1375491 六、發明說明： 【發明所屬之技術領域】 本發明疋有關於—種電路板，且制是㈣於一種可 撓性電路板及其在平面顯示H上的應用。 【先前技術】 由於平面顯示器具有輕薄且體積小等優勢，再加上近 幾年平面顯不技術的蓬勃發展，使得平面顯示器已成為目 刖顯料備的市場主流。—般而言，常見的平面顯示器包 括液晶顯示器（LCD)以及電漿顯示器。 目刖，為因應平面顯示器之解析度的提高以及各製造 廠所推行之降低成本政策，捲帶自動接合(丁叩61375491 VI. Description of the Invention: [Technical Field] The present invention relates to a circuit board, and is a (4) flexible circuit board and its application to a flat display H. [Prior Art] Due to the advantages of thinness and small size of flat-panel displays, coupled with the rapid development of flat-panel display technology in recent years, flat-panel displays have become the mainstream of the market. In general, common flat panel displays include liquid crystal displays (LCDs) and plasma displays. It is witnessed that in response to the improvement of the resolution of flat panel displays and the cost reduction policy implemented by various manufacturers, the tapes are automatically joined (Ding Wei 6
AutomatedAutomated
Bonding ’ TAB)/覆晶薄膜（chip 〇n Film ; C〇F)之多重導線 (Multi-Channel)接合技術已廣受採用。TAB/COF多重導線 之概念為具有相同寬度之TAB/c〇F帶中設置有更多之導 線，因此每一導線相對應之間隔必須縮小。舉例而言，在 液晶模組之接合(LCM Bonding)製程中，因面板解析度提高 的需求，而使面板之接腳端子(Lead)的數量激增，其接腳 端子的數量可能較過去之面板多了一倍’如此，在二定佈 局空間中，接腳端子數的增加也代表了接腳端子本身的寬 度與相鄰二接腳端子之間的間距均要相對縮減。隨著接腳 端子之寬度與間距的縮減，相對應之製程精度的需求則更 高，其中製程精度包括TAB/COF帶之製程精度與液晶模組 之對位接合精度。對於液晶模組的組裴廠而言，液晶模組 之對位接合精度相形之下更為重要。 ' 1375491 在目前的液晶模組對位接合製程中，大都利用異方性 導電膠(ACF)來接合ΤΑΒ/COF帶與面板及印刷電路板。請 參照第1圖’其係繪不傳統覆晶薄膜帶與印刷電路板之接 合剖面示意圖。利用異方性導電膠108來接合覆晶薄膜帶 100與印刷電路板102時’通常係利用上壓著刀頭u〇壓 制覆晶薄膜帶1〇〇，並利用下壓著刀頭112承載印刷電路 板102 ’以將覆晶薄膜帶100與印刷電路板1 〇2相對壓合。 其中，接合覆晶薄膜帶100之接腳端子104與印刷電路板 102之接腳端子106時，一般需將異方性導電膠之溫 度提升至約140°C。然而，加熱異方性導電膠1〇8時，通 常係透過加熱上壓著刀頭110與下壓著刀頭112,並透過熱 傳導方式來加熱異方性導電膠108，但由於熱傳導過程中 熱量會有相當程度的損失’因此上壓著刀頭11〇可能需加 熱至400°C以上，如此使得覆晶薄膜帶1〇〇本體的溫度相 當接近於壓制在上頭之上壓著刀頭11〇的溫度。在此同 時，下壓著刀頭112之溫度卻只控制在約7(rc，如此使得 覆晶薄膜帶1〇〇與印刷電路板102之本體的溫度之間具有 高達約200 C以上的差異。再加上，覆晶薄膜帶丨與印 刷電路板102之材質不同，因而覆晶薄膜帶1〇〇與印刷電 路板102之膨脹係數不同，進而導致覆晶薄膜帶1〇〇與印 刷電路板102之膨脹量有明顯差異。 受到覆晶薄膜帶100與印刷電路板1〇2之材料的熱膨 脹係數差異、以及覆晶薄膜帶1 〇〇與印刷電路板1 〇2在接 合過程中的溫度差異的影響，會導致覆晶薄膜帶1〇〇與印 刷電路板102的膨脹收縮量不同，進而造成覆晶薄膜帶1〇〇 1375491 •上之接腳端子與印刷電路板i〇2上之接腳端子i〇6產 生接合偏差的問題。因此，在液晶模組的接合製程中，常 .需為了接合偏移的問題來調整製程條件，如此一來，不僅 會使得生產排程產生混亂，製程品質更是難以掌控。 【發明内容】 因此，本發明之目的就是在提供一種可撓性電路板， 其可撓性基板之眾多輸出導線、與輸入導線之間分別設有 # 數個熱膨脹缓衝部，如此可使熱膨脹緩衝部所分隔出之每 一段輸出導線區與輸出導線區均可在不事先預設收縮量的 情況下，仍保持在與面板或印刷電路板之間的接合的需求 * 規格内。 - 本發明之另一目的是在提供一種平面顯示面板，其可 撓性電路板之輸出導線之間與輸入導線之間均勻地設置有 熱膨脹緩衝部’因而可有效控制膨脹量，以降低膨脹量的 影響，而可設計出更大的可撓性電路板，因此可減少可撓 • 性電路板的使用數量，進而可降低成本。此外，由於膨脹 量可獲得控制，因此可提高平面顯示面板之接合製程的品 質。 . 本發明之又一目的是在提供一種平面顯示器，其顯示 模組製程中可因所使用之可撓性電路板的數量減少，而降 低製程時間，並可縮減製程所需之人力物力。 根據本發明之上述目的’提出一種可撓性電路板，至 少包括：一可橈性基板；一積體電路設於可撓性基板上； 複數個輸入導線設於可撓性基板之一侧上，並與積體電路 1375491 電性連接，其中可撓性基板包括複數個第一熱膨脹緩衝部 設於輸入導線之中’而將輸入導線分隔成複數個輸入導線 區；以及複數個輸出導線設於可撓性基板之另一侧上，並 與積體電路電性連接’其中可撓性基板包括複數個第二熱 膨脹緩衝部設於輸出導線之中，而將輸出導線分隔成複數 個輸出導線區。 【實施方式】 本發明揭露一種可撓性電路板及其在平面顯示面板與 平面顯示器上的應用。為了使本發明之敘述更加詳盡與完 備，可參照下列描述並配合第2圖至第7圖之圖式。 請參照第2圖，其係繪示依照本發明第一較佳實施例 的一種可撓性電路板之上視示意圖。本示範實施例之可撓 性電路板200a可例如為覆晶薄膜帶或捲帶自動接合帶，而 可適用於一般平面顯示裝置，例如液晶顯示器或電漿顯示 器等之平面顯示模組與外部訊號之電性接合介面。可撓性 電路板200a主要包括可撓性基板202a、積體電路204、數 條輸入導線206以及數條輸出導線208,其中積體電路204 一般可為驅動積體電路，以驅動平面顯示模組等顯示單 元。積體電路204通常設於可撓性基板202a之中心區域， 而輸入導線206與輸出導線208通常係分別設於積體電路 204之二侧的可撓性基板202a上。在本示範實施例中，這 些輸入導線206與輸出導線208之一端均透過埋設在可撓 性基板202a内部之導線而與積體電路204接合，以形成電 性連接，而另一端則分別朝可撓性基板202a的二侧邊210 1375491 與212延伸。對於平面自 ^ ^ 十囟顯不裝置而言，其可撓性電路板200a 所需之輸入導線206之盔直、3 a 土 ， /|s。 <數里通常遠較輸出導線208之數量 在本不1&實施例中’可撓性電路板20〇a之可撓性基板 202a設有數個熱膨脹緩衝部心與服。盆中，軌膨服 緩衝部214a等距地設置在輸入導線施之中，以將全部之 輸入導線206分隔成數個實f等長之輸入導線區218 ;而 同樣地’熱膨脹緩衝部2l6a等距地設置在輸出導線之 中’以將全部之輸出導線施分隔成數個實質等長之輸入 導線區220。因此，每個輸入導線區218之長度實質 相等，且母個輸出導線區22〇之長度224實質相等。在一 實施例中，輸入導線206之寬度Wl與相鄰二輸入導線206 之間距Pl實質相等，而輸出導線208之寬度W2與相鄰二 輸出導線208之間距A實質相等。在本示範實施例中，熱 膨脹緩衝部214a與216a均為穿透式開孔，且熱膨脹緩衝 部214a穿透可撓性基板202a之側邊210，熱膨脹缓衝部 216a穿透可撓性基板202a之側邊212。 