JP7029609B2 - Component mounting device and component mounting method - Google Patents

Description

The present invention relates to a component mounting device for mounting components on a board and a component mounting method.

In the component mounting operation in the component mounting device for mounting components on the board, the suction nozzle that vacuum-sucks the component is lowered to land on the mounting surface of the board, and the vacuum is released to raise the suction nozzle. In this component mounting operation, it is known to move the suction nozzle up and down after opening the vacuum for the purpose of preventing the component released from the suction nozzle from becoming unstable on the mounting surface (for example, Patent Document 1). See).

In the component mounting device of Patent Document 1, in a suction nozzle having a configuration in which an elastic force for pressing a component against a substrate is applied according to a pushing amount, the suction nozzle is moved up and down according to a predetermined operation profile to open a vacuum. The load (elastic force) that presses the component against the substrate before and after is kept constant.

Japanese Patent No. 5113534

By the way, when the substrate is warped upward (convexly), the mounting surface of the substrate is temporarily flattened by the pushing operation when the suction nozzle is lowered to land the component on the substrate. When the vacuum is released from this state and the suction nozzle is raised, the parts released from the suction nozzle bounce on the mounting surface due to the rise of the suction nozzle and the restoration that the substrate returns to the original convex state, and the position is changed. It may shift or come off the board. However, in the prior art including Patent Document 1, since the suction nozzle is moved up and down according to a predetermined operation profile regardless of the degree of warpage of each substrate, it is said that the mounting of parts becomes unstable depending on the substrate. There was a problem.

Therefore, an object of the present invention is to provide a component mounting device and a component mounting method capable of stably mounting components even on a board that is warped upward.

The component mounting device of the present invention controls the suction nozzle that vacuum sucks the component and mounts the component on the substrate mounted on the carrier, the nozzle driving means that operates the suction nozzle, and the nozzle driving means, and controls the suction. The nozzle is lowered, the component comes into contact with the mounting surface of the substrate, and then lowered by a predetermined amount to bring the lower surface of the substrate into close contact with the upper surface of the carrier, and after releasing the vacuum of the suction nozzle, the said. It is provided with a nozzle drive control unit that raises the suction nozzle.

The component mounting method of the present invention is a component mounting method for mounting the component on the board by a component mounting device provided with a suction nozzle for vacuum suctioning the component and mounting the component on a substrate mounted on a carrier. The mounting device includes a nozzle driving means for operating the suction nozzle, controls the nozzle driving means to lower the suction nozzle, and further lowers the suction nozzle by a predetermined amount after the component comes into contact with the mounting surface of the substrate. As a result, the lower surface of the substrate is brought into close contact with the upper surface of the carrier, the vacuum of the suction nozzle is released, and then the suction nozzle is raised .

According to the present invention, components can be stably mounted even on a substrate that is warped upward.

Top view of the component mounting apparatus according to the embodiment of the present invention. Top view of the carrier used in the component mounting apparatus according to the embodiment of the present invention. Perspective view of the mounting head used in the component mounting device according to the embodiment of the present invention. Explanatory drawing of the mounting state of the suction nozzle in the mounting head used in the component mounting apparatus of one embodiment of the present invention. An explanatory diagram of (a) component mounting on a flexible board in a component mounting device according to an embodiment of the present invention (b) an explanatory diagram of height measurement of a mounting surface of a flexible board. (A) (b) (c) (d) Process explanatory view of component mounting on a flexible substrate in the component mounting device according to the embodiment of the present invention. A graph showing (a) an example of a change in height between a suction holding surface of a suction nozzle and a mounting surface of a flexible substrate during component mounting in a component mounting device according to an embodiment of the present invention (b) an example of a change in moving speed. Graph showing A graph showing (a) an example of a change in height between a suction holding surface of a suction nozzle and a mounting surface of a flexible substrate during component mounting in a component mounting device according to an embodiment of the present invention (b) an example of a change in moving speed. Graph showing A block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present invention. A graph showing (a) a change in height between a suction holding surface of a suction nozzle and a mounting surface of a flexible substrate in the component mounting method according to the embodiment of the present invention (b) a graph showing a change in moving speed. A graph showing an example of the relationship between (a) the ascending speed of the suction nozzle and the maximum inflow amount of air flowing from the suction nozzle in the first speed setting method in the component mounting method according to the embodiment of the present invention (b) suction nozzle. Graph showing an example of the relationship between the ascending speed of and the maximum load applied to the suction nozzle A flow chart showing a component mounting method according to an embodiment of the present invention. The flow chart which shows the 1st Embodiment of the 1st speed setting method in the component mounting method of 1 Embodiment of this invention. The flow chart which shows the 2nd Embodiment of the 1st speed setting method in the component mounting method of 1 Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device. In the following, the corresponding elements are designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In FIG. 1 and a part described later, as biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transport direction (horizontal direction in FIG. 1) and the Y direction orthogonal to the substrate transport direction (vertical direction in FIG. 1). Is shown. In FIG. 3 and a part described later, the Z direction (vertical direction in FIG. 3) is shown as a height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting device is installed on a horizontal plane.

