CN115148616A

CN115148616A - Electronic component mounting apparatus

Info

Publication number: CN115148616A
Application number: CN202210289622.5A
Authority: CN
Inventors: 菊池一哉
Original assignee: Shibaura Mechatronics Corp
Current assignee: Shibaura Mechatronics Corp
Priority date: 2021-03-31
Filing date: 2022-03-23
Publication date: 2022-10-04
Also published as: KR20220136202A; TW202241229A

Abstract

The invention provides an electronic component mounting device, which can simplify the position alignment of the cutting of ACF relative to the end of COF when the size of COF changes, and can omit the moving mechanism of a pressure head. The electronic component mounting apparatus of the present invention includes: a supply device for supplying the film-like electronic component (F); a bonding device (50) which bonds the anisotropic conductive member to the film-shaped electronic component (F) at a specific bonding position (R2); a mounting device (60) for mounting a film-like electronic component (F) to which an anisotropic conductive member is bonded on a display panel (D); and a delivery device (40) which sets a reference position (R1) for aligning the bonding position (R2), aligns the end of the film-shaped electronic component (F) with the reference position (R1), receives the film-shaped electronic component (F) from the supply device, bonds the anisotropic conductive member, and transfers the film-shaped electronic component to the mounting device (60).

Description

Electronic component mounting apparatus

Technical Field

The present invention relates to an electronic component mounting apparatus.

Background

As a display of a television, a personal computer, or the like, a liquid crystal display (lcd) or an organic Electroluminescence (EL) display is widely used. In a manufacturing process of such a display, there is a panel assembling process of mounting driving electronic components on a display panel. In the above-described assembly process, there are known two types, a type in which a driver Integrated Circuit (IC) for driving is directly mounted, and a type in which a Film-like electronic component called a Chip On Film (COF) is mounted in which a driver IC is mounted On a Film-like circuit substrate.

The former is a so-called Chip On Glass (COG) mounting in which Chip-like electronic components such as driver ICs are mounted On a Glass substrate constituting a display panel, and the latter is a so-called Film On Glass (FOG) mounting in which Film-like electronic components are mounted On a Glass substrate. In addition, COG mounting uses an electronic component mounting apparatus called COG mounting apparatus, and FOG mounting uses an electronic component mounting apparatus called Outer Lead Bonding (OLB) apparatus or FOG mounting apparatus.

Conventionally, display panels are limited to approximately 10 inches in size, and for example, large display panels exceeding 10 inches are mounted using FOG, and small display panels of 10 inches or less are mounted using COG. Therefore, in the mounting device for mounting electronic components on the display panel, the FOG mounting device is used for the large display panel, and the COG mounting device is used for the small display panel.

In addition, in a manufacturing process of a display panel, there is an increasing demand for an electronic component mounting apparatus capable of selectively performing COG mounting and FOG mounting. Here, the COF is punched and supplied from a tape-like member. The driver ICs are supplied from a tray. Therefore, such an electronic part mounting apparatus needs to include both a feeding apparatus using punching and a feeding apparatus using a tray.

In such an electronic component mounting apparatus, the driver IC or COF is temporarily pressure-bonded to the display panel via an Anisotropic Conductive member called an Anisotropic Conductive Film (ACF), and then mounted to the display panel by heat pressure bonding (hereinafter, also referred to as formal pressure bonding). Specifically, before the temporary pressure bonding, the ACF is bonded to the display panel, and the driver IC or COF is temporarily pressure bonded and permanently pressure bonded to the display panel. Such an ACF is a sheet-like member in which a large number of small conductive particles are incorporated in a thermosetting resin serving as a base material, and is supplied in the form of a tape-like member (hereinafter referred to as an ACF tape) attached to a release tape.

On the other hand, an electronic component mounting device is desired which can attach an ACF to a COF other than a display panel and mount the COF to which the ACF is attached to the display panel. As a bonding apparatus for bonding an ACF to a COF, for example, a bonding apparatus disclosed in patent document 1 is known. In patent document 1, an ACF tape to which an ACF is bonded is supplied, and the ACF is bonded to a COF. A slit is formed in such an ACF in advance according to the size of the COF, and after the ACF is attached to the COF, the ACF attached to the COF is separated from the ACF tape by the slit when the release tape is pulled away from the COF.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent application laid-open No. 2008-016594

Disclosure of Invention

[ problems to be solved by the invention ]

In addition, conventionally, when an electronic component such as a COF is held in an electronic component mounting apparatus, since the electronic component is held by aligning the center of the holding portion with the center of the electronic component, when the ACF is attached to COFs of various sizes, it is necessary to align the cut of the ACF with the end of the COF every time the size of the COF changes. At this time, as shown in fig. 16 a to 16C, the ACF (hatched portion in the figure) attached to the COF is separated into COF sizes by the cut placed in the ACF, and is attached to the COF. At this time, the ACF is already attached to the COF on the ACF tape on the downstream side of the ACF attached to the COF, and therefore the ACF does not remain, but the ACF attached to the COF is next attached to the ACF tape on the upstream side of the cut (the supply side of the ACF tape). Since the properties of the ACF change due to heating, it is desired to avoid applying heat to the ACF before the COF is bonded. Therefore, the cut of the ACF is aligned with the end face of the COF, and the end of the pressing head is aligned with the cut of the ACF to perform pressing and bonding in order to avoid the heated pressing head from contacting the ACF on the upstream side of the cut. Therefore, in order to cope with COFs of various sizes, it is necessary to add an adjustment for aligning the cut of the ACF with the end face of the COF, a moving mechanism for aligning the end of the pressing head with the cut of the ACF, control thereof, and the like, each time the size of the COF changes.

The invention aims to provide an electronic component mounting device, which can simplify the position alignment of a cutting of an ACF relative to an end part of a COF when the size of the COF changes, and can omit a moving mechanism of a pressure head.

[ means for solving problems ]

In order to achieve the above object, an electronic component mounting apparatus according to the present invention includes: a supply device for supplying the film-like electronic component; a bonding device for bonding the anisotropic conductive member to the film-like electronic component at a specific bonding position; a mounting device for mounting the film-like electronic component to which the anisotropic conductive member is bonded to a display panel; and a delivery device that sets a reference position for aligning the bonding position, receives the film-like electronic component from the supply device by aligning an end of the film-like electronic component with the reference position, bonds the anisotropic conductive member, and transfers the film-like electronic component to the mounting device.

[ Effect of the invention ]

The present invention can simplify the positional alignment of the cut of the ACF with respect to the end of the COF, which is required each time the size of the COF is changed, and can omit the moving mechanism of the pressing head.

Drawings

Fig. 1 (a) and 1 (B) are perspective views showing the film-like electronic component (a) and the chip-like electronic component (B) according to the embodiment.

Fig. 2 is a plan view showing the overall configuration of the electronic component mounting apparatus according to the embodiment.

Fig. 3 (a) and 3 (B) are an explanatory view (a) showing a step of mounting the film-shaped electronic component of the electronic component mounting apparatus according to the embodiment, and an explanatory view (B) showing a step of mounting the chip-shaped electronic component.

Fig. 4 (a) and 4 (B) are explanatory views showing a press feeding device according to the embodiment before (a) and after (B) the press.

Fig. 5 (a) to 5 (F) are explanatory views showing a tray receiving process of the tray supply device according to the embodiment.

Fig. 6 is a perspective view showing a first holding head and a second holding head according to the embodiment.