設置熱膨脹緩衝部214a與216a時，熱膨脹緩衝部214a 與216a之數量可依實際產品設計需求決定。在一較佳實施 例中，熱膨脹缓衝部214a(或熱膨脹缓衝部216a)之設置規 則可為’設有輸入導線206(或輸出導線208)之可撓性基板 202a的長度L除以所欲分出之輸入導線區218數量X〗（或 輸入導線區220數量χ2)所獲得的比值，再乘上可撓性基板 202a與預設接合基板，例如印刷電路板或平面顯示面板之 玻璃基板，之間的相對膨脹係數ε後，需小於輸入導線206 1375491 之寬度W〗（或輸出導線208之寬度Wz)的2/3，亦即上“〈 |Wl(或去吾W2)。在一實施例中，根據設計經驗法則， 可撓性基板202a與預設接合基板之間的相對膨脹係數£ 可為0·01%。此外，設有輸入導線2〇6(或輸出導線2〇8)之 可撓性基板202a的長度L除以所欲分出之輸入導線區218 數重Χι(或輸入導線區220數篁X2)所獲得的比值，再乘上 可撓性基板202a與預设接合基板之間的相對膨脹係數^ 後’較佳係小於熱膨服缓衝部214a的寬度匕（或熱膨脹緩 衝部21如的寬度hO，亦即或上xf<h )。 1 X2 本發明之可換性電路板可具有多種變化。請參照第3 圖’其係繪示依照本發明第二較佳實施例的一種可撓性電 路板之上視示意圖。同樣地，在可挽性電路板2〇〇b中，其 可挽性基板202b設有數個熱膨服緩衝部214b與216b，其 中熱膨脹緩衝部214b與216b分別等距地設置在輸入導線 206與輸出導線208之中’以分別將全部之輸入導線206 分隔成數個實質等長之輸入導線區218、以及將全部之輸 出導線208分隔成數個實質等長之輸入導線區220。在本 示範實施例中，熱膨脹緩衝部214b與216b同樣均為穿透 式開孔，但與上述第一實施例之可撓性電路板200a不同的 是’可撓性電路板200b之熱膨脹緩衝部214b並未穿透可 撓性基板202b之側邊210，且熱膨脹緩衝部216b也並未 穿透可撓性基板202b之側邊212。 第4圖係繪示依照本發明第三較佳實施例的一種可撓 性電路板之上視示意圖。相同地，在可撓性電路板200c 中’其可撓性基板202c亦設有數個熱膨脹緩衝部214c與 9 1375491 216c，其中熱膨脹缓衝部214c與216c分別等距地設置在 輸入導線206與輸出導線208之中，以將全部之輸入導線 206分隔成數個實質等長之輸入導線區218、以及將全部之 輸出導線208分隔成數個實質等長之輸入導線區220。在 本示範實施例中，與上述實施例之可撓性電路板200a及 200b不同的是，熱膨脹缓衝部214c與216c係均為切痕式 開孔。 請參照第5圖，其係繪示依照本發明第四較佳實施例 的一種可撓性電路板之上視示意圖。在可撓性電路板200d 中’其可撓性基板202d同樣設有數個熱膨脹緩衝部214d 與216d，其中熱膨脹緩衝部214d與216d分別等距地設置 在輸入導線206與輸出導線208之中，而分別將全部之輸 入導線206分隔成數個實質等長之輸入導線區218、以及 將全部之輸出導線208分隔成數個實質等長之輸入導線區 220。在本示範實施例中，熱膨脹緩衝部214d與216d同樣 均為穿透式開孔，但與上述實施例之可撓性電路板200a、 200b與200c不同的是，可撓性電路板200d之熱膨脹緩衝 部214d包括數個穿透式開孔226 ’且熱膨脹緩衝部2l6d 也包括數個穿透式開孔228，其中這些穿透式開孔226與 228可例如為類似郵票孔般的開孔。 請參照第6圖，其係繪示依照本發明第五較佳實施例 的一種可撓性電路板之上視示意圖。相同地，在可撓性電 路板200e中，其可撓性基板202e同樣設有數個熱膨脹緩 衝部214e與216e，其中熱膨脹緩衝部214e與216e分別等 距地設置在輸入導線206與輸出導線208之中，而分別將 1375491Bonding ‘TAB)/Chip 〇n Film (C〇F) multi-channel bonding technology has been widely adopted. The concept of the TAB/COF multiple conductors is that more conductors are provided in the TAB/c〇F strips of the same width, so the spacing of each conductor must be reduced. For example, in the LCM Bonding process, the number of pin terminals of the panel is greatly increased due to the increased resolution of the panel, and the number of pin terminals may be larger than that of the past. This is doubled. Thus, in the second layout space, the increase in the number of pin terminals also represents a relative reduction in the width of the pin terminals themselves and the spacing between adjacent two pin terminals. As the width and spacing of the pin terminals are reduced, the corresponding process accuracy requirements are higher. The process accuracy includes the process accuracy of the TAB/COF tape and the alignment accuracy of the liquid crystal module. For the group of liquid crystal modules, the alignment accuracy of the liquid crystal module is more important. ' 1375491 In the current liquid crystal module alignment bonding process, most of the anisotropic conductive adhesive (ACF) is used to bond the ΤΑΒ/COF tape to the panel and the printed circuit board. Please refer to Fig. 1 for a schematic cross-sectional view of a conventional flip chip tape and a printed circuit board. When the anisotropic conductive paste 108 is used to bond the flip chip tape 100 to the printed circuit board 102, the flip chip tape 1 is usually pressed by the upper pressing head, and the printing is carried out by pressing the cutter head 112. The circuit board 102' presses the flip chip tape 100 against the printed circuit board 1 〇2. Wherein, when the pin terminal 104 of the flip chip strip 100 and the pin terminal 106 of the printed circuit board 102 are bonded, the temperature of the anisotropic conductive paste is generally raised to about 140 °C. However, when the anisotropic conductive paste 1〇8 is heated, the anisotropic conductive paste 108 is usually heated by heat-pressing