First, the overall configuration of the component mounting device 1 will be described with reference to FIG. In FIG. 1, a substrate transport portion 2 is arranged in the X direction on the upper surface of the base 1a. The board transport unit 2 transports the carrier 3 delivered from the upstream device, positions it at the mounting work position by the component mounting mechanism described below, and holds it. A plastic material is mainly used as a base material on the carrier 3, and a plurality of thin and flexible flexible substrates 4 are mounted on the carrier 3. That is, the substrate transport unit 2 transports and holds the flexible substrate 4 (board). Parts supply units 5 are arranged on both sides of the board transfer unit 2. A plurality of tape feeders 6 are mounted side by side on the component supply unit 5. The tape feeder 6 pitch-feeds the carrier tape holding the component to position the component at the supply position to the mounting head 9 constituting the component mounting mechanism.

A Y-axis moving beam 7 is horizontally arranged in the Y direction at one end of the upper surface of the base 1a in the X direction. A pair of X-axis moving beams 8 are slidably mounted in the Y direction on the Y-axis moving beam 7. The X-axis moving beam 8 is driven in the Y direction by the linear drive mechanism provided in the Y-axis moving beam 7. A mounting head 9 is slidably mounted in the X direction on each X-axis moving beam 8. The mounting head 9 includes a plurality of nozzle units 10, and is driven in the X direction by a linear drive mechanism provided in the X-axis moving beam 8.

By driving the Y-axis moving beam 7, the X-axis moving beam 8, and the mounting head 9, the mounting head 9 is arranged in each component supply unit 5 by the suction nozzle 18 (see FIG. 3) provided in the nozzle unit 10. The parts are vacuum-sucked out from the tape feeder 6 and transferred to the flexible substrate 4 for mounting. That is, the suction nozzle 18 vacuum sucks the component and mounts it on the flexible substrate 4 (substrate). In the above configuration, the Y-axis moving beam 7 and the X-axis moving beam 8 constitute a head moving mechanism 11 that moves the mounting head 9 in the horizontal direction (X direction, Y direction). Further, the Y-axis moving beam 7, the X-axis moving beam 8, and the mounting head 9 constitute a component mounting mechanism.

In FIG. 1, a component recognition camera 12 is arranged between a substrate transport section 2 and each component supply section 5 in the base 1a. The mounting head 9 from which the component is taken out from the component supply unit 5 moves above the component recognition camera 12, so that the component recognition camera 12 takes an image of the component held by the suction nozzle 18 in the mounting head 9.

On the coupling plate 9a to which the mounting head 9 is attached, a substrate recognition camera 13 located on the lower surface side of the X-axis moving beam 8 and moving integrally with the mounting head 9 is arranged in a posture in which the imaging direction is downward. Has been done. By moving the mounting head 9 above the carrier 3 held by the substrate transport unit 2, the substrate recognition camera 13 can image a reference point such as a position recognition mark (not shown) of the flexible substrate 4.

By recognizing the image pickup data acquired by the component recognition camera 12 and the substrate recognition camera 13, the position shift of the component held by the suction nozzle 18 in the mounting head 9 and the carrier held by the substrate carrier 2 are displaced. It is possible to detect the positional deviation of the flexible substrate 4 on 3. In the component mounting operation by the component mounting mechanism, the component mounting position by the mounting head 9 is corrected in consideration of these positional deviations.

In FIG. 1, a height sensor 14 such as a laser displacement sensor that moves integrally with the mounting head 9 is arranged on one side of the mounting head 9. The height sensor 14 includes a laser light source that projects the laser light downward and a light receiving element that receives the reflected light of the laser light projected by the laser light source. The height sensor 14 is controlled by the height measurement control unit 30b (see FIG. 9) to project and receive laser light, and derives the height of the measurement target such as the mounting surface of the flexible substrate 4 by the principle of triangulation. .. That is, the height sensor 14 measures the height of the mounting surface of the flexible substrate 4 (board).

Next, with reference to FIG. 2, the configuration of the carrier 3 and the flexible substrate 4 mounted on the carrier 3 will be described. FIG. 2 shows a state in which the component P is mounted on the flexible substrate 4. The carrier 3 is made of a rigid metal plate such as aluminum or stainless steel. A plurality of flexible substrates 4 (three in this case) are placed on the upper surface of the carrier 3 and are fixed to the carrier 3 by the heat resistant tape 15. The heat-resistant tape 15 is attached by an operator to a plurality of positions such as corners of a flexible substrate 4 that does not interfere with the mounted component P.

Next, the configuration of the mounting head 9 will be described with reference to FIGS. 3 and 4. In FIG. 3, the mounting head 9 is mounted on the X-axis moving beam 8 via the coupling plate 9a. The mounting head 9 has a configuration in which a plurality of nozzle units 10 are arranged side by side. Each nozzle unit 10 has a configuration in which the nozzle shaft 16 extends downward from the nozzle drive unit 10a, and the suction nozzle 18 is attached to and detached from the nozzle mounting portion 17 coupled to the lower end portion of the nozzle shaft 16. It is freely attached.

In FIG. 4, the nozzle shaft 16 communicates with the suction nozzle 18 through the nozzle mounting portion 17, and the suction hole (not shown) provided through the nozzle shaft 16 is evacuated via the flow rate sensor 19. It is connected to the source 20. By vacuum suctioning the suction hole of the nozzle shaft 16 by the vacuum supply source 20, the suction nozzle 18 vacuum sucks and holds the component P to be mounted on the suction holding surface 18a at the lower end portion. When the vacuum suction by the vacuum supply source 20 is stopped and the vacuum of the suction nozzle 18 is released, the component P held on the suction holding surface 18a is released. The flow rate sensor 19 measures the flow rate of the air flowing in from the suction nozzle 18 and being sucked into the vacuum supply source 20. That is, the flow rate sensor 19 is a sensor that measures the flow rate of the air flowing in from the suction nozzle 18.

