JPS6377792A - Thin type electronic apparatus - Google Patents
Thin type electronic apparatusInfo
- Publication number
- JPS6377792A JPS6377792A JP61219765A JP21976586A JPS6377792A JP S6377792 A JPS6377792 A JP S6377792A JP 61219765 A JP61219765 A JP 61219765A JP 21976586 A JP21976586 A JP 21976586A JP S6377792 A JPS6377792 A JP S6377792A
- Authority
- JP
- Japan
- Prior art keywords
- outer frame
- electronic device
- thin electronic
- storage recess
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003860 storage Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 238000005452 bending Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Credit Cards Or The Like (AREA)
- Calculators And Similar Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、ＩＣチップ等の電子部品を内蔵する薄型電
子機器に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a thin electronic device incorporating electronic components such as an IC chip.
（従来の技術）
近年、精密電子技術および加工技術の発展により電子機
器は小型化、超薄型化されていて、カード状の電卓が製
造されている。また最近においては、従来の磁気カード
に比べて、セキュリティと記憶容量の大きさにおいて遥
かに優れているＩＣカードが開発され、さらにはこのＩ
Ｃカードに演算機能をもたせた電卓付ＩＣカード等も開
発されている。(Prior Art) In recent years, with the development of precision electronic technology and processing technology, electronic devices have become smaller and ultra-thin, and card-shaped calculators are being manufactured. Recently, IC cards have been developed that are far superior in terms of security and storage capacity compared to conventional magnetic cards.
IC cards with calculators, which are C cards with calculation functions, have also been developed.
このような従来の薄型電子機器としては、例えば第３図
および第４図に示すようなものがある。Examples of such conventional thin electronic devices include those shown in FIGS. 3 and 4, for example.
第３図において、１は外枠であり、この外枠１の上面と
下面には第４図にも示すように段部２，３が形成されて
いる。外枠１には電子部品が埋設された基板（図示せず
）が嵌挿されるが、段部２゜３にはこの基板を挾むよう
にして外板４．５が嵌合されている。外板４，５と外枠
１とは段部２゜３において合成樹脂系の接着剤によって
接着されている。In FIG. 3, reference numeral 1 denotes an outer frame, and stepped portions 2 and 3 are formed on the upper and lower surfaces of the outer frame 1, as shown in FIG. 4 as well. A board (not shown) in which electronic components are embedded is fitted into the outer frame 1, and an outer plate 4.5 is fitted into the stepped portion 2.3 so as to sandwich this board. The outer panels 4, 5 and the outer frame 1 are bonded together at the stepped portion 2.degree. 3 using a synthetic resin adhesive.
（発明が解決しようとする問題点）
しかしながら、このような薄型電子機器においては、外
板４，５と外枠１とを合成樹脂系の接着剤で接着してい
たので曲げ剛性が低く、使用する場合に曲げたりすると
、容易に大ぎく曲がっていた。したがって、永年に亘っ
て使用すると、繰り返し大きく曲げられ−Ｃ外板４，５
ど外枠１との接着部の接着強度は漸次低下し、ついには
外板４゜５と外枠１とが剥離していた。剥離すると、外
枠１と外板４，５との間には隙間が生じることになる。(Problems to be Solved by the Invention) However, in such thin electronic devices, since the outer panels 4 and 5 and the outer frame 1 are bonded together using a synthetic resin adhesive, the bending rigidity is low, making it difficult to use. When I tried to bend it, it easily bent sharply. Therefore, if used for many years, it will be repeatedly bent to a large extent.
The adhesive strength of the bonded portion with the outer frame 1 gradually decreased, and eventually the outer panel 4.5 and the outer frame 1 were peeled off. When peeled off, a gap will be created between the outer frame 1 and the outer panels 4 and 5.
その結果、この隙間から、汗や雨水等が基板に侵入し、
ひいては基板に埋設された電子部品は故障し、この薄型
電子機器が使用できなくなるという問題点があった。As a result, sweat, rainwater, etc. can enter the board through this gap,
As a result, the electronic components embedded in the board may fail, resulting in the problem that the thin electronic device becomes unusable.
また、外板４．５と外枠１とは接着剤によって接着して
いたため、この接着工程が必要となり、加えて接着剤も
必要であったために、この薄型電子機器の製造ロストが
高くなるという問題点もあった。In addition, since the outer panel 4.5 and the outer frame 1 were bonded with adhesive, this bonding process was necessary, and since adhesive was also required, manufacturing costs for this thin electronic device were high. There were also problems.
