KR101886300B1 - Electronic component mounting apparatus - Google Patents

Abstract

An object of the present invention is to prevent damage to electronic components and a substrate.
According to an aspect of the present invention, there is provided an elevator apparatus including a main body portion fixed to a head, an elevating body for performing an elevating operation in the body portion, an elevating mechanism for elevating and lowering the elevating body, A hollow nozzle shaft 30 for holding the suction nozzle at the lower end thereof, a turning mechanism 50 for rotating the nozzle shaft through the spline nut 55, and a load detector (not shown) for detecting the upward load received by the suction nozzle And an operation control unit (70) for controlling the load by detecting a load, wherein the elevating mechanism and the turning mechanism are supported by the main body, the upper end of the nozzle shaft is protruded from the upper portion of the main body, And is supported by the elevating member or the main body portion.

Description

ELECTRONIC COMPONENT MOUNTING APPARATUS

The present invention relates to an electronic component mounting apparatus for controlling a pressing force by a suction nozzle.

BACKGROUND ART A conventional electronic component mounting apparatus includes a collet (nozzle) for picking up an electronic component, a turning mechanism for rotating the collet, a case containing a turning mechanism, a guide for vertically movably supporting the case, And the collet is supported so as to be movable up and down in the case, and at the same time, the load cell is moved by the load cell through the projection extending in the horizontal direction from the turning mechanism, Thereby detecting the pressing force (see, for example, Patent Document 1).

In such an electronic component mounting apparatus, when the collet, which is in an adsorbed state of the electronic component, is lowered by the ball screw mechanism and the tip of the collet contacts the substrate below the electronic component, the collet and the turning mechanism are raised with respect to the case, The pressing force against the substrate at the tip end of the collet is detected. Then, when a predetermined predetermined pressing force is detected, the electronic part is released from the collet, and the lowering is stopped, and the collet is raised. Thus, the mounting operation of the electronic component to the substrate is performed with a predetermined pressing force.

The other electronic component mounting apparatus includes a suction nozzle for sucking an electronic component, a nozzle holding member for holding the suction nozzle while allowing the suction nozzle to move up and down, and a support frame for rotatably supporting the nozzle holding member about the suction nozzle A ball screw mechanism for moving the support frame up and down and a spline shaft provided in a fixed state on the upper end of the nozzle holder to rotate the suction nozzle and the nozzle holder And a voice coil motor provided on the support frame and moving the suction nozzle up and down through the spline shaft (refer to Japanese Patent Application Laid-Open See, for example, Patent Document 2).

In the above electronic component mounting apparatus, when the tip of the suction nozzle comes in contact with the substrate on the lower side by the ball screw mechanism, the suction nozzle which is in the state of suction of the electronic component is lifted and the load cell is pressed , The pressing force against the substrate at the tip of the suction nozzle is detected. Then, the voice coil motor is controlled so as to hold a predetermined predetermined pressing force for a predetermined time, and thereafter, the electronic component is released from the suction nozzle and the suction nozzle is raised by the ball screw mechanism. Thus, the mounting operation of the electronic component to the substrate is performed with a predetermined pressing force.

Japanese Patent Application Laid-Open No. 2001-127081 Japanese Patent Application Laid-Open No. 2004-158743

However, in the electronic component mounting apparatus of Patent Document 1, since the collet is lowered integrally with the turning mechanism, the responsiveness is reduced by increasing the total weight, thereby making it difficult to control the pressing of the electronic component on the substrate .

In the electronic component mounting apparatus of Patent Document 2, the rotating mechanism is separated from the suction nozzle by using the spline shaft, and only the suction nozzle and the nozzle holder are lifted at the time of the pressure control, thereby reducing the movable weight, However, since the load detector is disposed at the upper end of the suction nozzle and the rotation mechanism is disposed concentrically with the suction nozzle, the suction nozzle can not be drawn to the upper end of the apparatus . Therefore, the hose for connection to the suction source extends laterally to the suction nozzle, and the rotation range of the suction nozzle is limited as in Patent Document 1.

Further, since the wiring of the load cell provided in the nozzle holding body is drawn out to the outside of the nozzle holding body, such a wiring also causes a restriction on the turning range of the suction nozzle.

An object of the present invention is to improve the responsiveness of the suction nozzle at the same time in the up and down direction, and to make the suction nozzle more rotatable.

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component on a substrate by suctioning an electronic component by a suction nozzle provided on a head movable between a supply portion of the electronic component and a holding portion of the substrate, An elevating mechanism for elevating and lowering the elevating body; and an upper end holding portion for holding the adsorption nozzle at an upper end portion of the lifting body, A rotation mechanism that forms a spline groove in the nozzle shaft and imparts a turning operation to the nozzle shaft through a spline nut; A load detector for detecting a load, and a load detector for detecting a predetermined load by the load detector, An electronic component mounting apparatus including an elevating mechanism and a turning mechanism supported by the main body, an upper end of the nozzle shaft protruding from an upper portion of the main body, And the load detecting portion is supported by the lifting body or the main body portion.

The invention according to claim 2 has the same constitution as the invention according to claim 1, and the load detecting section includes a hollow holding section which is provided on the ascending / descending member and rotatably holds the nozzle shaft in a state of passing therethrough, A connecting portion connecting the hollow holding portion to the lifting body, and a distortion detecting element for detecting the distortion of the connecting portion.

The invention according to claim 3 has the same structure as the invention according to claim 1 and has a transmitting member for transmitting a lifting operation from the driving source of the elevating mechanism to the elevating body from the driving source, And a distortion detecting element for detecting a distortion of a driving source or a portion supporting the transmitting member.

The invention according to claim 4 has the same structure as the invention according to claim 1, wherein the elevating body is divided into an elevating operation input part from the elevating mechanism and a supporting part of the nozzle shaft, Wherein the supporting portion is disposed on the upper side with respect to the elevating operation input portion, and the load detecting portion includes an elastic member for urging the supporting portion and the elevating operation portion And a pressure detecting element for detecting a mutual pressing force of mutually opposing portions of the input section.

