JP2012174822A - Compression control head of mounter device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the compression time by switching the compression speed appropriately in a mounter device.SOLUTION: The mounter device comprises a servo motor 23 which positions the height of a nozzle 131 sucking a component, and a compression control head 13 which can control the load for pressing the component sucked by the nozzle 131 against a substrate. The mounter device is further provided with a shock absorbing spring 132 built into the tip of the nozzle 131, and a sensor which detects the pressure of the nozzle 131 for pressing the sucked component against the substrate surface. The component sucked by the nozzle 131 is lowered to the substrate surface at a constant velocity by driving the servo motor 23. Lowering speed of the nozzle 131 is decelerated after detecting the repulsive force due to compression of the shock absorbing spring 132 by means of the pressure sensor before completing compression of the shock absorbing spring 132.

Description

  The present invention relates to a pressure control head of a mounter device that mounts electronic components on a substrate.

  As a conventional electronic component mounter device, for example, according to Patent Document 1, as a conventional method for shortening the pressurization time, a position where the electronic component abuts a printed circuit board or the like at a position where the pressure detected by the pressure detection unit starts to increase. A method of learning the position and improving the accuracy of the position that can be lowered at high speed has been proposed.

Japanese Patent No. 3817207

However, in the conventional method, as in Patent Document 1, when pressure control is performed using a springless nozzle, an impact force determined by the momentum (mass × speed) on the side that gives an impact is generated during a collision. .
Since there is a possibility that the component is destroyed by this impact force, it is necessary to set the speed at which the electronic component contacts the board surface to be low.
In addition, if it is executed at a low axial speed throughout the entire mounting process, the mounting tact will be reduced, so it is moved to a position close to the mounting height at a high speed, and then switched to a sufficiently low speed that does not damage the parts and contact. I am doing so.
For this reason, as shown in FIG. 13, there existed a problem that pressurization time became long.

  An object of the present invention is to shorten a pressurization time by using a spring that buffers a collision with a substrate in a mounter device and appropriately switching a pressurization speed during the buffering.

  In order to solve the above problems, the present invention is a mounter device including a servo motor that positions the height of a nozzle that sucks a component, and a pressure control head that can control a load that presses the component sucked by the nozzle against a substrate. A shock absorbing spring incorporated at the tip of the nozzle and a sensor for detecting a pressure for pressing the component adsorbed by the nozzle against the substrate surface, and the component adsorbed by the nozzle by driving the servo motor The nozzle is lowered at a constant speed to the surface, and after detecting the repulsive force due to the compression of the shock absorbing spring by the pressure sensor, the lowering speed of the nozzle is decelerated until the compression of the shock absorbing spring is completed. To do.

  According to the present invention, the pressurization time can be shortened by appropriately switching the pressurization speed.

It is a schematic block diagram which shows the structure of one Embodiment of the mounter apparatus to which this invention is applied. It is a block diagram of the control system of a mounter apparatus. It is a block diagram of the mechanism system of a mounting head part. It is a graph which shows the relationship between the output voltage of a strain gauge, and a load value. It is the graph which showed the Z-axis motor speed with respect to the positional relationship of a component and a board | substrate, a detected load, a target load, and a Z-axis target coordinate. It is the graph which measured the relationship between a motor shaft transition angle (the difference of the target coordinate of a motor shaft, and a real coordinate) and generated torque. It is the graph which measured the change of the load which the board | substrate surface receives after the components adsorbed | sucked to the nozzle front-end | tip contact | abutted to the board | substrate surface. It is the schematic which shows the mechanical structure which has the nozzle spring provided in order to reduce an impact force in addition to a pressurization detection means. It is a graph which shows a pressure waveform and speed waveform at the time of carrying out pressurization control with a suction nozzle with a spring. It is a graph which shows the pressure waveform at the time of pressurization control by this invention, and a velocity waveform. It is a flowchart which shows mounting from setup in the control method of this invention. FIG. 11 is a graph showing the pressurization start positions aligned from FIG. 7 used in the description of the conventional control and FIG. 10 used in the description of the control of the present invention. It is a graph which shows a pressure waveform at the time of carrying out pressurization control with the conventional nozzle without a spring, and a speed waveform.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.
<Outline of the invention>
The present invention is a mounter device that moves and mounts an electronic component onto a substrate from a component supply unit by means of a suction nozzle, and a sensor (load cell) that detects the pressure with which the nozzle presses the component against the substrate surface, and is incorporated at the tip of the nozzle. A shock-absorbing spring is provided, and the adsorbed parts are lowered to the substrate surface at a constant speed, and the pressure sensor (load cell) detects the repulsive force due to the compression of the nozzle tip spring, and then the compression of the nozzle tip spring is completed. This is a pressurization control system that decelerates the descending speed of the nozzles until the start.
Furthermore, when the electronic component is sucked by the suction nozzle using the pressure control method, the nozzle tip spring completes the suction during the compression.