the cutter head 110 and pressing the cutter head 112, and is thermally transferred, but due to heat during heat conduction. There will be a considerable loss 'so the upper head 11 〇 may need to be heated to above 400 ° C, so that the temperature of the flip-chip film 1 〇〇 body is quite close to pressing the tip 11 above the upper head The temperature of the crucible. At the same time, the temperature at which the cutter head 112 is pressed is controlled to only about 7 (rc) such that the difference between the temperature of the flip chip strip 1 〇〇 and the body of the printed circuit board 102 is as high as about 200 C or more. In addition, the flip-chip film tape is different from the material of the printed circuit board 102, so that the flip-chip film tape 1 has a different expansion coefficient from the printed circuit board 102, thereby causing the flip chip tape 1 and the printed circuit board 102. There is a significant difference in the amount of expansion. The difference in thermal expansion coefficient between the material of the flip chip strip 100 and the printed circuit board 1 〇 2, and the difference in temperature between the flip chip strip 1 〇〇 and the printed circuit board 1 〇 2 during bonding The effect is that the flip-chip film strip 1 〇〇 is different from the expansion and contraction amount of the printed circuit board 102, thereby causing the flip chip terminal 1 1 1375491 on the pin terminal and the pin terminal on the printed circuit board i 〇 2 I〇6 has a problem of joint deviation. Therefore, in the bonding process of the liquid crystal module, it is often necessary to adjust the process conditions for the problem of the joint offset, so that not only the production schedule is confusing, but also the process quality is improved. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a flexible circuit board having a plurality of output expansion wires and a plurality of thermal expansion buffer portions between the input wires and the input wires. Each of the output lead regions and the output lead regions that can be separated by the thermal expansion buffer can be maintained within the requirements of the joint* with the panel or the printed circuit board without a predetermined amount of contraction. - Another object of the present invention is to provide a flat display panel in which a thermal expansion buffer portion is uniformly disposed between output wires of a flexible circuit board and an input wire, thereby effectively controlling the amount of expansion to reduce the amount of expansion The effect is to design a larger flexible circuit board, thus reducing the number of flexible circuit boards used, thereby reducing the cost. In addition, since the amount of expansion can be controlled, the flat display panel can be improved. The quality of the bonding process. A further object of the present invention is to provide a flat panel display which can be used in the process of the display module. The number of the circuit boards is reduced, and the process time is reduced, and the manpower and material resources required for the process are reduced. According to the above object of the present invention, a flexible circuit board is proposed, which comprises at least: an sizable substrate; an integrated circuit The plurality of input wires are disposed on one side of the flexible substrate and electrically connected to the integrated circuit 1347494. The flexible substrate includes a plurality of first thermal expansion buffers disposed on the input wires. And dividing the input wire into a plurality of input wire regions; and the plurality of output wires are disposed on the other side of the flexible