201243444 六、發明說明： 【發明所屬^^技術領域】 發明領域 本發明係有關於連接方法及連接夾具，更詳而言之， 係有關於將液晶面板與用以連接信號處理基板之 FPC(Flexible Printed Circuits)連接之連接方法及連接夾具。 L· 發明背景 習知，液晶顯示裝置由液晶面板、用以將用以使此液 晶面板運作之信號施加於液晶面板的信號處理基板構成。 組入此液晶面板之本體裝置有如行動電話般，尺寸有限制 而無法大型化者。 此時，信號處理基板一般係其外形形成與液晶面板幾 乎同尺寸或小於液晶面板’而配置於液晶面板之裡面。又， 連接於液晶面板之施加信號用柔性電纜連接於對應於1片 液晶面板，使信號產生之信號處理基板之連接器。 此時，連接於施加信號用柔性電纜（以下，稱為面板側 F P C)之連接器之端部側以環繞液晶面板之端部之狀態折返 至液晶面板之背面，與信號處理基板及其連接器一同配置 於液晶面板之背面。 而液晶面板若為單色液晶面板，便不致產生任何問 >4…i而近年來，行動電話之液晶面板亦為彩色顯示， 而形成為顯現紅、綠、藍3色之3層液晶面板而多層化。 連接於對應於3層液晶面板各面板，使信號產生之驅 201243444 動電路基板之連接H的3片面板修Pc按形成層之片數量， 增加連接數，對應於此，有必須將信號處理基板在液晶面 板之背面所佔之盤面區域擴大之問題。 又，為解決此問題，提出各種將連接於連接在各液晶 面板之面板側FPC之連接器側FpcM共通化，變更施加於 各液晶面板之信號來因應’以抑制產生信號之信號處理基 板之連接部份的區域增加之方法。 舉例言之’已知有-種顯示Fpc基板之配置形態之技 術，該FPC基板之配置形態係—方面藉由配線圖形，直接連 ^於控制基板側端子’另—方面，f曲成環繞控制基板之 端部，藉由通孔’連接於形成在配置於控制基板裡面之液 晶面板之邊端部之裡側的複數面板側端子（例如參照專利 文獻1)。 又已知有-種k號處理基板及液晶顯示裝置其係 在乍忙/薄型構造之液晶面板，可變式電阻器之封襄位置 不又限制’不致導致機械強度降低，而於絲時，不使可 隻式電阻器之破損產生(例如參照專利文獻幻。 查看此專利文獻2之第3圖及段落[〇〇35]之記載，顯示有 下述結構，前述結構係連接Tcp(Transmissi〇n c〇ntr〇i201243444 VI. Description of the Invention: [Technical Field] The present invention relates to a connection method and a connection jig, and more particularly to a liquid crystal panel and an FPC for connecting a signal processing substrate (Flexible) Printed Circuits) Connection methods and connection fixtures. BACKGROUND OF THE INVENTION Conventionally, a liquid crystal display device is composed of a liquid crystal panel and a signal processing substrate for applying a signal for operating the liquid crystal panel to a liquid crystal panel. The main unit incorporated in the liquid crystal panel is like a mobile phone, and has a limited size and cannot be enlarged. At this time, the signal processing substrate is generally disposed inside the liquid crystal panel such that its outer shape is formed to be approximately the same size as or smaller than that of the liquid crystal panel. Further, a signal for applying a signal to the liquid crystal panel is connected to a connector of a signal processing substrate corresponding to one liquid crystal panel to generate a signal. At this time, the end side of the connector connected to the flexible cable for applying signal (hereinafter referred to as panel side FPC) is folded back to the back surface of the liquid crystal panel in a state of surrounding the end of the liquid crystal panel, and the signal processing substrate and its connector The same is disposed on the back of the liquid crystal panel. If the liquid crystal panel is a monochrome liquid crystal panel, it will not cause any problem >4...i. In recent years, the liquid crystal panel of the mobile phone is also displayed in color, and is formed into a three-layer liquid crystal panel which displays three colors of red, green and blue. And multi-layered. Connected to each panel corresponding to the three-layer liquid crystal panel, the three-panel repair Pc of the connection H of the 201243444 dynamic circuit substrate of the signal generation is increased by the number of layers formed, and the number of connections is increased. Accordingly, it is necessary to process the signal processing substrate. The problem that the disk surface area occupied by the back surface of the liquid crystal panel is enlarged. In order to solve this problem, various types of connectors FpcM connected to the panel side FPC of each liquid crystal panel are connected, and signals applied to the respective liquid crystal panels are changed to respond to the signal processing of the substrate by suppressing generation of signals. Part of the area to increase the method. For example, 'there is a technique for displaying the configuration of the FPC substrate, and the configuration of the FPC substrate is directly connected to the terminal of the control substrate side by the wiring pattern, and the f is controlled into a surround control. The end portion of the substrate is connected to a plurality of panel-side terminals formed on the back side of the edge portion of the liquid crystal panel disposed on the inside of the control substrate by a through hole (see, for example, Patent Document 1). It is also known that the k-type processing substrate and the liquid crystal display device are in a liquid crystal panel of a busy/thin structure, and the sealing position of the variable resistor is not limited to 'not cause a decrease in mechanical strength, but when it is in the wire, The damage of the singular resistor is not caused (for example, refer to the patent document illusion. See the description of Fig. 3 and the paragraph [〇〇35] of Patent Document 2, and the following structure is shown, and the above structure is connected to Tcp (Transmissi〇) Nc〇ntr〇i
Protocol)規格之通信處理基板與液晶面板之tft(薄膜電晶 體驅動）基板之柔性連接⑽f曲成沿著f光模組之外周 環繞而配置。 顯示於上述專利文獻1或專利文獻2之技術關於多層化 之液晶面板並未提及。然而，於專利文獻3提出有在液晶顯 201243444 示裝置中’關於多層化之撓性基板之FPC之連接關係與配線 的技術。 查看此專利文獻3之第26圖及段落[0110]之記載，顯示 有下述結構，前述結構係在一端連接於液晶顯示元件之基 板之端部’另一端折返至該基板之下面或上面之信號輸入 用撓性基板中，將突出部分之聚醯亞胺薄膜之端部沿著彎 折線方向成形成波狀或鋸齒狀等。 第7A圖、第7B圖係以易了解之方式簡略地顯示上述專 利文獻3之技術結構的圖。第7A圖係顯示3層液晶面板丨、從 此液晶面板1之上方分別連接於第1層、第2層及第3層之3片 面板側FPC2(2a、2b、2c)。 第7A圖更顯示從信號處理基板3之連接器4伸出之共通 化FPC5、預先假接著於對應於位於3片面板側Fpc2之連接 端部之共通化連接部6的位置，且含有導電粒子之熱硬化接 著劑7。以含有導電粒子之熱硬化接著劑7相互接著之面板 側FPC2及共通化FPC5之接著部份雖未特別圖示，但形成有 導體圖形。 第7B圖係顯示下述狀態之圖，前述狀態係以省略圖示 之壓著裝置將面板側FPC2與共通化FPC5之接著部在第7A 圖之狀態下壓著，3片面板側FPC2f曲成箭動所示，信號 處理基板3與錢化FPC5配置於液晶面板丨之裡面者，當將 面板側FPC2在直線狀態下連接冑，内側之面板側Fp(：2形成 為在以FPC2形成之圓弧内側皺紋聚集之狀態，應力集中於 各FPC之連接部份。^ 201243444 而在專利文獻3(曰本專利公開公報2〇〇〇_472〇9號）之技 術中，將折返至基板之下面或上面之信號輸人用撓性基板 之突出部份的端mt折線方向絲祕有波狀或鑛齒 狀山部及谷部之形狀，可使彎折部之應力集中分散，在脊 折部形成良好之彎曲，而可抑制斷線之發生，而提高可靠 度。 先行技術文獻 專利文獻 專利文獻1 :曰本專利公開公報2〇〇6_2〇1216號 專利文獻2 :日本專利公開公報2〇〇1 1854〇4號 專利文獻3 :曰本專利公開公報2〇〇〇_472〇9號 C發明内容;3 發明概要 發明欲解決之課題 然而’為使彎折部之應力集中分散，而成形成於彎曲 部份之FPC沿著彎折線方向具有波狀或鋸齒狀之山部及谷 部之形狀需要將FPC彎折成山部與谷部複數次之空間，而有 彎曲部之R增大’ FPC大型化的問題。 又’即使可藉成形成鋸齒狀，使彎曲部對FPC之應力集 中分散，但全體來看，在複數層撓性基板之彎曲部份殘留 有於外側及内側之FPC有對曲率半徑之内外差之應力。 全體觀看時之曲率半徑之内外差、亦即視為彎曲直線 時之弧長差於以彎曲部之FPC之箭號bl、b2、b3、b4、b5、 b6顯示之接著部引發畸變。此畸變大概有沒時間經過引發 6 201243444 接著部份之剝離之虞。 本發明係解決上述習知課題者，其目的係提供於與妓 通化FPC連接後’彎曲重疊複數片之面板側Fpc時，於連接 之際，在彎曲之内外進行考慮了弧長差之連接，以解決因 弧長差引起之畸變，並且，將f曲部之職量縮小，以抑制 面板側FPC之大型化之連接方法及連接裝置。 用以欲解決課題之手段 為解決上述課題，本發明之連接方法構造成在由以共 通化FPC連接之至少第丨層及第2層構成之複數片液晶面板 側FPC中，將作為於連接後彎曲之f曲部份之外側的前述第 2層液晶面板側FPC之連接部與作㈣曲部份之内側之前述 第1層液晶面板側F P C之連接部形成為分別相對地短於預先 設於前述共通化FPC之連接部與連接部之_，且將前述共 通化FPC與前述液晶面板側Fpc連接。 在此連接方法中，構造成於將前述共通化Fpc與前述液 晶面板側FPC連接之際，將前述第2層液晶面板側Fpc在普 通狀態下連接，然後，使前述第2層液晶面板側Fpc挽曲， 以該撓曲，將前述共通化FPC往前述第2層液晶面板Fpc直 線縮短之方向拉近，接著，將前述第〗層液晶面板側Fpc之 連接部對位於前述共通化FPC之連接部，將該對位之位置暫 時固定，之後，將前述第丨層液晶面板側Fpc之前述連接部 連接於前述共通化FPC之前述連接部。 在此連接方法中，構造成於將前述共通化FPC與前述複 數片液晶面板側FPC連接之際，令前述複數片為3片時，將 201243444 月’J述第3層液晶面板側Fpc在普通狀態下連接，然後，使前 '曰液aa面板側FpC撓曲，以該撓曲，將前述共通化Fpc 往別述第3層液晶面板側FpC直線縮短之方向拉近，接著， 將月j述第2層液晶面板側Fpc之連接部對位於前述共通化 FPC之連接部，將該對位之位置暫時固定，之後，將前述第 2層液晶面板側FPC之前述連接部連接於前述共通化FPC之 前述連接部，接著，使前述第3層液晶面板側FPC進一步撓 曲同時，使前述第2層液晶面板側FPC撓曲，以該撓曲將 月J述/、通化FPC往前述第3層及前述第2層液晶面板側Fpc 直線縮短之方向拉近，然後，將前述第1層液晶面板側FPC 之連接部對位於前述共通化FPC之連接部，將該對位之位置 暫時固定，之後，將前述第丨層液晶面板側Fpc之前述連接 部連接於前述共通化FPC之前述連接部。 又，為解決上述課題，本發明之連接夾具構造成於在 由連接於共通化FPC之至少第1層及第2層構成之複數片液 晶面板側FPC中，將前述2片液晶面板側FPC連接於前述共 通化FPC之際使用者，前述2片液晶面板側FPC係作為於與 前述共通化FPC連接後彎曲之彎曲部份之外側的前述第2層 液晶面板側FPC之連接部與作為比其靠彎曲部份之内側之 前述第1層液晶面板側FPC之連接部形成為相對地短於預先 設於前述共通化FPC之連接部與連接部之間隔，又，該連接 夾具具有液晶面板載置面，該液晶面板載置面具有預定傾 斜角度，，將前述2片液晶面板裝設於該液晶面板載置面之 際’上ώ側液晶面板側FPC之連接部係在與連接於下面側液 201243444 晶面板之共通化FPC之與前述上面側液晶面板之連接呷一 致的位置。 ° 一 在此連接夾具中，構造成於令連接於前述共通化FPC 之前述複數片液晶面板側FPC之片數為3片時，將前述3片 晶面板側FPC連接於前述共通化FPC之際使用者，此、 液晶面板侧FPC係作為於與前述共通化Fpc連接後總 彎曲部份之外側的前述第3層或前述第2層液晶面板 之連接部與作為比其靠彎曲部份之内側之前述第2層或前 述第1層液晶面板側F P C之連接部形成為相對地短於預1嗖 於前述共通化FPC之連接部與連接部之間隔，又，該連接$ 具具有液晶面板載置面，該液晶面板載置面具有預定傾斜 角度，將前述3片液晶面板裝設於該液晶面板載置面之際:， 上面側液晶面板側FPC之連接部係在與連接於下面側圹曰 面板之共通化FPC之與前述上面側液晶面板之連接部—致 的位置。 構造成為上述任一情形時，上述連接夹具皆可調整上 述傾斜面之角度。 發明效果 本發明之連接方法及連接夾具由於將面板側Fpc連接 於共通化FPC後彎曲之際，面板側FPC以按弧長差之長度連 接’故於彎曲部之接著部產生之應力無内外差，而可^揮 獲得具有隨時間經過穩定之接著部之彎曲構造的效果。X 圖式簡單說明 第1A圖係齡在第丨實關之連接方法，用於為液晶面， 201243444 板之彳§號輸入線之面板側FPC與為控制基板之信號輸出線 之共通FPC的接著之連接裝置之圖。 第1B圖係顯示面板側FPC與共通FPC之接著位置之狀 態的圖。 第1C圖係連接頭降下至接著位置，以熱壓著連接面板 側FPC與共通FPC之接著部之圖。 第2A圖係顯示透明樹脂面板（面板）與為此面板所伸出 之信號輸入線之面板側FPC的圖。 第2B圖係顯示面板側FPC與共通Fpc連接前之相互之 位置關係與於連接後’將面板側FPC彎曲至面板裡面側而連 接於控制基板之狀態的圖。 第2C圖係以用以將從3片重疊之面板分別伸出之3片面 板側F P C之f曲部份放大而算出長度的示意圖顯示之圖。 第2D圖係顯示從依據第2(：圖所算出之關係式導出，共 通化FPC之各含有導電粒子之熱硬化接著劑與分別對應於 該等之面板側FPC之前端的偏離量之圖。 第3A圖係顯示下述狀態之圖，前述狀態係將第3層面板 側FPC在普通㈣下以連接裝置之連接頭，壓著於共通化 FPC之含有導電粒子之熱硬化接著狀接著部錢接者。 第3B圖係顯示使第3層自板側聊撓曲，以該挽曲將共 通化FPC拉近至面板側之狀態的圖。 第3 C圖係顯示將已假熔融之面板側F p c與共通化f p c 之連接部以連接頭壓著而使該等連接之狀態的圖。 第3D圖係顯示下述狀態之圖，前述狀態係使第3層面板 10 201243444 側FPC進一步撓曲，同時，使第2層面板側FPC撓曲，而拉 近共通化FPC，使用烙鐵，加熱連接部，而使含有導電粒子 之熱硬化接著劑熔融，而使面板側FPC與共通化FPC假炼融 者0 第3E圖係下述狀態（第3D圖）之立體圖，前述狀態係使 第3層面板側FPC進一步撓曲，同時，使第2層面板側FPC撓 曲’而拉近共通化FPC，使用烙鐵，加熱連接部，而使含有 導電粒子之熱硬化接著劑熔融，而使面板側Fpc與共通化 FPC假熔融者。 第3F圖係顯示將已假溶融之面板側Fpc與共通化Fpc 之連接部以壓著頭壓著而使該等連接之狀態的圖。 