JP4689430B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus suitable for application when electronic components are automatically mounted on a substrate such as a printed circuit board or a liquid crystal display panel substrate while applying pressure.

  As a component mounting apparatus that automatically mounts electronic components while applying pressure to a printed circuit board or the like, an apparatus including a mounting head shown in FIG.

  In the mounting head 100, the movable bracket 114 is lowered along the linear guide 117 by the Z-axis motor (first vertical movement means) 121 under the control of the operation control means (not shown) above the component supplied to a predetermined position. Drive down toward the position. At that time, the voice coil motor (second vertical movement means) 134 drives the lower flange 135 downward until the lower flange 135 comes into pressure contact with the thrust bearing 136 to prevent vertical vibration of the rotating case 131.

  As the movable bracket 114 descends, the tip of the suction nozzle 112 comes into contact with the electronic component C, and then the electronic component C is sucked to the tip by setting the inside of the suction nozzle 112 to a negative pressure.

  When the suction of the electronic component C is completed, the Z-axis motor 121 is driven, the bracket 114 is raised, the suction nozzle 112 is pulled up, the mounting head 100 is moved above the substrate, and the bracket is followed according to the same procedure as before the component suction. 114 is lowered, and the component is mounted at a target position on the board under a target pressing force.

  Thus, when the component pressure mounting operation is completed, the suction nozzle 112 is raised according to the flowchart of FIG.

  The operation control means starts to drive the movable bracket 114 toward the lift target position by the Z-axis motor 121 (step 21). During the raising operation of the movable bracket 114, it is determined whether or not the pressure detection value by the load cell 115 is equal to or less than the total value of the initial load and the rising threshold value (step 22). Here, the initial load is a pre-measured load cell output during no load, and the rising threshold is a set value.

  As described above, when the detection value of the load cell 115 becomes equal to or less than the total value and the suction nozzle 112 is substantially separated from the part C, the voice coil motor 134 raises the upper flange 137 until the thrust bearing 138 comes into pressure contact. Driven to prevent vertical vibration of the rotating case 131 (step 23).

  In this state, the movable bracket 114 continues to be lifted by the Z-axis motor 121, and when it is determined from the output of the encoder 122 that the lift target position has been reached (step 24), the lift drive by the Z-axis motor 121 is stopped (step 25). ). Thereby, the raising operation control of the suction nozzle 112 is completed, and the next component suction operation is started.

JP 2004-158743 A

  However, the electronic component mounting apparatus disclosed in Patent Document 1 has the following problems.

(1) Occurrence of component displacement due to bending of substrate during pressure mounting For convenience, description will be given with reference to FIG. When the components are pressure mounted, the substrate S is curved downward as shown in FIG. 8A in order to press the component C against the substrate S with a specified pressure. When the suction nozzle 112 (20 in the figure) is lifted from this state according to the flowchart, the substrate S that has been pushed downward by the suction nozzle 112 and curved downward is rebounded. As shown in FIG. 5B, the shape becomes convex upward, causing a phenomenon like a leaf spring accompanied by a change in the displacement W, and the mounted component causes a displacement. There was a problem.

(2) Increase in pressurization time due to substrate flexure during pressurization mounting The pressurization detection value based on the output of the load cell 115 is equal to or less than the total value of the initial load and the ascent threshold when the pressurization is completed after the pressurization is completed. As shown in FIG. 8A, if the substrate S bends during pressure mounting as shown in FIG. 8A, the state in which the suction nozzle is in contact with the electronic component C continues during the ascending operation. In the meantime, the pressing force exceeding the rising threshold value continues to be applied, and as a result, the pressurized load is continuously applied to the electronic component even after the designated target time has elapsed.

  The present invention has been made to solve the above-described conventional problems, and when a component is pressure-mounted on a substrate, even if the substrate is bent due to a pressure load, the mounted component is displaced due to the reaction. It is another object of the present invention to provide a component mounting apparatus that can prevent an excessive pressure load from being continuously applied to a component beyond a target time.

The present invention includes a suction head that sucks and holds a component by a mounting head that can be moved in a plane direction by an X-axis drive means and a Y-axis drive means, and a pressure drive means that moves the suction nozzle back and forth in the Z-axis direction, A component mounting apparatus comprising: a Z-axis driving unit that integrally moves the suction nozzle forward and backward in the Z-axis direction; and a load detection unit that detects a contact load applied to the suction nozzle. The suction nozzle is lowered by the driving means, the part held by suction is brought into contact with the substrate surface, a predetermined load is applied by the pressure driving means and the part is pressure-mounted, and then the Z-axis driving means when increasing the suction nozzle, wherein at the same time starts to rise in the suction nozzle at a predetermined starting speed by the Z-axis driving means starts decreasing the applied load due to the pressure drive unit, wherein the substrate is flexed Before the suction nozzle tip reaches the target height set directly above the position away from the component mounted on the substrate in the case have, in substantially zero applied load without stopping the increase of the suction nozzle By doing so, the above-mentioned problems are solved.