substrate and electrically connected to the integrated circuit, wherein the flexible substrate includes a plurality of The two thermal expansion buffers are disposed in the output wires, and the output wires are divided into a plurality of output conductor regions. [Embodiment] The present invention discloses a flexible circuit board and its application to a flat display panel and a flat panel display. In order to make the description of the present invention more detailed and complete, reference is made to the following description in conjunction with the drawings of Figures 2 through 7. Referring to Figure 2, there is shown a top plan view of a flexible circuit board in accordance with a first preferred embodiment of the present invention. The flexible circuit board 200a of the exemplary embodiment can be, for example, a flip-chip film tape or a tape automatic bonding tape, and can be applied to a general flat display device, such as a flat display module such as a liquid crystal display or a plasma display, and an external signal. Electrically bonded interface. The flexible circuit board 200a mainly includes a flexible substrate 202a, an integrated circuit 204, a plurality of input wires 206, and a plurality of output wires 208. The integrated circuit 204 can generally be a driving integrated circuit for driving the planar display module. Display unit. The integrated circuit 204 is generally disposed in a central region of the flexible substrate 202a, and the input wires 206 and the output wires 208 are generally disposed on the flexible substrate 202a on both sides of the integrated circuit 204, respectively. In the exemplary embodiment, one of the input wires 206 and the output wires 208 are connected to the integrated circuit 204 through wires embedded in the flexible substrate 202a to form an electrical connection, and the other ends are respectively The two sides 210 1375491 and 212 of the flexible substrate 202a extend. For the planar self-discrimination device, the flexible input circuit board 200a requires the input wires 206 to be straight, 3 a soil, /|s. <The number is usually much smaller than the number of output wires 208. In the present embodiment, the flexible substrate 202a of the flexible circuit board 20A is provided with a plurality of thermal expansion buffers. In the basin, the rail expansion buffer portion 214a is equidistantly disposed in the input wire to divide all of the input wires 206 into a plurality of input wire regions 218 of the same length of f; and similarly, the thermal expansion buffer portion is equidistant. The ground is disposed in the output conductors to divide all of the output conductors into a plurality of input conductor regions 220 of substantially equal length. Thus, each input conductor region 218 is substantially equal in length and the lengths 224 of the parent output conductor regions 22 are substantially equal. In one embodiment, the width W1 of the input conductor 206 is substantially equal to the distance P1 between the adjacent two input conductors 206, and the width W2 of the output conductor 208 is substantially equal to the distance A between the adjacent two output conductors 208. In the exemplary embodiment, the thermal expansion buffer portions 214a and 216a are both transmissive openings, and the thermal expansion buffer portion 214a penetrates the side 210 of the flexible substrate 202a, and the thermal expansion buffer portion 216a penetrates the flexible substrate 202a. Side 212. When the thermal expansion buffer portions 214a and 216a are provided, the number of the thermal expansion buffer portions 214a and 216a can be determined according to actual product design