JPH09283990A - Mounting head and bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a mounting head by which all leads at an electronic component can be brought into contact with a printed-circuit board in a low pressurization operation by a method wherein a voice coil motor whose moving- part tip comes into contact with a suction part and an elastic member which gives a tensile force to the voice coil motor and to the suction part are installed at a drive means. SOLUTION: A drive part 40 (a drive means) is installed around a shaft 30. The drive part 40 is provided with voice coil motors 41, 42. A collet 60 is connected to fixation parts 41a, 42a at the voice coil motors 41, 42 by tension springs 71, 72. In a mounting head 20 which is built in a bonding apparatus, the collet 60 is tilted until the rear surface 5b of a tape carrier package (TCP) 5 and the surface 6a of a printed-circuit board 6 become parallel, and the inclination of the collet 60 can be maintained. As a result, all leads 5b at the TCP 5 can be brought uniformly into contact with prescribed pads 6b at the printed- circuit board 6 in a low pressurization operation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mount head for mounting an electronic component on a printed circuit board with high precision, the electronic component mounted on the printed circuit board by the mount head, and the leads of the electronic component mounted on the printed circuit board. The present invention relates to a bonding device for soldering and connecting to a formed pad.

[0002]

2. Description of the Related Art Conventionally, a tape carrier package (hereinafter referred to as "TCP") is mounted on a pad of a printed circuit board.
2. Description of the Related Art A bonding device is used when soldering and connecting leads of electronic components such as. In addition, the bonding apparatus is provided with a mount head that adsorbs and holds TCP, mounts it on a printed circuit board, pressurizes it, and temporarily fixes it.

If the lower surface of the TCP and the upper surface of the printed circuit board to be mounted are not parallel to each other, some of the leads in the recent narrow pitch TCP will come into contact with the pads of the printed circuit board first, and others. There is a possibility that the lead cannot be pressed, or the lead may not be bonded to a predetermined pad because it is displaced from the position obtained by visual recognition.

Therefore, in order to accurately mount the TCP at a predetermined position on the printed circuit board, it is necessary to keep the lower surface of the TCP and the upper surface of the printed circuit board as parallel as possible. 4A and 4B are views showing a conventional example of a mount head. That is, the mount head 1 shown in FIG. 4A has the shaft 3 fixed to the mount head body 2.
And a collet 4 attached to the tip of the shaft. An intake passage 3a is provided inside the shaft 3, and the intake passage 3a is connected to a suction force generator (not shown). An intake passage 4a is provided inside the collet 4, and the intake passage 4a is exposed at a suction surface 4b provided at the lower end of the collet 4 in the figure, and is an electronic component TC.
Adsorbs P5. The TCP 5 has a plurality of leads 5a. In the figure, 6 is a printed circuit board, 6a is a pad provided on the printed circuit board 6 and used for bonding with the lead 5a,
Reference numeral 7 denotes a mounting table on which the printed circuit board 6 is mounted.

The mount head 1 configured as described above
The shaft 3 and the collet 4 are fixed. Therefore, in order to keep the lower surface 5a of the TCP 5 adsorbed by the collet 4 and the upper surface 6a of the printed circuit board 6 mounted parallel to each other, the assembly accuracy of the bonding apparatus itself has been made high in advance.

Further, the printed circuit board 6 is supported by a backup, and the upper surface of the backup and the suction surface 4b of the collet 4 are mechanically adjusted in advance, so that the TCP
There is also one in which the lower surface 5b of the printed circuit board 5 and the upper surface 6a of the printed circuit board 6 to be mounted are kept parallel to each other.

On the other hand, in the mount head 8 shown in FIG. 4B, as described above, the shaft 3 and the collet 4 are arranged.
And an elastic body 9 such as rubber is provided on the suction surface 4b of the collet 4. In such a mount head 8, the lower surface 5b of the TCP 5 and the upper surface 6 of the printed circuit board 6 are
Even if a is not parallel to a, the elastic body 9 is deformed to tilt the TCP 5 to some extent so that all the leads can be pressed.

[0008]

The bonding apparatus having the mount head as described above has the following problems. That is, the mount head shown in FIG. 4A has a problem that the shaft 3, the collet 4, the backup, and the like must be processed with high accuracy. Further, in the case of using a backup, it becomes impossible to place other electronic components on the back surface of the printed circuit board which the backup contacts, which imposes restrictions on the product design.

