CN101714500B - COG chip inversion bonding device - Google Patents
COG chip inversion bonding device Download PDFInfo
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- CN101714500B CN101714500B CN2009101907903A CN200910190790A CN101714500B CN 101714500 B CN101714500 B CN 101714500B CN 2009101907903 A CN2009101907903 A CN 2009101907903A CN 200910190790 A CN200910190790 A CN 200910190790A CN 101714500 B CN101714500 B CN 101714500B
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- pedestal
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- drive link
- correcting
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Abstract
The invention discloses a COG chip inversion bonding device which comprises a precalibration clamping device, a base plate positioning device and a delivering device, wherein the precalibration clamping device calibrates the position of a chip; the base plate positioning device positions a glass base plate bonded with the chip; the delivering device delivers the chip and the glass base plate; the precalibration clamping device and the base plate positioning device are sequentially fixed on a base; and the delivering device is respectively connected with drive parts on the precalibration clamping device and the base plate positioning device. The traditional delivering device chip is placed in the position of the precalibration clamping device, and the precalibration clamping device chip carries out precalibration; the position of the glass base plate on the base plate positioning device is calibrated by the base plate positioning device; and finally, the control device controls the clamping device to bond the chip on the glass base plate. Because the positions of the chip and the glass base plate are respectively calibrated before the chip is bonded, the bonding precision of the chip can be improved.
Description
Technical field
The present invention relates to the COG flip-chip bonding apparatus of COG chip bonding process on a kind of glass display substrate.
Background technology
COG adopts anisotropic conductive film ACF and thermocompression bonding technology that IC chip is mounted on the glass substrate of display screen, thereby dwindles small product size, raising packaging density, reduce cost, and accomplishes scale production.The COG technology is widely used in various flat-panel monitors and the individual mobile product, is the highest a kind of packing forms of present packaging density.
Must be in the COG chip bonding process through various means and method, the accurate location with glass plate is realized in the position that makes chip from magazine, take out, be delivered to bonding on the glass plate.
Need the position chip of bonding will be taken out, be delivered to the glass plate bonding, the location of realization chip and glass plate in the existing C OG chip bonding process from magazine.Existing chip is when taking out, because the position in the magazine of chip is unfixing, promptly the position of a plurality of chips and direction are not unique; Each chip direction and position are all inequality when therefore taking out chip; When bonding, the position of chip is unfixing, thereby influences the precision of bonding position; When chip is carried out bonding,,, with chip bonding the time, can not produce bigger error simultaneously even squint in the position of glass substrate because the size of glass substrate is less yet.But for the large-size glass substrate, for example 12 cun and above glass substrate when glass position generation less offset, produce bigger error during chip bonding, so the precision during chip bonding is not high.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of COG flip-chip bonding apparatus, and this COG glass substrate positioning device can be proofreaied and correct the position of said chip and glass substrate, improves chip and glass substrate bonding precision.
In order to address the above problem; The present invention provides a kind of COG flip-chip bonding apparatus; Said bonding apparatus comprises: the clamping device for precalibration that the position of chip is proofreaied and correct, to said chip carry out bonding the glass substrate location base positioner and carry the transport of said chip and glass substrate; Wherein, Said clamping device for precalibration and base positioner are fixed on the pedestal in order, and said transport is connected with driver part on the base positioner with said clamping device for precalibration respectively.
Preferably, said clamping device for precalibration comprises first motor that is fixed on this pedestal and the adhesive fixture of fixing with said pedestal, and said first motor is connected through first driving-belt and the first fixing runner of first rotating shaft; This first rotating shaft is connected with pedestal; Said first rotating shaft is provided with first cam, and said first cam outside is provided with first drive link of tight contact, and first drive link that is provided with first correcting block slidably is connected with said pedestal; Be provided with first spring between this first drive link and the pedestal; Said first drive link is connected with first slide block through first driving member, and this first slide block cooperates slip with first guide post on the pedestal, and this first slide block is provided with second correcting block; Said second correcting block and said first correcting block are oppositely arranged, and lay respectively at said adhesive fixture both sides.