requirements. In a preferred embodiment, the thermal expansion buffer portion 214a (or the thermal expansion buffer portion 216a) may be arranged such that the length L of the flexible substrate 202a provided with the input lead 206 (or the output lead 208) is divided by The ratio obtained by dividing the number of input conductor regions 218 (or the number of input conductor regions 220 χ 2), and multiplying the flexible substrate 202a with a predetermined bonding substrate, such as a printed circuit board or a glass substrate of a flat display panel After the relative expansion coefficient ε, it needs to be less than 2/3 of the width W of the input wire 206 1375491 (or the width Wz of the output wire 208), that is, "< |Wl (or go to W2). In the embodiment, according to the design rule of thumb, the relative expansion coefficient between the flexible substrate 202a and the predetermined bonding substrate may be 0·01%. In addition, the input wire 2〇6 (or the output wire 2〇8) is provided. The length L of the flexible substrate 202a is divided by the ratio of the number of input conductor regions 218 to be divided (or the number of input conductor regions 220 x 2), and then multiplied by the flexible substrate 202a and the predetermined bonding The relative expansion coefficient between the substrates is preferably 'less than the thermal expansion buffer portion 214a Width 匕 (or the width h0 of the thermal expansion buffer portion 21, that is, or xf<h). 1 X2 The replaceable circuit board of the present invention can have various variations. Please refer to FIG. 3, which is illustrated in accordance with the present invention. A top view of a flexible circuit board according to a second preferred embodiment. Similarly, in the slidable circuit board 2'b, the slidable substrate 202b is provided with a plurality of thermal expansion buffers 214b and 216b. Wherein the thermal expansion buffers 214b and 216b are disposed equidistantly between the input conductors 206 and the output conductors 208, respectively, to separate all of the input conductors 206 into a plurality of substantially equal length input conductor regions 218, and all of the output conductors 208 is divided into a plurality of input conductor regions 220 of substantially equal length. In the exemplary embodiment, the thermal expansion buffer portions 214b and 216b are both transmissive openings, but different from the flexible circuit board 200a of the first embodiment described above. The thermal expansion buffer portion 214b of the flexible circuit board 200b does not penetrate the side 210 of the flexible substrate 202b, and the thermal expansion buffer portion 216b does not penetrate the side 212 of the flexible substrate 202b. Drawings are shown in accordance with this issue A top view of a flexible circuit board of the third preferred embodiment. Similarly, in the flexible circuit board 200c, the flexible substrate 202c is also provided with a plurality of thermal expansion buffers 214c and 9 1375491 216c, wherein The thermal expansion buffers 214c and 216c are disposed equidistantly between the input conductor 206 and the output conductor 208 to separate all of the input conductors 206 into a plurality of substantially equal length input conductor regions 218, and to separate all of the output conductors 208. A plurality of input conductor regions 220 of substantially equal length are formed. In the present exemplary embodiment, unlike the flexible circuit boards 200a and 200b of the above-described embodiment, the thermal expansion buffer portions 214c and 216c are both incision openings. Referring to Figure 5, there is shown a top view of a flexible circuit board