Fig. 7 (a) and 7 (B) are explanatory views showing the operation of the moving mechanism according to the embodiment.

Fig. 8 is a plan view showing a reference position of the embodiment.

Fig. 9 is an explanatory view showing a bonding apparatus according to the embodiment.

Fig. 10 is a functional block diagram showing a control device according to an embodiment.

Fig. 11 is a flowchart showing a mounting procedure of the film-like electronic component according to the embodiment.

Fig. 12 is a flowchart showing a mounting procedure of the film-like electronic component according to the embodiment.

Fig. 13 is an explanatory diagram showing a relationship among the reference position, the half-cut line, and the bonding position in the embodiment.

Fig. 14 is a flowchart showing a mounting procedure of the chip-shaped electronic component according to the embodiment.

Fig. 15 (a) to 15 (C) are explanatory views showing alignment in the embodiment.

Fig. 16 (a) to 16 (C) are explanatory views showing the alignment of the ACFs corresponding to COFs of various sizes in the related art and the pressing head.

[ description of symbols ]

10. 10a, 10b: press feeding device

20. 20a, 20b: tray supply device

40: transfer device

50: laminating device

51. 110: supply part

52: cutting part

53: bonding part

54: stripping part

55: conveying part

56: recovery part

60: mounting device

80: control device

81: mechanism control unit

82: storage unit

83: input/output control unit

91: input device

92: output device

120. 610: platform

120a: opening(s)

130: die set

131: die head

131a: punching hole

132: punch head

140: lifting mechanism

141: supporting part

141a: support post

141b: supporting plate

142: driving part

142a: shaft

210: frame structure

220: holding part

410: mounting part

411: placing part

412: stop part

420: moving mechanism

430: transfer device

431: first arm

431a, 432b: adsorption nozzle

432: second arm

432a: rotating head

510: supply reel

511: tension mechanism

511a: fixed roller

511b: movable roller

512. 561: path roller

520: cutting machine

521. 531: supporting member

521a: flat surface

530: pressure head

530a: buffer member

531a: support roller

540. 541: stripping rod

550: conveying roller

560: recovery reel

620: crimping part

621: pressing member

622: supporting member

B: cleaning device

B1: brush with brush head

C: chip-shaped electronic component

D: display panel

F: film-like electronic component

G: measuring device

G1: pushing-out noodle

H1: first holding head

H2: second holding head

H11, H21: holding part

H12, H22: connecting part

H13, H23: pillar part

HC: half tangent line

R1, R1a, R1b: reference position

R2: bonding position

ST: thin plate-like member

T: tray

T1: adhesive tape

T2: demoulding belt

TP: band-shaped member

Detailed Description

Embodiments of the present invention (hereinafter, referred to as the present embodiments) will be specifically described with reference to the drawings. The drawings schematically show the respective members and the respective components, and do not accurately show the dimensions, the intervals, and the like.

[ Structure ]

[ electronic component and mounting object ]

The electronic components in the present embodiment are a film-like electronic component F shown in fig. 1 (a) and a chip-like electronic component C shown in fig. 1 (B). The film-shaped electronic component F is a component in which an electronic component is mounted on a flexible resin film and an electrode is formed at an end of one surface. The film-like electronic component F is prepared as a component that is individually press-mounted by integrally forming a plurality of film-like electronic components F into a sheet-like or strip-like thin plate-like member. In addition, the film-shaped electronic component F in the present embodiment has various sizes. The chip-like electronic component C is a driver IC. The chip-shaped electronic components C are mounted on the tray T (see fig. 3 a and 3B) in a state of being individually separated into products in advance.

The film-like electronic component F or the chip-like electronic component C is mounted on the substrate to be electrically connected to the electrodes of the film-like electronic component F or the chip-like electronic component C. In the present embodiment, the mounting object is a display panel D constituting a display device. That is, the display device is a member having a display function and electrodes.

[ electronic component mounting apparatus ]

(Overall Structure)

The overall configuration of the electronic component mounting apparatus according to the present embodiment will be described with reference to fig. 2 and 3 (a) and 3 (B). As shown in fig. 2, the electronic component mounting apparatus includes a press feeder 10, a tray feeder 20, a delivery unit 40, a bonding unit 50, a mounting unit 60, and a control unit 80.

The press feeding device 10 is a device that presses out the film-like electronic component F from the thin plate-like member ST and feeds the film-like electronic component F. The tray supply device 20 is a device for supplying a tray T containing chip-like electronic components C.

The delivery device 40 receives the film-like electronic component F from the press feeder 10 and transfers the film-like electronic component F to the mounting device 60 via the bonding device 50. The delivery device 40 is also a device that receives the chip-shaped electronic component C from the tray supply device 20 and transfers the chip-shaped electronic component C to the mounting device 60. The first holding head H1 is used to transfer the film-like electronic component F from the press feeder 10 to the transfer device 40. The second holding head H2 is used to transfer the chip-shaped electronic component C from the tray supply device 20 to the transfer device 40. The first holding head H1 and the second holding head H2 are detachably provided to the transfer device 40.

The bonding apparatus 50 is an apparatus that bonds an Anisotropic Conductive member called ACF (Anisotropic Conductive Film) to the electrodes of the Film-like electronic component F. The ACF is a sheet-like member in which a large number of small conductive particles are incorporated into a resin serving as a base material. The mounting apparatus 60 is an apparatus for pressure-bonding the film-like electronic component F or the chip-like electronic component C to the display panel D to be mounted.

The control device 80 controls the punching supply device 10, the tray supply device 20, the delivery device 40, the bonding device 50, and the mounting device 60. The control device 80 includes, for example, a dedicated electronic circuit or a computer or the like operated by a specific program. The control device 80 programs the control contents of each unit, and executes the program by a processing device such as a Programmable Logic Controller (PLC) or a Central Processing Unit (CPU).

In addition, in a plane parallel to the installation surface of the electronic component mounting apparatus, a straight line from the press feeder 10 to the mounting apparatus 60 is defined as a Y direction, a direction orthogonal thereto is defined as an X direction, an axis along the Y direction is defined as a Y axis, and an axis along the X direction is defined as an X axis. The XY plane formed by the Y axis and the X axis is parallel to the film-like electronic component F, the chip-like electronic component C, the display panel D, and the respective planes supporting them. In the following description, the XY plane may be referred to as a horizontal plane.

A direction perpendicular to the XY plane and upward from the installation surface is defined as a Z direction, and an axis along the Z direction is defined as a Z axis. When the installation surface is horizontal, the Z-axis is vertical. The Z axis is perpendicular to the film-like electronic component F, the chip-like electronic component C, the display panel D, and the respective planes supporting them. In the following description, the Z direction is referred to as an upper direction, and a direction opposite thereto is referred to as a lower direction. Further, a rotational direction parallel to the XY plane with the Z axis as a center is defined as θ direction, and a rotational direction perpendicular to the XY plane with the Y axis as a center is defined as α direction. These directions are expressions for explaining positional relationships among the respective components of the electronic component mounting apparatus, and are not intended to limit the positional relationships or directions when the electronic component mounting apparatus is installed on the installation surface.

(Press feeder)

As shown in fig. 2, 4 (a) and 4 (B), the press feeding device 10 includes a feeding unit 110, a platen 120, a die 130, and an elevating mechanism 140.