(Embodiment 1)
<Mounter structure>
FIG. 1 is a schematic configuration diagram of an electronic component mounting apparatus (mounter apparatus).
As shown in the figure, the electronic component mounting apparatus 1 is disposed on the circuit board transport path 15 extending in the left-right direction slightly rearward from the central part, and on the front part (lower side in the figure) of the apparatus 1. A component supply unit 11 that supplies components to be mounted on the apparatus 1, and an X-axis movement mechanism 12 and a Y-axis movement mechanism 14 that are disposed at the front of the apparatus 1 are provided.

A component recognition camera (imaging unit) 16 that images the component sucked by the suction nozzle 131 from below is disposed on the side of the component supply unit 11.
The X-axis moving mechanism 12 moves a mounting head unit 13 (pressure control head) including a suction nozzle 131 that sucks components in the X-axis direction.
The mounting head unit 13 is connected to the X-axis moving mechanism 12.
The Y-axis moving mechanism 14 moves the X-axis moving mechanism 12 and the mounting head unit 13 in the Y-axis direction.
The mounting head unit 13 includes a Z-axis moving mechanism that moves the suction nozzle 131 up and down in the vertical direction (Z-axis direction), and also rotates the suction nozzle 131 about the nozzle axis (suction axis). A moving mechanism is provided.
The mounting head unit 13 is mounted with a substrate recognition camera 17 that images a substrate mark formed on the circuit substrate 10 so as to be attached to the support member.

  FIG. 2 shows the configuration of the control system of the electronic component mounting apparatus. In the figure, reference numeral 20 denotes a microcomputer (CPU) for controlling the entire apparatus, and a controller (control means) comprising RAM, ROM, etc. A display device (monitor) 31 is connected to the controller 20 from an X-axis motor 21. Each has control.

The X-axis motor 21 is a drive source for the X-axis moving mechanism 12 and moves the mounting head unit 13 in the X-axis direction.
The Y-axis motor 22 is a drive source for the Y-axis moving mechanism 14 and drives the X-axis moving mechanism 12 in the Y-axis direction, so that the mounting head unit 13 can move in the X-axis direction and the Y-axis direction. .

The Z-axis motor 23 is a drive source of a Z-axis drive mechanism (not shown) that moves the suction nozzle 131 up and down, and moves the suction nozzle 131 up and down in the Z-axis direction (height direction).
The θ-axis motor 24 is a drive source for a θ-axis rotation mechanism (not shown) of the suction nozzle 131, and rotates the suction nozzle 131 about its nozzle central axis (suction axis).

The image recognition device 27 performs image recognition of the component 18 sucked by the suction nozzle 131, and includes an A / D converter 271, a memory 272, and a CPU 273.
The analog image signal output from the component recognition camera 16 that images the picked-up component 18 is converted into a digital signal by the A / D converter 271 and stored in the memory 272, and the CPU 273 is based on the image data. Recognize the sucked parts.
That is, the image recognition device 27 calculates the component center and the suction angle, and recognizes the suction posture of the component.
In addition, the image recognition device 27 calculates the substrate mark position by processing the image of the substrate mark captured by the substrate recognition camera 17.
Further, the image recognition device 27 processes the image data of the component 18 imaged by the component recognition camera 16 and the board mark data imaged by the board recognition camera 17, and transfers both correction data to the control means 20.