Preferably; Said clamping device for precalibration also comprises second motor, second runner and second rotating shaft concentric with said first rotating shaft; Said second motor and pedestal are fixed, and this second motor is connected with the second fixing runner of second rotating shaft through second driving-belt, and said second rotating shaft and pedestal are fixed; This second rotating shaft is provided with second cam; The outside of said second cam is provided with second drive link of tight contact, and second drive link that is provided with the 3rd correcting block slidably is connected with said pedestal, is provided with second spring between second drive link and the pedestal; Said second drive link is connected with second slide block through second driving member; Said second slide block cooperates slip with second guide post; This second slide block is provided with the 4th correcting block, and said the 3rd correcting block and said the 4th correcting block are oppositely arranged, and lays respectively at said fixture both sides.
Preferably, on said first cam on salient position and second cam salient position vertical each other.
Preferably, said first guide post is or/and second guide post is provided with gathering sill.
Preferably, said first driving member and the second driving member two ends are respectively equipped with the degree of depth greater than its wide groove, and this groove cooperates with said first drive link, second drive link and first slide block, second slide block.
Preferably, said base positioner is arranged on the glass microscope carrier of the bearing glass substrate on the said pedestal, and wherein, said base positioner is provided with rotatable flexible said positioner of positioner and said pedestal or glass microscope carrier and fixes.
Preferably, said positioner comprises: stepping motor and the rotating shaft that is connected with this stepping motor, and said rotating shaft is provided with the connecting rod of L shape, and this connecting rod one end is provided with the correcting plate of proofreading and correct said glass substrate.
Preferably; Said base positioner also comprises first travel switch and second travel switch of controlling said drive unit work; Said first travel switch and second travel switch are fixed with said pedestal or glass microscope carrier respectively; And said first travel switch and said second travel switch lay respectively at said rotating shaft both sides, and cooperate with said connecting rod.
COG flip-chip bonding apparatus of the present invention; First motor by on the said clamping device for precalibration drives first runner through first driving-belt; Coaxial first cam that is provided with of said first runner; Said first cam outside is provided with first drive link of tight contact, and first drive link and the said pedestal that are provided with first correcting block are slidingly connected, and said first drive link is connected with first slide block through first driving member; Said first slide block cooperates slip with guide post, this first slide block is provided with second correcting block.At said first drive link when side contacts moves outside said first cam, said first driving member with first cam to said chip fixture apparatus away from or move near direction; Said second correcting block is opposite with the said second correcting block moving direction in the first driving member effect; Be that said first correcting block is during away from said chip fixture apparatus; Said second correcting block is also synchronously away from said chip fixture apparatus, and the X-direction that said first correcting block and second correcting block are formed relatively moves.When said first correcting block and said second correcting block to when moving, first correcting block and said second correcting block chip on this chip fixture apparatus that can be fixedly clamped, thus realize the chip position correction.Make the glass substrate positioning and fixing of bonding again by the positioner on the said base positioner, can proofread and correct, thereby improve chip and glass substrate bonding precision the position of said glass substrate.When said positioner location; Correcting plate on the said positioner is under the effect of drive unit, rotating shaft and connecting rod; Its position moves to this above glass microscope carrier below being positioned at said glass microscope carrier; Because said correcting plate is parallel with the edge of said glass microscope carrier, when glass substrate edge on being placed on said glass microscope carrier and said glass microscope carrier edge are not parallel, be parallel with the marginal correction of said glass substrate with glass microscope carrier edge by said correcting plate; Therefore realize glass substrate is proofreaied and correct, thereby improve said glass substrate and chip bonding precision.After accomplish said positioner location; Said positioner overturns under the drive unit effect and falls, and makes said correcting plate leave the plane at said glass microscope carrier place, and promptly said correcting plate is packed up; Because during no-fix; Said correcting plate is not on the plane at glass microscope carrier place, therefore can avoid said correcting plate to stop that said glass substrate moves, and increases work efficiency.