  In the present invention, the gradual decrease of the pressurization load by the pressurization drive means may be stopped when a preset minute load is detected by the load detection means.

  In the present invention, when the contact load detected by the load detection unit becomes substantially zero, the Z-axis drive unit may start a high-speed ascending operation.

According to the present invention, after the pressure mounting is completed, the suction nozzle starts to rise at a predetermined start speed by the Z-axis driving means, and at the same time, the pressure load applied to the component by the pressure driving means is gradually reduced. Usually, before reaching the target height set immediately above the position where the tip of the suction nozzle is separated from the component mounted on the substrate, the pressure load is made substantially zero without stopping the suction nozzle from rising. As a result, even if the board is bent due to a pressurized load, the reaction can be suppressed, so that the mounted components can be prevented from being displaced, and an excessive pressurized load continues to be applied beyond the target time. Can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

  In FIG. 1, the mounting head 1 includes a pressurizing device that sucks and holds parts and pressurizes, and a recognition device (not shown) that performs position correction of the mounting head 1.

  The mounting head 1 is attached to an X-axis gantry (X-axis drive means) 2 that moves the electronic component mounting apparatus in the X-axis direction. The mounting head 1 and the X axis gantry 2 are attached to a Y axis gantry (Y axis driving means) 3 for moving in the Y axis direction of the electronic component mounting apparatus.

  Further, in this electronic component mounting apparatus, a recognition device 4 using a CMOS camera or a CCD camera for recognizing the posture of the sucked electronic component is fixed within the movable range of the mounting head 1. An electronic component supply device 5 for supplying an electronic component to be mounted on a substrate is installed on the front surface of the electronic component mounting device.

  Next, the mounting head 1 will be described with reference to FIGS.

  The mounting head 1 has a head base 6 for connecting and fixing to the X-axis gantry 2. The head base 6 is connected to the linear guide 7, and the vertical Z-axis drive unit 15 is configured to be movable in the vertical Z-axis direction.

  Above the head base 6 is a vertical rotation drive bearing 21 and a vertical rotation drive shaft 22 composed of a θ motor 9 for rotating parts, a spline bearing and a bearing, and the power of the θ motor is rotated vertically. A Z-axis motor (Z-axis drive means) 11 for vertically moving the belt 10 and the vertical Z drive unit 15 transmitted to the drive shaft 22 is attached. Further, a threaded portion 14 of a ball screw is connected to the Z-axis motor 11 via a coupling 12.

  A voice coil motor for pressurization (pressurization drive means, hereinafter referred to as VCM) 8 is attached to the upper part of the vertical Z drive unit 15. The VCM 8 is connected to the θ motor 9 via a vertical rotation drive shaft 22, and the drive side 8 b of the VCM 8 is supported independently of the vertical Z drive unit 15 by the vertical rotation drive shaft 22. Therefore, the vertical Z driving unit 15 can be rotated and moved up and down.

  A ball screw nut portion 13 is fixed to the vertical Z drive portion 15, and a ball screw screw portion 14 connected to the nut portion 13 via the coupling 12 is fitted into the nut portion 13. The Z-axis motor 11 is rotated and the vertical Z drive unit 15 can be moved up and down by the nut portion 13 of the ball screw.

  Further, a cylindrical pressure detection unit (load detection means) 16 is built in the vertical Z drive unit 15, and the pressure detection unit 16 has an outer periphery and an inner periphery of the vertical Z drive unit 15. The vertical Z drive unit 15 is capable of rotating and vertically moving up and down via a ball guide bearing 17 between them.

  A nozzle shaft 18 extends downward at the lower portion of the pressure detection unit 16, and a suction nozzle 20 is held by a nozzle chuck mechanism 19 at the lower end of the nozzle shaft 18 and has a replaceable structure. It has become. The nozzle 20 can hold the component by suction and mount the component on the substrate.

  Next, the pressure detection unit 16 and the vicinity thereof will be described with reference to FIG.