第3G圖係顯示下述狀態之圖，前述狀態係如實線所 不，將3片面板側fpc如描繪圓弧般彎曲至3片面板之下面 (裡面），以從面板側FpC與共通化FPC之連接完畢之以虛線 顯示的狀態，將共通化FPC連接於配置於3片面板之裡面的 控制基板之連接器。 第4A圖係顯示將第3層面板側FPC在普通狀態下藉連 接頭以壓著往共通化FPC之接著部連接之狀態的圖。 第4B圖係顯不第戌接夾具及於其面板載置面載置有2 片重疊之面板之狀態的圖。 第4C圖係顯示下述狀態之圖，前述狀態係將定位成重 逢於共通化FPC之接著部之第2層面板侧Fpc的接著部使用 载加熱而使含有導電粒子之熱硬化接著劑炫融而使 面板側FPC與共通化FPC‘熔融者。 201243444 第4D圖係顯示下述狀態（第4C圖）之立體圖，前述狀態 係將定位成重疊於共通化FPC之接著部之第2層面板側FPC 的接著部使用烙鐵加熱，而使含有導電粒子之熱硬化接著 劑溶融’而使面板側FPC與共通化FPC假炼融者。 第4E圖係顯示將已假熔融之面板側FPC之接著部與共 通化F P C之連接部以連接頭壓著而使該等連接之狀態的圖。 第4F圖係顯示下述狀態，前述狀態係從第i連接夾具取 出2片重疊之第3層面板側FPC及第2層面板側FPC與共通化 FPC之連接結束而形成的中間部份者。 第5A圖係說明與第2層用及第3層用不同之理由之圖。 第5B圖係顯示下述狀態之圖，前述狀態係使用烙鐵， 而使載置於第2連接夾具之3片重疊之面板之第丨層面板側 FPCa的接著部假熔融於共通化Fpc之接著部者。 第5C圖係顯示第5B圖之假熔融之作業狀態的立體圖。 第5D圖係顯示將已假熔融之面板側Fpc之接著部與共 通化FPC之連接部以連接頭壓著而使該等連接之狀態的圖。 第5E圖係顯示下述狀態之圖，前述狀態係從第2連接失 具取出3片重疊之第3、第2、第1層面板側Fpc與共通化Fpc 之連接結束，由面板側FPC與共通化Fpc構成的完成部份 者。 第5F圖係顯示下述狀態之圖，前述狀態係如實線所 不，將3片面板側FpC如描繪圓弧般，彎曲至3片面板之上面 (裡面）側’以從面板侧FPC與共通化Fpc之連接完畢之以虛 線顯示的狀態，將共通化FPC連接於配置於3片。面板之裡面 12 201243444 (在圖中為上面側）之控制基板的連接器。 第6A圖係說明面板之傾斜與面板側Fpc之前端部的延 伸之關係之圖（1)。 第6B圖係說明面板之傾斜與面板側171)(：之前端部的延 伸之關係之圖（2)。 第7A圖係以易了解之方式簡略地顯示習知多層化之撓 性基板之FPC的連接關係與配線之技術之圖（i)。 第7B圖係以易了解之方式簡略地顯示習知多層化之撓 性基板之FPC的連接關係與配線之技術之圖（2)。 C實施方式：J 用以實施發明之形態 以下，一面參照圖式，一面說明本發明之實施形態。 第1實施例 u 第1關_科第1實關之連接方法，用於為液晶面 板之信號輸入線之面板側FPC與為控制基板之信號輸出線 之共通FPC的接著之連接裝置之圖。於同圖顯示連接頭上下 機構部ίο、裝設於其下部之連接頭η。 於連接頭11内藏有加熱器12。於該連接頭"之下方配 置有由石英玻料構紅連接支撐板13。於料支樓板η 其中一側邊(在第1Α圖為左方）配置有吸附盤μ。 ,、連接支撐板13之上面_配置;^ -平面内。於此吸咖4之上面歸未料顯示，但 許多孔。此吸附盤14形成内空間，於該内空 於真空泵15之管16。 接有連接 13 201243444 當驅動真空泵15時，藉由管16，吸引吸附盤14之内空 間之空氣，而於吸附盤14之内空間產生負壓。藉此負壓， 外部空氣通過上述許多孔，而如箭號c所示，被吸引至内空 間内。 當於吸附盤14之上面載置液晶面板17時，以液晶面板 17所堵塞之孔之罝阻礙外部之空氣之吸引，而於内空間之 内外產生氣壓差。由於此氣壓差外部較内空間内高’故液 晶面板Π被吸附至吸附盤14之上面，而固定位置。 構成信號輸入線之面板側FPC丨8從液晶面板17延伸而 出。當將液晶面板17載置於吸附盤μ之上面時，面板側 FPC18之前端便定位於連接支撐板13之上面之以箭號d所示 的接著位置。定位於接著位置之面板側Fpc 18之前端作為導 體部露出之連接部。 於此面板側FPC18之前端之連接部重疊有與圖外之控 制基板連接之共通化FPC19之前端。共通化FPC19之前端亦 形成為導體部露出之連接部，進而’於該連接部預先貼附 有含有導體粒子之熱硬化接著劑。 將面板側FPC18與共通化FPC19接著之際，為連接頭上 下機構部10降下驅動，以加熱器12加熱之連接頭11降下至 以虛線11a所示之位置，將面板側FPC18與共通化FPC19之 接著部以熱壓著連接。 第1B圖係顯示以箭號d顯示之面板側FPC18與共通 FPC19之接著位置之狀態的圖。 於第ΐέ圖顯示面板側FPC18之撓性樹脂膜21、形成於 201243444 此撓性樹脂膜21之其中一面（在第⑺圖為下面）之印刷配線 22、共通化FPC19之撓性樹脂膜23、形成於此撓性樹脂膜23 之其中一面（在第1B圖為上面）之印刷配線24、定位於印刷 配線22之接著位置與印刷配線24之接著位置間，含有導電 粒子之熱硬化接著劑25。 第1C圖係連接頭11降下至以第丨a圖所示之虛線丨la顯 示之位置，以熱壓著連接面板側1?1>(：18與共通化Fpci9之接 著部之圖。含有導電粒子之熱硬化接著劑25藉業經以加熱 器12加熱之連接頭11以加熱溶融，且以壓力壓碎。 藉此壓碎，含有導電粒子之熱硬化接著劑25所含之導 電性粒子26藉由面板側FPC18與共通化FpC192連接部，使 各自之印刷配線22與24導通。 第2A圖〜第2D圖係說明第1實施例之連接方法之基本 概念的圖。第2A圖係顯示由PET等構成之厚度〇 3mm透明樹 脂面板（對應於液晶面板之1色者，以下僅稱為面板)27、為 此面板27所伸出之信號輸入線之面板側FpC28。 第2B圖係重疊3片液晶面板時之例，顯示從重疊成3片 之面板27(27a、27b、27c)分別伸出之面板側FpC28(28a、 28b、28c)與連接於控制基板29之連接器31之共通化即㈡〕 之連接關係及連接後之態樣的圖。 此外，自第2B圖之2點鏈線e往右顯示連接前之相互之 位置關係，自鏈線f往下顯示下述狀態之圖，前述狀態係將 連接後之3片面板側FPC28如箭號g所示，彎曲至3片面板27 之下面（裡面），藉由共通化FPC32連接於配置在面板27之裡 15 201243444 面之控制基板29。 於第2B圖顯示於從配置在3片面板27之裡面之控制基 板29伸出之共通化FPC32與面板27之裡面間形成的間隙為 amm ;連接寬度為3mm ;預先形成於共通化FPC32之3處 之含有導電粒子的熱硬化性接著劑25之各間隔為召mm ;及 面板側FPC28b與28c之前端如箭號1!及丨所示，較各自對應之 含有導電粒子之熱硬化接著劑25之位置短。 第2C圖係放大第2B圖之彎曲部份而顯示之圖，此第2C 圖係以用以算出從3片重疊之面板27分別伸出之3片面板側 FPC28a、28b及28c的長度之示意圖顯示。 在第2C圖中，令1片面板27之厚度為0.3mm時，從第1 層面板27a之側面中央伸出之面板側FPC28a從距離面板27a 之裡面0.15mm之位置伸出。 如前述’令形成於共通化FPC32與面板27之裡面間之間 隙為a mm，令連接寬度為3mm，令含有導電粒子之熱硬化 接著劑25與25之間隙為/?mm，令面板側FPC28之厚度為 0.06mm。又，令在a +0.15mm之距離内，不升j成錯刀狀而 形成半圓之面板側FPC28a(Ll)之曲率半徑為rl，令面板側 FPC28b(L2)之曲率半徑為r2，令面板側FPC28c(L3)之曲率 半徑為r3。 如此一來’各面板侧FPC28之曲率半徑r 1、r2、r3可以 下述式表示，前述式係 rl=( a +0.15)/2 r2=rl+0.06 16 201243444 r3=rl+0.12 從該等式，各面板側FPC28之長度LI、L2、L3可以下述式 表示，前述式係The flexible connection (10) of the communication processing substrate of the protocol) and the tft (thin film semiconductor driving) substrate of the liquid crystal panel is arranged so as to surround the outer circumference of the f-light module. The technique shown in the above Patent Document 1 or Patent Document 2 is not mentioned with respect to the multilayered liquid crystal panel. However, Patent Document 3 proposes a technique of connecting the FPC connection and wiring of the multilayered flexible substrate in the liquid crystal display device 201243444. Referring to the description of Fig. 26 and paragraph [0110] of Patent Document 3, there is shown a structure in which the end portion of the substrate connected to the liquid crystal display element at one end is folded back to the lower surface or above the substrate. In the flexible substrate for signal input, the end portion of the protruding polyimide film is formed into a wave shape or a zigzag shape in the direction of the bending line. Fig. 7A and Fig. 7B are diagrams showing the technical structure of the above Patent Document 3 in a manner that is easy to understand. Fig. 7A shows a three-layer liquid crystal panel 丨, and three panel side FPCs (2a, 2b, 2c) connected to the first layer, the second layer, and the third layer, respectively, from above the liquid crystal panel 1. Fig. 7A further shows that the common FPC 5 extending from the connector 4 of the signal processing substrate 3 is preliminarily placed at a position corresponding to the common connection portion 6 at the connection end portion of the three panel side Fpc2, and contains conductive particles. The heat hardens the adhesive 7. The panel side FPC2 and the common portion of the common FPC 5, which are followed by the thermosetting adhesive 7 containing conductive particles, are not specifically shown, but a conductor pattern is formed. Fig. 7B is a view showing a state in which the panel side FPC2 and the joint portion of the common FPC 5 are pressed in the state of Fig. 7A by a pressing device (not shown), and the three panel sides FPC2f are bent. As shown by the arrow movement, the signal processing substrate 3 and the Qianhua FPC5 are disposed inside the liquid crystal panel, and when the panel side FPC2 is connected in a straight line state, the inner panel side Fp (: 2 is formed in a circle formed by FPC2). In the state where the wrinkles on the inner side of the arc are concentrated, the stress is concentrated on the connecting portion of each FPC. ^ 201243444 In the technique of Patent Document 3 (Japanese Patent Laid-Open Publication No. Hei No. Hei No. _472 No. 9), the structure is folded back to the lower side of the substrate. Or the signal of the upper part of the protruding portion of the flexible substrate for the input of the mt line is in the shape of a wavy or ore-like mountain portion and a valley portion, so that the stress of the bent portion is concentrated and dispersed, and the ridge portion is dispersed. A good bending is formed, and the occurrence of the disconnection can be suppressed, and the reliability can be improved. PRIOR ART DOCUMENT Patent Document Patent Document 1: Patent Publication No. 2〇〇6_2〇1216 Patent Document 2: Japanese Patent Laid-Open Publication No. 2 1 Patent No. 1 1854〇4 Japanese Patent Laid-Open Publication No. Hei No. _472 No. 9 C. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION However, in order to concentrate the stress of the bent portion, the FPC formed in the curved portion is formed along the FPC. The shape of the ridges or valleys in the direction of the bend line needs to bend the FPC into the space of the mountain and the valley multiple times, and the R of the curved portion increases the problem of large-scale FPC. The FPC can be formed into a zigzag shape so that the stress of the FPC is concentrated and dispersed. However, the FPC having the outer side and the inner side remaining in the curved portion of the plurality of flexible substrates has a stress to the inside and outside of the radius of curvature. The inner and outer aberrations of the radius of curvature of the entire viewing, that is, the arc length difference when the curved line is regarded as a curve, causes distortion at the end portion indicated by the arrows bl, b2, b3, b4, b5, and b6 of the FPC of the curved portion. There is probably no time to pass the triggering of 6 201243444. The following is a solution to the above-mentioned problems. The purpose of the present invention is to provide a connection between the panel side Fpc and the panel side Fpc after the connection with the 妓通化 FPC. On the occasion In the inside and outside of the curve, the connection of the arc length difference is considered to solve the distortion caused by the arc length difference, and the connection amount of the f-curve portion is reduced to suppress the enlargement of the FPC on the panel side and the connection device. Means for Solving the Problem In order to solve the above problems, the connection method of the present invention is configured to be bent in a plurality of liquid crystal panel side FPCs composed of at least a second layer and a second layer connected