in accordance with a fourth preferred embodiment of the present invention. In the flexible circuit board 200d, the flexible substrate 202d is also provided with a plurality of thermal expansion buffer portions 214d and 216d, wherein the thermal expansion buffer portions 214d and 216d are disposed equidistantly between the input wire 206 and the output wire 208, respectively. All of the input conductors 206 are separated into a plurality of substantially equal length input conductor regions 218, and all of the output conductors 208 are separated into a plurality of substantially equal length input conductor regions 220. In the present exemplary embodiment, the thermal expansion buffer portions 214d and 216d are both transmissive openings, but unlike the flexible circuit boards 200a, 200b and 200c of the above embodiment, the thermal expansion of the flexible circuit board 200d The buffer portion 214d includes a plurality of penetrating openings 226' and the thermal expansion buffer portion 216d also includes a plurality of penetrating openings 228, wherein the penetrating openings 226 and 228 can be, for example, apertures like stamp holes. Referring to Figure 6, there is shown a top view of a flexible circuit board in accordance with a fifth preferred embodiment of the present invention. Similarly, in the flexible circuit board 200e, the flexible substrate 202e is also provided with a plurality of thermal expansion buffer portions 214e and 216e, wherein the thermal expansion buffer portions 214e and 216e are disposed equidistantly between the input wire 206 and the output wire 208, respectively. In, and separately will be 1374941
全部之輸入導線206分隔成數個實質等長之輸入導線區 218、以及將全部之輸出導'線成數個實質等長之輸 入導線區220。在本示範實施例中’與上述實施例之可換 性電路板200a、200b、200(；與200d不同的是，可挽性電 路板200e之熱膨脹緩衝部214e與2l6e均 構，熱膨脹缓衝部214e與216e係厚度減薄之區=也= 是說，熱膨脹緩衝部⑽與⑽之厚度較輸入導線區218 與輸出導線區220的厚度薄。藉由縮減可撓性基板廳中 熱膨脹緩衝部2i4e與216e的厚度，可縮減熱膨脹緩衝部 214e與216e之體積，進而可達到縮減膨脹量的目的。 本發明之可撓性電路板可適用於一般平面顯示裝置， 例如液晶顯示器或電漿顯示器。平面顯示農置主要係由平 面顯示面板以及背光模組所組成，其中背光模組設在平面 顯不面板之背面，以提供平面顯示面板光源。而可撓性電 路板則係設置在平面顯示面板中。 請參照第7圖，其係繪示依照本發明一較佳實施例的 一種平面顯示面板之裝置示意圖。平面顯示面板3〇〇主要 包括玻璃基板302、平面顯示單元304以及數個如同前述 之可撓性電路板200a。值得注意的一點是，上述實施例中 所描述之可橈性電路板200a〜200e均可應用在平面顯示面 板中’在本實施例中’僅以可撓性電路板2〇〇a來舉例說 明。玻璃基板之周邊上設有數個接觸端子306，其中這些 接觸端子306分別對應於可撓性電路板200之輸出導線 208。平面顯示單元304則設於玻璃基板302之上，而接觸 端子306之一端與平面顯示單元304接合，另一端則向外 1375491 側延伸至玻璃基板3〇2之一側邊處。這些可撓性電路板 200a可利用例如熱壓著方式對位接合在玻璃基板3〇2之周 邊上，其中可撓性電路板2〇〇a之輸入導線2〇8分別對準玻 璃基板302上之接觸端子306，並透過熱壓著而接合在一 起，以形成電性連接。透過可撓性電路板2〇〇a之輸入導線 208與玻璃基板302上之接觸端子306的對應壓合，可順 利使可撓性電路板200a之積體電路204與平面顯示單元 304電性連接。 由上述本發明之實施例可知，本發明之一優點就是因 為本發明之可撓性電路板之可徺性基板的輸出導線之間、 以及輸入導線之間分別設有數個熱膨脹緩衝部，如此可使 熱膨脹緩衝部所分隔出之每一段輸出導線區與輸出導線區 均可在不事先預設收縮量的情況下，仍保持在與面板或印 刷電路板之間的接合的需求規格内。 由上述本發明之實施例可知，本發明之另一優點就是 因為本發明之平面顯示面板之可撓性電路板的輸出導線之 間與輸入導線之間均勻地設置有熱膨脹緩衝部，因而可有 效控制膨脹量，以降低膨脹量的影響，而可設計出更大的 可撓性電路板，因此可減少可撓性電路板的使用數量，進 而可降低成本。此外，由於膨脹量可獲得控制’因此可提 向平面顯示面板之接合製程的品質。 由上逑本發明之實施例可知，本發明之又一優點就是 因為在本發明之平面顯示器的顯示模組製程中，可因所使 用之可撓性電路板的數量減少，而降低製程時間，並可縮 減製程所需之人力物力。All of the input conductors 206 are separated into a plurality of substantially equal length input conductor regions 218, and the entire output is 'wired' into a plurality of substantially equal length input conductor regions 220. In the present exemplary embodiment, 'with the replaceability circuit boards 200a, 200b, 200 of the above embodiment (unlike 200d, the thermal expansion buffer portions 214e and 2l6e of the switchable circuit board 200e are both configured, the thermal expansion buffer portion 214e and 216e are thinned regions = also = that the thickness of the thermal expansion buffers (10) and (10) is thinner than the thickness of the input lead region 218 and the output lead region 220. By reducing the thermal expansion buffer portion 2i4e