Description of drawings
Fig. 1 is a COG flip-chip bonding apparatus embodiment sketch map of the present invention;
Fig. 2 is a COG chip clamping device for precalibration example structure sketch map of the present invention;
Fig. 3 is a COG chip clamping device for precalibration embodiment A part-structure enlarged diagram of the present invention;
Fig. 4 is that COG glass substrate positioning device embodiment of the present invention assembles sketch map;
Fig. 5 is a COG glass substrate positioning device example structure decomposing schematic representation of the present invention.
Accompanying drawing critical piece description of symbols
Second correcting block 11; Second motor 12; Second driving-belt 13; Second cam 14;
Gathering sill 100; Groove 161;
The realization of the object of the invention, functional characteristics and advantage will combine embodiment, further specify with reference to accompanying drawing.
Embodiment
As shown in Figure 1, the present invention provides a kind of COG flip-chip bonding apparatus embodiment.
Said COG flip-chip bonding apparatus comprises: the clamping device for precalibration 1 that the position of chip is proofreaied and correct ', to said chip carry out the base positioner 2 of the glass substrate location of bonding ' and carry the transport 3 of said chip and glass substrate '; Wherein, Said clamping device for precalibration 1 ' with base positioner 2 ' be fixed in order on the pedestal, said transport 3 ' respectively and said clamping device for precalibration 1 ' with base positioner 2 ' on driver part be connected.
By said transport 3 ' with the said clamping device for precalibration 1 of chip 4 ' be delivered to ' on fixture 3 on, and by said first correcting block 7 and second correcting block 11 with carrying out calibration on the one hand; Glass substrate 36 by said transport 3 ' will be used for bonding is delivered to glass microscope carrier 22 again, by said base positioner 2 ' calibration is carried out in glass substrate 36 positions; At last by glass substrate 36 positions after the chip 4 of said transport 3 ' after will proofreading and correct ' the be delivered to correction, and with glass substrate 36 bondings.Compared with prior art since before chip bonding respectively to chip 4 ' proofread and correct the location with the position of glass substrate 36, thereby can improve the precision of said chip bonding.Said transport 3 ' can adopt prior art as required.
As shown in Figures 2 and 3; Said chip clamping device for precalibration 1 ' comprising: be fixed on first motor 2 and fixture 3 on the said pedestal 1; Said first motor 2 is connected with the first fixing runner 19 of first rotating shaft (accompanying drawing does not indicate) through first driving-belt 4, and this first rotating shaft and said pedestal 1 are fixing, and said first rotating shaft is provided with first cam 5; Said first cam 5 outsides are provided with first drive link 6 of tight contact; First drive link 6 that is provided with first correcting block 7 slidably is connected with said pedestal 1, and is provided with first spring 24 between this first drive link 6 and the pedestal 1, and said first drive link 6 is connected with first slide block 9 through first driving member 8; Said first slide block 9 cooperates slip with first guide post 10; This first slide block 9 is provided with second correcting block 11, and said second 11 of corrections and said first correcting block 7 are oppositely arranged, and lay respectively at said fixture 3 both sides.