The supply unit 110 includes a reel around which a thin plate-like member ST forming an electronic component is wound, and is a mechanism for sequentially feeding out stamped portions of the electronic component (see fig. 2). Therefore, the supply section 110 is provided with a shaft as a rotation shaft of the reel to which the rotation center of the reel is attached, and a transport roller that feeds out the thin plate-like member ST.

The stage 120 is a table that supports the mold 130. The die 130 includes a die 131 and a punch 132.

The die 131 has a flat surface on which the thin plate-like member ST fed from the supply unit 110 is placed, and is a flat plate-like member in which punched holes 131a are formed. The punched hole 131a is a through hole substantially matching the outer shape of the film-like electronic component F. The die 131 is fixed to the upper surface of the stage 120, and an opening 120a, which is a through hole larger than the punched hole 131a, is provided in the stage 120 at a position corresponding to the punched hole 131 a.

The punch 132 is a cutting die having a substantially rectangular parallelepiped shape with an outer edge substantially coinciding with an inner edge of the punched hole 131 a. The bottom surface of the punch 132 is moved along the Z axis toward the thin plate-like member ST placed on the die 131 to be inserted into the punch hole 131a, thereby punching out the film-like electronic part F from the thin plate-like member ST. Although not shown, a suction hole connected to an air pressure circuit is formed in the bottom surface of the punch 132, and the punched film-shaped electronic component F is sucked and held by negative pressure.

The lifting mechanism 140 is a mechanism for pressing the film-like electronic component F by moving the punch 132 along the Z axis. The lifting mechanism 140 includes a support 141 and a driving unit 142.

The support 141 is a structure that supports the punch 132 so as to be able to move up and down. The support 141 includes a support column 141a and a support plate 141b. The support posts 141a are four bar-like members standing on the die 131. The support plate 141b is a plate-like body attached to the upper end of the support 141a so as to be parallel to the upper surface of the die 131.

The driving section 142 is a device that is connected to the punch 132 and drives the punch 132 in a direction of contact with and separation from the die 131. As a driving source of the driving section 142, an air cylinder or the like can be used. The driving portion 142 has a shaft 142a. The shaft 142a is connected to the driving source, and penetrates the support plate 141b to be connected to the punch 132. The shaft 142a is moved up and down by the driving source, and the film-shaped electronic component F is punched out by the punch 132. The lower moving end of the punch 132 serves as a receiving position for the first holding head H1. That is, the punch 132 reaches a position where it can receive the first holding head H1 and stops while sucking and holding the film-shaped electronic component F punched out by lowering.

As shown in fig. 2, the press feeder 10 described above is provided in a pair on the left and right along the X axis in a plan view. One of the press feed devices 10a and the other press feed device 10b are disposed at positions separated by a transfer device 430 described below in a plan view. Hereinafter, the press feeding device 10 is referred to as a press feeding device 10 when the press feeding device 10a and the press feeding device 10b are not distinguished.

[ tray supply device ]

As shown in fig. 5 (a) to 5 (F), the tray supply device 20 includes a frame 210 and a grip portion 220. Frame 210 is a parallel pair of elongate members. The interval between the pair of frames 210 is approximately equal to the width of the tray T, and the tray T can pass vertically. The gripping portions 220 are provided on the side surfaces of the frame 210 facing each other, and can be advanced and retreated in a direction of contacting and separating from the side surfaces of the tray T by a driving mechanism not shown.

In the tray supply device 20, one tray T is held by the holding portion 220, and a plurality of trays T are stacked thereon (fig. 5 a). The lower surface of the tray T at the lowermost layer is a surface opposite to the surface for storing the chip-shaped electronic component C, and serves as a receiving position for the second holding head H2 (fig. 5B).

As shown in fig. 2, the above-described tray supply device 20 is provided in a pair on the left and right along the X axis in a plan view. One tray feeder 20a and the other tray feeder 20b are disposed at positions separated by a transfer device 430 described below in a plan view. Hereinafter, when the tray supply device 20a and the tray supply device 20b are not distinguished, the tray supply device 20 is assumed.

(Handover device)

As shown in fig. 2, 3 (a) and 3 (B), the delivery device 40 receives the film-like electronic component F from the press-supplying device 10 and transfers the film-like electronic component F to the mounting device 60 through the bonding device 50. The delivery device 40 is also a device that receives the chip-shaped electronic component C from the tray supply device 20 and transfers the chip-shaped electronic component C to the mounting device 60. As shown in fig. 3 (a), 3 (B), and 6 to 8, the transfer device 40 includes a mounting unit 410, a moving mechanism 420, and a transfer device 430.

(mounting part)

The first holding head H1 or the second holding head H2 is attached to and detached from the attachment portion 410. The mounting portion 410 has a mounting portion 411 and a locking portion 412. The mounting portion 411 is a cylindrical member on which the first holding head H1 or the second holding head H2 is mounted. The locking portions 412 are a plurality of pins standing from the upper surface of the placing portion 411. The first and second holding heads H1 and H2 attached to and detached from the mounting portion 410 will be described with reference to fig. 6.

The first holding head H1 holds the film-shaped electronic component F supplied from the press feeder 10 (see fig. 3 a and 3B). The first holding head H1 includes a holding portion H11, a connecting portion H12, and a column portion H13.

The holding portion H11 is a substantially rectangular parallelepiped member having a longitudinal direction corresponding to the side of the film-like electronic component F on which the electrodes are arranged. Although not shown, suction holes connected to an air pressure circuit are formed in the upper surface of the holding portion H11, and the punched film-shaped electronic component F is held by negative pressure suction.

The connection portion H12 is a substantially rectangular parallelepiped member mounted on the mounting portion 410. Although not shown, a hole into which the locking portion 412 is inserted is provided in the bottom surface of the connecting portion H12. The support portion H13 is a substantially rectangular parallelepiped member that stands from the upper surface of the connecting portion H12 and supports the bottom of the holding portion H11.

The second holding head H2 holds the tray T supplied from the tray supply device 20 (see fig. 3 a and 3B). The second holding head H2 includes a holding portion H21, a connecting portion H22, and a support portion H23.

The holding portion H21 has a substantially rectangular parallelepiped shape with an upper outer edge of the tray T or larger. Although not shown, suction holes connected to an air pressure circuit are formed in the upper surface of the holding portion H21, and the tray T is sucked and held by negative pressure. In view of preventing static electricity, there is a case where a concave-convex shape is provided on the bottom surface of the tray T. In this case, since there is a possibility that a sufficient suction force cannot be obtained in the concave-convex portion, it is preferable to form the suction hole at a position corresponding to the flat surface while avoiding the concave-convex portion. For example, the suction holes are provided at positions corresponding to the edge portions of the bottom surface of the tray T, thereby ensuring stable suction.

The connection portion H22 is a substantially rectangular parallelepiped member mounted on the mounting portion 410. Although not shown, a hole into which the locking portion 412 is inserted is provided in the bottom surface of the connecting portion H22. That is, the connection portions H12 and H22 of the first and second holding heads H1 and H2 have a common structure so as to be attachable to and detachable from the common mounting portion 410. The column part H23 is a substantially rectangular parallelepiped member that stands from the upper surface of the connecting part H22 and supports the bottom of the holding part H21.

