JPS61222724A - Bonding of member - Google Patents

Bonding of member

Info

Publication number
JPS61222724A
JPS61222724A JP60064476A JP6447685A JPS61222724A JP S61222724 A JPS61222724 A JP S61222724A JP 60064476 A JP60064476 A JP 60064476A JP 6447685 A JP6447685 A JP 6447685A JP S61222724 A JPS61222724 A JP S61222724A
Authority
JP
Japan
Prior art keywords
adhesive
board
bonding
bonded
bonding agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60064476A
Other languages
Japanese (ja)
Inventor
Shojiro Kotai
小鯛　正二郎
Masumi Tsuda
津田　真澄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIYOUDEN KASEI KK
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Original Assignee
RIYOUDEN KASEI KK
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIYOUDEN KASEI KK, Ryoden Kasei Co Ltd, Mitsubishi Electric Corp filed Critical RIYOUDEN KASEI KK
Priority to JP60064476A priority Critical patent/JPS61222724A/en
Publication of JPS61222724A publication Critical patent/JPS61222724A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322—Providing cavities in the joined article to collect the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1222—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1224—Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a butt joint-segment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To improve the accuracy in the thickness of a product by a method wherein recesses for storing excessive bonding agent is provided in the housing part of a board, in which a member to be bonded is fixed by bonding. CONSTITUTION:Storage recesses 1b for storing excessive bonding agent are provided in the housing part 1a of a board 1. A member to be bonded, which consists of an IC board 3 having an IC module 2, is arranged through thixotropic bonding agent 4 in the housing part 1a and fixed by bonding after pressing said member down to the position with the predetermined height. Due to the thixotropic property of the bonding agent, the member can be accurately positioned at the position with the predetermined height. In addition, no bonding agent overflows the surface of a product, because excessive bonding agent 4a is stored in recesses 1b. Because the member to be bonded can be accurately made flush with the board, the titled bonding is suitable for manufacturing IC cards and the like.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、部材の接着方法に関し、特に被接着部材の接
着高さの位置端、度の改善に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for bonding members, and particularly to improving the position and degree of bonding height of members to be bonded.

〔従来の技術〕[Conventional technology]

従来、部材同志を接着する場合は、その目、的に応じた
各種の方法があり、例えば基体上に被接着部材を単に接
着する場合は、接着剤を用いる方法が一般的である。と
ころで、このような接着方法においては１、上記被接着
部材を基体上の所定高さ（すに精度よく位置決め接着す
る必要がある場合があり、このような要請のあるものと
して、ＩＣカードがある。Conventionally, when bonding members together, there are various methods depending on the purpose. For example, when simply bonding members onto a substrate, a method using an adhesive is generally used. By the way, in such a bonding method, there are cases where it is necessary to position and bond the above-mentioned member to be bonded at a predetermined height (accurately) on the substrate, and an example of such a requirement is an IC card. .

ＩＣカードは、一般に主として基体であるカード本体と
、被接着部材であるＩＣモジュール搭載基板と、カバー
フィルムとからなり、大容量の記憶岬力と、照合、機能
等の任意の演算機能を有するもをであり、このＩＣカー
ドにおいては、上記ＩＣモジュール搭載基板をカード本
体の収容部に全体の厚さが所定厚さになるように接着固
定する必要がある。An IC card generally consists of a card body as a base, an IC module mounting board as an adhered member, and a cover film, and has a large capacity of memory and arbitrary calculation functions such as verification and functions. In this IC card, it is necessary to adhesively fix the IC module mounting board to the accommodating portion of the card body so that the overall thickness becomes a predetermined thickness.