by a common FPC. The connection portion between the connection portion of the second liquid crystal panel side FPC on the outer side of the f-curve portion and the first liquid crystal panel side FPC on the inner side of the (four) curved portion are formed to be relatively shorter than those previously provided in the foregoing common The connection portion of the FPC and the connection portion are connected, and the common FPC is connected to the liquid crystal panel side Fpc. In the connection method, when the common Fpc is connected to the liquid crystal panel side FPC, the second liquid crystal panel side Fpc is connected in a normal state, and then the second liquid crystal panel side Fpc is connected. In the bending, the common FPC is pulled in a direction in which the second liquid crystal panel Fpc is linearly shortened, and then the connection portion of the first liquid crystal panel side Fpc is located at the connection of the common FPC. The portion is temporarily fixed to the position of the alignment, and then the connection portion of the second liquid crystal panel side Fpc is connected to the connection portion of the common FPC. In the connection method, when the common FPC is connected to the plurality of liquid crystal panel side FPCs, when the plurality of sheets are three, the second layer liquid crystal panel side Fpc of 201243444 is described in the ordinary In the state of being connected, the front sputum aa panel side FpC is deflected, and the common Fpc is pulled toward the shortening direction of the FpC line on the third liquid crystal panel side of the other side by the deflection, and then the month j The connection portion of the second liquid crystal panel side Fpc is located at the connection portion of the common FPC, and the position of the alignment is temporarily fixed, and then the connection portion of the second liquid crystal panel side FPC is connected to the common portion. In the connection portion of the FPC, the third layer liquid crystal panel side FPC is further deflected, and the second layer liquid crystal panel side FPC is deflected, and the deflection is used to describe the moon and the FPC to the third. The layer and the second liquid crystal panel side Fpc are shortened in a straight line direction, and then the connection portion of the first liquid crystal panel side FPC is positioned at a connection portion of the common FPC, and the position of the alignment is temporarily fixed. After that, the aforementioned second layer The connection portion of the liquid crystal panel side Fpc is connected to the aforementioned connection portion of the common FPC. In order to solve the above problems, the connection jig of the present invention is configured to connect the two liquid crystal panel side FPCs in a plurality of liquid crystal panel side FPCs connected to at least the first layer and the second layer connected to the common FPC. In the case of the common FPC, the two liquid crystal panel side FPCs are connected to the second liquid crystal panel side FPC on the outer side of the curved portion bent after being connected to the common FPC. The connection portion of the first liquid crystal panel side FPC on the inner side of the curved portion is formed to be relatively shorter than the interval between the connection portion and the connection portion previously provided in the common FPC, and the connection jig has a liquid crystal panel mounting The liquid crystal panel mounting surface has a predetermined inclination angle, and when the two liquid crystal panels are mounted on the liquid crystal panel mounting surface, the connection portion of the upper liquid crystal panel side FPC is connected to the lower side liquid. 201243444 The position of the common FPC of the crystal panel coincides with the connection of the above-mentioned upper liquid crystal panel. In the connection jig, when the number of the plurality of liquid crystal panel side FPCs connected to the common FPC is three, the three crystal panel side FPCs are connected to the common FPC. The user, the liquid crystal panel side FPC is a connection portion between the third layer or the second layer liquid crystal panel on the outer side of the total curved portion after the connection with the common Fpc, and the inner side of the curved portion The connection portion of the second layer or the first layer liquid crystal panel side FPC is formed to be relatively shorter than the interval between the connection portion and the connection portion of the common FPC, and the connection device has a liquid crystal panel The liquid crystal panel mounting surface has a predetermined inclination angle, and the three liquid crystal panels are mounted on the liquid crystal panel mounting surface: the connection portion of the upper liquid crystal panel side FPC is connected to the lower surface side. The position of the common portion of the panel of the FPC and the connection portion of the upper liquid crystal panel. When the structure is any of the above, the connecting jig can adjust the angle of the inclined surface. Advantageous Effects of Invention According to the connection method and the connection jig of the present invention, when the panel side Fpc is connected to the common FPC and bent, the panel side FPC is connected by the length of the arc length difference, so that the stress generated at the end portion of the bending portion has no internal and external differences. The effect of having a curved structure with a stable back portion over time can be obtained. The X diagram briefly illustrates the connection method of the first phase of the first phase of the system, which is used for the liquid crystal surface, and the common FPC of the panel side FPC of the input line of the 201243444 board and the signal output line for the control board. Diagram of the connection device. Fig. 1B is a view showing the state of the position of the panel side FPC and the common FPC. In Fig. 1C, the connector is lowered to the next position to thermally press the connection between the panel side FPC and the common FPC. Fig. 2A is a view showing a panel side FPC of a transparent resin panel (panel) and a signal input line extending for the panel. Fig. 2B is a view showing a state in which the panel side FPC is connected to the common Fpc and a state in which the panel side FPC is bent to the back side of the panel and connected to the control board. Fig. 2C is a schematic diagram showing the length of the curved portion of the three panel sides F P C extending from the three overlapping panels, and the length is calculated. Fig. 2D is a view showing the amount of deviation between the thermally hardened adhesive containing conductive particles and the front end of each of the panel-side FPCs, which are derived from the relationship calculated according to the second (the graph). The 3A diagram shows a state in which the third layer panel side FPC is pressed under the normal (four) connection head of the connection device, and is pressed against the common hardened FPC containing the conductive particles and then hardened. Fig. 3B shows a state in which the third layer is flexed from the side of the board, and the common FPC is pulled to the panel side by the pull. Fig. 3C shows the panel side F which has been falsely melted. A diagram showing a state in which the connection between the pc and the common fpc is pressed by the connector. Fig. 3D is a view showing a state in which the FPC of the third layer panel 10 201243444 side is further deflected. At the same time, the second layer panel side FPC is deflected, and the common FPC is pulled, and the soldering iron is used to heat the joint portion, and the heat hardening adhesive containing the conductive particles is melted, thereby making the panel side FPC and the common FPC smelt. The 0E figure is the following state (Fig. 3D) In the above-described state, the third layer panel side FPC is further flexed, and the second panel side FPC is flexed to pull the common FPC, and the soldering iron is used to heat the connection portion to heat the conductive particles. The hardening adhesive is melted, and the panel side Fpc and the common FPC are pseudo-molded. The 3F figure shows that the connection portion of the panel side Fpc and the common Fpc which have been pseudo-melted is pressed by the pressing head to make the connection Fig. 3G is a view showing a state in which the three states of the panel side fpc are curved like an arc to the lower side (inside) of the three panels to the FpC from the panel side, as shown by the solid line. The connection to the common FPC is completed in a dotted line, and the common FPC is connected to the connector of the control board disposed inside the three panels. Fig. 4A shows the third panel side FPC in the normal state. Fig. 4B is a view showing a state in which the connection to the rear portion of the common FPC is pressed by the connector. Fig. 4B is a view showing a state in which the second clamp is placed on the panel mounting surface and two stacked panels are placed on the panel mounting surface. The 4C system displays a map of the following states, the aforementioned states The heat-curing adhesive containing the conductive particles is fused by the heating of the second layer panel side Fpc of the joint portion of the common FPC, and the panel-side FPC and the common FPC' are melted. 