  The VCM 8 is attached to the upper portion of the pressure detection unit 16, and a coil (not shown) is wound around the fixed side 8 a with the vertical Z drive unit 15 that is an outer cylinder of the VCM 8. Further, a magnet is attached to the drive side 8b of the VCM 8, and the VCM 8 can be linearly driven in the vertical direction by energizing the coil on the fixed side 8a of the VCM 8. The shaft 22 is extended at the center of the drive side 8 b of the VCM 8 and is coupled to the upper portion of the pressure detection unit 16.

  An upper stopper 23a and a lower stopper 23b using thrust bearings are attached to the upper and lower sides of the shaft fixed to the drive side 8b of the VCM 8. The upper stopper 23 a comes into contact with the lower part 6 a of the head base 6, and the lower stopper 23 b comes into contact with the upper part 15 a of the vertical Z drive unit 15.

  That is, the vertical movement amount of the VCM 8 is regulated by the upper stopper 23a and the lower stopper 23b. However, even when the movement amount of the VCM 8 is restricted by contacting the upper stopper 23a or the lower stopper 23b, the thrust side is used, so that the drive side 8b can be rotated.

  The internal structure of the pressure detection unit 16 will be described. A load cell (load detection means) 24 is fixed downward on the upper part. An upper support plate 25a for receiving a spring is attached below the load cell 24. A pressurizing spring 26 is provided below the upper support plate 25a, and a lower support plate 25b for receiving a lower portion of the pressurizing spring 26 is attached below the pressurizing spring 26.

  The nozzle shaft 18 is fixed to the lower side of the lower support plate 25b, and the nozzle shaft 18 has a structure capable of moving up and down by a spline bearing 28.

  A step portion 16a is provided below the lower support plate 25b in the pressure detection unit 16, and is smaller than the outer shape of the lower support plate 25b so that the lower support plate 25b abuts.

  A self-weight canceling spring 27 is attached below the lower support plate 25b between the spline bearing 28 and pushes up the lower support plate 25b. The spring force of the self-weight canceling spring 27 supports the spring force of the pressurizing spring 26, the weight of the lower support plate 25b, and the combined weight of the nozzle shaft 18, the nozzle chuck mechanism 19 and the nozzle 20. .

  In addition, the spring force of the self-weight canceling spring 27 is set slightly lower than the force supporting these, and the lower support plate 25b is configured to abut against the stepped portion 16a in the no-load state. Accordingly, the lower support plate 25b is normally pressed against the step portion 16a with a weak force, and when a load greater than the weak force is applied to the nozzle 20, the load cell 24 detects it.

  The electronic component suction operation and pressure mounting operation performed in the above configuration will be described with reference to FIGS. 4, 5, and 6.

  The mounting head 1 shown in FIG. 1 is moved above the electronic component supply device 5 by driving the X-axis gantry 2 and the Y-axis gantry 3, and the electronic components are sucked by the suction nozzle 20.

  The mounting head 1 that has attracted the electronic component is moved above the recognition device 4, and the recognition device 4 recognizes the component.

  After completing the recognition of the components, the mounting head 1 is moved to a mounting portion of an electronic component on a substrate (not shown), and the electronic component sucked by the suction nozzle 20 of the mounting head 1 is mounted on the mounting position on the substrate. To do.

  Hereinafter, these operations will be described in detail. These operations are executed by a control device that controls the mounting head 1 and that is schematically shown in FIG.

  The control device (control means) 40 is constituted by a CPU or the like, and the control device 40 includes a Z-axis motor 11 and a Z-axis encoder 41 incorporated therein via a Z-axis driver 42, and θ The shaft motor and its encoder 43 are connected via a θ-axis driver 44, and further the VCM motor 18 and the load cell 24 are connected via a VCM driver 45, and control signals can be transmitted and received respectively. The following control is executed by 40.

  In the component suction operation, the mounting head 1 is driven at the component suction position on the component supply device 5 to drive the Z-axis motor 11 and lower the suction nozzle 20 together with the vertical Z drive unit 15.

  At that time, a voltage is applied to the VCM 8 to generate a downward force, and the lower stopper 23b is abutted against the upper portion 15a of the vertical Z drive unit 15 as shown in FIG. 4 to regulate the downward movement of the VCM 8. deep.

  The suction nozzle 20 is lowered integrally with the vertical Z drive unit 15 by the Z-axis motor 11, and the suction nozzle 20 is rapidly stopped at a height immediately before the suction surface of the part to be sucked.