In FIG. 3, each nozzle drive unit 10a is a nozzle height of a nozzle elevating mechanism that raises and lowers the elevating shaft (not shown) coupled to the nozzle shaft 16 by a linear motor, a linear encoder that detects the height position of the elevating shaft, and the like. It is equipped with a detection sensor 10b (see FIG. 9) and a load sensor 10c (see FIG. 9) such as a load cell for measuring the load applied to the elevating shaft. By driving this nozzle raising / lowering mechanism, the suction nozzles 18 mounted on the nozzle mounting portion 17 are individually raised / lowered. That is, the nozzle driving unit 10a is a nozzle driving means for operating the suction nozzle 18.

In the process of individually raising and lowering the suction nozzle 18 by the nozzle drive unit 10a, the height position of the suction nozzle 18 is individually detected by the nozzle height detection sensor 10b. The nozzle drive control unit 30c (see FIG. 9) controls the nozzle drive unit 10a (nozzle drive means) based on the height detection result, so that the height position, the descending speed Vd, and the ascending speed Vu of the suction nozzle 18 are determined. Can be controlled. Further, a load applied to the suction nozzle 18 mounted on the nozzle mounting portion 17 propagates and is applied to the elevating shaft. Therefore, the load applied to the suction nozzle 18 can be measured by the load sensor 10c.

Next, the process of mounting the component P on the flexible substrate 4 by the component mounting device 1 will be described with reference to FIGS. 5 to 8. FIG. 5 shows the AA cross section of the carrier 3 in FIG. In FIG. 5A, a flexible substrate 4 having a substrate thickness ts is mounted on the upper surface 3a of the carrier 3. On the mounting surface 4a, which is the upper surface of the flexible substrate 4, the component P (1) having the thickness tp (1) of the component is located at the component mounting position S (1) on the left side, and the component P (1) is located at the component mounting position S (2) on the right side. The component P (2) having a thickness of tp (2) is mounted by the suction nozzle 18.

The height sensor 14 measures the height of the mounting surface 4a of the flexible substrate 4, and the nozzle height detection sensor 10b measures the height position of the suction nozzle 18 (height of the suction holding surface 18a). Hereinafter, the reference point (height position where the height is zero) of the height of the mounting surface 4a of the flexible substrate 4 and the height of the suction holding surface 18a of the suction nozzle 18 is defined as the height position of the upper surface 3a of the carrier 3, respectively. The height from the reference point is simply referred to as "mounting surface height hs" and "adsorption holding surface height hn".

In FIG. 5A, the flexible substrate 4 is placed in close contact with the upper surface 3a of the carrier 3 without warping upward. Therefore, both the mounting surface height hs (1) of the component mounting position S (1) of the component P (1) and the mounting surface height hs (2) of the component mounting position S (2) of the component P (2) are both. , The thickness ts of the substrate of the flexible substrate 4 is the same.

In FIG. 5B, the flexible substrate 4 is placed on the upper surface 3a of the carrier 3 so that the component mounting position S (1) and the component mounting position S (2) warp upward (convexly). Since the flexible substrate 4 is flexible, there may be slack when the operator attaches the heat-resistant tape 15 to the upper surface 3a of the carrier 3, or the heat-resistant tape 15 can be attached to the tip as in the component mounting position S (2). If not (see also FIG. 2), the flexible substrate 4 may warp upward without being in close contact with the upper surface 3a of the carrier 3. In this case, the mounting surface height hs (1) and the mounting surface height hs (2) measured by the height sensor 14 are larger (higher) than the thickness ts of the substrate of the flexible substrate 4.

Next, with reference to FIGS. 6 and 7, a step of mounting the component P (1) by the suction nozzle 18 at the component mounting position S (1) of the flexible substrate 4 warped upward will be described in order. Cream solder (not shown) is printed in advance on the component mounting position S (1) of the flexible substrate 4 by a printing machine or the like. Hereinafter, the height of the component mounting position S (1) measured by the height sensor 14 before mounting the component P (1) is defined as the mounting surface height hs (1).

FIG. 7A shows the transition of the time T at the height positions of the suction holding surface 18a and the mounting surface 4a in the mounting process of the component P (1). FIG. 7B shows the transition of the time T of the moving speed (descending speed Vd, ascending speed Vu) of the suction nozzle 18 and the mounting surface 4a in the Z direction in the mounting process of the component P (1).

In FIG. 6A, the suction nozzle 18 that vacuum-sucks the component P (1) descends (arrow b) toward the component mounting position S (1) at a descending speed Vd1. In FIG. 6B, the lower surface of the component P (1) descending (arrow c) at the descending speed Vd1 abuts on the component mounting position S (1) at the mounting surface height hs (1) at time T1. .. The suction holding surface height hn at this time is defined as the first height H1. That is, the first height H1 is the height obtained by adding the thickness tp (1) of the component P (1) to the mounting surface height hs (1) (H1 = hs (1) + tp (1)). ).