Further, even if they are held parallel to each other by the above-mentioned method, the surface processing accuracy of each printed circuit board and the warp of the printed circuit board due to reflow heating do not always cause T at the time of mounting.
The lower surface of the CP and the upper surface of the printed board are not always parallel.

On the other hand, in the mount head shown in FIG. 4B, there are problems that the attracting force is lowered due to deterioration of the elastic body 9 and additional work such as replacement of the elastic body 9 is increased.

Therefore, the present invention provides a low load even when the lower surface of the electronic component sucked and held by the mount head and the upper surface of the printed circuit board are not held parallel to each other, or when the parallel holding suddenly shifts. An object of the present invention is to provide a mount head and a bonding apparatus that can bring all the leads of an electronic component into contact with a printed board by pressure.

[0012]

In order to solve the above-mentioned problems and to achieve the object, the invention described in claim 1 is a mount head for sucking and holding an electronic component to be mounted on a printed circuit board. A suction part that has a suction surface for sucking the electronic component and is swingably provided on the head body; and a suction part that is provided on the head body and is slidable and swingable in a sliding direction. The driving unit includes a driving unit that drives the driving unit and a control unit that controls driving of the suction unit in the sliding direction by the driving unit. The driving unit includes a fixing unit fixed to the head body and a slidable movement to the fixing unit. At least a movable portion which is supported by the movable member and whose moving direction is perpendicular to the suction surface of the suction portion, and whose tip is in contact with the suction surface of the suction portion on the opposite side. Of the voice coil motor, and an elastic member having one end connected to the suction part and the other end connected to the fixed part and applying a predetermined tensile force to the one end and the other end. did.

According to a second aspect of the present invention, in a bonding apparatus for connecting an electronic component to a printed circuit board, a mount head for adsorbing and holding the electronic component and relative positioning of the mount head and the printed circuit board are performed. Positioning means for performing, the mount head,
A head body and a suction surface for sucking the electronic component,
A suction unit swingably provided on the head main body, a unit which is provided on the head main body, holds the suction unit slidably and swingably, and drives in the slide direction, and the suction unit by the driving unit. A drive unit for controlling the drive of the unit in the slide direction, the drive unit is fixed to the head main body and slidably supported by the fixed unit, and the moving direction of the drive unit is the suction unit. Of at least three voice coil motors each having a movable portion that is perpendicular to the suction surface of the suction portion and has a tip end abutting the opposite side of the suction surface of the suction portion, and one end thereof is connected to the suction portion. At the same time, the other end portion is connected to the fixed portion, and an elastic member that applies a predetermined tensile force to the one end portion and the other end portion is provided.

As a result of taking the above measures, the following operation occurs. That is, in the invention described in claim 1, in the case where the lower surface of the electronic component and the upper surface of the printed board are not held parallel to each other, as the mount head descends,
When a part of the electronic component contacts the printed circuit board, the electronic component receives a force in a direction parallel to the printed circuit board.
For this reason, the bottom surface of the electronic component and the top surface of the printed circuit board are finally parallel to each other in the suction portion held slidably and swingably on the support portion. By lowering the mount head while maintaining this state by the driving unit controlled by the control unit, the electronic component can be brought into uniform contact with the printed circuit board.

Further, the driving means is provided with a voice coil motor whose distal end abuts against the attracting portion, and an elastic member for applying a tensile force to the voice coil motor and the attracting portion. The thrust force of the voice coil and the tension of the elastic member are provided. By balancing the force with the force, the suction part can be easily tilted by the force that the electronic component receives from the printed board. Further, since the tip of the movable portion of the voice coil motor is in contact with the suction portion, the angle of the suction portion can be controlled in all directions by controlling the current applied to the voice coil motor.

Therefore, the pressure applied by the mount head can be reduced. Therefore, it is not necessary to assemble the bonding apparatus with high precision, and
No backup is required, and it is possible to place components on the back side of the printed circuit board.

According to the second aspect of the invention, when the lower surface of the electronic component and the upper surface of the printed circuit board are not held parallel to each other, part of the electronic component contacts the printed circuit board as the mount head descends. Upon contact, the electronic component receives a force in a direction parallel to the printed circuit board. For this reason, the bottom surface of the electronic component and the top surface of the printed circuit board are finally parallel to each other in the suction portion held slidably and swingably on the support portion. By lowering the mount head while maintaining this state by the driving unit controlled by the control unit, the electronic component can be brought into uniform contact with the printed circuit board.