The invention according to claim 5 has the same structure as the invention according to claim 1, wherein the ascending / descending body is divided into an elevating operation input part from the elevating mechanism and a support part of the nozzle shaft, And a pressure detecting element for detecting a pressing force between mutually opposing portions in which the lifting operation input portion is on the upper side and the support portion is on the lower side.

According to the invention as set forth in Claim 1, since both the elevating mechanism and the turning mechanism are supported by the main body, it is possible to reduce the weight as compared with the case where the turning mechanism is mounted on the elevating body, The control becomes easy, and it becomes possible to apply a load with high accuracy. Accordingly, the responsiveness of the suction nozzle at the same time as the up and down direction is improved. In addition, since the nozzle shaft is hollow and the upper end portion thereof is protruded from the upper portion of the main body portion, the upper end portion of the nozzle shaft can be connected to the suction source, and there is no need to extend the connection tube or the like laterally, It is possible to increase the pivotable angle.

Since the load detecting portion is supported by the ascending or descent member or the main body portion, the rotation of the suction nozzle does not cause the rotation of the load detecting portion. Therefore, the rotation of the suction nozzle is not restricted by the wiring of the load detecting portion, It becomes possible to enlarge the possible angle. In addition, a movable contact structure for transferring the wiring current of the load detecting section and the like can be dispensed with.

According to a second aspect of the invention, since the load detecting section detects the distortion of the connecting portion connected to the hollow holding portion through which the nozzle shaft penetrates, even when the nozzle shaft is arranged so as to pass through the upper and lower portions of the main body portion, the load detecting portion is not disturbed, Since the load is detected around the nozzle shaft, it becomes possible to more accurately detect the load applied to the suction nozzle and the nozzle shaft.

According to the invention as set forth in Claim 3, since the load detecting portion detects the distortion of the supporting portion of the driving source or the transmitting member of the elevating mechanism, the load detecting portion can be disposed apart from the nozzle shaft. Even when the nozzle shaft is arranged so as to penetrate the body portion up and down Since the load detection unit is not obstructed and the load detection unit is provided in the main body unit, the wiring does not interfere with the elevating and lowering operation of the elevating and lowering unit, It is possible to eliminate the need for a wiring structure.

According to a fourth aspect of the invention, since the pressure detecting element is disposed between the elevating operation input part and the supporting part and the supporting part is disposed on the upper side with respect to the elevating operation input part, when the lower part comes in contact with the lower part due to the descent of the suction nozzle, The gap between the lifting operation input portion and the support portion is widened so that the load at the time of contact becomes excessively large, whereby the pressure detecting element can be effectively prevented from being broken.

According to a fifth aspect of the present invention, since the load detecting unit detects the mutual pressing force between mutually opposing portions of the elevating operation input portion and the supporting portion, the load detection can be performed by inserting the pressure detecting element between the elevating operation input portion and the supporting portion, And the number of components can be reduced.

1 is a perspective view of an electronic component mounting apparatus according to the first embodiment.
2 is a side cross-sectional view of a nozzle driving apparatus for a suction nozzle according to the first embodiment.
3 is a sectional view along the center line of the load detecting portion.
4 (a) is a plan view showing only a portion of the load cell in the load detecting portion, and Fig. 4 (b) is a perspective view.
5 is a block diagram showing a control system of the electronic component mounting apparatus.
6 is a flow chart showing drive control of a suction nozzle when an electronic component is mounted on a substrate.
7 is a timing chart showing drive control of the suction nozzle when the electronic component is mounted on the substrate.
8 is a partial cross-sectional view of another example of the nozzle driving apparatus according to the first embodiment.
9 is a partial cross-sectional view of still another example of the nozzle driving apparatus according to the first embodiment.
10 is a side sectional view of the nozzle driving apparatus according to the second embodiment.
11 is a plan view of the load detecting portion.
12 is a side cross-sectional view of another example of the nozzle driving apparatus according to the third embodiment.
13 is a side cross-sectional view of the nozzle driving apparatus according to the third embodiment.
Fig. 14 is an enlarged cross-sectional view of the load detecting portion, in which (A) shows a state in which the connecting portions are close to each other, and Fig. 14 (B) shows a state in which the connecting portions are separated from each other.
15 is a diagram showing the relationship between the detection amount of the load detection unit and the amount of drop of the suction nozzle in the third embodiment.
16 is an enlarged cross-sectional view of another example of the load detecting portion in the third embodiment.
17 is an enlarged cross-sectional view of still another example of the load detecting portion in the third embodiment.
18 is a side cross-sectional view of the nozzle driving apparatus according to the fourth embodiment.
Fig. 19 is a perspective view of a load detecting section in the fourth embodiment. Fig.
20 is a side cross-sectional view of another example of the nozzle driving apparatus according to the fourth embodiment.

(First Embodiment: Overall Configuration)

A first embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus 100. Fig. Hereinafter, two directions perpendicular to each other in the horizontal plane are referred to as an X-axis direction, which is a substrate transport direction, and a Y-axis direction, which is a direction perpendicular to a substrate transport direction, and a vertical direction, which is orthogonal to the X- .

1, the electronic component mounting apparatus 100 includes a plurality of electronic component feeders 101 for supplying electronic components to be mounted and a plurality of electronic component feeders 101 And a feeder bank 102 for holding the substrate in the X-axis direction, and a feeder bank 102 for holding the substrate in the X-axis direction. A substrate holding unit 104 for performing an electronic component mounting operation on a substrate, a nozzle driving device 10 for holding a plurality of (three in this example) suction nozzles 12 so as to be able to move up and down, A head 106 for driving and transporting the head 106 to an arbitrary position in the work area including the two sets of component supply parts and the substrate holding part 104; An X-Y gantry 107 as a mechanism, A substrate recognition camera 108 as a plurality of image pickup means mounted on the image forming apparatus 106 for picking up an image of a substrate and an electronic component C , And an operation control means 70 for controlling the operations of the respective components shown in Fig.