In FIG. 6C, the suction nozzle 18 descending at the descending speed Vd1 stops at T2 when the lower surface of the flexible substrate 4 is in close contact with the upper surface 3a of the carrier 3 and the mounting surface 4a of the flexible substrate 4 becomes horizontal. .. The height of the suction holding surface hn at this time is the height obtained by adding the thickness tp (1) of the component to the thickness ts of the substrate (hn = ts + tp (1)).

That is, during the time T1 to the time T2, the mounting surface 4a of the flexible substrate 4 is continuously pushed downward by the lower surface of the component P (1) held by the suction nozzle 18. Therefore, during the time T1 to the time T2, the height position of the mounting surface 4a maintains the difference in the thickness tp (1) of the component from the height position of the suction holding surface 18a at the same descent speed Vd1 as the suction nozzle 18. It descends (see FIGS. 7 (a) and 7 (b)).

During the time T2 when the descent is stopped and the time T3 when the ascent is started, the suction nozzle 18 is released from the vacuum and stops the vacuum suction of the component P (1). Then, at time T3, the suction nozzle 18 in which the vacuum is released starts to rise at the first speed Vu1 (arrow d in FIG. 6D). As a result, the component P (1) is mounted at the component mounting position S (1). In FIG. 7A, the height position of the mounting surface 4a (component mounting position S (1)) of the flexible substrate 4 is warped upward as the suction nozzle 18 rises from the time T3 to the time T4. It moves upward (restored) by the restoring force of the flexible substrate 4.

Here, the first speed Vu1 is assumed to be slower than the speed at which the mounting surface 4a of the flexible substrate 4 recovers (restores) upward (hereinafter referred to as “recovery speed Vr”). In that case, the suction holding surface 18a of the suction nozzle 18 moves upward at the first speed Vu1 while restricting the component P (1) by the suction holding surface 18a without separating from the upper surface of the component P (1). See FIG. 7 (b)). Therefore, between the time T3 and the time T4, that is, until the suction holding surface 18a of the suction nozzle 18 reaches the first height H1, a force for pressing the component P (1) against the mounting surface 4a acts to force the component P (1). ) Does not separate from the mounting surface 4a.

Then, at time T4, the suction holding surface 18a reaches the first height H1 (hn = H1), and then the suction nozzle 18 leaves the component P (1) on the mounting surface 4a of the flexible substrate 4 (mounting). And then rise. As described above, in the first velocity Vu1, the suction holding surface 18a of the suction nozzle 18 is mounted on the flexible substrate 4 (board) until the suction holding surface 18a of the rising suction nozzle 18 reaches the first height H1. The speed is such that it does not separate from the upper surface of the component P.

As described above, when the ascending speed Vu is slower than the recovery speed Vr, the component P (1) rises to the original mounting surface height hs (1) in a state of being in contact with the suction holding surface 18a due to the restoring force of the flexible substrate 4. Therefore, the component P (1) does not bounce on the mounting surface 4a of the flexible substrate 4 and is not displaced or detached from the flexible substrate 4. Strictly speaking, when the component P (1) is mounted, the height of the mounting surface 4a is not restored to the original mounting surface height hs (1) due to the deflection caused by the weight of the component P (1). The deflection due to the weight of P (1) will be ignored in the explanation.

FIG. 8 shows a case where the suction nozzle 18 is raised at a second speed Vu2, which is faster than the recovery speed Vr, after the component P (1) held by the suction nozzle 18 is brought into contact with the flexible substrate 4 to release the vacuum. Shows. Since it is the same as in FIG. 7 up to the time T3, the description thereof will be omitted. In FIG. 8A, during the time T3 to the time T4, the suction holding surface 18a is 2 in the figure in which the component thickness tp (1) of the component P (1) is added to the height position of the mounting surface 4a. It is rising at a position higher than the height indicated by the dotted line e. That is, after the time T3, the suction holding surface 18a of the suction nozzle 18 rises in a state of being separated from the upper surface of the component P (1).

After the time T3, the mounting surface 4a of the flexible substrate 4 moves (restores) upward by its own restoring force with the component P (1) mounted at the component mounting position S (1). In FIG. 8B, the mounting surface 4a starts to rise from the time T3, reaches the recovery speed Vr which is the maximum rising speed between the time T3 and the time T4, and then the original mounting surface height hs (1). ) Slows down and stops ascending when the mounting surface height hs (1) is reached. Alternatively, the mounting surface 4a (component mounting position S (1)) may stop at the mounting surface height hs (1) while vibrating once exceeding the mounting surface height hs (1).

In this way, the component P (1) rises without exerting a pressing force on the flexible substrate 4, so that when a force exceeding the adhesive force of the cream solder is generated, the component P (1) is mounted on the mounting surface 4a. There is a risk that it will bounce on the top and deviate from the component mounting position S (1) or deviate from the flexible board 4. That is, after the vacuum is released, the suction nozzle 18 can be raised at an ascending speed Vu (for example, a second velocity Vu2) larger than the recovery speed Vr, so that the component mounting time can be shortened, but the mounted component P can be shortened. (1) may become unstable.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. 9. The component mounting device 1 includes a control unit 30, a storage unit 31, a board transport unit 2, a component supply unit 5, a mounting head 9, a head moving mechanism 11, a component recognition camera 12, a board recognition camera 13, a height sensor 14, and a flow sensor. It includes 19, a vacuum supply source 20, and a display unit 32. The mounting head 9 includes a nozzle driving unit 10a, a nozzle height detection sensor 10b, and a load sensor 10c.