  After the suction nozzle 20 is rapidly stopped, the Z-axis motor 11 is operated slowly to suppress the collision load, and the pressurizing operation for applying the specified load pressure to the component is performed by the pressurizing VCM 8 while the component is sucked and held.

  After attracting and holding the component, the Z-axis motor 11 is driven to raise the component, and the mounting head 1 is moved to move onto the recognition device 4.

  A recognition operation for component position correction is performed, and then the component is moved to the mounting position (above the board), and the following component mounting operation is performed.

  The descending / pressurizing operation when mounting the components will be described with reference to the time chart shown in FIG. The descending operation at the time of component mounting is basically the same as that at the time of component adsorption described above except that the component is adsorbed by the nozzle 20.

  When the Z-axis motor 11 is driven, the lower stopper 23b moves the vertical Z driving portion 15 in the restricted state of FIG. 4 from the height of Z0 to a height at which the component does not contact the upper surface of the substrate, and only a small displacement from the upper surface. It descends at a high speed to the upper first position Z1 (time T1). Next, the speed is switched, and the movement is started at a low speed to the second position Z2 set below the height (= 0) of the upper surface of the substrate (time T2). Note that the Z-axis heights such as Z0, Z1, and Z2 are determined by the output of the encoder 41 built in the Z-axis motor 11.

  When the control device 40 receives a signal from the encoder 41 that the Z-axis motor 11 has moved to the first position Z1 at which the suction component does not come into contact with the upper surface of the board, the VCM 8 is energized to drive the VCM 8 8b and the pressure detecting unit 16, which is connected to this and moves up and down, the nozzle shaft 18, the nozzle chuck 19, the suction nozzle 20, the stopper 23a, 23b, etc. A self-weight cancel of the movable part + α force V1 is generated. As a result, the lower stopper 23b changes from the state of FIG. 4 to the unregulated state of FIG.

  The suction nozzle 20 moves down together with the vertical Z drive unit 15 and when the suction nozzle 20 reaches the height 0 of the upper surface of the substrate, the component sucked by the nozzle 20 contacts the substrate at time T0. This contact is detected by the load cell 24 as shown as an output value of the pressure detection unit 16 in the figure.

  At time T2, even if the suction component of the nozzle 20 contacts the substrate at time T0, the Z-axis motor 11 does not stop driving until the encoder output becomes Z2. This Z2 is set to a height at which the suction component sufficiently comes into contact even when the VCM 8 raises the movable portion with the output of V1 and the state shown in FIG.

  On the other hand, when the VCM 8 receives the contact signal of the nozzle 20 from the load cell 24, the VCM 8 switches to a downward force, gradually increases the pressurization amount (load) to the set output value V2, and the pressurization detection unit 16 Pressurization is performed until the output value reaches the target pressurization amount L2. When the target pressurization amount L2 is reached, pressurization is stopped, the target pressurization amount L2 is held for a preset pressurization time T3, and then the pressurization mounting operation is terminated.

  FIG. 8A shows an enlarged view of the component C sucked by the suction nozzle 20 being mounted on the substrate S under pressure. This figure shows a state in which the substrate S supported by the support pins 50 is bent downward by a pressure load.

  As described above, when the pressure mounting operation of the component C is completed, the vertical Z drive unit 15 of the mounting head 1 is raised upward at the Vz start speed by the Z-axis motor 11. At this time, the amount of pressurization (load) detected by the pressurization detection unit 16, that is, the amount of pressurization applied to the component C and the substrate S on which the suction nozzle 20 is mounted is gradually reduced to VCM8. Reduce the applied pressure (output value).

  Specifically, the component C is shorter than the time T4 required to reach the vertical Z driving unit 15 at the start speed Vz at the start speed Vz with the first position Z1 as the target height and when it is raised to this position. The control mode shown in FIG. 9 is set so that the time Tv until the output value of the VCM 8 that has pressurized has reached 0 from the target value V2 becomes shorter.

T4: Travel time from the second position Z2 to the first position Z1 = (Z2−Z1) / Vz
Tv: Drive time until the VCM output value (pressurization amount) changes from V2 to 0

  The first position Z1 is a height at which the suction nozzle 20, that is, the vertical Z driving unit 15 is rapidly lowered by the Z-axis motor 11 and stopped when the parts are mounted as described above. This is a position immediately above the substrate S where the component C that is present does not contact the substrate S.