(moving mechanism)

As shown in fig. 7 (a), the moving mechanism 420 moves the mounting unit 410 to which the first holding head H1 is mounted between the press feeder 10 and a transfer device 430 described below. Alternatively, as shown in fig. 7 (B), the moving mechanism 420 moves the mounting unit 410 to which the second holding head H2 is mounted between the tray supply device 20 and the transfer device 430. The moving mechanism 420 is configured by combining a drive source, a ball screw, a slider, and the like, which are not shown, for example, below the transfer device 430, and is provided so as to be movable in the XYZ direction.

(transfer device)

As shown in fig. 2, the transfer device 430 is a device that receives the film-like electronic component F held by the first holding head H1 and transfers the film-like electronic component F to the mounting device 60 via the bonding device 50. The transfer device 430 is also a device that receives the chip-shaped electronic component C from the tray T held by the second holding head H2 and transfers the chip-shaped electronic component C to the mounting device 60.

As shown in fig. 2, 3 (a) and 3 (B), the transfer device 430 includes a first arm 431, a cleaning device B, a measuring device G, and a second arm 432.

The first arm 431 is a member provided to be rotatable on a plane parallel to the XY plane by a drive source such as a motor not shown. The first arm 431 is a cross-shaped arm in which four substantially rectangular parallelepiped-shaped arms extend in a cross direction from the center, and the center is fixed to a rotation shaft of a drive source not shown. The front ends of the four arms are provided with suction nozzles 431a connected to an air pressure circuit. The suction nozzle 431a sucks and holds the back surface of the electrode portion of the film-like electronic component F held by the first holding head H1 from above over the entire width in the direction in which the electrodes of the film-like electronic component F are arranged by the negative pressure of the vacuum source of the air pressure circuit.

The first arm 431 makes an intermittent rotation every 90 °. More specifically, when the Y direction side where the press feeder 10 is located is set to the 12-dot direction of the clock as viewed from the rotation axis of the first arm 431, the intermittent rotation is performed in the counterclockwise direction or the clockwise direction so as to stop at the 12-dot position, the 9-dot position, the 6-dot position, and the 3-dot position. The first arm 431 is intermittently rotated counterclockwise in the following order: the film-like electronic part F is received from the first holding head H1 at a position of 12 dots, transferred to the second arm 432 at a position of 6 dots via the attachment of the ACF by the attaching device 50 at a position of 9 dots, and passed through a position of 3 dots.

As shown in fig. 8, a reference position R1 for defining the position of the receiving film-like electronic component F is set at the tip of the four arms of the first arm 431. The reference position R1 is, for example, a reference line parallel to the direction in which the arms extend, and is set toward the right side of the front ends of the arms as viewed from the center side of the first arm 431. The reference position R1 is a reference position where the film-like electronic component F sucked and held by the first arm 431 is bonded with the ACF in the bonding apparatus 50 described below when the film-like electronic component F is positioned at the 9-point position by the rotation of the first arm 431, and here is an end of the bonding apparatus 50 on the supply side of the tape member TP of the pressing head 530. The film-like electronic component F is delivered to the first arm 431 such that an end portion thereof, i.e., a short side on the right side as viewed from the center of the first arm 431 is aligned with the reference position R1. Thus, the film-like electronic component F is delivered to the first arm 431 such that one side thereof is aligned with the reference position R1, regardless of the size thereof. In other words, the film-like electronic component F is positionally aligned in the X direction with reference to the reference position R1 at the position of 12 dots. Accordingly, when the first arm 431 is rotated to face the bonding apparatus 50 described later, the alignment is performed with the position of the bonding apparatus 50 in the Y direction.

The cleaning device B is disposed below the first arm 431 at the position of the 12 th point. The cleaning device B is a device for removing dirt and the like adhering to the electrode portion of the punched film-shaped electronic component F. The cleaning device B has a brush B1. The brush B1 is provided so as to be rotatable about an axis in the X axis direction by a drive source such as a motor not shown. The cleaning device B is provided so as to be movable by a drive mechanism, not shown, in a direction of coming into contact with and separating from the electrode portion of the film-like electronic component F held by the first arm 431.

The measuring device G is disposed below the first arm 431 at the position of the above-mentioned 12 points. The measuring device G has a push-out surface G1 parallel to the XZ plane. The push-out surface G1 can be moved in the Y direction by a drive mechanism not shown. Thereby, the push-out surface G1 of the measuring device G is pushed out to the press-feeding device 10 side in a state where the film-shaped electronic component F is adsorbed by the adsorption nozzle 431a, and the relative position of the film-shaped electronic component F with respect to the adsorption nozzle 431a is shifted. That is, the measuring device G aligns the film-like electronic component F sucked by the suction nozzle 431a in the Y direction. Thus, when the film-like electronic component F is opposed to the bonding apparatus 50 by the rotation of the first arm 431, the film-like electronic component F is aligned with the position of the bonding apparatus 50 along the X direction. In other words, the measurement device G performs the position alignment of the film-like electronic part F in the Y direction at the position of 12 points, and performs the position alignment of the film-like electronic part F in the X direction at the position of 9 points. By the above-described alignment, the positions of the electrodes of the film-like electronic component F are positioned at the positions of the ACFs supplied by the bonding device 50, and the ACFs are bonded by the bonding device 50 with high accuracy.

The second arm 432 is disposed between the first arm 431 and the mounting device 60. The second arm 432 is a long member that can be rotated on a plane parallel to the XY plane by a driving source such as a motor. One end of the second arm 432 is fixed to a rotation shaft of a drive source, not shown. A swivel head 432a is provided at the front end of the second arm 432. The rotation head 432a is provided so as to be rotatable in the α direction with the longitudinal direction of the second arm 432 as an axis. The second arm 432 makes one intermittent rotation every 180 deg.. More specifically, the intermittent rotation is performed in the counterclockwise direction or the clockwise direction so as to stop at the position of 12 o 'clock and the position of 6 o' clock.

The spin head 432a is provided with a suction nozzle 432b extending in the radial direction of the spin circle. Although not shown, the suction nozzle 432b is connected to an air pressure circuit, and sucks and holds the film-like electronic component F or the chip-like electronic component C by the negative pressure of the vacuum source. The direction of the front end of the adsorption nozzle 432b is changed by 180 ° by the rotating head 432a. That is, the second arm 432 is configured as a reverse transfer device capable of reversing the received component.

Therefore, the suction nozzle 432b sucks and holds the film-like electronic component F from below when receiving the film-like electronic component F held by the suction nozzle 431a of the first arm 431, and sucks and holds the chip-like electronic components C one by one from above when picking up the chip-like electronic components C from the tray T held by the second holding head H2. That is, the press-and-supply device 10 presses the film-shaped electronic component F with the electrode portion facing downward, and the first holding head H1 holds the film-shaped electronic component F pressed by the press-and-supply device 10 from below in a state where the electrode portion faces downward, and transfers the film-shaped electronic component F to the first arm 431. The suction nozzle 431a of the first arm 431 sucks and holds the film-like electronic component F held from below by the first holding head H1 from above. Therefore, when the adsorption nozzle 432b receives the film-shaped electronic component F from the adsorption nozzle 431a, the film-shaped electronic component F is held from above by the adsorption nozzle 431a with the electrode portion facing downward, and therefore the adsorption nozzle 432b adsorbs and holds the electrode side from below. Further, since the chip-shaped electronic component C is accommodated in the tray T held by the second holding head H2 with the electrode portion facing upward, the suction nozzle 432b sucks and holds the chip-shaped electronic component C from above.