The keyboard 28 and mouse 29 are used for inputting data such as component data.
The storage device 30 is configured by a flash memory or the like, and is used to store component data input by the keyboard 28 and the mouse 29, component data supplied from a host computer (not shown), and the like.
The display device (monitor) 31 displays component data, calculation data, an image of the component 18 captured by the component recognition camera 16, and the like on the display surface 311.

Actually, at the stage where the production of the board is started and the components are mounted on the circuit board, the board correction data (Δx, Δy, Δθ) of the circuit board 10 based on the board mark imaged in advance by the board recognition camera 17 is stored in the storage device 30. Stored in
Then, the component supplied from the component supply apparatus 11 is sucked by the suction nozzle 131, the mounting head unit 13 is moved to the upper part of the component recognition camera 16, and the component is imaged by the camera.
The captured image of the part is subjected to image processing by the image recognition device 27 and the correction data is transferred to the control means 20.
The control means 20 reads the board correction data and the component data of the component from the storage device 30, and based on the component data and the component center and component inclination calculated by the transferred image recognition device 27, the component Recognize the mounting position and suction posture of the.
Subsequently, there is a positional shift between the component mounting position, the component center, and the suction center, and when an angular shift is detected, these total positional shift and angular shift are the X-axis motor 21, Y-axis motor 22, and θ-axis. The correction is made by driving the motor 24, and the component is mounted in a correct posture (reference angle) at a predetermined circuit board position.

  Next, the mounting head unit 13 will be described with reference to FIG.

As shown in the figure, a linear guide 101 is installed on the base frame 100 of the mounting head unit 13 so that the vertical Z driving unit 102 can move in the vertical Z-axis direction.
A Z-axis motor 23 for moving the vertical Z drive unit 102 vertically up and down is fixed to the base frame 100 at the top of the mounting head unit 13, and a screw part 111 of a ball screw is coupled to the Z-axis motor 23 via a coupling 110. Is connected.

A θ-axis motor 24 for rotating the components includes a vertical rotation drive unit bearing 105 that includes a spline bearing 107 and a rotation bearing 106 and has a belt pulley attached to the outer periphery, a θ motor pulley 108, and a timing belt 109. Connected through.
The vertical rotation drive unit bearing 105 has a spline bearing 107 therein and is connected to a nozzle shaft 104 which is a spline shaft.
A rotation bearing 106 is attached to the outer periphery of the vertical rotation drive unit bearing 105. The outer periphery of the rotary bearing 106 is fixed to the base frame 100, and the nozzle shaft 104 is fixed by the vertical rotation drive unit bearing 105 so that the rotary operation and the vertical operation can be performed.

At one end of the vertical Z driving portion 102, a nut portion 118 that meshes with the screw portion 111 of the ball screw is fixed.
Therefore, by rotating the Z-axis motor 23, the vertical Z driving unit 102 is driven up and down by the nut portion 118 of the ball screw, and the nozzle shaft 104 and the suction nozzle 131 can be driven up and down.

In addition, the vertical Z drive unit 102 is provided with a lower rotary bearing 141 and an upper rotary bearing 142 for rotationally supporting the nozzle shaft 104.
A deforming portion 112 having a circular hole shape is provided between the nozzle shaft 104 of the vertical Z driving portion 102 and the nut portion 109 of the ball screw. A strain gauge 113 is attached to the deformed portion 112.
In the strain gauge 113, the relationship between the output voltage of the strain gauge 113 and the load value is preliminarily calibrated and takes the relationship as shown in FIG. 4 and stored in the controller 20.
The strain gauge 113 can be replaced with a load cell with an appropriate structural change.

  In addition, an origin sensor 114 is fixed to the base frame 100 so as to detect the vicinity of the fixed portion of the vertical Z driving unit 102 on the linear guide 101 side.

  Next, the flow of the pressure mounting operation of the electronic component will be described.

The X-axis moving mechanism 12 and the Y-axis moving mechanism 14 of the mounting head 13 shown in FIG. 1 are operated to move the mounting head unit 13 above the electronic component supply device 11 and suck the electronic component 18.
The mounting head portion 13 that has attracted the electronic component 18 is moved above the component recognition camera 16 to recognize the electronic component 18.
After the recognition is completed, the mounting head unit 13 is moved, and the electronic component 18 is adsorbed by the mounting head unit 13 to the portion where the electronic component 18 is to be mounted on the circuit board 10 and moved onto the component recognition camera 16. 18 is recognized on the component recognition camera 16 and moved to the mounting position on the circuit board 10 for mounting.