The control unit 30 is an arithmetic processing device having a CPU function, and includes a mounting control unit 30a, a height measurement control unit 30b, a nozzle drive control unit 30c, a determination unit 30d, and a speed setting unit 30e as internal processing functions. The storage unit 31 is a storage device and stores mounting data 31a, mounting surface height data 31b, nozzle speed data 31c, recovery speed data 31d, and the like. The mounting data 31a includes information such as the position of the flexible substrate 4 on the carrier 3, the component mounting position S of the component P on the flexible substrate 4, the type of the component P to be mounted, and the thickness tp of the component. The nozzle speed data 31c includes a descending speed Vd of the suction nozzle 18 at the time of mounting a component, an ascending speed Vu (first speed Vu1, second speed Vu2), and the like.

In FIG. 9, the mounting control unit 30a controls the substrate transport unit 2, the component supply unit 5, the mounting head 9, the head moving mechanism 11, and the vacuum supply source 20 based on the mounting data 31a, and is flexible by the suction nozzle 18. It controls the mounting of the component P on the board 4. The height measurement control unit 30b controls the head movement mechanism 11 and the height sensor 14 to control the measurement of the height of the mounting surface 4a (mounting surface height hs) at the component mounting position S of the flexible substrate 4. The measurement result is stored in the storage unit 31 as the mounting surface height data 31b.

The nozzle drive control unit 30c controls the nozzle drive unit 10a, the nozzle height detection sensor 10b, and the vacuum supply source 20 based on the nozzle speed data 31c, and operates the suction nozzle 18 in component mounting, the first speed Vu1. The operation of the suction nozzle 18 in the measurement of is controlled.

More specifically, in component mounting, the nozzle drive control unit 30c lowers the suction nozzle 18 that vacuum-sucks the component P, and after the component P comes into contact with the mounting surface 4a of the flexible substrate 4 (board), the location is further increased. Decrease a fixed amount. Then, the nozzle drive control unit 30c is set to the height (mounting surface height hs) of the mounting surface 4a of the flexible substrate 4 measured at least before lowering the suction nozzle 18 after releasing the vacuum of the suction nozzle 18. The suction nozzle 18 is raised at the first velocity Vu1 to the first height H1 to which the thickness tp is added. After that, the nozzle drive control unit 30c raises the suction nozzle 18 at a second speed Vu2, which is faster than the first speed Vu1.

FIG. 10B shows the moving speed (descending speed Vd, ascending speed Vu) of the suction nozzle 18 in the Z direction in the component mounting controlled by the nozzle drive control unit 30c. Further, in FIG. 10 (a), the suction holding surface 18a of the suction nozzle 18 in the component mounting when the component P (1) is mounted at the component mounting position S (1) warped upward as shown in FIG. 5 (b). The height position of the mounting surface 4a (component mounting position S (1)) of the flexible substrate 4 is shown. The nozzle drive control unit 30c lowers the suction nozzle 18 that vacuum-sucks the component P (1) until time T6 at a lowering speed Vd1 (see also FIG. 6A). During the descent, the lower surface of the component P (1) abuts on the flexible substrate 4 mounting surface 4a at time T5 (see also FIG. 6B).

From time T5 to time T6, the nozzle drive control unit 30c lowers the lower surface of the component P (1) by pushing down the mounting surface 4a until the mounting surface 4a of the flexible substrate 4 becomes horizontal (predetermined amount) (FIG. 6 (FIG. 6). See also c)). The predetermined amount to be lowered here is not limited to the amount of lowering (hs (1) -ts) at which the mounting surface 4a becomes horizontal, and a fixed value or the like may be arbitrarily set. The nozzle drive control unit 30c releases the vacuum of the suction nozzle 18 between the time T6 and the time T7. After that, the nozzle drive control unit 30c raises the suction nozzle 18 at the first speed Vu1 from the time T7 to the time T8. At time T8, the suction holding surface 18a reaches the first height H1. After that, the nozzle drive control unit 30c raises the suction nozzle 18 to the initial height position at the second speed Vu2 from the time T8.

In this way, the component P (1) is mounted on the mounting surface 4a by raising the suction nozzle 18 at the first speed Vu1 slower than the recovery speed Vr until the suction holding surface 18a reaches the first height H1. Can be stably implemented in. Further, after the first height H1 in which the suction holding surface 18a is separated from the upper surface of the component P (1), the suction nozzle 18 is raised at a faster second speed Vu2 (for example, the maximum rising speed of the nozzle drive unit 10a). By doing so, the component mounting time can be reduced. By controlling the suction nozzle 18 in this way, the component P can be stably mounted even on the flexible substrate 4 (board) that is warped upward.

In FIG. 9, in the measurement of the first speed Vu1, the nozzle drive control unit 30c lowers the suction nozzle 18 that vacuum-sucks the component P, and the component P abuts on the mounting surface 4a of the flexible substrate 4 (board). Further lower the predetermined amount from. After releasing the vacuum of the suction nozzle 18, the nozzle drive control unit 30c repeatedly executes an operation of raising the suction nozzle 18 to a height exceeding the first height H1 at a plurality of different ascending speeds Vu.