、このようなｔＣカードにおいては従来、粘着シートを
接着剤として用いて、上記ＩＣ基板をカード本体の収容
部に接着するようにしていた。　　、〔発明が解決しよ
うとする問題点〕 上記従来の接着方法においては、粘着シートを使用する
わけであるが、この粘着シートは厚さ誤差が生じ易いも
のであり、また当然ながらＩＣ基板、カード本体にも厚
さ誤差があり、このように基体、及び被接着部材１には
厚さ誤差があるのが一般的であるから、両者を単に接着
剤により接着する従来方法では、その被接着部材の高さ
位置、ひいては全体の厚さを所定値にするのは非常に困
難である。Conventionally, in such a tC card, an adhesive sheet has been used as an adhesive to adhere the IC board to the accommodating portion of the card body. , [Problems to be Solved by the Invention] In the conventional bonding method described above, an adhesive sheet is used, but this adhesive sheet tends to have thickness errors, and of course, it is difficult to There is also a thickness error in the main body, and it is common that there is a thickness error in the base body and the adhered member 1. Therefore, in the conventional method of simply bonding the two with adhesive, the adhered member It is very difficult to set the height position and thus the overall thickness to a predetermined value.

そこで本発明者は上記問題５点を改善するために以下の
接着方法を考案した。第２図は本発明の成立過程を説明
するためのもので、図において、１は基体であるカード
本体、２はメモリ、ＣＰＵ等からなるＩＣモジュール、
３は該ＩＣモジュール２が搭載されたＩＣ基板、１ａは
上記カード本体１に凹設された、ＩＣ基板３．及びＩＣ
モジュール２を収容するための収容部であり、これは上
記ＩＣ基板３．及びＩＣモジュール２の下面形状に応じ
た形状になっている。Therefore, the present inventor devised the following bonding method in order to improve the above five problems. FIG. 2 is for explaining the process of establishing the present invention. In the figure, 1 is a card body which is a base, 2 is an IC module consisting of a memory, a CPU, etc.
3 is an IC board on which the IC module 2 is mounted, and 1a is an IC board 3.3 recessed in the card body 1. and IC
This is a accommodating part for accommodating the module 2, and this is the accommodating part for accommodating the module 2. And the shape corresponds to the shape of the lower surface of the IC module 2.

また４は上記ＩＣ基板３を上記収容部１ａ上面に接着す
るための接着剤であり、この接着剤４はチクソトロピッ
ク性、即ち粘弾性がなく所定厚さに押圧した場合、その
厚さの状態に保持される性質を有する接着剤である。Further, 4 is an adhesive for bonding the above-mentioned IC board 3 to the upper surface of the above-mentioned accommodating portion 1a. It is an adhesive that has the property of being retained.

この第２図に示すＩＣカードにおいてＩＣモジュール２
が搭載されたＩＣ基板３をカード本体１上に接着するに
は、上記収容部ｌａ上に所定量の、例えば接着状態にお
ける収容部１ａと【Ｃ基板３とで囲まれた空間より少し
多めの接着剤４を配置し、この接着剤４上にＩＣモジュ
ール２が搭載されたＩＣ基板３を載置し、これを図示し
ないプレス装置により該ＩＣ基板３及びカード本体ｌの
厚さが所定値になるまで押下する。In the IC card shown in FIG.
In order to adhere the IC board 3 on which the IC board 3 is mounted onto the card body 1, a predetermined amount of space, for example, slightly larger than the space surrounded by the accommodating part 1a and the [C board 3] in the bonded state, is placed on the accommodating part la. An adhesive 4 is placed, and the IC board 3 on which the IC module 2 is mounted is placed on the adhesive 4, and then the thickness of the IC board 3 and the card body l is adjusted to a predetermined value using a press device (not shown). Press down until it appears.

すると上記接着剤４はＩＣ基板３と収容部１ａとの間に
おいてその厚さが薄くなりつつ、上記空間内に拡がって
いく。そしてこの際上述のＩＣ基板３．カード本体ｌの
厚さ誤差は上記接着剤４の変形により吸収され、またＩ
Ｃ基板３は該接着剤４のチクソトロピック性により該押
下位置に保持され、その結果全体の厚さは確実に上記所
定値になることとなる。Then, the thickness of the adhesive 4 becomes thinner between the IC board 3 and the accommodating portion 1a, and spreads into the space. At this time, the above-mentioned IC board 3. The thickness error of the card body l is absorbed by the deformation of the adhesive 4, and
The C substrate 3 is held in the pressed position by the thixotropic property of the adhesive 4, and as a result, the overall thickness is reliably kept at the predetermined value.