201243444 4D is a perspective view showing a state in which a state in which the second layer panel side FPC is superposed on the succeeding portion of the common FPC is heated by a soldering iron, and the conductive particles are contained. The thermosetting adhesive is melted to make the panel side FPC and the common FPC smelt. The 4E figure shows that the connection portion of the panel side FPC which has been pseudo-melted and the common FPC is pressed by the joint head. A diagram of the state of these connections. Fig. 4F shows a state in which the intermediate portion formed by the completion of the connection between the two layers of the panel-side FPC and the second-layer panel-side FPC and the common FPC from the i-th connection jig is obtained. Fig. 5A is a view for explaining the reasons for the difference between the second layer and the third layer. Fig. 5B is a view showing a state in which a soldering iron is used, and the succeeding portion of the second layer panel side FPCa placed on the three overlapping panels of the second connection jig is smelted to the common Fpc. Part. Fig. 5C is a perspective view showing the operational state of the pseudo melting of Fig. 5B. Fig. 5D is a view showing a state in which the connection portion between the succeeding portion of the panel side Fpc and the common FPC which has been falsely melted is pressed by the joint head. Fig. 5E is a view showing a state in which the connection of the third, second, and first layer panel sides Fpc and the common Fpc which are three overlapping from the second connection loss is completed, and the panel side FPC and Part of the completion of the composition of the FPC. Fig. 5F is a view showing a state in which the above-mentioned state is as a solid line, and three panel side FpCs are curved like an arc, and are bent to the upper (inside) side of the three panels to be common to the panel side FPC. The connection of the Fpc is completed in a state shown by a broken line, and the common FPC is connected to three pieces. Inside the panel 12 201243444 (on the top side in the figure) The connector of the control board. Fig. 6A is a view (1) showing the relationship between the inclination of the panel and the extension of the front end of the panel side Fpc. Fig. 6B is a view (2) showing the relationship between the inclination of the panel and the panel side 171) (the extension of the front end portion. Fig. 7A shows the FPC of the conventional multilayered flexible substrate in an easy-to-understand manner. Diagram (i) of the connection relationship and wiring technique. Fig. 7B is a diagram (2) showing the connection relationship of FPC and the wiring technique of the conventional multilayered flexible substrate in a manner that is easy to understand. EMBODIMENT OF THE INVENTION The embodiment of the present invention will be described below with reference to the drawings. First Embodiment u The first connection method is the first connection method for the liquid crystal panel. A diagram of the connection device between the panel side FPC of the line and the common FPC of the signal output line of the control board. The same figure shows the connector upper and lower mechanism portion ίο, the connector η installed at the lower portion thereof. A heater 12 is housed. A support plate 13 is connected to the bottom of the connector by a quartz glass. The suction plate μ is disposed on one side of the material support floor η (left side in the first drawing). , , connect the top of the support plate 13 _ configuration; ^ - plane The top of the suction cup 4 is not shown, but a plurality of holes. The suction disk 14 forms an inner space in which the tube 16 of the vacuum pump 15 is connected. The connection 13 is connected. 201243444 When the vacuum pump 15 is driven, The tube 16 attracts the air in the space inside the adsorption tray 14, and generates a negative pressure in the space inside the adsorption tray 14. By this negative pressure, the outside air passes through the above-mentioned many holes, and is attracted to the inner space as indicated by the arrow c. When the liquid crystal panel 17 is placed on the upper surface of the adsorption disk 14, the suction of the air blocked by the liquid crystal panel 17 blocks the attraction of the outside air, and a difference in air pressure occurs inside and outside the inner space. The liquid crystal panel is attracted to the upper surface of the adsorption tray 14 and is fixed. The panel side FPC 8 constituting the signal input line extends from the liquid crystal panel 17. When the liquid crystal panel 17 is placed on the adsorption tray μ On the upper side, the front end of the panel-side FPC 18 is positioned at the next position indicated by the arrow d on the upper surface of the connection support plate 13. The front end of the panel side Fpc 18 positioned at the subsequent position serves as a connecting portion where the conductor portion is exposed. panel The front end of the FPC 18 is overlapped with a front end of the common FPC 19 connected to the control board outside the drawing. The front end of the common FPC 19 is also formed as a connecting portion where the conductor portion is exposed, and the conductor portion is preliminarily attached to the connecting portion. After the panel side FPC 18 and the common FPC 19 are subsequently driven down, the connector upper and lower mechanism portions 10 are driven down, and the connector 11 heated by the heater 12 is lowered to a position indicated by a broken line 11a, and the panel side is opened. The FPC 18 and the joint portion of the common FPC 19 are connected by heat pressing. Fig. 1B is a view showing a state in which the panel side FPC 18 and the common FPC 19 are displayed at the position indicated by the arrow d. The flexible resin film 21 of the FPC 18 on the panel side, the printed wiring 22 formed on one side of the flexible resin film 21 (the lower side in FIG. 7), and the flexible resin film 23 of the common FPC 19 are shown in FIG. The printed wiring 24 formed on one surface (the upper surface in FIG. 1B) of the flexible resin film 23, and the heat-curing adhesive 25 containing conductive particles positioned between the subsequent position of the printed wiring 22 and the subsequent position of the printed wiring 24 . In Fig. 1C, the connector 11 is lowered to a position shown by a broken line 丨la shown in Fig. a, and is thermally pressed against the connection panel side 1?1> (: 18 and the common Fpci9 are connected to each other. The hot hardening adhesive 25 of the particles is heated and melted by the joint 11 heated by the heater 12, and is crushed by pressure. Thereby, the conductive particles 26 contained in the thermosetting adhesive 25 containing the conductive particles are crushed. The printed wirings 22 and 24 are electrically connected to each other by the panel side FPC 18 and the common FpC 192 connecting portion. Figs. 2A to 2D are diagrams for explaining the basic concept of the connecting method of the first embodiment. Fig. 2A shows the PET by PET. The thickness of the 〇3mm transparent resin panel (corresponding to the one color of the liquid crystal panel, hereinafter simply referred to as the panel) 27, the panel side FpC28 of the signal input line extended by the panel 27. The 2B image is overlapped by 3 pieces. In the case of the liquid crystal panel, it is shown that the panel side FpC28 (28a, 28b, 28c) extending from the panel 27 (27a, 27b, 27c) which is overlapped by three, and the connector 31 connected to the control board 29 are common. (b) The connection relationship and the pattern after the connection. The two-point chain line e in Fig. 2B