The operation control means 70 of the electronic component mounting apparatus 100 adsorbs the electronic components from the electronic component transfer portion 101a of the electronic component feeder 101 to each of the suction nozzles 12. [ The operation control means 70 performs image processing on the captured image data obtained by picking up the electronic component adsorbed by each of the suction nozzles 12 with the component recognition camera 120 to determine the position of the electronic component with respect to the nozzle tip, And corrects the positioning of the suction nozzle 12 with respect to the substrate and corrects the angle of the electronic component by rotating the suction nozzle 12 to perform the mounting control of the electronic component.

(Nozzle drive device for adsorption nozzle)

2 is a side sectional view of the nozzle driving device 10 of the adsorption nozzle 12. Fig. As shown in the figure, the nozzle driving apparatus 10 of the suction nozzle 12 includes a main frame 60 as a main body fixedly supported on a head 106, and a main body frame 60 for holding the electronic component C at its tip A nozzle holder 31 for holding the adsorption nozzle 12, a nozzle shaft 30 for holding the adsorption nozzle 12 at the lower end through the nozzle holder 31, An elevating mechanism 20 for vertically driving the movable bracket 14; a load detector 40 for detecting a load applied to the suction nozzle 12; Z A rotation mechanism 50 for adjusting the rotation angle of the suction nozzle 12 around a center line along the axial direction, and an operation control means 70 for controlling the operation of each of the above structures. Hereinafter, each part will be described in detail.

(Body frame)

The main body frame 60 includes a back plate 61 fixed to the head 106 and first and second extended support portions 62 and 63 extending from the upper portion of the back plate 61 along the Y- And a slide guide 64 provided at a lower portion of the back plate 61 and slidably supporting the movable bracket 14 along the Z-axis direction.

The back plate 61 is a flat plate along the XZ plane and one surface thereof is fixed to the head 106 and the first and second extended support portions 62 and 63 and the linear guide 64 are installed on the other surface .

The first extended portion 62 is plate-shaped along the X-Y plane and supports the elevating mechanism 20. [

The second extension portion 63 is plate-shaped along the X-Y plane and supports the rotation mechanism 50. The second extending portion 63 is located just below the first extending portion 62.

(Movable bracket)

The movable bracket 14 is supported so as to be slidable up and down through the movable block 14a with respect to the linear guide 64 provided at the lower portion of the back plate 61. [ The movable bracket 14 is vertically driven by an elevating mechanism 20 provided on the first extending portion 62.

(Lift mechanism)

The elevating mechanism 20 includes a rotary drive type Z-axis motor 21 (elevating movement source) provided in a state in which the output shaft is directed downward in the first extended support portion 62 of the main body frame 60, An encoder 22 (see FIG. 5) for detecting the rotation of the Z-axis motor 21 and a drive shaft 22 connected to the output shaft of the Z-axis motor 21 via a coupling 26, A ball screw shaft 23 as a transmitting member and a ball screw nut 24 which is vertically moved by the ball screw shaft 23.

The ball screw shaft 23 is connected to the output shaft of the Z-axis motor 21 in a concentric manner and is downwardly pulled along the Z-axis direction while being supported by the second extended support portion 63 via the bearing 25 And is rotatably supported.

The ball screw nut 24 is fixed to the movable bracket 14. The ball screw nut 24 moves the movable bracket 14 up and down according to the rotational angle degree by the rotational drive of the Z axis motor 21, . The encoder 22 outputs the detection signal to the operation control means 70. The operation control means 70 recognizes the current position of the movable bracket 14 based on the detection signal and outputs the detection result to the Z- And the like.

(Nozzle shaft)

The adsorption nozzle 12 is a tubular body whose lower end is formed with a narrow end, and the adsorption nozzle 12 is adsorbed and held in a state in which its tip end faces the electronic component C.

The nozzle shaft 30 has a nozzle holder 31 at the lower end thereof and holds the adsorption nozzle 12 through the nozzle holder 31. The inside of the nozzle shaft 30 is hollow throughout its entire length and at the upper end of the nozzle shaft 30 there is provided a hose joint 32 for connecting to a suction pump or an ejector to be a suction source . That is, when the suction is performed by the suction source from the hose joint 32 at the upper end portion, the nozzle shaft 30 enables suction by the suction nozzle 12 provided at the lower end portion.

A spline groove is formed on the outer circumferential surface of the upper portion of the nozzle shaft 30. The upper portion of the nozzle shaft 30 is rotated by the first and second extended support portions 62 and 63 And is fitted in a state of penetrating through a spline nut 55 which is supported so as to be described later.

The lower portion of the nozzle shaft 30 is rotatably supported about the Z axis with respect to the movable bracket 14 by a load detecting portion 40 attached to the movable bracket 14. [ For reference, the supporting state of the nozzle shaft 30 by the load detecting unit 40 will be described later in detail.

With this structure, the nozzle shaft 30 is vertically moved together with the movable bracket 14. Since the upper portion thereof is supported by the spline nut 55, the upward and downward movement is not hampered.

For reference, in reality, the upper half of the nozzle shaft 30 is a spline shaft having a hollow inside which a spline groove is formed on the outer circumferential surface, and the lower half thereof is a hollow tubular member having no hollow spline groove formed therein, And is integrally connected by a coupling 35.

The upper end portion of the nozzle shaft 30 is attached so as to protrude upward from the upper end face of the main body frame 60 even when the movable bracket 14 is lowered to the lowest position in the movable range. The hose attached to the joint 32 at the upper end of the nozzle shaft 30 is always kept in a state of being positioned above the main body frame 60 so that even if the nozzle shaft 30 rotates, It is not necessary to limit the range of the rotation angle of the adsorption nozzle 12. [0064]

(Rotating mechanism)

The turning mechanism 50 includes a? -Axis motor 51 (rotation drive source) provided in the second extended support portion 63 so as to face the output shaft in an upward direction, an origin sensor 52 for detecting the origin position of the rotation angle, (See FIG. 5) and a spline nut 55 connected to the output shaft of the? -Axis motor 51 via a timing belt 54 from a pulley 53.