The determination unit 30d determines whether or not the component P is in contact with the suction nozzle 18 in the measurement of the first velocity Vu1. More specifically, the determination unit 30d sucks the vacuum again from the vacuum supply source 20 while the suction nozzle 18 that has released the vacuum rises and the suction holding surface 18a reaches the first height H1. The flow rate sensor 19 measures the flow rate of the air flowing in from the suction nozzle 18.

Then, the determination unit 30d determines that the component P is in contact with the suction nozzle 18 if the maximum value of the air flow rate is smaller than the predetermined value (or is zero), and if it is larger than the predetermined value, the component P is attached to the suction nozzle 18. Judge that they were not in contact. That is, when the suction nozzle 18 rises faster than the component P and the suction holding surface 18a is separated from the upper surface of the component P, the flow sensor 19 detects that air flows in from the suction holding surface 18a.

Further, the determination unit 30d measures the load applied to the suction nozzle 18 by the load sensor 10c while the suction nozzle 18 that has released the vacuum rises and the suction holding surface 18a reaches the first height H1. Then, the determination unit 30d determines that the component P is in contact with the suction nozzle 18 if the maximum value of the load applied to the suction nozzle 18 is larger than the predetermined value, and if it is smaller than the predetermined value (or zero), the component P sucks. It is determined that the nozzle 18 is not in contact with the nozzle 18. That is, when the suction nozzle 18 rises faster than the component P and the suction holding surface 18a is separated from the upper surface of the component P, the load sensor 10c detects that the upward load applied to the suction nozzle 18 from the component P disappears.

In FIG. 9, in the measurement of the first speed Vu1, the speed setting unit 30e has the upper surface of the component P having the first height among the plurality of ascending speed Vu repeatedly executed by the nozzle drive control unit 30c by the determination unit 30d. The ascending speed Vu determined to be in contact with the suction holding surface 18a of the suction nozzle 18 up to H1 is set as the first speed Vu1. If there are a plurality of ascending speeds Vu whose upper surface of the component P is determined to be in contact with the suction holding surface 18a of the suction nozzle 18 up to the first height H1, the fastest ascending speed Vu is set. Is preferable.

FIG. 11 shows that in the measurement of the first velocity Vu1, the maximum flow rate of air is increased by the flow sensor 19 while increasing the ascending velocity Vu to the ascending velocity Vu (1), Vu (2), ... )), The maximum load is measured by the load sensor 10c (FIG. 11 (b)), and the measurement results are schematically shown. In FIG. 11A, the maximum flow rate of air, which was almost zero up to the ascending speed Vu (5), rapidly increases at the ascending speed Vu (6), so that the determination unit 30d ascends to the ascending speed Vu (5). It is determined that there is a recovery speed Vr between the speeds Vu (6), and the component P is no longer in contact with the suction nozzle 18 during this time. The speed setting unit 30e sets, for example, an ascending speed Vu (5) slower than the recovery speed Vr as the first speed Vu1 based on the result of the judgment by the determination unit 30d. The set first velocity Vu1 is stored in the storage unit 31 as nozzle velocity data 31c.

In FIG. 11B, since the maximum load applied to the suction nozzle 18 up to the ascending speed Vu (5) becomes almost zero at the ascending speed Vu (6), the determination unit 30d determines the ascending speed Vu (5). It is determined that there is a recovery speed Vr between the rising speed Vu (6) and the component P is no longer in contact with the suction nozzle 18. The speed setting unit 30e sets, for example, an ascending speed Vu (5) slower than the recovery speed Vr as the first speed Vu1 based on the result of the judgment by the determination unit 30d. The set first velocity Vu1 is stored in the storage unit 31 as nozzle velocity data 31c.

The recovery speed Vr varies depending on the weight of the component P mounted at the component mounting position S, the tension applied to the flexible substrate 4 warped upward, and the like. Therefore, the measured first velocity Vu1 differs depending on the component mounting position S. The speed setting unit 30e may store the first speed Vu1 in the nozzle speed data 31c for each component mounting position S, or the smallest first speed V1 among the first speed V1 of the plurality of component mounting positions S. The velocity Vu1 may be stored as nozzle velocity data 31c at all component mounting positions S.

In FIG. 9, the nozzle drive control unit 30c, the height measurement control unit 30b, and the speed setting unit 30e can also set the first speed Vu1 in cooperation with each other as follows. That is, the nozzle drive control unit 30c lowers the suction nozzle 18 without vacuum sucking the component P, and after the suction nozzle 18 comes into contact with the mounting surface 4a of the flexible substrate 4 (board), the component P is further lowered by a predetermined amount. The suction nozzle 18 is raised at the second speed Vu2 while measuring the height of the mounting surface 4a of the flexible substrate 4 by the height sensor 14 (see also time T3 and later in FIG. 8).

The height measurement control unit 30b controls the height sensor 14 to measure the time transition of the height of the mounting surface 4a that recovers upward. Then, in the speed setting unit 30e, the height of the mounting surface 4a of the flexible substrate 4 measured by the height sensor 14 is the height of the mounting surface 4a of the flexible substrate 4 measured before lowering the suction nozzle 18 (mounting). A speed equal to or less than the recovery speed Vr that recovers to the surface height hs (1)) is set as the first speed Vu1. The set first velocity Vu1 is stored in the nozzle velocity data 31c.