shows the positional relationship before the connection to the right, and the following state is displayed from the chain line f. The above state is the three panel side FPCs 28 connected as arrows It is bent to the lower surface (inside) of the three panels 27, and is connected to the control substrate 29 disposed on the surface of the panel 27 in the panel 27 by the common FPC 32. The second panel is shown in the inside of the three panels 27 The gap formed between the common FPC 32 of the control substrate 29 and the inside of the panel 27 is amm; the connection width is 3 mm; and the intervals of the thermosetting adhesive 25 containing conductive particles previously formed at three places of the common FPC 32 are formed. As shown in Fig. 1 and 之前, the front ends of the FPCs 28b and 28c on the panel side are shorter than the positions of the corresponding thermosetting adhesives 25 containing conductive particles. Fig. 2C is an enlarged view of the curved portion of Fig. 2B. In the figure, the 2C figure is a schematic display for calculating the lengths of the three panel side FPCs 28a, 28b, and 28c extending from the three overlapping panels 27. In the 2C figure, one piece is made. When the thickness of the panel 27 is 0.3 mm, from the side of the first layer panel 27a The extended panel side FPC 28a protrudes from the inner side of the panel 27a by 0.15 mm. As described above, the gap formed between the common FPC 32 and the inside of the panel 27 is a mm, and the connection width is 3 mm, so that the conductive particles are contained. The gap between the thermosetting adhesives 25 and 25 is /?mm, and the thickness of the panel side FPC28 is 0.06 mm. Further, in the distance of a +0.15 mm, the panel side of the semicircle is formed without forming a wrong blade shape. The radius of curvature of the FPC 28a (L1) is rl, the radius of curvature of the panel side FPC 28b (L2) is r2, and the radius of curvature of the panel side FPC 28c (L3) is r3. Thus, the curvature radii r 1 , r 2 , and r 3 of each panel side FPC 28 can be expressed by the following equation: rl = ( a + 0.15) / 2 r2 = rl + 0.06 16 201243444 r3 = rl + 0.12 from these The lengths LI, L2, and L3 of each panel side FPC 28 can be expressed by the following formula.
Ll=rl*3.14+2* β +3=1.57* a +2* β +3.24 L2=r2*3.14+0.3+召+3=(α/2+0.135) *3.14+/5+3.3=1 5 7氺 a +yS+3.72 L3=r3*3.14+0.6+3=(a;/2+0.195) *3.14+3.6=1.57* α+4 21 在此，當令a =2mm，厶=6mm時，Ll=rl*3.14+2* β +3=1.57* a +2* β +3.24 L2=r2*3.14+0.3+call +3=(α/2+0.135) *3.14+/5+3.3=1 5 7氺a +yS+3.72 L3=r3*3.14+0.6+3=(a;/2+0.195) *3.14+3.6=1.57* α+4 21 Here, when a = 2mm, 厶 = 6mm,
Ll = 18.38mm L2=12.86mm L3=7.35mm 當為直線之連接時，連接間距(含有導電粒子之熱硬化接著 劑25與25之間隔）係p=6mm之長度之差，但由於有面板側 FPC28之彎入，故Ll = 18.38mm L2 = 12.86mm L3 = 7.35mm When the connection is straight, the connection pitch (the distance between the thermosetting adhesives 25 and 25 containing conductive particles) is the difference of the length of p = 6 mm, but due to the panel side FPC28 bends in, so
Ll-L2=5.52mm(-〇.48mm) L2-L3=5.5 lmm(-〇.49mm) 第2D圖係顯示從上述關係式導出，共通化FpC32之各 含有導電粒子之熱硬化接著劑25與分別對應於該等之面板 側FPC28a(Ll)、28b(L2)、2Sc(L3)之前端的偏離量之圖。 第3A圖〜第3G圖係將面板重疊3層時之例，如上述，係 顯示具有形成有與含有導電粒子之熱硬化接著劑25之位置 偏離之面板側FPC28a及28b之3片面板側FPC28對共通化 FPC32的連接方法之圖。 17 201243444 此外’在以下之說明及圖式中，僅簡略地顯示連接頭 11，其他顯示於第丨圖之連接頭上下機構部1〇、加熱器12、 連接支撐板13、吸附盤14等之結構省略圖示。 首先，如第3A圖所示，將第3層面板側FPC28c在第1A 圖所示之普通狀態下，藉該❹熱II 12加熱之連接頭u 以壓著往共通化FPC32之含有導電粒子之熱硬化接著劑25 之接著部（以下亦稱為接著部25)連接。 接著’如第3B圖所示，使第3層面板側FPC28c撓曲， 以該撓曲將共通化FPC32往第3層面板侧FpC28c以直線（參 照虛線33)縮短之方向拉近。 然後’將第2層面板側FPC28b之連接部對位於共通化 FPC32之連接部25，為固定該對位之位置，在遠離連接部之 位置，使用防止偏離帶34，固定面板侧FPC28b與共通化 FPC32。 之後，使用烙鐵35，加熱連接部之兩端，使含有導電 粒子之熱硬化接著劑25適宜地溶融，而使面板側ppc28b與 共通化FPC32之連接部假熔融。 接著，如第3C圖所示，將已假炼融之面板側FPC28b與 共通化FPC32之連接部25以連接頭11壓著而使該等連接。 然後，如第3D圖所示，使第3層面板側FPC28c進一步 撓曲，同時，使第2層面板側FPC28b撓曲，以該撓曲，將共 通化FPC32往第3層及第2層面板側FPC28c及28b以直線（參 照虛線33、36)縮短之方向拉近。 之後，使第1層面板側FPC28a之連接部對位於共通化 201243444 FPC32之連接部25，為固定該對位之位置，在遠離連接部之 位置，使用防止偏離帶34，固定面板側1?1>(：28&與共通化 FPC32。 之後，使用烙鐵35，加熱連接部之兩端，使含有導電 粒子之熱硬化接著劑25適宜地熔融，而使面板側Fpc28a與 共通化FPC32之連接部假熔融。 第3E圖係顯示使用烙鐵35 ,使面板側1^(：：28&與共通化 FPC32之連接部假，熔融之作業狀態的立體圖。於第3E圖對 與第3A圖〜第3D圖所示之結構相同之結構部份附加與第3A 圖〜第3D圖相同之標號而顯示。 之後，如第3F圖所示，將已假熔融之面板側FpC28a與 共通化FPC32之連接部以連接頭U壓著而使該等連接。 第3G圖係顯示下述狀態之圖，前述狀態係如實線所 示，將3片面板側FPC28如描繪圓弧38般彎曲至3片面板27 之下面（裡面）側’以從面板側FPC28c、28b、28a與共通化 FPC32之連接完畢，緊接著卸除防止偏離帶34後之以虛線顯 示的狀態37 ’將共通化FPC34連接於配置於3片面板27之裡 面的控制基板29(參照第2B圖）之連接器。 如上述，一面使之前連接之面板側FpC28撓曲，而將共 通化FPC32拉近連接部之位置偏離量，一面將下個面板側 FPC28接著於接著部。藉此’如第2C圖所說明，一面將第1 層面板27a之裡面與共通化FPC32之間隙維持在2mm之窄間 隙，一面形成不形成鋸刀狀而形成半圓之面板側FPC28之彎 曲。 19 201243444 第2實施例 在第2實施例中，就下述夾具作說明，前述夾具係將具 有形成了與含有第2B圖〜第2D圖所示之導電粒子之熱硬化 接著劑25的位置偏離之面板側FPC28a與2813之3片面板側 FPC28連接於共通化Fpc32之際，如第1實施例般將面板側 FPC不強制地撓曲而連接者。 此外’在第2實施例中，亦使用第ία圖所示之連接裝 置，連接部之壓著所作之接著的原理與第1B圖及第1C圖時 相同。 第4A圖〜第4F圖及第5A圖〜第5F圖係就將具有形成了 與含有導電粒子之熱硬化接著劑25的位置偏離之面板側 FPC28a與28b之3片面板側FPC28對共通化FPC32之連接方 法及用於其連接作業之夾具說明的圖。 此外’在以下之說明及圖式中，除了夾具外，僅簡略 地顯示連接頭11，其他之第1圖所示之連接頭上下機構部 1〇、加熱器12、連接支撐部13、吸附盤14等結構省略圖示。 第4A圖係顯示將第3層面板側fpC28c在第1A圖所示之 普通狀態下藉連接頭11以壓著往共通化FpC32i連接部25 連接之狀態的圖。 第4B圖係顯示第1連接夾具41之圖。第丨連接夾具41具 有具角度(9之傾斜角度的面板載置面42。於此面板載置面 42與連接裝置之吸附盤14之上面14a同樣地設有許多孔。 又，於第1連接夾具41之内部雖未於圖顯示，但設有吸 附功忐連通機構。當此第丨連接夾具41之底面載置於作為連 20 201243444 接裝置之面板載置面之吸附盤14的上面14a時，吸附盤14之 上面14a之面板吸附功能透過第1連接夾具41之内部之吸附 功能連通機構’作用於具有角度0之傾斜角度之面板載置 面42。 於此面板載置面42如第4A圖所示，顯示以壓著連接至 共通化FPC32之連接部25之第3層面板側FPC28c、重4於此 面板側FPC28c而被定位其重疊位置之第2層面板側 FPC28b。 將此第2層面板側FPC28b連接於共通化FPC32之際，如 第4B圖所示’第3層面板27c之面載置於具有角度0之傾斜 角度之面板載置面42。第4B圖係顯示作用於面板載置面42 之透過吸附功能連通機構之吸附作用作用於第3層面板27c 之面的狀態。 於面板載置面42之面板載置面42將2層重疊之第3層面 板側FPC28c與第2層面板側FPC28b如上述載置時，設定面 板載置面42之傾斜角度Θ，以使第2層面板側FPC28b之前端 之接著部28b-l剛好重疊於對應於此之共通化pC32之連接 部25。 第4C圖係顯示下述狀態之圖，前述狀態係如上述將定 位成重疊於共通化FPC32之連接部25之第2層面板側 FPC28b的前端之連接部28b-l使用烙鐵35，沿著連接部25 加熱，而使含有導電粒子之熱硬化接著劑25熔融，而使面 板側FPC2 8 b與共通化FPC 3 2之連接部2 5假溶融者。 第4D圖係顯示使用烙鐵35，使面板側FpC28b與共通化 21 201243444 FPC32之連接部25假熔融之作業狀態的立體圆。於第4D圖 對第4A圖〜第4C圖所示之結構相同之構成部份標上與第4a 圖〜第4C圖相同之標號而顯示。 第4E圖係顯示將如第4C圖、第4D圖所示，已假熔融之 面板側FPC28b之接著部28b-1與共通化FPC32之連接部25 以連接頭11壓著而使該等連接之狀態。 第4F圖係顯示下述狀態，前述狀態係從第丨連接夾具“ 取出2片重豐之第3層面板側FPC28c及第2層面板側ppc28b 與共通化FPC32之連接結束，由面板側fpc28c及共通化 FPC32構成的中間部份43者。 第5 A圖係說明從第1連接爽具41取出中間部份μ之理 由的圖。在上述之下個連接中，需於中間部份43之第2層面 板側FPC28b重疊第1層面板側FPC28a，將該接著部27a-l連 接於共通化FPC32之接著部25。 然而’如前述’各面板側FPC28之前端(接著部）之間隔 與共通化FPC32之接著部25之間隔有位置偏離。因此，若將 3片重疊之面板27直接載置於第1連接夾具41，面板側 FPC28a之連接部27a-l於共通化FPC32之連接部25則不重疊 在適當之位置。即’於相互間引發位置偏離。 因此’需將共通化FPC32往以箭號j所示之面板27側方 向拉近，而解決位置偏離。是故，使用第2連接夹具44，將 面板側FPC28a之連接部27a-l靠近共通化FPC32，而重疊於 共通化FPC32之連接部32來取代將共通化FPC32拉近。 第2連接夾具44亦係其面板載置面45傾斜形成。又，其 22 201243444 傾斜角度5形成大於第1連接夾具41之面板載置面42之傾 斜角度0。 在此’當將共通化FPC32固定於第2連接夾具44，將面 板27載置於面板載置面45時，面板27傾斜大於第1連接失耳 41時。當面板27傾斜時，已連接共通化FPC32之第3層及第2 層面板側FPC28c及28b之彎曲與自然地彎曲之此後將連接 之第1層面板側FPC28a的彎曲曲率改變。 此曲率之改變方式係在某角度内，增大傾斜角度大之 量。因而’在第1連接夾具41，無法到達共通化FPC32之接 著部32之面板側FPC28a之連接部27a-l在傾斜角度大之第2 連接夾具44可及於連接部25。 如第5A圖所示，第2連接夾具44較第1連接夾具41短長 度k。又，面板載置面45之傾斜角<5大於第1連接夾具41之 傾斜角0。此兩者之變化相輔相成，當使用第2連接夾具44 時，面板側FPC28a之接著部27a-l便可及於接著部32。 第5B圖係顯示下述狀態之圖，前述狀態係使用烙鐵 35，使如上述載置於第2連接夾具44之3片重疊之面板27的 第1層面板側FPC28a之接著部28a-l假熔融於共通化FPC32 的接著部25者。 第5C圖係顯示第5B圖之假熔融之作業狀態的立體 圖。於第5C圖對與第5A圖、第5B圖所示之結構相同之結構 部份標上與第5A圖、第5B圖相同之號碼而顯示。 第5D圖係顯示將上述已假熔融之面板侧FPC28a之接 著部28a-l“共通化FPC32之連接部25以連接頭11壓著而使 23 201243444 δ亥專連接的狀態。 第5Ε圖係顯不下述狀態之圖，前述狀態係從第2連接夹 具44取出3片重疊之第3層面板側Fp(：28c、第2層面板側 FPC28b、及第丨層面板側FpC28a與共通化卯〇2之連接結 束，由面板側FPC28c、28b及28a與共通化FPC32構成的完 成部份46者。 第5F11係顯示下述狀態之圖，前述狀態係如實線所 示將3片面板側FPC28如描繪圓弧般，彎曲至3片面板27 之裡面側’以從以虛線顯示之第5E圖所*之完成部份邮的 狀態，將共通化FPC32連接於配置於3片面板27之裡面（面板 側FPC28a之裡面）的控制基板29(參照第2B圖）之連接器。 如上述，為此第2實施例時，使用第丨及第2連接夾具， 以面板之傾斜，將接著部間之位置偏離在不使用防止偏離 帶下對位而接著。藉此，如第2C圖所說明，一面將第1層面 板27a之裡面與共通化FpC32之間隙維持在2mm之窄間隙， 一面形成不形成鋸刀狀而形成半圓之面板側FpC28i彎曲。 第6A圖、第6B圖係說明面板27之傾斜與面板側fpc28 之前端部之延伸之關係的圖。此外，第6A圖為使說明簡便， 顯示面板27重疊2片之情形，且顯示作為連接夾具之第1連 接夾具41。 如第6A圖所示’從2片重疊之面板27(27c、27b)載置於 第1連接夾具41之實線之位置朝為第2連接夾具44之載置位 置之虛線的位置，使傾斜增大時，將此後將進行連接之上 方之面板27b之面板側FPC28b之1%接部28b-l的前端向前延 24 201243444 伸距離m。然而，當使傾斜增大時，連接部鳥奴前端並 非無限制地延伸。 第6B圖係顯示面板27之傾斜與面板側哪28之前端部 之延伸之關係的圖表。同圖表係根據實驗值者如同圖表 所示’在傾斜角度從5。至30。，至目標位置（連接部25)之位 置之差m逐漸從〇.37mm縮短至0.02mm。 然而，當傾斜大於30。時，每隔^，差爪以㈣如爪、 〇.29mm增大至垂直位置之45。。因而，連接夾具 之面板載置台之傾斜使用第6B圖所示之圖表，適當地決定。 在以上之例中，以重疊3片液晶面板時之例作了說明， 但不限於此，只要液晶面板為2片以上之複數層便可。 產業上之可利用性 可利用於連接液晶面板與用以連接信號處理基板之 FPC(Flexible Primed Circuits)之連接方法及連接夹具。 【圖式簡單說明】 第1A圖係顯不在第丨實施例之連接方法，用於為液晶面 板之信號輸入線之面板側FPC與為控制基板之信號 之共通FPC的接著之連接裝置之圖。 — 第1Β圖係顯示面板側FPC與共通Fpc之接著位置之狀 態的圖。 第1C圖係連接頭降下至接著位置，以熱壓著連接面板 側FPC與共通FPC之接著部之圖。 第2AS)係顯示透明樹脂面板（面板)與為此面板所伸出 之信號輸入線之面板側FPC的圖。 25 201243444 第2B圖係顯示面板側FPC與共通FPC連接前之相互之 位置關係與於連接後，將面板側FPC彎曲至面板裡面側而連 接於控制基板之狀態的圖。 第2C圖係以用以將從3片重疊之面板分別伸出之3片面 板側FPC之彎曲部份放大而算出長度的示意圖顯示之圖。 第2D圖係顯示從依據第2C圖所算出之關係式導出，共 通化FPC之各含有導電粒子之熱硬化接著劑與分別對應於 該等之面板側FPC之前端的偏離量之圖。 第3A圖係顯示下述狀態之圖，前述狀態係將第3層面板 側FPC在普通狀態下以連接裝置之連接頭，壓著於共通化 FPC之含有導電粒子之熱硬化接著劑之接著部而連接者。 第3B圖係顯示使第3層面板側FPC撓曲，以該撓曲將共 通化FPC拉近至面板側之狀態的圖。 第3 C圖係顯示將已假熔融之面板側Fpc與共通化fpc 之連接部以連接頭壓著而使該等連接之狀態的圖。 