When the suction nozzle 432b sucks and holds the film-like electronic component F, the spin head 432a reaches the mounting device 60 with the electrode side facing downward. That is, in this case, the rotary head 432a is not inverted. When the chip-shaped electronic component C is sucked and held by the suction nozzle 432b, the spin head 432a faces the electrode side of the chip-shaped electronic component C downward before reaching the mounting device 60. That is, in this case, the rotary head 432a is inverted.

[ bonding apparatus ]

The bonding apparatus 50 bonds the ACF to the electrode portion of the film-shaped electronic component F held by the suction nozzle 431a of the first arm 431. As shown in fig. 9, the bonding apparatus 50 includes a supply unit 51, a cutting unit 52, a bonding unit 53, a peeling unit 54, a conveying unit 55, and a collecting unit 56.

(supply part)

The supply unit 51 supplies the tape member TP to the bonding unit 53. The tape member TP is formed by bonding an adhesive tape T1 including an ACF to a release tape T2, for example. The release tape T2 is a tape that can be peeled from the tape T1, and is formed of a resin film such as polyimide, for example. The width of the belt-like member TP of the present embodiment is about 0.5mm to 3.5 mm.

The supply unit 51 includes a supply reel 510, a tension mechanism 511, and a path roller 512. The supply reel 510 is a reel that winds the strip-shaped member TP and feeds out the strip-shaped member TP by rotation. The tension mechanism 511 applies tension to the belt-like member TP. The tension mechanism 511 is a pair of rollers arranged at a vertical distance so as to guide the movement of the strip-like member TP pulled out from the supply reel 510. One of the rollers is a fixed roller 511a which does not move up and down, and the other roller is a movable roller 511b which can move up and down. The movable roller 511b is moved up and down by an unshown lifting mechanism. I.e. in the direction of the black arrows in the figure. The path roller 512 is a roller that changes the moving direction of the belt-like member TP from the tension mechanism 511 and feeds the belt-like member TP toward the cutting unit 52.

(cutting part)

The cutting unit 52 cuts the tape T1 in the tape-like member TP. Hereinafter, cutting only the tape T1 as described above is referred to as half-cut, and a cut formed in the tape T1 by cutting the cutting portion 52 is referred to as a half-cut line HC. The half-cut lines HC are formed at intervals corresponding to the size of the film-like electronic parts F. The interval between the half-cut lines HC is substantially the same as the length of the side of the film-like electronic component F connected to the display panel. That is, the interval between the half-cut lines HC is defined according to the size of the side where the film-like electronic component F to be mounted is connected to the display panel.

The cutting unit 52 is provided upstream of the bonding unit 53, and includes a cutter 520 and a support member 521. The cutter 520 cuts the tape T1 in the width direction. That is, the blade at the front end of the cutter 520 extends in the width direction of the belt-like member TP. The cutter 520 is moved by a movement mechanism, not shown, so that the blade at the tip thereof is brought into contact with and separated from the tape T1. The cutter 520 forms the half-cut line HC on the strip member TP supplied from the supply part 51 according to the size of the film-like electronic part F as described above. The support member 521 is a block body having a substantially rectangular parallelepiped shape. The support member 521 sandwiches the strip member TP between the cutter 520 and has a flat surface 521a in contact with the release tape T2.

(attaching part)

The bonding portion 53 bonds the tape T1 of the tape member TP to the electrode portion of the film-like electronic component F. The bonding portion 53 includes a pressing head 530 and a support member 531. The pressing head 530 is moved up and down by a not-shown lifting device, thereby pushing up the tape member TP and heating and pressing the adhesive tape T1 to the electrode portion of the film-like electronic component F. Therefore, a heater, not shown, is provided in the pressing head 530 to heat the contact surface with the belt member TP to a specific temperature. Further, a buffer member 530a is provided on a contact surface of the pressing head 530 with the belt member TP. The cushioning member 530a is, for example, a sheet made of an elastic body, and prevents the adhesive tape T1 softened by heating from adhering to the pressing head 530. The support member 531 is a member that supports the first arm 431 from above when the tape T1 is heat-pressure-bonded to the electrode portion of the film-like electronic part F by the pressure head 530. The support member 531 has a pair of support rollers 531a at positions facing the pressure head 530, and the film-like electronic component F is held by the suction nozzle 431a on the outer peripheral surface of the support rollers 531a, and supports the upper surface of the first arm 431 rotated to be aligned with the position of the bonding apparatus 50.

The bonding position R2 is set in the bonding portion 53. The bonding position R2 is a reference position at which a half-cut line HC of the tape T1 in the tape-like member TP is aligned by the conveying unit 55 described below, and here is a position of the end of the pressing head 530 on the supply unit 51 side in the traveling direction of the tape-like member TP.

(peeling part)

The peeling section 54 peels the release tape T2 from the tape T1 bonded to the film-shaped electronic component F. The peeling section 54 includes a peeling rod 540 and a peeling rod 541. The peeling bars 540 and 541 are, for example, round bars, and are members that contact the release tape T2. The peeling bar 540 contacts the surface of the release tape T2, i.e., the surface on the tape T1 side, and the peeling bar 541 contacts the back surface of the release tape T2. The peeling bars 540 and 541 are horizontally moved along the upstream side (the direction of the arrow of the broken line) of the tape-like member TP while sandwiching the release tape T2 by a not-shown moving mechanism, as shown in fig. 9, thereby peeling the release tape T2 from the tape T1 pressure-bonded to the film-like electronic component F.

(conveying part)

The conveying unit 55 conveys the strip-shaped member TP from the supply unit 51 to the collection unit 56 via the bonding unit 53. In particular, the conveyor 55 feeds the tape member TP to the bonding section 53 such that the half-cut line HC is aligned with the bonding position R2. The conveying unit 55 includes a conveying roller 550 and a conveying motor, not shown. The conveying roller 550 holds the release tape T2 by a pair of rollers, and moves the tape-like member TP from the supply portion 51 side to the recovery portion 56 side by rotation of the rollers. The conveying motor is a driving source for rotating the conveying roller 550. The conveying motor has a rotating shaft coupled to the conveying roller 550, and the conveying roller 550 is rotated about the rotating shaft by driving the motor to rotate the rotating shaft about the shaft.

(recovery section)

The recovery unit 56 recovers the release tape T2 peeled from the tape T1 bonded to the electrode portion of the film-like electronic component F in the bonding unit 53. The recovery unit 56 includes a recovery reel 560 and a path roller 561. The take-up reel 560 is a reel for winding the release tape T2 and taking up. The path roller 561 is a roller that changes the moving direction of the release tape T2 from the bonding section 53 side and feeds it toward the take-up reel 560.

[ mounting device ]

As shown in fig. 2 and fig. 3 (a) and 3 (B), the mounting device 60 is a device that heat-pressure bonds the electrodes of the film-like electronic component F or the electrodes of the chip-like electronic component C to the electrodes of the display panel D via the ACF.

The mounting device 60 has a platform 610, a crimp 620. The platform 610 is a horizontal plate-like body on which the display panel D is placed. Although not shown, a suction hole connected to an air pressure circuit is formed on the upper surface of the table 610, and the display panel D is held by negative pressure suction. The stage 610 is provided so as to be movable in the X-axis direction, the Y-axis direction, and the θ direction by a drive mechanism, not shown.