The spline nut 55 is rotatably supported about the Z axis between the first extended support portion 62 and the second extended support portion 63 as described above. When the nozzle shaft 30 is inserted, And this causes simultaneous rotation around the Z-axis.

The outer circumferential surface of the spline nut 55 is a pulley of the timing belt 54. The rotation of the spline nut 55 is imparted to the spline nut 55 by driving the?

That is, when the rotation of the nozzle shaft 30 is performed by the rotation mechanism 50, the rotation of the nozzle shaft 30 is permitted by the load detection unit 40. When the upward movement of the nozzle shaft 30 is performed by the elevator mechanism 20, ) Are allowed to move up and down. As a result, the nozzle shaft 30 can be supported by the movable bracket 14 and pivoted while moving up and down.

The origin sensor 52 outputs the origin position of the output shaft of the θ-axis motor 51 to the operation control means 70 at the time of origin search. Based on this, the operation control means 70 controls the θ- The rotation driving can be controlled so as to generate a rotation of a predetermined angle. As a result, the rotation of the suction nozzle 12 is performed from the output shaft of the? -Axis motor 51 through the spline nut 55 and the nozzle shaft 30, It is possible to adjust the direction of the liquid crystal display panel (C).

(Load detecting section)

Next, the supporting state of the nozzle shaft 30 in the load detecting section 40 and the movable bracket 14 will be described.

Fig. 3 is a cross-sectional view taken along the center line of the load detecting section 40, Fig. 4 (a) is a plan view showing only the portion of the load cell in the load detecting section 40, and Fig. 4 (b) is a perspective view. The load detection unit 40 includes a cylindrical hollow holding unit 41 for holding the nozzle shaft 30 rotatably by an inner bearing 47 in a state of passing through the nozzle shaft 30, A load cell 44 composed of a connecting arm portion 42 as a plurality of connecting portions connected to the connecting arm portion 14 and a distortion gauge 43 serving as a distortion detecting element for detecting the distortion of the connecting arm portion 42, And a stopper 46 provided on the upper side of the spacer 45 via a spacer 45.

On the other hand, the flange-shaped end portion (stepped portion) 33 provided at a substantially intermediate position in the longitudinal direction of the nozzle shaft 30 contacts the inner ring of the bearing 47 from below and the cylindrical collar 34 The coupling 35 fastens the inner ring of the bearing 47 from above. Thus, the nozzle shaft 30 forms a state in which the bearing 47 is sandwiched up and down, and is allowed to rotate about the Z axis with respect to the load cell 44 and remains fixed with respect to the Z axis direction have.

The nozzle shaft 30 is supported by the movable bracket 14 by a stroke rotary bearing 36 below the load cell 44 and rotates about the Z axis about the movable bracket 14 And the linear motion along the Z-axis direction is permitted.

The connecting arm portions 42 of the load cell 44 are provided in the hollow holding portion 41. The connecting arm portions 42 are arranged in the hollow holding portion 41, In the vertical direction in Fig. Each connecting arm portion 42 is fixed to the upper surface of the movable bracket 14 together with the spacer 45 and the stopper 46 by a fixing screw (not shown) at the extending end portion thereof.

The connecting arm portions 42 are integrally formed with the hollow holding portions 41. The connecting arm portions 42 are bent so that the hollow holding portions 41 are formed with respect to the moving bracket 14. [ (Upward and downward) in the Z-axis direction.

Each of the connecting arm portions 42 is provided with two strain gauges 43 in an adhered state on the upper surface at an intermediate position of the extended portion. Each of the strain gauges 43 has a hollow holding portion 41, The operation control means 70 performs a detection output in accordance with the amount of operation.

The stopper 46 is formed of a material having a rigidity higher than that of the connecting arm portion 42 and is spaced apart from the upper end surface of the hollow holding portion 41 by a distance corresponding to the thickness of the spacer 45.

When the suction nozzle 12 and the nozzle shaft 30 are pushed upward, the upper end surface of the hollow holding portion 41 comes into contact with the stopper 46 to regulate further upward movement.

That is, in the electronic component mounting apparatus 100, the maximum pressing load applied to the substrate by the electronic component C by the suction nozzle 12 is set to 50 N, and the suction nozzle 12 The thickness of the spacer 45 is set so as to be equal to the upward movement amount generated in the hollow holding portion 41 when it is pressed downward.

As a result, the stopper 46 restricts the connection arm portions 42 from being bent only in accordance with the maximum pressing load, so that an excessive load is not applied to each of the strain gauges. Further, the stopper 46 restricts the excessive warping of the connecting arm portions 42, thereby preventing breakage.

(Control system of electronic component mounting apparatus)

Fig. 5 is a block diagram showing a control system of the electronic component mounting apparatus 100. Fig. 5, the electronic component mounting apparatus 100 is provided with operation control means 70 for controlling the operation of each part of the electronic component mounting apparatus 100, Axis motor 121 and a Y-axis motor 122 of an X-Y gantry 107 for moving the head 106 in the X-axis direction and the Y-axis direction, and a Z-axis motor 122 for moving the suction nozzle 12 up and down. Axis motor 51 for rotating the suction nozzle 12 are connected to each other through drive circuits 121a, 122a, 21a and 51a, respectively.

The operation control means 70 is also connected to the encoder 22 of the Z-axis motor 21, the origin sensor 52 of the? -Axis motor 51, A distortion gauge 43 and an image recognition device 123 for recognizing the position of the substrate and the electronic components from the picked-up images of the substrate recognition camera 108 and the component recognition camera 120 are connected.