Specifically, before chip bonding, said chip is placed on the said fixture 3 fixing, makes 2 work of said first motor through existing control technology.This first motor 2 drives first rotating shaft that is connected transmission with this first driving-belt 4 through first driving-belt 4 and rotates.First cam 5 that is fixed in this first rotating shaft makes mobile on pedestal 1 with its first drive link 6 that closely contacts; And said first slide block 9 moves radially along first cam 5, thereby first correcting block 7 that is fixed on said first drive link 6 is moved near direction to said fixture 3.Because these first driving member, 8 centers and said pedestal 1 are rotatably connected, its two ends respectively with first slide block 9 and first driving member 8 slidably and be rotationally connected.Therefore said first drive link 6 drives connected first driving member 8 in moving process; And first guide post 10 that is fixed on the said pedestal 1 through said first slide block of these first driving member, 8 drives 9 edges moves; And the moving direction of said first slide block 9 is opposite with said first drive link, 6 moving directions, and second correcting block 11 that is fixed on said first slide block 9 is moved near direction to said fixture 3.Because first correcting block 7 and second correcting block 11 are oppositely arranged; And the position that first correcting block 7 and second correcting block 11 are proofreaied and correct is fixed; Therefore first correcting block 7 and 11 pairs of second correcting blocks are fixed on chip on the said fixture 3 when carrying out clamping, can be to the position correction of chip.Owing to be provided with first spring 24 between said first drive link 6 and the pedestal 1, therefore said first drive link 6 is closely contacted with said first cam 5 simultaneously.
In the present embodiment, can be bent through the rate of said first cam 5 of adjustment, thus adjusting said first correcting block 7 and second correcting block, 11 spacings, can realize the chip position of different size is proofreaied and correct.Said fixture 3 is put for existing aspiration attaches together.Said first guide post 10 is provided with gathering sill 20.Said first driving member 8 two ends are established the degree of depth respectively greater than its first wide driving groove 81, and this first driving groove 81 cooperates with said first drive link 6 and first slide block 9, and said first driving groove 81 can be a bar hole.
Said clamping device for precalibration also comprise second motor 12, second runner 20 and with second rotating shaft (accompanying drawing does not indicate) of the said first rotating shaft concentric; Said second motor 12 is fixed with said pedestal 1; This second motor 12 is connected with the second fixing runner 20 of second rotating shaft through second driving-belt 13; Said second rotating shaft and said pedestal 1 are fixing, and this second rotating shaft is provided with second cam 14, and the outside of said second cam 14 is provided with second drive link 15 of tight contact; Second drive link 15 that is provided with the 3rd correcting block 17 slidably is connected with said pedestal 1, and is provided with second spring (accompanying drawing does not indicate) between this second drive link 15 and the pedestal 1; Said second drive link 15 is connected with second slide block 21 through second driving member 16; Said second slide block 21 cooperates slip with second guide post 22; This second slide block 21 is provided with the 4th correcting block 18; Said the 3rd correcting block 17 is oppositely arranged with said the 4th correcting block 18, and lays respectively at said fixture 3 both sides.Other structures, annexation are same as the previously described embodiments, repeat no more.
Before chip bonding, said chip is placed on the said fixture 3 fixing, make 12 work of said second motor through existing control technology.This second motor 12 drives second rotating shaft that is connected transmission with it through second driving-belt 13 and rotates.Second cam 14 that is fixed in this second rotating shaft makes mobile on pedestal 1 with its second drive link 15 that closely contacts; And said second slide block 21 moves radially along second cam 14, thereby the 3rd correcting block 17 that is fixed on said second drive link 15 is moved near direction to said fixture 3.Because these second driving member, 16 centers and said pedestal 1 are rotatably connected, its two ends respectively with second slide block 21 and second driving member 16 slidably and be rotationally connected.Therefore said second drive link 15 drives connected second driving member 16 in moving process; And second guide post that is fixed on the said pedestal 1 through said second slide block of these second driving member, 16 drives 21 edges moves; And the moving direction of said second slide block 21 is opposite with said second drive link, 15 moving directions, and the 4th correcting block 18 that is fixed on said second slide block 21 is moved near direction to said fixture 3.Because the 3rd correcting block 17 and the 4th correcting block 18 are oppositely arranged; And the position that the 3rd correcting block 17 and the 4th correcting block 18 are proofreaied and correct is fixed; Therefore the 3rd correcting block 17 and 18 pairs of the 4th correcting blocks are fixed on chip on the said fixture 3 when carrying out clamping, can be to the position correction of chip.Therefore said COG chip clamping device for precalibration can be proofreaied and correct the position to said chip on relative both direction.