第3D圖係顯示下述狀態之圖，前述狀態係使第3層面板 側FPC進一步撓曲，同時，使第2層面板側Fpc撓曲，而拉 近共通化FPC，使用烙鐵，加熱連接部，而使含有導電粒子 之熱硬化接著劑熔融，而使面板側Fpc與共通化Fpc假熔融 者。 第3E圖係下述狀態（第3£)圖）之立體圖前述狀態係使 第3層面板側;FPC進—步撓曲，同時，使第2層面板側聊挽 曲，而拉近共通化FPC，使用烙鐵，加熱連接部，而使含有 導電粒子之熱硬化接著劑溶融，而使面板側與共通化 26 201243444 FPC假熔融者。 第3F圖係顯不將已假炫融之面板側Fpc與共通化 之連接部以壓著頭壓著而使該等連接之狀態的圖。 第係顯示下述狀態之圖，前述狀態係如實線所 不，將3片㈣反側啊如描緣圓弧般彎曲至3片面板之下面 (裡面），以從面板側FPC與共通化Fpc之連接完畢之以虛線 顯不的狀態’將共通化FPC連接於配置於％面板之裡面的 控制基板之連接器。 第4A圖係顯示將第3層面板側FPC在普通狀態下藉連 接頭以壓著往共通化FPC之接著部連接之狀態的圖。 第4B圖係顯示第！連接夹具及於其面板載置面載置有2 片重疊之面板之狀態的圖。 第4C圖係顯示下述狀態之圖，前述狀態係將定位成重 疊於共通化FPC之接著部之第2層純側Fpc的接著部使用 烙鐵加熱，而使含有導電粒子之熱硬化接著劑炫融，而使 面板側FPC與共通化FPC假熔融者。 第4D圖係顯示下述狀態（第4C圖）之立體目，前述狀態 係將足位成重璺於共通化Fpc之接著部之第2層面板側Fpc 的接著部使用烙鐵加熱，而使含有導電粒子之熱硬化接著 劑熔融，而使面板側FPC與共通化Fpc假熔融者。 第4E圖係顯示將已假熔融之面板側Fpc之接著部與共 通化FPC之連接部以連接頭壓著而使該等連接之狀態的圖。 第4F圖係顯示下述狀態，前述狀態係從第！連接夾具取 出2片重疊之第3層面板側FPC及第2層面板側Fpc‘共通化 27 201243444 FPC之連接結束而形成的中間部份者。 第5A圖係說明與第2層用及第3層用不同之理由之圖。 第沾圖係顯示下述狀態之圖，前述狀態係使用烙鐵， 而使載置於第2連接夾具之3片重疊之面板之第1層面板側 FPCa的接著部假溶融於共通化Fpc之接著部者。 第5C圖係顯示第5B圖之假炫融之作業狀態的立體圖。 第奶圖係顯示冑已假溶融之面板側Fpc之接著部與共 通化F P C之連接部以連接賴著*使料連接之狀態的圖。 第5E圖係顯示下述狀態之圖，前述狀態係從第2連接夹 具取出3片重疊之第3、第2、第w自板側Fpc與共通化咖 之連接結束’由面板側FPC與共通化FPC職的完成部份 者。 第5F圖係顯示下述狀態之圖，前述狀態係如實線所 示，將3片面板側FPC如描繪圓弧般，彎曲至3片面板之上面 (裡面）側，以從面板側FPC與共通化Fpc之連接完畢之以虛 線顯示的狀態，將共通化FPC連接於配置於3片面板之裡面 (在圖中為上面側）之控制基板的連接器。 第6A圖係說明面板之傾斜與面板側Fpc之前端部的延 伸之關係之圖（1)。 第6 B圖係說明面板之傾斜與面板側F p c之前端部的延 伸之關係之圖（2)。 第7A圖係以易了解之方式簡略地顯示習知多層化之撓 性基板之F P C的連接關係與配線之技術之圖（丨）。 第7B圖係以易了解之方式簡略地顯示習知多層化之撓 28 201243444 性基板之FPC的連接關係與配線之技術之圖（2)。 【主要元件符號說明 1…液晶面板Ll-L2=5.52mm (-〇.48mm) L2-L3=5.5 lmm(-〇.49mm) The 2D figure shows the thermal hardening adhesive 25 containing conductive particles each of the common FpC32 derived from the above relationship. Corresponding to the amount of deviation of the front ends of the panel side FPCs 28a (L1), 28b (L2), and 2Sc (L3), respectively. 3A to 3G are examples in which the panel is overlapped by three layers, and as described above, three panel side FPCs 28 having panel side FPCs 28a and 28b which are formed to be offset from the position of the thermosetting adhesive 25 containing conductive particles are shown. Diagram of the connection method for the common FPC32. 17 201243444 In addition, in the following description and drawings, only the connector 11 is simply shown, and other connector upper and lower mechanism portions 1〇, heater 12, connection support plate 13, suction pad 14 and the like are shown in the drawings. The structure is omitted. First, as shown in FIG. 3A, the third panel side FPC 28c is pressed by the thermal head II 12 in the normal state shown in FIG. 1A to press the conductive particles to the common FPC 32. The heat-curing adhesive 25 is joined to the rear portion (hereinafter also referred to as the rear portion 25). Then, as shown in Fig. 3B, the third panel side FPC 28c is deflected, and the common FPC 32 is pulled toward the third panel side FpC28c in a direction in which the straight line (refer to the broken line 33) is shortened by the deflection. Then, the connection portion of the second panel side FPC 28b is placed at the connection portion 25 of the common FPC 32 to fix the alignment position, and the deviation preventing belt 34 is used at a position away from the connection portion, and the panel side FPC 28b is fixed and common. FPC32. Thereafter, the soldering iron 35 is used to heat both ends of the connecting portion, and the thermosetting adhesive 25 containing the conductive particles is appropriately melted to falsely melt the joint portion between the panel side ppc28b and the common FPC32. Next, as shown in Fig. 3C, the connection portion 25 of the panel side FPC 28b and the common FPC 32 that has been falsified is pressed by the joint head 11 to be connected. Then, as shown in FIG. 3D, the third-layer panel side FPC 28c is further deflected, and the second-layer panel-side FPC 28b is deflected, and the common FPC 32 is moved to the third-layer and second-layer panels by the deflection. The side FPCs 28c and 28b are drawn in a direction in which the straight line (see the broken lines 33 and 36) is shortened. Thereafter, the connection portion of the first-layer panel-side FPC 28a is placed at the connection portion 25 of the common 201243444 FPC 32, and the position of the alignment is fixed, and the deviation preventing belt 34 is used at a position away from the connection portion, and the panel side 1?1 is fixed. (: 28 & and common FPC32. Thereafter, the soldering iron 35 is used to heat both ends of the joint portion, and the thermosetting adhesive 25 containing the conductive particles is appropriately melted, and the joint portion of the panel side Fpc28a and the common FPC32 is dummy. Fig. 3E is a perspective view showing a working state in which the connection portion of the panel side 1^(::28& and the common FPC32 is used to be melted by using the soldering iron 35. Fig. 3E and Fig. 3A to Fig. 3D The structural portions having the same structure are shown with the same reference numerals as those of Figs. 3A to 3D. Thereafter, as shown in Fig. 3F, the connection portion of the pseudo-melted panel side FpC28a and the common FPC 32 is connected. The head U is pressed to connect the same. Fig. 3G is a view showing a state in which the three panel side FPCs 28 are bent as shown by the solid line to the lower side of the three panels 27 as shown by the solid line ( Inside) side 'to the side of the panel FPC28c After the connection between the 28b and 28a and the common FPC 32 is completed, the state 37 which is displayed by the broken line after the deviation prevention band 34 is removed, and the common FPC 34 is connected to the control board 29 disposed inside the three panels 27 (refer to the second 2B). As shown above, the panel side FpC 28 connected to the front side is deflected, and the position of the common FPC 32 near the connection portion is shifted, and the next panel side FPC 28 is followed by the succeeding portion. In the second embodiment, the gap between the inner surface of the first layer panel 27a and the common FPC 32 is maintained at a narrow gap of 2 mm, and the panel side FPC 28 which forms a semicircle without forming a saw blade shape is formed. 19 201243444 In the second embodiment, the jig described above is characterized in that the jig has a panel side FPC 28a which is formed to deviate from the position of the thermosetting adhesive 25 containing the conductive particles shown in FIGS. 2B to 2D. When the panel side FPC 28 of 2813 is connected to the common Fpc 32, the panel side FPC is not forcibly bent and connected as in the first embodiment. Further, in the second embodiment, the ία diagram is also used. Connection The principle of the pressing of the connecting portion is the same as that of the first panel and the first panel. The 4A to 4F and the 5A to 5F are formed with heat containing conductive particles. The method of connecting the three panel side FPCs 28 of the panel side FPCs 28a and 28b of the panel-side FPCs 28a and 28b to the common FPC 32 and the illustration of the jig for the connection operation thereof is further described in the following description and drawings. The connector 11 is simply shown outside the jig, and the other configurations of the connector upper and lower mechanism portion 1A, the heater 12, the connection support portion 13, and the suction pad 14 shown in Fig. 1 are omitted. Fig. 4A is a view showing a state in which the third panel side fpC28c is connected to the common FpC32i connecting portion 25 by the connection head 11 in the normal state shown in Fig. 1A. Fig. 4B is a view showing the first connection jig 41. The second connection jig 41 has a panel mounting surface 42 having an angle (the inclination angle of 9). The panel mounting surface 42 is provided with a plurality of holes in the same manner as the upper surface 14a of the suction disk 14 of the connection device. Although the inside of the jig 41 is not shown, an adsorption power communication mechanism is provided. When the bottom surface of the second connection jig 41 is placed on the upper surface 14a of the suction disk 14 as the panel mounting surface of the connection 20 201243444 The panel suction function of the upper surface 14a of the suction disk 14 is applied to the panel mounting surface 42 having an inclination angle of an angle 0 through the adsorption function communication mechanism inside the first connection jig 41. The panel mounting surface 42 is as shown in FIG. 4A. As shown in the figure, the second panel side FPC 28c which is pressed to the third panel side FPC 28c connected to the connection portion 25 of