Actually, a plurality of Z-axis motors 21, θ-axis motors, encoders 22, origin sensors 52 and distortion gauges 43 are mounted, but only one of them is shown in FIG. 5 .

The operation control means 70 includes a ROM 72 in which a control program for performing various controls to be described later is stored in the nozzle driving device 10 of the suction nozzle 12 and a CPU 72 for centralized control of various configurations A RAM 73 functioning as a work area for storing processing data of the CPU 73, and a data memory 75 for storing processing data and setting data.

(Driving control method of adsorption nozzle)

Next, a driving control method of the suction nozzle 12 to be executed by the CPU 73 when the electronic component C is mounted on the substrate will be described with reference to the flowchart of Fig. 6 and the timing chart of Fig. 7 . This is a process performed by the CPU 73 executing a predetermined program stored in the ROM 72. [

The suction nozzle 12 sucks the electronic component C and the direction of the electronic component C adsorbed to the tip end of the suction nozzle 12 by the? Axis motor 51 is already adjusted, It is assumed that the head 106 is transported to the mounting position of the substrate. Further, this control is drive control for one adsorption nozzle 12, and when carrying out a plurality of adsorption, the following control is sequentially executed for each adsorption nozzle 12.

First, the CPU 73 drives the Z-axis motor 21 to move the tip of the suction nozzle 12 from the height Z4 (1 in Fig. 7) at the time of transporting the head 106 to the top surface (Step S 1: (2) in FIG. 7). Note that the height Z3 is set to a height that is close to the mounting surface Z0 but does not contact the lower end of the suction nozzle 12 with the electronic component C. [ The detected load by the strain gauge 43 in this state is L0.

Thereafter, the operation waits until the operation of the suction nozzle 12 is stabilized (③ in Fig. 7), and the gain of the Z-axis motor 21 is switched to the low speed load control mode to start the low speed descent (step S3: ④ in FIG. 7).

The CPU 73 monitors whether or not the detection load of the distortion gauge 43 rises from L0 as the electronic component C attracted to the suction nozzle 12 reaches the mounting surface : ⑤ in Fig. 7).

Then, when it is detected that the electronic component C has reached the mounting surface ((6) in Fig. 7, the height Z1 (the height when the electronic component C contacts the mounting surface)), S7) and further monitors whether or not the detection load has reached the target load (distortion gauge output L1) (step S9).

When it is detected that the detected load has reached the target load (the distortion gauge output L1), the Z-axis motor 21 is stopped, the movable bracket 14 is held at the height, and the time measurement of the predetermined pressing time is performed (Step S11: ⑦ in Fig. 7 and ⑧ in Fig. 7).

When the elapse of the preset pressing time T1 is detected (step S13: ⑨ in Fig. 7 and ⑩ in Fig. 7), the Z-axis motor 21 is driven to raise the suction nozzle 12 to the height Z2 (Step S15: (11) in Fig. 7).

For reference, the height Z2 is slightly higher than the mounting surface Z0 and lower than the height Z3, but may be the same height as Z3.

After the Z-axis motor 21 is temporarily stopped, the gain of the Z-axis motor 21 is switched to the high speed normal mode and the speed is raised to the height Z4 (step S17: The drive control is terminated.

(Effects in the First Embodiment)

The electronic component mounting apparatus 100 includes both the elevating mechanism 20 and the turning mechanism 50 supported by the main frame 60 so that the turning mechanism 50 is mounted on the movable bracket 14 Otherwise, the weight of the structure for performing the lifting operation can be reduced, the load of the electronic component C can be easily controlled by the lowering of the suction nozzle 12, and the load can be applied with high accuracy.

In addition, since the nozzle shaft 30 is hollow and the upper end thereof is protruded from the upper portion of the main body frame 60, a pipe such as a tube for connecting to the suction source is provided with the nozzle shaft 30 It is easy to avoid the interference with the surroundings even when the rotation is performed, and it becomes possible to enlarge the angle at which the suction nozzle 12 can be rotated.

Since the load detecting section 40 is provided on the movable bracket 14 so that the load detecting section 40 does not rotate at the same time as the suction nozzle 12 is rotated and the suction nozzle 12 is rotated by the wiring of the distortion gauge 43, So that it is possible to expand the pivotable angle in this respect as well.

The load detecting unit 40 has the distortion gauge 43 for detecting the distortion of the connecting arm portion 42 connected to the hollow holding portion 41 through which the nozzle shaft 30 penetrates. The load detection unit 40 is not disturbed and the load is detected around the nozzle shaft 30 when the suction nozzle 12 and the nozzle shaft 30 are extended to the upper side of the main body frame 60. Therefore, It is possible to more accurately detect the load applied to the load.

(Another example of the first embodiment)

For reference, in the above-described electronic component mounting apparatus 100, the case where the load detecting section 40 is mounted on the movable bracket 14 is exemplified, but the arrangement thereof is not limited thereto. For example, as shown in Fig. 8, the load detecting section 40 may be provided at the lower portion of the movable bracket 14. Fig. The load detecting unit 40 has the same structure as the load detecting unit 40 described above. In this case, the end portion 33 of the nozzle shaft 30 is formed in the vicinity of the lower end portion, thereby holding the bearing 47 of the load detecting portion 40. Further, the collar and the coupling for holding the bearing 47 from above are not shown.

In the above-described electronic component mounting apparatus 100, although the nozzle shaft 30 is disposed in the vicinity of the head 106 and the elevating mechanism 20 is disposed in a position distant from the head 106, the present invention is not limited thereto The nozzle shaft 30 may be disposed at a position away from the head 106 and the elevating mechanism 20 may be disposed in the vicinity of the head 106 as shown in Fig. Only the ball screw shaft 23 and the ball screw nut 24 are shown). Likewise, the arrangement of the rotation mechanism 50 may be changed.