しかしながらこの第２図のものでは、接着剤４の一部、
即ち上述の空間より多い分に相当する余分の接着剤４ａ
がＩＣ基板３と収容部１ａの壁面ＩＣとの間から外方に
押し出され、従ってこの余分の接着剤４ａを除去する必
要が生じる。この接着剤４ａの流出を防止するには、接
着剤４の量を上述の空間より少なめにすればよいが、こ
のようにすると今度は接着強度の信頗性が低下するとい
う問題が生じる。However, in this figure 2, part of the adhesive 4,
That is, the extra adhesive 4a corresponds to more than the above-mentioned space.
is pushed out from between the IC substrate 3 and the wall IC of the accommodating portion 1a, and therefore, it becomes necessary to remove this excess adhesive 4a. In order to prevent the adhesive 4a from flowing out, the amount of the adhesive 4 may be made smaller than the above-mentioned space, but if this is done, a problem arises in that the reliability of the adhesive strength is reduced.

本発明は、このような問題点を解消するためになされた
もので、被接着部材を基体上の所定高さ位置に精度よく
位置決め接着固定できる部材の接着方法を提供すること
を目的としている。The present invention has been made to solve these problems, and an object of the present invention is to provide a method for adhering members that can accurately position and adhesively fix a member to be adhered to a predetermined height position on a base body.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、部材の接着方法において、基体の収容部の壁
面に余分の接着剤を貯留するための凹部を形成し、被接
着部材をチクソトロピック性接着剤を介して収容部上に
配置し、上記被接着部材を所定高さ位置まで押下するよ
うにしたものである。The present invention provides a method for bonding members, in which a recess for storing excess adhesive is formed on the wall surface of a housing portion of a base body, and a member to be bonded is placed on the housing portion via a thixotropic adhesive. The adhered member is pressed down to a predetermined height position.

〔作用〕[Effect]

本発明では、基体、被接着部材の厚さ誤差は接着剤の変
形により吸収され、該接着剤のチクソトロピンク性によ
り被接着部材は所定の高さ位置に精度よく位置決め接着
され、またこの際上記接着剤のうち余分のものは貯留凹
部内に貯留され、余分の接着剤が外部に流出することは
ない。In the present invention, thickness errors between the substrate and the adhered member are absorbed by the deformation of the adhesive, and the adhered member is precisely positioned and adhered at a predetermined height position due to the thixotropic property of the adhesive. The excess adhesive is stored in the storage recess, and the excess adhesive does not flow out.

〔実施例〕〔Example〕

以下、本発明の実施例を図について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

第１歯は本発明の一実施例を示す。図において第２図と
同一符号は同−又は相当部分を示し、基体１の収容部１
ａの底壁には、接着剤４のうち余分のもの、即ち外方に
流出しようとする接着剤部分４ａを貯留するための貯留
凹部１ｂが凹設されている。この貯留凹部１ｂは収容部
１ａの側壁ＩＣに沿った形状の平面環状のものである。The first tooth represents one embodiment of the invention. In the figure, the same reference numerals as in FIG. 2 indicate the same or corresponding parts, and
A storage recess 1b is provided in the bottom wall of a for storing an excess of the adhesive 4, that is, an adhesive portion 4a that tends to flow outward. This storage recess 1b has a planar annular shape along the side wall IC of the accommodating portion 1a.

本実施例において、カード本体１上にＩＣ基板３を接着
するには、上述の第２図の場合と全く同様にして行なう
。そしてこの際、本実施例方法では、接着剤４のうち外
方に拡がっていく部分４ａは、上記貯留凹部１ｂ内に貯
留され、外部に流出することはない。In this embodiment, the IC board 3 is bonded onto the card body 1 in exactly the same manner as in the case of FIG. 2 described above. At this time, in the method of this embodiment, the outwardly expanding portion 4a of the adhesive 4 is stored in the storage recess 1b and does not flow out.