Further, the driving means is provided with a voice coil motor whose tip of the movable portion is in contact with the suction portion, and an elastic member for applying a tensile force to the voice coil motor and the suction portion, and the thrust force of the voice coil and the tension of the elastic member. By balancing the force with the force, the suction part can be easily tilted by the force that the electronic component receives from the printed board. Further, since the tip of the movable portion of the voice coil motor is in contact with the suction portion, the angle of the suction portion can be controlled in all directions by controlling the current applied to the voice coil motor.

Therefore, the pressure applied by the mount head can be reduced. Therefore, it is not necessary to assemble the bonding apparatus with high precision, and
No backup is required, and it is possible to place components on the back side of the printed circuit board.

[0020]

1 is a side view showing an outline of a bonding apparatus according to an embodiment of the present invention with a part thereof cut away, and FIG. 2 is a sectional view showing a mount head incorporated in this bonding apparatus. It is a figure. In these figures,
The same functional parts as those in FIG. 4 are designated by the same reference numerals.

Reference numeral 10 in FIG. 1 indicates a bonding apparatus. The bonding apparatus 10 includes a holder 13 attached to one side surface of a frame 12 erected on a pedestal 11.
It is movably held in the X direction (perpendicular to the paper surface) and the Z direction. A vertical drive mechanism 14 that vertically drives a mount head 20, which will be described later, is provided above the frame 12. The vertical drive mechanism 14 is connected to a vertical drive cylinder 16 via a cam lever 15. Reference numeral 17 in the drawing denotes a CCD camera for recognizing a mounting portion during mounting operation by the mount head 20, and reference numeral 18 denotes a bonding tool for soldering and connecting the leads 5b of the TCP 5 mounted by the mount head by thermocompression bonding. , 19 designates a mounting table for carrying and mounting the printed circuit board and for positioning in the X and Y directions in the figure.

The mount head 20 includes a vertical drive mechanism 14
The mount head body 21 is supported at the lower end in the figure. The mount head body 21 is provided with a hollow shaft 30 (support portion). An intake passage 31 is provided inside the shaft 30, and one end of the intake passage 31 is connected to an intake device 32. Also, the shaft 30
A collet 60 (adsorption portion), which will be described later, is swingably supported at the lower end in the figure via a ball joint 33.

A driving portion 40 (driving means) is provided around the shaft 30. The drive unit 40 includes three voice coil motors 41, 42, 43 (43 is not shown). Each of the voice coil motors 41, 42, 43 is fixed to the shaft 30 and has a cylindrical fixed portion 41a, 4a.
2a and 43a (43a is not shown) and the fixed portions 41a and 4
Movable parts 41b, 42b, 43b (43b is not shown) arranged inside 2a, 43a and slidable in the direction of arrow A in the figure are provided respectively. Fixing parts 41a, 42a,
43a has a coil (not shown) inside, and this coil is connected to the control unit 44, and a current is applied based on this control. Further, position sensors (not shown) such as Hall elements for detecting the positions of the movable parts 41b, 42b, 43b are attached to the fixed parts 41a, 42a, 43a. The thrust of the voice coil motors 41 to 43 is 50
It is controlled to about 300 gf.

The collet 60 is provided inside with an intake passage 61 communicating with the intake passage 31 of the shaft 30, and is exposed as a suction hole 61a on a suction surface 62 on the lower surface in the figure. The suction holes 61a can suck and hold electronic components such as TCP by the suction force from the suction device 32 through the suction passages 61 and 31. Plural suction holes 61a are arranged so that the suction surface 62 of the collet 60 and the upper surface of the electronic component are sufficiently in contact with each other. The collet 60 is removable so that the position of the suction hole 61a can be easily changed according to the shape of the electronic component.