In the electronic component mounting apparatus 100, the nozzle shaft 30 is rotatably and vertically movably supported by the stroke rotary bearing 36 in the movable bracket 14. For example, in the load detection section 40, When the displacement in the Z axis direction occurring at the time of the load application is sufficiently small, the nozzle shaft 30 is supported by a normal ball bearing in place of the stroke rotary bearing 36, and the nozzle shaft 30 is supported by the rattling The displacement of the nozzle shaft 30 in the Z-axis direction may be allowed.

(Second Embodiment)

A nozzle driving apparatus 10A according to a second embodiment of the present invention will be described with reference to the drawings. The second embodiment is characterized by the nozzle driving apparatus 10A and the remaining configuration is the same as that of the above-described electronic component mounting apparatus 100, so the nozzle driving apparatus 10A will be mainly described. The same components as those of the above-described nozzle driving apparatus 10 are denoted by the same reference numerals, and redundant description will be omitted.

Fig. 10 is a side sectional view of the nozzle driving device 10A, and Fig. 11 is a plan view of the load detecting portion 40A.

The nozzle driving apparatus 10A is different from the nozzle driving apparatus 10 in that the load detecting unit 40A is provided on the main frame 60 instead of the movable bracket 14A.

That is, the through holes 41A are formed in the second extended support portion 63 of the main frame 60 in a substantially fan shape with respect to the four peripheries of the bearings 25, Four beam structure portions 42A supported by four sides are formed and the strain gauges 43A are adhered to the upper and lower surfaces of the respective beam structure portions 42A to constitute a load detection portion 40A.

It is not necessary to support the nozzle shaft 30 so as to be swingable in the Z-axis direction in the movable bracket 14A by providing the load detecting section 40A on the side of the main frame 60. Therefore, But is supported by the normal ball bearings 36A and 36A so as to be supported so as to be rotatable about the Z axis without causing oscillation in the Z axis direction.

With the above arrangement, the nozzle driving apparatus 10A descends the adsorption nozzle 12 toward the substrate with the electronic component C being adsorbed, and when the electronic component C reaches the substrate, the reaction force The bearing 25 and the second extended support portion 63 via the nozzle shaft 30, the movable bracket 14A, the ball screw nut 24, and the ball screw shaft 23, Is pressed upward. As a result, the beam structure portions 42A are distorted, and the pressing load on the substrate can be obtained by detecting the respective distortion gauges 43A.

The operation control of the nozzle driving apparatus 10A can be executed by the same processing as the processing based on the flowchart of Fig. 6 and the timing chart of Fig. 7 described above.

(Effects in the Second Embodiment)

The nozzle driving apparatus 10A has the same effect as the nozzle driving apparatus 10 described above and detects the distortion of the supporting portion of the ball screw shaft 23 of the elevating mechanism 20 by the load detecting unit 40A The load detection unit 40A can be disposed apart from the nozzle shaft 30. When the nozzle shaft 30 is disposed so as to penetrate the main frame 60 up and down, It does not.

Since the load detecting portion 40A is provided on the main frame 60 so that the wiring of the strain gauges 43A of the load detecting portion 40A does not rise or fall along with the nozzle shaft 30, It does not interfere with the operation, and it is possible to make the wiring structure corresponding to the elevating operation unnecessary.

(Another example of the second embodiment)

In the above-described nozzle driving device 10A, the load detecting portion 40A is provided around the bearing 25 of the second extended supporting portion 63, but the arrangement thereof is not limited thereto. For example, as shown in Fig. 12, the load detecting section 40A may be provided at the position on the base side (back plate 61 side) of the second extended supporting portion 63 rather than the bearing 25. [

For example, a through hole 41A is formed in the X-axis direction so as to make the thickness in the Z-axis direction thinner with respect to a part of the second extended supporting portion 63 at its root side than the bearing 25, The beam structure section 42A may be formed and the load detection section 40A may be constituted by providing the strain gages 43A in an adhesive state in two places on the upper and lower surfaces thereof.

When the second extended support portion 63 does not support the ball screw shaft 23 and the reaction force at the time of pressing is transmitted to the Z-axis motor 21, The load detecting portion 40A having the same structure as that of the load detecting portion 40A may be formed. Alternatively, even if the load detecting portion 40A having the same structure as in Fig. 12 is formed at the position S2 of the first extended support portion 62 (the side of the rear plate 61) in the Z-axis motor 21 do.

(Third Embodiment)

A nozzle driving apparatus 10B according to a third embodiment of the present invention will be described with reference to the drawings. The third embodiment is characterized by the nozzle driving apparatus 10B and the remaining configuration is the same as that of the above-described electronic component mounting apparatus 100, so the nozzle driving apparatus 10B will be mainly described. The same components as those of the above-described nozzle driving apparatus 10 are denoted by the same reference numerals, and redundant description will be omitted.

Fig. 13 is a side sectional view of the nozzle driving device 10B, and Fig. 14 is an enlarged sectional view of the load detecting portion 40B.

The nozzle driving device 10B is structured such that the movable bracket 14B is divided into the elevating operation input portion 141B from the elevating mechanism 20 and the supporting portion 142B of the nozzle shaft 30, A tension spring 143B as an elastic body for pulling the mutually opposing portions of the support portion 142B and the elevation operation input portion 141B close to each other is provided at a position above the elevation operation input portion 141B , And a load detecting portion (40B) is provided between mutually opposing portions.

The movable bracket 14B is divided into the elevating operation input portion 141B and the supporting portion 142B of the nozzle shaft 30 and the elevation operation input portion 141B is provided with the elevation mechanism A screw nut 24 is provided on the support portion 142B and the nozzle shaft 30 is rotatably provided around the Z axis by two ball bearings 36B and 36B.

14, the connecting portions 144B and 145B of the elevating operation input portion 141B and the supporting portion 142B are arranged so as to be overlapped with each other in the Z-axis direction, and facing surfaces facing each other are formed .