このように本実施例では、ＩＣ基板３を所定の高さ位置
に位置決め接着でき、ＩＣカードを所定の厚さに精度よ
く形成でき、またこの際に接着剤が外方に流出すること
なく、接着強度を保持できる。In this way, in this embodiment, the IC board 3 can be positioned and bonded at a predetermined height position, the IC card can be formed to a predetermined thickness with high precision, and the adhesive does not flow outward at this time. Can maintain adhesive strength.

なお、上記実施例では貯留凹部１ｂを収容部１ａの底壁
に形成したが、この貯留凹部１ｂは収容部壁面であれば
どこに形成してもよく、例えば側壁ＩＣに凹設してもよ
い。In the above embodiment, the storage recess 1b is formed in the bottom wall of the accommodating part 1a, but the storage recess 1b may be formed anywhere on the wall of the accommodating part, for example, it may be recessed in the side wall IC.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明に係る部材の接着方法によれば、基
体の収容部の壁面に貯留凹部を形成し、被接着部材をチ
クソトロピック性接着剤を介して収容部上に配置し、上
記被接着部材を所定高さ位置まで押下するようにしたの
で、被接着部材の高さ位置の精度を大きく向上できる効
果がある。As described above, according to the method for bonding members according to the present invention, a storage recess is formed in the wall surface of the accommodating part of the base body, the member to be bonded is placed on the accommodating part via a thixotropic adhesive, and the member to be adhered is placed on the accommodating part via a thixotropic adhesive. Since the adhesive member is pressed down to a predetermined height position, the accuracy of the height position of the adhered member can be greatly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例による部材の接着方法を説明
するための断面図、第２図は本発明の成立過程を説明す
るための断面図である。 図において、１はカード本体（基体）、１ａは収容部、
１ｂは貯留凹部、３はｔＣ基板（被接着部材）、４は接
着剤、４ａは余分の接着剤である。 なお図中同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional view for explaining a method of bonding members according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view for explaining the process of establishing the present invention. In the figure, 1 is the card body (base), 1a is the storage part,
1b is a storage recess, 3 is a tC substrate (member to be bonded), 4 is an adhesive, and 4a is an excess adhesive. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] （１）基体上の所定高さ位置に被接着部材を接着固定す
る方法であって、基体の被接着部材収容部の壁面に余分
の接着剤を貯留するための凹部を形成し、上記被接着部
材をチクソトロピック性接着剤を介して上記収容部に配
置し、上記被接着部材を上記所定高さまで押下すること
を特徴とする部材の接着方法。(1) A method for adhesively fixing a member to be adhered to a predetermined height position on a base, in which a recess for storing excess adhesive is formed on the wall surface of a member-to-be-adhered portion of the base; A method for bonding members, characterized in that the member is placed in the housing portion via a thixotropic adhesive, and the member to be bonded is pressed down to the predetermined height.
JP60064476A 1985-03-28 1985-03-28 Bonding of member Pending JPS61222724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60064476A JPS61222724A (en) 1985-03-28 1985-03-28 Bonding of member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60064476A JPS61222724A (en) 1985-03-28 1985-03-28 Bonding of member

Publications (1)

Publication Number Publication Date
JPS61222724A true JPS61222724A (en) 1986-10-03

Family

ID=13259317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60064476A Pending JPS61222724A (en) 1985-03-28 1985-03-28 Bonding of member

Country Status (1)

Country Link
JP (1) JPS61222724A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1024005A3 (en) * 1999-01-29 2001-03-07 Seiko Epson Corporation Ink jet recording head and method of manufacturing the same
CN111277102A (en) * 2018-12-04 2020-06-12 日本电产三协株式会社 Actuator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1024005A3 (en) * 1999-01-29 2001-03-07 Seiko Epson Corporation Ink jet recording head and method of manufacturing the same
US6382778B1 (en) 1999-01-29 2002-05-07 Seiko Epson Corporation Ink jet recording head and method of manufacturing the same
CN111277102A (en) * 2018-12-04 2020-06-12 日本电产三协株式会社 Actuator

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