  Therefore, in the present embodiment, when the suction nozzle 20 is raised after the component C is mounted on the substrate S, the first position where the tip of the nozzle is reliably separated from the surface of the mounted component C if the substrate S is not bent. Z1 is set to the target height, and the vertical Z drive unit 15 starts to rise at the normal start speed Vz. The first position Z1 can be set to, for example, 0.1 mm from the normal substrate surface.

  In the present embodiment, as described above, the nozzle ascending by the Z-axis motor 11 is started at the start speed Vz, and at the same time, the operation of decreasing the pressurization amount by the VCM 8 is started, and is substantially 0 during the time Tv shorter than the time T4. To.

  In addition, while the nozzle rises at the start speed Vz, the suction nozzle 20 moves away from the component C, and the timing t1 when the contact load detected by the pressure detection unit 16 becomes 0 (output of the load cell 24 = initial load) is triggered. As described above, the ascending speed of the vertical Z drive unit 15 by the Z-axis motor 11 is switched to a speed higher than the start speed Vz, and the XY gantry is driven after the movement is completed. Then, move on to the next component suction mounting operation.

  As described above, according to the present embodiment, the following effects can be obtained.

  (1) Since the force that has pushed the component C or the substrate S by the VCM 8 before the rising suction nozzle 20 leaves the component C can be reduced, a minute force is generated at the moment when the nozzle 20 moves away from the component C. It can be in a state where it is only held down. Accordingly, as shown in the image of FIG. 8B, it is possible to suppress the generation of a large repulsive force that protrudes upward due to the substrate S being pressed. It is possible to prevent the mounting component C from being displaced due to the force. In particular, a very light minute component mounted via cream solder or the like is effective because it has a small contact area and a low holding force and is easily displaced.

  (2) By reducing the decompression drive time Tv of the VCM 8 shorter than the normal required time T4 for raising the suction nozzle 20 (vertical Z drive unit 15) to the first position Z1 (target height) at the start speed Vz. Even when the suction nozzle 20 moves away from the component C before the suction nozzle 20 reaches the first position Z1, the pressure applied to the component C and the substrate S at that time can be reduced to almost zero. The component C can be prevented from being displaced due to the repulsive force of the substrate S.

  (3) Immediately after the target pressurization amount L2 is applied for a specified time (T3) at the time of mounting the component, the pressure applied by the VCM 8 is immediately reduced, so that the suction nozzle 20 moves away from the component because the substrate S is bent. Even if time is required, it is possible to prevent a large amount of pressure from being applied until then.

  (4) Before the normal required time T4 to reach the target height elapses, after confirming that the output value of the pressure detection unit 16 becomes 0 and the nozzle tip is surely separated from the component surface, Since the ascending operation up to the Z-axis height Z0 by the Z-axis motor 11 is performed at a high speed, the tact time for component mounting can be shortened.

  Next, the control operation according to the second embodiment of the present invention will be described with reference to the time chart of FIG.

  As shown in FIG. 8A, when the substrate S is bent when the component C is pressurized by the suction nozzle 20, when the suction nozzle 20 is lifted after the pressurization for the specified time T3 is completed, The bent substrate S tries to return to the original state by the repulsive force. In this case, as in the first embodiment, only the control of gradually reducing the pressure load by the VCM 8 to 0 and the control of the rising speed by the Z-axis motor 11, the rising speed of the suction nozzle 20 is the return speed of the substrate S. There is a possibility that the tip of the nozzle will be lifted from the part C by becoming faster.

  Therefore, when the nozzle rises after pressure mounting, the output of the pressure detector 16, that is, the output of the load cell 24 is monitored, and the pressure amount slightly larger than the minimum pressure amount (determined by the resolution) that can be detected by the load cell 24. While monitoring until L1, the output value of VCM8 is decreased. The output value (minute load) L1 of the pressurization detection unit 16 that terminates the nozzle raising control by the VCM8 is L1 = 0.15, assuming that the minimum detectable pressurization amount is, for example, 0.1 [N]. [N].

  As described above, after the designated time T3 ends, the output value of the VCM 8 is decreased while the suction nozzle 20 is being lifted at the start speed Vz by the Z-axis motor 11, and the same as in the first embodiment. The output value of the pressurization detecting unit 16 is set to L1 over a required time Tv shorter than the time T4, and the output value V3 of the VCM 8 at this L1 is maintained. The minute pressurization amount is controlled so as to keep the value at L1.

