first aspect, the notch is formed in the top of the glass panel having the first connection terminal, which is located near the thermocompression bonding section. Is provided, the effect of local thermal stress during thermocompression bonding can be suppressed, and cracks near the top of the panel can be reduced without increasing the end region of the panel.

According to the flat panel display of the present invention, when viewed in a direction perpendicular to the edge of the glass panel connected to the notch, the formation range of the notch is from the edge of the glass panel to the thermocompression bonding portion. , The heat transmitted in a direction parallel to the edge of the glass panel of the thermocompression bonding portion can be particularly efficiently captured and buffered.

According to the flat panel display of the third aspect, since the notch is formed by linearly notching the top of the glass panel, the notch can be easily processed. is there.

According to the flat panel display of the fourth aspect, when thermocompression bonding is performed via the anisotropic conductive film,
Cracks at the top of the panel can be reduced.

According to the flat panel display of the fifth aspect, cracks at the top of the panel can be reduced during thermocompression bonding via solder.

According to the glass panel for a flat panel display according to the sixth aspect, the notch is formed in at least one top, so that this glass panel is used as a front panel or a rear panel. The present invention can be used for assembling a flat panel display having the effects of the first invention.

According to the glass panel for a flat panel display according to the seventh aspect, since the cutouts are formed at the four corners of the glass panel, the printed wiring portion is thermocompression-bonded to any end region of the glass panel. Can be used universally regardless of whether

[Brief description of the drawings]

FIG. 1 is a top view of a plasma display according to a first embodiment of the present invention.

FIG. 2 is a side view of the plasma display according to the first embodiment.

FIG. 3 is a cross-sectional view of a plasma display at a thermocompression bonding section.

FIG. 4 is a partially enlarged view of the plasma display according to the first embodiment.

FIG. 5 is a diagram illustrating an ACF connection process.

FIG. 6 is a sectional view of a plasma display according to a second embodiment.

FIG. 7 is a top view of the liquid crystal display according to the third embodiment.

FIG. 8 is a side view of the liquid crystal display according to the third embodiment.

FIG. 9 is a diagram showing a modification of the present invention.

FIG. 10 is a top view of a conventional plasma display.

FIG. 11 is a side view of a conventional plasma display.

FIG. 12 is a diagram illustrating a conventional ACF connection process.

FIG. 13 is a view showing cracks generated in a conventional plasma display.

[Explanation of symbols]

1,21 back panel, 2,22 front panel, 3,2
3 sealing material, 4, 8, 24 connection terminals, 5 flexible printed circuit board (FPC), 6, 26 circuit board,
7,27 anisotropic conductive film (ACF), 9,9A-9H,
29, 29A-29C Notch, 10, 30 Thermocompression bonding, 11 Solder, 25 Tape carrier package (TCP), D Frame area, HT heat tool, 10
1 back panel, 102 front panel, 103 sealing material, 104 connection terminal, 105 flexible printed board, 106 display circuit board, 107 anisotropic conductive film.

Continued on the front page (72) Eiji Kobayashi, 2-3-2 Marunouchi, Chiyoda-ku, Tokyo, Japan Mitsui Electric Co., Ltd. (72) Inventor Takao Kawauchiyama 2-3-2, Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Co., Ltd. In-house F-term (reference) 5C040 GA02 GA03 GK14 GK19 MA10 5C094 AA15 AA36 AA42 AA43 AA48 BA31 BA32 BA34 BA43 CA19 DA12 DB02 EA10 EB02 FA01 GB01 5G435 AA09 AA12 AA17 AA18 BB06 BB12 CC09 EE12 EE32 KK

Claims (7)

[Claims] 1. A main structure in which two opposing substantially rectangular glass panels are sealed via a sealing material, and a predetermined electric signal is supplied from a signal supply circuit via a printed wiring section. A first connection terminal provided in an end region of the at least one glass panel, a second connection terminal provided in the printed wiring portion, the first connection terminal, and the first connection terminal. And a thermocompression bonding portion for bonding the second connection terminal to the second connection terminal by thermocompression bonding.
A flat panel display, wherein a cutout portion is provided at a top located near the thermocompression bonding portion. 2. The flat panel display according to claim 1, wherein when viewed in a direction perpendicular to an edge of the glass panel connected to the notch, a formation range of the notch is from the edge of the glass panel. A flat panel display, wherein the distance is equal to or longer than the distance to the center of the thermocompression bonding section. 3. The flat panel display according to claim 1, wherein the notch is formed by linearly notching a top of a glass panel. 4. The flat panel display according to claim 1, wherein the first connection terminal and the second connection terminal are thermocompression-bonded via an anisotropic conductive film. A flat panel display characterized by the following. 5. The flat panel display according to claim 1, wherein the first connection terminal and the second connection terminal are thermocompression-bonded via solder. Flat panel display. 6. A glass panel for use as a front panel or a rear panel of a flat panel display, wherein at least one top has a cutout formed therein. 7. The glass panel according to claim 6, wherein the cutouts are formed at four corners of the glass panel.