  Next, a component mounting operation by load control will be described.

The Z-axis motor 23 is driven at the mounting position of the mounting head unit 13 on the circuit board 10, and the vertical Z driving unit 102 and the suction nozzle 131 are lowered.
The component 18 sucked by the suction nozzle 131 is lowered at a high speed to the position (Z1) immediately before the mounting height on the circuit board 10 to be mounted.
Thereafter, the Z-axis motor 23 is driven to lower the component 18 sucked by the suction nozzle 131 at a low speed of about 4 mm / second to lower the target load height while suppressing the impact load.
After the electronic component 18 is pressure-mounted, the vacuum air is turned off, the Z-axis motor 23 is operated, and the vertical Z-axis drive unit 102 and the suction nozzle 131 are raised.
Thereafter, the next electronic component is moved to the suction position.

  Next, the origin return operation will be described.

The Z-axis drive unit 102 is moved downward (for example, 2 mm) away from the detection range of the origin sensor 114.
Then, it is raised at the origin return speed of 10 mm / second.
The detection ON height (A0) of the origin sensor 114 is read from the encoder value of the Z-axis motor and stored in the CPU 27C.
By setting the encoder origin position of the Z-axis motor 23 detected immediately after the Z-axis drive unit 102 detects the origin sensor 114 as the origin of the Z-axis drive unit 102, the Z-axis can be repeatedly turned off and on. High reproducibility of the origin can be obtained.

<Description of operation>
In FIG. 5, “1” indicates that there is no possibility that the tip of the nozzle of the mounter head placed on the XY mechanism will come into contact with components on the board to be mounted or other mounter mechanism around the board by the XY operation. 1 is a second Z-axis height immediately before the component adsorbed by the nozzle starts to contact the substrate surface.

  From the first height “1” to the second height “2”, the vehicle descends at a high speed (about 900 mm / second) in order to minimize the reduction in mounting performance. At this time, the gain is set high in order to perform normal position control in order to realize the lowered position control of the nozzle with high accuracy.

At the second height “2”, the motor shaft is stopped once, the gain is set low, and then the shaft lowering is resumed.
Here, the motor speed is set to a low speed (4 mm / second), and the gain for generating the generated torque in the motor position control mode is set according to the required set load. The generated output torque is varied based on a control parameter including a position feedback gain of the servo motor.
In addition, the setting characteristic as a gain control parameter is changed to a gain with a small number of integral compensation gain parameters.
The generated torque of the servo motor is determined according to the position feedback gain and the position deviation, but since the feedback adjustment of the generated torque functions according to the position deviation amount and the duration of the state, the time axis such as the integral compensation gain is set. The feedback function as an element is set to be small and a stable pressure is obtained.

  In FIG. 5, “3” is a contact point between the lower surface of the component and the substrate surface.

  As long as the load cell measurement result does not reach the specified load value, the Z-axis is continuously lowered, so if the component adsorbed on the tip of the nozzle comes into contact with the board surface and is prevented from descending, the target coordinate of the motor axis Since the deviation of the actual coordinates advances, the torque generated by the servo motor increases as a result of the gain setting described above, and the measurement result of the load cell also increases temporarily as the target coordinates of the motor axis advance.

FIG. 6 is a graph obtained by actually measuring the relationship between the motor shaft transition angle (the difference between the target coordinate and the actual coordinate of the motor shaft) and the generated torque. The horizontal axis indicates the difference in the coordinates as a rotation angle (10 degrees to 60 degrees) of the motor shaft.
For the generated torque, the set gain 10 to the set gain 100 are evaluated for each numerical value 10.
As described above, the motor shaft shift angle, the gain, and the motor output torque are generally in a proportional relationship. Therefore, as described above, the generated output torque can be adjusted by selecting the feedback gain of the servo motor in response to the set load (the pressing force of the component on the board surface that varies depending on the component type).