  As described above, when the ascending operation by the Z-axis motor 11 is continued in the state where the output of the pressurization detection unit 16 holds L1, the tip of the suction nozzle 20 moves away from the upper surface of the component C mounted on the substrate S. Sometimes, the output of the pressure detection unit 16 becomes zero. Therefore, as in the case of the first embodiment, the rising speed by the Z-axis motor 11 is changed to a high speed with the timing t1 of the signal of the output value 0 detected by the pressurization detection unit 16 as a trigger. At that time, a voltage is applied to the VCM 8 to generate a downward force V4, and the lower stopper 23b is abutted against the upper portion 15a of the vertical Z drive unit 15 as shown in FIG. Regulate the movement of

  According to the embodiment described in detail above, after the pressurization for the designated time T3 is completed, the Z-axis motor 11 starts to increase at the start speed Vz, and at the same time, the operation of gradually decreasing the pressurization load by the VCM 8 is started. The ascending operation can be performed while gradually decreasing the amount of pressure applied by the VCM 8 to L1 close to the minimum value that can be detected by the pressure detection unit 16 in the drive time Tv shorter than the normal required time T4 to the first position Z1.

  Accordingly, simultaneously with the end of pressurization at the designated time T3, the pressurization load applied to the component C can be attenuated from the target pressurization amount L2, and the nozzle tip is separated from the component C when the substrate S is not bent. Since the component can be held until just before the height (= 0), the reaction of the substrate S can be suppressed, and as a result, the displacement of the component C can be prevented.

  Although the present invention has been specifically described above, the present invention is not limited to that shown in the embodiment.

  For example, the pressure driving means may not be a VCM but an air cylinder or the like, and is not particularly limited as long as the structure can operate in the vertical direction.

  Further, although one load cell is used as the load detector, other load cells may be used, and two or more load cells may be used, depending on the detected pressurization amount.

  Further, although the spring is used for pressurizing the load cell and canceling the self-weight of the pressurization detecting unit, it may be other than the spring as long as it is an elastic body.

1 is a schematic perspective view schematically showing a component mounting apparatus according to a first embodiment of the present invention. Side view including a cross section showing a mounting head provided in the component mounting apparatus of the present embodiment Partial sectional view centering on the movable part by VCM of the mounting head. Partial sectional view showing the movable part in the descending restricted state Partial sectional view showing the movable part in the ascending regulation state Time chart showing the outline of pressurizing operation and ascending operation when mounting components according to this embodiment Block diagram showing the outline of the control system of the mounted head Explanatory drawing which shows the state when components are pressure-mounted on the board by the nozzle Chart showing the relationship between the movement time by the Z-axis motor and the decompression time by VCM when the suction nozzle is raised Time chart showing the outline of pressurizing operation and ascending operation when mounting components according to the second embodiment Sectional view showing the outline of a conventional mounting head Flow chart showing ascending operation after component mounting by conventional mounting head

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mount head 2 ... X-axis gantry 3 ... Y-axis gantry 8 ... Voice coil motor (VCM)
DESCRIPTION OF SYMBOLS 11 ... Z-axis motor 15 ... Vertical Z drive part 16 ... Pressure detection part 20 ... Adsorption nozzle 24 ... Load cell 40 ... Control apparatus 41 ... Z-axis encoder C ... Parts S ... Board | substrate

Claims (3)

A mounting head that is movable in the plane direction by the X-axis driving means and the Y-axis driving means has a suction nozzle that sucks and holds components, a pressure driving means that moves the suction nozzle back and forth in the Z-axis direction, and the pressure driving In a component mounting apparatus comprising: a Z-axis drive unit that integrally moves the suction nozzle forward and backward in the Z-axis direction; and a load detection unit that detects a contact load applied to the suction nozzle.
The suction nozzle is lowered by the Z-axis driving means, the sucked and held part is brought into contact with the substrate surface, a predetermined load is applied by the pressure driving means to press-mount the part, and then the Z-axis driving is performed. When raising the suction nozzle by means,
At the same time to start the elevation of the suction nozzle at a predetermined starting speed by the Z-axis driving means, said start the tapering of the pressure load by the pressure application driving unit, the suction nozzle tip wherein in a case where the substrate is not bent before reaching the target height set directly above the position away from the component mounted on the substrate, wherein further comprising a that control means to the substantially zero applied load without stopping the increase of the suction nozzle A component mounting apparatus characterized by   2. The component mounting apparatus according to claim 1, wherein the gradual decrease of the pressurizing load by the pressurizing driving unit is stopped when a preset minute load is detected by the load detecting unit.   2. The component mounting apparatus according to claim 1, wherein when the contact load detected by the load detection unit becomes substantially zero, a high-speed ascending operation by the Z-axis driving unit is started.

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