As shown in fig. 3 (a) and 3 (B), the pressure-bonding section 620 includes a pressing member 621 and a support 622. The pressing member 621 heats and presses the film-like electronic component F or the chip-like electronic component C by superimposing the film-like electronic component F or the chip-like electronic component C on the display panel D supported by the stage 610 by a driving mechanism not shown. The pressing member 621 sucks and holds the film-shaped electronic component F or the chip-shaped electronic component C by a holding portion, not shown, and heats the film-shaped electronic component F or the chip-shaped electronic component C by a heating device, not shown. The support 622 is a member that supports the display panel D when the film-like electronic component F or the chip-like electronic component C is thermally and pressure bonded via the ACF by the pressing member 621.

Although the detailed description is omitted in the present embodiment, when the chip-shaped electronic component C is thermally and pressure bonded, the ACF is bonded to the display panel D in advance. In addition, even when the film-shaped electronic component F is thermally and pressure bonded, the ACF may be bonded to the display panel D in advance. In this case, the bonding of the ACF is not performed by the bonding device 50.

The crimping part 620 is a device for performing temporary crimping before performing final crimping. After the temporary pressure bonding is performed by the pressure bonding section 620, although not shown, the main pressure bonding is performed by a main pressure bonding section disposed in a downstream process.

[ control device ]

As shown in fig. 10, the control device 80 includes a mechanism control unit 81, a storage unit 82, and an input/output control unit 83. The mechanism control unit 81 controls the operations of the respective units of the punching supply device 10, the tray supply device 20, the delivery device 40, the bonding device 50, and the mounting device 60. The storage unit 82 stores information necessary for the control of the present embodiment, such as programs and data for realizing the above-described units. The input/output control unit 83 is an interface for controlling conversion of signals and input/output with each unit to be controlled.

Further, an input device 91 and an output device 92 are connected to the control device 80. The input device 91 is an input means such as a switch, a touch panel, a keyboard, and a mouse for allowing an operator to operate the electronic component mounting apparatus via the control device 80. The output device 92 is an output member such as a display device that uses information for confirming the state of the electronic component mounting apparatus to be visible to the operator.

[ Effect ]

The operation of the electronic component mounting apparatus as described above will be described in the case of separately mounting the film-like electronic component F and the chip-like electronic component C.

(mounting of film-like electronic parts)

First, a procedure for mounting the film-like electronic component F will be described with reference to fig. 3 (a) and fig. 11 to 13. The first holding head H1 is mounted in advance to the mounting portion 410. The half-cut line HC of the belt-like member TP on which the half-cut line HC is formed is positioned at the bonding position R2 by the conveyor section 55. As shown in fig. 11, the moving mechanism 420 moves the first holding head H1 attached to the attachment portion 410 so as to reach a position directly below the press feeding device 10 (step S01). In the press feeder 10, the film-shaped electronic component F is pressed out (step S02). The punched film-shaped electronic component F descends in a state of being attracted by the punch 132, and is attracted by the holding portion H11 of the first holding head H1 while being released from the attraction. Thereby, the first holding head H1 receives the film-like electronic component F (step S03).

The moving mechanism 420 moves the first holding head H1 that receives the film-like electronic component F to the lower portion of the adsorption nozzle 431a at the end of the first arm 431 (step S04). That is, the moving mechanism 420 moves the first holding head H1 so that the film-like electronic component F is positioned directly below the suction nozzle 431a of the arm positioned at the 12 o' clock among the four arms of the first arm 431. At this time, the moving mechanism 420 positions the film-like electronic component F in the X direction so that the end of the film-like electronic component F is aligned with the reference position R1 of the first arm 431 (step S05). Then, by performing the suction by the suction nozzle 431a while releasing the suction by the holding portion H11 of the first holding head H1, the first arm 431 receives the film-shaped electronic component F in a state where the end portion of the film-shaped electronic component F is aligned with the reference position R1 (step S06).

Next, at the position of 12 points, the cleaning device B is raised and brought into contact with the rotating brush B1, thereby cleaning the electrode portion of the film-like electronic component F (step S07). Further, after the cleaning device B that has finished cleaning is lowered, the pushing surface G1 of the measuring device G moves to the position of 12 points, and comes into contact with the film-like electronic component F, thereby aligning the film-like electronic component F sucked by the suction nozzle 431a in the Y direction (step S08).

Next, the bonding of the ACF to the film-shaped electronic component F and the temporary pressure-bonding of the film-shaped electronic component F to the display panel D will be described with reference to fig. 12. After the cleaning by the cleaning device B and the alignment by the measuring device G are completed, the first arm 431 is rotated to position the film-like electronic component F at 9 points, that is, the bonding device 50 (step S11). More specifically, the upper surface of the first arm 431 comes into contact with the support roller 531a and enters between the support member 531 and the belt member TP of the bonding device 50, and is positioned so as to be spaced apart from the film-shaped electronic component F by the first arm 431 to which the film-shaped electronic component F is adsorbed. At this time, when the first arm 431 is rotated at the position of 12 o' clock and is positioned at the bonding device 50, the reference position R1 set at the first arm 431 is set at the position where the ACFs are bonded, and thus the reference position R1 set at the first arm 431 matches the bonding position R2 set at the pressure head 530. As described above, the half-tangent line HC of the belt-like member TP on which the half-tangent line HC is formed is positioned at the bonding position R2. That is, as shown in fig. 13, the reference position R1, the half-cut line HC, and the bonding position R2 all coincide. Thus, in the bonding apparatus 50, each time the size of the film-like electronic component F changes, the ACF can be bonded to the film-like electronic components F having different sizes without controlling the alignment of the half-cut line HC of the tape-shaped member TP or providing a moving mechanism for moving the end of the pressing head 530.

In this state, the support roller 531a of the bearing member 531 supports the upper surface of the first arm 431. Then, the pressing head 530 is raised (step S12), and the tape-like member TP is pushed up from the release tape T2 side, so that the half-cut tape T1 is bonded to the electrode portion of the film-like electronic component F (step S13). After the tape T1 is attached, the pressure head 530 is lowered, and the peeling rod 540 and the peeling rod 541 are horizontally moved to the upstream side of the tape member TP, whereby the release tape T2 is peeled from the tape T1 attached to the electrode portion of the film-like electronic component F (step S14). The adhesive tape T1, i.e., the ACF, is attached to the film-shaped electronic component F in the above manner.

After the ACF is applied to the film-shaped electronic component F, the first arm 431 is rotated to position the film-shaped electronic component F at 6 o 'clock, and the film-shaped electronic component F is moved to the upper portion of the suction nozzle 432b of the second arm 432 waiting at 12 o' clock (step S15). Then, the film-like electronic component F is transferred to the second arm 432 by releasing the suction by the suction nozzle 431a of the first arm 431 and performing the suction by the suction nozzle 432b (step S16).

The second arm 432 is turned by 180 ° in the XY plane, and the film-like electronic part F is moved to the crimping part 620 of the mounting apparatus 60 (step S17). The suction by the suction nozzle 432b of the second arm 432 is released, and the suction by the pressing member 621 is performed, whereby the film-shaped electronic component F is held by the pressing member 621. Then, the pressing member 621 on which the film-like electronic component F is adsorbed is lowered, and thereby the electrode of the film-like electronic component F is heat-pressure bonded to the electrode of the display panel D via the ACF (step S18). The suction by the pressing member 621 is released, and the display panel D on which the film-like electronic component F is temporarily pressed is conveyed to the main pressure bonding section and is subjected to main pressure bonding.