Next, a component mounting method in the component mounting device 1 will be described with reference to FIGS. 5, 6, and 10 according to the flow of FIG. 12. Here, a case where the component P (1) is mounted at the component mounting position S (1) which is curved upward in a convex shape as shown in FIG. 5B will be described as an example. In FIG. 12, first, the height measurement control unit 30b measures the height (mounting surface height hs (1)) of the mounting surface 4a of the flexible substrate 4 (board) by the height sensor 14 (ST1: mounting surface). Height measurement step) (see FIG. 5 (b)).

Next, the nozzle drive control unit 30c lowers the suction nozzle 18 that vacuum-sucks the component P (1) (see FIG. 6A), and after the component P (1) comes into contact with the mounting surface 4a of the flexible substrate 4. (See FIG. 6 (b), time T5 in FIG. 10) Further lowering by a predetermined amount (ST2: nozzle lowering step) and stopping the lowering of the suction nozzle 18 (ST3: lowering stop step) (FIG. 6 (c), FIG. See time T6 at 10). Next, the nozzle drive control unit 30c releases the vacuum of the suction nozzle 18 (ST4: vacuum opening step).

In FIG. 12, the nozzle drive control unit 30c then applies the component thickness tp (1) to at least the height of the mounting surface 4a (mounting surface height hs (1)) of the flexible substrate 4 measured by the height sensor 14. The suction nozzle 18 is raised to the added first height H1 at the first speed Vu1 (ST5: first rising step) (see time T7 to time T8 in FIG. 10). After that, the nozzle drive control unit 30c raises the suction nozzle 18 at a second speed Vu2 faster than the first speed Vu1 (ST6: second rising step) (FIG. 6 (d), time T8 or later in FIG. 10). reference). Next, the nozzle drive control unit 30c stops the ascent of the suction nozzle 18 at the initial height position (ST7: ascending stop step).

Next, a first embodiment of the first speed setting method in the component mounting apparatus 1 will be described with reference to FIG. 11 in accordance with the flow of FIG. Hereinafter, the same steps as the above-mentioned component mounting method are designated by the same reference numerals, and detailed description thereof will be omitted. In FIG. 13, the nozzle drive control unit 30c sets the ascending speed Vu to the initial value ascending speed Vu (1) (ST11). Next, the mounting surface height measuring step (ST1) is executed, the height of the mounting surface 4a (mounting surface height hs) of the flexible substrate 4 (board) is measured, and the nozzle lowering step (ST2) is executed to execute the component P. The suction nozzle 18 for vacuum suction is lowered, and after the component P comes into contact with the mounting surface 4a of the flexible substrate 4, the component P is further lowered by a predetermined value.

Next, the descending stop step (ST3) and the vacuum opening step (ST4) are executed to release the vacuum of the suction nozzle 18. Next, the nozzle drive control unit 30c raises the suction nozzle 18 to a height exceeding the first height H1 at the set ascending speed Vu (1) (ST12). Next, the determination unit 30d is a component up to the first height H1 based on the measurement result of the flow rate of the air flowing in from the suction nozzle 18 by the flow rate sensor 19 or the measurement result of the load applied to the suction nozzle 18 by the load sensor 10c. It is determined whether or not P is in contact with the suction nozzle 18 (ST13).

When it is determined that the component P is in contact with the suction nozzle 18 up to the first height H1 (Yes in ST13), the nozzle drive control unit 30c increases the ascending speed Vu by a predetermined amount to increase the ascending speed Vu (2). (ST14). Next, the process returns to the nozzle lowering step (ST2), and it is determined whether or not the component P is in contact with the suction nozzle 18 up to the first height H1 while raising the suction nozzle 18 at the ascending speed Vu (2). In the example of FIG. 11, it is determined that the component P is not in contact with the suction nozzle 18 up to the first height H1 at the ascending speed Vu (6) (No in ST13), and the speed setting unit 30e has the first height. The ascending speed Vu (5) in which the component P is in contact with the suction nozzle 18 up to H1 is set to the first speed Vu1 (ST15).

In this way, a series of operations for raising the suction nozzle 18 to a height exceeding the first height H1 is repeatedly executed at a plurality of different ascending speeds Vu, and the first height among the plurality of ascending speeds Vu. The ascending speed Vu in which the component P is in contact with the suction nozzle 18 up to H1 is set as the first speed Vu1. In this way, the first speed Vu1 can be measured and set by the component mounting device 1 without adding a dedicated sensor and measuring device.

Next, a second embodiment of the first speed setting method in the component mounting apparatus 1 will be described with reference to FIG. 8 in accordance with the flow of FIG. The second embodiment of the first speed setting method is different from the first embodiment in that the first speed Vu1 is set by one measurement using the height sensor 14. Hereinafter, the same steps as the above-mentioned component mounting method are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 14, the mounting surface height measuring step (ST1) is executed, the height of the mounting surface 4a (mounting surface height hs) of the flexible substrate 4 (board) is measured, and the nozzle lowering step (ST2) is executed. The suction nozzle 18 that does not vacuum-suck the component P is lowered, and after the component P comes into contact with the mounting surface 4a of the flexible substrate 4, it is further lowered by a predetermined value. Next, the descent stop step (ST3) is executed to stop the descent of the suction nozzle 18. Next, while the height measurement control unit 30b measures the height of the mounting surface 4a of the flexible substrate 4 by the height sensor 14, the nozzle drive control unit 30c raises the suction nozzle 18 at the second speed Vu2 (ST21).