FIG. 7 shows actual changes in the load applied to the substrate surface after the component adsorbed on the nozzle tip contacts the substrate surface (Z-axis speed = 10 mm / second, head mass = 250 g).
Immediately after the component comes into contact with the board surface, the load shown on the vertical axis rises steeply, and thereafter the load increases in proportion to the transition of time.
The load portion that rises steeply is obtained by measuring the impact load due to the mass of the head movable portion.

In FIG. 5, as indicated by “4-1”, when the measurement result of the load cell exceeds the set load, the driving of the Z-axis motor is stopped.
If the minimum pressurization duration is set by the operation setting of the mounting machine, the Z-axis motor may be repeatedly lowered and raised according to the measurement result of the load cell in order to maintain the specified pressure up to “5”. It is possible.
It is desirable to stop the descent of the Z-axis motor instantaneously when the load cell measurement result exceeds the set load.
If there is a delay in this reaction, the target coordinates of the motor will advance and the generated torque of the motor shaft will be excessive.

  In the embodiment, by using the relationship between the motor shaft shift angle, the gain value, and the motor output torque, the gain is set to be low, so that even if a difference between the target coordinate of the motor and the actual coordinate occurs, an extremely large load change occurs. Since it does not occur, pressure control along the target load can be realized even if the target coordinate of the motor advances too much.

Here, when the gain is appropriately set so that the maximum delay with respect to the target coordinate at the nozzle tip at the set load is 0.75 mm, the control error for the target load is 3% and the speed of the Z-axis motor is 5 mm. Assuming / second, the reaction delay allowable time = (maximum delay amount × control accuracy) ÷ motor shaft speed = 0.0045 seconds.
For this reason, in this load system, a normal servo amplifier can be directly controlled from the mounter control unit to realize load control.
Therefore, it is not necessary to provide a special control system that performs high-speed feedback control on the motor shaft, VCM, or electropneumatic regulator by referring to the measurement result of the load cell for load control.

  As described above, according to the pressure control head of the mounter apparatus of the embodiment, the effects listed below can be exhibited.

1) The head is moved from the second height position to the third height position by a Z-axis motor provided as means for moving the head from the first height position to the second height position, and the nozzle is pressurized. Since the same Z-axis motor is used as a pressurizing source, the pressurizing control head can be provided at a low cost with a simple configuration.

2) Instead of a spring with a wide load range required for pressurization, it can be pressurized with the torque generated by the motor shaft, so the structure is simple and the accuracy over a wider load range Can cope well.

3) Since the Z-axis motor is always used in the position control mode, no error occurs in the motor axis coordinate management.

4) Since the pressurization is performed using the torque generated by the Z-axis motor, the maximum deviation amount between the target coordinates and the actual coordinates of the motor can be limited.
In other words, the spring-pressurized structure has characteristics such that the load decreases suddenly immediately after passing through the load load peak (passage through the return prevention part becomes the maximum load) as in the connector insertion process. If the load has a load, an overshoot of the shaft corresponding to the amount of deflection of the spring occurs, and there is a risk of damage to the parts due to the impact load.
On the other hand, in this method, since the maximum deviation amount is limited, the position overshoot with respect to the load fluctuation is small, and the impact load can be kept small.

5) A dedicated servo amplifier with a load control function is not required.

(Embodiment 2)
<Impact force buffering by nozzle spring>
FIG. 8 shows a mechanical configuration having a nozzle spring provided for the purpose of reducing the impact force in addition to the pressure detection means.

  In FIG. 8, as in the first embodiment, 10 is a circuit board such as a printed circuit board, 13 is a mounting head, 18 is an electronic component, 23 is a Z-axis motor, 24 is a θ-axis motor, 100 is a base frame, 101 Is a linear guide, 102 is a vertical Z drive unit, 104 is a nozzle shaft, 105 is a vertical rotation drive unit bearing, 106 is a rotary bearing, 107 is a spline bearing, 108 is a θ motor pulley, 109 is a timing belt, 110 is a coupling, 111 Is a screw part of the ball screw, 118 is a nut part of the ball screw, 131 is a suction nozzle, 132 is a nozzle spring (impact buffering spring), 133 is a nozzle movable part side stopper, 134 is a Z axis movable part side stopper, Reference numeral 143 denotes a rotary bush bearing, and 144 denotes a pressure detection unit (sensor).