Further, the film-like electronic parts F are first supplied by one of the press-supplying apparatuses 10 a. After the thin-plate-shaped member ST of the supply unit 110 of the press-feeding device 10a is used up, the press-feeding device is switched to another press-feeding device 10b, and the film-shaped electronic component F is continuously supplied. During this time, the reel of the thin plate-like member ST of the press feeder 10a is replaced, and after the thin plate-like member ST of the other press feeder 10b is used up, the supply of the film-like electronic components F by the press feeder 10a is switched again. This allows the electronic component mounting apparatus to be mounted continuously without stopping the electronic component mounting apparatus.

(mounting of chip-shaped electronic component)

Next, the mounting procedure of the chip-shaped electronic component C will be described with reference to fig. 3 (B), 5 (a) to 5 (F), and 14. The second holding head H2 is mounted in advance to the mounting portion 410. As shown in fig. 5 a, the moving mechanism 420 moves the second holding head H2 attached to the attachment 410 so as to reach a position directly below the tray supplying device 20 (step S21). In the tray supply device 20, as shown in fig. 5B, the holding portion H21 of the second holding head H2 is brought into contact with the bottom surface of the lowermost tray T and is suction-held (step S22). Then, the holding portion H21 of the second holding head H2 receives the tray T by the following procedure (step S23).

As shown in fig. 5 (C), the tray supply device 20 releases the grip of the grip portion 220. Then, as shown in fig. 5 (D), the second holding head H2 is lowered by one tray T. As shown in fig. 5 (E), the tray T one level higher than the lowermost level is gripped by the gripping unit 220 in the gripping unit 220. As shown in fig. 5 (F), the second holding head H2 is lowered to transfer the tray T to the holding portion H21.

The moving mechanism 420 moves the second holding head H2 that has received the tray T to a lower portion of the suction nozzle 432b of the second arm 432 (step S24). That is, the moving mechanism 420 moves the second holding head H2 so that the tray T is positioned below the suction nozzle 432b of the second arm 432 located at the 12 o' clock position. The suction nozzle 432b of the second arm 432 faces the tray T held by the second holding head H2 by the rotation of the rotating head 432a.

The moving mechanism 420 sequentially positions the chip-shaped electronic components C on the tray T at positions facing the suction nozzles 432b of the second arm 432. The positioning may be performed by scanning the tray T by a scanning unit, not shown. More specifically, the tray T is provided with housing portions partitioned into a grid shape, and the chip-shaped electronic components C are housed in these housing portions. Therefore, the storage portions are sequentially positioned at a position where the suction nozzle 432b of the second arm 432 receives the chip-shaped electronic component C, that is, at a position directly below the suction nozzle 432b when the second arm 432 is stopped at the position of 12 o' clock. Then, after one of the accommodating portions on the tray T is positioned, suction by the suction nozzle 432b is started, and the chip-shaped electronic component C is transferred to the second arm 432 (step S25).

The second arm 432 is rotated 180 ° in the XY plane, and the chip-like electronic part C is moved to the bonding part 620 of the mounting apparatus 60 (step S26). During the movement, the rotary head 432a rotates in the α direction and the chip-shaped electronic component C is inverted so that the electrode faces downward. The chip-shaped electronic component C is held by the pressure member 621 by releasing the suction by the suction nozzle 432b of the second arm 432 and simultaneously performing the suction by the pressure member 621 of the pressure-bonding section 620. Then, the electrode portions of the chip-shaped electronic component C are heat-pressure bonded to the electrodes of the display panel D via the ACF (step S27). The suction by the pressing member 621 is released, and the display panel D on which the chip-shaped electronic component C is temporarily pressed is conveyed to the main pressure-bonding section and is subjected to main pressure-bonding.

After the completion of the removal of the chip-shaped electronic components C from one tray T, the moving mechanism 420 conveys the second holding head H2 holding the empty tray T to the accommodating portion of the empty tray T prepared in the tray supply device 20, and transfers the tray T to the accommodating portion. Then, as described above, the moving mechanism 420 receives the tray T containing the chip-shaped electronic components C by the second holding head H2, and mounts the chip-shaped electronic components C. The receiving portion for the empty tray T may be provided at a position adjacent to the tray supply device 20, for example, in the same configuration as the tray supply device 20. By configuring as described above, the empty tray T can be stacked and stored in the reverse order of the tray supply device 20, that is, in the order of fig. 5 (F), 5 (E), 5 (D), 5 (C), 5 (B), and 5 (a).

Such feeding of the tray T is first performed by one of the tray feeding devices 20a. After the tray T containing the chip-shaped electronic components C is used up, the tray supply device 20a is switched to another tray supply device 20b, and the supply of the tray T is continued. During this period, the tray T of the tray supply device 20a is replaced, and after the tray T of the other tray supply device 20b is used up, the supply of the tray T by the tray supply device 20a is switched again. This allows the electronic component mounting apparatus to be mounted continuously without stopping the electronic component mounting apparatus.

[ Effect ]

(1) The electronic component mounting apparatus of the present embodiment includes: a press feeder 10 for feeding a film-like electronic component F; a bonding device 50 for bonding the anisotropic conductive member to the film-like electronic component F at a specific bonding position R2; a mounting device 60 for mounting a film-like electronic component F to which an anisotropic conductive member is bonded on a display panel D; and a delivery device 40 that sets a reference position R1 aligned with the bonding position R2, receives the film-shaped electronic component F from the press-feeding device 10 with the end of the film-shaped electronic component F aligned with the reference position R1, bonds the anisotropic conductive member, and then transfers the film-shaped electronic component F to the mounting device 60.

As a result, as shown in fig. 15 (a) to 15 (C), even if the film-like electronic components F have different sizes, the end portions thereof are aligned with the reference position R1. Therefore, even if the size of the film-like electronic component F to be supplied changes, the ACF can be accurately bonded to the film-like electronic component F without providing a moving mechanism for moving the pressing head 530 of the bonding device 50. This can simplify the time required for the alignment of the pressure head 530 of the bonding apparatus 50, thereby improving productivity, and can eliminate a moving mechanism for moving the pressure head 530, thereby reducing costs.

(2) The bonding apparatus 50 of the present embodiment includes: a cutting portion 52 that forms slits in the anisotropic conductive member at intervals corresponding to the size of the film-like electronic component F; and a conveying unit 55 that feeds out the anisotropic conductive member so that the slits are aligned with the bonding positions R2. Accordingly, when the film-like electronic component F is positioned in the bonding apparatus 50, the alignment between the reference position R1 and the bonding position R2 is completed, and the alignment between the bonding position R2 and the slit of the anisotropic conductive member is also completed, so that the time required for aligning the slit of the anisotropic conductive member with the bonding position can be simplified.

(3) The handover device 40 of the present embodiment includes: a first arm 431 that receives the film-like electronic component F from the press feeder 10; and a measuring device G for adjusting a position at which the first arm 431 receives the film-shaped electronic component F in a state in which the end portion of the film-shaped electronic component F is aligned with the reference position R1. This enables the anisotropic conductive member to be aligned with the film-like electronic component F in the width direction of the anisotropic conductive member.