The connecting portion 144B of the elevating operation input portion 141B is disposed below the connecting portion 145B of the supporting portion 142B.

The connection pins 146B and 147B extending along the Z axis direction are extended to the mating sides of the respective connection portions 144B and 145B and the connection pins 144B and 145B 147B, and 146B are inserted into the thrust collar 148B.

The connecting portion 144B of the lifting operation input portion 141B and the connecting portion 145B of the supporting portion 142B can move relative to each other along the Z axis direction.

As described above, the connecting portion 144B of the lifting operation input portion 141B and the connecting portion 145B of the supporting portion 142B are connected by the tension spring 143B so that the opposing surfaces of the elevating operation input portion 141B and the supporting portion 142B And is in a state of receiving a tensile force.

A load cell (pressure detecting element) as a load detecting portion 40B for detecting the contact pressure with the opposing surface on the side of the connecting portion 144B is provided on the opposite surface of the supporting portion 142B on the connecting portion 145B side, In a state where an external force is not applied to the movable bracket 14B, a constant pressing force is always applied by the tension spring, and the pressing force is always detected (Fig. 14A).

Here, when the maximum setting load applied to the electronic component C by the suction nozzle 12 is 50N, the tension spring 143B may be a member that generates a pressing load slightly larger than the maximum setting load (for example, 60N) do.

When the electronic component C is pressed against the substrate by the lowering of the suction nozzle 12, the connecting portion 144B and the connecting portion 145B act in a direction away from each other against the tension spring 143B, When the pushing of the nozzle 12 progresses, the detection output by the load detection unit 40B gradually decreases from the load 60N of the tension spring 143B as shown in Fig. When the suction nozzle 12 is pushed in until the load exceeds the load of the tension spring 143B, the connecting portion 144B and the connecting portion 145B are separated from each other as shown in Fig. 14B, However, since the tension spring 143B having a tensile load larger than the maximum setting load is selected, such a situation does not occur during the normal electronic component mounting operation.

For reference, the operation control of the nozzle driving apparatus 10B can be executed by the same processing as the processing based on the flowchart of Fig. 6 and the timing chart of Fig. 7 described above.

(Effects in the Third Embodiment)

The nozzle driving device 10B has the same effect as the nozzle driving device 10 described above and the load detecting portion 40B is disposed between the elevating operation input portion 141B and the supporting portion 142B. The supporting portion 142B rises and the gap between the elevating operation input portion 141B and the supporting portion 142B becomes wide so that the load at the time of contact becomes excessively large It is possible to effectively prevent the load detection unit 40B from being broken.

(Another example of the third embodiment)

The connecting portions 144B and 145B between the lifting operation input portion 141B of the movable bracket 14B and the supporting portion 142B described above are moved in the X- And a tension spring 143B may be provided so as to be rotatably connected to each other by the hinge 150B and to mutually oppose each other. In addition, the load detecting portion 40B may be provided on the other facing face of the contact / separable opposing face. In this case, as shown in Fig. 16B, even when the load detecting portion 40B is pressed at the maximum setting load so that the load detecting portion 40B is not separated from the other facing surface, It is necessary to select a tension spring 143B having a load of no load.

The connecting portions 144B and 145B of the elevating operation input portion 141B and the supporting portion 142B of the movable bracket 14B described above are parallel to each other as shown in Fig. The tension spring 143B may be provided so as to be connected by the two link members 151B and 152B having the same length and to face each other. Further, the load detecting portion 40B may be provided on the other facing face of the contact / separable opposing face. Even in this case, as shown in Fig. 17B, even when the load detecting portion 40B is pressed at the maximum setting load so that the load detecting portion 40B is not separated from the other opposing surface, It is necessary to select the tension spring 143B with a load that does not hold.

(Fourth Embodiment)

A nozzle driving apparatus 10C according to a fourth embodiment of the present invention will be described with reference to the drawings. The fourth embodiment is characterized by the nozzle driving apparatus 10C, and the remaining configuration is the same as that of the above-described electronic component mounting apparatus 100, so the nozzle driving apparatus 10C will be mainly described. The same components as those of the above-described nozzle driving apparatus 10 are denoted by the same reference numerals, and redundant description will be omitted.

Fig. 18 is a side sectional view of the nozzle driving device 10C, and Fig. 19 is a plan view of the load detecting portion 40C.

The nozzle driving device 10C divides the movable bracket 14C into the lift operation input portion 141C from the lift mechanism 20 and the support portion 142C of the nozzle shaft 30 and lifts the support portion 142C A load detecting section 40B is provided between the supporting sections 142C and the elevating operation input section 141C and the elevating operation input section 141C and the supporting section 142C are disposed below the operation input section 141C, (142C) is connected by a load detecting section (40C).

The movable bracket 14C is divided into the elevating operation input portion 141C and the supporting portion 142C of the nozzle shaft 30 and the elevation operation input portion 141C is provided with the ball screw And the nozzle shaft 30 is rotatably provided around the Z axis by two ball bearings 36C and 36C in the support portion 142C.

The nozzle shaft 30 is simultaneously penetrated through the through hole formed concentrically to the support portion 142C and the elevation operation input portion 141C.

Further, the lower surface of the lifting operation input portion 141C and the upper surface of the support portion 142C are opposed to each other, and these opposite surfaces are attached so as to connect the load detecting portion 40C.

The load detecting section 40C has a configuration in which a through hole is formed in the upstanding distortion body 41C and the upstanding distortion body 41C along the X axis direction so that the upper and lower surfaces thereof are thin, And two strain gauges 43C symmetrically arranged along the Y-axis direction in the thin portions of the upper and lower surfaces. The upstanding distortion body 41C is formed with an insertion hole 44C of the nozzle shaft 30 penetrating to the lower surface at the central portion of the upper surface.

When the load detecting unit 40C receives a load in the direction along the Z-axis direction from the center of the upper surface, the respective strain gauges 43C perform the detection output according to the load, and the load can be detected.