「発明の構成」
（問題点を解決するための手段）
このような問題点を解決するために、この発明にあって
は、機械加工によって金Ｒ製板材に形成された収納凹部
と、この収納凹部の底壁および側壁をそれぞれ構成し一
体形成された外板部および外枠部と、収納凹部に嵌挿・
収納され、電子部品が埋設された基板とを備え、この基
板を前記外板部および外枠部で保護・保持した構成とし
たものである。"Structure of the Invention" (Means for Solving the Problems) In order to solve the above problems, the present invention has a storage recess formed in a plate made of gold R by machining, and a storage recess for the storage recess. The integrally formed outer panel and outer frame that constitute the bottom wall and side wall of the recess, respectively, and the
The device is housed in a substrate and has electronic components embedded therein, and the substrate is protected and held by the outer plate portion and the outer frame portion.
〈作用）
この発明にあっては、外板部１２と外枠部１３とは一体
形成されてこれらのＩＪには接着剤が介在しないので、
従来のように外板と外枠とが接着剤によっ（接着された
場合に比べ、この薄型電子機器の曲げ剛性は高くなる。<Function> In this invention, the outer plate part 12 and the outer frame part 13 are integrally formed and there is no adhesive between these IJs.
The bending rigidity of this thin electronic device is higher than in the conventional case where the outer panel and the outer frame are bonded with adhesive.
このため、使用する場合に曲げたりしても、曲げ剛性が
高いので、この薄型電子機器は大きく曲げられることが
ない。Therefore, even if it is bent during use, this thin electronic device will not be bent significantly because of its high bending rigidity.
（実施例） 以下、この発明を図面に基づいて説明する。(Example) The present invention will be explained below based on the drawings.
第１図および第２図はこの発明に係る薄型電子機器の一
実施例を示１図である。FIGS. 1 and 2 are views showing one embodiment of a thin electronic device according to the present invention.
まず構成を説明する。First, the configuration will be explained.
第１図および第２図において、略長方形のステンレス鋼
板材がプレス加工されて、収納凹部１１が形成されてい
る。収納凹部１１の底壁および側壁はそれぞれ外板部１
２および外枠部１３で構成され、この外板部１２と外枠
部１３とは一体形成されている。収納凹部１１には電子
部品が埋設された基板（図示せず）が嵌挿・収納されて
、外板部１２と外枠部１３によって外部から保護され内
部に保持されでいる。外枠部１３の上端面には外板１４
が載置され、外枠部１３と外板１４とは合成樹脂系の接
着剤によって接着されている。In FIGS. 1 and 2, a substantially rectangular stainless steel plate material is pressed to form a storage recess 11. As shown in FIG. The bottom wall and side wall of the storage recess 11 are respectively connected to the outer panel part 1.
2 and an outer frame part 13, and the outer plate part 12 and the outer frame part 13 are integrally formed. A board (not shown) in which electronic components are embedded is inserted and stored in the storage recess 11, and is protected from the outside by the outer plate part 12 and the outer frame part 13 and held inside. An outer plate 14 is provided on the upper end surface of the outer frame portion 13.
is placed thereon, and the outer frame portion 13 and the outer panel 14 are bonded together using a synthetic resin adhesive.
次に作用を説明する。Next, the action will be explained.
外板部１２と外枠部１３とは一体形成されてこれらの間
には接着剤が介在しないので、従来のように外板と外枠
とが接着剤によって接着された場合に比べ、この薄型電
子機器の曲げ剛性は高くなる。このため、使用する場合
に曲げたりしても、曲げ剛性が高いので、この薄型電子
機器は大きく曲げられることがない。したがって、外板
１／ｌと外枠部１３との接着強度はさほど高くなくとも
よく、また繰り返し曲げられて漸次接着強度が低下する
ということもない。その結果、外板１／Ｉと外枠部１３
とは剥離せず、剥離によって生じるｌｌｊＪ間から汗や
雨水等が基板に侵入するということがなく、この薄型電
子機器の耐久性は向トする。Since the outer panel part 12 and the outer frame part 13 are integrally formed and there is no adhesive between them, the outer panel and the outer frame are thinner than the conventional case where the outer panel and the outer frame are bonded with adhesive. The bending rigidity of electronic devices increases. Therefore, even if it is bent during use, this thin electronic device will not be bent significantly because of its high bending rigidity. Therefore, the adhesive strength between the outer panel 1/1 and the outer frame portion 13 does not need to be very high, and the adhesive strength does not gradually decrease due to repeated bending. As a result, the outer panel 1/I and the outer frame 13
Since the substrate does not peel off, sweat, rainwater, etc. do not enter the substrate through the lljj gap caused by peeling, and the durability of this thin electronic device is improved.