The upper surface of the collet 60 in the drawing is fixed portions 41a, 42a, 43a (43) of the voice coil motors 41-43.
a is not shown), and tension springs 71, 72, 73 (73 is not shown) are connected to each other. Tension spring 7
1 to 73 pull up the collet 60 with a comparatively weak force (50 to 200 gf), and the movable parts 41 b to 41 b of the voice coil motors 41 to 43 are attracted even if the electronic parts described later are adsorbed.
A tension spring having a spring constant such that the collet 60 is lightly pressed against 43b is selected. The lower ends of the movable portions 41b to 43b of the voice coil motors 41 to 43 in the figure are in contact with the upper surface of the collet 60.

The step of mounting the TCP 5 on the printed circuit board 6 using the bonding apparatus thus constructed is performed as follows. The mount head 20 is moved by the holding device 13 onto the printed circuit board 6 positioned by the mounting table 19 of FIG. The CCD camera 17 recognizes that the positioning is completed at a predetermined position, and the positioning is completed.

Next, the vertical drive mechanism 14 is driven to move the mount head 20 downward in the drawing. At this time, the controller 44 applies a current to the voice coil motors 41 to 43 to cause the movable parts 41a to 43a to generate a predetermined thrust in the downward direction in the drawing. The thrust at this time is the tension springs 71 to 7
It is equivalent to the tensile force of 3.

In the case where the descending direction of the mount head 20 is not perpendicular to the surface of the printed circuit board 6, when the mount head 20 is descended, FIG.
As shown in FIG. 5, some of the leads 5b of the TCP 5 come into contact with the pads 6b of the printed circuit board 6. When the descent is continued as it is, the lead 5b is deformed by receiving a force from the pad 6b of the printed circuit board 6. Since the lead 5b has elasticity, a repulsive force is generated in the lead 5b. When the deformation amount reaches a predetermined value, the TCP 5 and the collet 60 are pushed back upward in the figure by the repulsive force, and the movable portion 41 of the voice coil motor 41 is moved.
b moves upward in the figure. At this time, the collet 60 tilts in a direction approaching the optimum parallelism. The angular displacement of the collet 60 directly changes the position of the movable portion 41b of the voice coil motor 41. When the amount of displacement reaches a predetermined amount, the lowering of the mount head 20 is stopped. At this time, as shown in FIG. 3B, the lower surface 5a of the TCP 5 and the upper surface 6a of the printed board 6 are parallel to each other.

In order to maintain this state, the thrust forces of the voice coil motors 41 to 43 are raised, and the mount head 20 is lowered again while maintaining the inclination of the collet 60. When all the leads 5b of the TCP 5 reach a predetermined deformation amount as shown in FIG.
Stop descending.

As described above, in the mount head 20 incorporated in the bonding apparatus according to this embodiment,
Since the collet 60 can be tilted until the lower surface 5b of the TCP 5 and the upper surface 6a of the printed circuit board 6 are parallel to each other, the tilt of the collet 60 can be maintained, so that all the leads 5b of the TCP 5 are evenly arranged on the predetermined pad 6b of the printed circuit board 6. Can be contacted with low pressure.

The present invention is not limited to the above embodiment. That is, although three voice coil motors are used in the above embodiment, only one voice coil motor may be used. In this case, the collet is fixed to the moving portion of the voice coil motor, and the thrust is equivalent to that for deforming all the leads, and the head is lowered. At this time, if the voice coil motor is stopped at a position immediately before displacement, all the leads of the TCP can be brought into contact with each other with low pressure. Further, if it is possible to raise all the leads to a thrust equivalent to elastically deforming them and lower them to the extent of bending the leads, all the leads can be brought into contact with the substrate with low pressure. Further, the number of voice coil motors is not limited, and the number can be changed according to the applied pressure. In addition, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0032]

According to the invention described in claim 1, when the lower surface of the electronic component and the upper surface of the printed circuit board are not held parallel to each other, as the mount head descends,
When a part of the electronic component contacts the printed circuit board, the electronic component receives a force in a direction parallel to the printed circuit board.
For this reason, the bottom surface of the electronic component and the top surface of the printed circuit board are finally parallel to each other in the suction portion held slidably and swingably on the support portion. By lowering the mount head while maintaining this state by the driving unit controlled by the control unit, the electronic component can be brought into uniform contact with the printed circuit board.

Further, the driving means comprises a voice coil motor whose tip of the movable portion is in contact with the suction portion, and an elastic member for applying a tensile force to the voice coil motor and the suction portion, and the thrust force of the voice coil and the tension of the elastic member. By balancing the force with the force, the suction part can be easily tilted by the force that the electronic component receives from the printed board. Further, since the tip of the movable portion of the voice coil motor is in contact with the suction portion, the angle of the suction portion can be controlled in all directions by controlling the current applied to the voice coil motor.