The standing-up distortion body 41C has a central upper portion in a fixed state on the lower surface of the lifting operation input portion 141C and a lower central portion of the standing-up distortion body 41C in a fixed state on the upper surface of the supporting portion 142C, And connects the lifting operation input section 141C and the support section 142C.

This causes the adsorption nozzle 12 to descend while adsorbing the electronic component C to press the substrate so that the standing up distortion member 41C is pressed between the lifting operation input portion 141C and the supporting portion 142C, Each strain gauge 43C performs the detection output in accordance with the pressing load so that the pressing load by the electronic component C can be detected.

For reference, the operation control on the nozzle driving apparatus 10C can be executed by the same processing as the processing based on the flowchart of Fig. 6 and the timing chart of Fig. 7 described above.

(Effects in the Fourth Embodiment)

The nozzle driving apparatus 10C has the same effect as the nozzle driving apparatus 10 described above and the load detecting unit 40C has a pressing force of mutual opposing portions of the elevating operation input portion 141C and the supporting portion 142C It is possible to detect the load by inserting the upright distortion body 41C of the load detection unit 40C between the elevation operation input portion 141C and the support portion 142C so that the structure can be simplified and the number of constituent parts can be reduced .

An insertion hole 44C is formed in the center portion in the XY plane of the upright distortion body 41C to allow the nozzle shaft 30 to be inserted therethrough so that the load detection portion 40C is moved to the elevation operation input portion 141C, The load applied to the adsorption nozzle 12 can be detected at a position immediately above the load, and detection with higher precision is possible.

(Another example of the fourth embodiment)

The above-described load detecting section 40C is provided in such a manner that the nozzle shaft 30 passes through between the elevating operation input section 141C and the supporting section 142C. However, the present invention is not limited to this, , And the nozzle shaft 30 may be avoided between the elevating operation input portion 141C and the supporting portion 142C.

In this case, it is not necessary to form the insertion hole 44C in the standing-up and downwardly projecting body 41C, and it is unnecessary to position the load detection portion 40C in alignment with the center line of the nozzle shaft 30 So that the configuration can be simplified and the productivity can be improved.

10, 10A, 10B, 10C: nozzle driving device
12: Adsorption nozzle
14, 14A, 14B, 14C: movable bracket (elevator)
20: Lift mechanism
23: Ball screw shaft (transmitting member)
24: Ball screw nut
30: nozzle shaft
40, 40A, 40C: a load detector
40B: Load detecting section (pressure detecting element)
41: hollow holding part
41A: Through hole
41C: an upright distortion body
42: Connection arm part (connection part)
42A: beam structure
43, 43A: Distortion gauge (distortion detecting element)
43C: Distortion gauge (pressure detecting element)
44: Load cell
50:
55: Spline nut
60: Body Frame (Body Frame)
70: Operation control means
100: Electronic component mounting apparatus
106: Head
141B, 141C: a lift operation input section
142B, 142C:
143B: spring (elastic body)
144B, 145B:
C: Electronic parts

Claims (5)

An electronic component is attracted by a suction nozzle 12 provided on a head 106 that is movable between a supply part 101 and an electronic part 102 of a substrate and a holding part 104 of the substrate, A component mounting apparatus (100)
A main body 60 fixed to the head,
A lifting body (14) supported so as to be movable with respect to the main body part,
A lifting mechanism (20) for lifting and lowering the lifting body,
A driving source (21) of the elevating mechanism and a transmitting member (23) for transmitting the elevating operation from the driving source to the elevating body,
A hollow nozzle shaft 30 holding the adsorption nozzle at a lower end thereof and having an upper end connected to a suction source,
A rotation mechanism (50) having a spline groove formed in the nozzle shaft and imparting a turning operation to the nozzle shaft through a spline nut (55)
A load detector (40) for detecting an upward load received by the suction nozzle,
And an operation control unit (70) for performing control to lower the elevating member (70) until the load detecting unit detects a predetermined load, and to perform suction control for attracting the electronic component from the supplying unit, the electronic component mounting apparatus comprising:
The elevating mechanism and the turning mechanism are supported by the main body,
An upper end of the nozzle shaft is protruded from an upper portion of the main body,
The load detecting portion is supported by the lifting body or the main body portion,
Wherein the load detection unit comprises:
(41) provided on the ascending / descending member and rotatably holding the nozzle shaft so as to pass therethrough, a connecting portion (42) connecting the hollow holding portion to the ascending / descending member, and a connecting portion And a distortion detecting element (43) for detecting the distortion. An electronic component is attracted by a suction nozzle 12 provided on a head 106 that is movable between a supply part 101 and an electronic part 102 of a substrate and a holding part 104 of the substrate, A component mounting apparatus (100)
A main body 60 fixed to the head,
A lifting body (14) supported so as to be movable with respect to the main body part,
A lifting mechanism (20) for lifting and lowering the lifting body,
A hollow nozzle shaft (30) holding the adsorption nozzle at its lower end and having an upper end connected to an intake air source,
A rotation mechanism (50) which forms a spline groove in the nozzle shaft and imparts a turning operation to the nozzle shaft through a spline nut (55)
A load detector (40) for detecting an upward load received by the suction nozzle,
And an operation control unit (70) for performing control to lower the elevating member (70) until the load detecting unit detects a predetermined load, and to perform suction control for attracting the electronic component from the supplying unit, the electronic component mounting apparatus comprising:
The elevating mechanism and the turning mechanism are supported by the main body,
An upper end of the nozzle shaft is protruded from an upper portion of the main body,
The load detecting portion is supported by the lifting body or the main body portion,
A driving source (21) of the elevating mechanism and a transmitting member (23) for transmitting the elevating operation from the driving source to the elevating body,
Wherein the load detecting section has a distortion detecting element (43) for detecting distortion of a driving source of the elevating mechanism or a portion supporting the transmitting member. delete delete delete

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