Like Fig. 5 and shown in Figure 6; Said base positioner 2 ' comprising: the glass microscope carrier 22 that is arranged on the bearing glass substrate 36 on the said pedestal 1; Wherein, said base positioner 2 ' also be provided with telescopic positioner 23, said positioner 23 is fixing with said pedestal 1 or glass microscope carrier 22.
Specifically, said positioner 23 comprises drive unit 30 and the rotating shaft 31 that is connected with this drive unit 30, and said rotating shaft 31 is provided with connecting rod 32, and these connecting rod 32 1 ends are provided with the correcting plate 33 of proofreading and correct said glass substrate 36.
When said positioner 23 location; Correcting plate 33 on the said positioner 23 is under the effect of drive unit 30, rotating shaft 31 and connecting rod 32; Its position moves to this above glass microscope carrier 22 below being positioned at said glass microscope carrier 22, because said correcting plate 33 is parallel with the edge of said glass microscope carrier 22.
When glass substrate 36 edges on being placed on said glass microscope carrier 22 and said glass microscope carrier 22 edges are not parallel, by said correcting plate 33 that the edge adjustment of said glass substrate 36 is parallel with glass microscope carrier 22 edges, realize glass substrate 36 is proofreaied and correct.Accurate, with the COG chip bonding time, can improve the bonding precision of COG chip and glass substrate 36 through the glass substrate 36 after the position correction.
After accomplish said positioner 23 location; This positioner 23 overturns under said drive unit 30 effects and falls; Make said correcting plate 33 leave the plane at said glass microscope carrier 22 places, promptly said correcting plate 33 is packed up, and said correcting plate 33 is not on the plane at glass microscope carrier 22 places; Therefore can avoid said correcting plate 33 to stop that said glass substrate 36 moves, and increases work efficiency.
In the present embodiment; Said COG glass substrate positioning device also comprises first travel switch 34 and second travel switch 35 of said drive unit 30 work of control; Said first travel switch 34 and second travel switch 35 are fixing with said pedestal 1 or glass microscope carrier 22 respectively; And said first travel switch 34 lays respectively at said rotating shaft 34 both sides with said second travel switch 35, and cooperates with said connecting rod 32.When said correcting plate 33 moved to said glass microscope carrier 2 upright positions, said connecting rod 32 contacted with said first travel switch 34, and the said drive unit 30 of these first travel switch, 34 controls stops.After accomplished said positioner 23 location, said correcting plate 33 was to said glass microscope carrier 22; When said connecting rod 32 contacts with said second travel switch 35, the said drive unit 30 of these second travel switch, 35 controls stops.Also can be as required to adopting existing technology that said drive unit 30 is controlled.
COG flip-chip bonding apparatus of the present invention; By said clamping device for precalibration 1 ' on first motor 2 drive first runner 19 through first driving-belt 4; Said first runner, 19 coaxial first cams 5 that are provided with; Said first cam 5 outsides are provided with first drive link 6 of tight contact, and first drive link 6 that is provided with first correcting block 7 is slidingly connected with said pedestal 1, and said first drive link 6 is connected with first slide block 9 through first driving member 8; Said first slide block 9 cooperates slip with first guide post 10, and this first slide block 9 is provided with second correcting block 11.
At said first drive link 6 when side contacts moves outside said first cam 5, said first driving member 8 with first cam 5 to the fixture 3 of fixed chip away from or move near direction; Said second correcting block 11 is opposite with said second correcting block, 11 moving directions in 8 effects of first driving member; When being said first correcting block 7 away from the fixture 3 of fixed chip; Said second correcting block 11 is also synchronously away from said fixture 3, and the X-direction that said first correcting block 7 and second correcting block 11 are formed relatively moves.
When said first correcting block 7 and said second correcting block 11 to when moving, first correcting block 7 and said second correcting block 11 chip on this fixture 3 that can be fixedly clamped, thus realize that chip position proofreaies and correct.