  In the configuration of FIG. 8, the force with which the suction nozzle 131 is pushed vertically upward can be detected by the pressure detection unit 144 provided on the nozzle shaft.

In the present invention, the portion indicated by the vertical line is referred to as the nozzle movable portion, and the nozzle movable portion and the portion indicated by the oblique line are collectively referred to as the Z-axis movable portion.
A shock absorbing nozzle spring 132 is sandwiched between the nozzle movable portion and the Z-axis movable portion, and the spring 132 contracts when receiving pressure from below the nozzle movable portion.
The nozzle spring 132 is initially compressed so as to move for the first time when a pressure of 1 (N) is applied, and the spring constant is set very low. Therefore, the nozzle spring 132 is generated regardless of the stroke of the nozzle spring 132. It has characteristics that make the spring force uniform.
Further, when the stroke in the contraction direction of the nozzle spring 132 reaches 1 (mm), the stoppers 133 and 134 are set to stop.

FIG. 9 shows a pressure waveform and a velocity waveform when pressurization control is performed using the nozzle spring 132 of FIG.
FIG. 9 shows the pressure waveform received by the electronic component and the velocity waveform of the Z-axis movable part when the suction nozzle 131 with spring of FIG. 8 is operated at the same speed as that of the nozzle without spring of FIG.

  In the present invention, the moment when the electronic component adsorbed by the nozzle is lowered and abuts against the substrate surface to start compression of the shock absorbing spring is called a first collision, and the moment when the stroke of the nozzle spring disappears thereafter is called a second collision. .

Here, the calculation formula of impact force is
Impact force (kg · m) = Weight on the side giving impact force (kg)
× Speed on the side that gives impact force (m / s)
÷ Time taken to convey the impact (s) (A)
Given in.

From the formula (A), the impact force of the first collision is very small because it is calculated from the mass of the nozzle moving part only, and is less than the initial compression of the nozzle, so that no overshoot occurs. However, the impact force of the second collision is large because it is calculated by the mass of the Z-axis movable part, and if the descent speed is not sufficiently decelerated, overshooting will not be different from the case of using a springless nozzle. .
As a result, when a nozzle spring is used, the pressurization time is increased by the stroke of the nozzle spring.
In addition, the position just before the component abuts on the printed circuit board was calculated from the height data of the electronic component, etc., so when mounting an electronic component with poor height accuracy, the pressurization time increased significantly. There is also a problem.

  In the present invention, since the collision is divided into two times by the nozzle spring 132 of FIG. 8, the first collision is detected by the pressure detection unit, the descending speed and the time from the nozzle spring stroke to the second collision are calculated, Adjust the descent speed just before the second collision.

First, FIG. 10 shows a pressure waveform and a velocity waveform when pressure control is performed in the present invention.
As shown, overshoot does not occur at the first collision even at the mounting speed, and the electronic component is brought into contact with the substrate surface at the mounting speed. At that time, the pressure waveform at the time of the first collision rises steeply to the initial compression value of the spring, so that it can be detected with high accuracy only by providing a threshold value for the pressure.

The time from the first collision to the second collision is
Time from nozzle spring compression start to second collision (s) = Nozzle spring stroke (m)
÷ Descent speed (m / s) (B)
Therefore, if the stroke of the nozzle spring and the descending speed of the Z-axis movable part are managed with high accuracy, the time from the start of compression of the nozzle spring to the second collision can be predicted with high accuracy.

Here, since variables other than the speed on the side of applying the impact force in the formula (B) are substantially constant values in the case of the configuration of FIG. 8, the impact force of the second collision depends only on the speed.
Therefore, based on the predicted time, the vehicle is decelerated by the second collision to a speed at which the impact force is within the allowable range of the target load.

  Next, FIG. 11 shows a flowchart from setup to mounting in the control method of the present invention.

In the setup, as shown in the flowchart of FIG. 11A, the time from the contact detection to the second collision is calculated by the start of processing (step S1).
Subsequently, a value obtained by applying a correction such as a safety factor to the calculated time is recorded (step S2). This completes the process.