in the flexible substrate chamber With the thickness of 216e, the volume of the thermal expansion buffer portions 214e and 216e can be reduced, thereby achieving the purpose of reducing the amount of expansion. The flexible circuit board of the present invention can be applied to a general flat display device such as a liquid crystal display or a plasma display. The display main body is composed of a flat display panel and a backlight module, wherein the backlight module is disposed on the back of the flat display panel to provide a flat display panel light source, and the flexible circuit board is disposed in the flat display panel. Please refer to FIG. 7 , which is a schematic diagram of a device for a flat display panel according to a preferred embodiment of the present invention. The flat display panel 3 〇〇 mainly includes The glass substrate 302, the flat display unit 304 and a plurality of flexible circuit boards 200a as described above. It is worth noting that the flexible circuit boards 200a to 200e described in the above embodiments can be applied to a flat display panel. 'In the present embodiment' is exemplified by only the flexible circuit board 2A. A plurality of contact terminals 306 are provided on the periphery of the glass substrate, wherein the contact terminals 306 correspond to the outputs of the flexible circuit board 200, respectively. The wire 208. The flat display unit 304 is disposed on the glass substrate 302, and one end of the contact terminal 306 is joined to the flat display unit 304, and the other end is extended to the side of the 1373941 side to the side of one of the glass substrates 3〇2. The flexible circuit board 200a can be bonded to the periphery of the glass substrate 3〇2 by, for example, a thermal pressing method, wherein the input wires 2〇8 of the flexible circuit board 2〇〇a are respectively aligned on the glass substrate 302. The terminals 306 are contacted and joined together by heat pressing to form an electrical connection. The corresponding input wires 208 of the flexible circuit board 2A and the contact terminals 306 of the glass substrate 302 are pressed together. The integrated circuit 204 of the flexible circuit board 200a can be smoothly electrically connected to the flat display unit 304. It is apparent from the above embodiments of the present invention that one of the advantages of the present invention is that the flexible circuit board of the present invention can be used. A plurality of thermal expansion buffer portions are respectively disposed between the output wires of the substrate and the input wires, so that each of the output wire regions and the output wire regions separated by the thermal expansion buffer portion can be preset without a predetermined amount of shrinkage. In this case, it remains within the required specifications of the bond with the panel or printed circuit board. From the above-described embodiments of the present invention, another advantage of the present invention is that the flexible circuit board of the flat display panel of the present invention is The thermal expansion buffer is evenly disposed between the output wires and the input wires, so that the amount of expansion can be effectively controlled to reduce the influence of the amount of expansion, and a larger flexible circuit board can be designed, thereby reducing the flexibility The number of boards used, which in turn reduces costs. In addition, since the amount of expansion can be controlled, the quality of the joining process of the flat display panel can be improved. According to the embodiment of the present invention, another advantage of the present invention is that in the process of the display module of the flat panel display of the present invention, the process time can be reduced due to the reduction of the number of flexible circuit boards used. And can reduce the manpower and material resources required for the process.