Again by said base positioner 2 ' on positioner 23 make glass substrate 36 positioning and fixing of bonding, can proofread and correct the position of said glass substrate 36, thus the precision of position when improving COG chip and glass substrate 36 bondings.When said positioner 23 location; Correcting plate 33 on the said positioner 23 is under the effect of drive unit 30, rotating shaft 31 and connecting rod 32; Its position moves to this above glass microscope carrier 22 below being positioned at said glass microscope carrier 22, because said correcting plate 33 is parallel with the edge of said glass microscope carrier 22.
When glass substrate 36 edges on being placed on said glass microscope carrier 22 and said glass microscope carrier 22 edges are not parallel; Is parallel with glass microscope carrier 22 edges by said correcting plate 33 with the marginal correction of said glass substrate 36; Therefore realize said glass substrate 36 is proofreaied and correct, thereby improve said glass substrate 36 and COG chip bonding precision.
After accomplish said positioner 23 location; Said positioner 23 overturns under drive unit 30 effects and falls, and makes said correcting plate 33 leave the plane at said glass microscope carrier 22 places, and promptly said correcting plate 33 is packed up; Because during no-fix; Said correcting plate 33 is not on the plane at glass microscope carrier 22 places, therefore can avoid said correcting plate 33 to stop that said glass substrate 36 moves, and increases work efficiency.
In the present embodiment, on said first cam 5 on salient position and second cam 14 salient position vertical each other.Said drive unit 30 is a stepping motor; Said connecting rod 32 is the L shape.Said correcting plate 33 is plastics, rubber or silica gel.
The above is merely the preferred embodiments of the present invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1.COG the flip-chip bonding apparatus is characterized in that:
Said bonding apparatus comprises clamping device for precalibration (1 ') that the position of chip is proofreaied and correct, to carrying out base positioner (2 ') and the transport (3 ') of said chip of conveying and glass substrate of the glass substrate location of bonding with said chip; Wherein, Said clamping device for precalibration (1 ') and base positioner (2 ') are fixed on the pedestal (1) in order, and said transport (3 ') is connected with driver part on the base positioner (2 ') with said clamping device for precalibration (1 ') respectively;
Said clamping device for precalibration (1 ') comprises first motor (2) that is fixed on the said pedestal (1) and the adhesive fixture (3) of fixing with said pedestal (1); Said first motor (2) is connected with fixing first runner (19) of first rotating shaft through first driving-belt (4); This first rotating shaft is connected with pedestal (1); Said first rotating shaft is provided with first cam (5), and said first cam (5) outside is provided with first drive link (6) of tight contact, and first drive link (6) that is provided with first correcting block (7) slidably is connected with said pedestal (1); Be provided with first spring between this first drive link (6) and the pedestal (1); Said first drive link (6) is connected with first slide block (9) through first driving member (8), and this first slide block (9) cooperates slip with first guide post (10) on the pedestal (1), and this first slide block (9) is provided with second correcting block (11); Said second correcting block (11) is oppositely arranged with said first correcting block (7), and lays respectively at said adhesive fixture (3) both sides;
Said base positioner (2 ') comprises the glass microscope carrier (22) that is arranged on the bearing glass substrate on this pedestal (1); Wherein, Said base positioner is provided with rotatable flexible positioner (23), and said positioner (23) is fixing with said pedestal (1) or glass microscope carrier (22);
Said positioner (23) comprises stepping motor (30) and the rotating shaft (31) that is connected with this stepping motor (3), and said rotating shaft (31) is provided with the connecting rod (32) of L shape, and these connecting rod (32) one ends are provided with the correcting plate (33) of proofreading and correct said glass substrate;
Said base positioner (2 ') also comprises first travel switch (34) and second travel switch (35) of the said drive unit of control (30) work; Said first travel switch (34) and second travel switch (35) are fixing with said pedestal (1) or glass microscope carrier (2) respectively; And said first travel switch (34) and said second travel switch (35) lay respectively at said rotating shaft (31) both sides, and cooperate with said connecting rod (32).
