JPS63160897A - Integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) This invention relates to an integrated circuit device such as an IC card, and particularly relates to a method for mounting a plurality of integrated circuit elements on the same support base and mounting them on the same support base. The present invention relates to an integrated circuit device configured by interconnecting wiring patterns formed on a support base.

(Prior Art) An integrated circuit device in which a plurality of integrated circuit elements are mounted on the same support base and is provided with wiring for interconnecting them is generally called an IC module. An example of this is a so-called IC card, in which an IC chip is mounted on a card-like base to provide calculation and storage functions.

In such devices, a technique has been proposed in which integrated circuit elements are placed in openings in a support base and interconnected by wiring patterns formed on the support base by screen printing or the like (for example, in a patent application). Showa 59-190
2011). According to this, there is no need to loop hide bonding wires, which is required when wire bonding is used to interconnect integrated circuit elements, so that the overall thickness can be reduced.

In this structure, in order to reliably interconnect the integrated circuit elements, the relative positional accuracy of the input/output terminals (electrode pads) of the integrated circuit elements, in other words, the relative positional accuracy between the integrated circuit elements must be sufficiently high. There is a need. For example, if the electrode size of the input/output terminal of an integrated circuit element is 100 μm,
The relative position accuracy between integrated circuit elements must be within ±30 μm.

If this level of relative positional accuracy is not ensured, when forming wiring patterns by screen printing, etc., masks must be aligned to optimize the positional relationship between the input/output terminals of a certain integrated circuit element and the wiring pattern. However, it is difficult to correctly align the positional relationship between the integrated circuit element and the wiring patterns of other integrated circuit elements to be connected. Therefore, in an integrated circuit device having this structure, it has been virtually impossible to mount and interconnect three or more integrated circuit elements.

(Problems to be Solved by the Invention) As described above, with the conventional techniques, it is difficult to mount a plurality of integrated circuit elements on the same support base and reliably interconnect them using wiring patterns.

The present invention provides an integrated circuit device in which integrated circuit elements can be positioned with high precision with respect to a support base, and integrated circuit elements can be reliably connected to each other by wiring patterns formed on the support base. The purpose is to

[Structure of the invention]

(Means for Solving the Problems) The present invention provides for positioning the opening portion of the support base for accommodating the integrated circuit device at a position that contacts the side surface of the integrated circuit device at a position shifted toward the input/output terminal forming surface side. It is characterized by having a protrusion for use.

(Function) Integrated circuit elements are generally separated into chips from a single wafer by dicing, but dicing is not performed over the entire thickness of the wafer, but after dicing to an appropriate thickness from the input/output terminal forming surface. Since the integrated circuit element is separated into chips by applying a pressing force, the dimensional accuracy of the side surface of the integrated circuit element near the input/output terminal forming surface is very high due to dicing. In the present invention, the integrated circuit element can be positioned with high precision by abutting the side surface of a portion of the integrated circuit element with high dimensional accuracy against the positioning protrusion. Therefore, the relative positional accuracy between the integrated circuit elements is increased, and the interconnection patterns are reliably connected to each other.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1(a) and 1(b) are a sectional view and a plan view of an integrated circuit device according to an embodiment of the present invention. In the figure, a support base 1 is made of metal such as stainless steel, and has a plurality of openings 2 for respectively accommodating integrated circuit cables 3. As shown in FIG. The integrated circuit element 3 is placed with the surface on which the input/output terminals 4 are formed facing down.
It is inserted into the opening 2 so that this input/output forming surface is located on the same plane as one surface of the support base 1.

The opening 2 has a generally rectangular shape as a whole, but has three positioning projections 5a to 5c in this example at positions shifted toward the input/output terminal forming surface of the integrated circuit element 3. That is, among these three positioning protrusions 5a to 5C, 5
Two pieces a and 5b are formed on one long side of the opening 2, and the remaining one 50 is formed on one short side adjacent to the side where 5a and 5b are formed. These positioning protrusions 5a to 5C contact the side surface of the integrated circuit element 3 at a position shifted toward the input/output terminal forming surface side, thereby positioning the integrated circuit cable 3 with respect to the support base 1. .

A curable resin 6 is placed around the integrated circuit element 3 in the opening 2.
For example, it is filled with a photocurable or thermosetting urethane-based, acrylic-based, or epoxy-based resin. Further, an insulating film 7 is formed on the input/output forming surface of the integrated circuit cable 3 and the surface of the supporting base 1 on the same surface so that the input/output terminals 4 are exposed. A wiring pattern 8 for interconnecting the integrated circuit elements 3 is formed thereon. Note that filling of the curable resin 6 may be performed after the insulating film 7 is formed.