the common FPC 32 and whose weight is 4 is positioned on the panel side FPC 28c is displayed. When the layer panel side FPC 28b is connected to the common FPC 32, as shown in Fig. 4B, the surface of the third layer panel 27c is placed on the panel mounting surface 42 having an inclination angle of an angle of 0. Fig. 4B shows that the panel is applied to the panel. Transmissive adsorption function of the mounting surface 42 The state in which the adsorption action of the mechanism acts on the surface of the third layer panel 27c. The panel mounting surface 42 of the panel mounting surface 42 is placed on the third panel side FPC 28c and the second panel side FPC 28b which are stacked in two layers as described above. At this time, the inclination angle Θ of the panel mounting surface 42 is set such that the rear portion 28b-1 of the front end of the second panel side FPC 28b is just overlapped with the connection portion 25 corresponding to the common pC32. The 4C figure shows In the state of the state, the connection portion 28b-1 which is positioned so as to overlap the front end of the second panel side FPC 28b of the connection portion 25 of the common FPC 32 is heated by the soldering iron 35 along the connection portion 25 The thermosetting adhesive 25 containing conductive particles is melted, and the panel side FPC2 8 b and the joint portion 25 of the common FPC 3 2 are fused. Fig. 4D shows the use of the soldering iron 35 to make the panel side FpC28b and the common 21 201243444 The solid portion of the connection portion 25 of the FPC 32 is in a pseudo-melting state. The components having the same structure as shown in FIG. 4A to FIG. 4A to FIG. 4C are denoted by the same reference numerals as those of FIGS. 4a to 4C. Display. Fig. 4E shows that it will be as shown in Figure 4C and Figure 4D. The connection portion 25 of the panel portion FPC 28b that has been falsely melted and the connection portion 25 of the common FPC 32 are pressed by the connector 11 to be in a state of connection. The fourth FF shows the state in which the state is The second connection jig "takes out the two pieces of the third layer panel side FPC 28c and the second layer panel side ppc28b and the common FPC 32, and the intermediate portion 43 composed of the panel side fpc28c and the common FPC32. Fig. 5A is a view for explaining the reason why the intermediate portion μ is taken out from the first connecting device 41. In the above-described next connection, the first layer panel side FPC 28a is superposed on the second layer board side FPC 28b of the intermediate portion 43, and the rear portion 27a-1 is connected to the junction portion 25 of the common FPC 32. However, the interval between the front end (adjacent portion) of each panel side FPC 28 as described above and the interval between the rear portions 25 of the common FPC 32 are shifted. Therefore, when the three overlapping panels 27 are directly placed on the first connecting jig 41, the connecting portion 27a-1 of the panel side FPC 28a is not overlapped with the connecting portion 25 of the common FPC 32 at an appropriate position. That is, positional deviation is caused between each other. Therefore, it is necessary to pull the common FPC 32 toward the side of the panel 27 indicated by the arrow j to solve the positional deviation. Therefore, the second connection jig 44 is used to bring the connection portion 27a-1 of the panel side FPC 28a closer to the common FPC 32, and to overlap the connection portion 32 of the common FPC 32 instead of bringing the common FPC 32 closer. The second connection jig 44 is also formed to be inclined by the panel mounting surface 45. Further, the angle 22 of the 2012 201244 44 is formed to be larger than the inclination angle 0 of the panel mounting surface 42 of the first connecting jig 41. Here, when the common FPC 32 is fixed to the second connecting jig 44 and the panel 27 is placed on the panel mounting surface 45, the panel 27 is inclined more than the first connecting ear 41. When the panel 27 is tilted, the bending of the third layer and the second panel side FPCs 28c and 28b of the connected common FPC 32 and the bending curvature of the first panel side FPC 28a which is naturally bent thereafter are changed. This curvature is changed in a certain angle to increase the amount of tilt angle. Therefore, in the first connecting jig 41, the connecting portion 27a-1 of the panel side FPC 28a of the connecting portion 32 of the common FPC 32 cannot reach the connecting portion 25 at the second connecting jig 44 having a large inclination angle. As shown in Fig. 5A, the second connection jig 44 has a shorter length k than the first connection jig 41. Further, the inclination angle <5 of the panel mounting surface 45 is larger than the inclination angle 0 of the first connection jig 41. The change between the two is complementary. When the second connecting jig 44 is used, the rear portion 27a-1 of the panel side FPC 28a can be attached to the rear portion 32. Fig. 5B is a view showing a state in which the soldering iron 35 is used to make the rear portion 28a-l of the first layer panel side FPC 28a of the panel 27 on which the three pieces of the second connection jig 44 are stacked as described above. Melted in the junction 25 of the common FPC 32. Fig. 5C is a perspective view showing the operational state of the pseudo melting of Fig. 5B. In the fifth embodiment, the same components as those shown in Figs. 5A and 5B are denoted by the same reference numerals as those in Figs. 5A and 5B. Fig. 5D shows a state in which the connecting portion 25 of the FMC 28a of the pseudo-melted panel side FPC 28a is pressed by the connecting head 11 to connect 23 201243444 δ. In the above-described state, the third state of the third panel side Fp (: 28c, the second panel side FPC 28b, and the second layer panel side FpC28a and the common 卯〇 2 are taken out from the second connection jig 44. The connection is completed, and the completed portion 46 composed of the panel-side FPCs 28c, 28b, and 28a and the common FPC 32. The fifth F11 shows a state in which the three panel side FPCs 28 are drawn as shown by the solid line. In the arc-like manner, the inner side of the three-piece panel 27 is bent to connect the common FPC 32 to the inside of the three-piece panel 27 in a state of completion of the partial mailing from the fifth drawing shown in phantom (panel side FPC28a) As described above, in the second embodiment, the second and second connection jigs are used, and the position between the subsequent portions is shifted by the inclination of the panel. Do not use to prevent deviation from the underside alignment and then. As shown in Fig. 2C, the gap between the inner surface of the first layer panel 27a and the common FpC32 is maintained at a narrow gap of 2 mm, and the panel side FpC28i which is formed into a semicircle without forming a saw blade shape is formed. Fig. 6A, Fig. 6B The figure shows the relationship between the inclination of the panel 27 and the extension of the front end of the panel side fpc 28. Further, FIG. 6A is a view showing a simple explanation, a case where the display panel 27 is overlapped by two, and a first connection jig as a connection jig is displayed. 41. As shown in FIG. 6A, 'the position where the two overlapping panels 27 (27c, 27b) are placed on the solid line of the first connecting jig 41 is at the position of the dotted line at the mounting position of the second connecting jig 44, When the inclination is increased, the front end of the 1% joint portion 28b-1 of the panel side FPC 28b of the panel 27b which is to be connected later is extended forward by 24 201243444. However, when the inclination is increased, the joint portion is increased. The front end of the bird slave does not extend without limitation. Fig. 6B is a graph showing the relationship between the inclination of the panel 27 and the extension of the front end of the panel side 28. The same chart is based on the experimental value as shown in the graph 'at an angle of inclination from 5 To 30., to the target location ( The difference m in the position of the connecting portion 25) is gradually shortened from 〇.37 mm to 0.02 mm. However, when the inclination is greater than 30, the claw is increased to 45 in the vertical position by (4), for example, claws, 〇.29 mm. Therefore, the tilt of the panel mounting table to which the jig is attached is appropriately determined by using the graph shown in Fig. 6B. In the above example, the example in which three liquid crystal panels are stacked is described, but is not limited thereto, as long as liquid crystal The panel can be a plurality of layers of two or more layers. Industrial availability can be utilized in a connection method and a connection jig for connecting a liquid crystal panel and an FPC (Flexible Primed Circuits) for connecting a signal processing substrate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a diagram showing a connection method of a panel-side FPC for a signal input line of a liquid crystal panel and a subsequent connection device for a common FPC of a signal for controlling a substrate. — Figure 1 shows a diagram showing the state of the next position of the panel side FPC and the common Fpc. In Fig. 1C, the connector is lowered to the next position to thermally press the connection between the panel side FPC and the common FPC. The second AS) is a view showing a panel side FPC of a transparent resin panel (panel) and a signal input line extending for the panel. 