また、外板部１２と外枠部１３どを一体形成したもので
、これらを接着する■程を要せず、接着剤も不要となる
。したがって、この薄型電子機器の製造コストを低くす
ることができる。Further, since the outer plate part 12 and the outer frame part 13 are integrally formed, it is not necessary to glue them together, and no adhesive is required. Therefore, the manufacturing cost of this thin electronic device can be reduced.
一方、薄型電子機器の曲げ剛性が向上するので、この薄
型電子機器はさらに薄カード化することができる。On the other hand, since the bending rigidity of the thin electronic device is improved, the thin electronic device can be made into an even thinner card.
なお、上記実施例にあっては、外板部１２と外枠部１３
とはプレス加Ｊ］によって一体形成したが、収納凹部１
１を切削加工やハーフ■ツヂング法等によって形成して
外板部１２と外枠部１３とを一体形成してもよい。In addition, in the above embodiment, the outer panel part 12 and the outer frame part 13
Although it was formed integrally by press processing, the storage recess 1
The outer plate portion 12 and the outer frame portion 13 may be integrally formed by forming the outer plate portion 1 by cutting, a half-twisting method, or the like.
［発明の効果］
以上説明したように、この発明によれば、基板を一体形
成された外板部および外枠部で保護・保持したので、こ
の薄型電子機器の曲げ剛性は高くなり、この使用時に大
きく曲げられることがない。[Effects of the Invention] As explained above, according to the present invention, since the board is protected and held by the integrally formed outer plate part and outer frame part, the bending rigidity of this thin electronic device is increased, and this use is improved. It does not bend much at times.
したがって外板と外枠部とが剥離するようなことはなく
なり、この薄型電子機器の耐久性は向上する。また、接
着工程を要せず、接着剤も不要となるので、この薄型電
子機器の製造コス１〜を低くすることができる。Therefore, peeling between the outer panel and the outer frame is prevented, and the durability of this thin electronic device is improved. Furthermore, since no bonding process is required and no adhesive is required, the manufacturing cost of this thin electronic device can be reduced.
第１図および第２図はこの発明に係る薄型電子機器の一
実施例を示す図であり、第１図はこの薄型電子機器の分
解斜視図で、第２図は第１図にお【プるＩＩ−ＩＩ線断
面図である。第３図および第４図は従来の薄型電子機器
を示で図であり、第３図はこの薄型電子機器の分解斜視
図で、第４図は第３図におけるＴＶ −ＩＶ線断面図で
ある。
１１・・・収納凹部
１２・・・外板部
１３・・・外枠部1 and 2 are diagrams showing an embodiment of a thin electronic device according to the present invention. FIG. 1 is an exploded perspective view of the thin electronic device, and FIG. It is a sectional view taken along the line II-II. 3 and 4 are diagrams showing a conventional thin electronic device, FIG. 3 is an exploded perspective view of this thin electronic device, and FIG. 4 is a sectional view taken along the line TV-IV in FIG. 3. . 11... Storage recess 12... Outer plate part 13... Outer frame part
Claims (2)
部と、この収納凹部の底壁および側壁をそれぞれ構成し
一体形成された外板部および外枠部と、収納凹部に嵌挿
・収納され、電子部品が埋設された基板とを備え、この
基板を前記外板部および外枠部で保護・保持したことを
特徴とする薄型電子機器。(1) A storage recess formed in a metal plate by machining, an integrally formed outer panel and outer frame that constitute the bottom wall and side walls of the storage recess, and a container that is inserted and stored in the storage recess. 1. A thin electronic device comprising: a substrate in which electronic components are embedded; the substrate is protected and held by the outer plate portion and the outer frame portion.
特徴とする特許請求の範囲第１項記載の薄型電子機器。(2) The thin electronic device according to claim 1, wherein the metal plate material is a stainless steel plate material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61219765A JPS6377792A (en) | 1986-09-19 | 1986-09-19 | Thin type electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61219765A JPS6377792A (en) | 1986-09-19 | 1986-09-19 | Thin type electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377792A true JPS6377792A (en) | 1988-04-07 |
Family
ID=16740650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61219765A Pending JPS6377792A (en) | 1986-09-19 | 1986-09-19 | Thin type electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377792A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101674U (en) * | 1990-02-01 | 1991-10-23 |
-
1986
- 1986-09-19 JP JP61219765A patent/JPS6377792A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101674U (en) * | 1990-02-01 | 1991-10-23 |
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