As shown in the flowchart of FIG. 11B, the mounting is performed by picking up an electronic component and aligning it above the mounting position on the substrate surface by starting processing (step S11).
Subsequently, the electronic component is lowered at a constant speed and a high speed (step S12).
Next, it is determined whether or not the first collision at which the compression of the shock absorbing spring starts at the moment of contact with the substrate surface is detected by the pressure detection unit 144 (step S13). If it is detected in step S13, the process proceeds to the next step. If not detected, the process returns to step S12 to continue the process.
Next, it is decelerated from the constant speed and high speed to the pressurizing speed by the time recorded in the setup (step S14).
Subsequently, the electronic component is lowered at a pressing speed (step S15).
Next, has the pressure detection unit 144 detected that the target pressure has been reached? Is determined (step 16). In step S16, if it has reached, the process is terminated, and if not, the process returns to step S15 to continue the process.

  In addition, when adsorbing an electronic component with a spring-equipped nozzle, it is known that if the nozzle is adsorbed to the electronic component by applying a pressure of about 1 (N), the adsorption is known to be stable, but the stroke of the nozzle spring is 1 (mm). ), It rarely exceeds this stroke, which may destroy not only suction mistakes, but also electronic components and devices that supply electronic components.

  However, if the method of the present invention is used, the nozzle can be stopped and reliably adsorbed without dropping the tact and without deviating from the stroke of the nozzle spring.

  Next, FIG. 12 shows the pressurization start positions aligned from FIG. 7 used in the description of the conventional control and FIG. 10 used in the description of the control of the present invention.

As shown in FIG. 12, in the conventional pressure waveform, the pressurization time is long because the contact must be made at a speed that can suppress the impact force from the start of pressurization.
On the other hand, in the control of the present invention, the pressure is lowered at a high speed from the start of pressurization, the first collision is detected without generating an impact force, the timing of the second collision is predicted, and the pressurization speed is switched immediately before the second collision. Thus, the pressurization time can be shortened.

  Further, in the conventional control, the height immediately before the electronic component is mounted is calculated from parameters such as the height of the component inputted in advance, and the impact is reduced by decelerating the height as a threshold value. Therefore, when an electronic component with a low height accuracy is mounted, there is a problem that the pressurization time becomes very long due to the variation.

However, in the proposed method, the height of the parts is not related, and the pressing time does not change theoretically even if the height of the parts varies. This eliminates the need to input the part height data during setup.
In addition, when applied at the time of suction of electronic parts, it is possible to reliably avoid suction before the first collision and suction after the second collision, which result in a suction failure, so that it is possible to improve the quality of part suction.

(Other examples)
In the embodiment, the time from the start of compression of the nozzle spring to the second collision is calculated by using the stroke of the nozzle spring and the descending speed of the Z-axis movable part, and used for speed switching. The embodiment can also be realized by using the relative distance from the position where the electronic component adsorbed on the substrate contacts the substrate surface.
In addition, a value having the same effect as the distance can be calculated by using the time integration of velocity.
When the target pressure is much larger than the initial compression value of the nozzle spring, the pressurization time can be further shortened by decelerating after the second collision.

  In the embodiment, the control is based on the detection by the load cell, but current control is also possible.

1 Mounter Device 10 Substrate 13 Mounting Head (Pressure Control Head)
131 Adsorption nozzle 132 Shock absorbing spring 144 Pressurization detection unit (sensor)
18 Electronic parts 23 Servo motor

Claims (1)

A mounter device comprising a servo motor that positions the height of a nozzle that sucks a component, and a pressure control head that can control a load pressing the component sucked by the nozzle against a substrate,
An impact buffering spring incorporated at the tip of the nozzle;
A sensor for detecting pressure for pressing the component adsorbed by the nozzle against the substrate surface;
Lowering the parts adsorbed by the nozzle to the substrate surface at a constant speed by driving the servo motor,
The pressure control head of the mounter apparatus, wherein after the repulsive force due to the compression of the shock absorbing spring is detected by the pressure sensor, the lowering speed of the nozzle is decelerated until the compression of the shock absorbing spring is completed.

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