12 1375491 • 雖然本發明已以一較佳實施例揭露如上’然其並非用 • · 以限定本發明，任何在此技術領域中具有通常知識者’在 • 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾，因此本發明之保護範圍當視後附之申請專利範圍所界 定者為準。 【圖式簡單說明】 第1圖係繪示傳統COF帶與印刷電路板之接合剖面示 Φ 意圖。 第2圖係繪示依照本發明第一較佳實施例的一種可撓 性電路板之上視示意圖。 第3圖係繪示依照本發明第二較佳實施例的一種可撓 性電路板之上視示意圖。 第4圖係繪示依照本發明第三較佳實施例的一種可撓 性電路板之上視示意圖。 第5圖係繪示依照本發明第四較佳實施例的一種可撓 ® 性電路板之上視示意圖。 第6圖係繪示依照本發明第五較佳實施例的一種可撓 性電路板之上視示意圖。 第7圖係繪示依照本發明一較佳實施例的一種平面顯 示面板之裝置示意圖。 【主要元件符號說明】 ι〇0.覆晶薄膜帶 102:印刷電路板 104:接腳端子 106:接腳端子 13 1375491The present invention has been disclosed in a preferred embodiment as described above, but it is not intended to limit the invention, and any person having ordinary skill in the art, without departing from the spirit and scope of the invention, The scope of the present invention is defined by the scope of the appended claims. [Simple description of the drawing] Fig. 1 shows the joint profile of the conventional COF tape and the printed circuit board. Figure 2 is a top plan view of a flexible circuit board in accordance with a first preferred embodiment of the present invention. Figure 3 is a top plan view of a flexible circuit board in accordance with a second preferred embodiment of the present invention. Figure 4 is a top plan view of a flexible circuit board in accordance with a third preferred embodiment of the present invention. Figure 5 is a top plan view of a flexible circuit board in accordance with a fourth preferred embodiment of the present invention. Figure 6 is a top plan view showing a flexible circuit board in accordance with a fifth preferred embodiment of the present invention. Figure 7 is a schematic view of a device for a flat display panel in accordance with a preferred embodiment of the present invention. [Main component symbol description] ι〇0. Flip chip film strip 102: Printed circuit board 104: Pin terminal 106: Pin terminal 13 1375491
108 :異方性導電膠 112 :下壓著刀頭 200b :可撓性電路板 200d :可撓性電路板 202a :可撓性基板 202c :可撓性基板 202e :可撓性基板 206 :輸入導線 210 :側邊 214a :熱膨脹緩衝部 214c :熱膨脹緩衝部 214e :熱膨脹緩衝部 216b :熱膨脹緩衝部 216d :熱膨脹緩衝部 218 .輸入導線區 222 :長度 226 :穿透式開孔 300 :平面顯示面板 304 :平面顯示單元 比：寬度 L :長度 P2 :間距 W2 :寬度 110 :上壓著刀頭 200a :可撓性電路板 200c :可撓性電路板 200e :可撓性電路板 202b :可撓性基板 202d :可撓性基板 204 :積體電路 208 :輸出導線 212 :側邊 214b :熱膨脹緩衝部 214d :熱膨脹緩衝部 216a :熱膨脹緩衝部 216c :熱膨脹緩衝部 216e :熱膨脹緩衝部 220 :輸出導線區 224 :長度 228 :穿透式開孔 302 :玻璃基板 306 :接觸端子 h2 :寬度 p!:間距 Wj :寬度 14108: anisotropic conductive paste 112: under the cutter head 200b: flexible circuit board 200d: flexible circuit board 202a: flexible substrate 202c: flexible substrate 202e: flexible substrate 206: input wire 210: side 214a: thermal expansion buffer portion 214c: thermal expansion buffer portion 214e: thermal expansion buffer portion 216b: thermal expansion buffer portion 216d: thermal expansion buffer portion 218. input lead region 222: length 226: transmissive opening 300: flat display panel 304 : flat display unit ratio: width L: length P2: pitch W2: width 110: upper pressing head 200a: flexible circuit board 200c: flexible circuit board 200e: flexible circuit board 202b: flexible substrate 202d: flexible substrate 204: integrated circuit 208: output lead 212: side 214b: thermal expansion buffer portion 214d: thermal expansion buffer portion 216a: thermal expansion buffer portion 216c: thermal expansion buffer portion 216e: thermal expansion buffer portion 220: output lead portion 224 Length 228: Penetration opening 302: Glass substrate 306: Contact terminal h2: Width p!: Spacing Wj: Width 14