Therefore, the pressure applied by the mount head can be reduced. Therefore, it is not necessary to assemble the bonding apparatus with high precision, and
No backup is required, and it is possible to place components on the back side of the printed circuit board.

According to the second aspect of the present invention, when the lower surface of the electronic component and the upper surface of the printed circuit board are not held parallel to each other, a part of the electronic component is partially removed from the printed circuit board as the mount head descends. When contacted with, the electronic component receives a force in a direction parallel to the printed circuit board. For this reason, the bottom surface of the electronic component and the top surface of the printed circuit board are finally parallel to each other in the suction portion held slidably and swingably on the support portion. By lowering the mount head while maintaining this state by the driving unit controlled by the control unit, the electronic component can be brought into uniform contact with the printed circuit board.

Further, the driving means is provided with a voice coil motor whose distal end abuts against the attracting portion, and an elastic member for applying a tensile force to the voice coil motor and the attracting portion. The thrust force of the voice coil and the tension of the elastic member are provided. By balancing the force with the force, the suction part can be easily tilted by the force that the electronic component receives from the printed board. Further, since the tip of the movable portion of the voice coil motor is in contact with the suction portion, the angle of the suction portion can be controlled in all directions by controlling the current applied to the voice coil motor.

Therefore, the pressure applied by the mount head can be reduced. Therefore, it is not necessary to assemble the bonding apparatus with high precision, and
No backup is required, and it is possible to place components on the back side of the printed circuit board.

[Brief description of drawings]

FIG. 1 is a side view showing an outline of a bonding apparatus according to an embodiment of the present invention with a part thereof cut away.

FIG. 2 is a cross-sectional view showing a mount head incorporated in the bonding apparatus.

FIG. 3 is a side view showing an operation of mounting the TCP on the printed circuit board by the mount head.

FIG. 4 is a side view showing a conventional mount head.

[Explanation of symbols]

 5 ... TCP 5b ... Lead 6 ... Printed circuit board 6b ... Pad 10 ... Bonding device 11 ... Stand 12 ... Frame 13 ... Holding body 14 ... Vertical drive mechanism 15 ... Cam lever 16 ... Vertical drive cylinder 17 ... CCD camera 18 ... Bonding tool 19 ... Mounting table 20 ... Mount head 21 ... Mount head main body 30 ... Shaft 31 ... Intake passage 32 ... Intake device 33 ... Ball joint 40 ... Drive part 41, 42 ... Voice coil motor 41a, 42a ... Fixed part 41b, 42b ... Movable part 44 ... Control part 60 ... Collet (suction part) 61 ... Intake passage 61a ... Suction hole 62 ... Suction surface 71, 72 ... Tension spring

Claims (2)

[Claims] 1. A mount head for adsorbing and holding an electronic component to be mounted on a printed circuit board, comprising: a head main body; and an adsorbing surface for adsorbing the electronic component, which is swingably provided on the head main body. A drive unit for driving the suction unit to a predetermined swing angle, and a control unit for controlling the swing angle of the suction unit by the drive unit. A fixed portion fixed to the head body, and slidably supported by the fixed portion,
And a voice coil motor having a movable portion whose moving direction is perpendicular to the suction surface of the suction portion and a tip end of which is in contact with the suction surface of the suction portion. Mount head. 2. A bonding apparatus for connecting an electronic component to a printed circuit board, comprising: a mount head that sucks and holds the electronic component; and a positioning unit that relatively positions the mount head and the printed circuit board. The mount head has a head body, a suction portion that has a suction surface that sucks the electronic component, and is provided on the head body so as to be swingable; and the mount portion is provided on the head body, and the suction portion is slidable. The driving unit includes a unit that swingably holds and drives in the sliding direction, and a control unit that controls driving of the suction unit in the sliding direction by the driving unit, and the driving unit includes a fixing unit fixed to the head body. And while being slidably supported by this fixed part,
And a voice coil motor having a movable portion whose moving direction is perpendicular to the suction surface of the suction portion and a tip end of which is in contact with the suction surface of the suction portion. Mount head.