(4) The electronic component mounting apparatus of the present embodiment further includes: the tray supply device 20 supplies the tray T in which the chip-shaped electronic components C are accommodated, and the delivery device 40 receives the chip-shaped electronic components C from the tray supply device 20 and transfers the chip-shaped electronic components C to the mounting device 60, and the mounting device 60 mounts the chip-shaped electronic components C on the display panel D to which the anisotropic conductive member is bonded in advance. This makes it possible to selectively mount the film-like electronic component F to which the anisotropic conductive member is bonded on the display panel D and mount the chip-like electronic component C on the display panel D to which the anisotropic conductive member is bonded.

[ modification ]

(1) In the above embodiment, the description has been made only with the configuration in which one of the press feeding devices 10a and the other press feeding device 10b are alternately switched, but the thin plate-like member ST in which the film-like electronic parts F having different sizes are formed may be attached to one of the press feeding devices 10a and the other press feeding device 10 b. With the present embodiment, it is not necessary to align the position of the cut of the ACF with respect to the end of the COF each time the size of the COF changes, and therefore a plurality of film-like electronic components F having different sizes can be easily mounted on the display panel D without stopping the electronic component mounting apparatus.

(2) In the above embodiment, the press-feeding device 10 that presses the film-like electronic component F from the thin plate-like member ST is used as a configuration for feeding the film-like electronic component F, but the present invention is not limited thereto. For example, a supply device that supplies the film-like electronic component F that is punched out in advance from the thin plate-like member ST may be used.

(3) The bonding apparatus 50 according to the above embodiment includes a supply unit 51, a cutting unit 52, a bonding unit 53, a peeling unit 54, a conveying unit 55, and a collecting unit 56, but is not limited thereto. The bonding apparatus 50 may include at least the bonding section 53, and the other configurations, that is, the supply section 51, the cutting section 52, the peeling section 54, the conveying section 55, and the collecting section 56, may be configured differently from the bonding apparatus 50.

(4) The tape T1 of the above embodiment has the half-cut line HC formed as a slit in the cut portion 52, but is not limited thereto. The tape T1 may be one in which slits are formed in advance according to the size of the film-shaped electronic component F. Further, the tape T1 is not necessarily provided with slits, and for example, numerous fine holes may be formed on the entire surface of the tape T1 and the peeling portion 54 may be torn along the edge of the film-like electronic component F as a boundary line.

(5) The electronic component mounting apparatus may include the mounting portions 410 of the first holding head H1 and the second holding head H2, and is not limited to the configuration in which both can be replaced. For example, a device having a plurality of mounting portions 410 may be used, in which one of the mounting portions is fixed to the first holding head H1 and the other mounting portion is fixed to the second holding head H2. This allows switching between mounting of the film-like electronic component F and mounting of the chip-like electronic component C without replacing the first holding head H1 and the second holding head H2.

(6) The pair of moving mechanisms 420 may be provided along the X-axis direction via the transfer device 430. That is, one of the moving mechanisms 420 may be provided corresponding to one of the press feeder 10a and the tray feeder 20a, and the other moving mechanism 420 may be provided corresponding to the other of the press feeder 10b and the tray feeder 20 b. In addition, a pair of first and second holding heads H1 and H2 may be provided corresponding to the pair of moving mechanisms 420.

(7) Since the movement paths of the film-shaped electronic component F and the chip-shaped electronic component C are common to the second arm 432, the film-shaped electronic component F and the chip-shaped electronic component C can be positioned by a common camera by providing the camera for imaging the film-shaped electronic component F and the chip-shaped electronic component C at two stop positions (a position at 12 o 'clock and a position at 6 o' clock) of the second arm 432. For example, one pre-alignment camera is disposed at a position above the suction nozzle 432b at the position of 12 dots. While the film-like electronic part F is held by the adsorption nozzle 432b, the alignment marks provided at both ends of the electrode portion in the film-like electronic part F are photographed using the camera, and the position of the film-like electronic part F is recognized based on the alignment marks. The recognition may be performed by the control device 80 using a known image recognition technique. Based on the recognition position, when the film-like electronic component F is transferred to the pressure member 621, the relative position of the adsorption nozzle 432b and the pressure member 621 is adjusted. This ensures the positional accuracy of the transfer of the film-like electronic component F to the pressing member 621.

When the chip-shaped electronic component C is taken out from the tray T, the alignment mark provided on the electrode surface of the chip-shaped electronic component C is photographed, and the position of the chip-shaped electronic component C is recognized based on the alignment mark. Based on the recognition position, the relative position between the suction nozzle 432b and the chip-shaped electronic component C when the chip-shaped electronic component C is taken out is adjusted. This ensures the positional accuracy of the transfer of the film-like electronic component F to the pressing member 621.

On the other hand, a pair of simultaneous recognition cameras for temporary crimping is arranged at a position of 6 points. The simultaneous recognition camera simultaneously takes an image of the alignment mark provided at one end of the electrode portions of the film-like electronic component F and the chip-like electronic component C and the alignment mark of the display panel D corresponding thereto, which are introduced into the field of view. The recognition cameras are arranged in a pair corresponding to the alignment marks at both ends of the film-like electronic component F and the chip-like electronic component C. This ensures the accuracy of the film-shaped electronic component F when it is temporarily pressed and the chip-shaped electronic component C when it is temporarily pressed.

[ other embodiments ]

While the embodiments and the modifications of the respective parts of the present invention have been described above, the embodiments and the modifications of the respective parts are presented as examples and do not limit the scope of the present invention. The above-described novel embodiments can be implemented in other various embodiments, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope or gist of the invention and are included in the invention described in the scope of the claims.

Claims

1. An electronic part mounting apparatus comprising:

a supply device for supplying the film-like electronic component;

a bonding device for bonding the anisotropic conductive member to the film-like electronic component at a specific bonding position;

a mounting device for mounting the film-like electronic component to which the anisotropic conductive member is bonded on a display panel; and

and a transfer device that sets a reference position for aligning the bonding position, aligns an end of the film-like electronic component with the reference position, receives the film-like electronic component from the supply device, bonds the anisotropic conductive member, and then transfers the film-like electronic component to the mounting device.

2. The electronic parts mounting apparatus as claimed in claim 1, wherein

The laminating device includes:

a cutting portion that forms slits in the anisotropic conductive member at intervals corresponding to the size of the film-like electronic component; and

and a conveying unit configured to send out the anisotropic conductive member such that the slit is aligned with the bonding position.

3. The electronic parts mounting apparatus as claimed in claim 1, wherein

The handover device includes:

an arm that receives the film-like electronic parts from the supply device; and

and a measuring device that adjusts a position at which the arm receives the film-like electronic component in a state in which an end portion of the film-like electronic component is aligned with the reference position.

4. The electronic parts mounting apparatus according to claim 2, wherein

The handover apparatus includes:

an arm that receives the film-like electronic parts from the supply device; and

5. The electronic parts mounting apparatus according to claim 3, wherein

The attaching device further includes:

a support member supporting the arm receiving the film-like electronic parts, and

the support member has a pair of support rollers, and supports the arms by outer peripheral surfaces of the support rollers.

6. The electronic parts mounting apparatus as claimed in claim 4, wherein

The attaching device further includes:

7. The electronic part mounting apparatus according to any one of claims 1 to 6, further comprising:

a tray supply device for supplying a tray containing chip-like electronic components

The delivery device receives the chip-shaped electronic component from the tray supply device and transfers the chip-shaped electronic component to the mounting device,

the mounting device mounts the chip-shaped electronic component on a display panel to which an anisotropic conductive member is bonded in advance.