The insulator film 7 is, for example, a photosensitive dry film, such as a polymethyl methacrylate resin mixed with a cross-linking reactive material (known under trade names such as Tukton and Bakel).
is applied, exposed and developed to form openings that expose the input/output terminals 4. The reason why the curable resin 6 is filled is that if there is a gap around the integrated circuit element 3 in the opening 2 during development of the photosensitive dry film, the film will wrinkle and the wiring on the surface of the insulating film 7 will be formed. pattern 8
This is because it becomes difficult to form.

Note that the wiring pattern 8 is formed by screen printing using, for example, a thick film conductor paste.

FIG. 2 shows an enlarged view of the integrated circuit element 3 (IC chip), and shows an area A shifted to the surface where the input/output terminals 4 are formed.
Since the side surfaces of the area B are diced, the dimensional accuracy is very high, but the other area B is not diced and is separated by pressing force, so the dimensional accuracy is extremely low. In the present invention, as explained in the above embodiment, A with high dimensional accuracy
Since the integrated circuit element 3 is positioned by bringing the positioning protrusions 5a to 5C into contact with the regions, the integrated circuit cable 3 can be fixed to the support base 1 with a high relative positional accuracy of approximately ±3 μm. . This is a value that easily satisfies ±30 μm required as relative positional accuracy of integrated circuit elements, and therefore it is possible to reliably connect the integrated circuit cables 3 to each other by the wiring pattern 8.

Note that the support base 1 explained in the above embodiment includes a first plate 11 and a thinner second plate 1, as shown in FIG. 3, for example.
2 are stacked and integrated, and positioning protrusions 58 to 5C are formed in the opening 2 of the second plate 12.

The positioning protrusions 5a to 5C must be formed with sufficient precision, and the openings 2 may be formed by etching. The first and second plates 11, 12 are made of stainless steel, for example, and the second plate 12 is a thin plate of about 30 to 100 μm. It is easy to form the positioning projections 5a to 5c on such a thin plate 12 by etching. The second plate 12 on which the positioning protrusions 5a to 5c are formed is adhesively fixed to the first plate 11 by, for example, spot welding, seam welding, adhesive, or solder, thereby forming the support base 1. Note that the supporting base 1 may be made of resin instead of metal, for example.

[Effects of the Invention] According to the present invention, the positioning protrusion is formed at a position that contacts the side surface of the opening of the support base at a position shifted toward the input/output terminal forming surface of the integrated circuit element, and the integrated circuit By positioning the elements, it is possible to support and fix the integrated circuit elements on the same support base with extremely high relative positional accuracy, and then reliably connect them to each other using the wiring pattern formed on the support base. Therefore, in the present invention, in a structure in which integrated circuit elements are directly interconnected by wiring patterns, it becomes possible to mount three or more integrated circuit elements, which was previously considered difficult. This can contribute to improving the functionality of IC modules such as IC cards.

[Brief explanation of the drawing]

1(a) and 1(b) are a sectional view and a front view of an integrated circuit device according to an embodiment of the present invention, FIG. 2 is a diagram for explaining the side shape of an integrated circuit element, and FIG. 3 is the same. FIG. 3 is an exploded perspective view showing details of a support base in an example. DESCRIPTION OF SYMBOLS 1... Support base, 2... Opening, 3... Integrated circuit element, 4... Input/output terminal, 5a-5C... Positioning protrusion, 6... Curing resin, 7...・Insulator film, 8・
... Wiring pattern, 11... First board, 12... Second board.

Claims (4)

[Claims] (1) In an integrated circuit device in which a plurality of integrated circuit elements are arranged in openings formed in the same support base, and the integrated circuit elements are connected to each other by a planar wiring pattern formed on the support base, An integrated circuit device characterized in that the opening of the support base has a positioning protrusion at a position that contacts a side surface of the integrated circuit element at a position shifted toward the input/output terminal forming surface. (2) Three positioning protrusions are provided for one opening, two of which are provided on the same side, and the other one is provided on another side adjacent to this. An integrated circuit device according to claim 1. (3) The base body has a structure in which a first plate and a thinner second plate are stacked and integrated, and a positioning protrusion is formed on the second plate. The integrated circuit device according to item 1. (4) The integrated circuit device according to claim 1, wherein a curable resin is filled around the integrated circuit element in the opening.