2. COG flip-chip bonding apparatus according to claim 1 is characterized in that:
Said clamping device for precalibration (1 ') also comprises second motor (12), second runner (20) and second rotating shaft concentric with said first rotating shaft; Said second motor (12) is fixing with pedestal (1); This second motor (12) is connected with fixing second runner (20) of second rotating shaft through second driving-belt (13); Said second rotating shaft and pedestal (1) are fixing, and this second rotating shaft is provided with second cam (14), and the outside of said second cam (14) is provided with second drive link (15) of tight contact; Second drive link (15) that is provided with the 3rd correcting block (17) slidably is connected with said pedestal (1), is provided with second spring between second drive link (15) and the pedestal (1); Said second drive link (15) is connected with second slide block (21) through second driving member (16); Said second slide block (21) cooperates slip with second guide post; This second slide block (21) is provided with the 4th correcting block (18); Said the 3rd correcting block (17) is oppositely arranged with said the 4th correcting block (18), and lays respectively at said fixture (3) both sides.
3. COG flip-chip bonding apparatus according to claim 2 is characterized in that:
Said first cam (5) is gone up salient position, and upward salient position is vertical each other with second cam (14).
4. COG flip-chip bonding apparatus according to claim 3 is characterized in that:
Said first guide post (10) is or/and second guide post is provided with gathering sill (100).
5. COG flip-chip bonding apparatus according to claim 4 is characterized in that:
Said first driving member (8) and second driving member (16) two ends are respectively equipped with the degree of depth greater than its wide groove (161), and this groove (161) cooperates with said first drive link (6), second drive link (15) and first slide block (9), second slide block (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101907903A CN101714500B (en) | 2009-09-30 | 2009-09-30 | COG chip inversion bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101907903A CN101714500B (en) | 2009-09-30 | 2009-09-30 | COG chip inversion bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101714500A CN101714500A (en) | 2010-05-26 |
| CN101714500B true CN101714500B (en) | 2012-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101907903A Expired - Fee Related CN101714500B (en) | 2009-09-30 | 2009-09-30 | COG chip inversion bonding device |
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| CN (1) | CN101714500B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489800B (en) * | 2012-06-11 | 2016-09-21 | 北京中电科电子装备有限公司 | Two-way keying features on bonding apparatus |
| JP6705727B2 (en) * | 2016-09-26 | 2020-06-03 | ファスフォードテクノロジ株式会社 | Flip chip bonder and method for manufacturing semiconductor device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1848400A (en) * | 2005-04-04 | 2006-10-18 | 弘塑科技股份有限公司 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
| CN101114064A (en) * | 2007-07-23 | 2008-01-30 | 华映视讯（吴江）有限公司 | ACF sticking carrying platform |
| CN101393332A (en) * | 2007-08-21 | 2009-03-25 | 株式会社日立高新技术 | ACF paste device and flat panel display |
| CN201590409U (en) * | 2009-09-30 | 2010-09-22 | 日东电子科技(深圳)有限公司 | COG chip back bonding device |
-
2009
- 2009-09-30 CN CN2009101907903A patent/CN101714500B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1848400A (en) * | 2005-04-04 | 2006-10-18 | 弘塑科技股份有限公司 | Mechanical structure of apparatus for holding chip with multi-clamping finger |
| CN101114064A (en) * | 2007-07-23 | 2008-01-30 | 华映视讯（吴江）有限公司 | ACF sticking carrying platform |
| CN101393332A (en) * | 2007-08-21 | 2009-03-25 | 株式会社日立高新技术 | ACF paste device and flat panel display |
| CN201590409U (en) * | 2009-09-30 | 2010-09-22 | 日东电子科技(深圳)有限公司 | COG chip back bonding device |
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| Publication number | Publication date |
|---|---|
| CN101714500A (en) | 2010-05-26 |
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