25 201243444 Fig. 2B is a view showing a positional relationship between the panel side FPC and the common FPC before connection, and a state in which the panel side FPC is bent to the inside of the panel and connected to the control board after the connection. Fig. 2C is a schematic diagram showing a length obtained by enlarging the curved portions of the three panel side FPCs which are respectively extended from the three overlapping panels. Fig. 2D is a view showing the amount of deviation of the thermosetting adhesive containing conductive particles and the amount of deviation from the front end of the panel side FPC, respectively, derived from the relationship calculated from Fig. 2C. Fig. 3A is a view showing a state in which the third layer panel side FPC is pressed against the joint of the connection device by the connection head of the connection device in the ordinary portion of the thermal curing adhesive containing the conductive particles of the common FPC. And the linker. Fig. 3B is a view showing a state in which the third panel side FPC is deflected, and the common FPC is pulled to the panel side by the deflection. Fig. 3C is a view showing a state in which the connection portions of the panel side Fpc and the common fpc which have been falsely melted are pressed by the joint head to connect them. 3D is a view showing a state in which the third panel side FPC is further deflected, and the second panel side Fpc is deflected, and the common FPC is pulled, and the soldering iron is used to heat the connection portion. The thermosetting adhesive containing conductive particles is melted, and the panel side Fpc and the common Fpc are pseudo-molten. Fig. 3E is a perspective view of the following state (Fig. 3); the state is the third panel side; the FPC is flexed in the same manner, and the second panel side is slid and the commonality is brought closer. In FPC, a soldering iron is used to heat the joint, and the heat-hardening adhesive containing conductive particles is melted, and the panel side is combined with the common fuse 26 201243444 FPC. Fig. 3F is a view showing a state in which the connection portion between the panel side Fpc and the common portion which has been falsely melted is pressed by the pressing head to make the connection. The first system shows a diagram of the state in which the above-mentioned state is as solid as it is, and the three (four) opposite sides are bent like arcs to the underside (inside) of the three panels to obtain FPC from the panel side and the common Fpc. The connection is completed in a state in which the dotted line is not displayed. The common FPC is connected to the connector of the control board disposed inside the % panel. Fig. 4A is a view showing a state in which the third panel side FPC is borrowed from the joint in a normal state to be pressed against the joint of the common FPC. Figure 4B shows the first! A diagram in which the connection jig and a panel in which two overlapping panels are placed on the panel mounting surface are provided. Fig. 4C is a view showing a state in which the rear portion of the second layer pure side Fpc which is positioned to overlap the junction of the common FPC is heated by a soldering iron, and the heat hardening adhesive containing conductive particles is dazzled. Melt, while making the panel side FPC with the common FPC pseudo-molder. 4D is a three-dimensional view showing a state in which the foot is placed on the second panel side Fpc of the joint portion of the common Fpc, and is heated by a soldering iron to contain The thermally hardened adhesive of the conductive particles melts, and the panel side FPC and the common Fpc pseudo-molder. Fig. 4E is a view showing a state in which the connection portion between the succeeding portion of the panel side Fpc and the common FPC which has been falsely melted is pressed by the joint head. The 4F figure shows the following state, and the above state is from the first! The connection jig takes the intermediate portion formed by the two overlapping third panel side FPCs and the second panel side Fpc 'commonization 27 201243444 FPC. Fig. 5A is a view for explaining the reasons for the difference between the second layer and the third layer. The first touch screen shows a state in which the soldering iron is used, and the succeeding portion of the first layer panel side FPCa placed on the three overlapping panels of the second connection jig is pseudo-melted to the common Fpc. Part. Fig. 5C is a perspective view showing the working state of the false sleek in Fig. 5B. The first milk map shows a state in which the joint portion of the panel side Fpc that has been falsely melted and the joint portion of the common F P C are connected to each other. Fig. 5E is a view showing a state in which the third, second, and second w-pieces from the second connection jig are overlapped from the board side Fpc and the common coffee is completed. Part of the completion of the FPC job. Fig. 5F is a view showing a state in which the three panel side FPCs are bent as shown by a solid line to the upper (inner) side of the three panels to be common to the panel side FPC. The connection of the Fpc is completed in a state shown by a broken line, and the common FPC is connected to the connector of the control board disposed inside the three panels (the upper side in the drawing). Fig. 6A is a view (1) showing the relationship between the inclination of the panel and the extension of the front end of the panel side Fpc. Fig. 6B is a diagram (2) showing the relationship between the inclination of the panel and the extension of the front end of the panel side F p c . Fig. 7A is a view schematically showing the connection relationship of F P C and the wiring technique of the conventional multilayered flexible substrate in a manner that is easy to understand. Fig. 7B is a diagram (2) showing the connection relationship of FPC and the wiring technique of the conventional substrate in a manner that is easy to understand. [Main component symbol description 1...LCD panel
2(2a-2c),18,28(28a-28c)...面板 側FPC 3.. .信號處理基板 4.31.. .連接器 5.19.32.. .共通化卩卩€ 6.··共通化連接部 7,25·.·熱硬化接著劑 10…連接頭上下機構部 11.··連接頭 1 la…虛線 Π…加熱器 13.. .連接支撐板 14.. .吸附盤 14a…上面 15…真空聚 16…管 17…液晶面板 21,23…撓性樹脂膜 22,24…印刷配線 26.. .導電性粒子 27(27a-27c)...面板 27a-l…接著部 28a-l...連接部 28b-l…接著部 29…控制基板 33,36··.直線位置 34···防止偏離帶 35…烙鐵 3 7…緊接在連接完畢後之狀態 38…彎曲部之圓弧 41…第1連接夾具 42 ’ 45…面板載置面 43...中間部份 44…第2連接夾具 46…完成部份 a,c，d,g,h,i,j…箭號 bl-b6...箭號 e…2點鏈線 f...鏈線 L1-L3…面板側FPC28之長度 rl-r3...曲率半徑 θ，<5…角度 292(2a-2c),18,28(28a-28c)...panel side FPC 3..Signal processing substrate 4.31.. .connector 5.19.32.. .Communication 6.€··· Connecting portion 7, 25·.·thermal hardening adhesive 10... connector head upper and lower mechanism portion 11.··connecting head 1 la...dashed line 加热器...heater 13... connecting support plate 14.... adsorption plate 14a...above 15...vacuum poly 16...tube 17...liquid crystal panel 21,23...flexible resin film 22,24...printed wiring 26..electroconductive particle 27 (27a-27c)...panel 27a-l...adjacent portion 28a- l...connecting portion 28b-1;adjoining portion 29...control board 33,36··.linear position 34···preventing the offset strip 35...the soldering iron 3 7...the state immediately after the connection is completed 38...the bent portion Arc 41...1st connection jig 42'45...panel mounting surface 43...intermediate part 44...2nd connection jig 46...complete part a,c,d,g,h,i,j...arrow Bl-b6...arrow number e...2 point chain line f...chain line L1-L3...the length of the panel side FPC28 rl-r3...curvature radius θ, <5...angle 29