Next, the height measurement control unit 30b calculates the recovery speed Vr based on the measurement result of the height sensor 14 (ST22), and the speed setting unit 30e sets the first speed Vu1 based on the recovery speed Vr (ST23). ). That is, in the speed setting unit 30e, the height of the mounting surface 4a of the flexible substrate 4 measured by the height sensor 14 is the height of the mounting surface 4a of the flexible substrate 4 measured before lowering the suction nozzle 18. The speed of the recovery speed Vr or less that recovers to the mounting surface height hs) is set as the first speed Vu1. As described above, in this embodiment, the first speed Vu1 can be set by one measurement.

As described above, the component mounting device 1 of the present embodiment includes the substrate transport unit 2, the suction nozzle 18, the nozzle drive unit 10a (nozzle drive means), the nozzle drive control unit 30c, and the height sensor 14. And have. Then, the nozzle drive control unit 30c lowers the suction nozzle 18 that vacuum-sucks the component P, and after the component P comes into contact with the mounting surface 4a of the flexible substrate 4 (board), the component P is further lowered by a predetermined amount. Then, after the vacuum of the suction nozzle 18 is released, the thickness tp of the component is added to the height (mounting surface height hs) of the mounting surface 4a of the flexible substrate 4 measured at least before the suction nozzle 18 is lowered. The suction nozzle 18 is raised at the first speed Vu1 to the height H1 of 1, and then the suction nozzle 18 is raised at the second speed Vu2 which is faster than the first speed Vu1.

As a result, even if the flexible substrate 4 (board) is warped upward, the component P does not bounce on the mounting surface 4a and is not displaced or detached from the flexible substrate 4, and the component P can be stably mounted. Can be implemented.

In the above description, the case where the component P is mounted on the flexible substrate 4 has been described, but the substrate to be mounted is not limited to the flexible substrate 4. For example, it can be applied even when the printed circuit board is warped upward when the component P is mounted on the printed circuit board held in the board transport unit 2.

The component mounting device and the component mounting method of the present invention have the effect that components can be stably mounted even on a board that is warped upward, and are useful in the field of component mounting in which components are mounted on the board. be.

1 Component mounting device 2 Board transfer unit 4 Flexible board (board)
4a Mounting surface 10a Nozzle drive unit (nozzle drive means)
14 Height sensor 18 Suction nozzle 19 Flow sensor (sensor)
H1 1st height P component Vr recovery speed Vu1 1st speed Vu2 2nd speed

Claims (8)

A suction nozzle that vacuum sucks parts and mounts them on a substrate placed on a carrier,
The nozzle driving means for operating the suction nozzle and
By controlling the nozzle driving means to lower the suction nozzle and further lowering the component by a predetermined amount after the component comes into contact with the mounting surface of the substrate, the lower surface of the substrate is brought into close contact with the upper surface of the carrier . A component mounting device including a nozzle drive control unit that raises the suction nozzle after releasing the vacuum of the suction nozzle. The nozzle drive control unit raises the suction nozzle at the first speed.
The component mounting device according to claim 1 , wherein the first speed is set to a speed slower than the recovery speed at which the substrate recovers . The component according to claim 2 , wherein the nozzle drive control unit raises the suction nozzle at the first speed to at least a first height obtained by adding the thickness of the component to the height of the mounting surface of the substrate. Mounting device. The nozzle drive control unit is
After releasing the vacuum of the suction nozzle, the operation of raising the suction nozzle to a height exceeding the first height is repeatedly executed at a plurality of different ascending speeds.
The component mounting device according to claim 3, wherein among the plurality of ascending speeds, the ascending speed at which the component is in contact with the suction nozzle up to at least the first height is set as the first velocity. It is a component mounting method for mounting the component on the board by a component mounting device equipped with a suction nozzle for vacuum suctioning the component and mounting the component on the substrate mounted on the carrier.
The component mounting device includes a nozzle driving means for operating the suction nozzle.
By controlling the nozzle driving means to lower the suction nozzle and further lowering the component by a predetermined amount after the component comes into contact with the mounting surface of the substrate, the lower surface of the substrate is brought into close contact with the upper surface of the carrier . A component mounting method in which the suction nozzle is raised after the vacuum of the suction nozzle is released. The component mounting device includes a nozzle drive control unit that controls the nozzle drive means.
The nozzle drive control unit raises the suction nozzle at the first speed.
The component mounting method according to claim 5 , wherein the first speed is set to a speed slower than the recovery speed at which the substrate recovers . The component according to claim 6 , wherein the nozzle drive control unit raises the suction nozzle at the first speed to at least a first height obtained by adding the thickness of the component to the height of the mounting surface of the substrate. Implementation method. The nozzle drive control unit is
After releasing the vacuum of the suction nozzle, the operation of raising the suction nozzle to a height exceeding the first height is repeatedly executed at a plurality of different ascending speeds.
The component mounting method according to claim 7, wherein the ascending speed at which the component is in contact with the suction nozzle is set as the first velocity among the plurality of ascending speeds.

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